JP4847513B2 - Breaking method for brittle material substrate - Google Patents

Description

  The present invention relates to a method for breaking a brittle material substrate used for dividing a brittle material substrate such as glass, a semiconductor wafer, and ceramics.

  FIG. 1 shows a state in which a glass plate 1 is scribed using a glass cutter wheel 2. By this scribing, a scribe line S is formed on the surface of the glass plate 1. In the figure, an enlarged cross section in a circle region is shown in the following figure. B shows the depth of the vertical crack formed by this scribing.

  FIG. 2 shows an outline of a conventional break device generally used. In this breaking apparatus, a glass plate 1 having a scribe line S formed on the back surface is set on a table 3 with a mat M interposed therebetween. A break bar 4 is located above the glass plate 1. The break bar 4 is formed by joining a hard rubber 4b having a V-shaped cross section to a lower surface of a rod-like metal material 4a, and is held in parallel to the glass plate 1 by a drive mechanism (not shown) and moves up and down. It is made free. Then, the lower end portion of the hard rubber 4 b of the break bar 4 is pressed from above the glass plate 1 so as to match the scribe line S through the glass plate 1. In this way, the glass plate 1 is slightly bent on the mat M, so that the vertical crack reaches the surface of the glass plate, and the glass plate 1 is divided along the scribe line S.

FIG. 3 shows another break method disclosed in Patent Document 1. The divided tables 3a and 3b are installed with a gap therebetween. The glass plate 1 is sucked and fixed across the tables 3a and 3b so that the scribe line S formed on the upper surface is positioned in the gap portion. And the glass plate 1 is bent and divided | segmented by slightly rotating one table 3a to the arrow direction along the rotation center axis | shaft O parallel to a downward gap. The glass plate 1 can also be divided by rotating both the tables 3a and 3b simultaneously. Further, by rotating one table 3a and separating it from the table 3b at the same time, it can be divided so that the cut surface is not damaged.
JP-A-4-280828

  However, as shown in the lower diagram of FIG. 1 described above, the depth of the scribe line is not uniform, and there are deep portions such as Da and Db. The scribe locations corresponding to Da and Db are indicated by Sa and Sb. When the glass plate 1 is divided by the above method, even if a uniform dividing force is applied to the glass plate 1, the division of the glass plate 1 does not proceed uniformly, but is indicated by Sa and Sb. At this point, the division of the glass plate is completed first. That is, a vertical crack reaches the lower surface of the glass plate 1 at this position, and thereafter, the division of the glass plate 1 proceeds in the scribe direction starting from the points Sa and Sb.

  Therefore, in the conventional dividing method, since the glass plate 1 is divided starting from a plurality of points on the scribe line, the dividing section may be a folding screen or curved, resulting in a reduction in commercial value. There was a drawback of doing.

  Laser scribing using a laser beam has also been studied because dust generation during scribing can be prevented. In laser scribing, a glass plate is moved while being irradiated with a laser beam, and spot cooling with a coolant is performed following this movement. Thus, a thin scribe line is formed on the glass plate by utilizing the thermal strain of the glass plate. Since this scribe line is thin and invisible, this scribe method is also called blind scribe. However, when a glass plate that has been blind scribed is divided by a conventional break device, a large breaking force is required because the depth of the crack generated as a result of the blind scribe is shallow. For this reason, there is a problem that the apparatus becomes large or cannot be completely divided.

  The present invention has been made in view of such conventional problems, and is a brittle material that can reduce the breaking force applied to the substrate of various shapes of the brittle material substrate and obtain a uniform sectional surface. It aims at realizing the breaking method of a board | substrate.

The method for breaking a brittle material substrate according to the present invention is a method for breaking a brittle material substrate by dividing a mother bonded substrate obtained by bonding two brittle material substrates and obtaining a plurality of smaller bonded substrates. A step (1) of forming a scribe line S1 using a first scribe device at a predetermined position on one substrate surface of the mother bonded substrate, and the other substrate surface of the mother bonded substrate, The step (2) of forming the scribe line S2 using the second scribe device in the same direction as the scribe line S1, and the mother bonding substrate on which the scribe lines S1, S2 are formed on both sides are referred to as the scribe lines S1, S2. Is fixed to the two tables of the breaking device, and one of the two tables is rotated about the first rotation axis, and the two tables are rotated. Rotating the other of the first and second rotation shafts on the opposite side of the first rotation shaft across the mother bonding substrate in the thickness direction of the mother bonding substrate. The step (3) of applying tensile stress or shear stress to the scribe lines S1, S2 and dividing the mother bonded substrate into a plurality of sheets , wherein the first and second rotating shafts are It has an opening angle of −α and + α with respect to the scribe lines S1 and S2 when viewed from the surface of the mother bonded substrate .

  Here, you may provide the inversion apparatus which inverts the scribe surface of the said mother bonding board | substrate between the said process (1) and the said process (2).

The method for breaking a brittle material substrate according to the present invention divides a mother bonded substrate obtained by bonding a first brittle material substrate in which a scribe line is not formed and a second brittle material substrate in which a scribe line S2 is formed in advance. A brittle material substrate breaking method for obtaining a plurality of bonded substrates having a smaller shape than the above, which is a surface of the first brittle material substrate and is scribed using a scribe device in the same direction as the scribe line S2. The step (1) of forming the line S1, and the mother bonded substrate having the scribe lines S1 and S2 formed on both sides thereof are fixed to the two tables of the breaking device with the scribe lines S1 and S2 as a boundary. One of the tables is rotated about the first rotation axis, and the other of the two tables is rotated on the mother bonding substrate. In this case, tensile stress or shear stress is applied to the scribe lines S1 and S2 by rotating around the second rotating shaft located on the opposite side of the first rotating shaft across the mother bonding substrate. Applying and dividing the mother bonding substrate into a plurality of sheets (2), and the first and second rotating shafts are scribe lines S1 and S2 as viewed from the surface of the mother bonding substrate. In contrast, it has an opening angle of -α and + α , respectively.

In the method for breaking a brittle material substrate according to the present invention, a mother bonded substrate in which a first brittle material substrate and a second brittle material substrate in which a scribe line is not formed is divided, and a smaller size is bonded thereto. A method of breaking a brittle material substrate for obtaining a plurality of substrates, the step of simultaneously forming scribe lines S1 and S2 on the surfaces of the first and second brittle material substrates using a double-sided scribing device (1) And the mother bonded substrate having the scribe lines S1 and S2 formed on both sides thereof is fixed to the two tables of the breaking device with the scribe lines S1 and S2 as a boundary, and one of the two tables is fixed to the first table. While rotating around the rotation axis, the other of the two tables is moved in the thickness direction of the mother bonding substrate with the mother bonding substrate sandwiched between the first rotation. A step of applying tensile stress or shear stress to the scribe lines S1 and S2 by turning about a second turning shaft located on the opposite side of the shaft, and dividing the mother bonding substrate into a plurality of pieces. (2), and the first and second rotating shafts have an opening angle of −α and + α with respect to the scribe lines S1 and S2, respectively, when viewed from the surface of the mother bonded substrate. It is a feature.

