CN1259264C - Device and method for breaking fragile material substrate - Google Patents

Device and method for breaking fragile material substrate Download PDF

Info

Publication number
CN1259264C
CN1259264C CNB028025164A CN02802516A CN1259264C CN 1259264 C CN1259264 C CN 1259264C CN B028025164 A CNB028025164 A CN B028025164A CN 02802516 A CN02802516 A CN 02802516A CN 1259264 C CN1259264 C CN 1259264C
Authority
CN
China
Prior art keywords
mentioned
product
substrate
brittle substrate
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB028025164A
Other languages
Chinese (zh)
Other versions
CN1464866A (en
Inventor
若山治雄
羽阪登
藤井昌宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN1464866A publication Critical patent/CN1464866A/en
Application granted granted Critical
Publication of CN1259264C publication Critical patent/CN1259264C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

A breaking device and breaking method, wherein a first product table (13) and a second product table (14) are disposed on a sliding table (11) and a tilting table (12), respectively, so that the edge parts thereof can provide specific angles. A substrate (G) having scribed both faces is put on the tables and fixedly pressed by a first clamp bar (15a) and a second clamp bar (16a), and a shearing force and a tension are applied to the substrate (G) at scribe lines (S) by the clamp bar as a pressing point when the second product table (14) is rotated, whereby, since the clamp bar with less clearance acts as a break point, the substrate (G) can be laterally divided into two parts.

