JP4904036B2 - Substrate cutting system - Google Patents

Description

  The present invention relates to a substrate cutting system used for cutting various substrates such as a mother substrate such as a glass substrate used in a display panel such as a liquid crystal display device, and in particular, a pair of brittle material substrates are mutually connected. The present invention relates to a substrate cutting system that can be suitably used for dividing bonded bonded mother substrates.

  A display panel such as a liquid crystal display device is usually formed using a glass substrate which is a brittle material substrate. A display panel of a liquid crystal display device is configured by bonding a pair of glass substrates together by forming an appropriate gap and enclosing liquid crystal in the gap.

  When such a display panel is manufactured, the mother glass substrate is divided into a plurality of divided glass substrates by dividing the bonded mother substrate to which the mother glass substrate is bonded. A scribing device used for cutting a bonded mother substrate is disclosed in Japanese Utility Model Publication No. 59-22101 (Patent Document 1).

  FIG. 6 is a schematic configuration diagram of the scribing apparatus. The scribing device 950 includes tables 951 on which the side edge portions on both sides of the bonded mother substrate 908 are respectively placed. A clamp tool 952 for clamping each side edge of the bonded mother substrate 908 is attached to the table 951. The scribing device 950 includes cutter heads 953 and 954 provided above and below the bonded mother substrate 908, respectively. The cutter heads 953 and 954 are in a state of facing each other with the bonded mother substrate 908 interposed therebetween.

In the scribing apparatus 950 having such a configuration, when the bonded mother substrate 908 is fixed to the respective tables 951 by the respective clamps 952, the upper side of the bonded mother substrate 908 is configured by the pair of cutter heads 953 and 954. The substrate and the lower substrate are simultaneously scribed to form a scribe line.
Japanese Utility Model Publication No.59-22101

  However, in such a scribe device 950, the bonded mother substrate 908 on which the scribe line is formed is not completely divided, so it is necessary to transport the bonded mother substrate 908 to the dividing step and divide by the dividing device (break device). . However, when the bonded mother substrate 908 formed with the scribe line is transferred to the cutting apparatus, if the bonded mother substrate 908 is stressed, the bonded mother substrate 908 may be cut along the scribe line. . In this case, since a uniform stress is not applied to the bonded mother substrate 908, the bonded mother substrate 908 is not divided into a state along the scribe line throughout the scribe line, and is not chipped or cracked. May occur.

  By setting the bonded mother substrate to a system that automatically performs the dividing process continuously after the scribe process, the dividing work efficiency of the bonded mother substrate is remarkably improved. However, in this case as well, when the bonded mother substrate is transported to the cutting process when the bonded mother substrate on which the scribe line is formed is subjected to stress, the bonded mother substrate is completely in a state along the scribe line. There is a risk that it will not be divided.

  Further, by transporting the bonded mother substrate in the same posture from the scribing process to the cutting process, it is not necessary to position the bonded mother board in the cutting process, thereby significantly improving the work efficiency. However, there is a problem that the posture of the bonded mother substrate changes when the bonded mother substrate cannot be stably supported during the transfer of the bonded mother substrate. In this case, it is necessary to position the bonded mother substrate in the dividing step, and work efficiency is reduced.

  Such a problem occurs not only in the bonded mother substrate but also in the case of a substrate constituted by a single plate. In particular, in the case of a mother glass substrate composed of a single plate having a large area and a small thickness, the mother glass substrate itself is easily bent, and stress is easily applied during transportation, so that a scribe line is formed. The mother glass substrate may be easily cut off due to chipping or cracking.

  Further, in the case of a mother glass substrate having a large area and a small thickness, as described above, since it bends easily, even in a state where no scribe line is formed, it can be stably conveyed. If not supported, there is a risk of cracking, chipping and the like.

  The present invention solves such a problem, and its purpose is to stably transport various mother substrates without causing cracks, chips, etc., and to significantly improve the cutting work efficiency. An object of the present invention is to provide a substrate cutting system that can be used.

In the substrate cutting system according to the present invention, a substrate on which a scribe line is formed is placed, a first substrate support unit that transports the placed substrate, and the substrate transported by the first substrate support unit. A second substrate support unit to which the substrate is transferred, and a scribe line of the substrate is positioned between the first substrate support unit and the second substrate support unit, thereby facing the scribe line. And a substrate cutting system including a cutting unit that divides the substrate along the scribe line, wherein the first substrate support unit is provided by a plurality of belt conveyors having a flat belt. It is configured, clamping means for clamping the side edge portions of the carry-in side of the substrate, along the gap between the flat belt of the plurality of belt conveyors, prior The plurality of belt conveyors are provided so as to be movable in the substrate conveyance direction, and are driven so that the rotation speed of each flat belt is the same as the movement speed of the substrate that is clamped and conveyed by the clamping means. It is characterized by Rukoto.