  Here, the double-sided scribing device of the step (1) uses the wheel cutter made of cemented carbide or diamond on the surface of the first and second brittle material substrates to fix the mother bonded substrate. You may scribe.

  Here, the double-sided scribing device in the step (1) fixes the mother bonded substrate, and performs heating with a laser beam and local cooling with a coolant on the surfaces of the first and second brittle material substrates. You may do a blind scribe.

  As described above, according to the break method of the brittle material substrate of the present application, since the dividing force is applied to one end of the scribe line when the substrate is divided, the substrate is divided at one end side. It progresses in order from the other side to the other end side, and the end face where the substrate is divided can be cleaned. Further, the breaking force to be applied is much smaller than that of the conventional break method, and the break device body can be downsized.

  Moreover, according to the breaking method of the brittle material substrate of the present application, in the step of dividing one liquid crystal mother glass substrate into a plurality of liquid crystal glass substrates, the liquid crystal mother glass substrate is formed in one step without inverting the substrate. Both sides can be divided. For this reason, the inversion process for board | substrate parting is reduced.

(Embodiment 1)
The breaking method in Embodiment 1 of this invention is demonstrated referring drawings. FIG. 4 is an external perspective view showing the overall configuration of the breaking device 10 used in the breaking method in the first embodiment. This breaking device 10 is referred to as a one-side tilting breaker. The substrate G to be divided is a brittle material substrate such as a glass plate.

Here, for convenience of explanation, spatial coordinates (x, y, z) are used, a table reference plane parallel to the installation floor surface of the break device 10 is (x, y, z ₀ ), and a direction perpendicular to the installation floor surface Is the z axis, and the dividing direction (break direction) of the substrate G is the y axis. The break device 10 includes a slide table 11 that can slide in the −x-axis direction, and a tilt table 12 that can tilt around a rotation axis parallel to the y-axis and can be adjusted to slide in the x-axis direction.

  FIG. 5 is a perspective view showing a state in which the left unit 10A and the right unit 10B of the breaking device 10 are separated. Assuming that the entire breaking device 10 is attached to the base 17 of FIG. 4, the left unit 10A has a mechanism unit installed on the left side (−x axis direction) of the scribe line S on the substrate G as shown in FIG. The right unit 10 </ b> B indicates a mechanism unit installed on the right side (+ x axis direction) from the scribe line S of the substrate G.

  Further, in order to place and hold the substrate G to be cut, the first product table 13 is fixed to the slide table 11, and the second product table 14 is fixed to the tilting table 12. A first product clamp unit 15 is attached to the upper part of the first product table 13, and a second product clamp unit 16 is attached to the upper part of the second product table 14. The scribe line S of the substrate G is parallel to the y axis, the region on the −x axis side (left side) of the substrate around the scribe line S is called the substrate left portion GL, and the region on the + x axis side (right side) is the right side of the substrate Called GR. The first product clamp unit 15 firmly presses the right end portion of the substrate left portion GL to fix the substrate, and the second product clamp unit 16 firmly presses the left end portion of the substrate right portion GR to fix the substrate. To do.

  The left unit 10A is provided with a slide mechanism 11a. The slide mechanism 11a biases the slide table 11 in the -x-axis direction, and is provided with an elastic member that applies a biasing force, such as an air cylinder or a spring. In addition, the slide mechanism 11a is provided with a stopper for regulating the slide range, a damper for regulating the slide speed, and the like (not shown).

  The right unit 10 </ b> B is held by a pair of horizontal holding block upper parts 18 and a pair of horizontal holding block lower parts 19 which are pillars. The horizontal holding block lower part 19 is fixed to the base 17, and the horizontal holding block upper part 18 holds the tilting table 12 so as to be rotatable. A slide unit (not shown) is provided between the horizontal holding block upper part 18 and the horizontal holding block lower part 19 so that the horizontal holding block upper part 18 can be slid and adjusted in the x-axis direction. The horizontal holding block upper portion 18 on the + y axis side and the −y axis side is provided with a tilt shaft 18a, and the tilt table 12, the second product table 14, and the second product clamp unit 16 rotate the tilt shaft 18a. It is held so as to be able to tilt as a dynamic axis. For example, the tilting shaft 18a is provided with a bearing housing in the horizontal block upper portion 18 and is held by a ball bearing press-fitted into the housing. Here, the horizontal holding block upper portion 18 and the tilt shaft 18a are referred to as a tilt mechanism.

  The first product clamp unit 15 fixes the substrate left portion GL and concentrates shear stress and bending stress on the scribe line of the substrate. The first product clamp unit 15 is provided with a first clamp bar 15 a that presses the vicinity of the scribe line S of the substrate G. The tip end of the first clamp bar 15a is located at the right edge of the first product table 13 and can be finely moved in the z-axis direction. Similarly, the second product clamping unit 16 fixes the substrate right part GR and concentrates shear stress and bending stress on the scribe line of the substrate. The second product clamp unit 16 is provided with a second clamp bar 16 a that presses the vicinity of the scribe line S of the substrate G. The tip of the second clamp bar 16a is located at the left edge of the second product table 14, and can be finely moved in the z-axis direction.

  FIG. 6 is a plan view showing the positional relationship with the first and second product tables 13 and 14. The main shaft of the first product clamp unit 15 including the first clamp bar 15a is attached so as to be inclined so that the + y-axis side is opened by an angle −α. The main axis of the second product clamp unit 16 including the second clamp bar 16a is also inclined and attached so that the + y-axis side is opened by the angle + α. For this reason, a gap is formed between the product tables 13 and 14.

  As shown in FIG. 6, the first product table 13 can be rotationally adjusted on the slide table 11 within a (x, y) plane by a small angle in the CCW direction around the rotational axis 13a. The second product table 14 can also be rotationally adjusted on the tilting table 12 within the (x, y) plane by a minute angle in the CW direction around the rotational axis 14a. At the four corners of the first product table 13, screw holes 13b to 13e having a long diameter in the tangential direction when viewed from the rotation shaft 13a are provided. Similarly, screw holes 14b to 14e having a long diameter in the tangential direction when viewed from the rotation shaft 14a are provided at the four corners of the second product table 14. Accordingly, the first product table 13 is rotated by an angle −α around the rotation shaft 13a, and the bolts of the screw holes 13b to 13e are tightened to the slide table 11 at the position. In this way, the first product table 13 can be fixed together with the first clamp bar 15a from the position indicated by the two-dot chain line in FIG. 6 to the position indicated by the solid line. The same applies to the second product table 14. By such an angle adjustment, the opening angle of the first clamp bar 15a and the second clamp bar 16a can be set to 2α.