Description

The disrumpent feelings device of brittle substrate and disrumpent feelings method thereof and cutting system with female adhesive substrates of this device
Technical field
The present invention relates to be used to block the disrumpent feelings device of brittle substrate and the disrumpent feelings method thereof of brittle substrates such as glass, semiconductor wafer, pottery.
Background technology
The state that Fig. 1 illustrates relative sheet glass 1 when using 2 line of glass cutting wheel.Form line S on the surface of sheet glass 1 by this line action.Among the figure, at the enlarged section that illustrates round zone down.B illustrates the degree of depth of the crackle of the vertical direction that is formed by this line.
Fig. 2 is the existing disrumpent feelings schematic representation of apparatus that general use is shown.In this disrumpent feelings device, clamp mat M and on platform 3, be placed on the sheet glass 1 that the back side forms line S.Disrumpent feelings bar 4 is positioned at the top of sheet glass 1.This is disrumpent feelings, and bar 4 joint section below shaft-like metallic substance 4a is the vulcanite 4b of V word shape, by relative sheet glass 1 keeping parallelism of not shown driving mechanism, but and easy on and off move.The bottom of the vulcanite 4b of disrumpent feelings bar 4 is as one man pushed from the top of sheet glass 1 with line S.Like this, sheet glass 1 is deflection slightly on mat M, thereby makes the crackle of vertical direction arrive glass pane surface, and S blocks sheet glass 1 along line.
Fig. 3 illustrates another the disrumpent feelings method that is disclosed in Japanese kokai publication hei 4-280828 communique.The platform 3a, the 3b that are divided into 2 parts are spaced from each other with gap and are provided with.Sheet glass 1 is subjected to attracting fixing with being across two 3a, 3b and makes the line S that is formed at upper surface be positioned at clearance portion.Platform 3a by making a side along the rotating shaft central shaft O parallel with the gap of below slightly towards direction of arrow revolution, thereby make sheet glass 1 deflection and block.By platform 3a, 3B are turned round simultaneously, also can block sheet glass 1.In addition, by it is left in that the platform 3a that makes a side is rotating from platform 3b, can not block at cut surface with producing damage yet.
Yet like that, the degree of depth of line is different, has the such dark position of Da, Db shown in figure below of above-mentioned Fig. 1.By Sa, Sb the line position corresponding with this Da, Db is shown.When blocking this sheet glass 1 by above-mentioned gimmick, even relatively sheet glass 1 adds the same power of blocking, blocking also differently of sheet glass 1 carried out, at position shown in Sa, the Sb, sheet glass block FEFO.That is, in this position, vertical crack reach sheet glass 1 below, after this, be that starting point is carried out blocking towards the line direction of sheet glass 1 with the position of Sa, Sb.
Therefore, in existing method for cutting,,, there is the shortcoming of commodity value decline so truncation surface may become screen shape or bending owing to as starting point ground blocking of sheet glass 1 carried out with a plurality of positions of line.
In addition, in order to prevent to produce dust when disrumpent feelings, also consider to have studied the laser scribing of using laser.By laser scribing the time, to sheet glass illuminating laser beam on one side move on one side, follow it and carry out a cooling by refrigerant.Like this, by utilizing the thermal distortion of sheet glass, form tiny line at sheet glass.This line is thinner, with soon less than, so this method of scoring is also referred to as blind stroke.In the occasion that the sheet glass that has carried out blind stroke is relatively blocked by existing disrumpent feelings device, the degree of depth of blind stroke of crackle that is produced is more shallow, so need the big power of blocking.For this reason, it is big that device becomes, or can not block fully.
Summary of the invention
The present invention proposes in view of such existing issue point, and its purpose is to provide a kind of brittle substrate of different shape relatively to reduce to be added to the disrumpent feelings devices and methods therefor of brittle substrate of the power of blocking of substrate, acquisition truncation surface equally.
Disrumpent feelings device of the present invention is characterised in that: have the 1st, the 2nd product platform, the 1st product clamping device, the 2nd product clamping device, slide mechanism, inclining rotary mechanism, reach the revolution control part; 1st, the 2nd product platform mounting forms the brittle substrate of line and makes at 1 at least and rules between the therebetween crack; When will with the 2nd product platform the 1st product edge of table in opposite directions as the 1st edge, will be with the 1st product platform the 2nd product edge of table in opposite directions during as the 2nd edge, the part that is positioned at the 1st edge of the 1st product clamping device pushing brittle substrate is fixed; The part that is positioned at the 2nd edge of the 2nd product clamping device pushing brittle substrate is fixed it; This slide mechanism towards making the 1st product platform and the 1st product clamping device provide pressure from line with the rectangular direction of the line of brittle substrate with being integral with retreating; This inclining rotary mechanism can make the revolution of the 2nd product platform and the 2nd product clamping device one with the tiliting axis parallel with the line of brittle substrate as rotating shaft; This revolution control part control inclining rotary mechanism makes the revolution of the 2nd product platform and the 2nd product clamping device; The 1st product platform and the 2nd product platform dispose two edge in opposite directions not parallelly, and the tiliting axis of the 2nd product platform is in the thickness range of substrate when the line of brittle substrate is watched.
Disrumpent feelings device of the present invention is characterised in that: have the 1st, the 2nd product platform, the 1st product clamping device, the 2nd product clamping device, the 1st inclining rotary mechanism, the 2nd inclining rotary mechanism, reach the revolution control part; 1st, the 2nd product platform mounting forms the brittle substrate of line and makes at 1 at least and rules between the therebetween crack; When will with the 2nd product platform the 1st product edge of table in opposite directions as the 1st edge, will be with the 1st product platform the 2nd product edge of table in opposite directions during as the 2nd edge, the part that is positioned at the 1st edge of the 1st product clamping device pushing brittle substrate is fixed; The part that is positioned at the 2nd edge of the 2nd product clamping device pushing brittle substrate is fixed it; The 1st inclining rotary mechanism can make the revolution of the 1st product platform and the 1st product clamping device one with the tiliting axis parallel with the line of brittle substrate as rotating shaft; The 2nd inclining rotary mechanism can make the revolution of the 2nd product platform and the 2nd product clamping device one with the tiliting axis parallel with the line of brittle substrate as rotating shaft; This revolution control part is controlled the 1st and the 2nd inclining rotary mechanism, makes the revolution of the 1st product platform and the 1st product clamping device and the 2nd product platform and the 2nd product clamping device; The 1st product platform and the 2nd product platform dispose two edge in opposite directions not parallelly, and the tiliting axis of the 1st product platform is in the line substrate upside nearby of brittle substrate, and the tiliting axis of the 2nd product platform is in the line substrate downside nearby of brittle substrate.
In addition, disrumpent feelings device of the present invention will be rule above the brittle substrate that finishes is fixed at the platform that is divided into 2 parts, make at least one side's platform revolution, thereby make brittle substrate disrumpent feelings; It is characterized in that: make the line direction of the relative brittle substrate of rotary middle spindle of platform have the angle of regulation.
In addition, disrumpent feelings device of the present invention will be rule above the brittle substrate that finishes is fixed at the platform that is divided into 2 parts, make at least one side's platform revolution, thereby make brittle substrate disrumpent feelings; It is characterized in that: thus at least one side's platform has uneven 6 arms that freely stretch of at least a portion, is located at the two ends of arm and connect universal coupling between platform and fixed part, a side the control part of position of length supervisory control desk by control arm by free angle respectively.
The disrumpent feelings method of brittle substrate of the present invention separates specified gap and platform is carried out position control with becoming identical faces, make and be fixed in platform with gap between the brittle substrate alignment tool that is pre-formed line, make a side platform revolution along rotating shaft not parallel with the line that is formed at brittle substrate and that be not in same level with line, thereby make sheet glass disrumpent feelings along line.
In addition, will fit mother (the マ ザ one) adhesive substrates of 2 brittle substrates of the disrumpent feelings method of brittle substrate of the present invention blocks, and obtains the polylith adhesive substrates than its little shape; It is characterized in that: the prescribed position that has at a side's of female adhesive substrates substrate surface uses the 1st chalker to form the operation (1) of line S1, at the opposing party's of female adhesive substrates substrate surface along using the 2nd chalker to form the operation (2) of line S2 with line S1 equidirectional, thereby and above-mentioned female adhesive substrates that will form line S1, S2 on the two sides be fixed to disrumpent feelings device 2 platforms, make at least one side revolution of platform apply tensile stress or shear-stress at rule S1, S2, female adhesive substrates is blocked into the operation (3) of multi-disc.
In addition, the disrumpent feelings method of brittle substrate of the present invention will be fitted not to form the 1st brittle substrate of line and to be pre-formed female adhesive substrates that the 2nd brittle substrate of line S2 obtains and be blocked, thereby obtain the adhesive substrates of multi-disc than its little shape; It is characterized in that: have on the surface of the 1st brittle substrate along and line S2 equidirectional use chalker to form the operation (1) of line S1, thereby and will be fixed on 2 platforms of disrumpent feelings device at above-mentioned female adhesive substrates that the two sides forms line S1, S2, at least one side of platform turned round at rule S1, S2 apply the operation (2) that tensile stress or shear-stress block into female adhesive substrates multi-disc.
In addition, the disrumpent feelings method of the brittle substrate of the present invention female adhesive substrates that the 1st brittle substrate that forms line and the 2nd brittle substrate obtain of will fitting not blocks, thereby obtains the adhesive substrates of multi-disc than its little shape; It is characterized in that: have surface at the 1st and the 2nd brittle substrate, use chalker to form the operation (1) of line S1, S2 simultaneously, thereby and above-mentioned female adhesive substrates that will form line S1, S2 on the two sides be fixed to disrumpent feelings device 2 platforms, at least one side of platform is turned round at rule S1, S2 apply the operation (2) that tensile stress or shear-stress block into female adhesive substrates multi-disc.
Description of drawings
Fig. 1 is the explanatory view of the state of the vertical crack when being illustrated in sheet glass enforcement line.
Fig. 2 is the skeleton view that the major portion formation of the existing disrumpent feelings device that uses disrumpent feelings bar is shown.
Fig. 3 illustrates by the revolution of platform to carry out the skeleton view that the major portion of disrumpent feelings existing disrumpent feelings device constitutes.
Fig. 4 illustrates the skeleton view that the integral body of the device of the invention process form 1 constitutes.
Fig. 5 illustrates the decomposition diagram that the integral body of the disrumpent feelings device of form of implementation 1 constitutes.
Fig. 6 illustrates the orthographic plan of state that substrate is configured to the platform of disrumpent feelings device.
Fig. 7 illustrates the sectional drawing that the major portion of disrumpent feelings line portion of the disrumpent feelings device of form of implementation 1 constitutes.
Fig. 8 is the explanatory view that the modified example of the substrate when disrumpent feelings is shown.
Fig. 9 is the sectional drawing at the state that blocks of substrate shown in the disrumpent feelings device of form of implementation 1.
Figure 10 is the orthographic plan at the state that blocks of substrate shown in the disrumpent feelings device of form of implementation 1.
Figure 11 is the skeleton view of all formations that the disrumpent feelings device of the invention process form 2 is shown.
Figure 12 is the decomposition diagram of all formations that the disrumpent feelings device of form of implementation 2 is shown.
Figure 13 illustrates the sectional drawing that the major portion of line portion of the disrumpent feelings device of form of implementation 2 constitutes.
Figure 14 is the sectional drawing at the state that blocks of substrate shown in the disrumpent feelings device of form of implementation 2.
Figure 15 illustrates the biopsy cavity marker devices skeleton view that the major portion of the disrumpent feelings device of the invention process form 3 constitutes.
Figure 16 is figure on the state that shown in the disrumpent feelings device of form of implementation 3 sheet glass is configured to platform.
Figure 17 is the explanatory view in the action when disrumpent feelings shown in the disrumpent feelings device of form of implementation 3.
Figure 18 is the amplification profile diagram that the layer structure of liquid crystal board is shown.
Figure 19 is the biopsy cavity marker devices skeleton view of major portion structure that the disrumpent feelings device of the invention process form 4 is shown.
Figure 20 is the side elevational view of major portion structure that the disrumpent feelings device of the invention process form 5 is shown.
Figure 21 be shown in the disrumpent feelings device of form of implementation 5 with the skeleton view of sheet glass mounting in the state of platform.
Figure 22 is the side elevational view of the action when sheet glass blocks shown in the disrumpent feelings device of form of implementation 5.
