JP6227098B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus that processes a scribe line for cutting a substrate made of a brittle material such as glass, silicon, ceramic, and a compound semiconductor, and divides the substrate along the scribe line.

  Conventionally, a large sized mother board placed on a table is rolled with a scribing device while the cutter wheel (also referred to as a scribing wheel) is applied with a predetermined scribe pressure, or thermal distortion caused by laser beam irradiation. To form a plurality of parallel scribe lines orthogonal to each other, and then reverse the mother substrate by a suction inversion device and place it on the table of the break device, and provide the scribe line For example, Patent Document 1 discloses a method in which a substrate is divided by pressing a break bar from the surface opposite to the substrate and the substrate is bent to take out a unit product.

  In addition, when the mother substrate on which the two glass substrates are bonded together is cut, the cutter wheel is rolled on the mother substrate placed on the table of the scribe device so that A is one surface of the substrate. A scribe line is formed on the surface. Next, after the substrate is sucked and reversed by the suction reversing device, it is placed on the table of the breaking device, and the substrate B surface which is the back surface of the substrate A surface is pressed with a break bar or the like to divide the substrate A surface. . Next, in the same manner as described above, a scribe line is formed on the surface of the substrate B, the substrate is inverted, and then the surface of the substrate A is pressed with a break bar or the like to divide the surface of the substrate B. Thereafter, a method of removing the material of the divided substrate from the breaking device and moving to the next step is disclosed in, for example, Patent Document 2 (FIG. 45).

International Publication WO2005 / 053925 International Publication No. WO2002 / 057192

  In the substrate processing method as described above, the suction reversing device used for reversing the substrate includes a suction plate that sucks and reverses the substrate. Then, for example, the mother substrate that has been scribed by the scribing device and placed on the table is sucked and reversed by the suction plate of the suction reversing device and then sucked and held on the suction plate of the suction reversing device turned upward Means are taken such that a substrate that has been adsorbed is adsorbed by an adsorbing plate of a separate adsorbing and conveying apparatus and conveyed to the next step, for example, a table of a breaking apparatus. On the other hand, the mother board on the table of the scribe device is sucked by the suction plate of the suction transfer device, moved to the suction plate of the suction reversing device waiting in the upward direction, passed, and the suction plate is reversed. The substrate that has been turned upside down is placed on the table of a breaker that is the next step.

Therefore, in the conventional method, since the mother substrate is received from the scribe device and reversed, and the reversed substrate is placed on the table in the next process, a suction conveyance device is required separately from the suction reversing device. However, there is a problem that the apparatus configuration becomes large and the cost is high.
In addition, it takes time to transfer the substrate inverted from the suction plate of the suction reversing device to the next process table, or to transfer the substrate from the table of the scribing device to the suction plate of the suction reversing device. There was also a problem that the work time required for the division became longer.

  Therefore, in view of the above-described conventional problems, the present invention has a simpler apparatus configuration than the conventional apparatus when performing an operation of inverting a substrate and placing it on a receiving unit such as a table in the next process, and further reducing the work time. An object of the present invention is to provide a substrate processing apparatus provided with an adsorption reversal device that can be shortened.

  In order to achieve the above object, the present invention takes the following technical means. That is, in the substrate processing apparatus of the present invention, a scribe device that forms a scribe line on the surface of the brittle material substrate in the middle of the main route, and a scribe device in which the main route for sequentially transporting the brittle material substrate is the first direction. A substrate processing apparatus having an adsorption reversing device having an adsorption portion that adsorbs and reverses the brittle material substrate scribed by the step, and delivers it to a receiving portion in the next process, wherein the receiving portions are parallel to each other at intervals. The plurality of receiving members are arranged so as to be able to protrude and retract on the upper surface of the table of the breaking device.