  As a method for holding the substrate G, it can be fixed to the product table by vacuum suction or other means. When the substrate is made of glass and a resin film is formed on the surface thereof, it can be fixed also by electrostatic adsorption.

  A tilt mechanism of the tilt table 12 will be described. As shown in FIGS. 4 and 5, the tilting shaft 18 a of the horizontal holding block upper part 18 makes the entire right side unit 10 </ b> B except for the horizontal holding block lower part 19 rotatable in the CW direction or CCW direction using this as the rotation axis. FIG. 7 is a cross-sectional view of the main part of the breaking device showing the attachment position of the tilt shaft 18a. A rotation control unit 20 is provided to rotate the tilt table 12 via the tilt mechanism. The rotation control unit 20 may rotate the tilting table 12 by a predetermined angle using the rotational force of a motor or a fluid cylinder, and manually rotates the tilting table 12 via an arm or a link. There may be. The tilting table 12 is moved in the + x direction at the same time as the rotation starts.

  It is assumed that the first product table 13 and the second product table 14 are positioned so as to have the same placement surface with respect to one substrate G in the initial setting of the breaking device. The height of the tilting shaft 18a is adjusted so that the tilting shaft 18a comes to the center when viewed from the upper and lower surfaces of the substrate G placed on the table.

The thickness of the substrate G and 2d _0. The mounting surface of the first product table 13 is (x, y, −d ₀ ), and the position of the tilt shaft 18a is (0, y, 0). The position of the tilt shaft 18a can be adjusted according to the thickness and material of the substrate G. If the gap between the right edge of the first product table 13 and the left edge of the second product table 14 is 2 g, the pressing position of the first clamp bar 15a against the substrate G and the second clamp bar 16a The gap between the pressing position with respect to the substrate G is set to the extent shown in FIG. 7, and the interval between the pressing positions of the closest portions is preferably about the same as 2 g. The tilting axis 18a is preferably parallel to the scribe line of the substrate G and positioned within the thickness range of the substrate.

Next, the operation of the break device having such a mechanism will be described. The substrate G is a laminated glass substrate used for a liquid crystal panel. As shown in FIG. 8A, an upper substrate G1 (thickness 0.7 mm) and a lower substrate G2 (thickness 0.7 mm) on which various electrodes are formed. It is assumed that the liquid crystal cell is sealed in the gap (0.1 mm). In this case, the thickness 2d ₀ of the substrate is 1.50 mm. As shown in FIG. 8A, scribe lines S1 and S2 are formed in advance on the upper surface of the upper substrate G1 and the lower surface of the lower substrate G2, respectively, at the same position when viewed from the (x, y) plane. The method of forming the scribe lines S1 and S2 is the same as that of the conventional example, and a portion having a high shear stress or tensile stress is a break point of the glass substrate.

  FIG. 9 is a partially enlarged cross-sectional view of the breaking device with the scribe line S as the center. FIG. 10 is a plan view of an essential part of the breaking device centered on the scribe line S indicated by a two-dot chain line. Here, the position after the division of the substrate G is shown using a solid line. The position (x, y, z) of the tilt axis 18a is assumed to be (0, y, 0). As shown in FIG. 10, in the divided substrate left part GL, the end point on the + y-axis side of the scribe line S2 in FIG. 8 is PL, and the end point on the −y-axis side is QL. Further, the end point on the + y axis side of the line in which the substrate left portion GL is in contact with the right edge of the first product table 13 is PL ′, and the end point on the −y axis side is QL ′. In the divided substrate right part GR, the end point on the + y axis side of the scribe line S2 is set as PR, and the end point on the −y axis side is set as QR. The end point on the + y-axis side of the line where the substrate right portion GR is in contact with the left edge of the second product table 14 is PR ′, and the end point on the −y-axis side is QR ′. Before the substrate G is divided and cut, PR coincides with PL and QR coincides with QL.

When the second product table 14 is tilted in the CCW direction by an angle θ as shown in FIG. 9A, the position of the point PR ′ is changed from (x ₁ , y ₁ , z ₁ ) to (x ₂ , y ₂ , Move to z ₂ ). Here, each coordinate value is as follows.
x ₁ = g ₂
y ₁ = y ₁
z ₁ = −d ₀
x ₂ = d ₀ sin θ + g ₂ cos θ
y ₂ = y ₁
z ₂ = d ₀ (1−cos θ) + g ₂ sin θ−d ₀

If the portion of the point PR ′ (x ₂ , y ₂ , z ₂ ) of the substrate right part GR becomes a fixed point with respect to the second product table 14 due to the pressing force of the second clamp bar 16a, A shearing force and a tensile force are applied to the break portion located at the point PR from the fixed point PR ′.

  Such a shearing force and a tensile force are similarly applied to the point QR in FIG. 9B. However, the position of the scribe line S2 viewed from the point PR ′ and the position of the scribe line S2 viewed from the point QR ′ are different as shown in FIG. 9 and FIG. 10, and the −y axis is closer to the + y axis. Compared to the other side (opposite side), the shear stress and the tensile stress are increased. Even if the Young's modulus of the glass material is the same in both portions, the tip end portion of the one end support of the substrate right portion GR with respect to the substrate left portion GL that does not rotate and move is shown in FIG. ) Is shorter. For this reason, the shear stress is less likely to be relaxed at the tip of the one-end support shown in FIG. 9B than in the case of FIG. Therefore, the points QR and QL become break points, and the lower substrate G2 is divided. Next, when the second product table 14 is tilted in the CW direction, as in the case of tilting in the CCW direction, shear stress and tensile stress are applied to the scribe line S1 of the upper substrate G1, and the upper substrate G1 is divided. When the substrate G is divided, an urging force in the −x-axis direction is applied to the substrate left portion GL by the slide mechanism 11a, and at the same time the tilting table 12 starts to rotate, the slide table 11a moves in the + x direction. The right edge portion, which is a divided section, retreats in the −x-axis direction and does not contact the left edge portion of the substrate right portion GR. For this reason, the dividing surface of a glass substrate is not damaged, and a smooth dividing surface is obtained.

After dividing the substrate G, the position of the point PR moves from (x ₃ , y ₃ , z ₃ ) to (x ₄ , y ₄ , z ₄ ). Here, each coordinate value is as follows.
x ₃ = 0
y ₃ = y ₃
z ₃ = −d ₀
x ₄ = d ₀ sin θ
y ₄ = y ₃
z ₄ = d ₀ (1-cos θ) −d ₀
When the horizontal movement amount x ₄ −x ₃ in this case is calculated, it becomes 0.039 mm when θ = 3 °.

  FIG. 8B shows the substrate deformation profile when the substrate right portion GR rotates in the CCW direction, and FIG. 8C shows the substrate deformation profile when the substrate right portion GR rotates in the CW direction. Show.