Figure 23 is the side elevational view that moves of the platform after the blocking of sheet glass shown in the disrumpent feelings device of form of implementation 5.
Figure 24 is the side elevational view of the action when after sheet glass blocks shown in the disrumpent feelings device of form of implementation 5 sheet glass being moved.
Figure 25 is the explanatory view of the automatic transversal of the female glass substrate of liquid crystal of an example of disrumpent feelings method that the brittle substrate of the invention process form 3 is shown.
Figure 26 is the process picture sheet that the disrumpent feelings method of existing brittle substrate is shown.
Figure 27 is the process picture sheet of an example that the disrumpent feelings method of form of implementation 6 is shown.
Figure 28 is the sectional drawing of the female glass substrate of liquid crystal that is used for the disrumpent feelings method of the invention process form 7.
Figure 29 is the explanatory view of the automatic transversal of the female glass substrate of liquid crystal of an example of disrumpent feelings method that the brittle substrate of form of implementation 7 is shown.
Figure 30 is the explanatory view of the automatic transversal of the female glass substrate of liquid crystal of an example of disrumpent feelings method that the brittle substrate of the invention process form 8 is shown.
Embodiment
(form of implementation 1)
The disrumpent feelings device of form of implementation 1 of the present invention is described with reference to the accompanying drawings.Fig. 4 illustrates the outward appearance skeleton view that the integral body of the disrumpent feelings device 10 of form of implementation 1 constitutes.This is disrumpent feelings, and device 10 is called the one-sided shear that verts.Becoming the substrate G that blocks object is brittle substrates such as glass.
Here, for convenience of description, the usage space coordinate (x, y, z), will with the parallel stage fiducial face in ground that is provided with of disrumpent feelings device 10 as (x, y, z 0), will be made as the z axle with the vertical direction in ground is set, the direction (disrumpent feelings direction) of blocking of substrate G is made as the y axle.Disrumpent feelings device 10 has the sliding stand 11 that can slide towards-x direction of principal axis and the rotating shaft parallel with the y axle can be verted as the center and can be towards the slide swivel angle plate 12 of adjustment of x direction of principal axis.
Fig. 5 illustrates the left-hand unit 10A of disrumpent feelings device 10 and the skeleton view of right-hand unit 10B separate stage.When disrumpent feelings device 10 complete installations during to the base 17 of Fig. 4, left-hand unit 10A refers to be located at substrate G as shown in Figure 4 the portion of mechanism in line S left side (x direction of principal axis), and right-hand unit 10B refers to be set to the portion of mechanism on the line S right side (+x direction of principal axis) of substrate G.
In addition, for mounting and keep the substrate G that to cut off, the 1st product platform 13 is fixed to sliding stand 11, the 2nd product platform 14 is fixed to swivel angle plate 12.In addition, the 1st product clamping device 15 is installed, the 2nd product clamping device 16 is installed on the top of the 2nd product platform 14 on the top of the 1st product platform 13.Make the line S of substrate G parallel with the y axle, with line S be the center with substrate-zone of x axle side (left side) is called substrate left part GL, the zone of general+x axle side (right side) is called substrate right part GR.The 1st product clamping device 15 pushes the right part of substrate left part GL and fixing base securely, and the 2nd product clamping device 16 pushes the left part of substrate right part GR and fixing base securely.
At left-hand unit 10A slide mechanism 11a is set.Slide mechanism 11a is used for court-x direction of principal axis sliding stand 11 is applied elastic force, is provided with the elastic component for example cylinder, the spring etc. that apply elastic force.In addition, be provided for the stop dog of limit slippage scope, the (not shown)s such as snubber of limit slippage speed at slide mechanism 11a.
Right-hand unit 10B is by keeping as the horizontal maintainance block of 1 couple of pillar top 18 and 1 pair of horizontal maintainance block bottom 19.Base 17 is fixed in horizontal maintainance block bottom 19, and horizontal maintainance block top 18 can keep swivel angle plate 12 freely to rotate.Between horizontal maintainance block top 18 and horizontal maintainance block bottom 19, not shown carriage is set, horizontal maintainance block top 18 adjustment of can on the x direction of principal axis, sliding.+ y axle side and-the horizontal maintainance block top 18 of y axle side is provided with tiliting axis 18a, swivel angle plate the 12, the 2nd product platform 14, and the 2nd product clamping device 16 tiliting axis 18a can be kept obliquely as rotating shaft.Tiliting axis 18a is provided with plumer block on horizontal maintainance block top 18, is kept by the spot contact bearing that is pressed into this plumer block.Horizontal maintainance block top 18 and tiliting axis 18a are called inclining rotary mechanism here.
The 1st product clamping device 15 fixing base left part GL make shear-stress and stress in bending focus on the line of substrate.Near the 1st supporting rod 15a the line S of pushing substrate G is set at the 1st product clamping device 15.The front end of the 1st supporting rod 15a is positioned at the right side edge of the 1st product platform 13, can be towards the axial fine motion of z.Equally, the 2nd product clamping device 16 fixing base right part GR focus on shear-stress and stress in bending the line of substrate.Near the 2nd supporting rod 16a the line S of pushing substrate G is set at the 2nd product clamping device 16.The front end of the 2nd supporting rod 16a is positioned at the left side edge of the 2nd product platform 14, can be towards the fine motion of z direction of principal axis.
Fig. 6 is the orthographic plan that the position relation of the 1st, 2 product platforms 13,14 is shown.Comprising the 1st entreats the main shaft of the 1st product clamping device 15 of holding bar 15a to make+the only opening angle-α ground inclination installation of y axle side.In addition, the main shaft that comprises the 2nd product clamping device 16 of the 2nd supporting rod 16a also make+y axle side opening angle+α ground tilts to install.In addition, between these product platforms 13,14, form the gap.
As shown in Figure 6, the 1st product platform 13 can rotating shaft 13a be the center towards the CCW direction (x, y) on the inherent sliding stand 11 in plane only revolution adjust small angle.The 2nd product platform 14 also can rotating shaft 14a be the center towards the CW direction at (x, y) the whole small angle of the inherent swivel angle plate modulation 12 last time in plane.At 4 jiaos of the 1st product platform 13 the screw hole 13b-13e that becomes major diameter when rotating shaft 13a watches in tangential direction is set.Equally, at 4 jiaos of the 2nd product platform 14 the screw hole 14b-14e that becomes major diameter when rotating shaft 14a watches in tangential direction is set.Therefore, be that the center makes only angle of revolution-α of the 1st product platform 13 with rotating shaft 13a, the bolted in this position with screw hole 13b-13e arrives sliding stand 11.Like this, the 1st product platform 13 can with the 1st supporting rod 15a from by stationkeeping shown in 2 long and short dash line of Fig. 6 to by position shown in the solid line.For the 2nd product platform 14 too.By carrying out angular setting like this, the angular aperture of the 1st supporting rod 15a and the 2nd supporting rod 16a can be set at 2 α.
Maintenance method as substrate G can be fixed to the product platform by devices such as vacuum suck.At substrate is glass and the occasion that forms resin molding on its surface, also can be fixed by electrostatic adhesion.
The following describes the inclining rotary mechanism of swivel angle plate 12.As shown in Figure 4 and Figure 5, the tiliting axis 18a on horizontal maintainance block top 18 can make right-hand unit 10B integral body except that horizontal maintainance block bottom 19 towards CW direction or the revolution of CCW direction as rotating shaft it.Fig. 7 is the sectional drawing of disrumpent feelings device major portion that the installation site of tiliting axis 18a is shown.In order to make swivel angle plate 12 revolutions by inclining rotary mechanism, revolution control part 20 is set.Revolution control part 20 uses the turning force of electric motor or fluid cylinder to make swivel angle plate 12 revolution predetermined angulars, also can be by arm or connecting rod by manually making swivel angle plate 12 revolutions.In addition, swivel angle plate 12 is in the rotating while of beginning, and court+x direction moves.
Under the initial setting of disrumpent feelings device, the 1st product platform 13 has location, identical mounting surface ground with the 2nd product platform 14 relative 1 plate base G.Tiliting axis 18a from above the substrate G of mounting on platform and below come central authorities when watching ground, position adjust height.
The thickness of substrate G is 2d 0The mounting surface of the 1st product platform 13 becomes (x, y ,-d 0), the position of tiliting axis 18a becomes (0, y, 0).The position of tiliting axis 18a can be corresponding to thickness and the material adjustment of substrate G.In addition, as to make the gap of the left hand edge of the right hand edge of the 1st product platform 13 and the 2nd product platform 14 be 2g, then the pushing position of the relative substrate G of the 1st supporting rod 15a is a degree shown in Figure 7 with the gap of the pushing position of the relative substrate G of the 1st supporting rod 15a, and the interval of the pushing position of immediate part is preferably the degree identical with 2g.Tiliting axis 18a is preferably parallel with the line of substrate G, is positioned at the thickness range of substrate.
Below, the action of the disrumpent feelings device with such mechanism is described.Substrate G forms the laminated glass substrate that is used for liquid crystal board, and like that, liquid crystal cell is enclosed in the upper substrate G1 (thickness 0.7mm) and the gap (0.1mm) between the hypocoxa G2 (thickness 0.7mm) that form various electrodes in the inboard shown in Fig. 8 (a).The substrate thickness 2d of this occasion 0Be 1.50mm.In addition, shown in Fig. 8 (a) like that, on upper substrate G1 and hypocoxa G2 below respectively from (x, the same position when y) plane is watched are pre-formed line S1, S2.The formation method of line S1, S2 is identical with the prior art example, and the part that shear-stress or tensile stress are high becomes the disrumpent feelings point of glass substrate.
Fig. 9 for the line S be the local amplification profile diagram of the disrumpent feelings device at center.In addition, Figure 10 for by shown in 2 long and short dash line line S be the major portion orthographic plan of the disrumpent feelings device at center.Here, the position after substrate G blocks illustrates with solid line.(x, y z) are (0, y, 0) in the position of tiliting axis 18a.As shown in Figure 10, the substrate left part GL after blocking, with the line S2 of Fig. 8+terminal point of y axle side is made as PL, and the terminal point of-y axle side is made as QL.In addition, the line that the right hand edge of substrate left part GL and the 1st product platform 13 joins+terminal point of y axle side is PL ', the terminal point of-y axle side is QL '.In addition, the substrate right part GR after blocking, with line S2+terminal point of y axle side is made as PR, and the terminal point of-y axle side is made as QR.In addition, the line that the left hand edge of substrate right part GR and the 2nd product platform 14 is joined+y axle side terminal point is made as PR '.General-y axle side terminal point is made as QR '.PR is consistent with PL before substrate G is cut apart cut-out, and QR is consistent with QL.
Shown in Fig. 9 (a), like that, as make the 2nd product platform 14, then put the position of PR ' from (x towards CCW direction cant angle theta only 1, y 1, z 1) move to (x 2, y 2, z 2).Here, each coordinate values is as follows.
x 1=g 2
y 1=y 1
z 1=-d 0
x 2=d 0sinθ+g 2cosθ
y 2=y 1
z 2=d 0(1-cosθ)+g 2sinθ-d 0
Make the some PR ' (x of substrate right part GR by the thrust pressure of the 2nd supporting rod 16a 2, y 2, z 2) part when becoming the fixed point of relative the 2nd product platform 14, the disrumpent feelings part of some PR that is positioned at substrate right part GR relatively is from above-mentioned PR ' effect shearing force and drawing force.
Such shearing force and drawing force act on the some QR of Fig. 9 (b) too.Yet, the position of the line S2 that watches from a PR ' and position such as Fig. 9 and different as shown in Figure 10 of the line S2 that watches from a QR ' ,-y axle one side (forward side) compares with+y axle one side (toward inboard), and shear-stress and tensile stress increase.Even the modulus in tension of glass material is identical in both parts, substrate right part GR is shorter than the occasion of Fig. 9 (a) Fig. 9 (b) side relative to the leading section of the one-sided supporting of not turning round the substrate left part GL that moves.For this reason, leading section one side of one-sided supporting shown in Fig. 9 (b) compares the difficult mitigation of shear-stress with the occasion of Fig. 9 (a).For this reason, some QR, QL become disrumpent feelings point, and hypocoxa G2 blocks.Then, make the 2nd product platform 14 when the CW direction is verted, identical with the occasion of verting of CCW direction, apply shear-stress and tensile stress at the line S1 of upper substrate G1, G1 blocks with upper substrate.When carrying out the shearing of substrate G, by the axial elastic force of the relative substrate left part of slide mechanism 11a GL effect-x, in addition, in the 12 rotating whiles of beginning of swivel angle plate, court+x direction moves, and, retreat as the court-x of the right hand edge portion direction of principal axis of the cut surface of substrate left part GL, the left hand edge with substrate right part GR does not contact.For this reason, the truncation surface at glass substrate does not produce scar, can obtain level and smooth truncation surface.
After substrate G blocked, the position of some PR was from (x 3, y 3, z 3) move to (x 4, y 4, z 4).Here, each coordinate values is as follows.
X 3=0
y 3=y 3
z 3=-d 0
x 4=d 0sinθ
y 4=y 3
z 4=d 0(1-cosθ)-d 0
Calculate the amount of the moving horizontally x of this occasion 4-x 3, then the occasion in θ=3 ° becomes 0.039mm.
Fig. 8 (b) illustrates substrate right part GR towards the rotating state of CCW direction, and Fig. 8 (c) illustrates substrate right part GR towards the profile of the base plate deformation of the rotating occasion of CW direction and the state that cut surface retreats.
