WO2018016038A1

WO2018016038A1 - Cutting device and cutting method

Info

Publication number: WO2018016038A1
Application number: PCT/JP2016/071313
Authority: WO
Inventors: 耕治石田
Original assignee: 堺ディスプレイプロダクト株式会社
Priority date: 2016-07-20
Filing date: 2016-07-20
Publication date: 2018-01-25

Abstract

The cutting device according to the present embodiment is for cutting a plate-shaped member obtained by affixing a plate-shaped first member and second member to each other, wherein the cutting device is provided with: a first cutting part, which comes into contact with a first processing surface of the first member on the opposite side from the surface facing the second member and moves, thereby forming a first cutting groove extending in the movement direction on the first processing surface; one or more first movement parts, which move together with the movement of the first cutting part and move in the movement direction while being in contact with the first processing surface; a second cutting part, which comes into contact with a second processing surface of the second member on the opposite side from the surface facing the first member and moves in the movement direction, and thereby forms a second cutting groove extending in the movement direction on the second processing surface; and one or more second movement parts, which move together with the movement of the second cutting part and move in the movement direction while being in contact with the second processing surface. The first cutting part and one of the second movement parts face each other across the plate-shaped member, and the second cutting part and one of the first movement parts face each other across the plate-shaped member.

Description

Cutting apparatus and cutting method

The present invention relates to a cutting device and a cutting method for cutting a plate-like member.

For example, Patent Document 1 discloses a method of cutting a glass substrate (plate member) on which a TFT (Thin Film Transistor) substrate and a CF (Color Filter) substrate are bonded.

In the cutting method disclosed in Patent Document 1, first, a glass substrate is placed on a stage with the TFT substrate facing upward. Then, the wheel cutter (cutting portion) moves on the TFT substrate, that is, scribes, whereby a scribe groove (cutting groove) is formed in the TFT substrate. Next, the glass substrate is placed on the stage with the CF substrate facing upward. Then, when the wheel cutter moves on the CF substrate, that is, scribes, a scribe groove is formed in the CF substrate. The scribe groove is formed perpendicular to the surface of each of the TFT substrate and the CF substrate, and the glass substrate is cut by the scribe groove extending in the depth direction. A liquid crystal panel is manufactured based on the cut glass substrate. Patent Document 1 also discloses scribing a glass substrate from below.

In the cutting method disclosed in Patent Document 1, when the glass substrate is scribed from the upper side, the glass substrate is supported from the lower side by the mounting table. When the glass substrate is scribed from the lower side, the glass substrate is supported from the upper side by a load balance wheel arranged to face the wheel cutter. Therefore, it is suppressed that a glass substrate bends with the external force applied to a glass substrate from a wheel cutter.

Japanese Patent No. 4885111

By the way, in order to shorten the time required for cutting the glass substrate, the TFT substrate and the CF substrate are simultaneously scribed using two wheel cutters, that is, the glass substrate is simultaneously scribed from both the upper and lower sides. It is possible. When the scribe position on the TFT substrate and the scribe position on the CF substrate are the same and the two wheel cutters are arranged to face each other through the glass substrate, the external forces applied from the two wheel cutters cancel each other out. Substrate bending is suppressed. On the other hand, when the scribe position on the TFT substrate and the scribe position on the CF substrate are different, the glass is caused by the downward external force applied to the glass substrate from the upper wheel cutter and the upward external force applied to the glass substrate from the lower wheel cutter. There is a possibility that the substrate bends. Note that, for example, in a portion where the terminal is provided, the scribe position on the TFT substrate is different from the scribe position on the CF substrate.

If the glass substrate bends while the glass substrate is scribed, the scribe groove cannot be formed perpendicular to the surface of the glass substrate, and as a result, the scribe groove progresses in the depth direction. Thus, defects such as burrs or chips may occur in the glass substrate. The problems as described above are not limited to glass substrates, and may occur when cutting a plate-like member formed by bonding one surface of two plate-like members having flexibility.

This invention is made | formed in view of such a situation, The main objective is to use a plate-shaped member at the time of cut | disconnecting the plate-shaped member by which two members are bonded together from both sides of two members simultaneously. It is an object of the present invention to provide a cutting device and a cutting method that can prevent the occurrence of defects.

The cutting device according to the present embodiment is a cutting device that cuts a plate-like member formed by laminating a plate-like first member and a second member. What is the surface of the first member that faces the second member? By moving in contact with the first processing surface on the opposite side, a first cutting portion for forming a first cutting groove extending in the moving direction on the first processing surface, and the movement of the first cutting portion together with the first cutting portion. One or more first moving parts that move in the moving direction while contacting one processing surface, and the second member that contacts the second processing surface opposite to the surface facing the first member in the movement direction A second cutting portion that forms a second cutting groove extending in the moving direction on the second processing surface by moving in the direction, and the second cutting surface while contacting the second processing surface along with the movement of the second cutting portion. One or more second moving parts moving in the moving direction, One cutting part and one second moving part are opposed to each other via the plate-like member, and the second cutting part and one first moving part are opposed to each other via the plate-like member. It is characterized by.

The cutting method according to the present embodiment is a cutting method for cutting a plate-like member formed by laminating a plate-like first member and a second member. What is the surface of the first member facing the second member? The first cutting portion for forming the first cutting groove on the first processing surface on the opposite side and the second processing surface on the opposite side to the surface of the second member facing the first member are in contact with each other. The second moving portion that moves is opposed to the second processing portion through the plate-like member, and moves while being in contact with the first processing surface and the second cutting portion for forming the second cutting groove on the second processing surface. The first moving part is opposed to the first moving part via the plate-like member, and the first cutting part, the second cutting part, the first moving part, and the second moving part are moved in the same direction at the same speed. The first cutting part extends in the moving direction to the first cutting part and the second cutting part. And wherein the to simultaneously form the second cutting grooves.

According to the present invention, there is provided a cutting device and a cutting method capable of preventing the plate-like member from being defective when simultaneously cutting a plate-like member formed by bonding two members from both sides of the two members. Provided.