  The substrates divided into the left and right by the scribe line S can be removed from the product table by releasing the first clamp bar 15a and the second clamp bar 16a from the substrate G. In the case where a single substrate having a strip shape in the x-axis direction is divided into a large number, a scribe line is provided at a predetermined position of the substrate G. Then, the substrate G is conveyed by a predetermined pitch in the x direction, the product clamp unit is set, and the tilting table 12 is tilted each time. By repeating such an operation, a plurality of substrates can be manufactured from one mother substrate.

  Next, the breaking device 30 used for the breaking method in the present embodiment will be described with reference to the drawings. FIG. 11 is an external perspective view showing the overall configuration of the breaking device 30. This breaking device 30 is called a double tilting breaker. Also here, for convenience of explanation, a table reference plane parallel to the installation floor surface of the breaking device 30 is (x, y), a direction perpendicular to the installation floor surface is az axis, and a break direction of the substrate is a y axis. The break device 30 has a first and second tilting tables 31 and 32 having a rotation axis parallel to the y-axis and capable of tilting.

  FIG. 12 is a perspective view showing a state in which the left unit 30A and the right unit 30B of the breaking device 30 are separated. The entire breaking device 30 is attached to a base 37 shown in FIG. 11 via holding blocks 38 and 39. The first product table 33 is fixed to the first tilting table 31, and the second product table 34 is fixed to the second tilting table 32. Similarly to the break device 10, the first product clamp unit 35 is attached to the upper part of the first product table 33, and the second product clamp unit 36 is attached to the upper part of the second product table 34. Since the function of these clamp units is the same as that of the break apparatus 10, description of a mechanism is abbreviate | omitted.

  The 1st tilting table 31, the 1st product table 33, and the 1st product clamp unit 35 are hold | maintained at the 1st holding block 38 which is a support | pillar. The second tilting table 32, the second product table 34, and the second product clamping unit 36 are held by a second holding block 39 that is a support column. As shown in FIG. 11, the column interval of the second holding block 39 is wider than the column interval of the first holding block 38, and the left unit 30 </ b> A and the right unit 30 </ b> B are placed on the base 37 at the normal position (operation position). When installed, all struts are generally aligned on the y-axis.

Assuming that the tilting axis of the first holding block 38 is 38a and the tilting axis 39a of the second holding block 39, as shown in FIG. 13, the tilting axis 38a and the tilting axis 39a are positioned at the reference position (x ₀ , y, z ₀ ) and substantially symmetrical in the z-axis direction as viewed from the scribe lines S1 and S2. The reference position (x ₀ , y, z ₀ ) is the intermediate position (0, y, 0) between the scribe lines S 1 and S 2 of the substrate G as in the break device 10. When the center position of the thickness of the substrate G is set to z = 0, the position d ₁ on the z axis of the tilt axis 38a is preferably 0 mm ≦ d ₁ ≦ 20 mm, and the position −d ₂ of the tilt axis 39a is It is desirable that −20 mm ≦ −d ₂ ≦ 0 mm.

  The attachment positions of the first clamp bar 35a and the second clamp bar 36a are the same as those of the break device 10. The first holding arm 38b is rotatable about the first tilting shaft 38a, and holds the first tilting table 31 at an arbitrary angle. Here, the first holding arm 38b and the first tilting shaft 38a are referred to as a first tilting mechanism. Similarly, the second holding arm 39b is rotatable about the second tilting shaft 39a, and holds the second tilting table 32 at an arbitrary angle. The second holding arm 39b and the second tilt shaft 39a are referred to as a second tilt mechanism.

  The rotation control unit 40 may rotate the first tilt table 31 and the second tilt table 32 by a predetermined angle using the rotational force of a motor or a fluid cylinder, and may be manually operated via an arm or a link. Alternatively, the tilting table 12 may be rotated. The first holding arm 38b and the second holding arm 39b are moved by the initial setting of the rotation control unit 40 so that the first tilting table 31 and the second tilting table 32 are (x, y) before the substrate G is cut. Hold parallel to the surface, that is, horizontally.

  Again, the main axis of the first product clamp unit 35 including the first clamp bar 35a is inclined and attached so that the + y-axis side is opened by the angle −α, and the second product clamp unit including the second clamp bar 36a. The main shaft 36 is also attached with an inclination so that the + y-axis side opens by an angle + α.

Let us consider a case where the thickness of the substrate G is 2d0 and a laminated glass substrate used in a liquid crystal panel is cut here as an example. If the mounting surface of the first product table 33 is (x, y, −d ₀ ), the position of the tilting shaft 38a is (0, y, + d ₁ ) as shown in FIG. This position can also be adjusted according to the thickness and material of the substrate. Position of the tilting axis 39a becomes _{(0, y, -d 2)} . This position can also be adjusted. The tilt axes 38a and 39a are preferably symmetric from the center position of the substrate, that is, d ₁ = d ₂ .

  If the gap between the right edge of the first product table 33 and the left edge of the second product table 34 is 2 g, the pressing position of the first clamp bar 35a against the substrate G and the second clamp bar 36a The pressing position with respect to the substrate G is preferably close to each edge as shown in FIG. 13, and the distance between the pressing positions of the closest portions is preferably about 2 g.

The operation of the break device 30 having such a mechanism will be described. FIG. 14 is a partially enlarged cross-sectional view of the breaking device with the scribe line S as the center. FIG. 10 is used as a plan view of the main part of the breaking device with the scribe line S as the center. As described above, the position of the first tilt axis 38a is (0, y, + d ₁ ), and the position of the second tilt axis 39a is (0, y, −d ₂ ).

FIG. 14A is a cross-sectional view near the PR point and the PL point in FIG. Here, the edge interval between the first product table 33 and the second product table 34 is 2 g ₂ . FIG. 14B is a cross-sectional view around the QR point and the QL point in FIG. Here, the edge interval between the first product table 33 and the second product table 34 is 2 g ₁ (g ₁ <g ₂ ). As shown in FIG. 14, first, the second product table 34 is tilted in the CW direction by an angle θ, and then the first product table 33 is tilted in the CW direction by an angle θ. Similarly to the break device 10, the pressing point of the substrate right portion GR against the second product table 34 is PR ′. This point PR ′ can be considered as a force point for applying a shear stress when the substrate G is divided along the scribe line S.

First, consider a case where the second product table 34 is rotated by an angle θ in the CW direction. The position of PR ′ moves from (x ₅ , y ₅ , z ₅ ) to (x ₆ , y ₆ , z ₆ ). Here, each coordinate value is as follows.
x ₅ = g ₂
y ₅ = y ₅
z ₅ = −d ₀
x ₆ = (d ₂ −d ₀ ) sin θ + g ₂ cos θ
y ₆ = y ₅
z ₆ = − (d ₂ −d ₀ ) (1−cos θ) −g ₂ sin θ−d ₀
As described above, the (x ₆ , y ₆ , z ₆ ) portion of the substrate right portion GR becomes a fixed point with respect to the second product table 34, and the fixed portion is fixed with respect to the break portion located at the point PR of the substrate right portion GR. Shear force and tensile force work from the point.