The substrate of 2 parts can be pulled down substrate GR, GL from the product platform by remove the 1st supporting rod 15a, the 2nd supporting rod 16a from substrate G about line S is divided into.Be divided into a plurality of occasions will becoming zonal 1 plate base, at the regulation position of substrate G line be set respectively along the x direction of principal axis.Along the x direction substrate G is transported a constant pitch, install the product clamping device after, swivel angle plate 12 is tilted.By carrying out such operation repeatedly, can make multi-piece substrate from 1 mother substrate.
(form of implementation 2)
The disrumpent feelings device of the invention process form 2 is described with reference to the accompanying drawings.Figure 11 illustrates the outward appearance skeleton view that the integral body of the disrumpent feelings device 30 of form of implementation 2 constitutes.This is disrumpent feelings device 30 is called two shears that vert.Here, for convenience of explanation, make with the parallel stage fiducial face in ground that is provided with of disrumpent feelings device 30 for (x, y), making and the vertical direction in ground is set is the z axle, the disrumpent feelings direction that makes substrate is the y axle.This is disrumpent feelings, and device 30 has the rotating shaft parallel with the y axle, has the 1st, the 2nd swivel angle plate 31,32 that can vert.
Figure 12 is the skeleton view that the left-hand unit 30A and the isolating state of right-hand unit 30B of disrumpent feelings device 30 are shown.Disrumpent feelings device 30 all is installed on base 37 shown in Figure 11 by maintainance block 38,39.The 1st product platform 33 is fixed in the 1st swivel angle plate 31, the 2 product platforms 34 and is fixed in the 2nd swivel angle plate 32.In addition, same with form of implementation 1, on the top of the 1st product platform 33 the 1st product clamping device 35 is installed, the 2nd product clamping device 36 is installed on the top of the 2nd product platform 34.The function of these clamping devices is also same with form of implementation 1, so, omit explanation to mechanism.
The 1st swivel angle plate the 31, the 1st product platform 33, and the 1st product clamping device 35 remain in the 1st maintainance block 38 as pillar.The 2nd swivel angle plate the 32, the 2nd product platform 34, and the 2nd product clamping device 36 remain in the 2nd maintainance block 39 as pillar.As shown in figure 11, the pillar spacer of the 2nd maintainance block 39 is wideer than the pillar spacer of the 1st maintainance block 38, and when when regular position (operating position) is installed on base 37 with left-hand unit 30A and right-hand unit 30B, all pillars are in unified position to the y axle substantially.
Symbol 38a is the tiliting axis of the 1st maintainance block 38, and symbol 39a is the tiliting axis of the 2nd maintainance block 39, and as shown in Figure 13, tiliting axis 38a and tiliting axis 39a are from the reference position (x of disrumpent feelings device 0, y, z 0) symmetrical substantially along the z direction of principal axis when watching, be line S1, S2 position nearby.Reference position (x 0, y, z 0) same with form of implementation 1, be the mid-way (0, y, 0) of line S1, the S2 of substrate G.As the mid-depth position of establishing substrate G is z=0, then the position d on the z axle of the 1st tiliting axis 38a 1Be preferably 0mm≤d 1≤ 20mm, position-d of tiliting axis 39a 2Be preferably-20mm≤d 2≤ 0mm.
The installation site of the 1st supporting rod 35a and the 2nd supporting rod 36a is identical with the occasion of form of implementation 1.The 1st keeping arm 38b can the 1st tiliting axis 38a be that the center is freely turned round, by arbitrarily angled maintenance the 1st swivel angle plate 31.Here, the 1st keeping arm 38b and the 1st tiliting axis 38a are called as the 1st inclining rotary mechanism.Equally, the 2nd keeping arm 39b can the 2nd tiliting axis 39a be that the center is freely turned round, by arbitrarily angled maintenance the 2nd swivel angle plate 32.The 2nd keeping arm 39b and the 2nd tiliting axis 39a are called as the 2nd inclining rotary mechanism.
Revolution control part 40 can use the turning force of electric motor or fluid cylinder to make the 1st swivel angle plate 31 and the 2nd swivel angle plate 32 revolution predetermined angulars, also can be by arm or connecting rod with swivel angle plate 31,32 is turned round.The 1st keeping arm 38b and the 2nd keeping arm 39b are parallel to before substrate G cuts off by being initially set in of revolution control part 40 that (x, y) face promptly flatly keeps the 1st swivel angle plate 31 and the 2nd swivel angle plate 32.
Here, the main shaft that comprises the 1st product clamping device 35 of the 1st supporting rod 35a also makes+y axle side opening angle-α ground installs obliquely, the main shaft that comprises the 2nd product clamping device 36 of the 2nd supporting rod 36a also make angle open+α ground tilts to install.
If the thickness of substrate G is 2d 0,,, also can consider to cut off the occasion of the laminated glass substrate that is used for liquid crystal board here as an example.As the mounting surface of establishing the 1st product platform 33 is (x, y ,-d 0), then the position of tiliting axis 38a be as shown in Figure 13 (0, y ,+d 1).This position also can be corresponding to the thickness or the material adjustment of substrate.The position of tiliting axis 39a become (0, y ,-d 2).This position also can be adjusted.Tiliting axis 38a, 39a are preferably from symmetric position, the central position of substrate, i.e. d 1=d 2
In addition, when the gap of the left hand edge of the right hand edge of the 1st product platform 33 and the 2nd product platform 34 is 2g, the pushing position that preferably makes the pushing position of the relative substrate G of the 1st supporting rod 35a and the relative substrate G of the 2nd supporting rod 36a is as shown in Figure 13 near each edge, and the interval of the pushing position of immediate part is preferably the degree identical with 2g.
The following describes the action of disrumpent feelings device 30 with such mechanism.Figure 14 for the line S be the local amplification profile diagram of the disrumpent feelings device at center.In addition, use Figure 10 as being the major portion orthographic plan of the disrumpent feelings device at center with line S.As described above, the position of the 1st tiliting axis 38a become (0, y ,+d 1), the position of the 2nd tiliting axis 39a be (0, y ,-d 2).
Figure 14 (a) is the PR point of Figure 10 and near the sectional drawing the PL point.The marginating compartment of the 1st product platform 33 and the 2nd product platform 34 is 2g 2Figure 14 (b) is the QR point of Figure 10 and near the sectional drawing the QL point.Here, the marginating compartment of the 1st product platform 33 and the 2nd product platform 34 is 2g 1(g1<g 2).As shown in figure 14, make the 2nd product platform 34 at first, then, make the 1st product platform 33 towards CW direction tilt angle θ only towards CW direction cant angle theta.Same with form of implementation 1, with the pushing point of relative the 2nd product platform 34 of substrate right part GR as PR '.This PR ' can regard the force that shear-stress is provided as when line S blocks substrate G.
At first, consider to make the occasion of the 2nd product platform 34 towards CW direction angle of revolution θ.The position of PR ' is from (x 5, y 5, z 5) move to (x 6, y 6, z 6).Here, each coordinate values is as follows.
X 5=g 2
y 5=y 5
z 5=-d 0
x 6=(d 2-d 0)sinθ+g 2cosθ
y 6=y 5
z 6=-(d 2-d 0)(1-cosθ)-g 2sinθ-d 0
Like this, (the x of substrate right part GR 6, y 6, z 6) part become the fixed point of relative the 2nd product platform 34, the disrumpent feelings part of some PR that is positioned at substrate right part GR relatively is from above-mentioned fixed point effect shearing force and drawing force.
Such shearing force and drawing force also act on the some QR shown in Figure 14 (b).Yet, from a PR ' watch to the distance of line S2 with different as shown in Figure 10 to the distance with line S2 of watching from a QR ', QR one side compares with PR, shear-stress and tensile stress become greatly.Even the modulus in tension of glass material is identical in both parts, the QR value of the shear-stress of the leading section of the one-sided supporting of the relative substrate left part of substrate right part GR GL, tensile stress, stress in bending diminishes.This is because the front end length of this one-sided supporting is longer like that shown in Figure 14 (a), so recoverable deformation relaxes stress.For this reason, the some QR that stress is high becomes disrumpent feelings point, and upper substrate G1 is blocked.
Then, when making the 1st product platform 33 towards CW direction tilt angle θ, in line S2 effect shear-stress and tensile stress, hypocoxa G2 blocks.In this occasion, produce at the PL of substrate left part GL point and QL point with above-mentioned same situation.Like this, by the revolution of two product platforms with line S be center court+x axially and-x axial action tensile stress, and ,+z axially with-z axial action shear-stress, so, can easily block substrate G.When blocking, substrate left part GL and substrate right part GR leave mutually.In this occasion, do not contact with the left hand edge portion of substrate right part GR as the right hand edge portion of truncation surface.For this reason, the truncation surface of glass substrate does not produce scar, can obtain level and smooth truncation surface.
During the amount of moving horizontally of calculation level PR, become (d 0+ d 2) sin θ, at d 2=5.0mm, d 0The occasion of=0.75mm, θ=3 ° becomes 0.300mm, obtains the value more much bigger than the amount of the moving horizontally 0.039mm of form of implementation 1.In addition, the amount of movement of the vertical direction of calculation level PR becomes (d 0+ d 2) (1-cos θ), the above-mentioned numerical value of substitution, the vertical shifting amount becomes 0.0079mm.This value forms the shearing force of line S.
, can pull down by removing the pushing of the 1st supporting rod 35a, the 2nd supporting rod 36a by the substrate of cutting apart about line S edge from the product platform.Though make the 1st swivel angle plate 31 and the 2nd swivel angle plate 32 equal angular θ that alternatively only verts, the angle of inclination also can be in each swivel angle plate difference, and the shut-off feature which swivel angle plate verts earlier not to substrate G is exerted an influence.
As described above, by which disrumpent feelings device forward the end face side of substrate G is become and block starting point, make successively towards the inside in the past and block expansion.In this cutting device, because the starting point of blocking of substrate is 1 point, so it is low that size and the existing disrumpent feelings method that acts on the power of substrate compared price.In addition, block the end face neat appearance, do not occur in such problem of blocking end face described in the prior art.In addition, the substrate that has been carried out relatively ruling by laser scribe apparatus also can similarly block.In device of the present invention, can easily change the installation site of each maintainance block and height etc., can arbitrarily set the revolution amount and open-angle 2 α of product platform, so the degree of freedom of design increases.In this form of implementation, line S1, S2 that the substrate that is formed on the laminated glass that is used for liquid crystal board has been described are from (x, y) plane is seen as the occasion of same position, even but the position of S1 and S2 also can use this disrumpent feelings device to block for formation of the terminal of liquid crystal board etc. and leave several mm no problemly.
In addition, the disrumpent feelings device of this form of implementation not only can block laminated glass, and can block the brittle substrate such as glass, semiconductor wafer, ceramic substrate of veneer.Particularly, can alternately block sheet glass up and down by the disrumpent feelings action of alternative in the occasion of the such laminated glass substrate of liquid crystal board, and, do not need to make the operation of substrate counter-rotating, so, can increase substantially operating efficiency.Disrumpent feelings device of the present invention also can be applicable to use heater means heating brittle substrate such as laser, utilize the thermal distortion that takes place at brittle substrate to form the blocking of brittle substrate of line.
(form of implementation 3)
Below, the disrumpent feelings device of this form of implementation 3 is described.Figure 15 is the skeleton view of the part of disrumpent feelings device 50 that this form of implementation is shown in the mode of biopsy cavity marker devices.In this form of implementation, the platform 51a, the 51b that are divided into 2 parts are spaced from each other Z ground, gap and are provided with, and a side platform 51b fixes.The fixing universal coupling 52,53,54 at the back side of platform 51a is provided with 3 pillars 56,57,58 by them.Pillar 57,58 is along the end face setting of the gap Z of platform 51a, and pillar 56 is located at the rear of pillar 57.
In the bottom of each pillar 56,57,58 universal coupling 59,60,61 is installed respectively.Be fixed to pedestal 62 in the other end of universal coupling 59 and 61.Pillar 57 is shorter than other pillar.Pedestal 62 is fixed in by telescopic boom 63 in the other end of universal coupling 60.This telescopic boom 63 be within it wiring electric motor etc. in the portion, according to from the control signal of outside towards the flexible arm of length direction.
In addition, as the occasion of blocking 1 sheet glass H of brittle substrate, as scheming Figure 16 illustrates above, sheet glass H being configured on the platform.The line S that is formed at upper surface this moment is cross over sheet glass H platform 51a with being positioned at clearance portion, the absorption of 51b ground is fixing.Behind the fastening glass panels H, make telescopic boom 63 elongations or compression like this.
Figure 17 removes the explanatory view that sheet glass H illustrates the state when making telescopic boom 63 elongations.Platform 51a is to be central axis L 1 revolution by the line by shown in 1 long and short dash line that connects universal coupling 59 and 61, and direction is not parallel but the direction of its rotary middle spindle is not rule relatively, has certain angle.That is, the rotating central axis L 1 of the line S of sheet glass and platform 51a is set not parallelly.Like this, the amount of movement of the end face of the gap Z of platform 51a as by shown in each arrow among the figure like that, front side becomes big more in figure more.In addition, along with above-mentioned angle increases, this is inclined to enhancing.