It is a front view which shows typically the structure of the cutting device which concerns on Embodiment 1. FIG. It is a front view which shows typically the principal part structure of the cutting device which concerns on Embodiment 1. FIG. It is a top view for demonstrating the cutting procedure by the cutting device which concerns on Embodiment 1. FIG. It is sectional drawing for demonstrating the cutting procedure by the cutting device which concerns on Embodiment 1. FIG. 3 is a cross-sectional view schematically showing a glass substrate cut by the cutting device according to Embodiment 1. FIG. It is a front view which shows typically the structure of the cutting device which concerns on Embodiment 2. FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the embodiment, the plate member cut by the cutting device is a glass substrate formed by bonding a CF substrate and a TFT substrate, and the two plate members constituting the plate member are a CF substrate and a TFT substrate. is there. Note that the two plate-like members constituting the plate-like member are not limited to glass, and may be made of, for example, a synthetic resin.

(Embodiment 1)
First, with reference to FIG.1 and FIG.2, the structure of the glass substrate 2 as the cutting device 1 which concerns on this Embodiment, and a plate-shaped member is demonstrated. FIG. 1 is a front view schematically showing the configuration of the cutting device 1 according to the first embodiment. FIG. 2 is a front view schematically showing the main configuration of the cutting device 1 according to the first embodiment. Hereinafter, the left-right direction in the figure is referred to as the left-right direction, the up-down direction in the figure is referred to as the up-down direction, and the front-rear direction in the figure is referred to as the front-rear direction.

The cutting device 1 cuts a glass substrate 2 (plate-like member) on which a CF substrate 21 (first member) and a TFT substrate 22 (second member) are bonded, and a plurality of pieces (for example, six pieces) from the glass substrate 2. Take out the glass substrate. A liquid crystal display panel is manufactured based on a glass substrate (hereinafter referred to as a unit glass substrate) that is finally taken out by cutting the glass substrate 2.

The glass substrate 2 includes a CF substrate 21 including a rectangular glass substrate and a TFT substrate 22 including a rectangular glass substrate. A color filter (not shown) is formed on the surface of the CF substrate 21 facing the TFT substrate 22 (hereinafter referred to as a CF forming surface). Scribe grooves 511 to 514 (see FIG. 4) are formed on a surface (hereinafter referred to as a first processing surface) 211 opposite to the CF formation surface of the CF substrate 21. A TFT array (not shown) is formed on the surface of the TFT substrate 22 facing the CF substrate 21 (hereinafter referred to as a TFT formation surface). Scribe grooves 521 to 524 (see FIG. 4) are formed on a surface 221 opposite to the TFT formation surface (hereinafter referred to as a second processing surface) 221 on the TFT substrate 22.

The CF substrate 21 and the TFT substrate 22 are bonded together via a plurality of sealing portions 23 in a state where the CF forming surface and the TFT forming surface are arranged to face each other with an appropriate distance therebetween. Transparent spacers (not shown) are arranged inside each sealing portion 23 between the CF substrate 21 and the TFT substrate 22.

The sealing portion 23 is, for example, a hardened adhesive and has a rectangular ring shape. For example, when six unit glass substrates are taken out from the glass substrate 2, that is, when the number of chamfers is 6, for example, three sealing portions 23 in the front-rear direction and two sealing portions 23 in the left-right direction are arranged in a matrix. (See FIG. 3).

The cutting device 1 includes a plurality of (three in the present embodiment) mounting tables 10, a plurality (four in the present embodiment)

guide rails

111, 112, 121, 122, a first unit 13, and a second unit. 14. In the present embodiment, the cutting apparatus 1 includes two units of the first unit 13 and the second unit 14, but the number of the units is not limited to two, and may be one, There may be more than one. The configurations of the first unit 13 and the second unit 14 are substantially the same except that the

guide rails

111, 112, 121, and 122 to be attached are different. Hereinafter, the first unit 13 will be specifically described as a representative.

The upper surface of each mounting table 10 is a flat surface and is kept horizontal. The mounting tables 10 are juxtaposed in the left-right direction so that the upper surfaces of the mounting tables 10 have the same height. The glass substrate 2 is mounted on the mounting table 10 with the TFT substrate 22 facing down. The upper surface of the mounting table 10 is in contact with the lower surface of the TFT substrate 22 on the glass substrate 2 mounted on the mounting table 10, that is, the second processing surface 221. The glass substrate 2 is fixed to the mounting table 10 by, for example, vacuum suction.

Each of the

guide rails

111, 112, 121, 122 is a rod-shaped member. Each of the guide rails 111 and 112 is arranged on the upper side of the glass substrate 2 mounted on the mounting table 10 so that the longitudinal direction thereof faces the front-rear direction. Each of the guide rails 111 and 112 is supported by a support (not shown). The guide rail 111 is disposed on the left side of the guide rail 112 with an appropriate distance. Each of the

guide rails

121 and 122 is disposed on the lower side of the glass substrate 2 placed on the placing table 10 so that the longitudinal direction thereof faces the front-rear direction. Each of the

guide rails

121 and 122 is supported by a support (not shown). The guide rail 121 is arranged on the left side of the guide rail 122 with an appropriate distance.

The first unit 13 includes

movement support portions

31 and 41,

wheel cutters

32 and 42, and

rollers

33 and 43. The movement support part 31 is a first movement support part in the present embodiment. The movement support unit 31 is disposed above the glass substrate 2 placed on the placement table 10. The movement support unit 31 supports the upper wheel cutter 32 and the roller 33 while moving them in the movement direction (front-rear direction). The movement support unit 31 moves in the front-rear direction along the guide rail 111 by being given a thrust from a ball screw rotated by a motor, for example. As the movement support unit 31 moves, the wheel cutter 32 and the roller 33 move in the front-rear direction. The movement support unit 31 includes a box 311 and a cutter holder 312.