  Such shearing force and tensile force also act on the point QR shown in FIG. However, the distance from the point PR ′ to the scribe line S2 and the distance from the point QR ′ to the scribe line S2 are different as shown in FIG. Stress increases. Even if the Young's modulus of the glass material is the same in both portions, the shear stress, the tensile stress, and the bending stress at the tip end portion of the one end support of the substrate right portion GR with respect to the substrate left portion GL are smaller than the QR value. This is because the stress is relieved by elastic deformation because the tip length of the one-end support is long as shown in FIG. For this reason, the point QR with high stress becomes a break point, and the upper substrate G1 is divided.

  Next, when the first product table 33 is tilted in the CW direction by an angle θ, shear stress and tensile stress are applied to the scribe line S2, and the lower substrate G2 is divided. In this case, the same thing as described above occurs at the PL point and the QL point of the substrate left portion GL. By rotating both product tables in this way, tensile stress acts in the + x axis direction and −x axis direction around the scribe line S, and shear stress acts in the + z axis direction and the −z axis direction. The substrate G can be easily divided. At the time of division, the substrate left portion GL and the substrate right portion GR are separated from each other. Also in this case, the right edge portion, which is a divided section, does not contact the left edge portion of the substrate right portion GR. For this reason, the dividing surface of a glass substrate is not damaged, and a smooth dividing surface is obtained.

When the amount of horizontal movement of the point PR is calculated, it becomes (d ₀ + d ₂ ) sin θ, and when d ₂ = 5.0 mm, d ₀ = 0.75 mm, and θ = 3 °, it becomes 0.300 mm. A value much larger than the moving amount of 0.039 mm is obtained. When the amount of movement of the point PR in the vertical direction is calculated, it becomes (d ₀ + d ₂ ) (1−cos θ), and when the above numerical value is substituted, the amount of vertical movement is 0.0079 mm. This value contributes to the shearing force in the scribe line S.

  The board | substrate divided | segmented right and left by the scribe line S can be removed from a product table by canceling | releasing the press of the 1st clamp bar 35a and the 2nd clamp bar 36a. Although the first tilt table 31 and the second tilt table 32 are alternately tilted by the same angle θ, the tilt angle may be different for each tilt table, and which tilt table is tilted first. Does not affect the dividing characteristics of the substrate G.

  As described above, in any of the break devices, the front end face side of the substrate G becomes the starting point of the division, and the division progresses in order from the front to the back. In this break apparatus, since the starting point of dividing the substrate is one point, the magnitude of the force applied to the substrate can be significantly reduced as compared with the conventional break method. Moreover, the cut end face is finished finely, and the defect of the cut end face as described in the prior art does not occur. Moreover, it can cut | disconnect similarly about the board | substrate scribed with the laser scribing apparatus. In the break device in the present embodiment, the mounting position and height of each holding block can be easily changed, and the rotation amount and the opening angle 2α of the product table can be arbitrarily set, so that the degree of freedom in design is increased. In the above description, the case where the scribe lines S1 and S2 formed on the laminated glass substrate used in the liquid crystal panel are at the same position when viewed from the (x, y) plane has been described. The positions of S1 and S2 Can be divided without any inconvenience using this break device even if they are several millimeters apart due to the formation of terminals of the liquid crystal panel.

  The break device in this embodiment can cut not only laminated glass but also a brittle material substrate such as a semiconductor wafer and a ceramic substrate as well as a single glass plate. In particular, in the case of a laminated glass substrate such as a liquid crystal panel, the upper and lower glass plates can be alternately divided by an alternating break operation, and the process of reversing the substrate is not required, so that the work efficiency can be greatly improved. it can. The break device of the present invention can also be applied to the division of a brittle material substrate in which a brittle material substrate is heated using a heating means such as a laser and a scribe line is formed using thermal strain generated in the brittle material substrate.

  Next, a break method in the present embodiment will be described. The breaking method of the brittle material substrate in the present embodiment is a manufacturing method for obtaining a plurality of liquid crystal glass substrates 121 by dividing one liquid crystal mother glass substrate 120 into a predetermined shape as the substrate G described above. In order to obtain a liquid crystal panel that displays an image or a character in pixel units by a drive signal from one liquid crystal mother glass substrate 120, various manufacturing processes are required.

  A substrate including a TFT, a scanning electrode, a signal electrode, and a pixel electrode is referred to as a TFT substrate (also referred to as an AM substrate), and a substrate including a color filter is referred to as a counter substrate. These are the ones in which these two substrates are filled with liquid crystal. The liquid crystal mother glass substrate 120 is a substrate (mother bonded substrate) at a stage where a TFT substrate before division (referred to as a mother TFT substrate) and a counter substrate before division (referred to as a mother counter substrate) are bonded together. Say. Accordingly, the divided bonded substrate becomes a liquid crystal glass substrate 121 (bonded substrate). Then, the liquid crystal glass substrate 121 is filled with liquid crystal, the liquid crystal injection port is sealed, and a state in which a flat cable can be connected to the electrode on the substrate edge is a liquid crystal panel.

  Further explanation will be added in order to clarify the position of the breaking method in the present embodiment in the manufacturing process of the liquid crystal panel. In order to obtain a plurality of liquid crystal glass substrates 121 from a single liquid crystal mother glass substrate 120, a plurality of types of dividing steps are required. This is distinguished by the part of the liquid crystal panel where the scribe line or dividing plane of the substrate is located. For example, (A) a step of dividing the liquid crystal mother glass substrate 120, which is a multi-sided large-sized bonded substrate, into individual liquid crystal glass substrates 121 having a predetermined shape, and (B) a division for exposing the liquid crystal injection port while being multi-sided. Examples are a process, (C) a dividing step for taking out an electrode portion, and the like. Here, the order of the steps does not need to be determined in advance, but at least the steps (A) and (B) are incorporated in this embodiment. Also in the step (A), as long as the scribe line S is formed in a lattice shape (also referred to as a cross scribe) on the liquid crystal mother glass substrate 120, a plurality of dividing steps are required.

  FIG. 15 shows a breaking method of the liquid crystal mother glass substrate 120 including such a dividing step. This breaking method includes (1) a cassette loader, (2) a first substrate transfer device, (3) a first scribe device, (4) a second scribe device, (5) a second substrate transfer device, 6) A first break device, (7) a second break device, and a plurality of liquid crystal glass substrates 121 are manufactured via these devices. For this reason, such a dividing process is called a liquid crystal mother glass substrate automatic dividing line.

  In FIG. 15, a cassette loader 122 stores and holds a large number of liquid crystal mother glass substrates 120 in a cassette. The material supply robot R 1 takes out the liquid crystal mother glass substrate 120 from the cassette of the cassette loader 122 and transfers it to the first substrate transfer device 123. The first substrate transfer device 123 positions the liquid crystal mother glass substrate 120 supplied from the material supply robot R1 at a fixed position on the table. This positioning is performed by pressing end surfaces of the liquid crystal mother glass substrate 120 that are orthogonal to each other to positioning pins.

