CN1259264C - Device and method for breaking fragile material substrate and system with the device for dividing substrate - Google Patents

Device and method for breaking fragile material substrate and system with the device for dividing substrate Download PDF

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Publication number
CN1259264C
CN1259264C CN 02802516 CN02802516A CN1259264C CN 1259264 C CN1259264 C CN 1259264C CN 02802516 CN02802516 CN 02802516 CN 02802516 A CN02802516 A CN 02802516A CN 1259264 C CN1259264 C CN 1259264C
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China
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substrate
product
brittle material
means
scribing
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CN 02802516
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Chinese (zh)
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CN1464866A (en
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若山治雄
羽阪登
藤井昌宏
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三星钻石工业股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups

Abstract

一种破断装置及破断方法,其中,第1产品台13和第2产品台14配置于滑动台11和倾转台12并且其边缘部具有一定角度。 One kind of breaking apparatus and breaking method, wherein the product of the first stage 13 and second stage product 14 is disposed within the slide table 11 and the turret 12 pour and the edge portion thereof having a certain angle. 两面划线的基板G载置于台上,由第1夹持杆15a和第2夹持杆16a推压固定基板。 G scribing both surfaces of a substrate placed on the stage, the first and the second clamping rod 15a presses the clamping bar fixed substrate 16a. 当使第2产品台14回转时,将夹持杆作为推压点相对基板G的划线S作用剪切力和拉伸力。 When the second stage product 14 rotates, the clamp rod scribe line S shear and tensile forces as the substrate G is relatively pressed point. 为此,夹持杆的间隙少的一方作为破断点起作用,基板G朝左右截断。 For this reason, a small gap as one of the clamping bar broken breakpoint function, the substrate G in the lateral cut.

Description

脆性材料基板的破断装置及其破断方法以及具有该装置的母贴合基板的分断系统 It means breaking a brittle material substrate and a method of its parent breaking apparatus having the bonded substrate cutting system

技术领域 FIELD

本发明涉及用于截断玻璃、半导体晶片、陶瓷等脆性材料基板的脆性材料基板破断装置及其破断方法。 The present invention relates to a cut glass, a semiconductor wafer brittle material substrate, ceramic and other brittle material substrate breaking apparatus and breaking method.

背景技术 Background technique

图1示出相对玻璃板1使用玻璃切割轮2划线时的状态。 1 shows a state where the scribe line using the glass cutter wheel 2 relative to the glass plate 1. 由该划线动作在玻璃板1的表面形成划线S。 A scribe line formed by the surface of the glass scribing operation S. 图中,在下图示出圆的区域的放大断面。 FIG next illustrated enlarged cross-sectional circular area. B示出由该划线形成的垂直方向的裂纹的深度。 B shows the depth of the vertical cracks formed by the scribe line.

图2为示出一般使用的现有的破断装置的示意图。 FIG 2 is a schematic diagram illustrating a conventional breaking apparatus generally used. 在该破断装置中,夹住垫子M在台3上放置在背面形成划线S的玻璃板1。 In the breaking apparatus, the mat M clamped on the table 3 is placed on the back of the glass plate 1 scribe line S is formed. 破断杆4位于玻璃板1的上方。 1 is located above the broken glass plate 4 bar. 该破断杆4在杆状的金属材料4a的下面接合断面呈V字状的硬质橡胶4b,由图中未示出的驱动机构相对玻璃板1保持平行,而且可上下自由移动。 The broken section bar 4 bonding a metal material rod 4a below the V-shaped hard rubber 4b, driven by a mechanism not shown in FIG. 1 relative to the glass sheet held parallel to, and freely movable up and down. 通过玻璃板1使破断杆4的硬质橡胶4b的下端部与划线S一致地从玻璃板1的上方推压。 By breaking the glass plate 1 so hard rubber rod 4b of the lower end portion of the scribe line S uniformly pressed from above the glass plate 1. 这样,玻璃板1在垫子M上稍挠曲,从而使垂直方向的裂纹到达玻璃板表面,沿划线S截断玻璃板1。 Thus, the glass sheet 1 is slightly flexed on the mat M, so that the vertical crack reaches the surface of the glass sheet, the glass sheet 1 cut along the scribe line S.

图3示出公开于日本特开平4-280828号公报的另一破断法。 FIG 3 shows another method is disclosed in broken JP 4-280828 Gazette. 分成2个部分的台3a、3b相互隔开间隙地设置。 Table is divided into two portions 3a, 3b are arranged with a gap from each other. 玻璃板1横跨于两台3a、3b地受到吸引固定并且使形成于上表面的划线S位于间隙部。 1 transversely to the two glass plates 3a, 3b and be attracted by the fixed scribe line S formed on the surface of the portion located in the gap. 通过使一方的台3a沿与下方的间隙平行的回转轴中心轴O稍朝箭头方向回转,从而使玻璃板1挠曲而截断。 By slightly turning direction of the arrow along the gap beneath the one parallel to the rotary shaft 3a station center axis O, so that the glass sheet 1 cut flexing. 通过使台3a、3B同时回转,也可截断玻璃板1。 By stage 3a, 3B while turning, the glass plate 1 can be cut off. 另外,通过在使一方的台3a回转的同时使其从台3b离开,也可不在切断面产生损伤地截断。 Further, 3b away from the station by making one of the station 3a while it is rotating, the cut may not be damaged in the cutting plane.

然而,如上述图1的下图所示那样,划线的深度不一样,存在Da、Db那样的深的部位。 However, as described above in FIG. 1 as shown in the FIG., The depth of the scribe line is not the same, the presence of a deep portion such as Da, Db. 由Sa、Sb示出与该Da、Db对应的划线部位。 A Sa, Sb shown with the chain line portion Da, Db corresponding. 当由上述手法截断该玻璃板1时,即使相对玻璃板1加上一样的截断力,玻璃板1的截断也不一样地进行,在Sa、Sb所示部位,玻璃板的截断先结束。 When the cut glass sheet 1 by the way, even if the opposite glass 1 plus the same cut force, the glass sheet 1 is not the same cut performed, the first cut ends Sa, the portion indicated Sb, glass sheet. 即,在该位置,垂直裂纹达到玻璃板1的下面,此后,以Sa、Sb的部位为起点使玻璃板1的截断朝划线方向进行。 That is, in this position, the vertical crack reaches 1 below the glass sheet, thereafter, to parts Sa, Sb as a starting point that the glass sheet 1 is cut off toward the scribing direction.

因此,在现有的截断方法中,由于以划线的多个部位作为起点地使玻璃板1的截断进行,所以,截断面可能成为屏风状或弯曲,存在商品价值下降的缺点。 Thus, in the conventional cutting method, since a plurality of portions to be scribed as a starting point that the glass sheet 1 is cut, so that the cut surface may be a curved shape or a screen, there is a drawback of lowered commodity value.

另外,为了可防止破断时产生粉尘,还考虑研究了使用激光的激光划线。 In order to prevent generation of dust when breaking, also contemplated investigated laser scribing using a laser. 在由激光划线时,一边向玻璃板照射激光束一边移动,跟随它由冷媒进行点冷却。 When crossed by the laser beam while the laser is irradiated while the glass plate is moved to follow it to the point of the cooling refrigerant. 这样,通过利用玻璃板的热变形,在玻璃板形成细小的划线。 Thus, by using the thermal deformation of the glass sheet, the glass sheet form fine scribe line. 该划线较细,用眼看不到,所以,该划线法也称为盲划。 Scribing the fine, with not watch, therefore, the scribing method is also referred to as blind draw. 在相对进行了盲划的玻璃板由现有破断装置截断的场合,盲划所产生的裂纹的深度较浅,所以需要大的截断力。 Relative to the case were designated blind glass sheet cut by the conventional breaking means, draw the blind crack generated shallow depth, it is necessary to cut a large force. 为此,装置变大,或不能完全截断。 For this purpose, the apparatus becomes large, or not completely cut off.

发明内容 SUMMARY

本发明就是鉴于这样的现有问题点而提出的,其目的在于提供一种可相对各种形状的脆性材料基板减小加到基板的截断力、获得一样的截断面的脆性材料基板破断装置及其方法。 The present invention in view of such conventional problems and has as its object to provide a variety of shapes can be relatively brittle material substrate to reduce the force to cut the substrate to give the same cut surface of the brittle material breaking device and the substrate its methods.

本发明的破断装置的特征在于:具有第1、第2产品台、第1产品夹持装置、第2产品夹持装置、滑动机构、倾转机构、及回转控制部;该第1、第2产品台载置至少在1面形成划线的脆性材料基板并使划线位于其间隙之间;当将与第2产品台相向的第1产品台的边缘作为第1边缘、将与第1产品台相向的第2产品台的边缘作为第2边缘时,该第1产品夹持装置推压脆性材料基板的位于第1边缘的部分进行固定;该第2产品夹持装置推压脆性材料基板的位于第2边缘的部分对其进行固定;该滑动机构朝与脆性材料基板的划线成直角的方向使第1产品台和第1产品夹持装置成一体地从划线后退地提供压力;该倾转机构可将与脆性材料基板的划线平行的倾转轴作为回转轴,使第2产品台和第2产品夹持装置一体回转;该回转控制部控制倾转机构,使第2产品台和第2产品夹持装置回转 Wherein the breaking apparatus according to the present invention comprising: a first and second stage product, the product of the first holding means, second holding means products, the slide mechanism, the tilting mechanism, and a rotation control unit; the first, second a brittle material substrate forming a scribe line item table for mounting on at least one surface thereof and a gap is located between the scribe line; when the opposing edges of the product and the second stage of the first stage product as a first edge, the first product the second edge of the table opposite the product table as the second edge, the first product holding means is in the first pressing edge portion of the brittle material substrate is fixed; the second product holder means pressing a brittle material substrate located on the second edge portion thereof is fixed; mechanism toward the sliding direction of the scribing a brittle material substrate at right angles to the first stage product and the first product holding means integrally provided in the backward pressure from the scribe line; the the tilting mechanism may scribe the brittle material substrate as a tilt axis parallel to the rotary shaft, the second stage product and the second product holder rotates integrally apparatus; rotation control unit controls the tilting mechanism, and the second stage product The second product holder revolving device 第1产品台和第2产品台使两台的相向边缘不平行地配置,第2产品台的倾转轴从脆性材料基板的划线观看时处于基板的厚度范围内。 The first stage product and second stage product so that the two facing edges are not arranged parallel to the tilt shaft is in the second stage the product within the thickness range of the substrate when viewed from the scribing a brittle material substrate.

本发明的破断装置的特征在于:具有第1、第2产品台、第1产品夹持装置、第2产品夹持装置、第1倾转机构、第2倾转机构、及回转控制部;该第1、第2产品台载置至少在1面形成划线的脆性材料基板并使划线位于其间隙之间;当将与第2产品台相向的第1产品台的边缘作为第1边缘、将与第1产品台相向的第2产品台的边缘作为第2边缘时,该第1产品夹持装置推压脆性材料基板的位于第1边缘的部分进行固定;该第2产品夹持装置推压脆性材料基板的位于第2边缘的部分对其进行固定;该第1倾转机构可将与脆性材料基板的划线平行的倾转轴作为回转轴,使第1产品台和第1产品夹持装置一体回转;该第2倾转机构可将与脆性材料基板的划线平行的倾转轴作为回转轴,使第2产品台和第2产品夹持装置一体回转;该回转控制部控制第1和第2倾转机构,使第1产品台和第1产品 Wherein the breaking apparatus according to the present invention comprising: a first and second stage product, the product of the first holding means, second holding means the product, the first tilting mechanism, the second tilting mechanism, and a rotation control unit; the the first and second sets of products scribing a brittle material substrate is placed on at least one surface is formed and the gap is located between the scribe line; when the opposing edges of the product and the second stage of the first stage product as first edge, when the edge of the first stage product in the second opposed sets of product as a second edge, the first product holding means is in the first pressing edge portion of the brittle material substrate is fixed; the second holding means to push the product located at the second edge of the brittle material substrate pressure portion thereof is fixed; the first tilting means may scribe the brittle material substrate with a parallel rotation axis as a tilt axis, the first stage product and the first product holder means rotate integrally; the second with the tilting mechanism may tilt axis parallel to scribe a brittle material substrate as a rotation axis, the second stage product and the second product holder rotates integrally apparatus; the control unit controls rotation of the first and the second tilting mechanism, the first stage product and the first product 持装置及第2产品台和第2产品夹持装置回转;第1产品台和第2产品台使两台的相向边缘不平行地配置,第1产品台的倾转轴处于脆性材料基板的划线近旁的基板上侧,第2产品台的倾转轴处于脆性材料基板的划线近旁的基板下侧。 Stage product and second product holder revolving device and a second holding means; a first product and a second stage product so that opposing sets of two parallel edges are not arranged, the tilt axis of the first product table in a brittle material substrate scribing on the near side of the substrate, the tilt shaft is in the second stage the product side of the lower substrate scribing a brittle material substrate vicinity.

另外,本发明的破断装置在分成2部分的台将已划线完毕的脆性材料基板固定于上面,使至少一方的台回转,从而使脆性材料基板破断;其特征在于:使台的回转中心轴相对脆性材料基板的划线方向具有规定的角度。 Further, breaking apparatus according to the present invention is divided into two parts of the station has scribe a brittle material substrate is completed is fixed to the above, at least one of the table rotates, so that the brittle material substrate broken; wherein: make station rotational center axis scribing a brittle material substrate opposite direction having a predetermined angle.

另外,本发明的破断装置在分成2部分的台将已划线完毕的脆性材料基板固定于上面,使至少一方的台回转,从而使脆性材料基板破断;其特征在于:至少一方的台具有至少一部分不平行的6个自由伸缩的臂、分别设于臂的两端并且按自由角度连接台与固定部间的万向联轴节、通过控制臂的长度从而控制台的一方的位置的控制部。 Further, breaking apparatus according to the present invention is fixed to the brittle material substrate is divided into two portions station has crossed completed to the above, at least one of the table rotates, so that the brittle material substrate broken; wherein: at least one station having at least portion 6 are not parallel extendable arms are provided at the free ends of the arms and are connected at an angle by a universal joint between the fixed table portion, the length of the control arm to control the position of one console .

本发明的脆性材料基板的破断方法隔开规定间隙成为相同面地对台进行位置控制,使预先形成划线的脆性材料基板对准台间的间隙地固定于台,沿与形成于脆性材料基板的划线不平行而且不与划线处于相同平面的回转轴使一方的台回转,从而沿划线使玻璃板破断。 The method of breaking a substrate of brittle material according to the present invention, a predetermined gap to make the surface position control Taiwan, scribing a brittle material substrate so that a gap is formed between the pre-alignment station to the fixed station, along with the brittle material substrate is formed the scribe line is not parallel to the scribe line and not in the same plane as the rotary shaft makes one rotation stage, so that the glass plate broken along the scribe line.

另外,本发明的脆性材料基板的破断方法将贴合2片脆性材料基板的母(マザ一)贴合基板截断,获得比其小的形状的多块贴合基板;其特征在于:具有在母贴合基板的一方的基板表面的规定位置使用第1划线装置形成划线S1的工序(1),在母贴合基板的另一方的基板表面沿与划线S1相同方向使用第2划线装置形成划线S2的工序(2),及将在两面形成划线S1、S2的上述母贴合基板固定到破断装置的2个台、使台的至少一方回转从而在划线S1、S2施加拉伸应力或剪切应力,将母贴合基板截断成多片的工序(3)。 Further, breaking method brittle material substrate according to the present invention, the bonded mother two brittle material substrate (ma za a) bonded to the substrate cut to obtain smaller shape than that of the plurality of bonded substrate; characterized in that: having in the parent predetermined position using a first scribing device bonded substrate one surface of the substrate of the scribe line forming step S1 (1), using the second scribe line in the same direction along the surface of the other substrate and the scribe line S1 mother bonded substrate means forming step (2) of the scribe line S2, and a scribe line formed on both surfaces S1, S2 the mother bonded substrate 2 is fixed to the breaking station apparatus, so that the rotary table to apply at least one scribe line S1, S2 shear stress or tensile stress, the bonded mother substrate cut into step (3) multiple sheet.