  Preferably, the second substrate support unit is constituted by a belt conveyor having a flat belt.

  In the substrate cutting system of the present invention, the substrate on which the scribe line is formed can be stably conveyed by the belt conveyor having a flat belt, so that the substrate is divided at the time of conveyance, and cracks, chips, etc. are surely generated. Can be prevented. In addition, since the substrate transported by the first substrate support unit is stably transferred to the second substrate support unit, the side edge of the substrate is divided so that the two substrate support units are separated from each other. It is also possible to prevent falling.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  1 is a schematic perspective view showing an example of an embodiment of a substrate cutting system according to the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is a side view thereof. The substrate cutting system 100 of the present invention includes a mother substrate that is divided into a plurality of substrates, a single substrate such as a metal substrate such as a steel plate, a wooden plate, a plastic substrate and a ceramic substrate, a brittle material substrate such as a semiconductor substrate, and a glass substrate. Used to divide the “substrate”. Further, the present invention is not limited to such a single plate, but is also used for dividing a bonded substrate obtained by bonding a pair of substrates together and a laminated substrate obtained by stacking a pair of substrates.

  In the following, a case will be described in which a bonded mother substrate is divided into a plurality of divided bonded substrates by the substrate cutting system of the present invention.

  As shown in FIG. 1, the substrate cutting system 100 of the present invention has a hollow rectangular parallelepiped base 81. The gantry 81 extends in a straight line. The direction in which the gantry 81 extends long is defined as the Y direction, the direction orthogonal to the Y direction in the horizontal plane is defined as the X direction, and the vertical direction is defined as the Z direction.

  On the upper surface of the gantry 81, a first substrate support unit 10 that supports a bonded mother substrate 90 (see FIG. 2), which is transported to the substrate cutting system 100 by a transport robot, in a horizontal state and transports the substrate in the Y direction. And a second substrate support unit 20 that is disposed downstream of the one substrate support unit 10 in the transport direction and onto which the bonded mother substrate 90 transported by the first substrate support unit 10 is transferred in a horizontal state. Yes. Between the first substrate support unit 10 and the second substrate support unit 20, a bonded mother substrate 90 supported in a horizontal state by the first substrate support unit 10 and the second substrate support unit 20 is disposed along the X direction. A scribing unit 50 for scribing is provided. The second substrate support unit 20 is configured to transport the bonded mother substrate 90 scribed by the scribe unit 50 in the Y direction.

  On the downstream side of the second substrate support unit 20 in the transport direction, the bonded mother substrate 90 after scribing transported by the second substrate support unit 20 is transferred and transported along the Y direction. The fourth substrate support unit 40 on which the bonded mother substrate 90 transferred by the third substrate support unit 30 is transferred is provided on the downstream side in the transfer direction of the third substrate support unit 30. Yes.

  Between the third substrate support unit 30 and the fourth substrate support unit 40, the bonded mother substrate 90 after scribing supported in a horizontal state by the third substrate support unit 30 and the fourth substrate support unit 40 is X. A cutting unit 60 is provided for cutting along the direction. The fourth substrate support unit 40 is capable of transporting the cut and bonded substrate 91 cut by the cutting unit 60 in the Y direction.

  A substrate carry-out unit 70 is provided on the downstream side in the transport direction of the fourth substrate support unit 40, and the divided bonded substrate 91 placed on the fourth substrate support unit 40 is connected to the fourth substrate support unit 40. The substrate is carried on a carry-out table 82 provided on the side of the gantry 81 in the Y direction by the substrate carry-out unit 70 provided on the downstream side in the transfer direction.

  4 is a perspective view of the first substrate support unit 10, and FIG. 5 is a cross-sectional view thereof. The first substrate support unit 10 includes, for example, four belt conveyors 11 that are arranged along the Y direction. Each belt conveyor 11 is arranged side by side with the adjacent belt conveyor 11 so that the gap in the X direction is about several centimeters to several millimeters. Each belt conveyor 11 is wound around a drive pulley 11a disposed on the downstream side in the transport direction, a driven pulley 11b (see FIG. 4) disposed on the downstream side in the transport direction, and the drive pulley 11a and the driven pulley 11b. The drive pulleys 11a are synchronously and integrally driven by a single drive motor 12 with a flat belt 11c. The flat belt 11c is made of, for example, aramid fibers and has a width of about 150 mm, and the surface thereof is coated with a fluororesin.

