JP2010052995A - Method for scribing mother substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a scribing method which hardly causes break in scribing. <P>SOLUTION: In the method for scribing a mother substrate, scribing along a line to be scribed in the Y direction of the mother substrate is performed by bringing a scribing wheel into pressure contact with the substrate and conveying the mother substrate side kept in the pressure contact state in the Y direction, and scribing along a line to be scribed in the X direction of the mother substrate is performed by moving the scribing wheel side kept in the pressure contact state in the X direction, whereby scribed lines in the crossing X and Y directions are formed. Such scribed lines are formed in the order of (a) scribing along each line to be scribed in the Y direction between unit display panels, (b) scribing along each line to be scribed in the X direction, and (c) scribing along each line to be scribed in the Y direction in the periphery of the mother substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to a method for scribing a mother substrate (also referred to as a bonded substrate or a bonded mother substrate) to which a glass substrate is bonded, and more specifically, a mother substrate including an edge material region to be discarded as an unnecessary portion at the periphery. It relates to the scribing method.
The substrate processing method of the present invention is specifically used for processing a unit display panel for a liquid crystal display panel.

  In a liquid crystal display panel, two large-area glass substrates are used, a color filter (Color Filter) is formed on one substrate, a liquid crystal driving TFT (Thin Film Transistor) on the other substrate, and an external connection Forming a terminal region for the purpose. Then, these two substrates are bonded to each other, a mother substrate in which liquid crystal is sealed is formed, and then divided into individual unit display panels (unit substrates for liquid crystal display panels). Panels are manufactured.

  In a mother substrate for a liquid crystal display panel, a first substrate (also referred to as a CF side substrate) on which a color filter is formed, and a second substrate (also referred to as a TFT side substrate) on which a TFT and a terminal region are formed Are attached with a sealant in between. Also, in order to form a terminal area between the periphery of the mother board or between the unit display panels, or to provide a buffer area between adjacent unit display panels, there is an end material area discarded after the division. It is formed.

  Generally, a scribing wheel is used in the process of cutting out the unit display panel from the mother substrate. In that case, first, a scribe line is formed by moving the scribing wheel relative to the two substrates (CF side substrate and TFT side substrate) constituting the mother substrate while pressing the scribing wheel along the respective scribe lines. To do.

  Subsequently, after scribe lines are formed on all scribe lines on the mother substrate, breaks are applied along each scribe line by applying force (mechanical break) or by applying heated steam (steam). Breaking is performed to completely divide the mother substrate into unit display panels. Then, the separated unit display panels are transferred to the subsequent process by the transfer robot. If necessary, after the unit display panel is transferred, the remaining offcuts are crushed.

  A substrate processing system is disclosed in which a series of processing of a mother substrate is simultaneously performed on two upper and lower surfaces, and an efficient processing is performed without inverting a large-area substrate (see Patent Document 1). ).

  The substrate processing system described in Patent Document 1 will be briefly described. In this system, the scribing mechanism that performs scribing using the scribing wheel and the break mechanism that performs steam break and mechanical break are provided at different positions, and the mother substrate is separated from the position of the scribing mechanism by the substrate transport mechanism. It is intended to be transferred to the position. The transport direction by this substrate transport mechanism is defined as the Y direction.

  The scribe mechanism simultaneously scribes two mother boards from the vertical direction with a pair of upper and lower scribing wheels. Since the unit display panel is generally rectangular, the mother substrate is scribed along two directions orthogonal to each other. In the scribe mechanism, one of these two directions is matched with the Y direction which is the transport direction of the substrate transport mechanism, and the other direction is the X direction orthogonal to the Y direction. Thereby, in the Y direction, scribing is performed while moving the mother substrate in the Y direction using the substrate transport mechanism.

  For example, FIG. 8 shows an example of a typical mother board. Unit display panels P are arranged in three rows vertically and horizontally on the mother substrate M, and the TFT side substrate G2 of each unit display panel P is provided with terminal regions T on two sides. An end material region S is formed at the boundary between adjacent unit display panels P (including the CF-side substrate G1 at a position covering the terminal region T) and the outer peripheral portion of the mother substrate M. When the mother substrate M is placed on the substrate transport mechanism of this system, two sides of the rectangular unit display panel P are oriented in the X direction and the other two sides are oriented in the Y direction.