另外,本发明的脆性材料基板的破断方法将贴合未形成划线的第1脆性材料基板和预先形成划线S2的第2脆性材料基板获得的母贴合基板截断,从而获得多片比其小的形状的贴合基板;其特征在于:具有在第1脆性材料基板的表面沿与划线S2相同方向使用划线装置形成划线S1的工序(1),及将在两面形成划线S1、S2的上述母贴合基板固定到破断装置的2个台上、使台的至少一方回转从而在划线S1、S2施加拉伸应力或剪切应力将母贴合基板截断成多片的工序(2)。 Further, breaking a brittle material substrate according to the method of the invention will not bonded to the first scribing a brittle material substrate and forming a second pre-formed female S2 scribing a brittle material substrate obtained by bonding the substrate cut to obtain multiple pieces than bonded substrate smaller shape; characterized in that: a step (1) forming a scribe line using a scribing apparatus S1 in the same direction and the scribe line along the surface of the first brittle material substrate S2, and a scribe line formed on both surfaces S1 , S2 the mother bonded substrate table 2 is fixed to the breaking apparatus, at least one of the rotary table so that the scribe line S1, S2 shear stress or tensile stress is applied to the mother bonded substrate is cut into multiple pieces of step (2).

另外,本发明的脆性材料基板的破断方法将贴合未形成划线的第1脆性材料基板和第2脆性材料基板获得的母贴合基板截断,从而获得多片比其小的形状的贴合基板;其特征在于:具有在第1和第2脆性材料基板的表面,使用划线装置同时形成划线S1、S2的工序(1),及将在两面形成划线S1、S2的上述母贴合基板固定到破断装置的2个台、使台的至少一方回转从而在划线S1、S2施加拉伸应力或剪切应力将母贴合基板截断成多片的工序(2)。 Further, breaking method brittle material substrate according to the present invention will be bonded is not the master of the first brittle material substrate and a second brittle material substrate scribed obtained by forming the bonded substrate cut to obtain multiple pieces smaller shape than the bonded a substrate; characterized in that: a scribe line S1 is formed and simultaneously the surface of the second brittle material substrate, using a first scribing device 1, S2 of the step (1), and a scribe line formed on both surfaces S1, S2 of the female-paste bonded substrate is fixed to the two sets of breaking apparatus, at least one of the rotary table so that the scribe line S1, S2 shear stress or tensile stress is applied to the mother bonded substrate sheet cut into a plurality of step (2).

附图说明 BRIEF DESCRIPTION

图1为示出在玻璃板实施划线时的垂直裂纹的状态的说明图。 FIG 1 is an explanatory view showing a state when a vertical crack in the glass sheet embodiment of the scribe line.

图2为示出使用破断杆的现有破断装置的主要部分构成的透视图。 FIG 2 is a perspective view of a main portion illustrating the conventional breaking apparatus using the breaking bar configuration.

图3为示出由台的回转进行破断的现有破断装置的主要部分构成的透视图。 3 is a perspective view of a main portion illustrating the conventional breaking apparatus of the turntable by a broken configuration.

图4为示出本发明实施形式1的装置的整体构成的透视图。 4 is a perspective view showing the overall configuration of the apparatus embodiment of the present invention in the form of 1.

图5为示出实施形式1的破断装置的整体构成的分解透视图。 5 is an exploded perspective view illustrating the embodiment of FIG overall configuration of the apparatus 1 is broken.

图6为示出将基板配置到破断装置的台的状态的平面图。 FIG 6 is a plan view illustrating the configuration of the substrate to the stage of breaking the state of the apparatus.

图7为示出实施形式1的破断装置的破断划线部的主要部分构成的断面图。 7 is a sectional view of a main portion of the broken chain line portion shown broken apparatus configuration of Embodiment 1.

图8为示出破断时的基板的变型例的说明图。 FIG 8 is an explanatory view showing a modification of the substrate when the breaking.

图9为在实施形式1的破断装置中示出基板的截断状态的断面图。 FIG 9 is a sectional view of the breaking apparatus of the embodiment 1 shown in a cut state of the substrate.

图10为在实施形式1的破断装置中示出基板的截断状态的平面图。 FIG 10 is a breaking apparatus in the embodiment shown in the form of a plan view of a cut state of the substrate.

图11为示出本发明实施形式2的破断装置的全体构成的透视图。 11 is a perspective view showing the whole configuration of the breaking device according Embodiment 2 of the present invention.

图12为示出实施形式2的破断装置的全体构成的分解透视图。 12 is an exploded perspective view illustrating the whole configuration of the embodiment 2 of the breaking apparatus.

图13为示出实施形式2的破断装置的划线部的主要部分构成的断面图。 13 is a sectional view of a main portion illustrating part of the scribe breaking apparatus of the embodiment 2 constituted.

图14为在实施形式2的破断装置中示出基板的截断状态的断面图。 FIG 14 is a sectional view of the breaking apparatus of the embodiment 2 shown in a cut state of the substrate.

图15为示出本发明实施形式3的破断装置的主要部分构成的局部剖切透视图。 FIG 15 is a partial cutaway perspective view of a main part of the breaking apparatus of the present embodiment of the invention composed of 3.

图16为在实施形式3的破断装置中示出将玻璃板配置到台的状态的上面图。 FIG 16 is a breaking apparatus of the embodiment 3 shown in FIG glass plate arranged above the table state.

图17为在实施形式3的破断装置中示出破断时的动作的说明图。 FIG 17 is an explanatory view showing an operation when breaking the breaking apparatus of the embodiment 3.

图18为示出液晶板的层构造的放大断面图。 18 is an enlarged sectional view illustrating the layer structure of the liquid crystal panel.

图19为示出本发明实施形式4的破断装置的主要部分构造的局部剖切透视图。 FIG 19 is a partial cutaway perspective view of a main part configuration of embodiment 4 of the breaking means in the form of the present invention.

图20为示出本发明实施形式5的破断装置的主要部分构造的侧面图。 FIG 20 is a side view showing a main part configuration breaking apparatus 5 forms an embodiment of the present invention is shown.

图21为在实施形式5的破断装置中示出将玻璃板载置于台的状态的透视图。 FIG 21 is a breaking apparatus in the embodiment 5 is shown a perspective view of a glass board placed in a state table.

图22为在实施形式5的破断装置中示出玻璃板截断时的动作的侧面图。 FIG 22 is a breaking apparatus in the embodiment 5 a side view showing the operation when the cut glass sheet.

图23为在实施形式5的破断装置中示出玻璃板的截断后的台的移动的侧面图。 FIG 23 is a breaking apparatus in the embodiment 5 is shown a mobile station of the truncated side view of the glass sheet.

图24为在实施形式5的破断装置中示出玻璃板截断后使玻璃板移动时的动作的侧面图。 24 is a graph illustrating the breaking apparatus of the embodiment 5 in that the rear glass plate cut side view of the operation when moving the glass sheet.

图25为示出本发明实施形式3的脆性材料基板的破断方法的一例的液晶母玻璃基板自动截断线的说明图。 FIG 25 is a diagram illustrating an example of a liquid crystal mother glass substrate method of breaking a substrate of brittle material in the form of an automatic cut-off line 3 shows the embodiment of the present invention.

图26为示出现有脆性材料基板的破断方法的工序图。 FIG 26 is a process drawing method for breaking brittle material substrate illustrating.

图27为示出实施形式6的破断方法的一例的工序图。 FIG 27 is a diagram illustrating an example of the step of FIG breaking method of the sixth embodiment.

图28为用于本发明实施形式7的破断方法中的液晶母玻璃基板的断面图。 FIG 28 is a cross-sectional view of the liquid crystal for breaking the mother glass substrate of the present invention, a method embodiment. 7.

图29为示出实施形式7的脆性材料基板的破断方法的一例的液晶母玻璃基板自动截断线的说明图。 Liquid crystal mother glass substrate 29 is a diagram of an example of method of breaking a brittle material substrate 7 of the embodiment of the automatic cut-off line described in FIG.

图30为示出本发明实施形式8的脆性材料基板的破断方法的一例的液晶母玻璃基板自动截断线的说明图。 Liquid crystal mother glass substrate 30 is a diagram showing an example of a method of breaking a brittle material substrate in the form of embodiment 8 of the present invention automatically cut line described in FIG.

具体实施方式 Detailed ways

(实施形式1)下面参照附图说明本发明的实施形式1的破断装置。 BRIEF DESCRIPTION breaking apparatus of the present embodiment of the invention 1 (Embodiment 1) Hereinafter reference. 图4为示出实施形式1的破断装置10的整体构成的外观透视图。 4 is the embodiment shown broken perspective view showing the overall appearance of a configuration of the apparatus 10. 该破断装置10称为单侧倾转截断机。 The breaking apparatus 10 is called a single clipping machine roll transfer. 成为截断对象的基板G为玻璃等脆性材料基板。 Becomes truncated target substrate G brittle material substrate such as glass.

在这里,为了方便说明,使用空间座标(x,y,z),将与破断装置10的设置地面平行的台基准面作为(x,y,z0),将与设置地面垂直的方向设为z轴,将基板G的截断方向(破断方向)设为y轴。 Here, for convenience of explanation, the floor is provided the use of spatial coordinates (x, y, z), and the breaking apparatus 10 as a reference plane parallel to the table (x, y, z0), will be provided to a direction perpendicular to the ground z-axis, the direction of the substrate G is cut (breaking direction) is y-axis. 破断装置10具有可朝-x轴方向滑动的滑动台11和可将与y轴平行的回转轴作为中心倾转而且可朝x轴方向滑动调整的倾转台12。 10 has a tilting slidable toward the -x-axis direction slide table 11 and the y-axis may be parallel to the rotary axis as a center and slidably adjusted tilting toward the x-axis direction of the turntable 12 means broken.

图5为示出破断装置10的左侧装置10A和右侧装置10B分离状态的透视图。 FIG 5 is a diagram illustrating breaking means 10A and 10B right side perspective view of the left side 10 separated state means. 当破断装置10整体安装到图4的底座17时,左侧装置10A指在图4所示那样的基板G设于划线S左侧(-x轴方向)的机构部,右侧装置10B指设置到基板G的划线S右侧(+x轴方向)的机构部。 When the breaking means 10 integrally mounted to the chassis 17 of FIG. 4, the left side refers to the device 10A shown in FIG. 4 as substrate G scribing mechanism portion provided at the left (-x axis direction) S, refers to the right device 10B provided to the scribe line S on the right side of the substrate G (+ x-axis direction) of the mechanism portion.

另外,为了载置并保持应切断的基板G,将第1产品台13固定到滑动台11,将第2产品台14固定到倾转台12。 Further, in order to be cut placed on a substrate holder and G, the first product table 13 is fixed to the slide table 11, the second table 14 is fixed to a product pour the turntable 12. 另外,在第1产品台13的上部安装第1产品夹持装置15,在第2产品台14的上部安装第2产品夹持装置16。 Further, in the upper portion of the first product table 13 is mounted a first product holding means 15, the upper portion 14 of the second stage product mounting the second holding means 16 products. 使基板G的划线S与y轴平行,以划线S为中心将基板的-x轴侧(左侧)的区域称为基板左部GL,将+x轴侧(右侧)的区域称为基板右部GR。 Scribing the substrate S and G is the y-axis is parallel to the scribe line S as the center axis of the substrate region -x side (left side) is called a left portion of the substrate GL, the + x-axis side area (right side) of the said a substrate right portion GR. 第1产品夹持装置15牢固地推压基板左部GL的右端部而固定基板,第2产品夹持装置16牢固地推压基板右部GR的左端部而固定基板。 The first product holding means 15 is pushed firmly press the right end of the left portion of the substrate and the fixed substrate GL, the second product clamping device 16 is fixed firmly pressing the substrate board the right portion of the left end portion GR.

在左侧装置10A设置滑动机构11a。 In the left slide mechanism is provided apparatus 10A 11a. 滑动机构11a用于朝-x轴方向对滑动台11施加弹性力,设置有施加弹性力的弹性构件例如气缸、弹簧等。 The slide mechanism toward the -x-axis direction 11a for applying an elastic force to the slide table 11, an elastic member such as a cylinder, a spring for applying a resilient force. 除此之外,在滑动机构11a设置用于限制滑动范围的止动器、限制滑动速度的缓冲器等(图中未示出)。 In addition, the slide mechanism 11a is provided for limiting the sliding range of the stopper to limit the slip speed buffer or the like (not shown).

右侧装置10B由作为支柱的1对水平保持块上部18和1对水平保持块下部19保持。 Right holding means 10B and a pair of upper block 18 by one horizontal level as the lower portion of the pillar holding block 19 remains. 水平保持块下部19固定于底座17,水平保持块上部18可自由回转地保持倾转台12。 A lower horizontal holding block 19 fixed to the base 17, an upper horizontal holding block 18 rotatably holding turret 12 pour. 在水平保持块上部18与水平保持块下部19之间设置图中未示出的滑动装置,水平保持块上部18可在x轴方向上滑动调整。 Holding block 18 and an upper horizontal level holding means, not shown, the slide block 19 is provided between the lower portion of the drawing, the upper level of retention block 18 slidably adjusted in the x-axis direction. 在+y轴侧和-y轴侧的水平保持块上部18设置倾转轴18a,倾转台12、第2产品台14、及第2产品夹持装置16可将倾转轴18a作为回转轴倾斜地受到保持。 + Y axis in the horizontal side and a -y-axis side of the upper block 18 is provided holding the tilt shaft 18a, the turntable 12 is poured, the product of the second stage 14, the second clamping means 16 may be the product of the tilt shaft 18a as a rotation axis inclined by maintain. 倾转轴18a在水平保持块上部18设置轴承箱,由压入到该轴承箱的滚珠轴承保持。 Tilt shaft 18a holding block 18 is provided an upper horizontal bearing housing, pressed into a bearing housing holding the ball bearing. 在这里,将水平保持块上部18和倾转轴18a称为倾转机构。 Here, the level of the upper block 18 and holding the tilt shaft 18a called tilting mechanism.

第1产品夹持装置15固定基板左部GL,使剪切应力和弯曲应力集中到基板的划线。 15 is fixed to the substrate holding apparatus of the first product portion left GL, shearing stress and bending stress is concentrated to scribe the substrate. 在第1产品夹持装置15设置推压基板G的划线S附近的第1夹持杆15a。 In the first clamping bar 15a is provided near the scribe line S 15 presses the first substrate holding apparatus G products. 该第1夹持杆15a的前端位于第1产品台13的右侧边缘,可朝z轴向微动。 The distal end of a clamp 15a on the right side edge of the first product table 13, the z-direction toward fretting. 同样,第2产品夹持装置16固定基板右部GR,将剪切应力和弯曲应力集中到基板的划线。 Similarly, the second fixed substrate 16 means the right product holder unit GR, the shear stress and bending stress is concentrated to scribe the substrate. 在第2产品夹持装置16设置推压基板G的划线S附近的第2夹持杆16a。 In the vicinity of the second scribe line S product holding means 16 is provided pressing the second substrate G clamping bar 16a. 第2夹持杆16a的前端位于第2产品台14的左侧边缘,可朝z轴方向微动。 The second clamping bar on the left edge of the leading end 16a of the second product table 14, the fine movement in the z axis direction.

图6为示出第1、2产品台13、14的位置关系的平面图。 FIG 6 is a plan view illustrating the positional relationship between the product of the first and second stations 13 and 14. 包含第1央持杆15a的第1产品夹持装置15的主轴使+y轴侧仅张开角度-α地倾斜安装。 First spindle means comprises a first holding goods central holding rod 15a of the y-axis 15 so that only the opening angle -α + side inclined installation. 另外,包含第2夹持杆16a的第2产品夹持装置16的主轴也使+y轴侧张开角度+α地倾斜安装。 Further, the second clamping rod comprising a main shaft 16a of the second product holder 16 is also an open angle + y + α axis side inclined installation. 另外,在这些产品台13、14之间形成间隙。 Further, a gap is formed between these units 13 and 14 products.

如图6所示那样,第1产品台13可以回转轴13a为中心朝CCW方向在(x,y)平面内在滑动台11上仅回转调整微小角。 As shown in Figure 6, the product of the first stage 13 can be centered on the rotary shaft 13a in the CCW direction (x, y) on the inner plane of the sliding table 11 only a slight rotation angle adjustment. 第2产品台14也可以回转轴14a为中心朝CW方向在(x,y)平面内在倾转台12上回转调整微小角。 The second stage product 14 may be centered on the rotary shaft 14a toward the CW direction (x, y) for rotating the turntable about a plane tilt angle adjustment 12 minute. 在第1产品台13的4角设置从回转轴13a观看时在切线方向上成为长径的螺钉孔13b-13e。 4 angle setting 13 when viewed from the rotary shaft 13a becomes the major axis of the screw hole 13b-13e in the tangential direction of the first stage product. 同样,在第2产品台14的4角设置从回转轴14a观看时在切线方向上成为长径的螺钉孔14b-14e。 Similarly, when the four corners of the second setting item table 14 as viewed from the rotary shaft 14a becomes the major axis of the screw hole 14b-14e in the tangential direction. 因此,以回转轴13a为中心使第1产品台13仅回转角度-α,在该位置将螺钉孔13b-13e的螺栓紧固到滑动台11。 Thus, the rotating shaft 13a as a center of the first product table 13 the turning angle [alpha only, in this position the fastening screw bolt holes 13b-13e to the slide table 11. 这样,第1产品台13可与第1夹持杆15a一起从由图6的2点划线所示位置固定到由实线所示位置。 Thus, the first product table 13 from the position shown in a dashed line in FIG. 6 is fixed to a position shown by a solid line together with the first clamping bar 15a. 对于第2产品台14也同样。 The same applies to the second stage 14 products. 通过这样进行角度调整,可将第1夹持杆15a和第2夹持杆16a的开口角设定为2α。 By adjusting the angle, the opening angle of the first clamp 15a and a second clamping bar 16a can be set to 2α.