  As shown in FIG. 1, the second substrate support units 20 arranged on the downstream side in the transport direction of the first substrate support unit 10 are four units each extending along the Y direction, like the first substrate support unit 10. The belt conveyor 21 is provided. As shown in FIG. 4, each belt conveyor 21 has the same configuration as each belt conveyor 11 of the first substrate support unit 10, and includes a drive pulley 21a disposed on the downstream side in the transport direction, and a transport direction. It has a driven pulley 21b disposed on the downstream side, and a flat belt 21c wound around the driving pulley 21a and the driven pulley 21b. Each drive pulley 21a is integrally rotated by a single drive motor 22 in synchronization. The flat belt 21c is made of, for example, aramid fibers and has a width of about 150 mm, and the surface thereof is coated with a fluororesin.

  The dividing unit 50 provided between the first substrate support unit 10 and the second substrate support unit 20 is bonded to the first substrate support unit 10 and the second substrate support unit 20 so as to be horizontally supported in a erected state. An upper guide rail 51 and a lower guide rail 52 are provided above and below the mother board 90, respectively, along the X direction. An upper scribe device 53 is provided on each of the upper guide rail 51 and the lower guide rail 52. The lower scribing device 54 is provided to be movable along the X direction.

  Each of the upper scribe device 53 and the lower scribe device 54 is provided with a cutter head having a cutter wheel. For example, as disclosed in JP-A-9-188534, the cutter wheel has a cutting edge protruding so that the central portion in the width direction has an obtuse V shape, and a predetermined cutting edge is formed on the cutting edge. The projections having a height of 5 are formed at a predetermined pitch in the circumferential direction.

  The lower scribing device 54 has the same configuration as the upper scribing device 53 and is arranged in a state where the vertical direction is inverted.

  The cutter wheel of the upper scribe device 53 is pressed against the upper surface of the bonded mother substrate 90, and the cutter wheel of the lower scribe device 54 is also pressed into the lower surface of the bonded mother substrate 90. Then, the scribe line is formed on the bonded mother substrate 90 by simultaneously moving the upper scribe device 53 and the lower scribe device 54 in the same direction with the respective cutter wheels facing each other.

  Similarly to the first substrate support unit 10, the third substrate support unit 30 disposed on the downstream side in the transport direction of the second substrate support unit 20 also includes four belt conveyors 31 that extend along the Y direction. ing. As shown in FIG. 4, each belt conveyor 31 has the same configuration as each belt conveyor 11 of the first substrate support unit 10, and includes a drive pulley 31a disposed on the downstream side in the transport direction, and a transport direction. It has a driven pulley 31b disposed on the downstream side, and a flat belt 31c wound around the driving pulley 31a and the driven pulley 31b. Each drive pulley 31a is synchronously and integrally driven by a single drive motor 32. The flat belt 31c has a width of about 150 mm made of aramid fibers, for example, and the surface thereof is coated with a fluororesin.

  The cutting unit 60 provided between the third substrate support unit 30 and the fourth substrate support unit 40 completely cuts the bonded mother substrate 90 scribed by the scribe unit 50, and the bonded mother An upper steam spray unit 61 (see FIG. 3) for spraying steam on the upper mother substrate forming the substrate 90, and a lower steam spray unit 62 (see FIG. 3) for spraying steam on the lower mother substrate in the bonded mother substrate 90. And have. The upper steam spraying part 61 is located above and below the bonded mother substrate 90 supported in a horizontal state by the third substrate support unit 30 and the fourth substrate support unit 40, respectively. Each of the guide rails 63 and 64 (see FIG. 3) is attached to be slidable in the X direction.

  As shown in FIG. 1, the fourth substrate support unit 40 arranged on the downstream side in the transport direction of the third substrate support unit 30 also has four units each extending along the Y direction, like the first substrate support unit 10. The belt conveyor 41 is provided. As shown in FIG. 4, each belt conveyor 41 has the same configuration as each belt conveyor 11 of the first substrate support unit 10, and includes a drive pulley 41a disposed on the downstream side in the transport direction, and a transport direction. A driven pulley 41b disposed on the downstream side, and a flat belt 41c wound around the driving pulley 41a and the driven pulley 41b are provided. Each drive pulley 41a is integrally rotated by a single drive motor 42 in synchronization. The flat belt 41c is made of, for example, aramid fibers and has a width of about 150 mm, and the surface thereof is coated with a fluororesin.