In the present invention, when the suction portion of the suction reversing device sucks the substrate from the table of the scribe device and reversely rotates by the rotation shaft, the reversed substrate can be transferred to the upper surface of the receiving member. The conventional suction transfer device for delivering the substrate can be omitted, the device configuration is simplified, and the equipment cost can be reduced.
The receiving portion may be formed of a plurality of receiving members arranged in parallel at intervals, and the plurality of receiving members may be provided so as to be able to appear and retract on a table upper surface of the breaking device. .
Thereby, at the time of substrate delivery, it can be effectively delivered to the receiving member protruding from the table of the breaking device, and the delivered substrate can be placed on the table surface by lowering the receiving member, The next break step can be continued.

1 is a perspective view showing a schematic overall configuration of a substrate processing apparatus according to the present invention. The perspective view of the scribing apparatus in the board | substrate processing apparatus of FIG. The perspective view of the adsorption | suction inversion apparatus in the board | substrate processing apparatus of FIG. The perspective view of the breaking apparatus in the board | substrate processing apparatus of FIG. Sectional drawing of the receiving part provided in the table of the breaking apparatus. Explanatory drawing which shows the work process by the board | substrate processing apparatus which concerns on this invention. The perspective view which shows another Example of a receiving part. Explanatory drawing which shows the operation | work process by the board | substrate processing apparatus provided with the receiving part of FIG. The perspective view which shows another Example of a receiving part. Explanatory drawing which shows the operation | work process by the board | substrate processing apparatus provided with the receiving part of FIG.

Hereinafter, details of the substrate processing apparatus according to the present invention will be described based on the embodiments shown in FIGS.
A substrate processing apparatus A shown in the present embodiment includes a scribing apparatus B, an adsorption / reversing apparatus C, and a breaking apparatus D as shown in FIG.
The substrate W to be processed (see FIG. 6) is sequentially transferred along the first direction from the scribing device B to the break device D through the suction inversion device C. The “first direction” is the X direction in the figure. In the present invention, this substrate feed path along the first direction is referred to as a “substrate main path”.

  As shown in FIG. 2, the scribing device B includes a table 2 that moves along a rail 1 that extends in the X direction, and is driven by a screw shaft 3 that is rotated by a motor. Further, the table 2 has a large number of air suction holes (not shown) on its upper surface, and can be rotated on a horizontal plane by a rotary drive unit 5 incorporating a motor on the moving stage 4. A pair of left and right support columns 6 and 6 and a beam 8 including a guide 7 bridged by these support columns 6 and 6 extending in the Y direction form a gate-shaped support. A scribe head 10 having a cutter wheel 9 is attached to the guide 7 so as to be movable in the Y direction along the guide 7.

As shown in FIG. 3, the suction reversing device C includes a rotary shaft 13 extending in the Y direction supported by the left and right side plates 12, 12 on the frame 11, and a comb-like suction portion 14 that rotates together with the rotary shaft 13. It has.
The comb-like suction portion 14 is formed by a plurality of comb teeth portions 14 a extending from the rotation shaft 13 in the direction orthogonal to the rotation shaft 13. As shown in FIG. 1, the suction portion 14 rotates in reverse with the rotary shaft 13 from a position where it is in contact with the table 2 of the scribing device B to a receiving member 24 that forms a receiving portion of the breaking device D described later. Is formed. Further, in a posture in which the comb teeth portion 14a of the suction portion 14 is in contact with the table 2, a large number of air suction holes (not shown) are provided on the lower surface of the comb tooth portion 14a.
Further, the rotary shaft 13 is disposed between the table 2 of the scribing device B and the receiving unit of the breaking device D at a position close to the table 2 and the receiving unit. The rotating shaft 13 is driven by a reversing drive unit 15 incorporating a motor.

As shown in FIG. 4, the breaking device D includes a moving stage 18 that moves by rotation of a screw shaft 17 along a rail 16 that extends in the X direction, and a plurality of air suction holes (not shown) are provided in the moving stage 18. A table 19 is attached.
Further, a pair of left and right support columns 20 and 20 and a beam 21 that is bridged by the support columns 20 and 20 and extends in the Y direction form a gate-shaped support, and the beam 21 has a plate shape extending in the Y direction. A break bar 22 is attached by a fluid cylinder 23 so as to be movable up and down.