作为基板G的保持方法,可由真空吸附等装置固定到产品台。 As a method of holding the substrate G, is fixed by vacuum suction means to the products table. 在基板为玻璃并在其表面形成树脂膜的场合,也可由静电吸附固定。 In the case where the substrate is a glass and a resin film formed on its surface, it may also be fixed to electrostatic adsorption.

下面说明倾转台12的倾转机构。 Tilting the turntable will be described tilting mechanism 12. 如图4和图5所示,水平保持块上部18的倾转轴18a可将其作为回转轴使除水平保持块下部19外的右侧装置10B整体朝CW方向或CCW方向回转。 As shown in FIGS. 4 and 5, a horizontal upper holding piece 18a 18 can tilt axis as the horizontal rotary shaft so that it remains in addition to the entire block CW direction or CCW direction toward the right side of the rotary means 19 the lower portion 10B outside. 图7为示出倾转轴18a的安装位置的破断装置主要部分的断面图。 FIG 7 is a diagram illustrating the installation position of the tilt axis 18a of the cross-sectional view of the main part of the breaking apparatus. 为了通过倾转机构使倾转台12回转,设置回转控制部20。 In order to pour by tilting the turntable revolving mechanism 12, rotation control section 20 is provided. 回转控制部20使用电动机的回转力或流体缸使倾转台12回转规定角度,也可通过臂或连杆由手动使倾转台12回转。 Rotation control unit 20 uses the rotational force of the motor or fluid cylinder 12 causes the tilting rotary turret a predetermined angle, and tilting the turntable 12 by swivel arms or links so manually. 另外,倾转台12在开始回转的同时,朝+x方向移动。 Further, tilting the turntable 12 starts to rotate while moving toward the + x direction.

在破断装置的初期设定下,第1产品台13和第2产品台14相对1片基板G具有相同载置面地定位。 In the initial setting of the breaking means, the product of the first stage 13 and second stage 14 relative to the product substrate G having a mounting surface positioned the same manner. 倾转轴18a从载置于台上的基板G的上面和下面观看时来到中央的位置地调整高度。 From the tilt shaft 18a is placed above and below the substrate stage to adjust the position G to the center of the viewing height.

基板G的厚度为2d0。 The thickness of the substrate G is 2d0. 第1产品台13的载置面成为(x,y,-d0),倾转轴18a的位置成为(0,y,0)。 The mounting surface of the first product table 13 becomes (x, y, -d0), the position of the tilt shaft 18a becomes (0, y, 0). 倾转轴18a的位置可相应于基板G的厚度和材料调整。 A tilt shaft 18a and a position may correspond to the thickness of the material of the substrate G adjusted. 另外,如使第1产品台13的右边缘与第2产品台14的左边缘的间隙为2g,则第1夹持杆15a相对基板G的推压位置与第1夹持杆15a相对基板G的推压位置的间隙为图7所示程度,最接近的部分的推压位置的间隔最好为与2g相同的程度。 Further, as the first product table 13 the gap left edge and the right edge 14 of the second stage is product 2g, the pressing position of the first clamping bar 15a opposite the substrate G and the first clamping rod 15a opposite the substrate G the pressing position is the extent of the gap shown in FIG. 7, the position of the closest spacing of the pressing portion 2g is preferably the same extent. 倾转轴18a最好与基板G的划线平行,位于基板的厚度范围内。 Tilt shaft 18a is preferably parallel to the scribe line G substrate located within the thickness of the substrate.

下面,说明具有这样的机构的破断装置的动作。 Next, the operation having such a mechanism breaking apparatus. 基板G形成为用于液晶板的夹层玻璃基板,如图8(a)所示那样,在内侧形成各种电极的上基板G1(厚度0.7mm)和下基板G2(厚度0.7mm)之间的间隙(0.1mm)封入液晶元件。 G formed the substrate for a laminated glass substrate of the liquid crystal panel, as shown in FIG 8 (a) as shown, is formed on a substrate the various electrodes G1 (0.7mm thickness) and a lower substrate G2 (thickness 0.7mm) between the inner side clearance (0.1mm) of the liquid crystal element is enclosed. 该场合的基板厚度2d0为1.50mm。 2d0 substrate thickness in this case is to 1.50mm. 另外,如图8(a)所示那样,在上基板G1的上面和下基板G2的下面分别在从(x,y)平面观看时的同一位置预先形成划线S1、S2。 Further, in FIG. 8 (a) as shown in the following on the upper substrate and the lower substrate G1 and G2 are at the same position when viewed from the plane (x, y) previously formed scribe line S1, S2. 划线S1、S2的形成方法与现有技术例相同,剪切应力或拉伸应力高的部分成为玻璃基板的破断点。 Scribing Sl, S2 of the method of forming the same as the prior art example, a high shear stress or tensile stress portion becomes broken breakpoint of the glass substrate.

图9为以划线S为中心的破断装置的局部放大断面图。 FIG 9 is a partially broken device to the center of the scribe line S is an enlarged sectional view. 另外,图10为以由2点划线所示划线S为中心的破断装置的主要部分平面图。 Further, in FIG. 10 by the two-dot chain line shown in chain line S as the center of a main portion plan view of a breaking apparatus. 在这里,基板G截断后的位置用实线示出。 Here, the substrate G cut position shown in solid lines. 倾转轴18a的位置(x,y,z)为(0,y,0)。 Tilt shaft 18a of the position (x, y, z) is (0, y, 0). 如图10所示那样,在截断后的基板左部GL,将图8的划线S2的+y轴侧的终点设为PL,将-y轴侧的终点设为QL。 As shown in FIG. 10, in the left portion of the truncated GL substrate, the scribe line S2 of FIG. 8 + y axis end PL side is the -y-axis side is defined as the end point QL. 另外,基板左部GL与第1产品台13的右边缘相接的线的+y轴侧的终点为PL′,-y轴侧的终点为QL′。 Further, the left portion of the substrate and the first product table GL + y-axis in contact with the right edge of the end of the line 13 side is PL ', - y axis side end of QL'. 另外,在截断后的基板右部GR,将划线S2的+y轴侧的终点设为PR,将-y轴侧的终点设为QR。 Further, the substrate was cut in the right portion GR, the shaft end side of the scribe + y S2 is defined as PR, the end point is set to -y-axis side QR. 另外,将基板右部GR与第2产品台14的左边缘相接的线的+y轴侧终点设为PR'。 Further, the + y-axis-side end portion of the left and right edge of the substrate 2 and the second GR product table 14 is set in contact with the line PR '. 将-y轴侧终点设为QR'。 -Y-axis side is set to the end of the QR '. 在基板G分割切断之前PR与PL一致,QR与QL一致。 PR PL is consistent with the G into the substrate before the cutting, is consistent with the QR QL.

如图9(a)所示那样,如使第2产品台14朝CCW方向仅倾斜θ,则点PR′的位置从(x1,y1,z1)移动到(x2,y2,z2)。 9 (a) as shown in Fig, 2 as the first product table 14 in the CCW direction tilted by [theta], then the point PR 'from the position (x1, y1, z1) is moved to (x2, y2, z2). 在这里,各座标值如下。 Here, each of the coordinate values ​​as follows.

x1=g2y1=y1z1=-d0x2=d0sinθ+g2cosθy2=y1z2=d0(1-cosθ)+g2sinθ-d0由第2夹持杆16a的推压力使基板右部GR的点PR′(x2,y2,z2)的部分成为相对第2产品台14的不动点时,相对位于基板右部GR的点PR的破断部分从上述PR′作用剪切力和拉伸力。 x1 = g2y1 = y1z1 = -d0x2 = d0sinθ + g2cosθy2 = y1z2 = d0 (1-cosθ) + g2sinθ-d0 by the pressure of the second pushing lever 16a of the substrate holding portion GR of the right point PR '(x2, y2, z2 time) constitutes a fixed point relative to the second product table 14, the breaking portion is located opposite the point PR of the right portion of the substrate from the GR PR 'shear and tensile forces.

这样的剪切力和拉伸力也同样作用于图9(b)的点QR。 Such shear and tensile forces also acting on the point QR FIG. 9 (b) is. 然而,从点PR′观看到的划线S2的位置与从点QR′观看到的划线S2的位置如图9和图10所示那样不同,-y轴一方(靠前侧)与+y轴一方(往里侧)相比,剪切应力和拉伸应力增大。 However, from the point PR 'viewed by the chain line position from the point S2 and QR' scribe line S2 is viewed as a different position, as shown in FIGS. 9 and 10 one of the -y-axis (front side) + y one of the shafts (inside side) compared to increases shear and tensile stresses. 即使玻璃材料的拉伸弹性模量在两者的部分相同,基板右部GR相对不回转移动的基板左部GL的单侧支承的前端部在图9(b)一方比图9(a)的场合短。 Even if the tensile modulus of the glass material in both parts of the same, the substrate does not rotate relative to the right portion GR moving substrate GL left portion of the distal end of the cantilevered portion in FIG. 9 (b) than the one in FIG. 9 (a) is short occasion. 为此,图9(b)所示单侧支承的前端部一方与图9(a)的场合相比剪切应力不易缓和。 To this end, FIG. 9 (b) compared to the one shown in FIG. 9 (a) of the distal portion where the shearing stress is less likely cantilevered relaxation. 为此,点QR、QL成为破断点,下基板G2截断。 For this purpose, point QR, QL breakpoint becomes broken, the cut substrate G2. 然后,使第2产品台14朝CW方向倾转时,与CCW方向的倾转场合相同,在上基板G1的划线S1施加剪切应力和拉伸应力,将上基板G1截断。 Then, when the product table 14 toward the second tilting direction CW, CCW direction and the tilting of the same case, the application of shear and tensile stresses in the scribe line on a substrate G1, S1, cut the upper substrate G1. 当进行基板G的剪切时,由滑动机构11a相对基板左部GL作用-x轴方向的弹性力,另外,在倾转台12开始回转的同时,朝+x方向移动,并且,作为基板左部GL的切断面的右边缘部朝-x轴方向后退,不与基板右部GR的左边缘接触。 When the substrate G is cut, the counter substrate 11a by the action of GL left slide mechanism portion elastic force -x-axis direction, in addition, movement toward the + x direction while tilting the turntable 12 starts rotating, and the left portion as the substrate GL right edge portion of the cutting face back toward the -x-axis direction, not in contact with the left and right edges of the base portions GR. 为此,不在玻璃基板的截断面产生伤痕,可获得平滑的截断面。 For this reason, the cut surface of the glass substrate is not scratched, smooth cut surface can be obtained.

基板G截断后,点PR的位置从(x3,y3,z3)移动到(x4,y4,z4)。 After the substrate G truncated PR from the position of the point (x3, y3, z3) is moved to (x4, y4, z4). 在这里,各座标值如下。 Here, each of the coordinate values ​​as follows.

X3=0y3=y3z3=-d0x4=d0sinθy4=y3z4=d0(1-cosθ)-d0计算该场合的水平移动量x4-x3,则在θ=3°的场合,成为0.039mm。 X3 = 0y3 = y3z3 = -d0x4 = d0sinθy4 = y3z4 = d0 (1-cosθ) -d0 calculated amount of horizontal movement of the case of x4-x3, in the case of θ = 3 ° and becomes 0.039mm.

图8(b)示出基板右部GR朝CCW方向回转的状态,图8(c)示出基板右部GR朝CW方向回转的场合的基板变形的轮廓和切断面后退的状态。 FIG 8 (b) shows the GR in the CCW direction and right portions of the substrate rotating state, FIG. 8 (c) shows a profile of a right portion of the substrate the substrate is rotated in the CW direction toward GR case of a cut surface and the deformed retracted state.

在划线S分割成左右2部分的基板通过从基板G解除第1夹持杆15a、第2夹持杆16a,可从产品台拆下基板GR、GL。 15a, the second clamping rod 16a, the substrate can be removed in the scribe line S is divided into two parts approximately by releasing the first holding a product from the substrate G from the substrate stage GR, GL. 在将沿x轴方向成为带状的1片基板分割成多个的场合,分别在基板G的规定部位设置划线。 In the band shape along an x-axis direction of the substrate into a plurality of occasions, are provided at a predetermined portion of scribing the substrate G. 沿x方向将基板G运送一定节距,装好产品夹持装置后,使倾转台12倾斜。 The x-direction at a predetermined pitch conveying the substrate G installed after the product clamping device, the turntable 12 is tilted so that tilting. 通过反复进行这样的操作,可从1片的母基板制造多片基板。 By repeating this operation, a plurality of substrates can be manufactured from the base substrate 1 sheet.

(实施形式2) (Embodiment 2)

下面参照附图说明本发明实施形式2的破断装置。 BRIEF DESCRIPTION breaking apparatus embodiment of the present invention, reference 2 below. 图11为示出实施形式2的破断装置30的整体构成的外观透视图。 FIG 11 is a diagram illustrating the embodiment 2 broken appearance perspective view showing the overall configuration of device 30. 该破断装置30称为两倾转截断机。 The breaking apparatus 30 is called two tilting clipping machine. 在这里,为了便于说明,使与破断装置30的设置地面平行的台基准面为(x,y),使与设置地面垂直的方向为z轴,使基板的破断方向为y轴。 Here, for convenience of explanation, and that the breaking means 30 is provided parallel to the ground station reference plane (X, y), a direction perpendicular to the ground provided the z-axis, so breaking the y-axis direction of the substrate. 该破断装置30具有与y轴平行的回转轴,具有可倾转的第1、第2倾转台31、32。 The breaking device 30 has a rotary axis parallel to the y axis, having a first tilting, the second turret 31 pour.

图12为示出破断装置30的左侧装置30A和右侧装置30B分离的状态的透视图。 FIG 12 is a broken perspective view illustrating the left side devices 30A and 30B of the right side apparatus 30 separated state of the apparatus. 破断装置30全体通过保持块38、39安装于图11所示底座37。 Breaking through the entire apparatus 30 is attached to the holding block 38, 39 of the base 37 as shown in FIG. 11. 第1产品台33固定于第1倾转台31,第2产品台34固定于第2倾转台32。 The first product of the first stage 33 is fixed to the tilting rotary table 31, the second product of the second stage 34 fixed to the turret 32 ​​pour. 另外,与实施形式1同样,在第1产品台33的上部安装第1产品夹持装置35,在第2产品台34的上部安装第2产品夹持装置36。 Further, in Embodiment 1, the upper portion of the first product table 33 is mounted a first clamping means 35 product, the product in the second upper stage 34 mounting the second holding means 36 products. 这些夹持装置的功能也与实施形式1同样,所以,省略对机构的说明。 The clamping device also functions similarly to the embodiment 1, therefore, description thereof is omitted mechanism.

第1倾转台31、第1产品台33、及第1产品夹持装置35保持于作为支柱的第1保持块38。 The first tilting the turntable 31, the product of the first stage 33, a second holding means 35 holding the product in the first holding block 38 as a strut. 第2倾转台32、第2产品台34、及第2产品夹持装置36保持于作为支柱的第2保持块39。 Tilting the second turret 32, the second product table 34, the second holding means 36 holding the product as a pillar in the second holding block 39. 如图11所示,第2保持块39的支柱间隔比第1保持块38的支柱间隔宽,当在正规的位置(动作位置)将左侧装置30A和右侧装置30B安装于底座37时,所有的支柱大体处于统一到y轴的位置。 As shown, the second holding block 39 of struts 11 spaced wider than the first holding strut spacing block 38, when the normal position (operation position) of the left and right sides of the device 30A is mounted to the base unit 30B to 37, All the pillars is substantially uniform to the y-axis position.

