JP2904089B2 - Substrate cutting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cutting apparatus for cutting a hard substrate such as a glass plate or a ceramic plate.

[0002]

2. Description of the Related Art Japanese Unexamined Patent Publication (Kokai) No. 1-246155 discloses a sheet glass cutting apparatus for cutting a glass plate having a cutting groove formed on one surface in advance at the cutting groove.
As shown in FIG. 14, this sheet glass cutting apparatus 100 includes:
Lower receiving roller 102 on which plate glass 101 is placed
And a pressure roller 103 for pressing the plate glass 101 from above
And The receiving roller 102 is wider than the sheet glass 101 and is made of a material having a smaller Young's modulus than the sheet glass 101. The sheet glass 101 is placed so that the cutting groove 104 is on the receiving roller 102 side. The pressure roller 103 is narrower than the sheet glass 101 and
The other surface of the one cutting groove 104 is pressed.

[0003] A sheet glass 101 is conveyed while being sandwiched between a receiving roller 102 and a pressing roller 103, and cut by a cutting groove 10.
At the position 4, the pressing roller 103 is pressed. At this time, the elongation of the receiving roller 102 and the friction between the sheet glass 101 and the receiving roller 102 cause the sheet glass 101
In the cutting groove 104, stresses B and B 'along the axial direction of the receiving roller 102 are generated. When the receiving roller 102 is pressed by the pressing roller 103, the sheet glass 10 is pressed.
1 generate moments A and A ′. The sheet glass 101 is broken at the cutting groove 104 by these loads.

[0004]

The width w of the sheet glass 101
When the thickness w is sufficiently larger than the thickness t, the plate glass 101 can be cut by the plate glass cutting device 100 without any trouble. However, when the width w becomes four times the thickness (4t) or less, the figure becomes smaller. 15 or crack 1 as shown in FIG.
05 proceeds in a direction deviating from the cutting groove 104, causing a problem that the sheet glass 101 does not break along the cutting groove 104.

In general, a fluorescent display tube has an envelope in which plate glass is assembled in a box shape, and the plate glass constituting the envelope is formed by the above-described plate glass cutting apparatus. In recent years, since fluorescent display tubes have tended to be thin, it has been demanded that plate glass constituting the envelope, particularly a side plate, be small in height. For example, a sheet glass whose height is four times or less the sheet thickness t is required. As a specific example, if t = 2 mm, a plate glass having a height (width) of 8 mm or less is required, and if t = 1.5 mm, a plate glass having a height (width) of 6 mm or less is required. Sheet glass of such a size cannot be manufactured by the conventional sheet glass cutting apparatus due to the above-mentioned problems.

The inventors of the present invention have examined the causes of cracks coming off the cut grooves when breaking a sheet glass having a small width with respect to the sheet thickness from various angles, and as a result, have considered as follows. As shown in FIG. 15, if the angle θ formed between the surface of the broken portion of the plate glass 101 and the line of the upper end surface of the receiving roller 102 becomes too large, the receiving roller 102, the pressure roller 103, and the tip of the plate glass 101 Section C between
, The bending moments A and A ′ applied to the glass sheet 101 are maximized. Further, as shown in FIG. 16, small and large cracks 1
06 are present at the time of streaking.
6 grows due to the bending moment and thus cracks 10
5 may be shifted in a direction deviating from the cutting groove 104.

In the conventional sheet glass cutting apparatus 100, the interval between the receiving roller 102 and the pressure roller 103 is determined in accordance with the thickness t of the sheet glass 101 so that an appropriate pressure is applied to the sheet glass 101. Since the thickness of the sheet glass varies depending on the product, the force for pressing the sheet glass is not always constant even when the roller interval is set in this manner. Even if the roller interval is set in the best condition, if the sheet thickness changes, the pressing force of the pressing roller 103 against the sheet glass 101 also changes, and problems such as the cracked surface of the sheet glass 101 not being formed in a constant shape occur.