The box 311 is attached to the guide rail 111. The cutter holder 312 has a cylindrical shape extending downward from the lower end of the box 311. In the lower part of the cutter holder 312, there is an opening facing the first processing surface 211 of the glass substrate 2 placed on the placing table 10. Inside the cutter holder 312, a rotating shaft portion 321 that rotatably supports the wheel cutter 32 is provided. A rotating shaft portion 331 that rotatably supports the roller 33 is provided outside the cutter holder 312. The rotation shaft portion 321 and the rotation shaft portion 331 are shafts extending in the left-right direction. In addition, the rotating shaft part 331 may be provided not on the cutter holder 312 but on, for example, the box 311 or an arm provided on the box 311.

The wheel cutter 32 is the first cutting part in the present embodiment. The wheel cutter 32 has a disk shape. The wheel cutter 32 is rotatably supported by a rotating shaft portion 321 in the cutter holder 312 such that a part of the lower side of the wheel cutter 32 protrudes downward from the opening of the cutter holder 312. The wheel cutter 32 rotates around the rotation shaft portion 321. The wheel cutter 32 contacts the first processing surface 211 and moves while rotating to form scribe grooves 511 to 514 extending in the moving direction on the first processing surface 211.

In the present embodiment, the first unit 13 includes two rollers 33. The two rollers 33 are arranged one on each of the left and right sides of the cutter holder 312. Each roller 33 is a first moving unit in the present embodiment. The two rollers 33 are juxtaposed in the left-right direction (direction intersecting the moving direction), and the wheel cutter 32 is disposed between the two rollers 33. Each roller 33 is rotatably supported by a rotation shaft portion 331 and rotates around the rotation shaft portion 331. Each roller 33 moves in the moving direction while rotating in contact with the first processing surface 211 as the wheel cutter 32 moves.

The movement support part 41 is a second movement support part in the present embodiment. The movement support unit 41 is disposed below the glass substrate 2 placed on the placement table 10. The movement support unit 41 supports the lower wheel cutter 42 and the roller 43 and moves them in the movement direction (front-rear direction). The movement support unit 41 moves in the front-rear direction along the guide rail 121 by being given a thrust from a ball screw rotated by a motor, for example. As the movement support unit 41 moves, the wheel cutter 42 and the roller 43 move in the front-rear direction. The movement support unit 41 includes a box body 411 and a cutter holder 412.

The box body 411 is attached to the guide rail 121. The cutter holder 412 has a cylindrical shape extending upward from the upper end portion of the box body 411. In the upper part of the cutter holder 412, there is an opening facing the second processing surface 221 of the glass substrate 2 placed on the placing table 10. Inside the cutter holder 412, a rotating shaft portion 421 that rotatably supports the wheel cutter 42 is provided. A rotating shaft 431 that rotatably supports the roller 43 is provided outside the cutter holder 412. The rotation shaft portion 421 and the rotation shaft portion 431 are shafts extending in the left-right direction. In addition, the rotating shaft part 431 may be provided not on the cutter holder 412 but on, for example, the box 411 or an arm provided on the box 411.

The wheel cutter 42 is a second cutting part in the present embodiment. The wheel cutter 42 has a disk shape. The wheel cutter 42 is rotatably supported by a rotating shaft portion 421 in the cutter holder 412 so that a part of the upper portion thereof protrudes upward from the opening of the cutter holder 412. The wheel cutter 42 rotates around the rotation shaft portion 421. The wheel cutter 42 contacts the second processing surface 221 and moves while rotating, thereby forming scribe grooves 521 to 524 extending in the moving direction on the second processing surface 221.

In the present embodiment, the first unit 13 includes two rollers 43. Two rollers 43 are arranged one on each of the left and right sides of the cutter holder 412. Each roller 43 is a second moving unit in the present embodiment. The two rollers 43 are juxtaposed in the left-right direction (direction intersecting the moving direction), and a wheel cutter 42 is disposed between the two rollers 43. Each roller 43 is rotatably supported by a rotation shaft portion 431 and rotates around the rotation shaft portion 431. Each roller 43 moves in the moving direction while rotating in contact with the second processing surface 221 as the wheel cutter 42 moves.

As shown in FIG. 1, in the first unit 13, the upper wheel cutter 32 and the lower wheel cutter 42 are arranged at different positions in the left-right direction. That is, the first unit 13 is used for cutting a portion of the glass substrate 2 where the terminal is provided (a portion where the electrode terminal of the TFT array is provided). On the other hand, in the second unit 14, the upper wheel cutter 32 and the lower wheel cutter 42 are arranged at the same position in the left-right direction, that is, opposed to each other via the glass substrate 2. That is, the second unit 14 is used for cutting a portion of the glass substrate 2 where no terminal is provided.

In the first unit 13 used for cutting a portion to be connected to the terminal, the upper wheel cutter 32 and one of the lower two rollers 43 are opposed to each other with the glass substrate 2 interposed therebetween, and the lower wheel cutter 42. And one of the upper two rollers 33 are opposed to each other with the glass substrate 2 interposed therebetween. Accordingly, the lower roller 43 facing the wheel cutter 32 can receive the downward external force applied to the glass substrate 2 from the upper wheel cutter 32 when the scribe grooves 511 to 514 are formed. Similarly, the upper roller 33 facing the wheel cutter 42 can receive the upward external force applied to the glass substrate 2 from the lower wheel cutter 42 when the scribe grooves 521 to 524 are formed. Therefore, the bending of the glass substrate 2 when the scribe grooves 511 to 514 and 521 to 524 are formed can be suppressed.

Next, the cutting procedure of the glass substrate 2 will be described with reference to FIGS. 3 to 5 in addition to FIGS. FIG. 3 is a plan view for explaining a cutting procedure by the cutting apparatus 1 according to the first embodiment. FIG. 4 is a cross-sectional view for explaining a cutting procedure by the cutting apparatus 1 according to the first embodiment. FIG. 5 is a cross-sectional view schematically showing the glass substrate 2 cut by the cutting device 1 according to the first embodiment. 4 and 5, as in FIGS. 1 and 2, the horizontal direction in the figure is referred to as the horizontal direction, the vertical direction in the figure is referred to as the vertical direction, and the front-rear direction in the figure is referred to as the front-rear direction. . In FIG. 3, the left-right direction in the figure is referred to as the left-right direction, the up-down direction in the figure is referred to as the front-rear direction, and the front-rear direction in the figure is referred to as the up-down direction. Further, the lower side of the glass substrate 2 in FIG. 3 is referred to as a front side, and the upper side of the glass substrate 2 in FIG. 3 is referred to as a rear side.