符号38a为第1保持块38的倾转轴,符号39a为第2保持块39的倾转轴,如图13所示那样,倾转轴38a和倾转轴39a从破断装置的基准位置(x0,y,z0)观看时沿z轴方向大体对称,为划线S1、S2近旁的位置。 Symbol 38a is a first tilt shaft holder block 38, the symbol 39a to the second holding block 39 of the tilt shaft, as shown in FIG. 13, the tilt axis of the tilt shaft 38a and 39a from the reference position (x0, y, z0 breaking apparatus ) when viewed along the z-axis direction is substantially symmetrical, as scribe-lane S1, S2 near the location. 基准位置(x0,y,z0)与实施形式1同样,为基板G的划线S1、S2的中间位置(0,y,0)。 Reference position (x0, y, z0) in the form of the embodiment 1, the substrate G as scribe-lane S1, S2 in an intermediate position (0, y, 0). 如设基板G的厚度中心位置为z=0,则第1倾转轴38a的z轴上的位置d1最好为0mm≤d1≤20mm,倾转轴39a的位置-d2最好为-20mm≤d2≤0mm。 The thickness of the central position of the substrate G is set to z = 0, the first tilt shaft 38a of the z-axis position of d1 is preferably 0mm≤d1≤20mm, the tilt shaft 39a is preferably a position -d2 -20mm≤d2≤ 0mm.

第1夹持杆35a与第2夹持杆36a的安装位置与实施形式1的场合相同。 The first case holding rod 35a and 36a form the mounting position of the embodiment 1 is the same as the second clamping bar. 第1保持臂38b可以第1倾转轴38a为中心自由回转,按任意角度保持第1倾转台31。 First holding arm 38b may be a first tilt axis 38a rotatably centered, at any angle of the first holding turret 31 pour. 在这里,第1保持臂38b和第1倾转轴38a被称为第1倾转机构。 Here, the first holding arms 38b and 38a of the first inclination axis is referred to as a first tilting mechanism. 同样,第2保持臂39b可以第2倾转轴39a为中心自由回转,按任意角度保持第2倾转台32。 Similarly, the second arm 39b holding the second tilt axis may be centered 39a rotatably, at any angle of the second holding turret 32 ​​pour. 第2保持臂39b和第2倾转轴39a被称为第2倾转机构。 Holding the second arm 39b and the second tilting shaft 39a is referred to as the second tilting mechanism.

回转控制部40可使用电动机的回转力或流体缸使第1倾转台31和第2倾转台32回转规定角度,也可通过臂或连杆用手动使倾转台31、32回转。 Rotation control unit 40 may use a fluid cylinder or the rotating force of the motor 31 of the first tilt and the second tilt the turntable 32 revolving turret a predetermined angle, and also enable tilting rotary turret 31 by a link arm or manually. 第1保持臂38b和第2保持臂39b由回转控制部40的初始设定在基板G切断前平行于(x,y)面即水平地保持第1倾转台31和第2倾转台32。 First holding arm 38b and the second holding arm 39b is set before the substrate G is cut by the initial rotation control portion 40 parallel to the (x, y) plane, ie horizontally holding the turntable 31 of the first tilt and the second tilt the turntable 32.

在这里,包含第1夹持杆35a的第1产品夹持装置35的主轴也使+y轴侧张开角度-α地倾斜地安装,包含第2夹持杆36a的第2产品夹持装置36的主轴也使角度张开+α地倾斜安装。 Here, the first clamp comprising a first spindle 35a in the product holder device 35 also open angle + y axis side of the obliquely mounted -α, comprising a second clamping bar 36a of the second holding means products spindle 36 is also inclined an angle + α mounting opening.

设基板G的厚度为2d0,在这里,作为一例,也可考虑切断用于液晶板的夹层玻璃基板的场合。 The thickness of the substrate G is 2D0, here, as an example, the case may also be considered for cutting a laminated glass substrate of the liquid crystal panel. 如设第1产品台33的载置面为(x,y,-d0),则倾转轴38a的位置如图13所示那样为(0,y,+d1)。 The product of the first stage 33 is provided in the mounting surface for the (x, y, -d0), the tilt shaft 38a, as shown in Figure 13 to the position (0, y, + d1). 该位置也可相应于基板的厚度或材料调整。 This position may be adjusted corresponding to the thickness or material of the substrate. 倾转轴39a的位置成为(0,y,-d2)。 Tilt axis position 39a becomes (0, y, -d2). 该位置也可调整。 This position may also be adjusted. 倾转轴38a、39a最好为从基板的中心位置对称的位置,即d1=d2。 Tilt shaft 38a, 39a is preferably symmetrical position from the center of the substrate, i.e., d1 = d2.

另外,当第1产品台33的右边缘与第2产品台34的左边缘的间隙为2g时,最好使第1夹持杆35a相对基板G的推压位置和第2夹持杆36a相对基板G的推压位置如图13所示那样接近各边缘,最接近的部分的推压位置的间隔最好为与2g相同的程度。 Further, when the gap left edge and right edge of the first product table 33 and the second table 34 when the product 2g, preferably so as to sandwich the first substrate opposite the pressing bar 35a and the second position of the clamping bar 36a opposite G pressing position of the substrate G in FIG. 13 as close to the edges, the position of the closest spacing of the pressing portion 2g is preferably the same extent.

下面说明具有这样的机构的破断装置30的动作。 Breaking operation of the apparatus 30 having such a mechanism will be described below. 图14为以划线S为中心的破断装置的局部放大断面图。 FIG 14 is a partial enlarged sectional view of the device broken chain line S in the center. 另外,使用图10作为以划线S为中心的破断装置的主要部分平面图。 In addition, FIG. 10 as a means for breaking the scribe line S is a main part plan view of the center. 如上述那样,第1倾转轴38a的位置成为(0,y,+d1),第2倾转轴39a的位置为(0,y,-d2)。 As described above, the first tilt shaft 38a becomes a position (0, y, + d1), the second tilt shaft 39a of the position (0, y, -d2).

图14(a)为图10的PR点和PL点附近的断面图。 FIG 14 (a) is a sectional view of the vicinity of the point PL and PR point 10 of FIG. 第1产品台33与第2产品台34的边缘间隔为2g2。 Edge of the first product and the second stage 33 of the product table 34 is spaced 2g2. 图14(b)为图10的QR点和QL点附近的断面图。 FIG. 14 (b) is a sectional view of the vicinity of the point QR and QL of the points 10 of FIG. 在这里,第1产品台33与第2产品台34的边缘间隔为2g1(g1<g2)。 Here, the edge 33 of the first stage product and second stage product 34 is spaced 2g1 (g1 <g2). 如图14所示,最初使第2产品台34朝CW方向倾斜θ,然后,使第1产品台33朝CW方向仅倾转角度θ。 As shown in FIG. 14, the first product of the second stage 34 is inclined toward the CW direction [theta], then the product of the first stage 33 in the CW direction toward only the tilting angle θ. 与实施形式1同样,将基板右部GR相对第2产品台34的推压点作为PR′。 Similarly with Embodiment 1, the right portion of the substrate relative to the second product GR pressing station 34 as the point PR '. 该点PR′在沿划线S截断基板G时可看成提供剪切应力的力点。 The point PR 'when cut along the scribe line S can be regarded as a force point G substrate to provide a shear stress.

最初,考虑使第2产品台34朝CW方向回转角度θ的场合。 Initially, consider the second case the product angle θ rotary table 34 toward the CW direction. PR′的位置从(x5,y5,z5)移动到(x6,y6,z6)。 PR 'from the position (x5, y5, z5) to move to (x6, y6, z6). 在这里,各座标值如下。 Here, each of the coordinate values ​​as follows.

X5=g2y5=y5z5=-d0x6=(d2-d0)sinθ+g2cosθy6=y5z6=-(d2-d0)(1-cosθ)-g2sinθ-d0这样,基板右部GR的(x6,y6,z6)的部分成为相对第2产品台34的不动点,相对位于基板右部GR的点PR的破断部分从上述不动点作用剪切力和拉伸力。 X5 = g2y5 = y5z5 = -d0x6 = (d2-d0) sinθ + g2cosθy6 = y5z6 = - (d2-d0) (1-cosθ) -g2sinθ-d0 Thus, the right portion of the substrate of GR (x6, y6, z6) of Fixed point opposite portion becomes the second stage 34 of the product, breaking portion is located opposite the point PR of the right portion of the substrate the fixed point GR acting from shear and tensile forces.

这样的剪切力和拉伸力也作用于图14(b)所示的点QR。 Such shear and tensile force acts on the QR shown in FIG. 14:00 (b). 然而,从点PR′观看到的到划线S2的距离和从点QR′到观看到的与划线S2的距离如图10所示那样不同,QR一方与PR相比,剪切应力和拉伸应力变大。 However, from the point PR 'viewed by the chain line and the distance S2 from the point QR' viewing distance to the scribe line S2 are different, as shown in FIG. 10, QR one compared with PR, a shear stress and tensile elongation stress becomes large. 即使玻璃材料的拉伸弹性模量在两者的部分相同,基板右部GR相对基板左部GL的单侧支承的前端部的剪切应力、拉伸应力、弯曲应力的QR值变小。 Even if the tensile modulus of the glass material in the same section between the shear stress of the distal portion of the right portion of the substrate mounted on one side of the substrate opposite the left portion GR GL tensile stress, bending stress QR value becomes smaller. 这是由于该单侧支承的前端长度如图14(a)所示那样较长,所以,弹性变形使应力缓和。 This is because the length of the cantilevered distal end of FIG. 14 (a), as long as shown, so that the elastic deformation of the stress relaxation. 为此,应力高的点QR成为破断点,上基板G1被截断。 For this purpose, the high stress points QR become broken breakpoint on the substrate G1 is truncated.

然后,当使第1产品台33朝CW方向倾转角度θ时,在划线S2作用剪切应力和拉伸应力,下基板G2截断。 Then, when the first product table 33 toward the tilting angle [theta] CW direction, the scribe line S2 shear and tensile stresses, the lower substrate G2 truncated. 在该场合,与上述同样的情况在基板左部GL的PL点和QL点产生。 In this case, similar to the case of the above point is generated in the PL and QL GL of the left portion of the substrate point. 这样,由两产品台的回转以划线S为中心朝+x轴向和-x轴向作用拉伸应力,而且,在+z轴向和-z轴向作用剪切应力,所以,可容易地截断基板G。 Thus, the two products by the rotary table toward the center in a scribe line S + x and -x axis axially acting tensile stress, and, in the shearing stress + z and -z axial direction axially, therefore, can be easily truncated substrate G. 截断时,基板左部GL与基板右部GR相互离开。 When cut, the substrate with the substrate left portion and right portion GL GR away from each other. 在该场合,作为截断面的右边缘部不与基板右部GR的左边缘部接触。 In this case, as the right edge portion of the cut surface is not in contact with the left edge portion of the substrate right portion GR. 为此,玻璃基板的截断面不产生伤痕,可获得平滑的截断面。 To this end, cut surface of the glass substrate is not scratched, smooth cut surface can be obtained.

计算点PR的水平移动量时,成为(d0+d2)sinθ,在d2=5.0mm、d0=0.75mm、θ=3°的场合,成为0.300mm,获得比实施形式1的水平移动量0.039mm大得多的值。 When the horizontal movement amount calculating PR point become (d0 + d2) sinθ, at d2 = 5.0mm, d0 = 0.75mm, θ = 3 ° occasion, becomes 0.300 mm, the amount of horizontal movement is obtained in the form of a specific embodiment of 0.039mm much greater value. 另外,计算点PR的铅直方向的移动量,成为(d0+d2)(1-cosθ),代入上述数值,垂直移动量成为0.0079mm。 Further, a vertical direction movement amount calculation point PR is, becomes (d0 + d2) (1-cosθ), substituting these values, the amount of vertical movement becomes 0.0079mm. 该值形成划线S的剪切力。 The shear force value scribe line S is formed.

由划线S沿左右分割的基板通过解除第1夹持杆35a、第2夹持杆36a的推压,可从产品台拆下。 S divided by scribing the substrate along the left and right 35a, the second holding lever 36a is pressed, can be removed from the product by releasing the first holding station 1. 虽然使第1倾转台31和第2倾转台32交互地仅倾转相同角度θ,但倾斜角度也可在各倾转台不同,使哪个倾转台先倾转都不对基板G的截断特性产生影响。 Although the first tilting rotary table 31 and the second tilting turret 32 ​​alternately only tilting the same angle [theta], but the inclination angle may be in the tilting turret different, so which pour the turntable to the tilting does not affect the chopping characteristic substrate G.

如以上那样,由哪个破断装置都使基板G的靠前面的端面侧成为截断开始点,从前面向里面依次使截断扩展。 As described above, by the means which are broken so that the substrate G on the front face side becomes truncated starting point, sequentially truncated front extension facing inside. 在该截断装置中,由于基板的截断开始点为1点,所以,作用于基板的力的大小与现有的破断法相比价格低。 In the cutoff apparatus, since the cut start point of the substrate is 1 point, therefore, the amount of force applied to the substrate as compared with the conventional method of breaking a low price. 另外,截断端面整齐美观,不发生在现有技术中所述的那样的截断端面的问题。 Further, the end faces cut neat appearance, problems such as a cut end surface does not occur in the prior art. 另外,由激光划线装置相对进行了划线的基板也可同样地截断。 Further, by the laser scribing apparatus relative to the substrate was scribed can be similarly truncated. 在本发明的装置中,可容易地改变各保持块的安装位置和高度等,可随意设定产品台的回转量和张开角2α,所以设计的自由度增大。 In the apparatus of the present invention, the mounting position can be easily changed and the height of each holding block, and the like, can be arbitrarily set the amount of rotation of the product and opening angle 2 [alpha stage, so the degree of freedom in design is increased. 在本实施形式中,说明了形成在用于液晶板的夹层玻璃的基板的划线S1、S2从(x,y)平面看为相同位置的场合,但即使S1与S2的位置为了液晶板的端子的形成等而离开数mm,也可使用本破断装置没有问题地截断。 In the present embodiment, described is formed in the scribe line S1 of the substrate for a liquid crystal panel of laminated glass, S2 from the (x, y) is a plan view of the same position in the case, but even S1 and S2 to position the liquid crystal panel forming a terminal to leave the like numbers mm, this may also be used without problems breaking apparatus truncation.

另外,本实施形式的破断装置不仅可截断夹层玻璃,而且可截断单板的玻璃、半导体晶片、陶瓷基板等脆性材料基板。 Further, the present embodiment forms breaking apparatus not only cut a laminated glass, and the brittle material can be cut glass board, semiconductor wafer, ceramic substrate or the like. 特别是在液晶板那样的夹层玻璃基板的场合,可由交替的破断动作交替地截断上下的玻璃板,而且,不需要使基板反转的工序,所以,可大幅度提高作业效率。 Especially in the case of the liquid crystal panel such as a laminated glass substrate by alternately breaking down operation alternately cut the glass sheet, and does not require the substrate inverting step, therefore, can greatly improve the working efficiency. 本发明的破断装置也可应用于使用激光等加热手段加热脆性材料基板、利用在脆性材料基板发生的热变形形成划线的脆性材料基板的截断。 Breaking apparatus of the present invention may also be applied using a heating means for heating the brittle material substrate such as a laser, cut by heat deformation brittle material substrate forming a scribe line on a brittle material substrate occurs.

(实施形式3)下面,说明本实施形式3的破断装置。 (Embodiment 3) Next, the present embodiment 3 in the form of broken equipment. 图15为以局部剖切的方式示出本实施形式的破断装置50的一部分的透视图。 FIG 15 is a partial cross-section illustrating the embodiment of the present embodiment in the form of a perspective view of part 50 of the breaking device. 在本实施形式中,分成2部分的台51a、51b相互隔开间隙Z地设置,一方的台51b固定。 In the present embodiment, the stage is divided into parts 51a 2, 51b spaced from each other a gap Z is provided, one fixed station 51b. 在台51a的背面固定万向联轴节52、53、54,通过它们设置3根支柱56、57、58。 The rear surface 51a of the fixed joint coupling units 52, 53, which are provided by three struts 56, 57. 支柱57、58沿台51a的间隙Z的端面设置,支柱56设于支柱57的后方。 Struts 57, 58 are disposed along the end face 51a of the Z stage of the gap, the strut 56 is disposed behind the pillar 57.

在各支柱56、57、58的下部分别安装万向联轴节59、60、61。 In the lower portion of each strut 56, 57, 59, 60 are mounted universal joint. 在万向联轴节59和61的另一端部固定到基座62。 In the universal joint 59 and the other end portion 61 is fixed to the base 62. 支柱57比其它支柱短。 Pillar 57 shorter than the other struts. 万向联轴节60的另一端部通过伸缩臂63固定于基座62。 The other end portion of the universal joint 60 by a telescopic arm 63 fixed to the base 62. 该伸缩臂63为在其内部内装线性电动机等、根据来自外部的控制信号朝长度方向伸缩的臂。 The telescopic arm 63 is built in the interior of the linear motor and the like, according to a control signal stretchable in the longitudinal direction of the arm from the outside.