SUMMARY OF THE INVENTION An object of the present invention is to provide a sheet glass cutting apparatus capable of breaking a sheet glass having a small width with respect to the sheet thickness without any trouble and coping with a change in the sheet thickness.

[0009]

Means for Solving the Problems] substrate cutting apparatus according to claim 1, in the substrate cutting device for cutting the substrate along the groove by machining a groove in the substrate, the groove in the bottom surface of the substrate
And a substrate formed by the cutter
Swarf collecting means for sucking and collecting swarf generated from
And a pair of holding portions for fixing the bottom surfaces of the respective portions on both sides of the groove of the substrate, and at least one of the pair of holding portions is formed with the groove.
External force loading means for moving the substrate upward along the center and cutting the substrate along the groove.

[0010] The substrate cutting apparatus according to claim 2, group
In the substrate cutting device for cutting the substrate along the groove by working a groove in a plate, cutter for forming a groove in the bottom surface of the substrate
And the cutting generated from the substrate by the cutter.
Swarf collecting means for sucking and collecting the powder, a pair of holding portions for holding the bottom surfaces of the respective portions on both sides of the groove of the substrate so as to be movable within a predetermined range, and a pair of holding portions held by the holding portion. External force loading means for moving each portion of the substrate upward with the groove as a center .

[0011] The substrate cutting apparatus according to claim 3, group
In the substrate cutting device for cutting the substrate along the groove by working a groove in a plate, cutter for forming a groove in the bottom surface of the substrate
And the cutting generated from the substrate by the cutter.
A chip collecting means for sucking and collecting powder, and a pair of holding surfaces respectively holding the bottom surfaces of the respective portions on both sides of the groove of the substrate can be moved between a state where they are in the same plane and a state where they are not parallel to each other. A pair of holding tables provided at predetermined intervals, holding means for holding the substrate on the holding surface of the holding table, and moving the holding table upward about the groove. And a drive mechanism for causing

[0012] The substrate cutting apparatus according to claim 4, group
In the substrate cutting device for cutting the substrate along the groove by working a groove in a plate, cutter for forming a groove in the bottom surface of the substrate
And the cutting generated from the substrate by the cutter.
And swarf collecting means for collecting by sucking the powder, the grooves between the state pair of the holding surface for holding each a bottom surface of each portion of each side of the groove of the substrate are not parallel to each other and a state in the same plane A pair of holding tables provided at predetermined intervals that can be moved upward with respect to the center, holding means for holding the substrate on the holding surface of the holding table, and a substrate held by the holding table. A pressing body for applying an external force along the groove, and the pressing body is provided on the pressing body and is generated when the substrate is cut.
Suction means for sucking and removing fragments of the substrate .

[0013] The substrate cutting apparatus of claim 5, group
Substrate cutting for processing a groove in a plate and cutting the substrate along the groove
A cutter for forming a groove in a bottom surface of the substrate,
And the cutting generated from the substrate by the cutter.
A chip collecting means for sucking and collecting the powder and a predetermined interval
And a pair of bases provided on the upper surface of each base.
And hold the bottom of each part on both sides of the substrate groove respectively
A pair of elastic bodies having a pair of holding surfaces in the same plane,
An external force is applied to the upper surface of the substrate held by the elastic body along the groove.
The pressing body to be added and the substrate provided on the pressing body are cut.
Suction removal that sucks and removes substrate fragments generated when the substrate is broken
Means .

[0014] The substrate cutting apparatus according to claim 6, group
In the substrate cutting device for cutting the substrate along the groove by working a groove in a plate, cutter for forming a groove in the bottom surface of the substrate
And the cutting generated from the substrate by the cutter.
A chip collecting means for sucking and collecting powder and a groove
The fixed side that holds the bottom of one part of the substrate in place
Holds the holding part and the bottom of the other part of the board bordering the groove
And rotate around a rotation axis that substantially matches the groove
Move the movable side holding section and the movable side holding section
And a driving mechanism for rotating the motor in a direction .