3 and 4, reference numerals A1 to A4 are scribe positions on the CF substrate 21, respectively. The scribe positions A1 to A4 are arranged in this order from right to left. Reference numerals B 1 to B 4 are scribe positions on the TFT substrate 22. The scribe positions B1 to B4 are arranged in this order from right to left. In the present embodiment, a region (hereinafter referred to as a first region) 20A between the scribe positions A1, B1 and the scribe positions A2, B2 on the glass substrate 2, and a scribe position A3, B3 and the scribe position A4 on the glass substrate 2 are used. , B4, three sealing portions 23 are disposed in each of the regions 20B (hereinafter referred to as second regions) 20B.

The scribe positions A1 and B1 have the same horizontal position. That is, the scribe positions A1 and B1 are portions where the terminals are not provided, and the second unit 14 forms scribe

grooves

511 and 521 at the scribe positions A1 and B1. On the other hand, the horizontal positions of the scribe positions A2 and B2 are different. Specifically, the horizontal position of the scribe position A2 is on the right side of the horizontal position of the scribe position B2. That is, the scribe positions A2 and B2 are portions where terminals are led out, and the first unit 13 forms scribe

grooves

512 and 522 at the scribe positions A2 and B2.

Scribe grooves

511 and 512 are first cutting grooves in the present embodiment, and

scribe grooves

521 and 522 are second cutting grooves in the present embodiment.

As in the scribe positions A1 and B1, the horizontal positions of the scribe positions A3 and B3 are the same. That is, the scribe positions A3 and B3 are portions where the terminals are not provided, and the second unit 14 forms scribe

grooves

513 and 523 at the scribe positions A3 and B3. On the other hand, as in the scribe positions A2 and B2, the positions in the left-right direction of the scribe positions A4 and B4 are different. Specifically, the horizontal position of the scribe position A4 is on the right side of the horizontal position of the scribe position B4. That is, the scribe positions A4 and B4 are portions where the terminals are led out, and the first unit 13 forms scribe

grooves

514 and 524 at the scribe positions A4 and B4.

Scribe grooves

513 and 514 are first cutting grooves in the present embodiment, and

scribe grooves

523 and 524 are second cutting grooves in the present embodiment.

First, the cutting device 1 simultaneously cuts the glass substrate 2 at the scribe positions A1 and B1 and the scribe positions A2 and B2, and takes out a portion of the first region 20A from the glass substrate 2. Specifically, the cutting device 1 uses the second unit 14 to form

scribe grooves

511 and 521 at the scribe positions A1 and B1, and cuts the glass substrate 2 at the scribe positions A1 and B1. At the same time, the cutting device 1 uses the first unit 13 to form

scribe grooves

512 and 522 at the scribe positions A2 and B2, and cuts the glass substrate 2 at the scribe positions A2 and B2.

Next, the cutting apparatus 1 simultaneously cuts the glass substrate 2 at the scribe positions A3 and B3 and the scribe positions A4 and B4, and takes out the portion of the second region 20B from the glass substrate 2. Specifically, the cutting device 1 uses the second unit 14 to form

scribe grooves

513 and 523 at the scribe positions A3 and B3, and cuts the glass substrate 2 at the scribe positions A3 and B3. At the same time, the cutting device 1 uses the first unit 13 to form

scribe grooves

514 and 524 at the scribe positions A4 and B4, and cuts the glass substrate 2 at the scribe positions A4 and B4.

The formation of the

scribe grooves

511 and 521 at the scribe positions A1 and B1 and the formation of the

scribe grooves

512 and 522 at the scribe positions A2 and B2 are not necessarily performed at the same time, and may be performed sequentially. Similarly, the formation of the

scribe grooves

513 and 523 at the scribe positions A3 and B3 and the formation of the

scribe grooves

514 and 524 at the scribe positions A4 and B4 may be performed sequentially instead of simultaneously. Hereinafter, the cutting procedure of the glass substrate 2 will be described in more detail.

Before the glass substrate 2 is mounted on the mounting table 10, the first unit 13 and the second unit 14 are located behind the glass substrate 2 mounted on the mounting table 10 (upper side in FIG. 3, rear side in FIG. 4). Side). In this state, the glass substrate 2 is mounted and fixed on the mounting table 10 by, for example, a transfer robot. The glass substrate 2 is disposed such that the scribe positions A1, A2, B1, and B2 are not placed on the placement table 10, that is, in a gap between the placement tables 10.

Next, in the cutting device 1, the left and right positions of the wheel cutter 32 on the upper side of the first unit 13 and the scribe position A2 coincide with each other, and the left and right wheel cutters 42 on the lower side of the first unit 13 and the scribe position B2 The positional relationship between the first unit 13 and the glass substrate 2 is adjusted so that the position in the direction matches. This adjustment may be performed, for example, by moving the guide rails 111 and 121, the

movement support portions

31 and 41 of the first unit 13, and / or the mounting table 10 in the left-right direction, or transporting the glass substrate 2, for example. You may carry out by moving to the left-right direction using a robot. Here, the wheel cutter 32 on the upper side of the first unit 13 and one of the two rollers 43 on the lower side of the first unit 13 (the right side roller 43) are arranged to face each other with the glass substrate 2 interposed therebetween. The Further, the lower wheel cutter 42 of the first unit 13 and one of the two rollers 33 on the upper side of the first unit 13 (the left roller 33) are arranged to face each other with the glass substrate 2 interposed therebetween. .