  When the divided bonded substrate 91 divided by the dividing unit 60 is placed on the fourth substrate support unit 40, the substrate is unloaded by the substrate unloading unit 70 provided on the downstream side of the fourth substrate support unit 40 in the substrate conveyance direction. It is carried out to the table. As shown in FIG. 1, the substrate carry-out unit 70 includes a carry-out robot 71 that sucks and holds the divided bonded substrate 91 supported on the fourth substrate support unit 40 and slides it to the substrate carry-out side. There is provided a reversal transfer robot 72 on which the slidable bonded substrate 91 is placed, and the divided bonded substrate 91 is sucked and held and turned upside down. The laminated substrate 91 is placed on the carry-out table 82.

  The operation of the substrate cutting system having such a configuration will be described. A bonded mother substrate 90 in which large glass substrates are bonded to each other is placed on each belt conveyor 11 on the first substrate support unit 10 in the substrate cutting system 100 of the present invention by a transfer robot or the like.

  The bonded mother substrate 90 placed on each belt conveyor 11 is positioned so as to have a predetermined posture on the flat belt 11c of each belt conveyor 11 by positioning means (not shown).

  Thereafter, the bonded mother substrate 90 positioned on the flat belt 11c of each belt conveyor 11 is clamped by the clamping means (not shown) at the side edge portion on the substrate carry-in side of the bonded mother substrate 90 located on the substrate carry-in side. The The clamping means is provided so as to be movable in the Y direction along the gap between the conveyor belts 11.

  When the side edge portion of the bonded mother substrate 90 positioned on the substrate carry-in side is clamped by the clamping means, the bonded mother substrate 90 is auxiliaryly supported by the flat belt 11 c of each belt conveyor 11.

  In such a state, the bonded mother substrate 90 is moved at a predetermined speed along the + Y direction which is the substrate carry-out direction by the clamping means, and the flat belt 11c of each belt conveyor 11 in the first substrate support unit 10 is used. And the flat belt of each belt conveyor 21 in the 2nd board | substrate support unit 20 is driven so that it may become the same rotational speed as the moving speed of the bonding mother board | substrate 90 by a clamp means.

At this time, the bonded mother substrate 90 is moved in the Y direction while the cutter wheels of the upper scribe device 53 and the lower scribe device 54 are pressed against the upper and lower surfaces of the bonded mother substrate 90 at predetermined positions, respectively. Thus, scribe lines along the Y direction are formed on the upper surface and the lower surface of the bonded mother substrate 90, respectively. When forming a plurality of scribe lines along the Y direction, the positions of the upper scribe device 53 and the lower scribe device 54 in the X direction are changed, and the bonded mother substrate 90 is moved a plurality of times along the Y direction. What is necessary is just to make it move. Alternatively, a plurality of scribe lines may be simultaneously formed on both surfaces of the bonded mother substrate 90 by using a plurality of upper scribe devices and lower scribe devices.

  As a result, the bonded mother substrate 90 held by the moving clamping means is slid in a state of being supplementarily supported by the flat belt 11c of each belt conveyor 11 in the first substrate support unit 10, and the second substrate. It will be in the state supported by the flat belt of each belt conveyor 21 in the support unit 20 auxiliary. In this case, the bonded mother substrate 90 that is held and slid by the clamping means is attached to the flat belt 11c of each belt conveyor 11 in the first substrate support unit 10 and the flat belt of each belt conveyor 21 in the second substrate support unit 20. Each is conveyed without sliding contact.

  Each belt conveyor 11 in the first substrate support unit 10 has a gap in the X direction between adjacent flat belts 11c of about several centimeters to several millimeters, and almost the entire lower surface of the bonded mother substrate 90 is Since the bonded mother substrate 90 is supported by all the flat belts 11c, there is no possibility that the bonded mother substrate 90 is bent, and the bonded mother substrate 90 can be stably conveyed. Similarly, when a part of the bonded mother substrate 90 is supported by the flat belt of each belt conveyor 21 in the second substrate support unit 20, the bonded mother substrate 90 is also stably conveyed without being bent.

  After the scribe line along the Y direction is formed, the bonded mother substrate 90 is then moved to the upper scribe device 53 and the lower scribe device 54 by the clamping means, the first substrate support unit 10 and the second substrate support unit 20. The position in the Y direction is moved to a position where the scribe line along the X direction of the bonded mother substrate 90 coincides.