另外,在作为截断脆性材料基板的1个的玻璃板H的场合,如在图16示出上面图那样将玻璃板H配置到台上。 Further, in a case where a glass plate as a cutoff H brittle material substrate, as shown in FIG. 16 as a top view onto the stage glass H configuration. 此时形成于上表面的划线S位于间隙部地将玻璃板H跨到台51a、51b地吸附固定。 At this scribe line S is formed on the surface of the glass plate to a gap portion H to the stage across 51a, 51b fixed adsorbed. 这样固定玻璃板H后,使伸缩臂63伸长或压缩。 The thus fixed glass plate H, the telescopic arm 63 extended or compressed.

图17为除去玻璃板H示出使伸缩臂63伸长时的状态的说明图。 FIG 17 is a glass plate was removed state H illustrated telescopic arm 63 is elongated mission to FIG. 台51a以由连接万向联轴节59和61的由1点划线示出的线为中心轴L1回转,但其回转中心轴的方向不相对划线方向平行,具有某种角度。 Table 51a to the coupling 59 and the line shown by one-dot chain line 61 is connected to a universal central axis L1 of rotation, but the direction of rotation center axis not parallel to a direction opposite scribe line having a certain angle. 即,玻璃板的划线S与台51a的回转的中心轴L1不平行地设定。 That is, the central axis L1 of the rotary table 51a of the scribe line S is not set parallel to the glass sheet. 这样,台51a的间隙Z的端面的移动量如由图中的各箭头所示那样,越朝向图中前方侧越变大。 Thus, the amount of movement of the end face 51a of the table gap Z as indicated by the arrows in the figure by the above, toward the front side shown in the figure becomes large. 另外,随着上述角度增大,该倾向增强。 Further, as the angle increases, this tendency is enhanced.

结果,玻璃板H的前面的端面侧成为玻璃板的截断开始点,从前面向里面依次使玻璃板H的截断进展。 As a result, the front face side of the glass plate becomes truncated H start point of the glass sheet, which faces the front glass plate sequentially truncated progress of H. 在该破断法中,截断的开始点为1点,所以,作用于玻璃板的截断力的大小与现有的破断法相比价格变低。 In the breaking process, the starting point was 1 truncation point, so that the force acting on the size of the cut glass sheet becomes lower price compared with the conventional breaking method. 另外,破断端面即截断面整齐美观地形成,不发生在现有技术中所述那样的玻璃板H的截断端面的问题。 Also, broken ends cut surface i.e. neat appearance surface is formed, the end face of the glass sheet H truncation problem does not occur as in the prior art. 另外,对于由上述激光划线装置划线的玻璃板也可同样地截断。 Further, the glass sheet by the laser scribing means scribe can be similarly truncated. 在这样的截断方式中,可容易地改变各支柱56、57、58的安装位置和高度等,可随意设定台51a的回转量和回转方向,所以,设计的自由度高。 In this truncation may be easily changed and the position of the respective mounting pillars 56, 57 in height, and the amount of rotation can be arbitrarily set table 51a of the rotation direction, so that the degree of freedom of design.

在本实施形式中,另一方的台51b固定,但对于该台51b也可具有相同的回转机构。 In the present embodiment, the other 51b fixed station, but the station 51b may have the same swivel mechanism. 在该场合,需要使台51b的回转方向朝相反方向。 In this case, it is necessary to make the rotation direction of the table 51b in the opposite direction.

图18示出液晶母玻璃基板的放大断面。 FIG 18 shows an enlarged cross section of a liquid crystal mother glass substrates. 液晶母玻璃基板70的构造如周知的那样,将粘接剂72涂覆到一方的母玻璃基板71的周缘部等,夹住粒状的分隔物73地重合另一母玻璃基板74地相互固定母基板。 Configuration of the liquid crystal mother glass substrate 70 As is well known, the adhesive 72 applied to the peripheral edge portion of one of the other mother glass substrate 71, sandwiching the particulate separator 73 coincides another mother glass substrate 74 fixed to each other parent substrate. 通过从设于粘接剂72层的小孔向两母玻璃基板间的间隙部注入液晶75,可获得图中未示出的液晶板。 75 by injecting the liquid crystal, a liquid crystal panel obtained in FIG from the small holes (not shown) provided in the adhesive layer, the gap portion 72 between the two mother glass substrate.

为了使用规定尺寸的母板形成液晶母玻璃基板70并分离成多个液晶板,相对上侧的母玻璃基板74在其上面形成划线S1,下侧的母玻璃基板71使用已形成划线S2的基板。 To form the liquid crystal mother glass substrate 70 using the master predetermined size and separated into a plurality of liquid crystal panels, the mother glass substrate 74 on opposite sides of the scribe line S1 is formed thereon, the lower mother glass substrate 71 using the formed scribe line S2 substrate. 在现有的破断法中,当截断液晶母玻璃基板70时,截断一方的母玻璃基板后,使表里反转后,截断另一方的母玻璃基板。 In the conventional breaking method, when the cut liquid crystal mother glass substrate 70, the mother glass substrate cut one of the front and back reversed, the other cut the mother glass substrate.

使用本实施形式的破断装置时,在图18的液晶母玻璃基板70中,在组装前预先在母玻璃基板74的上面和母玻璃基板71的上面形成划线,由1次的台的回转动作同时截断上下的母玻璃基板。 When using this embodiment of the breaking means, the liquid crystal mother glass substrate 18 in 70, previously formed scribe line above the upper mother glass substrate 74 and the mother glass substrate 71 before assembly, the turntable 1 operation At the same time cut down the mother glass substrate. 为此,不需要母玻璃基板的反转工序,可大幅度提高作业效率。 For this purpose, the mother glass substrate reversal step is not required, can greatly improve the working efficiency.

(实施形式4)下面,说明本发明实施形式4的破断装置。 (Embodiment 4) Next, the breaking apparatus of the embodiment of the present invention form 4. 图19为示出本实施形式的破断装置80的主要部分构成的局部剖切透视图。 FIG 19 is a diagram illustrating the present embodiment in the form of broken partially cutaway perspective view showing a main portion 80 constituting the apparatus. 该破断装置80具有与实施形式3同样的台81a、81b。 The breaking means 80 in the form of Embodiment 3 has the same units 81a, 81b. 台81a、81b在设水平的即具有同一载置面的姿势的台间的间隙为Z时,间隙Z的大小在该状态下一样。 Units 81a, 81b disposed in the horizontal i.e. a gap between the mounting surface of the same station when the gesture is Z, Z is the same size as the gap in this state. 与实施形式1、2同样,设间隙Z的中央线为y轴。 Similarly with embodiment 1, the gap provided for the center line Z of the y-axis. 相对台81a的下部与y轴非平行,安装与台81a的下面成直角的轴承板82。 A lower table 81a relative to the y-axis non-parallel, to the mounting station 81a is below the bearing plate 82 at right angles. 在轴承板82的下部设置轴孔83,将通过该轴孔83的轴作为回转轴L2,可自由回转地保持台81a。 A shaft hole 83 provided in the lower bearing plate 82, the shaft through the shaft hole 83 as the rotary axis L2, rotatably holding table 81a. 由图中未示出的驱动装置使轴承板82转。 By a driving means not shown in FIG bearing plate 82 rpm. 这样,可获得与实施形式3相同的作用效果。 Thus, the embodiment can be obtained the same effects as 3.

(实施形式5)下面,说明本发明实施形式5的破断装置。 (Embodiment 5) Next, the breaking apparatus of the embodiment 5 of the present invention form. 图20和图21为示出本实施形式的破断装置90的主要部分构成的说明图,图20为侧面图,图21为透视图。 20 and FIG. 21 is a diagram illustrating the present embodiment in the form of a main portion explanatory view of the device 90 constituting the breaking, FIG. 20 is a side view, FIG. 21 is a perspective view of FIG. 该破断装置90通过同时地控制平行连杆机构的6轴,扩大玻璃板的截断自由度。 The breaking device 90 by simultaneously controlling the six-axis parallel link mechanism, the degree of freedom expanding cut glass sheet. 该破断装置90具有与实施形式3、4同样的台92a、92b。 The breaking means 90 in the form of embodiment has the same 3,4 station 92a, 92b. 台92a为固定台,台92b为可自由移动的台。 A fixed station units 92a, 92b is freely movable stage table.

如图20所示,台92a由4根支柱93-96固定于基座91。 20, the four sets of struts 92a fixed to the base 91 93-96. 台92b配置到台92a的侧方。 Table 92b disposed to the side of the station 92a. 台92b在其下面通过万向联轴节97-102连接到伸缩臂103-108。 92b connected to the telescopic arm units 103-108 via a universal joint on its lower 97-102. 这些伸缩臂103-108为具有与图15的伸缩臂63同样的功能的臂。 The arm is a telescopic arm 103-108 having the same function as telescoping arm 63 in FIG. 15. 在伸缩臂的内部内装线性电动机等,其长度方向的长度根据控制信号自由伸缩地控制。 Linear motor built inside the telescopic boom, etc., the length in the longitudinal direction in accordance with a control signal controlling telescopically freedom.

各伸缩臂103-108的下部通过万向联轴节109-114连接到基座91。 103-108 lower portion of each telescopic arm connected to the base 91 by a universal joint 109-114. 根据来自图21所示控制部115的控制信号独立地控制这些伸缩臂103-108的长度。 Independently controlling the lengths of the telescopic arms 103-108 control signal from the control unit 115 shown in FIG. 21. 如图21所示,由台92b下面的万向联轴节97-102形成的6角形和由基座91上的万向联轴节109-114形成的6角形为相互不同的形状。 , Hexagonal 92b formed by the following table and universal joints 97-102 base 91 by a universal joint on 109-114 formed hexagonal shapes different from each other as shown in FIG. 21. 由伸缩臂的伸缩控制任意一律地选择台92b的位置和载置面相对水平面的角度。 Telescopic telescopic arm is controlled by any of all selected angle relative to the horizontal position of the table 92b and the mounting surface. 使用这样并列伸缩动作的6轴的伸缩臂对控制对象物的回转量进行控制、或对位置进行控制的机构由平行机构实现。 Use of such a telescopic arm shaft 6 parallel to the telescopic operation of the swing control the amount of the object to be controlled, or the position controlling means is realized by a parallel mechanism.

当截断玻璃板时,首先,如图21所示那样,相对台92a隔开规定间隙使台92b成为同一平面地控制姿势。 When the cut glass sheet, first, as shown in FIG. 21, a predetermined gap relative units 92a 92b causes the stage to control the posture of the same plane. 然后,使划线S成为上面而且位于间隙部的中心地跨于台上配置玻璃板H。 Then, the scribe line S is located above and across the center of a gap portion disposed on the stage glass H. 在该状态下,由例如真空吸附或其它方法将玻璃板H固定于各台92a、92b。 In this state, for example, vacuum suction or other means is fixed to the glass plate H each station 92a, 92b. 在玻璃面形成硅等绝缘层膜的场合,也可由静电吸附固定。 Forming a silicon film where the insulating layer on the glass surface and the like, may also be electrostatically attracted and fixed.

台92b根据来自控制部115的控制信号使各伸缩壁成为规定长度地伸缩,从而使平行连杆机构动作。 Each station 92b becomes a predetermined length to the telescopic retractable wall according to a control signal from the control unit 115, so that the parallel link mechanism is operated. 与实施形式3同样地将中心轴L3作为假想轴使台92b回转。 Embodiment 3 with the central axis L3 in the same manner as the virtual axis so that the rotary table 92b. 中心轴L3位于台92b的下方,不与划线S平行。 L3 is located below the central axis table 92b is not parallel with the scribe line S. 即,中心轴L3与划线S在空间座标内处于扭转关系。 That is, the center axis L3 in a twisted relationship with the scribe line S in the spatial coordinates.

图22为示出截断玻璃板H的状态的破断装置90的侧面图。 FIG 22 is a state diagram illustrating a side view of the cut glass plate 90 H breaking. 与实施形式3同样,回转轴的方向可相对划线方向具有某种角度地使台92b回转。 Similarly with Embodiment 3, the rotary axis direction relative to a direction having a certain angle scribe line so that the rotary table 92b. 因此,将前面侧作为玻璃板H的截断开始点从前面依次使玻璃板H的截断发展。 Thus, as the front side of the cut start point of the glass sheet sequentially truncated development H H from the front glass. 为此,作用于玻璃板H的截断力的大小可较小,可整齐地加工玻璃板H的截断面。 For this reason, the force acting on the size of the cut glass plate H may be small, the processing can be neatly cut surface H of the glass plate. 另外,相对由激光形成盲裂纹的线的玻璃板施加比过去小的截断力也可将其截断。 Further glass line, the relative laser blind crack is formed by applying a smaller force than in the past may also be truncated truncated.

在该实施形式中,可对应于成为对象的玻璃板的厚度和形状由平行连杆机构设定任意的回转轴。 In this embodiment form, and it may correspond to the shape of the glass plate to a thickness of an object by a set of parallel linkage any rotating shaft. 另外,完成截断后,如图23所示那样,使再次截断的玻璃板H的端面相互不再接触地使台92b与台92a平行,而且形成台阶。 Further, after the completion of cut, as shown in FIG. 23, an end surface of the cut glass sheet H again to make contact with each other no longer station units 92a and 92b in parallel, and a step is formed. 另外,由此可容易地处理截断后的玻璃板H。 Further, the glass sheet easily handled whereby the truncated H.

另外,在将玻璃板配置到台92b的区域的周边,如图24所示那样,配置可自由上下移动的顶起销116。 Further, in the peripheral region of the glass sheet to a configuration of the table 92b, as shown in Figure 24, arranged vertically move freely from a top pin 116. 结束玻璃板的截断、水平地对台92b进行保持后,释放截断的玻璃板的吸附,使顶起销116动作,可从台92b抬起玻璃板。 Cut-off end of the glass plate, the arms 92b horizontally holding, adsorbing released truncated glass sheet, so that the operation pin 116 from the top, the glass sheet can be lifted from the table 92b. 然后,也可在如图24所示那样切断的玻璃板H与台92b之间插入除材手(除材ハンド)117,抬起玻璃板H,输送截断后的玻璃板H。 Then, may be inserted between the cutting as shown in table H and the glass sheet 92b shown in FIG. 24 in addition to the hand member (except material Haas nn then) 117, H lift glass, cut glass sheet conveyance H. 因此,可获得容易地向下一工序输送玻璃板H的效果。 Thus, a step down can be obtained easily effect conveyance of the glass sheet H.

另外,在该实施形式中,说明了截断1片玻璃板的场合,但在截断如图18所示那样在作为贴合脆性材料基板的一例的上下母玻璃基板形成划线的液晶母玻璃基板的场合也可适用该实施形式。 Further, in this embodiment, the description of a case where a glass plate is cut, but in the cut liquid crystal mother glass substrate as shown in the scribe line forming the upper and lower mother glass substrate of the example of the brittle material substrate 18 as shown as bonded this embodiment is also applicable case. 该场合不使液晶基板的表里反转即可截断两面的母玻璃基板。 In this case the substrate of the liquid crystal without inverting front and back sides can cut the mother glass substrate.

(实施形式6)下面说明本发明实施形式6的破断方法。 (Embodiment 6) Next, the method of breaking 6 of the present invention is described. 本实施形式的脆性材料基板的破断方法指作为上述基板G将1片液晶母玻璃基板120截断成规定形状、获得多个液晶玻璃基板121的制造方法。 The method of breaking a substrate of brittle material according to the present embodiment refers to a form of the substrate to a G liquid crystal mother glass substrate 120 cut into a predetermined shape, a method of manufacturing a plurality of liquid crystal glass substrates 121. 为了从1片液晶母玻璃基板120获得根据驱动信号按像素单位显示图像或文字的液晶板,需要各种制造工序。 In order to obtain from a liquid crystal mother glass substrate 120 of the liquid crystal display panel according to the driving signal of the image or text in pixel units, it requires a variety of manufacturing processes.