Further, in the cutting device 1, the left and right positions of the wheel cutter 32 on the upper side of the second unit 14 and the scribe position A1 coincide with each other, and the left and right direction of the wheel cutter 42 on the lower side of the second unit 14 and the scribe position B1. The positional relationship between the second unit 14 and the glass substrate 2 is adjusted so that these positions coincide with each other. This adjustment may be performed, for example, by moving the

guide rails

112 and 122, the

movement support portions

31 and 41 of the second unit 14, and / or the mounting table 10 in the left-right direction, or transporting the glass substrate 2, for example. You may carry out by moving to the left-right direction using a robot. Adjustment of the position of the 1st unit 13 and the 2nd unit 14 in the left-right direction is performed simultaneously, for example. Here, the wheel cutter 32 on the upper side of the second unit 14 and the wheel cutter 42 on the lower side of the second unit 14 are arranged to face each other with the glass substrate 2 interposed therebetween.

Next, the cutting device 1 adjusts the positional relationship in the front-rear direction of the

wheel cutters

32, 42 and the

rollers

33, 43 and the positional relationship in the left-right direction of the

wheel cutters

32, 42,

rollers

33, 43, and the glass substrate 2. The first unit 13 and the second unit 14 are moved forward (moved to the lower side in FIG. 3 and the front side in FIG. 4) while maintaining the subsequent positional relationship. At this time, each of the

wheel cutters

32 and 42 of the first unit 13 and the

wheel cutters

32 and 42 of the second unit 14 is driven and rotated by a drive unit (not shown).

When the cutting device 1 advances the first unit 13, the upper side movement support part 31 (wheel cutter 32 and roller 33) of the first unit 13 and the lower side movement support part 41 (wheel cutter 42) of the first unit 13. And the roller 43) are moved at the same speed in the same direction (forward). Further, when the cutting device 1 advances the second unit 14, the movement support portion 31 (wheel cutter 32 and roller 33) on the upper side of the second unit 14 and the movement support portion 41 (wheel on the lower side of the second unit 14). The cutter 42 and the roller 43) are moved in the same direction (forward) at the same speed. Furthermore, in the present embodiment, the cutting device 1 moves the first unit 13 and the second unit 14 in the same direction (forward) at the same speed.

When the first unit 13 moves forward, the upper moving support portion 31 of the first unit 13 moves forward along the guide rail 111. At this time, the wheel cutter 32 on the upper side of the first unit 13 advances while rotating in contact with the scribe position A2 on the first processing surface 211, and the roller 33 on the upper side of the first unit 13 moves on the first processing surface. It advances while rotating in contact with the left and right sides of the scribe position A2 at 211. As the wheel cutter 32 of the first unit 13 moves from the rear side portion to the front side portion of the CF substrate 21, a scribe groove 512 is formed at the scribe position A <b> 2 on the first processing surface 211 of the CF substrate 21.

Also, when the first unit 13 moves forward, the lower movement support portion 41 of the first unit 13 moves forward along the guide rail 121. At this time, the lower wheel cutter 42 of the first unit 13 advances while rotating in contact with the scribe position B2 on the second processing surface 221, and the lower roller 43 of the first unit 13 The processing surface 221 advances while contacting and rotating on both the left and right sides of the scribe position B2. As the wheel cutter 42 of the first unit 13 moves from the rear side portion to the front side portion of the TFT substrate 22, a scribe groove 522 is formed at the scribe position B <b> 2 on the second processing surface 221 of the TFT substrate 22.

When the second unit 14 moves forward, the upper moving support portion 31 of the second unit 14 moves forward along the guide rail 112. At this time, the wheel cutter 32 on the upper side of the second unit 14 advances while rotating in contact with the scribe position A1 on the first processing surface 211, and the roller 33 on the upper side of the second unit 14 moves on the first processing surface. It advances while rotating in contact with the left and right sides of the scribe position A1 at 211. As the wheel cutter 32 of the second unit 14 moves from the rear side portion to the front side portion of the CF substrate 21, a scribe groove 511 is formed at the scribe position A1 on the first processing surface 211 of the CF substrate 21.

Also, when the second unit 14 moves forward, the lower movement support portion 41 of the second unit 14 moves forward along the guide rail 122. At this time, the lower wheel cutter 42 of the second unit 14 moves forward while rotating in contact with the scribe position B1 on the second processing surface 221, and the lower roller 43 of the second unit 14 The processing surface 221 advances while rotating in contact with the left and right sides of the scribe position B1. As the wheel cutter 42 of the second unit 14 moves from the rear side portion to the front side portion of the TFT substrate 22, a scribe groove 521 is formed at a scribe position B 1 on the second processing surface 221 of the TFT substrate 22.

As the

scribe grooves

511, 521, 512, and 522 are formed, the

scribe grooves

511, 521, 512, and 522 each advance in the depth direction. Alternatively, after the

scribe grooves

511, 521, 512, 522 are formed, an external force is applied to the glass substrate 2, whereby each of the

scribe grooves

511, 521, 512, 522 develops in the depth direction. As a result, the glass substrate 2 is cut at the scribe positions A1, B1 and the scribe positions A2, B2, and a portion of the first region 20A is taken out from the glass substrate 2 (see FIG. 5).

As described above, the

movement support portions

31 and 41 of the first unit 13 and the

movement support portions

31 and 41 of the second unit 14 are moved simultaneously. Therefore, the

scribe grooves

511, 521, 512, 522 are formed simultaneously. Since the

scribe grooves

511, 521, 512, and 522 are formed at the same time, it is possible to shorten the time required to take out the portion of the first region 20 A from the glass substrate 2.

Further, the scribe positions A1, A2, B1, and B2 on the glass substrate 2 are not supported by the mounting table 10. However, below the wheel cutter 32 on the upper side of the first unit 13, there is one of the lower rollers 43 (the right roller 43). Therefore, the downward external force applied to the glass substrate 2 from the wheel cutter 32 of the first unit 13 is received by the lower roller 43 of the first unit 13. In addition, above the wheel cutter 42 of the first unit 13, there is one of the upper rollers 33 (the left roller 33). Therefore, the upward external force applied to the glass substrate 2 from the wheel cutter 42 of the first unit 13 is received by the upper roller 33 of the first unit 13. Therefore, the bending of the glass substrate 2 due to the external force applied to the glass substrate 2 from the

wheel cutters

32 and 42 of the first unit 13 is suppressed.