  Then, the upper scribe device 53 and the lower scribe device 54 of the scribe unit 50 are positioned on the scheduled scribe line in the bonded mother substrate 90 and moved along the scheduled scribe line.

  In this way, cracks along the vertical direction are sequentially formed along the X direction on the upper and lower surfaces of the bonded mother substrate 90 by the respective cutter wheels of the upper scribe device 53 and the lower scribe device 54. A scribe line along the X direction is formed.

  In addition, when it is necessary to form a plurality of scribe lines along the X direction at predetermined intervals on the upper and lower surfaces of the bonded mother substrate 90, the upper and lower surfaces of the bonded mother substrate 90. When the scribe lines are respectively formed, the clamping means for clamping the bonded mother substrate 90, the flat belt 11c of each belt conveyor 11 in the first substrate support unit 10, and each belt conveyor 21 in the second substrate support unit 20 are provided. After the bonded mother substrate 90 is moved in the Y-axis direction by the flat belt, the upper surface of the bonded mother substrate 90 is obtained by the upper scribe device 53 and the lower scribe device 54 of the scribe unit 50 by the same operation as described above. And on the bottom, there is a scribe line along the X direction. It is made.

  When scribe lines along the X direction and the Y direction are respectively formed on the upper surface and the lower surface of the bonded mother substrate 90, the clamp of the bonded mother substrate 90 by the clamping means is released, and the first substrate support unit 10 The flat belt 11c of each belt conveyor 11, the flat belt of each belt conveyor 21 in the second substrate support unit 20, and further, the flat belt of each belt conveyor 31 in the third substrate support unit 30 are driven in synchronization. . Accordingly, the bonded mother substrate 90 is transferred onto the second substrate support unit 20, transported by the second substrate support unit 20, and transferred onto the third substrate support unit 30.

  Also in this case, since almost the entire lower surface of the bonded mother substrate 90 is supported by all the flat belts in the second substrate support unit 20 and all the flat belts in the second substrate support unit 30, a scribe line is formed. The bonded mother substrate 90 is not likely to be bent, and as a result, the bonded mother substrate 90 is stably conveyed without being divided along the scribe line.

  Further, when the belt conveyor of the third substrate support unit 30 is driven, the belt conveyor of the fourth substrate support unit 40 is driven and transferred onto the third substrate support unit 30 in synchronization with the drive. A part of the bonded mother substrate 90 to be conveyed is positioned on the belt conveyor of the fourth substrate support unit 40. Also in this case, since almost the entire lower surface of the bonded mother substrate 90 is supported by all the flat belts in the second substrate support unit 20 and all the flat belts in the third substrate support unit 30, a scribe line is formed. There is no possibility that the bonded mother substrate 90 is bent.

  Further, a part of the bonded mother substrate 90 (for example, an unnecessary part separated from the divided display panel) hangs down from the scribe line formed on the bonded mother substrate 90 in the transport direction. There is no risk of coming into contact with the belt conveyor of the fourth substrate support unit 40 without being transferred to the belt conveyor of the fourth substrate support unit 40. Therefore, the divided bonded substrate 91 portion is divided and the third substrate support unit 30 There is no risk of falling onto the belt conveyor and the belt conveyor of the fourth substrate support unit 40, and there is no possibility that the posture of the bonded mother substrate 90 placed on the belt conveyor of the third substrate support unit 30 will change. As a result, the bonded mother substrate 90 can be stably transported without being divided along the scribe line.

  Thereafter, the divided bonded substrate 91 portion is placed on the fourth substrate support unit 40, and the scribe lines formed on the upper and lower surfaces of the bonded mother substrate 90 are connected to the third substrate support unit 30. When positioned between the fourth substrate support unit 40, the conveyance of the bonded mother substrate 90 by the third substrate support unit 30 and the fourth substrate support unit 40 is stopped. Then, the steam ejected from the upper steam spraying portion 61 and the lower steam spraying portion 62 of the dividing unit 60 is sprayed along the scribe lines formed on the upper surface and the lower surface of the bonded mother substrate 90, and the bonded mother substrate The regions where the scribe lines are formed on the upper and lower surfaces of 90 are heated. Thereby, the vertical crack which forms a scribe line is extended | stretched to the orthogonal | vertical direction, and the bonding mother board | substrate 90 is parted along a scribe line.

  When the bonded mother substrate 90 is in a divided state, the belt conveyor of the third substrate support unit 30 and the belt conveyor of the fourth substrate support unit 40 are driven in synchronization, so that the divided bonded substrate 91 is the fourth substrate. It is transferred onto the belt conveyor of the support unit 40.