FIG. 9 is a diagram showing the positions of the scribe planned lines set on the TFT side substrate G2 of the mother substrate M when each unit display panel P is cut out from the mother substrate M. Two scribe lines (Y1, Y6) along the Y direction and two (X1, X6) along the X direction are set on the periphery of the mother substrate M (TFT side substrate G2). Further, in the central portion of the mother substrate M (TFT-side substrate G2), there are two each between adjacent unit display panels P, four along the Y direction (Y2, Y3, Y4, Y5), in the X direction. Four scribe lines (X2, X3, X4, X5) are set along the line. The position of the CF side substrate G1 is shifted by the width of the terminal region T, but the description is omitted because the scribe line is set with substantially the same arrangement.
Therefore, when each unit display panel P is cut out from the mother substrate M, scribing is performed a plurality of times in the X direction and the Y direction.

In this system, for scribing in the Y direction, the scribing wheel is positioned on each scribe line in the Y direction, the cutting edge is directed in the Y direction, and the mother substrate is reciprocated in the Y direction by the substrate transport mechanism described above. Scribing is performed accordingly. On the other hand, for scribing in the X direction, scribing is performed by driving a scribing wheel moving mechanism (attached to the scribing mechanism) that scans the scribing wheel in the X direction. That is, the scribing process is performed by aligning the position of the scribing wheel with each scribe line in the X direction, turning the cutting edge in the X direction, and reciprocating the scribing wheel in the X direction by the scribing wheel moving mechanism.
WO2005 / 087458

  In the substrate processing system described above, scribing is performed by moving the scribing wheel in the X direction, and scribing is performed by moving the mother substrate in the Y direction.

  In the cross-cut portion where the scribe lines in the X direction and the Y direction intersect, the inventors of the present invention have cracks (vertical cracks) formed in the thickness direction of the substrate along the scribe lines in the previously scribed direction. It has been found that the pressure applied during scribing may extend further deep, and the vertical crack may break through the substrate. Originally, all the scribe lines must be formed and then a break must occur at a predetermined position (break process), but if a break occurs first, the substrate is transferred and separated thereafter. This may hinder the removal and removal of (milling materials, etc.). Therefore, in the process management, it becomes a problem to prevent the break from occurring during the scribe.

  In this regard, until now, as shown in FIG. 11, the Y-direction scribe (Y1 to Y6) is performed first, and then the X-direction scribe (X1 to X6) is performed thereafter. The reason is that if the X-direction scribing is performed first, the scribing is performed while reciprocating the substrate in the Y-direction when the Y-direction scribing is performed later. It is inevitable that a frictional force acts between the transport mechanism and the substrate surface during the transport of the substrate in the Y direction. If the scribe line in the X direction is formed first, the force acts in the direction of further expanding the vertical crack groove formed along the scribe in the X direction due to the influence of friction during conveyance. When the frequency of conveyance increases, the break may occur along the scribe line in the X direction.

On the other hand, if the scribing in the Y direction is performed first, it is not necessary to greatly reciprocate the substrate in the Y direction by the transport device when scribing in the X direction later. Therefore, when scribing in the X direction, no force acts in the direction of spreading the vertical cracks formed along the scribe line in the Y direction, so that there is almost no occurrence of break due to conveyance.
Therefore, the Y direction in which the substrate is transported is scribed first, and then the scribing wheel is moved in the X direction to scribe in the X direction, thereby preventing the occurrence of breaks due to the reciprocal transport of the substrate in the Y direction. .

  By the way, recent liquid crystal display panels are required to reduce the weight of glass substrates. For this reason, the thickness of the two glass substrates (CF side substrate and TFT side substrate) constituting the liquid crystal display panel is reduced to reduce the weight. The thickness of the substrate used for the liquid crystal display panel so far has been about 0.7 mm, but recently it has been shifted to 0.5 mm and 0.3 mm, and in the future 0.2 mm, There is a tendency to become thinner and thinner at 0.1 mm and 0.05 mm.

In scribing using a scribing wheel, when the thickness of the substrate is reduced, vertical cracks formed along the scribe line are likely to penetrate the substrate, so that a problem of breaking occurs easily.
In the substrate processing system described above, the inventor scribes in the Y direction, which is the substrate transport direction, with the same pressure contact force as before, when the substrate thickness is reduced to 0.5 mm or less, and later in the X direction. It has been found that there is a problem that a break occurs along the scribe line in the Y direction. In particular, among the scribe lines in the Y direction, when a break occurs on the scribe lines (the scribe lines at both ends) on the periphery of the mother substrate, a problem that the end material falls occurs.