将包含TFT、扫描电极、信号电极、像素电极的基板称为TFT基板(也称为AM基板),将包含滤色片的基板称为相向基板,则液晶板为贴合上述TFT基板与相向基板、在该两基板充填液晶的阶段的制品。 Including the TFT, the scanning electrode, signal electrode, the pixel electrode substrate is referred to a TFT substrate (also referred to as AM substrate), the substrate comprising a color filter substrate opposed called, the liquid crystal panel is bonded to the TFT substrate and the counter substrate article filling stage of the two substrates of the liquid crystal. 上述液晶母玻璃基板120指贴合截断前的TFT基板(称母TFT基板)与截断前的相向基板(称为母相向基板)阶段的基板(母贴合基板)。 The liquid crystal mother glass substrate 120 refers to a bonded substrate before truncation TFT (called mother TFT substrate) and a counter substrate before truncation (called mother opposed substrate) of the substrate stage (mother bonded substrate). 因此,截断的贴合基板成为液晶玻璃基板121(贴合基板)。 Thus, truncated become bonded substrate 121 of the liquid crystal glass substrate (bonded substrate). 在液晶玻璃基板121中充填液晶,封闭液晶的注入口,在基板边缘的电极,成为可连接扁形电缆的状态的液晶板。 In the liquid crystal filled in a liquid crystal glass substrate 121, the liquid crystal injection port is closed, the edge of the electrode substrate, the liquid crystal panel may be a flat cable connection state.

为了明确本实施形式的破断方法在上述液晶板的制造工序中的定位,进一步增加说明。 To clarify the present form of embodiment the positioning method of breaking in the manufacturing process of the liquid crystal panel is further increased will be described. 为了从1片液晶母玻璃基板120获得多片液晶玻璃基板121,需要多种截断工序。 In order to obtain a multi-piece glass substrate 121 of the liquid crystal from a liquid crystal mother glass substrate 120, it requires multiple cutting step. 这由基板的划线或截断面位于液晶板的哪个部分加以区别。 This part of the liquid crystal panel which is distinguished by a scribe line or cut surface located in the substrate. 例如(A)将作为多倒角的大张贴合基板的液晶母玻璃基板120分割成规定形状的各液晶玻璃基板121的工序、(B)用于在多倒角的状态下露出液晶注入口的截断工序、(C)用于取出电极部分的截断工序等为其例。 For example, (A) the liquid crystal mother glass substrate as a multi-chamfered large post bonded substrate 120 is divided into a predetermined shape of the glass substrate of the liquid crystal of each step 121, (B) for exposing the liquid crystal injection port in a state where multiple chamfers the cutting step, (C) a step for removing the cut portion of the electrode and the like for Fig. 上述各工序的顺序在这里不需要预先决定,但至少(A)、(B)的工序包含于本实施形式。 Order of the above respective steps here need not be predetermined, but at least (A), (B) a step included in the present embodiment. 另外,在(A)的工序中,只要划线S以格子状(也称十字划线)形成于液晶母玻璃基板120,则需要多次截断工序。 Further, the (A) step, as long as the chain line S in a grid pattern (also called crosshatch) formed on the liquid crystal mother glass substrate 120, the cutting step multiple times.

图25示出包含这样的截断工序的液晶母玻璃基板120的破断方法。 FIG 25 illustrates a method of breaking the liquid crystal mother glass substrate comprising such a cutting step 120. 该破断方法包含(1)盒式装载机、(2)第1基板输送装置、(3)第1划线装置、(4)第2划线装置、(5)第2基板输送装置、(6)第1破断装置、(7)第2破断装置,经由这些装置制造多片液晶玻璃基板121。 The breaking method comprising (1) Cartridge loader, (2) the first substrate transfer means, (3) a first scribing device, (4) a second scribing device, (5) the second substrate transfer means (6 ) the first breaking means (7) the second breaking apparatus, liquid crystal manufacturing a multi-piece glass substrate 121 via these devices. 为此,将这样的截断工序称为液晶母基板自动截断线。 To this end, such a liquid crystal mother substrate cutting step is called automatic cut-off line.

如图25所示,盒式装载机122将多片液晶母玻璃基板120收容于盒中加以保持。 As shown, the multi-plate cassette loader 122 of the liquid crystal mother glass substrate 25 housed in the cassette 120 to be held. 供料机器人R1从盒式装载机122的盒取出液晶母玻璃基板120,移送到第1基板输送装置123。 Feeding the robot R1 withdrawn liquid crystal mother glass substrate from the cassette loader 120 of the cassette 122, is transferred to the first substrate transfer device 123. 第1基板输送装置123用于将从供料机器人R1供给的液晶母玻璃基板120定位到台的定位置。 First substrate transfer means 123 for the liquid crystal mother glass frit robot R1 supplied from the donor substrate 120 is positioned to the predetermined position of the stage. 该定位通过将液晶母玻璃基板120相互直交的端面推压到定位销而进行。 By positioning the liquid crystal mother glass substrate 120 to each other perpendicular to the end face pressed against the positioning pins is performed.

输送机器人R2用于将载置于台上的液晶母玻璃基板120输送到第1划线装置124的规定位置。 Transport liquid crystal mother glass substrate transfer robot R2 for the stage 120 is placed to a predetermined position of the first scribing apparatus 124. 将液晶母玻璃基板120中的母TFT基板设为120a,将母相向基板设为120b。 The mother TFT substrate 120 to the liquid crystal mother glass substrate 120a, the mother substrate opposed to 120b. 另外,基板的加工面与实施形式1、2同样地形成为与(x,y)平行的面。 Further, the embodiment forms the working surface of the substrate 1 and formed as the same (x, y) parallel to the plane. 第1划线装置124例如成为与母相向基板120b的x轴或y轴方向平行地分别形成划线S1,在这里,使用在现有技术例中说明的那样的划线方法。 A first scribing device 124 may be an x-axis or y-axis direction opposed to the mother board 120b are formed parallel to the scribe line Sl, where a scribing method as described in the prior art embodiment.

输送机器人R3从第1划线装置124取出形成划线S1的液晶母玻璃基板120,使上面与下面反转,提供给输送机器人R4。 Liquid crystal mother glass substrate transfer robot R3 scribing device 1 is removed from the first scribe line S1 124 120 the top surface and bottom inverted, is supplied to the transfer robot R4. 输送机器人R4用于将反转后的液晶母玻璃基板120输送到第2划线装置125的规定位置。 R4 conveying robot for conveying the reversed liquid crystal mother glass substrate 120 to a predetermined position of the second scribing apparatus 125. 第2划线装置125平行于母TFT基板120a的x轴或y轴方向地分别形成划线S2。 The x-axis parallel to the second scribe line 125 to the mother TFT substrate 120a or the y-axis direction, respectively, formed scribe line S2. 这些划线S1、S2的位置和其长度(绘画数据)由图中未示出的控制用CPU控制。 These scribe line S1, S2 and the length position (drawing data) CPU for controlling the control is not shown by FIG.

在两面形成划线的液晶母玻璃基板120由输送机器R5移送到第2基板输送装置126。 Liquid crystal mother glass substrate 120 is formed by a scribe line on both sides of the conveying machine R5 transferred to the second substrate transport device 126. 第2基板输送装置126用于将从输送机器人R5供给的液晶母玻璃基板120定位到定位置。 Liquid crystal mother glass substrate 126 of the second substrate transport means for transporting robot from R5 120 is positioned to supply a predetermined position. 输送机器人R6将载置于第2基板输送装置126的液晶母玻璃基板120移送到第1破断装置127的定位置。 The transfer robot R6 liquid crystal mother glass placed on the second substrate transport device 126 is transferred to the substrate 120 of the first breaking apparatus 127 of the predetermined position.

第1破断装置127和第2破断装置128与实施形式1或2的破断装置同样,所以,省略构造说明。 The first breaking means and breaking means 127 and 128 form the second embodiment 1 or 2, breaking the same, therefore, the configuration description thereof will be omitted. 第1破断装置127推压横跨第1台127a和第2台127b配置的液晶母玻璃基板120的上面地进行固定,使一方的台如图4所示那样朝+z方向和-z方向回转或如图11所示那样使双方的台同时朝相同方向回转,从而将液晶母玻璃基板120截断成方形。 The first breaking apparatus 127 is pushed across the top of the liquid crystal mother glass substrate 1 and the second stage 127a 127b disposed station 120 is fixed, so that as shown in one of the rotary table toward the + z direction and -z direction in FIG. 4 as shown in FIG. 11 or so that both stations simultaneously revolving in the same direction, so that the liquid crystal mother glass substrate 120 cut into a square.

输送机器人R7从台127b取出截断成方形的液晶母玻璃基板120,定位到第2破断装置128的定位置即跨于2个台128a、128b地定位载置。 Liquid crystal mother glass substrate transfer robot R7 taken from table 127b cut into a square 120, is positioned to the second predetermined position, i.e., the breaking apparatus 128 straddle two sets 128a, 128b positioned placement. 第2破断装置128截断液晶母玻璃基板120。 The second breaking apparatus 128 cut the mother glass substrate 120 of the liquid crystal. 在这里获得的基板成为规定形状的液晶玻璃基板121。 Here the substrate into a predetermined shape of the obtained glass substrate 121 of the liquid crystal. 这些液晶玻璃基板121由输送机器人R8和第3基板输送装置129移送,进入下一液晶板的制造工序。 The liquid crystal glass substrate 121 by the conveying robot apparatus 129 and the third substrate transfer R8 is transferred into the next manufacturing process of the liquid crystal panel.

下面,与现有的破断方法进行比较地说明具有以上工序的本实施形式的破断方法。 Hereinafter, the conventional method of breaking the breaking method of the present embodiment described the form of a comparatively more steps. 图26为使用现有的破断装置截断液晶母玻璃基板120的场合的工序图。 FIG 26 is a conventional breaking apparatus using a liquid crystal master cut step 120 of FIG case of a glass substrate. 图27为使用本发明破断装置截断液晶母玻璃基板120的场合的工序图。 FIG 27 is a breaking apparatus of the present invention where the cutting step of FIG liquid crystal mother glass substrate 120. 但是,图26由于示出截断工序为1个的场合,所以,不与图25的截断工序数一致。 However, FIG. 26 so that the cutting step is not consistent with a number of occasions, and since the cutting step shown in FIG. 25.

现有的截断装置按照图2所示方法,在玻璃板1的一方的面形成划线S,在玻璃板1的另一方的面推压破断杆4,使玻璃板1挠曲,从而截断玻璃板1。 Shutoff device according to the conventional method shown in FIG. 2, scribe line S formed on one surface of the glass plate 1, on the other surface of the glass sheet 1 is pushed broken rod 4, the glass sheet 1 flexed, thus cutting off the glass 1 plate. 另外,按照图3所示方法,在形成划线S的部分作用拉伸应力地使玻璃板1挠曲,截断玻璃板1。 Further, according to the method shown in FIG. 3, the scribe line S formed in part of the role of the tensile stress to the glass sheet 1 flexed, the glass sheet 1 cut. 当使用这样的破断装置时,在贴合玻璃基板的截断中需要图26(b)-(g)所示的工序。 Step shown in (g) - When such a breaking apparatus, the cut bonded glass substrate required FIG 26 (b).

即,使图26(a)所示液晶母玻璃基板120的母TFT基板120a处于上方,使用划线装置如(b)那样在母TFT基板120a形成划线S1。 That is, FIG. 26 (a) shown in the mother TFT liquid crystal mother glass substrate 120 is located above the substrate 120a, such as a scribing means (b), scribe line S1 formed on the mother TFT substrate 120a. 然后如(c)那样使用反转装置使液晶母玻璃基板120反转。 Then, as in (c) inverting means using the liquid crystal mother glass substrate 120 is inverted. 然后,如(d)那样,将破断杆推压于母相向基板120b,使垂直于母TFT基板120a的裂纹扩展,截断母TFT基板120a。 Then, as shown in (d), a breaking bar is pressed toward the mother substrate 120b, the vertical crack of the mother TFT substrate 120a, cut the mother TFT substrate 120a. 然后,保持液晶母玻璃基板120,使用划线装置如(e)所示那样在母相向基板120b形成划线S2。 Then, holding the liquid crystal mother glass substrate 120, such as a scribing means (e) is formed as shown in the scribe line S2 mother counter substrate 120b. 再次使用反转装置使液晶母玻璃基板120如(f)那样反转。 Again reversing device using the liquid crystal mother glass substrate 120, such as (f) above is inverted. 然后,如(g)那样将破断杆推压到母TFT基板120a,使垂直于母相向基板120b的裂纹扩展。 Then, as (g) above the breaking bar is pressed to the mother TFT substrate 120a, the vertical crack in the mother opposing substrate 120b. 然后,使液晶母玻璃基板120左右分离,则如(h)所示那样将液晶母玻璃基板120截断成多个液晶玻璃基板121。 Then, the liquid crystal mother glass substrate separated about 120, such as the (h) as shown in the liquid crystal mother glass substrate 120 cut into a plurality of liquid crystal glass substrate 121. 然而,在该方法中,需要2次基板的反转工序。 However, this method requires a substrate inverting step twice.

然而,当使用本实施形式1或2的破断装置时,相对液晶母玻璃基板120用图27(b)-(f)所示工序即可对应。 However, when the present form of embodiment the breaking apparatus 1 or 2, the relative liquid crystal mother glass substrate 120 (b) with FIG. 27 - (f) correspond to the step shown in FIG. 即,使图27(a)所示液晶母玻璃基板120的母相向基板120b位于上方,利用图25的第1划线装置124如(b)所示那样在母相向基板120b形成划线S1。 That is, FIG. 27 (a) shown in the mother liquid crystal mother glass substrates to face 120b of substrate 120 is positioned above by the first scribing device 124 as in FIG. 25 (b), a scribe line S1 as the mother counter substrate 120b. 接着,如(c)那样使用反转装置使液晶母玻璃基板120反转。 Next, as in (c) inverting means using the liquid crystal mother glass substrate 120 is inverted. 如(d)所示那样使用第2划线装置125在母TFT基板120a形成划线S2。 As (d), using the second scribing means scribe line S2 is formed as shown 125 on the mother TFT substrate 120a.

将在两面形成划线的液晶母玻璃基板120设置到图25的第1破断装置127,使一方的台回转到上侧和下侧,则如(e)和(f)所示那样在母TFT基板120a和母相向基板120b使垂直裂纹分别朝基板的厚度方向扩展,贯穿各基板。 A liquid crystal mother glass substrate 120 formed on both sides of the scribe line of the first breaking apparatus 127 of FIG. 25, so that the one stage to the upper and lower back side, such as (e) and (f) as shown in the mother TFT mother substrate 120a and the counter substrate 120b so that the vertical cracks are extended in the thickness direction of the substrate, through each of the substrates. 为此,产生所谓裂纹。 For this purpose, a so-called crack. 当朝左右分离液晶母玻璃基板120时,如(g)所示那样获得截断的液晶玻璃基板121。 When the liquid crystal mother glass substrate 120 separating the right and left, such as (g), obtained as a liquid crystal glass substrate 121 is cut. 按照该方法,基板的反转工序由1次即可对应。 According to this method, the substrate inverting step corresponds to a 1 times.

以上的工序为例如将液晶母玻璃基板120截断成方形的场合。 The above processes, for example, the liquid crystal mother glass substrate 120 is cut into a square case. 如图25所示那样,相对液晶母玻璃基板120以格子状形成划线,截断成更小尺寸的形状的液晶玻璃基板121的场合,图26和图27的工序差更大,在本实施形式的破断方法中,除了基板的截断面的平滑度外,还可获得省去基板的反转工序的效果。 As shown in Figure 25, relative to the liquid crystal mother glass substrate 120 to form scribing grid pattern, cut into the shape of a smaller size LCD glass substrate 121 of the case, step 27 of FIG. 26 and FIG greater the difference, in the present embodiment form breaking process, in addition to givers smooth cut surface of the substrate, may be omitted to obtain the effect of the substrate inverting step.

(实施形式7)下面说明本发明实施形式7的破断方法。 (Embodiment 7) breaking method of the present embodiment 7 of the invention will be described. 本实施形式的脆性材料基板的破断方法为图28所示那样的将液晶母玻璃基板130截断成多个液晶玻璃基板131的方法。 The method of breaking a substrate of brittle material according to the present embodiment is in the form of FIG. 28 as the liquid crystal mother glass substrate 130 cut into a plurality of liquid crystal glass substrate, a method 131 of FIG. 将包含TFT、扫描电极、信号电极、像素电极的基板称为TFT基板,将包含滤色片的基板称为母相向基板。 Including the TFT, the scanning electrode, signal electrode, the pixel electrode substrate is called a TFT substrate, the substrate including the color filter is called the mother counter substrate. 该液晶母玻璃基板130为由密封剂132贴合未形成划线的作为第1脆性材料基板的母相向基板130b和预先形成划线S2的作为第2脆性材料的母TFT基板130a获得的基板。 The liquid crystal mother glass substrate 130 by the sealant 132 is not formed together as a first scribe a brittle material substrate a mother counter substrate 130b and the substrate formed in advance as the mother TFT substrate 130a of the second brittle material obtained scribe line S2.