For the second unit 14, the upper and

lower wheel cutters

32 and 42 are disposed to face each other with the glass substrate 2 interposed therebetween. Accordingly, the external forces applied from the

wheel cutters

32 and 42 cancel each other, so that the bending of the glass substrate 2 is suppressed.

Thus, since the bending of the glass substrate 2 at the time of forming the

scribe grooves

511, 521, 512, 522 is suppressed, the

scribe grooves

511, 521, 512, 522 are respectively replaced with the first processing surface 211 and the second processing surface. 221 can be formed perpendicularly. Accordingly, the occurrence of defects such as burrs or chips on the glass substrate 2 is suppressed.

After the glass substrate 2 is cut at the scribe positions A 1 and B 1 and the scribe positions A 2 and B 2, the cutting apparatus 1 moves the first unit 13 and the second unit 14 from the glass substrate 2 mounted on the mounting table 10. Also, the glass substrate 2 is released from the rear side and released. Thereafter, the portion of the first region 20A, the remaining glass substrate 2 (the portion on the left side of the scribe positions A2 and B2), and the end material generated at the time of cutting for taking out the portion of the first region 20A are cut. It is unloaded from the device 1.

Next, the cutting device 1 takes out the portion of the second region 20B from the remaining glass substrate 2. The process of taking out the part of the second area 20B is substantially the same as the process of taking out the part of the first area 20A. Hereinafter, a process for extracting the portion of the second region 20B will be briefly described.

That is, the remaining glass substrate 2 is mounted again on the mounting table 10 by, for example, a transfer robot and fixed. The remaining glass substrate 2 is arranged such that the scribe positions A3, A4, B3, and B4 are not placed on the placing table 10, that is, in the gap between the placing tables 10.

Next, in the cutting device 1, the left and right positions of the wheel cutter 32 on the upper side of the first unit 13 and the scribe position A4 coincide, and the left and right positions of the wheel cutter 42 on the lower side of the first unit 13 and the scribe position B4 are aligned. The positional relationship between the first unit 13 and the glass substrate 2 is adjusted so that the position in the direction matches. Here, the wheel cutter 32 on the upper side of the first unit 13 and one of the two rollers 43 on the lower side of the first unit 13 (the right side roller 43) are arranged to face each other with the glass substrate 2 interposed therebetween. The Further, the lower wheel cutter 42 of the first unit 13 and one of the two rollers 33 on the upper side of the first unit 13 (the left roller 43) are arranged to face each other with the glass substrate 2 interposed therebetween. .

Further, in the cutting device 1, the left and right positions of the wheel cutter 32 on the upper side of the second unit 14 and the scribe position A3 coincide with each other, and the left and right direction of the wheel cutter 42 on the lower side of the second unit 14 and the scribe position B3. The positional relationship between the second unit 14 and the glass substrate 2 is adjusted so that these positions coincide with each other.

wheel cutters

32, 42 and the

rollers

33, 43 and the positional relationship in the left-right direction of the

wheel cutters

32, 42,

rollers

33, 43, and the glass substrate 2. The first unit 13 and the second unit 14 are advanced at the same speed while maintaining the subsequent positional relationship.

As the first unit 13 moves from the rear side of the glass substrate 2 to the front side, a scribe groove 514 is formed at the scribe position A4 on the first processing surface 211 of the CF substrate 21, and the second processing of the TFT substrate 22 is performed. A scribe groove 524 is formed at a scribe position B4 on the surface 221. Further, as the second unit 14 moves from the rear side portion to the front side portion of the glass substrate 2, a scribe groove 513 is formed at the scribe position A <b> 3 on the first processing surface 211 of the CF substrate 21, and the second substrate 14 of the TFT substrate 22 is formed. 2 A scribe groove 523 is formed at a scribe position B3 on the processing surface 221.

Thereafter, with the formation of the

scribe grooves

513, 523, 514, and 524, the

scribe grooves

513, 523, 514, and 524 each advance in the depth direction. Alternatively, after the

scribe grooves

513, 523, 514, and 524 are formed, an external force is applied to the glass substrate 2, so that each of the

scribe grooves

513, 523, 514, and 524 develops in the depth direction. As a result, the glass substrate 2 is cut at the scribe positions A3 and B3 and the scribe positions A4 and B4, and a portion of the second region 20B is taken out from the glass substrate 2 (see FIG. 5).

Thereafter, the cutting device 1 retracts the first unit 13 and the second unit 14 to the rear side of the glass substrate 2 placed on the placement table 10 and releases the fixation of the glass substrate 2. Thereafter, the portion of the second region 20 </ b> B is unloaded from the cutting device 1.

In the present embodiment, the process of taking out the part of the first region 20A and the part of the second region 20B from the glass substrate 2 has been described. After the process, for example, the second unit 14 is used to form the first region 20A. Cutting processing is performed on the portion and the portion of the second region 20B, and the unit glass substrate is taken out. Thereafter, a liquid crystal display panel is manufactured based on the unit glass substrate.

As described above, according to the present embodiment, when the portion of the glass substrate 2 where the terminal is placed is scribed simultaneously from both the upper and lower sides, the upper wheel cutter 32 and the lower roller 43 are The lower wheel cutter 42 and the upper roller 33 are arranged to face each other with the glass substrate 2 interposed therebetween. Thereby, the

rollers

33 and 43 facing the

wheel cutters

32 and 42 can receive the external force applied to the glass substrate 2 from the

wheel cutters

32 and 42 when the

scribe grooves

512 and 522 or the

scribe grooves

514 and 524 are formed. . Therefore, the bending of the glass substrate 2 when forming the

scribe grooves

512, 522 or the

scribe grooves

514, 524 can be suppressed, and the

scribe grooves

512, 522 or the

scribe grooves

514, 524 can be arranged with respect to the surface of the glass substrate 2. It can be formed vertically. As a result, the occurrence of defects such as burrs or chips in the glass substrate 2 is suppressed.