The table 19 of the breaker D is provided with a plurality of receiving members 24 that protrude from the protruding posture protruding from the upper surface thereof to the immersion posture that is flush with the table surface. Thus, a substantial receiving portion that receives the substrate W reversed by the suction portion 14 is formed.
The receiving member 24 as a receiving portion is arranged in parallel so as to fit between the comb-tooth portions 14a of the suction portion 14 in a protruding posture when the substrate W is transferred, such as a fluid cylinder 25 arranged below. It is formed to move up and down by an elevating mechanism (see FIG. 5).

  The air suction holes of the suction units 14 of the scribing device B and the breaking device D, and the suction reversing device C are connected to an air suction device such as a vacuum pump through a pipe, although not shown. It is formed so that the substrate W can be sucked by suction air through the air suction hole.

Next, the processing steps of the substrate W by the substrate processing apparatus will be described in order with reference to FIG.
In FIG. 6A, the substrate W placed on the table 2 of the scribing apparatus B is already processed with a plurality of scribe lines along the Y direction (front-rear direction in the figure) on the upper surface by the scribing apparatus B. It is in the state. The scribe line is processed by placing the substrate W on the table 2 and then moving the table 2 to the position of the scribe head 10 (see FIGS. 1 and 2) to press the cutter wheel 9 against the surface of the substrate W. This is done by moving the cutter wheel 9 in the Y direction.

  The substrate W after forming the scribe line placed on the table 2 is sucked by the comb teeth portion 14a of the suction portion 14 of the suction reversing device C and rotated reversely as shown in FIG. The inverted comb teeth portion 14 a fits between a plurality of receiving members 24, and is inverted and transferred to the upper surface of the receiving member 24. Even after the comb-tooth portion 14a is transferred to the receiving member 24, the comb-tooth portion 14a rotates to an angle α that is free from the substrate W, as shown in FIG. Thereby, the substrate W can be completely left on the upper surface of the receiving member 24.

Next, as shown in FIGS. 6D and 6E, after the table 19 of the breaking device D is moved and separated from the comb teeth portion 14a, the comb teeth portion 14a is scribed for the next substrate W ′. Turn to the B side.
In the break apparatus D, the table 19 on which the substrate W is placed is moved to a position below the break bar 22 (see FIGS. 1 and 4) to move the break bar 22 downward, and the substrate W is stripped along the Y-direction scribe line. Break into a shape. Thereafter, the broken substrate W is removed from the table 19.

  In addition, when the substrate W is transferred to the surface of the receiving member 24 by inverting the comb teeth portion 14a, the surface of the substrate W may be damaged if the substrate W contacts the surface of the receiving member 24 in an inclined posture. Therefore, when the substrate is delivered, as shown in FIG. 6B, the receiving member is arranged so that the substrate W is delivered to the upper surface of the receiving member 24 when the suction surface of the comb tooth portion 14 a is in a horizontal posture. It is preferable to set 24 projecting positions in advance. As a result, the substrate W can be delivered without damaging it.

  FIG. 7 shows another embodiment of the receiving portion in the present invention. In this embodiment, the receiving portion is formed by a plurality of receiving members 26 processed into a comb-teeth shape at one end of the table 19 of the breaking device D. The receiving members 26 are arranged parallel to each other with a space therebetween, and when the substrate W is transferred, the comb teeth portion 14a of the suction portion 14 fits between the receiving members 26, and the substrate W is placed in a horizontal posture on the upper surface of the receiving member 26. Shaped to receive.

FIG. 8 is an explanatory view similar to FIG. 6 showing a work procedure in the embodiment shown in FIG.
As in the previous embodiment, the substrate W placed on the table 2 is adsorbed by the comb teeth portion 14a of the adsorption portion 14 of the adsorption inversion device C as shown in FIGS. 8 (a) and 8 (b). Is reversed and rotated. The inverted comb teeth portion 14 a fits between a plurality of receiving members 26 and transfers the substrate W to the upper surface of the receiving member 26. Even after the comb-tooth portion 14a is transferred to the receiving member 26, the comb-tooth portion 14a is rotated to an angle α that is free from the substrate W, as shown in FIG.