图29为示出这样的液晶母玻璃基板130的破断方法的液晶母玻璃基板自动截断线的构成图。 FIG 29 is a block diagram illustrating such a method of breaking the mother glass substrate 130 of the liquid crystal mother glass substrate automatically cut line. 该破断方法包含(1)盒式装载机、(2)第1基板输送装置、(3)第1划线装置、(4)第1破断装置、(5)第2基板输送装置、(6)第2破断装置、(7)第3基板输送装置,经由这些装置制造多片液晶玻璃基板131。 The breaking method comprising (1) Cartridge loader, (2) the first substrate transfer means, (3) a first scribing device, (4) the first breaking means (5) the second substrate transport device (6) the second breaking means (7) the third substrate transfer apparatus for producing multi-piece glass substrate 131 via the liquid crystal device.

在图29中,(1)的盒式装载机133用于将多片液晶母玻璃基板130收容于盒中加以保持。 In FIG. 29, (1) a cartridge loader 133 for multi-chip liquid crystal mother glass substrate 130 to be received in the cassette holder. 供料机器人R1从盒式装载机133的盒取出液晶母玻璃基板130,移送到(2)所示第1基板输送装置134。 Feeding the robot R1 withdrawn liquid crystal mother glass substrate from the cassette loader 130 of the cassette 133, is transferred to (2) shown in the first substrate transfer device 134. 第1基板输送装置134用于将移送的液晶母玻璃基板130定位到台的定位置。 Liquid crystal mother glass substrate 134 of the first substrate transfer means 130 is positioned for transfer to a predetermined position of the table.

输送机器人R2用于将载置于台上的液晶母玻璃基板130输送到(3)的划线装置135的规定位置。 Scribing the mother glass substrate of the liquid crystal device delivery transfer robot R2 for the stage 130 is placed to (3) in a predetermined position 135. 划线装置135用于在图28所示母相向基板130b的上面形成划线S1。 In the above apparatus 135 for scribing the counter substrate 28 shown in FIG master 130b formed scribe line S1.

输送机器人R3从划线装置135取出形成划线S1的液晶母玻璃基板130,移送到(4)的第1破断装置136的定位置。 Liquid crystal mother glass substrate transfer robot R3 scribe line S1 is removed from the scribe line forming means 135 130, is transferred to (4) in a first predetermined position breaking apparatus 136. 在第1破断装置136适用由实施形式1-5说明的破断装置。 Breaking the first breaking means breaking device 136 by a suitable form of embodiment 1-5 is described. 图29示出适用实施形式1或2的破断装置的场合,推压跨于第1台136a和第2台136b地载置的液晶母玻璃基板130的上面进行固定,使一方的台回转或使双方的台同时回转,从而将液晶母玻璃基板130截断成方形。 FIG 29 shows a suitable embodiment of the case of breaking device 1 or 2 is pressed straddle is fixed above the first station 136a and the second stage 136b to the mounting of the liquid crystal mother glass substrate 130 of the stage one revolution or to while both the rotary table, so that the liquid crystal mother glass substrate 130 cut into a square.

输送机器人R4取出截断成方形的液晶母玻璃基板130,载置到(5)的第2基板输送装置137的台。 Transfer robot R4 to cut a square liquid crystal mother glass substrate 130, is placed (5) of the second stage 137 of the substrate transfer apparatus. 输送机器人R5用于将截断成为方形的液晶母玻璃基板130移送到(6)的第2破断装置138的定位置。 Liquid crystal mother glass substrate transfer robot for R5 130 square truncated be transferred to (6) of the second breaking apparatus 138 in a predetermined position. 第2破断装置138将液晶母玻璃基板130截断成规定形状,获得多个液晶玻璃基板131。 The second liquid crystal device 138 breaking the mother glass substrate 130 cut into a predetermined shape to obtain a plurality of liquid crystal glass substrate 131. 截断的液晶玻璃基板131由输送机器人R6和第3基板输送装置139移送,进入到下一液晶板的制造工序。 Truncated LCD glass substrate 131 by the conveying robot 139 and the third substrate transfer R6 is transferred proceeds to the next manufacturing process of the liquid crystal panel. 作为第2破断装置,适用在实施形式1-5中说明的破断装置。 As the second breaking means for breaking apparatus in the form of embodiment described in 1-5.

在这样的破断方法中,不需要液晶母玻璃基板130的反转装置,如图29的(3)所示那样由1台破断装置即可对应。 In such a method of breaking, no liquid crystal mother glass substrate inverting device 130, and (3) corresponds to 29 of FIG. 1 as shown by a broken station apparatus.

(实施形式8)下面,说明本发明实施形式8的破断方法。 (Embodiment 8) Next, the breaking method of the embodiment of the present invention 8. 本实施形式的脆性材料基板的破断方法的特征在于使用两面划线装置。 Wherein the method of breaking a substrate of brittle material according to the present form of embodiment is the use of both sides of scribe devices. 另外,本实施形式的液晶母玻璃基板140与实施形式7的液晶母玻璃基板130不同,在母TFT玻璃基板和母相向基板都不预先形成划线S。 Further, different forms of embodiment of the present liquid crystal mother glass substrate 140 and the mother glass substrate 130 of the embodiment 7, the mother TFT substrate opposed to the glass substrate and the mother not previously formed scribe line S.

图30为示出这样的液晶母玻璃基板140的破断方法的液晶母玻璃基板自动截断线的构成图。 FIG 30 is a diagram illustrating such a liquid crystal mother liquid crystal mother glass substrate constituting FIG automatically cut line breaking a glass substrate 140 method. 该破断方法包含(1)盒式装载机142、(2)第1基板输送装置143、(3)第1两面划线装置144、(4)第2基板输送装置147、(5)第1破断装置148、(6)第3基板输送装置149、(7)第2两面划线装置150、(8)第4基板输送装置153、(9)第2破断装置154、(10)第5基板输送装置155,经由这些装置制造多片液晶玻璃基板141。 The breaking method comprising (1) a cassette loader 142, (2) the first substrate transfer apparatus 143, (3) on both sides of the first scribing device 144, (4) the second substrate transport device 147, (5) a first breaking device 148, (6) a third substrate transfer apparatus 149, the second breaking means (7) the second sides scribing apparatus 150, (8) a fourth substrate transfer device 153, (9) 154, (10) a fifth substrate transfer apparatus 155, a multi-piece manufacturing a liquid crystal glass substrate 141 via these devices.

对于供料机器人R1、输送机器人R2-R7、第1基板输送装置143、147、149、153、155,由于与实施形式6、7所示场合功能相同,所以省略说明。 For feeding the robot R1, transfer robot R2-R7, 143,147,149,153,155 first substrate transfer means, the same as with the case shown in FIG. 6 and 7 embodiment function, description thereof is omitted.

第1两面划线装置144具有多个台145a和145b、设于该装置中央的划线头安装件146a、可自由移动地保持于划线头安装件146a的上下的划线头146b。 Both surfaces of the first scribing apparatus 144 having a plurality of stations 145a and 145b, disposed in the center of the head mounted scribing device member 146a, is held movably in the vertical scribe head mounted scribing head 146b of member 146a. 液晶母玻璃基板140由台145a移送到划线头安装件146a的部分时,液晶母玻璃基板140的上下两面的一部分进入到加工区域地保持为桥接状态。 When the liquid crystal mother glass substrate 140 by the scribing station 145a is transferred to the head portion 146a of the mounting member, a portion of the upper and lower surfaces of the liquid crystal mother glass substrate 140 into the processing region to bridge state maintained. 划线头146b通过扫描该桥接部分,进行上下两面的划线。 Scribing head by scanning the bridge portion 146b, upper and lower surfaces of scribing.

作为划线装置,如现有技术例说明的那样,具有使用超硬金属制或金刚石制的轮式切割机的场合和使用由激光进行工作的激光划线器的场合。 As the scribing device, as in the prior art embodiment described above, a cemented carbide having a metal case or a diamond wheel using a laser scriber and operates by the laser cutting machine of the case. 在轮式切割机方式的场合,2个轮式切割机同步地压接液晶母玻璃基板140的两面地回转移动(转动),从而同时形成划线S1和S2。 In the case of the embodiment cutter wheel, two wheel cutting machine crimping the liquid crystal in synchronization with both surfaces of the mother glass substrate 140 of the rotary movement (rotation), thereby simultaneously forming scribe line S1 and S2. 另外,在激光划线方式的场合,将2个光点照射到液晶母玻璃基板140的两面,同时进行扫描,跟随该照射部分由冷媒进行点冷却。 Further, in the case where the laser scribing method, the two light spot is irradiated onto both sides of the liquid crystal mother glass substrate 140, while scanning the illuminated portion follows the point-cooled by a refrigerant. 这样,进行利用玻璃材料的热变形的盲划。 In this way, thermal deformation of the blind using a glass material plan. 第2两面划线装置150的构造与第1两面划线装置144同样。 Both surfaces of the second scribing means scribe line on both sides of the first structure 144 150 likewise.

第1破断装置148和第2破断装置154为使形成于液晶母玻璃基板140两面的划线S成为截断面地截断基板的装置。 The first breaking means 148 and the second breaking apparatus 154 is formed on both surfaces of the liquid crystal mother glass substrate 140 of the scribing apparatus S is cut to the cut surface of the substrate. 如由实施形式1或2所述那样,保持左右的台并使其间隙不平行,使左右的台的至少一方回转。 As a form of the embodiment 1 or 2 above, so as to maintain a gap around the table, and not parallel, so that at least one of the left and right rotary table. 在图30中,使用该方式的破断装置,在第1破断装置148中,台148a、148b的间隙不平行。 In FIG 30, a breaking apparatus of the embodiment, the first breaking apparatus 148, station 148a, 148b are not parallel to the gap. 对于第2破断装置154,也使台154a、154b的间隙不平行。 To the second breaking apparatus 154, also units 154a, 154b are not parallel to the gap.

作为第1破断装置148和第2破断装置154,也有使用其它方式的场合。 A first breaking apparatus 148 and the second breaking apparatus 154, there are occasions in other ways. 例如,使用图20-图23所示的平行连杆机构保持如在实施形式5说明的那样载置液晶母玻璃基板140进行固定的2个台内的一方的台。 For example, the parallel link mechanism shown in FIG. 20 as in FIG. 23 for holding the station side within the fixed station 2 is placed above the liquid crystal mother glass substrate 5 in the form of embodiment described in 140. 另外,为在基板截断时将从划线离开的位置的轴作为回转轴使该台回转从而截断的方式。 The shaft is cut when the substrate away from the chain line position of the rotary shaft as the rotary table so that the truncated manner. 在该方式的场合,图30所示台148a、148b的间隙和台154a、154b的间隙平行。 In the case of this embodiment, as shown in FIG units 148a, 148b, and the gap 30 units 154a, 154b are parallel to the gap.

这样按照本实施形式的破断方法,不需要液晶母玻璃基板140的上下面反转的工序,不需要设置基板的反转装置,可减小液晶母玻璃基板截断线的设置面积。 Thus, according to the form of breaking of the method according to the present embodiment, the upper and lower reversing step does not require the liquid crystal mother glass substrate 140, a substrate inverting device need not be provided, may be provided to reduce the area of ​​the liquid crystal mother glass substrate cut line.

按照本申请的脆性材料基板的破断装置,对于已形成划线的基板,当截断基板时在划线的一端作用截断力,所以,基板的截断从该一端侧朝另一端侧依次扩展,可整齐地形成基板截断的端面。 Breaking apparatus according to the present application is a brittle material substrate, the substrate formed scribe line, when the cut end of the substrate scribing action closing force, so that the substrate is sequentially cut from the extended end side toward the other end side, neatly cut end surface formed in the substrate. 另外,作用的截断力与现有的破断法相比小得多,可使破断装置本体小型化。 Further, the cut force of the conventional method is much smaller than the breaking, breaking enable downsizing of the apparatus body.

按照本申请的脆性材料基板的破断方法,在从1片液晶母玻璃基板截断成多片液晶玻璃基板的工序中,不使基板反转即可由1次的工序截断液晶母玻璃基板的两面。 The method according to the present disclosure breaking brittle material substrate, in the liquid crystal cut from a mother glass substrate into a plurality of sheets of LCD glass substrate step, the substrate is not inverted to both surfaces of the liquid crystal mother glass substrate 1 by truncating step. 为此,可减少用于基板截断的反转工序。 For this purpose, the substrate can be reduced for inverted truncated step.

Claims (18)