  The divided bonded substrate 91 transferred onto the fourth substrate support unit 40 is sucked and held by the carry-out robot 71 of the substrate carry-out unit 70 and is transferred onto the reverse transfer robot 72, and the cut is held by the reverse transfer robot 72. The bonded substrate 91 is turned upside down and transferred onto the carry-out table 82.

  As described above, the bonded mother substrate 90 or the divided bonded substrate 91 is bent by the flat belts of the conveyor belts provided in the first to third substrate transport units 10 to 30 and the fourth substrate support unit 40. In order to be stably conveyed without unavoidable, the scribing process and the dividing process for the bonded mother substrate 90 can be stably performed with high accuracy.

  In the above embodiment, the first substrate support unit 10 has four belt conveyors 11. However, one belt conveyor having a flat belt that can support the bonded mother substrate is provided. You may make it the structure provided. The second to third substrate transport units 20 to 30 and the fourth substrate support unit 40 may have the same configuration.

  The material of the flat belt of each belt conveyor is not particularly limited as long as it can stably support and transport the bonded mother substrate or the divided bonded substrate. It may be made of a material such as resin, and the shape may be a mesh. Note that when a mesh-like flat belt is used, it is possible to prevent substrate fragments and the like from remaining on the conveyor belt, and to reduce damage to the bonded mother substrate. When a mesh-like flat belt is used for the third substrate support conveyor, the bonded mother substrate steam is sprayed from above and below while moving the cutting unit in the Y direction while supporting the substrate on the third substrate support conveyor. Can be.

  Further, as a flat belt, for example, a structure using a low friction material for the bonded mother substrate such as a fluororesin, or the surface of the flat belt is coated with a low friction material such as a fluororesin coating material. You may do it. Accordingly, it is possible to reduce the stress applied to the bonded mother substrate during the transfer operation of the bonded mother substrate due to a difference in speed between the plurality of conveyor belts and the clamp device, an error in the moving distance, and the like.

  As mentioned above, although this invention has been illustrated using preferable embodiment of this invention, this invention should not be limited and limited to this embodiment. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range based on the description of the present invention and the common general technical knowledge from the description of specific preferred embodiments of the present invention. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  A substrate such as a glass substrate used for a display panel such as a liquid crystal display device can be stably transported in a state in which a scribe line is formed, and the substrate may be cracked or chipped during transport. Can be prevented.

It is a schematic perspective view which shows an example of embodiment of the board | substrate cutting system of this invention. It is a top view which shows schematic structure of the board | substrate cutting system. It is a side view which shows schematic structure of the board | substrate cutting system. It is a perspective view which shows schematic structure of the 1st-4th board | substrate support unit used for the board | substrate cutting system. It is sectional drawing which shows the outline of the principal part of the 1st board | substrate support unit. It is a schematic front view which shows the structure of the conventional scribe apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 1st board | substrate support unit 11 Belt conveyor 11a Drive pulley 11b Driven pulley 11c Flat belt 20 2nd board | substrate support unit 21 Belt conveyor 21a Drive pulley 21b Driven pulley 21c Flat belt 30 3rd board | substrate support unit 31 Belt conveyor 31a Drive pulley 31b Driven Pulley 31c Flat belt 40 Fourth substrate support unit 41 Belt conveyor 41a Drive pulley 41b Driven pulley 41c Flat belt 50 Scribe unit 60 Dividing unit 70 Substrate unloading unit

Claims (2)

A first substrate support unit on which a substrate on which a scribe line is formed is placed and transports the placed substrate;
A second substrate support unit to which the substrate conveyed by the first substrate support unit is transferred;
The scribe line of the substrate is positioned between the first substrate support unit and the second substrate support unit so as to be opposed to the scribe line, and along the scribe line A substrate cutting system comprising a cutting unit for cutting the substrate,
The first substrate support unit is constituted by a plurality of belt conveyors having a flat belt ,
Clamping means for clamping a side edge portion on the carry-in side of the substrate is provided so as to be movable in the conveyance direction of the substrate along a gap between flat belts of the plurality of belt conveyors,
Substrate cutting system wherein the plurality of belt conveyors are driven so that orbiting speed of each of the flat belt is the same as the moving speed of the substrate to be transported is clamped by the clamping means, characterized in Rukoto. The substrate cutting system according to claim 1, wherein the second substrate support unit is configured by a belt conveyor having a flat belt.

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