In addition, the 1st cutting part or 2nd cutting part of embodiment is not limited to the

wheel cutters

32 and 42, For example, the glass cutter which forms a scribe groove | channel in the glass substrate 2 without rotating may be sufficient. Moreover, the 1st moving part or 2nd moving part of embodiment is not limited to the

rollers

33 and 43, For example, the ring | wheel or ball | bowl rotating centering on the

rotating shaft parts

331 and 431 may be sufficient. Further, the first moving unit or the second moving unit is not limited to the rotating unit, and may slide on the first processing surface 211 or the second processing surface 221 of the glass substrate 2, for example.

(Embodiment 2)
FIG. 6 is a front view schematically showing the configuration of the cutting device 1 according to the second embodiment. The cutting device 1 according to the present embodiment is substantially the same as the cutting device 1 according to the first embodiment, except that each of the first unit 13 and the second unit 14 includes one roller 33 and one roller 43. It is a configuration. In the following, differences from the first embodiment will be mainly described, and the same components as those in the first embodiment will be denoted by the same reference numerals and description thereof will be omitted.

In the cutting device 1 of the present embodiment, each of the first unit 13 and the second unit 14 includes one roller 33 and one roller 43. The upper roller 33 of the first unit 13 is disposed on the left side of the upper wheel cutter 32 of the first unit 13. Further, the lower roller 43 of the first unit 13 is disposed on the right side of the lower wheel cutter 42 of the first unit 13.

When the first unit 13 scribes the portion of the glass substrate 2 that leads out, the wheel cutter 32 on the upper side of the first unit 13 and the roller 43 on the lower side of the first unit 13 face each other with the glass substrate 2 in between. Arranged. Further, the lower wheel cutter 42 of the first unit 13 and the upper roller 33 of the first unit 13 are disposed to face each other with the glass substrate 2 interposed therebetween. Thereby, like Embodiment 1, the bending of the glass substrate 2 at the time of forming the scribe groove | channel 512,522 or the scribe groove | channel 514,524 can be suppressed, and the scribe groove | channel 512,522 or the scribe groove | channel 514,524 is possible. Can be formed perpendicular to the surface of the glass substrate 2. As a result, the occurrence of defects such as burrs or chips in the glass substrate 2 is suppressed.

In the present embodiment, the portion where the terminal is led out is always on the right side of the scribe position A2 (A4) on the upper CF substrate 21 than the scribe position B2 (B4) on the lower TFT substrate 22. Therefore, as described above, the upper roller 33 is arranged on the left side of the upper wheel cutter 32, and the lower roller 43 is arranged on the right side of the lower wheel cutter 42, so that the terminal is provided. When scribing, the

wheel cutters

32 and 42 and the

rollers

33 and 43 can be arranged to face each other with the glass substrate 2 interposed therebetween.

As described above, when the positional relationship between the upper scribe position and the lower scribe position in the portion where the terminal is to be extended is constant, the number of the rollers 33 and the rollers 43 is reduced to one as in the present embodiment. It can reduce, and the structure of the cutting device 1 can be simplified.

In the above, several embodiments of the present invention have been described. As described above, the cutting device 1 according to the embodiment is a cutting device that cuts the plate-like member 2 in which the plate-like first member 21 and the second member 22 are bonded to each other. First cutting grooves 511 to 514 extending in the moving direction are formed in the first processing surface 211 by moving in contact with the first processing surface 211 opposite to the surface facing the two members 22. The cutting unit 32, one or more first moving units 33 that move in the moving direction while contacting the first processing surface 211 as the first cutting unit 32 moves, and the first member of the second member 22 The second cutting grooves 521 to 524 extending in the moving direction are formed in the second processing surface 221 by contacting the second processing surface 221 opposite to the surface opposite to the surface 21 and moving in the moving direction. The second cutting part 42 One or more second moving parts 43 that move in the moving direction while contacting the second processing surface 221 along with the movement of the second cutting part 42, and the second movement that is the same as the first cutting part 32 The portion 43 is opposed to the plate-like member 2, and the second cutting portion 42 and the one first moving portion 33 are opposed to each other via the plate-like member 2.

According to the above configuration, the second moving unit 43 receives the external force applied from the first cutting part 32 to the plate-like member 2, and the first moving part 33 receives the external force applied from the second cutting part 42 to the plate-like member 2. Since it receives, the bending of the plate-shaped member 2 can be suppressed. Accordingly, the first cutting grooves 511 to 514 can be formed perpendicular to the first processing surface 211, and the second cutting grooves 521 to 524 can be formed perpendicular to the second processing surface 221. It is possible to suppress the occurrence of defects such as burrs or chips in the shaped member 2. Further, the formation of the first cutting grooves 511 to 514 by the first cutting portion 32 and the formation of the second cutting grooves 521 to 524 by the second cutting portion 42 are performed simultaneously, so that the plate-like member 2 is formed. The time required for cutting can be shortened.

The cutting apparatus 1 according to the embodiment includes a first movement support unit 31 that moves in the moving direction while supporting the first cutting unit 32 and the first moving unit 33, the second cutting unit 42, and the first moving unit 33. You may further provide the 2nd movement support part 41 which moves to the said moving direction, supporting the 2 movement part 43. FIG.

According to the above configuration, since the first movement support part 31 supports the first cutting part 32 and the first movement part 33, the first cutting part 32 and the first movement part 31 are moved by moving the first movement support part 31. One moving part 33 can be moved in the same direction at the same speed. Similarly, since the second movement support part 41 supports the second cutting part 42 and the second movement part 43, the second cutting part 42 and the second movement part are moved by moving the second movement support part 41. 43 can be moved in the same direction and at the same speed.

The cutting device 1 according to the embodiment includes two each of the first moving unit 33 and the second moving unit 43, and the two first moving units 33 are juxtaposed in a direction intersecting the moving direction. And the first cutting part 32 is disposed between the two first moving parts 33 and faces one of the two second moving parts 43 via the plate-like member 2. The two second moving parts 43 are juxtaposed in a direction intersecting the moving direction, and the second cutting part 42 is disposed between the two second moving parts 43 and the two One of the first moving parts 33 faces the plate-like member 2.