Next, as shown in FIG. 8D, after the table 19 of the breaking device D is moved and separated from the comb tooth portion 14a, the comb tooth portion 14a is moved to the scribing device B side as shown in FIG. 8E. Rotate in reverse.
In this embodiment, since the receiving member 26 serving as the substrate receiving portion does not require a mechanism that moves up and down like the receiving member 24 shown in the previous embodiment, the configuration of the receiving portion can be simplified. it can.

FIG. 9 shows an embodiment in which a receiving member 27 as a receiving portion of the present invention is constituted by a plurality of conveyor belts 28. Each conveyor 27 is formed with a width smaller than the interval between the comb teeth portions 14a of the suction reversing device C, and the comb teeth portions 14a fit between the conveyors 27 when the substrates are delivered, and the substrate W is placed on the upper surface of the conveyor 27. Is configured to receive in a horizontal position.

FIG. 10 shows the work procedure of the embodiment shown in FIG.
As in the previous embodiment, the substrate W placed on the table 2 is adsorbed by the comb teeth portion 14a of the adsorption portion 14 of the adsorption reversing device C as shown in FIGS. 10 (a) and 10 (b). Inverted and rotated. The inverted comb teeth portion 14 a fits between the plurality of conveyors 28 and transfers the substrate W to the upper surface of the conveyor 28. Even after the substrate 14 is transferred to the conveyor 28, the comb tooth portion 14a rotates to an angle α that is free from the substrate W as shown in FIG.

  Next, as shown in FIG. 10 (d), the substrate W transferred to the conveyor 28 is transported to the next process by the conveyor 28, and the comb teeth portion 14a is moved to the scribing device B as shown in FIG. 10 (e). Turn to the side.

  As described above, in the present invention, when the suction unit 14 of the suction reversing device C sucks the substrate W from the table 2 of the scribing device B and rotates it by the rotary shaft 13, the reversed substrate W is received. Since it can be transferred to the upper surfaces of the members 24, 26, and 27, it is possible to omit the suction conveyance device for transferring the substrate as in the conventional case, and it is possible to simplify the substrate processing apparatus A. . Further, since the rotary shaft 13 of the suction reversing device C is disposed between the table 2 of the scribing device B and the receiving portion, and in the proximity of these members, the substrate W can be removed simply by reversing the suction portion 14. The operation of inverting and the operation of placing the inverted substrate W on the receiving portion can be performed simultaneously. Thereby, the working time can be greatly shortened.

While typical examples of the present invention have been described above, the present invention is not necessarily limited to the above embodiments. For example, although not shown, the suction portion 14 of the suction reversing device C may be formed so that the vertical position can be adjusted with respect to the side plate 12. As a result, when the suction unit 14 is reversed and the substrate W is delivered to the surface of the receiving unit, the position of the suction unit 14 is finely adjusted to a position where the substrate W is correctly in a horizontal posture with respect to the surface of the receiving unit. Can do.
Others The present invention can be appropriately modified and changed within the scope of achieving the object and without departing from the scope of the claims.

  The present invention is used in a substrate processing apparatus that forms a scribe line on a substrate and breaks along the scribe line.

A Substrate processing device B Scribing device C Suction reversing device D Breaking device W Substrate 2 Scribing device table 9 Cutter wheel 14 Suction reversing device suction portion 14a Comb tooth portion 19 Break device tables 24, 26, 27 Receiving as receiving portion Member 28 Conveyor

Claims (1)

A scribing device for forming a scribe line on the surface of the brittle material substrate in the middle of the main path, the main path for sequentially transporting the brittle material substrate,
A substrate processing apparatus comprising an adsorption reversing device having a suction unit that sucks and reverses the brittle material substrate scribed by a scribing device, and delivers it to a receiving unit in a next process,
The receiving portion is formed of a plurality of receiving members arranged in parallel at intervals,
The substrate processing apparatus, wherein the plurality of receiving members are provided so as to be able to appear and retract on a table upper surface of a breaking apparatus.