As a result, the end face side of the front of sheet glass H becomes the starting point of blocking of sheet glass, makes the progress of blocking of sheet glass H successively towards the inside in the past.In this disrumpent feelings method, the starting point of blocking is 1 point, so the size that acts on the power of blocking of sheet glass is compared the price step-down with existing disrumpent feelings method.In addition, disrumpent feelings end face is that truncation surface neat appearance ground forms, and does not occur in the problem of blocking end face of sheet glass H such described in the prior art.In addition, also can similarly block for sheet glass by above-mentioned laser scribe apparatus line.Such blocking in the mode, can easily change the installation site of each pillar 56,57,58 and height etc., can arbitrarily set revolution amount and the turning direction of platform 51a, so, the degree of freedom height of design.
In this form of implementation, the opposing party's platform 51b fixes, but also can have identical traversing mechanism for this 51b.In this occasion, the turning direction that need make platform 51b in the opposite direction.
Figure 18 illustrates the enlarged section of the female glass substrate of liquid crystal.The structure of the female glass substrate 70 of liquid crystal is coated to caking agent 72 circumference etc. of female glass substrate 71 of a side as known, clamp granulous separator 73 ground and overlap another female glass substrate 74 ground mother substrate that interfixes.By injecting liquid crystal 75, can obtain not shown liquid crystal board from the clearance portion of aperture between two female glass substrates of being located at 72 layers of caking agents.
For the motherboard that uses specified dimension forms the female glass substrate 70 of liquid crystal and is separated into a plurality of liquid crystal boards, female glass substrate 74 of upside forms line S1 in the above relatively, and female glass substrate 71 of downside uses the substrate that has formed line S2.In existing disrumpent feelings method, when blocking the female glass substrate 70 of liquid crystal, block female glass substrate of a side after, make in the table after the counter-rotating, block female glass substrate of the opposing party.
When using the disrumpent feelings device of this form of implementation, in the female glass substrate 70 of the liquid crystal of Figure 18, before assembling, on female glass substrate 74, rule in advance, block female glass substrate up and down simultaneously by the revolution action of 1 time platform with formation above female glass substrate 71.For this reason, do not need the counter-rotating operation of female glass substrate, can increase substantially operating efficiency.
(form of implementation 4)
Below, the disrumpent feelings device of the invention process form 4 is described.Figure 19 illustrates the biopsy cavity marker devices skeleton view that the major portion of the disrumpent feelings device 80 of this form of implementation constitutes.This is disrumpent feelings device 80 has platform 81a, the 81b same with form of implementation 3.When platform 81a, 81b were Z in the gap of the interstation of the posture that promptly has same mounting surface of the level of establishing, the size of gap Z was the same under this state.Same with form of implementation 1,2, the Central Line that establishes gap Z is the y axle.Bottom and the y axle of platform 81a are non-parallel relatively, and the following rectangular shaft bearing plate 82 with platform 81a is installed.In the bottom of shaft bearing plate 82 axis hole 83 is set, will by this axis hole 83 the axle as rotating shaft L2, can keep platform 81a freely to rotate.By not shown drive unit shaft bearing plate 82 is changeed.Like this, can obtain the action effect identical with form of implementation 3.
(form of implementation 5)
Below, the disrumpent feelings device of the invention process form 5 is described.Figure 20 and Figure 21 illustrate the explanatory view that the major portion of the disrumpent feelings device 90 of this form of implementation constitutes, and Figure 20 is a side elevational view, and Figure 21 is a skeleton view.This is disrumpent feelings device 90 enlarges the degree of freedom of blocking of sheet glass by side by side controlling 6 of parallel linkage.This is disrumpent feelings device 90 has platform 92a, the 92b same with form of implementation 3,4.Platform 92a is a stationary platen, and platform 92b is the platform that can move freely.
As shown in figure 20, platform 92a is fixed in pedestal 91 by 4 pillar 93-96.Platform 92b is configured to the side of platform 92a.Platform 92b is connected to telescopic boom 103-108 by universal coupling 97-102 in its lower section.These telescopic booms 103-108 is the arm that has with the same function of the telescopic boom 63 of Figure 15.Wiring electric motor etc. in the inside of telescopic boom, the length of its length direction is telescopically controlled according to the control signal freedom.
The bottom of each telescopic boom 103-108 is connected to pedestal 91 by universal coupling 109-114.According to the length of controlling these telescopic booms 103-108 from the control signal of control part 115 shown in Figure 21 independently.As shown in figure 21,6 dihedrals that form and 6 dihedrals that formed by the universal coupling 109-114 on the pedestal 91 of the universal coupling 97-102 below platform 92b are mutual different shape.Uniformly select the position of platform 92b and the angle of the relative horizontal plane of mounting surface arbitrarily by the extension and contraction control of telescopic boom.Use 6 telescopic boom of such expanding-contracting action arranged side by side the revolution amount of controlled member thing to be controlled or the mechanism that the position is controlled is realized by parallel mechanism.
When blocking sheet glass, at first such as shown in figure 21, relative platform 92a separates specified gap makes platform 92b become same plane earth control posture.Then, make line S become top and the center ground that is positioned at clearance portion configuration sheet glass H on the platform.Under this state, sheet glass H is fixed in each 92a, 92b by for example vacuum suck or other method.Form the occasion of insulating layer films such as silicon in glass surface, also can fix by electrostatic adhesion.
Platform 92b makes each flexible wall become the specified length crustal extension according to the control signal from control part 115, thereby makes the parallel linkage action.Similarly central axis L 3 is made platform 92b revolution as imaginary axis with form of implementation 3.Central axis L 3 is positioned at the below of platform 92b, and is not parallel with line S.That is, central axis L 3 is in the relation of reversing with line S in space coordinates.
Figure 22 is the side elevational view that the disrumpent feelings device 90 of the state that blocks sheet glass H is shown.Same with form of implementation 3, the direction of the rotating shaft direction of can ruling relatively makes platform 92b revolution with having certain angle.Therefore, with block the block development that starting point from front successively make sheet glass H of front face side as sheet glass H.For this reason, the big I of the power of blocking that acts on sheet glass H is less, fitly the truncation surface of processing glass sheets H.In addition, the sheet glass that relatively forms the line of blind crackle by laser applies the block power littler than the past and also it can be blocked.
In this form of implementation, can set rotating shaft arbitrarily by parallel linkage corresponding to the thickness and the shape of the sheet glass that becomes object.In addition, finish block after, such as shown in figure 23, make the end face of the sheet glass H that blocks once more make platform 92b parallel mutually no longer contiguously, and form step with platform 92a.In addition, can easily handle sheet glass H after blocking thus.
In addition, such as shown in figure 24 at the periphery that sheet glass is configured to the zone of platform 92b, the jack-up pin 116 that configuration can freely move up and down.After finishing the blocking, flatly platform 92b is kept of sheet glass, discharge the absorption of the sheet glass that blocks, make 116 actions of jack-up pin, can lift sheet glass from platform 92b.Then, also can between sheet glass H that cuts off like that as shown in figure 24 and platform 92b, insert and remove material hand (removing material Ha Application De) 117, lift sheet glass H, carry the sheet glass H after blocking.Therefore, can obtain easily to carry the effect of sheet glass H to subsequent processing.
In addition, in this form of implementation, the occasion of blocking 1 glass sheets has been described, but has blocked as shown in Figure 18 also applicable this form of implementation of occasion that forms the female glass substrate of liquid crystal of line at female up and down glass substrate of an example of conduct applying brittle substrate.This occasion does not make counter-rotating in the table of crystal liquid substrate can block female glass substrate on two sides.
(form of implementation 6)
The following describes the disrumpent feelings method of the invention process form 6.The disrumpent feelings method of the brittle substrate of this form of implementation refers to as aforesaid substrate G the female glass substrate 120 of 1 liquid crystal be blocked the manufacture method of established practice setting shape, a plurality of liquid crystal glass bases 121 of acquisition.In order to obtain to need various manufacturing processes from the female glass substrate 120 of 1 liquid crystal according to the actuate signal liquid crystal board of unit display image or literal according to pixels.
The substrate that will comprise TFT, scan electrode, signal electrode, pixel electrode is called TFT substrate (being also referred to as the AM substrate), the substrate that will comprise colour filter is called substrate in opposite directions, and then liquid crystal board is for fit above-mentioned TFT substrate and substrate in opposite directions, at the goods in stage of this two substrates filling liquid crystal.The female glass substrate 120 of above-mentioned liquid crystal refers to the substrate (female adhesive substrates) in substrate in opposite directions (being called parent phase to the substrate) stage before applying is blocked preceding TFT substrate (claiming female TFT substrate) and blocked.Therefore, the adhesive substrates that blocks becomes liquid crystal glass base 121 (adhesive substrates).Filling liquid crystal in liquid crystal glass base 121, the inlet of sealing liquid crystal at the electrode of substrate edges, becomes the liquid crystal board of the state that can connect flat cable.
For the location of disrumpent feelings method in the manufacturing process of above-mentioned liquid crystal board of clear and definite this form of implementation, further increase explanation.In order to obtain multi-disc liquid crystal glass base 121, need the multiple operation of blocking from the female glass substrate 120 of 1 liquid crystal.Which part that this line or truncation surface by substrate are positioned at liquid crystal board is distinguished.For example (A) the female glass substrate 120 of liquid crystal that will close substrate as putting up greatly of many chamferings operation, (B) that be divided into each liquid crystal glass base 121 of regulation shape operation etc. of blocking that operation, (C) be used to take out the electrode part of blocking that be used for exposing liquid crystal injecting port under the state of many chamferings is its example.The order of above-mentioned each operation does not here need to be predetermined, but the operation of (A), (B) is contained in this form of implementation at least.In addition, in the operation of (A),, then need repeatedly to block operation as long as line S is formed at the female glass substrate 120 of liquid crystal with reticulation (also claiming the cross line).
Figure 25 illustrates the disrumpent feelings method that comprises so female glass substrate 120 of the liquid crystal that blocks operation.This disrumpent feelings method comprises (1) boxlike shovel loader, (2) the 1st base board delivery devices, (3) the 1st chalkers, (4) the 2nd chalkers, (5) the 2nd base board delivery devices, (6) the 1st disrumpent feelings devices, (7) the 2nd disrumpent feelings devices, makes multi-disc liquid crystal glass base 121 via these devices.For this reason, such operation of blocking is called the automatic transversal of liquid crystal mother substrate.
As shown in figure 25, boxlike shovel loader 122 is contained in the female glass substrate 120 of multi-disc liquid crystal in the box and is kept.The R1 of feed robot takes out the female glass substrate 120 of liquid crystal from the box of boxlike shovel loader 122, is transplanted on the 1st base board delivery device 123.The female glass substrate 120 of liquid crystal that the 1st base board delivery device 123 is used for supplying with from the R1 of feed robot navigates to the allocation of platform.This location is pressed to steady brace by the end face with the female glass substrate 120 mutual orthogonals of liquid crystal and carries out.
Transfer robot R2 is used for the female glass substrate 120 of the liquid crystal of mounting on platform is transported to the prescribed position of the 1st chalker 124.Female TFT substrate in the female glass substrate 120 of liquid crystal is made as 120a, parent phase is made as 120b to substrate.In addition, the machined surface of substrate and form of implementation 1,2 similarly form and (x, y) parallel face.The 1st chalker 124 for example becomes with parent phase and forms line S1 abreast respectively to the x of substrate 120b axle or y direction of principal axis,, uses the such scribble method that illustrates here in the prior art example.
Transfer robot R3 takes out the female glass substrate 120 of the liquid crystal that forms line S1 from the 1st chalker 124, with following counter-rotating, offers transfer robot R4 above making.Transfer robot R4 is used for the female glass substrate 120 of the liquid crystal after the counter-rotating is transported to the prescribed position of the 2nd chalker 125.X axle or y direction of principal axis ground that the 2nd chalker 125 is parallel to female TFT substrate 120a form line S2 respectively.Position and its length (paint data) of these line S1, S2 are controlled with CPU by not shown control.
The female glass substrate 120 of liquid crystal that forms line on the two sides is by carrying machine R5 to be transplanted on the 2nd base board delivery device 126.The female glass substrate 120 of liquid crystal that the 2nd base board delivery device 126 is used for supplying with from transfer robot R5 navigates to allocation.Transfer robot R6 is transplanted on mounting the allocation of the 1st disrumpent feelings device 127 in the female glass substrate 120 of the liquid crystal of the 2nd base board delivery device 126.