  The transport robot R <b> 2 transports the liquid crystal mother glass substrate 120 placed on the table to a predetermined position of the first scribe device 124. Of the liquid crystal mother glass substrate 120, the mother TFT substrate is 120a, and the mother counter substrate is 120b. The processed surface of the substrate is parallel to the (x, y) plane as in the break devices 10 and 30. The first scribing device 124 forms the scribe line S1 so as to be parallel to the x-axis direction or the y-axis direction of the mother counter substrate 120b, for example, and here, the scribing method as described in the conventional example is used.

  The transfer robot R3 takes out the liquid crystal mother glass substrate 120 on which the scribe line S1 is formed from the first scribing device 124, and gives the transfer robot R4 with the upper surface and the lower surface reversed. The transport robot R4 transports the inverted liquid crystal mother glass substrate 120 to a predetermined position of the second scribe device 125. The second scribe device 125 forms scribe lines S2 so as to be parallel to the x-axis or y-axis direction of the mother TFT substrate 120a. The positions and lengths (drawing data) of these scribe lines S1, S2 are controlled by a control CPU (not shown).

  The liquid crystal mother glass substrate 120 with scribe lines formed on both sides is transferred to the second substrate transfer device 126 by the transfer robot R5. The second substrate transfer device 126 positions the liquid crystal mother glass substrate 120 supplied from the transfer robot R5 at a fixed position. The transfer robot R 6 transfers the liquid crystal mother glass substrate 120 placed on the second substrate transfer device 126 to a fixed position of the first break device 127.

  Since the first break device 127 and the second break device 128 are the same as the break device 10 or 30, the description of the structure is omitted. The first break device 127 presses and fixes the upper surface of the liquid crystal mother glass substrate 120 placed across the first table 127a and the second table 127b, and one table is shown in FIG. Thus, the liquid crystal mother glass substrate 120 is divided into strips by rotating in the + z direction and the −z direction, or by simultaneously rotating both tables in the same direction as shown in FIG.

  The transport robot R7 takes out the liquid crystal mother glass substrate 120 divided into strips from the table 127b and positions and places the second breaker 128 so as to straddle the two tables 128a and 128b. To do. The second breaker 128 divides the liquid crystal mother glass substrate 120. The substrate obtained here becomes a liquid crystal glass substrate 121 having a predetermined shape. These liquid crystal glass substrates 121 are transferred by the third substrate transfer device 129 by the transfer robot R8, and are further brought into the manufacturing process of the next liquid crystal panel.

  The breaking method of the present embodiment having the above steps will be described in comparison with a conventional breaking method. FIG. 16 is a process diagram when the liquid crystal mother glass substrate 120 is cut using a conventional break device. FIG. 17 is a process diagram in the case where the liquid crystal mother glass substrate 120 is divided using the break device in the present embodiment. However, since FIG. 16 shows the case where there is one dividing step, it does not match the number of dividing steps shown in FIG.

  In the conventional break device, according to the method shown in FIG. 2, the scribe line S is formed on one surface of the glass plate 1, the break bar 4 is pressed against the other surface of the glass plate 1, and the glass plate 1 is bent. By doing so, the glass plate 1 was divided. Further, according to the method shown in FIG. 3, the glass plate 1 is bent by bending the glass plate 1 so that tensile stress acts on the portion where the scribe line S is formed. If such a break device is used, the process shown by (b)-(g) of FIG. 16 is needed in the division | segmentation of a bonded glass substrate.

  That is, the mother TFT substrate 120a of the liquid crystal mother glass substrate 120 shown in FIG. 16A is turned up, and a scribe line S1 is inserted into the mother TFT substrate 120a as shown in FIG. Next, as shown in (c), the liquid crystal mother glass substrate 120 is reversed using a reversing device. Then, as shown in (d), a break bar is pressed against the mother counter substrate 120b, and a vertical crack is developed on the mother TFT substrate 120a to divide the mother TFT substrate 120a. Next, the liquid crystal mother glass substrate 120 is held, and a scribe line S2 is inserted into the mother counter substrate 120b as shown in (e) using a scribe device. Then, the liquid crystal mother glass substrate 120 is inverted again as shown in FIG. Next, as shown in (g), a break bar is pressed against the mother TFT substrate 120a, and a vertical crack is developed on the mother counter substrate 120b. Next, when the liquid crystal mother glass substrate 120 is separated to the left and right, the liquid crystal mother glass substrate 120 can be divided into a plurality of liquid crystal glass substrates 121 as shown in (h). However, this method requires two inversion steps of the substrate.

  However, when the break device 10 or 30 in this embodiment is used, the steps shown in FIGS. 17B to 17F for the liquid crystal mother glass substrate 120 are sufficient. That is, the mother counter substrate 120b of the liquid crystal mother glass substrate 120 shown in FIG. 17A is turned up, and the scribe line S1 is formed on the mother counter substrate 120b as shown in FIG. Put in. Next, as shown in (c), the liquid crystal mother glass substrate 120 is inverted using an inversion device. Then, as shown in (d), the scribe line S2 is inserted into the mother TFT substrate 120a using the second scribe device 125.

  Then, when the liquid crystal mother glass substrate 120 with scribe lines on both sides is set in the first breaking device 127 of FIG. 15 and one of the tables is rotated upward and downward, it is shown in (e) and (f). As described above, in the mother TFT substrate 120a and the mother counter substrate 120b, vertical cracks propagate in the thickness direction of the substrate and penetrate through the respective substrates. Thus, so-called cracks are generated. Then, when the liquid crystal mother glass substrate 120 is separated into right and left, the divided liquid crystal glass substrate 121 as shown in (g) is obtained. According to this method, the substrate inversion process is only required once.

  The above process is a case where the liquid crystal mother glass substrate 120 is cut into strips, for example. As described with reference to FIG. 15, when the scribe lines are formed in a lattice pattern on the liquid crystal mother glass substrate 120 and further divided into the liquid crystal glass substrate 121 having a smaller size, the process difference between FIG. 16 and FIG. In the break method according to the present embodiment, in addition to the smoothness of the sectional surface of the substrate, the effect of omitting the substrate inversion step can be obtained.

(Embodiment 2)
Next, the breaking method in Embodiment 2 of this invention is demonstrated. The breaking method of the brittle material substrate in this embodiment is a method of dividing a liquid crystal mother glass substrate 130 as shown in FIG. 18 into a plurality of liquid crystal glass substrates 131. A mother substrate including a TFT, a scanning electrode, a signal electrode, and a pixel electrode is referred to as a mother TFT substrate, and a mother substrate including a color filter is referred to as a mother counter substrate. The liquid crystal mother glass substrate 130 includes a mother counter substrate 130b that is a first brittle material substrate in which a scribe line is not formed, and a mother TFT substrate 130a that is a second brittle material substrate in which a scribe line S2 is formed in advance. , Refers to a substrate bonded with a sealant 132.