  Therefore, the present invention scribes the mother substrate by moving the scribing wheel in the X direction, and forms a plurality of scribe lines in the mother substrate by moving the mother substrate by the substrate transport mechanism in the Y direction. At the time of finishing all the scribe lines in the X direction and the Y direction (before breaking at a predetermined position (breaking step)), some scribe lines (especially in the Y direction on the peripheral edge of the substrate) It aims at reducing the malfunction which a break generate | occur | produces.

In order to solve the above-described problems, the present invention is designed to suppress the occurrence of breaks particularly in the Y-direction scribe lines on the periphery of the substrate by devising the order in which the scribe lines are scribed.
That is, in the scribing method of the present invention, the unit display panels are arranged side by side in the X direction and the Y direction of the mother substrate to be processed, and in the X direction or the Y direction between the unit display panels and on the periphery of the mother substrate. A scheduled scribe line is set.
The scribing with respect to the Y-direction scribe line of the mother substrate is performed by conveying the mother substrate side in the Y direction in a pressure contact state. Further, the scribing of the mother substrate with respect to the scribe line in the X direction is performed by moving the scribing wheel side in the X direction in a pressure contact state.
In the present invention, (a) a scribe with respect to a Y-direction scribe line between the unit display panels, (b) a scribe with respect to an X-direction scribe line, and (c) a Y-direction in the periphery of the mother substrate. The scribe lines are formed in the order of the scribe lines with respect to the scheduled scribe lines, and the scribe lines in the X direction and the Y direction intersecting each other are formed.
The present invention is more effective particularly when the mother substrate has a thickness of 0.05 mm or more and 0.5 mm or less.

According to the present invention, first, scribing in the Y direction is performed by pressing the scribing wheel against the mother substrate and transporting the mother substrate side in the Y direction. At this time, scribing is performed on the Y-direction scribe line between the unit display panels in the central portion of the mother substrate, and no scribing is performed on the Y-direction scribe line on the periphery of the mother substrate.
Subsequently, scribing in the X direction is performed by pressing the scribing wheel side against the substrate and moving in a pressed state in the X direction. In the Y-direction scribe line formed earlier, the crossing portion is pressed into contact when the X-direction scribe is performed, and a vertical crack in the vicinity of the scribe line is extended. Since it is moved in the X direction, the force to deeply extend the vertical crack formed along the Y-direction scribe line due to the movement of the substrate does not work, so the possibility that a break will occur along the Y-direction scribe line is low. .
In addition, since the scribe line in the Y direction at the periphery of the mother board has not yet been scribed at this time, if it is broken, the scribe line in the Y direction scribe line at the periphery, which is likely to cause inconvenience such as falling off of the end material, etc. A break does not occur.
Subsequently, in a state where the scribing wheel is again in pressure contact with the mother substrate, the mother substrate side is transported in the Y direction, thereby scribing the scribe line in the Y direction at the periphery of the mother substrate. Since the central portion excluding the peripheral edge of the mother substrate has already been scribed in the Y direction, the central portion of the scribe line in the X direction is not pressed later.
Since the Y-direction scribe line in the periphery of the mother substrate is pressed, it is conceivable that the vertical crack formed along the X-direction scribe line near the periphery at this time extends in the vicinity of the periphery. However, in the central part (other than the periphery) of the X-direction scribe line, the Y-direction scribe is performed before the X-direction scribe is performed, and the Y-direction scribe is not performed later, so that the vertical crack is extended. do not do. After scribing in the X direction, the substrate is conveyed in the Y direction for scribing in the Y direction at the periphery, so that the force that extends the vertical crack formed along the scribe line in the X direction works. Only the scribe line is formed, the number of reciprocations is minimal (at most twice), and the risk of occurrence of a break along the scribe line in the X direction is minimized. Eventually, as a comprehensive evaluation, the situation is such that it is difficult to break both in the X direction and in the Y direction (the situation in which the risk of the vertical crack extending until it breaks is minimized).

  Thus, the scribe line in the X direction is likely to be in a break state due to the conveyance of the substrate during the scribe in the Y direction, and among these, the scribe in the Y direction at the center portion of the substrate is performed before the scribe in the X direction. Therefore, the center part of the substrate is not pressed by the Y-direction scribe after scribing, and the Y-direction scribe line at the peripheral edge is scribed at the end so that it is not pressed after the scribing. To prevent the growth of cracks formed.