The 1st disrumpent feelings device 127 and the 2nd disrumpent feelings device 128 are same with the disrumpent feelings device of form of implementation 1 or 2, so, omit the structure explanation.The 1st disrumpent feelings device 127 pushes fixing across the female glass substrate 120 of liquid crystal of the 1st 127a and the 2nd 127b configuration toply, the platform that makes a side as shown in Figure 4 court+z direction and-z direction revolution or make both sides' platform revolution in the same direction simultaneously as shown in Figure 11, thereby the female glass substrate 120 of liquid crystal is blocked squarely.
Transfer robot R7 takes out the female glass substrate 120 of the liquid crystal that blocks squarely from platform 127b, and the allocation that navigates to the 2nd disrumpent feelings device 128 is promptly across 2 platform 128a, location, 128b ground mounting.The 2nd disrumpent feelings device 128 blocks the female glass substrate 120 of liquid crystal.Here the substrate of Huo Deing becomes the liquid crystal glass base 121 of regulation shape.These liquid crystal glass bases 121 are transferred by transfer robot R8 and the 3rd base board delivery device 129, enter the manufacturing process of next liquid crystal board.
Below, with existing disrumpent feelings method the disrumpent feelings method of this form of implementation with above operation is described with comparing.Figure 26 blocks the process picture sheet of the occasion of the female glass substrate 120 of liquid crystal for using existing disrumpent feelings device.Figure 27 blocks the process picture sheet of the occasion of the female glass substrate 120 of liquid crystal for using the disrumpent feelings device of the present invention.But it is 1 occasion that Figure 26 owing to illustrate blocks operation, so, not with Figure 25 to block process number consistent.
Existing cutting device is according to method shown in Figure 2, forms line S at a side's of sheet glass 1 face, pushes disrumpent feelings bar 4 at the opposing party's of sheet glass 1 face, makes sheet glass 1 deflection, thereby blocks sheet glass 1.In addition, according to method shown in Figure 3, the partial action tensile stress that forms line S make sheet glass 1 deflection, block sheet glass 1.When using so disrumpent feelings device, in the blocking of glass adhering substrate, need the operation shown in Figure 26 (b)-(g).
That is, make female TFT substrate 120a of the female glass substrate 120 of liquid crystal shown in Figure 26 (a) be in the top, use chalker as (b), to form line S1 at female TFT substrate 120a.As (c), use reversing gear to make female glass substrate 120 counter-rotatings of liquid crystal then.Then, as (d), disrumpent feelings bar is pushed on parent phase to substrate 120b, makes crack propagation, block female TFT substrate 120a perpendicular to female TFT substrate 120a.Then, keep the female glass substrate 120 of liquid crystal, use chalker shown in (e), to form line S2 at parent phase to substrate 120b like that.Reusing reversing gear reverses the female glass substrate 120 of liquid crystal as (f).Then, as (g), disrumpent feelings bar is pressed to female TFT substrate 120a, makes perpendicular to the crack propagation of parent phase to substrate 120b.Then, the female glass substrate about 120 of liquid crystal is separated, then shown in (h), like that the female glass substrate 120 of liquid crystal is blocked into a plurality of liquid crystal glass bases 121.Yet, in the method, need the counter-rotating operation of No. 2 substrates.
Yet when using the disrumpent feelings device of this form of implementation 1 or 2, operation can be corresponding shown in the female glass substrate 120 usefulness Figure 27 (b)-(f) of liquid crystal relatively.That is, make the parent phase of the female glass substrate 120 of liquid crystal shown in Figure 27 (a) be positioned at the top, utilize the 1st chalker 124 of Figure 25 shown in (b), to form line S1 at parent phase to substrate 120b like that to substrate 120b.Then, as (c), use reversing gear to make female glass substrate 120 counter-rotatings of liquid crystal.Shown in (d), use the 2nd chalker 125 to form line S2 like that at female TFT substrate 120a.
The female glass substrate 120 of liquid crystal that will form line on the two sides is set to the 1st disrumpent feelings device 127 of Figure 25, make a side platform be turned back to upside and downside, then make vertical crack respectively towards the thickness direction expansion of substrate at female TFT substrate 120a and parent phase to substrate 120b like that, run through each substrate as (e) with (f).For this reason, produce so-called crackle.When separating liquid crystal mother glass substrate 120 about present dynasty, shown in (g), obtain the liquid crystal glass base 121 that blocks like that.According to this method, the counter-rotating operation of substrate can be corresponding by 1 time.
Above operation is for for example blocking the female glass substrate 120 of liquid crystal the occasion of squarely.Such as shown in figure 25, the female glass substrate 120 of liquid crystal forms line with reticulation relatively, block into the occasion of liquid crystal glass base 121 of the shape of smaller szie, the operation difference of Figure 26 and Figure 27 is bigger, in the disrumpent feelings method of this form of implementation, except the smoothness of the truncation surface of substrate, also can obtain to save the effect of the counter-rotating operation of substrate.
(form of implementation 7)
The following describes the disrumpent feelings method of the invention process form 7.The disrumpent feelings method of the brittle substrate of this form of implementation is the method that the female glass substrate 130 of liquid crystal is blocked into a plurality of liquid crystal glass bases 131 as shown in Figure 28.The substrate that will comprise TFT, scan electrode, signal electrode, pixel electrode is called the TFT substrate, and the substrate that will comprise colour filter is called parent phase to substrate.The substrate that the parent phase of conduct the 1st brittle substrate that the female glass substrate 130 of this liquid crystal does not form line for being fitted by sealing agent 132 obtains to female TFT substrate 130a of substrate 130b and conduct the 2nd hard brittle material that is pre-formed line S2.
Figure 29 is the pie graph of the automatic transversal of the female glass substrate of liquid crystal that the disrumpent feelings method of the female glass substrate 130 of such liquid crystal is shown.This disrumpent feelings method comprises (1) boxlike shovel loader, (2) the 1st base board delivery devices, (3) the 1st chalkers, (4) the 1st disrumpent feelings devices, (5) the 2nd base board delivery devices, (6) the 2nd disrumpent feelings devices, (7) the 3rd base board delivery devices, makes multi-disc liquid crystal glass base 131 via these devices.
In Figure 29, the boxlike shovel loader 133 of (1) is used for that the female glass substrate 130 of multi-disc liquid crystal is contained in box and is kept.The R1 of feed robot takes out the female glass substrate 130 of liquid crystal from the box of boxlike shovel loader 133, is transplanted on the 1st base board delivery device 134 shown in (2).The female glass substrate 130 of liquid crystal that the 1st base board delivery device 134 is used for transferring navigates to the allocation of platform.
Transfer robot R2 is used for the female glass substrate 130 of the liquid crystal of mounting on platform is transported to the prescribed position of the chalker 135 of (3).Chalker 135 is used at parent phase shown in Figure 28 formation line S1 above substrate 130b.
Transfer robot R3 takes out the female glass substrate 130 of the liquid crystal that forms line S1 from chalker 135, is transplanted on the allocation of the 1st disrumpent feelings device 136 of (4).Be suitable for the disrumpent feelings device that illustrates by form of implementation 1-5 at the 1st disrumpent feelings device 136.Figure 29 illustrates the occasion of the disrumpent feelings device that is suitable for form of implementation 1 or 2, pushing is fixed above the female glass substrate 130 of the liquid crystal of the 1st 136a and the 2nd 136b ground mounting, make a side platform revolution or both sides' platform is turned round simultaneously, thereby the female glass substrate 130 of liquid crystal is blocked squarely.
Transfer robot R4 takes out the female glass substrate 130 of the liquid crystal that blocks squarely, and mounting is to the platform of the 2nd base board delivery device 137 of (5).Transfer robot R5 is used for becoming the allocation that the female glass substrate 130 of quadrate liquid crystal is transplanted on the 2nd disrumpent feelings device 138 of (6) with blocking.The 2nd disrumpent feelings device 138 blocks established practice setting shape with the female glass substrate 130 of liquid crystal, obtains a plurality of liquid crystal glass bases 131.The liquid crystal glass base 131 that blocks is transferred by transfer robot R6 and the 3rd base board delivery device 139, enters into the manufacturing process of next liquid crystal board.As the 2nd disrumpent feelings device, be useful in the disrumpent feelings device that illustrates among the form of implementation 1-5.
In so disrumpent feelings method, do not need the reversing gear of the female glass substrate 130 of liquid crystal, like that can be corresponding shown in Figure 29 (3) by 1 disrumpent feelings device.
(form of implementation 8)
Below, the disrumpent feelings method of the invention process form 8 is described.The disrumpent feelings method of the brittle substrate of this form of implementation is characterised in that uses the two sides chalker.In addition, the female glass substrate 140 of the liquid crystal of this form of implementation is different with the female glass substrate 130 of the liquid crystal of form of implementation 7, is not pre-formed line S at female TFT glass substrate and parent phase to substrate.
Figure 30 is the pie graph of the automatic transversal of the female glass substrate of liquid crystal that the disrumpent feelings method of the female glass substrate 140 of such liquid crystal is shown.This disrumpent feelings method comprises (1) boxlike shovel loader 142, (2) the 1st base board delivery devices 143, (3) the 1st two sides chalkers 144, (4) the 2nd base board delivery devices 147, (5) the 1st disrumpent feelings device 148, (6) the 3rd base board delivery devices 149, (7) the 2nd two sides chalkers 150, (8) the 4th base board delivery devices 153, (9) the 2nd disrumpent feelings device 154, (10) the 5th base board delivery devices 155, makes multi-disc liquid crystal glass base 141 via these devices.
For the R1 of feed robot, transfer robot R2-R7, the 1st base board delivery device 143,147,149,153,155, since identical with occasion function shown in the form of implementation 6,7, so omit explanation.
The 1st two sides chalker 144 has a plurality of 145a and 145b, be located at the scribe head fabricated section 146a of these device central authorities, remain in the scribe head 146b up and down of scribe head fabricated section 146a with can move freely.When the female glass substrate 140 of liquid crystal was transplanted on the part of scribe head fabricated section 146a by platform 145a, the part of the upper and lower surface of the female glass substrate 140 of liquid crystal remained bridge status with entering into process zone.Scribe head 146b carries out the line of upper and lower surface by this bridging part of scanning.
As chalker, as the explanation of prior art example, have the occasion of using superhard metal system or adamantine wheeled cutting machine and use the occasion of carrying out the laser scriber of work by laser.In the occasion of wheeled cutting machine mode, 2 synchronously ground, two sides revolutions mobile (rotation) of the female glass substrate 140 of crimping liquid crystal of wheeled cutting machine, thus form line S1 and S2 simultaneously.In addition,,, scan simultaneously, follow this illuminated portion and carry out a cooling by refrigerant with the two sides of 2 light spot to the female glass substrate 140 of liquid crystal in the occasion of laser scribing mode.Like this, utilize blind stroke of thermal distortion of glass material.The structure of the 2nd two sides chalker 150 and the 1st two sides chalker 144 are same.
The 1st disrumpent feelings device 148 and the 2nd disrumpent feelings device 154 block the device of substrate for making the line S that is formed at the female glass substrate of liquid crystal 140 two sides with becoming truncation surface.As by as described in form of implementation 1 or 2, the platform about maintenance also makes its gap not parallel, at least one side's revolution of the platform about making.In Figure 30, use the disrumpent feelings device of this mode, in the 1st disrumpent feelings device 148, the gap of platform 148a, 148b is not parallel.For the 2nd disrumpent feelings device 154, also make the gap of platform 154a, 154b not parallel.
As the 1st disrumpent feelings device 148 and the 2nd disrumpent feelings device 154, the occasion that makes is otherwise arranged also.For example, use Figure 20-parallel linkage shown in Figure 23 to keep carrying out the platform of the side in 2 platforms of fixed as the female glass substrate 140 of mounting liquid crystal form of implementation 5 explanations.In addition, thus the mode for will as rotating shaft this revolution being blocked from the axle of the position that line is left when the base board cutting.In the occasion of this mode, the gap of shown in Figure 30 148a, 148b is parallel with the gap of platform 154a, 154b.
According to the disrumpent feelings method of this form of implementation, do not need the operation of the top and bottom counter-rotating of the female glass substrate 140 of liquid crystal like this, do not need to be provided with the reversing gear of substrate, can reduce the area that is provided with of the female glass substrate transversal of liquid crystal.
Disrumpent feelings device according to the application's brittle substrate, for the substrate that forms line, when blocking substrate, block power in an end effect of line, so, blocking from this of substrate is one distolateral towards another distolateral expansion successively, can fitly form the end face of base board cutting.In addition, the power of blocking of effect is compared much smaller with existing disrumpent feelings method, can make disrumpent feelings device body miniaturization.
According to the disrumpent feelings method of the application's brittle substrate, blocking into the operation of multi-disc liquid crystal glass base from the female glass substrate of 1 liquid crystal, do not make the substrate counter-rotating can block the two sides of the female glass substrate of liquid crystal by 1 time operation.For this reason, can reduce the counter-rotating operation that is used for base board cutting.