  FIG. 19 is a configuration diagram of a liquid crystal mother glass substrate automatic dividing line showing such a breaking method of the liquid crystal mother glass substrate 130. This breaking method includes (1) a cassette loader, (2) a first substrate transfer device, (3) a scribe device, (4) a first break device, (5) a second substrate transfer device, and (6) a first 2 break devices, and (7) a third substrate transport device, and a plurality of liquid crystal glass substrates 131 are manufactured via these devices.

  In FIG. 19, a cassette loader 133 of (1) stores and holds a large number of liquid crystal mother glass substrates 130 in a cassette. The material supply robot R1 takes out the liquid crystal mother glass substrate 130 from the cassette of the cassette loader 133 and transfers it to the first substrate transfer device 134 shown in (2). The first substrate transfer device 134 positions the transferred liquid crystal mother glass substrate 130 at a fixed position on the table.

  The transport robot R2 transports the liquid crystal mother glass substrate 130 placed on the table to a predetermined position of the scribing device 135 of (3). The scribing device 135 forms a scribe line S1 on the upper surface of the mother counter substrate 130b shown in FIG.

  The transfer robot R3 takes out the liquid crystal mother glass substrate 130 on which the scribe line S1 is formed from the scribe device 135 and transfers it to a fixed position of the first break device 136 of (4). As the first break device 136, the break device 10 or 30 described in the first embodiment is applied. FIG. 19 shows a case where the break device 10 or 30 according to Embodiment 1 is used, and the upper surface of the liquid crystal mother glass substrate 130 placed across the first table 136a and the second table 136b. Is pressed and fixed, and the liquid crystal mother glass substrate 130 is divided into strips by rotating one table or rotating both tables simultaneously.

  The transfer robot R4 takes out the liquid crystal mother glass substrate 130 divided into strips and places it on the table of the second substrate transfer device 137 in (5). The transfer robot R5 transfers the liquid crystal mother glass substrate 130 divided into strips to a fixed position of the second breaker 138 in (6). The second breaker 138 divides the liquid crystal mother glass substrate 130 into a prescribed shape to obtain a plurality of liquid crystal glass substrates 131. The divided liquid crystal glass substrate 131 is transferred by the third substrate transfer device 139 by the transfer robot R6 and further brought into the next manufacturing process of the liquid crystal panel.

  Such a break method does not require a reversing device for the liquid crystal mother glass substrate 130, and only one scribing device is required as shown in FIG.

(Embodiment 3)
Next, the breaking method in Embodiment 3 of this invention is demonstrated. The brittle material substrate breaking method in this embodiment is characterized in that a double-sided scribing apparatus is used. Further, unlike the mother glass substrate 130 of the second embodiment, the liquid crystal mother glass substrate 140 of the present embodiment is assumed that the scribe line S is not formed in advance on either the mother TFT glass substrate or the mother counter substrate.

  FIG. 20 is a configuration diagram of a liquid crystal mother glass substrate automatic cutting line showing such a breaking method of the liquid crystal mother glass substrate 140. This breaking method includes (1) a cassette loader 142, (2) a first substrate transfer device 143, (3) a first double-sided scribing device 144, (4) a second substrate transfer device 147, ( 5) first break device 148, (6) third substrate transfer device 149, (7) second double-sided scribing device 150, (8) fourth substrate transfer device 153, (9) A plurality of liquid crystal glass substrates 141 are manufactured via these devices, including the second break device 154 and the fifth substrate transport device 155 of (10).

  The material supply robot R1, the transfer robots R2 to R7, and the substrate transfer apparatuses 143, 147, 149, 153, and 155 have the same functions as those shown in the first and second embodiments, and thus description thereof is omitted.

  The first double-sided scribing device 144 has a plurality of tables 145a and 145b, a scribing head mount 146a provided at the center of the device, and upper and lower scribing heads 146b held movably on the scribing head mount 146a. is doing. When the liquid crystal mother glass substrate 140 is transferred to the portion of the scribe head mount 146a by the table 145a, the liquid crystal mother glass substrate 140 is held in a bridge state so that part of the upper and lower surfaces of the liquid crystal mother glass substrate 140 enter the processing region. The scribing head 146b scans the bridge portion to perform scribing on both the upper and lower surfaces.

  As described in the prior art, there are a scribing device using a hard metal or diamond wheel cutter and a device using laser scribing by laser light. In the wheel cutter type, the scribe lines S1 and S2 are simultaneously formed by the two wheel cutters synchronously rotating and rolling (rolling) while pressing both surfaces of the liquid crystal mother glass substrate 140. In the laser scribing method, scanning is performed while irradiating two surfaces of the liquid crystal mother glass substrate 140 with two beam spots, and spot cooling using a coolant is performed following the irradiated portion. In this way, blind scribe using the thermal distortion of the glass material is performed. The structure of the second double-sided scribing device 150 is the same as that of the first double-sided scribing device 144.

  The first break device 148 and the second break device 154 are devices that divide the substrate so that the scribe lines S formed on both surfaces of the liquid crystal mother glass substrate 140 are divided. As described in the first embodiment, there is a system in which the left and right tables are held such that the gaps are not parallel, and at least one of the left and right tables is rotated. In FIG. 20, this type of break device is used, and in the first break device 148, the gaps of the tables 148a and 148b are shown to be non-parallel. The gap between the tables 154a and 154b is also made non-parallel for the second break device 154.

  Some of the first break device 148 and the second break device 154 use other methods. In this, one of the two tables on which the liquid crystal mother glass substrate 140 is placed and fixed is held using a parallel link mechanism (not shown). Then, when the substrate is divided, the table is divided by rotating the table about the axis away from the scribe line as a rotation axis. In the case of this method, the gaps of the tables 148a and 148b and the gaps of the tables 154a and 154b shown in FIG.

  As described above, according to the breaking method of the present embodiment, there is no need to invert the upper and lower surfaces of the liquid crystal mother glass substrate 140, there is no need to install a substrate inversion device, and the liquid crystal mother glass substrate cutting line is installed. The area can be reduced.