  According to the present invention, by performing scribing in the order of the Y-direction scribe line in the central portion of the substrate excluding the periphery (that is, between the unit display panels), the X-direction scribe line, and the Y-direction scribe line in the periphery, In both the X direction and the Y direction, it is possible to reduce the occurrence of a break at a position other than a predetermined position (break process). As a result, it is possible to effectively prevent the occurrence of inconvenience such as dropping of the end material along the Y-direction scribe line on the peripheral edge of the substrate, which is particularly problematic in the process.

  Hereinafter, an embodiment of a mother substrate scribing method according to the present invention will be described with reference to the drawings. The scribing method described below is used in the manufacturing process of a liquid crystal display panel.

(Board processing system)
First, an example of a substrate processing system used when carrying out the scribing method of the present invention will be described.
FIG. 1 is a perspective view showing the overall configuration of a substrate processing system 1 in which the substrate processing method of the present invention is used. FIG. 2 is a perspective view (excluding a platform 10 described later) of FIG. FIG. 3 is a plan view of the substrate processing system 1 (excluding a frame 11 and a column 14 described later). 4 is a sectional view taken along the line BB ′ of FIG. 3, FIG. 5 is a sectional view taken along the line CC ′ of FIG. 3, FIG. 6 is a sectional view taken along the line DD ′ of FIG. FIG.

  Here, a case will be described in which a mother substrate 90 (same as the mother substrate M in FIG. 8) in which unit display panels are arranged in three rows in the X direction and three rows in the Y direction is described. The XYZ directions used in the description are shown in the figure.

First, the overall structure of the system will be described.
The substrate processing system 1 is configured such that the mother substrate 90 is transported in the Y direction from the substrate carry-in side 1L to the substrate carry-out side 1R, and scribe processing and break processing are performed on the way.
The mother substrate 90 is placed so that the upper side is the second substrate G2 (TFT side substrate) and the lower side is the first substrate G1 (CF side substrate).

In the substrate processing system 1, a frame structure is formed by the hollow frame 10, the main frame 11, and the support column 14. A substrate support device 20 for supporting the mother substrate 90 is disposed above the gantry 10. The substrate support apparatus includes a first substrate support portion 20A located on the substrate carry-in side and a second substrate support portion 20B located on the substrate carry-out side. A scribe mechanism 30 is disposed at an intermediate position between the first substrate support portion 20A and the second substrate support portion 20B.
As shown in FIG. 4 (cross-section BB ′ in FIG. 3), each of the first substrate support portion 20A and the second substrate support portion 20B includes five support units 21 arranged in the X direction. . Each support unit 21 is fixed to the gantry 10 on the side close to the scribe mechanism 30. A timing belt rotates around the upper surface of each support unit 21 and conveys the mother substrate 90 in the Y direction in conjunction with a clamp device 50 described later.

The scribe mechanism 30 is provided with an upper guide rail 31 positioned above the mother substrate 90 supported on the substrate support device 20 and a lower guide rail 32 positioned below, and the upper guide rail 31 moves in the X direction. The upper scribe mechanism 60 and the lower guide rail 32 that can be attached are respectively attached with a lower scribe mechanism 70 that is attached so as to be movable in the X direction.
As shown in FIG. 5 (cross-section CC ′ in FIG. 3), the upper scribing mechanism 60 has a second scribing wheel W2 attached to the lower end and an elevating mechanism 61 that raises and lowers the second scribing wheel W2, and a second scribing mechanism. A rotation mechanism 62 that allows the cutting edge direction of the wheel W2 to rotate within the XY plane, and an X-axis drive mechanism 63 that moves in the X direction along the upper guide rail 31 are provided.
The lower scribing mechanism 70 has a first scribing wheel W1 attached to the upper end, an elevating mechanism 71 that moves the first scribing wheel W1 up and down, a rotating mechanism 72 that allows the cutting edge direction of the first scribing wheel to rotate within the XY plane, An X-axis drive mechanism 73 for moving in the X direction along the lower guide rail is provided.
As the elevating mechanisms 61 and 71, for example, a pressing mechanism (scribe head) using an air cylinder, a servo motor, or a linear motor can be exemplified. As the rotation mechanisms 62 and 72, for example, a joint mechanism using a ball bearing can be exemplified. For example, the substrate and the scribing wheel are structured by displacing the position of the horizontal rotating shafts (pins) of the scribing wheels W1 and W2 with respect to the vertical rotating shafts of the rotating mechanisms 62 and 72 in the horizontal plane. The direction of the cutting edge of the scribing wheel is equivalent to the scribing direction in accordance with relative movement (conveyance of the substrate in the Y direction, movement of the scribing wheel in the X direction). Examples of the X-axis drive mechanisms 63 and 73 include a mechanism using a servo motor and a ball screw, and a linear motor mechanism.
As the scribing wheels W1 and W2, for example, a scribing wheel or a cutter wheel disclosed in WO2007 / 004700A1 and JP-A-9-188534 can be used. That is, the outer peripheral edge portion where the bottom portions of the two truncated cones sharing the rotation axis intersect and a circumferential ridge line is formed, and a plurality of notches (grooves) alternately formed in the circumferential direction along the circumferential ridge line. ) And a protrusion, and the protrusion is constituted by a portion of a circumferential ridge line having a length in the circumferential direction, in which the circumferential ridge line is notched (a groove is formed in the circumferential ridge line) and remains. A scribed scribing wheel (cutter wheel) can be used.