Claims (18)

1. the cutting device of a brittle substrate is characterized in that: have the 1st, the 2nd product platform, the 1st product clamping device, the 2nd product clamping device, slide mechanism, inclining rotary mechanism and revolution control part;
1st, 2 product platforms are mounted with at least at 1 face has the brittle substrate of line and makes between the therebetween crack of above-mentioned line;
When with above-mentioned the 2nd product platform above-mentioned the 1st product edge of table in opposite directions as the 1st edge, with above-mentioned the 1st product platform above-mentioned the 2nd product edge of table in opposite directions during as the 2nd edge, the part that is positioned at above-mentioned the 1st edge of pushing of the 1st product clamping device and fixing above-mentioned brittle substrate;
The part that is positioned at above-mentioned the 2nd edge of pushing of the 2nd product clamping device and fixing above-mentioned brittle substrate;
This slide mechanism towards making above-mentioned the 1st product platform and the 1st product clamping device provide pressure from line with the rectangular direction of the line of above-mentioned brittle substrate with being integral with retreating;
This inclining rotary mechanism is a rotating shaft with the tiliting axis parallel with the line of above-mentioned brittle substrate, can make the revolution of above-mentioned the 2nd product platform and the 2nd product clamping device one;
This revolution control part is controlled above-mentioned inclining rotary mechanism, makes the revolution of above-mentioned the 2nd product platform and the 2nd product clamping device;
Above-mentioned the 1st product platform and the 2nd product platform dispose two edge in opposite directions not parallelly, and the tiliting axis of above-mentioned the 2nd product platform is arranged to be present in the thickness range of substrate when the line of above-mentioned brittle substrate is watched.
2. the cutting device of brittle substrate according to claim 1 is characterized in that:
Above-mentioned the 1st product clamping device has near the 1st supporting rod of line of the above-mentioned brittle substrate of pushing,
Above-mentioned the 2nd product clamping device has near the 2nd supporting rod of line of the above-mentioned brittle substrate of pushing,
When above-mentioned the 2nd product platform turned round, above-mentioned the 2nd supporting rod was as being worked near the force of the substrate portion effect shearing force the above-mentioned line.
3. the cutting device of brittle substrate according to claim 1, it is characterized in that: the tiliting axis of above-mentioned the 2nd product platform is positioned at the top and following center of above-mentioned brittle substrate.
4. the cutting device of a brittle substrate is characterized in that: have the 1st, the 2nd product platform, the 1st product clamping device, the 2nd product clamping device, the 1st inclining rotary mechanism, the 2nd inclining rotary mechanism and revolution control part;
1st, 2 product platform mountings are formed with the brittle substrate of line and make between the therebetween crack of above-mentioned line at 1 face at least;
When with above-mentioned the 2nd product platform above-mentioned the 1st product edge of table in opposite directions as the 1st edge, with above-mentioned the 1st product platform above-mentioned the 2nd product edge of table in opposite directions during as the 2nd edge, the part that is positioned at above-mentioned the 1st edge of pushing of the 1st product clamping device and fixing above-mentioned brittle substrate;
The part that is positioned at above-mentioned the 2nd edge of pushing of the 2nd product clamping device and fixing above-mentioned brittle substrate;
The 1st inclining rotary mechanism is a rotating shaft with the tiliting axis parallel with the line of above-mentioned brittle substrate, can make the revolution of above-mentioned the 1st product platform and the 1st product clamping device one;
The 2nd inclining rotary mechanism is a rotating shaft with the tiliting axis parallel with the line of above-mentioned brittle substrate, can make the revolution of above-mentioned the 2nd product platform and the 2nd product clamping device one;
This revolution control part is controlled the 1st and the 2nd inclining rotary mechanism, makes the revolution of above-mentioned the 1st product platform and the 1st product clamping device and above-mentioned the 2nd product platform and the 2nd product clamping device;
Above-mentioned the 1st product platform and the 2nd product platform dispose two edge in opposite directions not parallelly,
The tiliting axis of above-mentioned the 1st product platform is arranged at the upside of the line substrate nearby of above-mentioned brittle substrate.
The tiliting axis of above-mentioned the 2nd product platform is arranged at the downside of the line substrate nearby of above-mentioned brittle substrate.
5. the cutting device of brittle substrate according to claim 4 is characterized in that:
Above-mentioned the 1st product clamping device has near the 1st supporting rod of line of the above-mentioned brittle substrate of pushing,
Above-mentioned the 2nd product clamping device has near the 2nd supporting rod of line of the above-mentioned brittle substrate of pushing,
When above-mentioned the 1st product platform or the revolution of the 2nd product platform, above-mentioned the 1st supporting rod or the 2nd supporting rod are as near the substrate portion effect shearing force the above-mentioned line and the force of drawing force are worked.
6. the cutting device of brittle substrate according to claim 4, it is characterized in that: the tiliting axis of the tiliting axis of above-mentioned the 1st product platform and the 2nd product platform is arranged at and is in laterally zygomorphic position when the mid-depth of above-mentioned brittle substrate is watched.
7. dividing method fixedly is formed with the brittle substrate of line, on separate two minutes with a gap product platform, makes above-mentioned line be positioned at above-mentioned gap location, cuts apart described brittle substrate by turning round at least one product platform, it is characterized in that:
Above-mentioned the 1st product platform and the 2nd product platform dispose two edge in opposite directions not parallelly,
Above-mentioned brittle substrate is fixed on above-mentioned the 1st product platform and the 2nd product platform, and makes the gap location of line between above-mentioned the 1st product platform and the 2nd product platform of above-mentioned brittle substrate,
Is the center rotation with above-mentioned the 1st product platform and/or the 2nd product platform with the axle that fascinates separately parallel with above-mentioned line, thereby above-mentioned brittle substrate is cut apart to the other end of above-mentioned line successively from an end of above-mentioned line.
8. dividing method according to claim 7 is characterized in that:
The tiliting axis setting of above-mentioned the 2nd product platform is present in the thickness range of substrate when the line of above-mentioned brittle substrate is watched.
9. dividing method according to claim 8 is characterized in that:
The tiliting axis of above-mentioned the 2nd product platform is arranged on the top and following central position of above-mentioned brittle substrate.
10. dividing method according to claim 8 is characterized in that:
If will with above-mentioned the 2nd product platform above-mentioned the 1st product edge of table in opposite directions as the 1st edge, with above-mentioned the 1st product platform above-mentioned the 2nd product edge of table in opposite directions as the 2nd edge, be the 1st product supporting rod with the parts of the part that is positioned at above-mentioned the 1st edge of pushing and fixing above-mentioned brittle substrate; The parts of the part that is positioned at above-mentioned the 2nd edge of pushing and fixing above-mentioned brittle substrate are the 2nd product supporting rod,
When above-mentioned the 2nd product platform turned round, above-mentioned the 2nd supporting rod was as being worked near the force of the substrate portion effect shearing force the above-mentioned line.
11. dividing method according to claim 7 is characterized in that:
The tiliting axis of above-mentioned the 1st product platform is arranged at the upside of the line substrate nearby of above-mentioned brittle substrate,
The tiliting axis of above-mentioned the 2nd product platform is arranged at the downside of the line substrate nearby of above-mentioned brittle substrate.
12. dividing method according to claim 7 is characterized in that:
If will with above-mentioned the 2nd product platform above-mentioned the 1st product edge of table in opposite directions as the 1st edge, with above-mentioned the 1st product platform above-mentioned the 2nd product edge of table in opposite directions as the 2nd edge, be the 1st product supporting rod with the parts of the part that is positioned at above-mentioned the 1st edge of pushing and fixing above-mentioned brittle substrate; The parts of the part that is positioned at above-mentioned the 2nd edge of pushing and fixing above-mentioned brittle substrate are the 2nd product supporting rod,
Above-mentioned the 1st supporting rod or the 2nd supporting rod are as near the substrate portion effect shearing force the above-mentioned line and the force of drawing force are worked when above-mentioned the 1st product platform or the revolution of above-mentioned the 2nd product platform.
13. dividing method according to claim 12 is characterized in that:
The tiliting axis of the tiliting axis of above-mentioned the 1st product platform and the 2nd product platform is arranged at and is in laterally zygomorphic position when the mid-depth of above-mentioned brittle substrate is watched.
14. each the described dividing method according to claim 7-13 is characterized in that:
This brittle substrate is female adhesive substrates that the 1st female brittle substrate and the 2nd brittle substrate fit together in opposite directions.
15. the segmenting system of a female adhesive substrates, this mother's adhesive substrates constitutes for being fit together in opposite directions by the 1st female brittle substrate and the 2nd female brittle substrate,
It is characterized in that: have the 1st transfer robot, the 1st chalker, the 2nd transfer robot, the 2nd chalker, the 3rd transfer robot, the 1st cutting device, the 4th transfer robot, the 2nd cutting device,
Wherein the 1st transfer robot is carried to female adhesive substrates at the 1st chalker place of ruling on the 1st female brittle substrate of above-mentioned female adhesive substrates;
The 1st chalker is rule on the 1st female brittle substrate of the female adhesive substrates that is come by above-mentioned the 1st transfer robot carrying;
The 2nd transfer robot will be reversed up and down by the female adhesive substrates of the 1st chalker after forming line on the 1st female brittle substrate, and be transported to the 2nd chalker place;
The 2nd chalker is rule on the 2nd female brittle substrate of the female adhesive substrates that is come by above-mentioned the 2nd transfer robot carrying;
The 3rd transfer robot will by the 2nd chalker after forming line on the 2nd female brittle substrate female adhesive substrates and be transported to each described the 1st cutting device of claim 1-6;
The 1st cutting device is described any the 1st cutting device of claim 1-6, and will be divided into oblong-shaped by female adhesive substrates that the carrying of the 3rd transfer robot comes;
The 4th transfer robot will be divided into OBL adhesive substrates and be transported to the 2nd cutting device;
The 2nd cutting device is each described the 2nd cutting device of claim 1-6, also will carries the next adhesive substrates that OBL oblong-shaped adhesive substrates is divided into definite shape that is divided into by the 4th transfer robot.
16. the segmenting system of a female adhesive substrates, this mother's adhesive substrates constitutes for fitting together in opposite directions with the wherein one side of the 1st female brittle substrate with at the face that the 2nd female brittle substrate is formed with certain line,
It is characterized in that: have the 5th transfer robot, chalker, the 6th transfer robot, the 1st cutting device, the 7th transfer robot, the 2nd cutting device,
The 5th transfer robot is carried to chalker with above-mentioned female adhesive substrates;
The line on the 1st female brittle substrate of the female adhesive substrates that comes by above-mentioned the 5th transfer robot carrying of this chalker;
The 6th transfer robot will be transported to the 1st cutting device by female adhesive substrates that described chalker forms after ruling on the 1st female brittle substrate;
The 1st cutting device will be for being divided into described each the 1st cutting device of OBL claim 1-6 by female adhesive substrates that the 6th transfer robot carrying comes;
The 7th transfer robot will be divided into OBL female adhesive substrates and be transported to the 2nd cutting device;
The 2nd cutting device is described each the 2nd cutting device of the claim 1-6 of the adhesive substrates that will be divided into the regulation shape by the oblong-shaped adhesive substrates that the 7th transfer robot carrying comes.
17. the segmenting system of a female adhesive substrates, this mother's adhesive substrates constitutes for the 1st female brittle substrate and the 2nd female brittle substrate are fit together in opposite directions,
It is characterized in that: have the 8th transfer robot, the 1st two sides chalker, the 9th transfer robot, the 1st cutting device, the 10th transfer robot, the 2nd two sides chalker, the 11st transfer robot, the 2nd cutting device,
The 8th transfer robot is carried to above-mentioned female adhesive substrates at the chalker place of being rule in its two sides, two sides;
The 1st two sides chalker is rule on the two sides of the female adhesive substrates that is come by above-mentioned the 8th transfer robot carrying;
The 9th transfer robot will be transported to the 1st cutting device by the female adhesive substrates of the 1st two sides chalker after forming line on the two sides;
The 1st cutting device will be for being divided into described each the 1st cutting device of OBL claim 1-6 by female adhesive substrates that the 9th transfer robot carrying comes;
The 10th transfer robot is transported to the 2nd two sides chalker with above-mentioned OBL adhesive substrates;
The 2nd two sides chalker is rule on the two sides of the oblong-shaped adhesive substrates that will be come by the carrying of the 10th transfer robot;
The 11st transfer robot will form the OBL adhesive substrates of ruling by above-mentioned the 2nd two sides chalker and be transported to the 2nd cutting device;
The 2nd cutting device is described each the 2nd cutting device of the claim 1-6 of the adhesive substrates that will be divided into definite shape by the OBL adhesive substrates that the 11st transfer robot carrying comes.
18. the segmenting system of female adhesive substrates according to claim 17, it is characterized in that: above-mentioned the 1st two sides chalker and the 2nd two sides chalker are illuminating laser beam luminous point on the two sides of female adhesive substrates, follow this illuminated portion then and carry out a cooling, the chalker that utilizes the thermal strain of substrate to rule.
CNB028025164A 2001-06-28 2002-06-27 Device and method for breaking fragile material substrate Expired - Fee Related CN1259264C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP196419/01 2001-06-28
JP196419/2001 2001-06-28
JP2001196419 2001-06-28