It is the figure which showed the state of the vertical crack when forming a scribe in a glass plate. It is the perspective view which showed the principal part structure of the conventional break apparatus using a break bar. It is the perspective view which showed the principal part structure of the conventional break device which breaks by rotation of a table. It is a perspective view which shows the whole structure of the break device in Embodiment 1 of this invention. It is a disassembled perspective view which shows the whole structure of the break device in Embodiment 1. FIG. It is a top view which shows the state which has arrange | positioned the board | substrate to the table of a break apparatus. It is sectional drawing which shows the principal part structure of the scribe line part of the breaking apparatus in Embodiment 1. FIG. It is explanatory drawing which shows the modification of the board | substrate at the time of a break. FIG. 5 is a cross-sectional view showing a cut state of the substrate in the break device in the first embodiment. FIG. 5 is a plan view showing a cut state of the substrate in the breaking device in the first embodiment. It is a perspective view which shows the whole structure of the break device in Embodiment 1 of this invention. It is a disassembled perspective view which shows the whole structure of the break device in Embodiment 1. FIG. It is sectional drawing which shows the principal part structure of the scribe line part of the breaking apparatus in Embodiment 1. FIG. FIG. 5 is a cross-sectional view showing a cut state of the substrate in the break device in the first embodiment. It is explanatory drawing of the liquid crystal mother glass substrate automatic parting line which shows an example of the breaking method of the brittle material board | substrate in Embodiment 1 of this invention. It is process drawing which shows the breaking method of the conventional brittle material board | substrate. FIG. 5 is a process diagram illustrating an example of a breaking method in the first embodiment. It is sectional drawing of the liquid crystal mother glass substrate used for the breaking method of Embodiment 2 of this invention. It is explanatory drawing of the liquid crystal mother glass substrate automatic parting line which shows an example of the breaking method of the brittle material board | substrate in Embodiment 2. FIG. It is explanatory drawing of the liquid crystal mother glass substrate automatic parting line which shows an example of the breaking method of the brittle material board | substrate in Embodiment 3 of this invention.

Explanation of symbols

G substrate GL substrate left portion GR substrate right portion G1 upper substrate G2 lower substrate H glass plate S, S1, S2 scribe line L1, L2, L3 rotating shaft 10, 30, 50, 80, 90 break device 10A, 30A left unit 10B , 30B Right unit 13, 14, 33, 34 Product table 13a, 14a Rotating shaft 13b-13e, 14a-14e Screw hole 11 Slide table 12, 31, 32 Tilt table 15a, 16a, 35a, 36a Clamp bar 15, 16 , 35, 36 Product clamp unit 11a Slide mechanism 17 Base 18 Horizontal holding block upper part 19 Horizontal holding block lower part 18a, 38a, 39a Tilt axis 20, 40 Rotation control part 38b, 39b Holding arm 38, 39 Holding block 120, 130, 140 Liquid Crystal Mother Gala Substrate 120a, 130a Mother TFT substrate 120b, 130b Mother counter substrate 121, 131, 141 Liquid crystal glass substrate 122, 133, 142 Cassette loader 123, 134, 143 First substrate transfer device 124 First scribe device 125 Second Scribing device 126, 137 Second substrate transport device 127, 136, 148 First break device 127a, 127b, 128a, 128b, 136a, 136b, 145a, 145b, 148a, 148b, 151a, 151b Table 128, 138, 154 Second break device 129, 139, 149 Third substrate transport device 132 Sealant 144 First double-side scribe device 146a Scribe mount head 146b Scribe head 150 Second double-side scribe device 153 Fourth substrate transfer device 155 Fifth substrate transfer device R1 Feeding robot R2-R8 Transfer robot

Claims (6)

A method for breaking a brittle material substrate, in which a mother bonded substrate obtained by bonding two brittle material substrates is divided, and a plurality of smaller bonded substrates are obtained.
A step (1) of forming a scribe line S1 using a first scribe device at a predetermined position on one surface of the mother bonded substrate;
Step (2) of forming the scribe line S2 on the other substrate surface of the mother bonded substrate using a second scribe device in the same direction as the scribe line S1;
The mother bonded substrate having the scribe lines S1 and S2 formed on both sides is fixed to two tables of the breaking device with the scribe lines S1 and S2 as a boundary, and one of the two tables is first rotated. And rotating the other one of the two tables on the opposite side of the first rotation shaft across the mother bonding substrate in the thickness direction of the mother bonding substrate. by rotating around a second rotation axis, the scribing line S1, by applying a tensile or shear stress in S2, has a step (3) for dividing the mother laminated substrate on a plurality ,
The brittle material substrate breaking method , wherein the first and second rotation axes have opening angles of -α and + α with respect to the scribe lines S1 and S2, respectively, when viewed from the surface of the mother bonded substrate. .   The brittle material substrate breaking method according to claim 1, wherein a reversing device for reversing the scribe surface of the mother bonded substrate is provided between the step (1) and the step (2). A mother bonded substrate obtained by bonding a first brittle material substrate in which a scribe line is not formed and a second brittle material substrate in which a scribe line S2 is formed in advance is divided, and a plurality of bonded substrates having a smaller shape are divided. A method of breaking a brittle material substrate to be obtained,
Forming a scribe line S1 on the surface of the first brittle material substrate using a scribe device in the same direction as the scribe line S2,
The mother bonded substrate having the scribe lines S1 and S2 formed on both sides is fixed to two tables of the breaking device with the scribe lines S1 and S2 as a boundary, and one of the two tables is first rotated. And rotating the other one of the two tables on the opposite side of the first rotation shaft across the mother bonding substrate in the thickness direction of the mother bonding substrate. by rotating around a second rotation axis, the scribing line S1, by applying a tensile or shear stress in S2, has a step (2) for dividing the mother laminated substrate on a plurality ,
The brittle material substrate breaking method , wherein the first and second rotation axes have opening angles of -α and + α with respect to the scribe lines S1 and S2, respectively, when viewed from the surface of the mother bonded substrate. . Method for breaking a brittle material substrate by dividing a mother bonded substrate obtained by bonding a first brittle material substrate and a second brittle material substrate in which a scribe line is not formed, and obtaining a plurality of smaller bonded substrates Because
A step (1) of simultaneously forming scribe lines S1, S2 on the surfaces of the first and second brittle material substrates using a double-sided scribe device;
The mother bonded substrate having the scribe lines S1 and S2 formed on both sides is fixed to two tables of the breaking device with the scribe lines S1 and S2 as a boundary, and one of the two tables is first rotated. And rotating the other one of the two tables on the opposite side of the first rotation shaft across the mother bonding substrate in the thickness direction of the mother bonding substrate. by rotating around a second rotation axis, the scribing line S1, by applying a tensile or shear stress in S2, has a step (2) for dividing the mother laminated substrate on a plurality ,
The brittle material substrate breaking method , wherein the first and second rotation axes have opening angles of -α and + α with respect to the scribe lines S1 and S2, respectively, when viewed from the surface of the mother bonded substrate. . The double-sided scribing device in the step (1) is
The said mother bonding board | substrate is fixed and it scribes using the wheel cutter made from a cemented carbide metal or a diamond with respect to the surface of the said 1st and 2nd brittle material board | substrate. Breaking method of brittle material substrate as described. The double-sided scribing device in the step (1) is
The mother bonding substrate is fixed, and the surface of the first and second brittle material substrates is subjected to blind scribing by heating with a laser beam and local cooling with a coolant. Item 5. A method for breaking a brittle material substrate according to Item 4.

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