  As shown in FIG. 1 or FIG. 2, a clamp device 50 that clamps the end of the mother substrate 90 on the substrate carry-in side (the rear end of the mother substrate 90) is disposed on the substrate carry-in side 1 </ b> L side of the substrate support device 20. The The clamp device 50 includes a pair of clamp tools 51 (51L, 51R), an elevating mechanism 55 (55L, 55R) for moving the clamp tools 51 up and down, and a moving base 57, and moves the mother substrate 90 in the Y direction in a clamped state. . The clamp device 50 is driven by a linear motor mechanism 58. And it moves so that it may pass through the scribe mechanism 30 to the rear end of the mother board | substrate 90, with the state which clamped the mother board | substrate 90 by moving the clearance gap and the downward direction of the support unit 21. The clamp tool 51L and the clamp tool 51R are configured to clamp the left column and the right column of the unit display panel formed on the mother substrate 90, respectively.

  On the substrate carry-out side 1R of the substrate support device 20, as shown in FIG. 6 (cross-section DD ′ in FIG. 3), an upper steam unit 101 that blows heated steam on the mother substrate 90 sent from above, A steam break device 100 having a lower steam unit 102 sprayed from below is arranged. The active breaking process of extending the vertical crack formed along the scribe line in the thickness direction of the substrate by passing the scribe-processed mother substrate 90 between the heated steam sprayed from the steam breaking device 100. Done. The steam breaker 100 can be moved in the Y direction by a linear motor mechanism 130.

  At the position of the substrate unloading side 1R of the steam breaker 100, as shown in FIG. 7 (cross-section EE ′ in FIG. 3), the substrate unloading is performed by taking out the unit display panels one by one from the mother substrate 90. A device 120 is arranged. There is no limitation in particular about the structure of a board | substrate carrying-out apparatus, For example, the robot hand provided with the mechanism for adsorb | sucking a unit display panel at the front-end | tip can be illustrated. For example, in the substrate carry-out device, an upper guide rail 121 is provided above the placement position of the mother substrate 90 after scribing, and a carry robot 80 that can move in the X direction along the upper guide rail 121 is attached. The carry-out device 120 can be exemplified. The upper guide rail 121 of the substrate carry-out device 120 can be moved in the Y direction by a linear motor 130, for example.

The carry-out robot 80 includes a plate 83 to which the suction pad 82 is attached, a rotation mechanism 84 that rotates the plate 83, an elevating mechanism 85 that raises and lowers the plate 83, and an X-axis drive mechanism 86. The unloading robot 80 sucks one of the unit display panels separated from the mother substrate 90 and pulls it upward. Further, the unit display panel that has been separated is moved in the X-axis direction while rotating, and further moved in the Y-direction by the linear motor 130 to carry out one by one. The unloaded unit display panel is transferred to a subsequent process (not shown), and the next processing is performed.
A crush device for crushing the remaining scrap after the unit display panel is carried out may be arranged on the substrate carry-out side 1R of the substrate carry-out device 120.

(Scribe method)
Next, a method for scribing the mother substrate 90 according to the present invention will be described.
When scribing the mother substrate 90 in the Y direction, the X-axis drive mechanisms 63 and 73 of the scribe mechanism 30 (upper scribe mechanism 60 and lower scribe mechanism 70) are used to scribe the scribing wheels W1 and W2 on the scribe line. Move to the start position. The scribing wheels W1, W2 are pressed against the substrate surface by the lifting mechanisms 61, 71. The substrate support device 20 and the clamp device 50 scribe the mother substrate 90 by reciprocating it in the Y direction. At this time, the cutting edges of the scribing wheels W1, W2 are driven in the Y direction by the rotating mechanisms 62, 72.