According to the above configuration, even when the relative positional relationship in the direction intersecting the moving direction of the first cutting unit 32 and the second cutting unit 42 is changed, the first cutting unit 32 and the second moving unit 43 are The second cutting part 42 and the first moving part 33 can be opposed to each other via the plate-like member 2 via the plate-like member 2. Accordingly, the relative positions of the first cutting grooves 511 to 514 formed on the first processing surface 211 and the second cutting grooves 521 to 524 formed on the second processing surface 221 in the direction intersecting the moving direction. Even when the relationship is changed, the first cutting unit 32 (second cutting unit 42) and the second moving unit 43 (first movement) are not changed without changing the arrangement of the first moving unit 33 and the second moving unit 43. A cutting process in which the moving part 33) is opposed to each other via the plate-like member 2 can be performed.

In the cutting device 1 according to the embodiment, each of the first moving unit 33 and the second moving unit 43 may be a roller that rotates with movement in the moving direction. According to the above configuration, the first moving unit 33 and the second moving unit 43 can move smoothly while being in contact with the first processing surface 211 and the second processing surface 221.

In the cutting apparatus 1 according to the embodiment, the plate-like member 2 is a glass substrate formed by bonding two substrates, and the first cutting grooves 511 to 514 and the second cutting grooves 521 to 524 are used. May be a scribe groove.

The cutting method according to the embodiment is a cutting method in which the plate-like member 2 formed by bonding the plate-like first member 21 and the second member 22 is cut, and is opposed to the second member 22 in the first member 21. The first cutting portion 32 for forming the first cutting grooves 511 to 514 on the first processing surface 211 opposite to the surface to be processed, and the surface of the second member 22 facing the first member 21 The second moving portion 43 that moves while contacting the second processing surface 221 on the opposite side is opposed to the second processing surface 221 to form second cutting grooves 521 to 524 on the second processing surface 221. The first cutting unit 32 and the second cutting unit 42 are opposed to each other via the plate-like member 2 with the second cutting unit 42 for moving and the first moving unit 33 moving while contacting the first processing surface 211. Unit 42, first moving unit 33, and second moving unit 4. Are moved in the same direction at the same speed, so that the first cutting grooves 511 to 514 and the second cutting grooves 521 to 524 extending in the movement direction in the first cutting part 32 and the second cutting part 42 are provided. It is characterized by being formed simultaneously. According to the said structure, the effect similar to the cutting device 1 which concerns on embodiment is acquired.

The embodiment disclosed this time is to be considered as illustrative in all points and not restrictive. The scope of the present invention is not intended to include the above-described meaning, but is intended to include meanings equivalent to the scope of the claims and all modifications within the scope of the claims.
Moreover, as long as the effect of the present invention is obtained, the cutting device 1 may include components that are not disclosed in the first and second embodiments.
The constituent elements (technical features) disclosed in each embodiment can be combined with each other, and a new technical feature can be formed by the combination.

1 Cutting device 2 Glass substrate (plate-like member)
21 CF substrate (first member)
211 First processing surface 22 TFT substrate (second member)
221 2nd processing surface 31 Movement support part (1st movement support part)
32 Wheel cutter (first cutting part)
33 Roller (first moving part)
41 Movement support part (second movement support part)
42 Wheel cutter (second cutting part)
43 Roller (second moving part)
511 to 514 Scribe groove (first cutting groove)
521 to 524 Scribe groove (second cutting groove)

Claims

In a cutting device for cutting a plate-like member formed by laminating a plate-like first member and a second member,
A first cutting groove extending in the moving direction is formed in the first processing surface by moving in contact with the first processing surface opposite to the surface facing the second member of the first member. 1 cutting part,
One or more first moving parts that move in the moving direction while contacting the first processing surface along with the movement of the first cutting part;
A second cutting groove extending in the moving direction is moved in the second direction by contacting the second processing surface opposite to the surface facing the first member in the second member and moving in the moving direction. A second cutting portion formed on the surface;
And one or more second moving parts that move in the moving direction while contacting the second processing surface along with the movement of the second cutting part,
The first cutting part and the one second moving part are opposed to each other via the plate-like member,
The cutting apparatus, wherein the second cutting part and the one first moving part are opposed to each other via the plate-like member.
A first movement support section that moves in the movement direction while supporting the first cutting section and the first movement section;
The cutting apparatus according to claim 1, further comprising: a second movement support unit configured to move in the movement direction while supporting the second cutting unit and the second movement unit.
Two each of the first moving unit and the second moving unit,
The two first moving parts are juxtaposed in a direction intersecting the moving direction,
The first cutting part is disposed between the two first moving parts and is opposed to one of the two second moving parts via the plate-like member,
The two second moving parts are juxtaposed in a direction intersecting the moving direction,
The second cutting part is disposed between two second moving parts, and faces one of the two first moving parts via the plate-like member. The cutting device according to claim 1 or 2.
The cutting apparatus according to any one of claims 1 to 3, wherein each of the first moving unit and the second moving unit is a roller that rotates with movement in the moving direction.
The plate member is a glass substrate in which two substrates are bonded together,
The cutting device according to any one of claims 1 to 4, wherein the first cutting groove and the second cutting groove are scribe grooves.
In the cutting method of cutting the plate-like member formed by bonding the plate-like first member and the second member,
A first cutting portion for forming a first cutting groove on a first processing surface opposite to a surface facing the second member in the first member, and facing the first member in the second member The second moving part that moves while contacting the second processing surface opposite to the surface to be opposed is opposed to the plate-like member,
A second cutting portion for forming a second cutting groove on the second processing surface and a first moving portion that moves while contacting the first processing surface are opposed to each other via the plate-like member,
The first cutting unit, the second cutting unit, the first moving unit, and the second moving unit are moved in the same direction at the same speed, thereby moving the first cutting unit and the second cutting unit in the moving direction. The first cutting groove and the second cutting groove extending simultaneously are formed simultaneously.