Publications (2)

Publication Number Publication Date
CN1464866A CN1464866A (en) 2003-12-31
CN1259264C true CN1259264C (en) 2006-06-14

Family

ID=19034236

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028025164A Expired - Fee Related CN1259264C (en) 2001-06-28 2002-06-27 Device and method for breaking fragile material substrate

Country Status (5)

Country Link
JP (4) JP4482328B2 (en)
KR (1) KR100835622B1 (en)
CN (1) CN1259264C (en)
TW (1) TW559620B (en)
WO (1) WO2003002471A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102473513A (en) * 2009-07-10 2012-05-23 丰田自动车株式会社 Device for cleaving magnet and method for cleaving magnet
CN105643721A (en) * 2016-02-17 2016-06-08 珠海迈科智能科技股份有限公司 PCBA board separation device

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006520278A (en) * 2003-03-17 2006-09-07 バウマン ゲーエムベーハー Breaking device for single ceramic conductor plate
KR101381094B1 (en) * 2005-12-01 2014-04-04 미쓰보시 다이야몬도 고교 가부시키가이샤 Tip holder
DE102006015142B4 (en) * 2006-03-31 2014-02-20 Asys Automatisierungssysteme Gmbh Device for breaking semiconductor wafers
CN101182110B (en) * 2007-11-16 2010-08-18 太原风华信息装备股份有限公司 Liquid crystal glass automatic cutting machine
KR101171875B1 (en) * 2008-02-29 2012-08-07 미쓰보시 다이야몬도 고교 가부시키가이샤 Separation device and separation method of mother board for plane display panel
JP5167161B2 (en) * 2009-01-30 2013-03-21 三星ダイヤモンド工業株式会社 Breaking device for brittle material substrate
JP4996703B2 (en) * 2010-02-09 2012-08-08 三星ダイヤモンド工業株式会社 Substrate cutting device
JP5643036B2 (en) * 2010-09-14 2014-12-17 株式会社ディスコ Processing method of optical device wafer
KR20120107722A (en) 2011-03-22 2012-10-04 삼성디스플레이 주식회사 Substrate cutting apparatus and substrate cutting method using the same
JP5839321B2 (en) * 2011-09-29 2016-01-06 不二越機械工業株式会社 Method and apparatus for bonding cutting allowance plate and mounting plate to ingot
US9021837B2 (en) * 2011-12-12 2015-05-05 Nippon Electric Glass Co., Ltd. Method of cleaving and separating a glass sheet and apparatus for cleaving and separating a glass sheet
CN102717404B (en) * 2012-07-18 2015-08-26 东莞市龙健电子有限公司 A kind of PCB board separator
CN102879937B (en) * 2012-10-16 2015-04-22 深圳市华星光电技术有限公司 Sheet splitting device and method of LCD (liquid crystal display) panel
EP2976304A1 (en) * 2013-03-20 2016-01-27 Corning Incorporated Apparatus and method for processing lengths of flexible glass
CN103232157B (en) * 2013-05-10 2015-07-29 深圳市华星光电技术有限公司 A kind of base plate processing device
JP6140012B2 (en) * 2013-07-08 2017-05-31 三星ダイヤモンド工業株式会社 Breaking method for bonded substrates
JP2015034111A (en) * 2013-08-09 2015-02-19 三星ダイヤモンド工業株式会社 Segmentation method of laminated ceramic substrate
CN103412432B (en) * 2013-08-29 2016-07-06 深圳市华星光电技术有限公司 Liquid crystal panel sliver apparatus and splinter method
JP6207307B2 (en) * 2013-09-03 2017-10-04 三星ダイヤモンド工業株式会社 Break device
JP6154713B2 (en) * 2013-09-30 2017-06-28 三星ダイヤモンド工業株式会社 Method and apparatus for breaking brittle material substrate
JP6185812B2 (en) * 2013-09-30 2017-08-23 三星ダイヤモンド工業株式会社 Method and apparatus for breaking brittle material substrate
KR101568012B1 (en) * 2014-02-14 2015-11-12 유엠메카닉스 주식회사 LCD panel cutting device
JP2016043505A (en) * 2014-08-20 2016-04-04 三星ダイヤモンド工業株式会社 Dividing method and dividing device of brittle material substrate
CN104445902B (en) * 2014-12-09 2017-01-04 泉州市永茂电子科技有限公司 Cutting method that a kind of brittle property thin plate fractures cutting machine and thin plate fractures
KR102400550B1 (en) * 2015-03-16 2022-05-23 주식회사 탑 엔지니어링 Breaking system for attached substrate
KR101609782B1 (en) * 2015-04-22 2016-04-06 에스엔티코리아 주식회사 An apparatus for braking a glass plate
DE102016205902A1 (en) * 2015-04-29 2016-11-03 Tridonic Jennersdorf Gmbh Separator for printed circuit boards
US9920219B2 (en) 2015-06-22 2018-03-20 Awi Licensing Llc Soil and dirt repellent powder coatings
JP6716900B2 (en) * 2015-12-04 2020-07-01 三星ダイヤモンド工業株式会社 Cutting device
CN105382946A (en) * 2015-12-17 2016-03-09 哈尔滨新力光电技术有限公司 Automatic efficient splintering machine and method for sapphire LED bar
JP2017177452A (en) * 2016-03-29 2017-10-05 三星ダイヤモンド工業株式会社 End material removal device and end material removal method
CN105784486B (en) * 2016-05-05 2018-09-14 南京林业大学 A kind of veneer elasticity modulus detection method
CN106082617A (en) * 2016-06-22 2016-11-09 苏州市灵通玻璃制品有限公司 Workbench suitable for glass cutting
KR101826235B1 (en) * 2016-08-05 2018-02-06 한국미쯔보시다이아몬드공업(주) Method for dividing glass substrate inducing time difference
KR101854198B1 (en) * 2016-08-05 2018-05-03 한국미쯔보시다이아몬드공업(주) Method for dividing glass substrate including pre-cracking process
KR102331075B1 (en) * 2017-03-17 2021-11-25 주식회사 케이씨텍 Substrate procesing apparatus
JP2017114138A (en) * 2017-03-29 2017-06-29 三星ダイヤモンド工業株式会社 Holding member for breaking
CN107336369B (en) * 2017-06-20 2019-01-04 杭州师范大学钱江学院 Vial segmentation recycling environmental protecting device
KR102064891B1 (en) 2017-08-29 2020-01-10 한국미쯔보시다이아몬드공업(주) Panel breaking device of brittle material substrate and panel breaking method using the same
KR101980606B1 (en) * 2017-08-29 2019-05-21 한국미쯔보시다이아몬드공업(주) Tilting type panel breaking device of brittle material substrate and tilting type panel breaking method using the same
CN108162068A (en) * 2018-01-29 2018-06-15 广东利元亨智能装备有限公司 A kind of board separating device and scoreboard charging equipment
KR102572111B1 (en) * 2018-02-13 2023-08-30 삼성디스플레이 주식회사 Stage for cutting a substrate and a substrate cutting device and the method for operating the substrate cutting device
KR102147126B1 (en) * 2018-03-26 2020-08-25 주식회사 탑 엔지니어링 Apparatus for breaking substrate
US11029139B2 (en) * 2018-07-27 2021-06-08 United States Gypsum Company Wallboard score, snap and edge appearance test procedure
CN111233313B (en) * 2018-11-29 2022-11-01 塔工程有限公司 Substrate cutting device
CN109531829B (en) * 2019-01-28 2021-06-15 林华勇 Ceramic matrix lath splitter of stretching type LED filament lamp
CN110255877A (en) * 2019-06-30 2019-09-20 东莞市佰荣森机械设备有限公司 A kind of high-accuracy glass, which is cut, breaks integral type cutter head
CN110405490B (en) * 2019-07-24 2021-05-28 Tcl华星光电技术有限公司 Cutting device and plate cutting method
JP7098173B2 (en) * 2020-02-12 2022-07-11 三星ダイヤモンド工業株式会社 Brittle material Substrate splitting mechanism
JP2021154502A (en) * 2020-03-25 2021-10-07 三星ダイヤモンド工業株式会社 Breaking method of brittle material substrate and substrate processing device
CN111875241A (en) * 2020-06-29 2020-11-03 江苏亚威艾欧斯激光科技有限公司 Panel cutting groove extends cutting device
CN112405878B (en) * 2020-09-30 2022-09-09 青岛铭青机电有限公司 Automatic board breaking device for ceramic chip products

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5355319A (en) * 1976-10-29 1978-05-19 Nippon Sheet Glass Co Ltd Method of separating plate glass
JPS61172131A (en) * 1985-01-28 1986-08-02 Fuji Photo Film Co Ltd Pick up device for instant photograph
JPS6237050A (en) * 1985-08-12 1987-02-18 Hitachi Ltd Stepping motor for driving throttle valve
JP2961721B2 (en) * 1991-01-16 1999-10-12 旭硝子株式会社 Method and apparatus for cutting sheet glass
JPH0674153B2 (en) * 1991-11-07 1994-09-21 旭硝子株式会社 Method and apparatus for cutting glass plate
JP3042192B2 (en) * 1992-07-29 2000-05-15 三星ダイヤモンド工業株式会社 Method and apparatus for cutting laminated glass substrate
JPH08119654A (en) * 1994-10-25 1996-05-14 Casio Comput Co Ltd Cutting of glass plate and device therefor
JP2904089B2 (en) * 1995-01-30 1999-06-14 双葉電子工業株式会社 Substrate cutting device
JP3095999B2 (en) * 1996-04-15 2000-10-10 株式会社ベルデックス Glass scribing method and apparatus
JPH10209086A (en) * 1997-01-28 1998-08-07 Matsushita Electric Ind Co Ltd Breaking method for plate-shaped work and its equipment
JP3498895B2 (en) * 1997-09-25 2004-02-23 シャープ株式会社 Substrate cutting method and display panel manufacturing method
JP2000249999A (en) * 1999-03-03 2000-09-14 Seiko Epson Corp Manufacture of liquid crystal panel
JP2000250000A (en) * 1999-03-03 2000-09-14 Seiko Epson Corp Production of liquid crystal panel
JP2001206728A (en) * 2000-01-21 2001-07-31 Nakamura Tome Precision Ind Co Ltd Breaking device for glass substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102473513A (en) * 2009-07-10 2012-05-23 丰田自动车株式会社 Device for cleaving magnet and method for cleaving magnet
CN102473513B (en) * 2009-07-10 2014-02-19 丰田自动车株式会社 Device for cleaving magnet and method for cleaving magnet
CN105643721A (en) * 2016-02-17 2016-06-08 珠海迈科智能科技股份有限公司 PCBA board separation device

Also Published As

Publication number Publication date
WO2003002471A1 (en) 2003-01-09
JP4902631B2 (en) 2012-03-21
JP4847513B2 (en) 2011-12-28
CN1464866A (en) 2003-12-31
JP2009078569A (en) 2009-04-16
JP2009101692A (en) 2009-05-14
JP4482328B2 (en) 2010-06-16
JPWO2003002471A1 (en) 2004-10-21
KR20030040392A (en) 2003-05-22
JP2010000805A (en) 2010-01-07
TW559620B (en) 2003-11-01
KR100835622B1 (en) 2008-06-09

Similar Documents

Publication Publication Date Title
CN1259264C (en) Device and method for breaking fragile material substrate
CN1265947C (en) Equipment for cutting liquid crystal display panel
CN101068666A (en) Method and apparatus for scribing brittle material board and system for breaking brittle material board
CN1220101C (en) Apparatus for cutting liquid crystal displaying screen and method for operating cutting with the same apparatus
CN1890074A (en) Substrate machining method, substrate machining device, substrate carrying method, and substrate carrying mechanism
CN1132046C (en) Substrate binding method and device, and method for mfg. LCD
CN1737649A (en) Optical sheet adhesive method and device
CN1591816A (en) Substrate treater and treating method
CN1991478A (en) Method for cutting liquid crystal display panel and method for fabricating liquid crystal display panel
CN1441300A (en) Method for producing LCD
CN101075037A (en) Display device
CN1437044A (en) LCD adhesion machine and method for producing LCD with the same adhering machine
CN1501148A (en) Base plate bonding apparatus for liquid crystal display device
CN1496339A (en) Scribing method, cutter wheel, scribing device using the cutter wheel and device for mfg. cutter wheel
CN1679170A (en) Thin film transistor, liquid crystal display apparatus, manufacturing method
CN101042487A (en) Liquid crystal panel
CN1649799A (en) Fragile material substrate scriber, fragile material substrate processing machine, fragile material substrate polishing device, and fragile material substrate parting system
JP4436592B2 (en) Breaking device for brittle material substrate
CN1437045A (en) Large size substrate and its producing method
CN1974165A (en) Process to separate pieces from a substrate
CN1441301A (en) Method for producing liquid crystal display
CN101061528A (en) Substrate holding structure
CN1577761A (en) Substrate joining method and apparatus
CN1259577C (en) Producing method and arrangement for optical elements mounted with resin film with micro-concave-convex pattern and reflective board
CN1624539A (en) Loader and bonding apparatus for fabricating liquid crystal display device and loading method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1061553

Country of ref document: HK

C14 Grant of patent or utility model
GR01 Patent grant
REG Reference to a national code

Ref country code: HK

Ref legal event code: WD

Ref document number: 1061553

Country of ref document: HK

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060614

Termination date: 20130627