  When scribing in the X direction, the substrate 90 is transported by the substrate support device 20 and the clamp device 50 so that the scribing wheels W1 and W2 are positioned at the scribe start position on the scribe line. The scribing wheels W1, W2 are pressed against the substrate surface by the lifting mechanisms 61, 71. Then, scribing is performed by moving the scribing wheels W1 and W2 in the X direction by driving the X-axis drive mechanisms 63 and 73. At this time, the cutting edges of the scribing wheels W1, W2 are driven in the X direction by the rotating mechanisms 62, 72.

  FIG. 9 is a diagram showing the order of scribing with respect to the X-direction and Y-direction scribing lines set on the mother board 90. Although the TFT side substrate G2 will be described here, the CF side substrate G1 is also scribed in the same order with respect to the corresponding scribe line.

  First, among the scribe lines in the Y direction, the scribe lines Y2, Y3, Y4, and Y5 set between the adjacent unit display panels P other than the scribe lines Y1 and Y6 on the periphery of the mother substrate 90. Do a scribe. The order between Y2 and Y5 may be arbitrary.

  Next, scribing is performed for the scheduled scribe lines X1, X2, X3, X4, X5, and X6 in the X direction. In addition, the order between X1-X6 may be arbitrary. At this time, since the scribe lines Y1 and Y6 are not scribed, there is no occurrence of problems such as falling off of the end material at this portion.

  Next, scribing is performed for Y1 and Y6 in the Y-direction scribe line. The order between Y1 and Y6 may be arbitrary. At this time, at the intersections with X1 to X6, the X-direction scribe lines of these portions are pressed again when scribes Y1 and Y6. At that time, since the substrate is reciprocated in the Y direction, a force may be exerted to spread the vertical cracks formed along the scribe line in the X direction. Therefore, the vertical crack formed along the scribe line in the X direction may extend deep near the intersection of Y1 and Y6, but the scribe line in the X direction is not pressed in the vicinity of the intersection with Y2 to Y5. Vertical cracks formed along the line do not extend. Therefore, the occurrence of a break along the X-direction scribe line can be prevented by suppressing the extension of the vertical crack at the center portion of the scribe line.

  By scribing according to the above procedure, the possibility of breaking during scribing can be reduced.

  The scribing method of the present invention can be used for scribing a mother substrate for a liquid crystal panel.

The perspective view which shows the whole structure of the board | substrate processing system used with the scribing method of this invention. FIG. 2 is a perspective view of the substrate processing system of FIG. The top view of the board | substrate processing system of FIG. B-B 'sectional drawing of FIG. C-C 'sectional drawing of FIG. D-D 'sectional drawing of FIG. E-E 'sectional drawing of FIG. The figure which shows an example of a mother board | substrate. The figure which shows the scribe plan line set to the mother board | substrate of FIG. The figure which shows the scribe order in the scribe method of this invention. The figure which shows the scribe order in the conventional scribe method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate processing system 20 Substrate support device 30 Substrate cutting mechanism 50 Clamp device 60 Upper scribe mechanism 70 Lower scribe mechanism 80 Unloading robot 90 Mother substrate 100 Steam break device 120 Substrate unloader G1 First substrate (CF side substrate)
G2 Second substrate (TFT side substrate)
S End material region T Terminal region

Claims (2)

Unit display panels are arranged side by side in the X and Y directions of the mother substrate to be processed, and scribe lines along the X or Y direction are set between the unit display panels and at the periphery of the mother substrate. ,
The scribing for the Y-direction scribe line of the mother substrate is performed by conveying the mother substrate side in the Y direction in a pressure contact state,
The scribing of the mother board against the scribe line in the X direction is performed by moving the scribing wheel side in the X direction while being pressed.
A mother substrate scribing method for forming scribe lines in the X direction and the Y direction intersecting each other,
(A) A scribe to a scribe line in the Y direction between the unit display panels;
(B) A scribe to the scribe line in the X direction,
(C) A method for scribing a mother substrate, in which scribe lines are formed in the order of scribe to a scribe line in the Y direction at the periphery of the mother substrate.   The scribing method according to claim 1, wherein the mother substrate has a thickness of 0.05 mm or more and 0.5 mm or less.

Images