1.一种脆性材料基板的分割装置,其特征在于:具有第1、第2产品台、第1产品夹持装置、第2产品夹持装置、滑动机构、倾转机构及回转控制部;该第1、2产品台装载有至少在1面有划线的脆性材料基板并使上述划线位于其间隙之间;当将上述第2产品台相向的上述第1产品台的边缘作为第1边缘,将上述第1产品台相向的上述第2产品台的边缘作为第2边缘时,该第1产品夹持装置推压并固定上述脆性材料基板的位于上述第1边缘的部分;该第2产品夹持装置推压并固定上述脆性材料基板的位于上述第2边缘的部分;该滑动机构朝向与上述脆性材料基板的划线成直角的方向使上述第1产品台和第1产品夹持装置成一体地从划线后退地提供压力;该倾转机构以与上述脆性材料基板的划线平行的倾转轴为回转轴,可使上述第2产品台和第2产品夹持装置一体回转;该回转控 An apparatus dividing a brittle material substrate, comprising: a first and second stage product, the product of the first holding means, second holding means products, the slide mechanism, the tilting mechanism and a rotation control unit; the the first and second stage product is loaded with at least scribing a brittle material substrate scribing and positioned above a gap between its surface; when the edge of the first stage product of the stage facing the second product as the first edge when the edge of the second product of the first stage product stage as opposed second edge, the first product and clamping means for fixing the pressed portion is located above the first edge of the brittle material substrate; the second product located on the second edge portion of the clamping device is pressed and fixed to the above-described brittle material substrate; the above-described slide mechanism toward the scribing a brittle material substrate so that the direction perpendicular to the first stage product and the first product into a holding means integrally provided in the backward pressure from the scribe line; the tilting mechanism to scribe a brittle material substrate with the above-described tilt axis is parallel to the rotary shaft, causes said second stage product and the second product holder means rotate integrally; the revolution control 部控制上述倾转机构,使上述第2产品台和第2产品夹持装置回转;上述第1产品台和第2产品台使两台的相向边缘不平行地配置,上述第2产品台的倾转轴设置成从上述脆性材料基板的划线观看时存在于基板的厚度范围内。 Means for controlling the tilting unit, so that the second stage product and the second product holder revolving device; the first stage product and second stage product 2 so that two opposing edges are not arranged in parallel, the second product was poured station when the shaft is arranged above scribing a brittle material substrate is viewed from the thickness range is present in the substrate.
2.根据权利要求1所述的脆性材料基板的分割装置,其特征在于:上述第1产品夹持装置具有推压上述脆性材料基板的划线附近的第1夹持杆,上述第2产品夹持装置具有推压上述脆性材料基板的划线附近的第2夹持杆,当上述第2产品台回转时,上述第2夹持杆作为对上述划线附近的基板部分作用剪切力的力点起作用。 2. The brittle material substrate dividing apparatus according to claim 1, wherein: said first product having a first clamping means clamping bar presses the vicinity of the scribing a brittle material substrate, the second clip product holding means having a second clamping bar presses the vicinity of the scribing a brittle material substrate, the second product when said rotary table, and the second clamping rod acting as a substrate portion in the vicinity of the scribe line shear force point kick in.
3.根据权利要求1所述的脆性材料基板的分割装置,其特征在于:上述第2产品台的倾转轴位于上述脆性材料基板的上面与下面的中心。 Dividing means 3. The brittle material substrate according to claim 1, wherein: said second tilt axis is located above the product units below the brittle material substrate center.
4.一种脆性材料基板的分割装置,其特征在于:具有第1、第2产品台、第1产品夹持装置、第2产品夹持装置、第1倾转机构、第2倾转机构及回转控制部;该第1、2产品台载置至少在1面形成有划线的脆性材料基板并使上述划线位于其间隙之间;当将上述第2产品台相向的上述第1产品台的边缘作为第1边缘,将上述第1产品台相向的上述第2产品台的边缘作为第2边缘时,该第1产品夹持装置推压并固定上述脆性材料基板的位于上述第1边缘的部分;该第2产品夹持装置推压并固定上述脆性材料基板的位于上述第2边缘的部分;第1倾转机构以与上述脆性材料基板的划线平行的倾转轴为回转轴,可使上述第1产品台和第1产品夹持装置一体回转;第2倾转机构以与上述脆性材料基板的划线平行的倾转轴为回转轴,可使上述第2产品台和第2产品夹持装置一体回转;该回转控制 A brittle material substrate division apparatus, comprising: a first and second stage product, the product of the first holding means, second holding means the product, the first tilting mechanism, and the second tilting mechanism rotation control unit; the scribe line of the brittle material substrate placed on the first and second stage product is formed on at least one surface thereof and a gap is located between the scribe; product when said first stage to said second stage product facing edge as the first edge, the second edge of the product of the first stage product of the stage facing the second edge as the product of the first gripping means and fixing the pressing brittle material substrate is located at the first edge part; the product of the second holding means and pressed fixing the brittle material substrate is positioned in the second edge portion; a first tilting mechanism to scribe a brittle material substrate with the above-described tilt axis is parallel to the rotary axis, can the first product and the first product table rotates integrally holding means; second tilting mechanism to scribe a brittle material substrate with the above-described tilt axis is parallel to the rotary shaft, causes said second stage product and the second product holder means rotate integrally; the swing control 控制第1和第2倾转机构,使上述第1产品台和第1产品夹持装置及上述第2产品台和第2产品夹持装置回转;上述第1产品台和第2产品台使两台的相向边缘不平行地配置,上述第1产品台的倾转轴设置于上述脆性材料基板的划线近旁的基板的上侧。 2 controls the first and second tilting means, so that the product of the first stage product and the first holding means and the second item and the second item table rotary holding means; said first product and the second stage so that the two sets of products not arranged parallel to the upper stage of opposing edges, the first tilt shaft provided to the product table brittle material substrate scribing the vicinity of the substrate. 上述第2产品台的倾转轴设置于上述脆性材料基板的划线近旁的基板的下侧。 The lower side of the tilt axis of the second stage product is provided to the brittle material substrate scribing the vicinity of the substrate.
5.根据权利要求4所述的脆性材料基板的分割装置,其特征在于:上述第1产品夹持装置具有推压上述脆性材料基板的划线附近的第1夹持杆,上述第2产品夹持装置具有推压上述脆性材料基板的划线附近的第2夹持杆,当上述第1产品台或第2产品台回转时,上述第1夹持杆或第2夹持杆作为对上述划线附近的基板部分作用剪切力和拉伸力的力点起作用。 The dividing means of the brittle material substrate according to claim 4, wherein: said first product having a first clamping means clamping bar presses the vicinity of the scribing a brittle material substrate, the second clip product holding means having a second clamping bar presses the vicinity of the scribing a brittle material substrate, when said first stage product or the second stage product swivel, the clamp first one or the second clamping lever as described above zoned the shearing force acting portion of the substrate and tensile forces acting in the vicinity of the point line.
6.根据权利要求4所述的脆性材料基板的分割装置,其特征在于:上述第1产品台的倾转轴和第2产品台的倾转轴设置于从上述脆性材料基板的厚度中心观看时处于上下对称的位置。 6. The dividing means of the brittle material substrate according to claim 4, wherein: the tilt axis of the tilt shaft of the first stage product and second stage product is provided in the vertical as viewed from the center of the thickness of the brittle material substrate symmetrical positions.
7.一种分割方法,固定形成有划线的脆性材料基板,在隔开有间隙地两分的产品台的上面,使上述划线位于上述间隙处,通过回转至少一个产品台来分割所述脆性材料基板,其特征在于:上述第1产品台和第2产品台使两台的相向边缘不平行地配置,将上述脆性材料基板固定于上述第1产品台和第2产品台上,并使上述脆性材料基板的划线位于上述第1产品台和第2产品台之间的间隙处,将上述第1产品台和/或者第2产品台以与上述划线平行的各自的倾动轴为中心旋转,从而使上述脆性材料基板从上述划线的一端依次向上述划线的另一端被分割。 A segmentation method for securing a scribing a brittle material substrate is formed in two spaced apart with a gap above the product on the table, so that the chain line is located at the gap to divide the product by the rotation of the at least one station brittle material substrate, wherein: said first and second stage product so that opposing two sets of products are not arranged parallel to the edges, the above-described brittle material substrate fixed to the first product and the second stage product stage, and scribing a brittle material substrate is positioned above the gap between the product and the second stage of the first stage product, the product of the first stage and / or the second stage product to the above-described respective scribe line parallel to the center axis of tilting rotation, so that said brittle material substrate sequentially from one end of the scribe line to the other end of the divided scribe lines.
8.根据权利要求7所述的分割方法,其特征在于:上述第2产品台的倾转轴设置从上述脆性材料基板的划线观看时存在于基板的厚度范围内。 8. The method of segmentation according to claim 7, wherein: the tilt axis of the second product present in the table provided within the thickness of the substrate as viewed from the above-described scribing a brittle material substrate.
9.根据权利要求8所述的分割方法,其特征在于:上述第2产品台的倾转轴设置于上述脆性材料基板的上面和下面的中心位置上。 9. The method of segmentation according to claim 8, wherein: the tilt axis of the second stage product is disposed above and below the central position of the brittle material substrate.
10.根据权利要求8所述的分割方法,其特征在于:如果将与上述第2产品台相向的上述第1产品台的边缘作为第1边缘,与上述第1产品台相向的上述第2产品台的边缘作为第2边缘,以推压并固定上述脆性材料基板的位于上述第1边缘的部分的部件为第1产品夹持杆;推压并固定上述脆性材料基板的位于上述第2边缘的部分的部件为第2产品夹持杆,当上述第2产品台回转时,上述第2夹持杆作为对上述划线附近的基板部分作用剪切力的力点起作用。 10. The method of segmentation according to claim 8, wherein: the first edge of the product if the facing table and the second edge as the first stage product, the product of the first stage facing the second product edge as the second edge of the table, and fixed to the pressing portion member located at the first edge of the brittle material substrate is a first clamping bar products; pressing and fixing the brittle material substrate are positioned the second edge member portion is a second clamping bar products, the second product when said rotary table, and the second holding lever as a force point portion of the substrate close to the shear force acts scribing.
11.根据权利要求7所述的分割方法,其特征在于:上述第1产品台的倾转轴设置于上述脆性材料基板的划线近旁的基板的上侧,上述第2产品台的倾转轴设置于上述脆性材料基板的划线近旁的基板的下侧。 11. The method of segmentation according to claim 7, wherein: the tilt axis of the tilt shaft on the first product table is provided on the brittle material substrate scribing vicinity of the substrate side, the second stage is disposed on the product vicinity of the lower substrate scribing the brittle material substrate.
12.根据权利要求7所述的分割方法,其特征在于:如果将与上述第2产品台相向的上述第1产品台的边缘作为第1边缘,与上述第1产品台相向的上述第2产品台的边缘作为第2边缘,以推压并固定上述脆性材料基板的位于上述第1边缘的部分的部件为第1产品夹持杆;推压并固定上述脆性材料基板的位于上述第2边缘的部分的部件为第2产品夹持杆,当上述第1产品台或上述第2产品台回转时上述第1夹持杆或第2夹持杆作为对上述划线附近的基板部分作用剪切力和拉伸力的力点起作用。 12. The method of segmentation according to claim 7, wherein: the first edge of the product if the facing table and the second edge as the first stage product, the product of the first stage facing the second product edge as the second edge of the table, and fixed to the pressing portion member located at the first edge of the brittle material substrate is a first clamping bar products; pressing and fixing the brittle material substrate are positioned the second edge the second member is part of the product holder bar, when the first stage product or the second product holder above the table rolling a first lever or the second holding part acting as a substrate for the vicinity of the scribe line shear point of force and tensile force acts.
13.根据权利要求12所述的分割方法,其特征在于:上述第1产品台的倾转轴和第2产品台的倾转轴设置于从上述脆性材料基板的厚度中心观看时处于上下对称的位置。 13. The segmentation method as claimed in claim 12, wherein: the tilt axis of the tilt shaft of the first stage product and second stage product is disposed in vertically symmetrical positions as viewed from the center of the thickness of the brittle material substrate.
14.根据权利要求7-13的任一项所述的分割方法,其特征在于:该脆性材料基板为第1母脆性材料基板和第2脆性材料基板相向贴合在一起的母贴合基板。 14. The method of segmentation according to any one of 7-13 claims, characterized in that: the brittle material substrate is a brittle material of the first mother substrate and the second substrate opposing brittle material attached to the mother bonded substrate together.
15.一种母贴合基板的分割系统,该母贴合基板为由第1母脆性材料基板和第2母脆性材料基板相向贴合在一起构成,其特征在于:具有第1搬运机器人、第1划线装置、第2搬运机器人、第2划线装置、第3搬运机器人、第1分割装置、第4搬运机器人、第2分割装置,其中该第1搬运机器人将母贴合基板搬运至在上述母贴合基板的第1母脆性材料基板上划线的第1划线装置处;该第1划线装置在由上述第1搬运机器人搬运来的母贴合基板的第1母脆性材料基板上划线;该第2搬运机器人将由第1划线装置在第1母脆性材料基板上形成划线后的母贴合基板上下反转,并搬运到第2划线装置处;该第2划线装置在由上述第2搬运机器人搬运来的母贴合基板的第2母脆性材料基板上划线;该第3搬运机器人将由第2划线装置在第2母脆性材料基板上形成划线后的母贴合基板并搬运到权利要 A segmentation system bonded mother substrate, the mother bonded mother substrate by the first brittle material substrate and the second mother substrate opposing brittle material bonded together to form, comprising: a first transfer robot, a first scribing apparatus 1, the second transfer robot, the second scribing means, the third transfer robot, the first dividing means, the first transfer robot 4, the second dividing means, wherein the first transfer robot the mother bonded substrate is transported to the said master bonding scribing device at a first scribe line on a brittle material substrate, the first mother substrate; a first scribe line of the conveying means by the first master robot to transfer a first mother bonded substrate a brittle material substrate overline; the mother by the first scribing means scribe line formed on the first mother of the second brittle material substrate transfer robot bonded substrate upside down, and is transported to a second scribing device; the second stroke after the third transfer robot is formed by the second scribing means scribe line on a brittle material substrate, the second mother; parent line means carried by the second transfer robot bonded to the second mother substrate scribing a brittle material substrate the mother bonded substrate is transported to and claims 1-6的任一项所述的第1分割装置;该第1分割装置是权利要求1-6所述的任一个第1分割装置,并将由第3搬运机器人搬运来的母贴合基板分割成长方形状;第4搬运机器人将被分割成长方形状的贴合基板搬运到第2分割装置;该第2分割装置是权利要求1-6的任一项所述的第2分割装置、并将由第4搬运机器人搬运来的分割成长方形状的长方形状贴合基板分割成一定形状的贴合基板。 A first dividing means according to any one of 1 to 6; the first dividing means is a dividing means according to any one of claims 1-6, and conveyed by the third transfer robot to the mother bonded substrate dividing into strips; second transfer robot 4 is divided into the rectangular bonded substrate conveying means to the second division; the second dividing means is a dividing claims 1-6 in the second device according to claim, and the the first transfer robot 4 to a rectangular shape is divided into strips bonded substrate is divided into a certain shape of the bonded substrate.
16.一种母贴合基板的分割系统,该母贴合基板为将第1母脆性材料基板的其中一面和在第2母脆性材料基板形成有一定划线的面相向贴合在一起构成的,其特征在于:具有第5搬运机器人、划线装置、第6搬运机器人、第1分割装置、第7搬运机器人、第2分割装置,该第5搬运机器人将上述母贴合基板搬运至划线装置;该划线装置在由上述第5搬运机器人搬运来的母贴合基板的第1母脆性材料基板的上面划线;该第6搬运机器人将由所述划线装置在第1母脆性材料基板的上面形成划线后的母贴合基板搬运到第1分割装置;该第1分割装置为将由第6搬运机器人搬运来的母贴合基板分割成长方形状的权利要求1-6所述的任一项的第1分割装置;该第7搬运机器人将被分割成长方形状的母贴合基板搬运到第2分割装置;该第2分割装置为将由第7搬运机器人搬运来的长方形状贴合 16. A segmentation system bonded mother substrate, the mother substrate is bonded masterbatch in which a first brittle material substrate and the one surface of the second brittle material substrate mother certain scribe line is formed with a surface to paste together form characterized in that: a first transfer robot 5, scribing means, the first transfer robot 6, the first dividing means, the handling robot 7, the second dividing means, the first transfer robot 5 above the mother bonded substrate is transported to the scribe line means; scribing the mother means carried by the first transfer robot 5 above the dashed line attached to the first mother substrate of a brittle material substrate; the sixth by the first transfer robot mother means in said brittle material substrate scribing after forming the scribe line above the mother bonded substrate is transported to the first dividing means; the first means is divided by the first transfer robot 6 attached to the mother bonded substrate as claimed dividing into strips of any of claims 1-6 a first dividing means; and the second transfer robot 7 will be split rectangular mother bonded substrate is transported to the second dividing means; the second means is divided by the first transfer robot 7 to a rectangular shape bonded 板分割成规定形状的贴合基板的权利要求1-6所述的任一项的第2分割装置。 A second dividing device according to any one of claims 1-6 bonded to the substrate plate is divided into a predetermined shape requirements.
17.一种母贴合基板的分割系统,该母贴合基板为将第1母脆性材料基板和第2母脆性材料基板相向贴合在一起构成的,其特征在于:具有第8搬运机器人、第1两面划线装置、第9搬运机器人、第1分割装置、第10搬运机器人、第2两面划线装置、第11搬运机器人、第2分割装置,该第8搬运机器人将上述母贴合基板搬运至对其两面进行划线的两面划线装置处;该第1两面划线装置在由上述第8搬运机器人搬运来的母贴合基板的两面上划线;该第9搬运机器人将由第1两面划线装置在两面上形成划线后的母贴合基板搬运到第1分割装置;该第1分割装置为将由第9搬运机器人搬运来的母贴合基板分割成长方形状的权利要求1-6所述的任一项的第1分割装置;该第10搬运机器人将上述长方形状的贴合基板搬运到第2两面划线装置;该第2两面划线装置在将由第10搬运机器人搬运来的 17. A segmentation system bonded mother substrate, the mother bonded substrate to the first mother substrate and the second brittle material brittle material substrate mother bonded together to form the facing, characterized by: a first handling robot 8, the first scribing means on both sides, the first transfer robot 9, the first dividing means, the first transfer robot 10, both surfaces of the second scribing means, the first transfer robot 11, the second dividing means, the first transfer robot 8 above mother bonded substrate conveyed to both sides of the scribing apparatus for scribing both surfaces thereof; scribe line on both sides of the first conveying means in the base 8 by the second transfer robot bonded to both sides of the scribe line on a substrate; the second by the first transfer robot 9 is formed on both sides of the scribing means scribe line on both sides of the mother bonded substrate is transported to the first dividing means; the first means is divided by the first transfer robot 9 to the mother bonded substrate is divided into strips as claimed in claim 1- first dividing means according to any one of claim 6; the second transfer robot 10 above the rectangular substrate transport bonded to both surfaces of the second scribing means; scribe line on both sides of the second device by the first transfer robot 10 to of 方形状贴合基板的两面上划线;该第11搬运机器人将由上述第2两面划线装置形成划线的长方形状的贴合基板搬运到第2分割装置;该第2分割装置为将由第11搬运机器人搬运来的长方形状的贴合基板分割成一定形状的贴合基板的权利要求1-6所述的任一项的第2分割装置。 Rectangular shape bonded on both surfaces of a substrate scribing; by the second transfer robot 11 are formed on both sides of the second rectangular scribing means scribe the bonded substrate is transported to the second dividing means; the second means is divided by the first 11 a second dividing device according to any one of claims 1-6 bonded to the substrate transfer robot to the divided rectangular-shaped substrates bonded into a certain shape requirements.
18.根据权利要求17所述的母贴合基板的分割系统,其特征在于:上述第1两面划线装置及第2两面划线装置为在母贴合基板的两面上照射激光束光点,然后追随该照射部分进行点冷却,利用基板的热应变进行划线的划线装置。 18. The system as claimed in claim female fit dividing the bonded substrate 17, wherein: both surfaces of the above-described first scribing means and the second scribing means is a laser irradiation both surfaces of the mother bonded substrate on both sides of the beam spot, then follows the irradiation point of the cooling part by thermal strain of the substrate scribing means scribe.
CN 02802516 2001-06-28 2002-06-27 Device and method for breaking fragile material substrate and system with the device for dividing substrate CN1259264C (en)

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