The substrate cutting apparatus according to claim 7, 請
7. The substrate cutting apparatus according to claim 6, wherein the holding unit is provided
A holding surface on which the substrate is placed, and a holding surface formed on the holding surface;
Comprising a suction groove and suction means for suctioning the inside of the suction groove
Wherein the suction groove forms a groove in the substrate by the groove forming means.
Near the starting position, it is closer to the groove than other parts
It is characterized by being formed by .

[0016]

[0017]

[0018]

In the above configuration, the substrate on which the groove has been processed is held by the holding table. At this time, each part on both sides of the substrate sandwiching the groove is held on each holding surface of the pair of holding tables. The groove of the substrate is pressed from the side opposite to the holding table with respect to the substrate by a pressing body serving as an external force applying means. Alternatively, a driving mechanism, which is an external force loading unit, is operated to drive the holding table that holds the substrate. A pair of holding surfaces respectively holding the portions on both sides of the groove of the substrate move from a state of being relatively in the same plane to a state of being not parallel to each other, and the substrate is cut in the groove.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A substrate cutting apparatus according to each of the embodiments described below is used, for example, for cutting a glass plate constituting an envelope of a fluorescent display tube described above. A first embodiment will be described with reference to FIG. The substrate cutting apparatus 1 of the present embodiment includes a holding unit 2 that holds a glass substrate 10, an external force load unit that generates an external force applied to the glass substrate 10, and a cutter 3 that processes a groove in the glass substrate 10. ing.

The holding section 2 has a pair of holding tables 4 and 4. Each of the holding tables 4 and 4 has a rectangular parallelepiped shape, and a flat upper surface thereof is a holding surface 4 a for holding the glass substrate 10. The pair of holding tables 4, 4 are arranged at a predetermined interval, and the glass substrate 10 is placed when each holding surface 4a is in the same plane, and each holding surface 4a holds the glass substrate 10 respectively. I do.

Although not shown, each holding table 4 has holding means for holding the glass substrate 10 on the holding surface 4a. The holding means of the present embodiment includes a holding surface 4 a of the holding table 4.
, A plurality of suction holes provided inside the holding table 4, a cavity continuous with the suction holes, and suction means for sucking the inside of the cavity. That is, when the suction means sucks the inside of the cavity, the glass substrate 10 placed on the holding surface 4a is sucked and held on the holding table 4 via the suction hole.

Each of the holders 4 is provided with a link mechanism 5a, 5d so as to move along a predetermined locus within a predetermined movement range.
5b is supported on the installation surface. Each holding table 4
Is a pair of links 6 (6a, 6a,
6b), two sets of connecting shafts 7a and 7b are connected to two connecting shafts 8a and 8b on the installation surface, respectively. In each holding base 4, the outer link 6b is longer than the inner link 6a. The link mechanism 5 of both the holding tables 4 has a symmetrical structure with respect to a groove 10 a formed on the lower surface of the glass substrate 10 held on the both holding tables 4. 4 of each outer link mechanism 5b of both holding bases 4
The connecting shafts 7b, 8b at one place are on one circumference centered on the groove 10a in a plane orthogonal to the connecting shafts 7b, 8b. The connecting shafts 7a, 8a at four locations of the link mechanism 5a on each inner side of both holding stands 4 are on one circumference centered on the groove 10a on a plane orthogonal to the connecting shafts 7a, 8a.

Each holding table 4 has a driving cylinder 9 as a driving mechanism as an external force load means for moving the holding table 4 to apply an external force to the glass substrate 10 held on the holding table 4.
Is provided. The distal end of the rod 9a of the drive cylinder 9 is connected to the center pin of the outer link 6b in each link mechanism 5b of each holder 4. The rod 9a of the driving cylinder 9 is driven along a direction facing the groove 10a of the glass substrate 10 on a plane perpendicular to the longitudinal direction of each of the connecting shafts 7b, 8b of the link mechanism 5b or the groove 10a.

Therefore, if the rod 9a of the driving cylinder 9 is made to protrude, the pair of holding surfaces 4a
From the state of being in the same plane as shown in FIG.
It is possible to move to an inclined state which is not parallel to each other as shown in FIG.

A cutter 3 for forming a groove in the glass substrate 10 is provided between the pair of holding tables 4 and 4.
The cutter 3 is connected to each of the connecting shafts 7 of the link mechanisms 5a and 5b.
A groove 10a is formed on the lower surface of the glass substrate 10 held on the holding table 4 by moving in parallel with the a, 7b, 8a, 8b.

The operation of the above configuration will be described. The holding surfaces 4a, 4a of the pair of holding tables 4, 4 are set in the same plane. One glass substrate 10 is placed on the pair of holding tables 4,
Put it over 4 The suction means is driven to hold the glass substrate 10 on each holding surface 4 a of each holding table 4. The cutter 3 is driven between the pair of holding tables 4, 4 to form a groove 10 a on the lower surface of the glass substrate 10. Drive cylinder 9
Is operated, and each holding table 4 holding the glass substrate 10 is operated.
Drive. The pair of holding surfaces 4a holding the respective portions on both sides of the groove 10a of the glass substrate 10 move from being in the same plane to being not parallel to each other. Accordingly, both sides of the glass substrate 10 having the groove 10a formed on the lower surface are subjected to an action of bending upward around the groove 10a, whereby the glass substrate 10 is folded in the groove 10a and cut into two pieces.

A second embodiment will be described with reference to FIG. The substrate cutting device 11 of the present embodiment
It has a holding portion 12 for holding 0, an external force applying means for applying an external force to the glass substrate 10, and a cutter 3 for processing a groove 10a in the glass substrate 10.

The holding section 12 has a pair of holding tables 14 and 14. Each holding table 14 has a substantially rectangular parallelepiped shape, and its flat upper surface is a holding surface 14a for holding the glass substrate 10. The pair of holding tables 14 are arranged at a predetermined interval, and are supported by shafts 15 provided in parallel with each other along the outer edge so that the inner edge can rotate. Has become. Springs 17, 17 as elastic members are interposed between the lower surface side of the inner edge of each holding table 14 and the installation surface 16, respectively.
Although each holding surface 14a of each holding table 14 is in the same plane, when the glass substrate 10 is placed on each holding table 14 and a predetermined force is applied to the glass substrate 10 from above, each holding table 14a 1
4 rotates downward about the shaft 15.

Although not shown, each holding table 14 has a holding surface 1
4a has a holding means for holding the glass substrate 10. The holding means of the present embodiment has the same configuration and operation as the holding means of the first embodiment.

As described above, as an external force loading means for pushing the glass substrate 10 from above and rotating the holding table 14 downward, a pressing body 18 is provided above the pair of holding tables 14 and 14.
Is provided. The pressing body 18 is a plate-like member having a longitudinal shape along the longitudinal direction of the groove 10 a formed in the glass substrate 10, and its length is determined according to the length of the glass substrate 10 to be cut. The lower end edge of the pressing body 18 in contact with the glass substrate 10 is formed as a ridge 18a continuous along the longitudinal direction of the groove 10a. The tip of the pressing body 18 of the present embodiment is slightly rounded.

A cutter 3 for processing a groove 10a in the glass substrate 10 is provided between the pair of holding tables 14, 14. The cutter 3 is provided with a ridge 18 a of the pressing body 18.
Are moved in parallel along the longitudinal direction of the glass substrate 10 to form a groove 10 a on the lower surface of the glass substrate 10 held on the holding table 14.

The operation of the above configuration will be described. One glass substrate 10 is placed over the pair of holding tables 14 and 14. The suction means is driven to hold the glass substrate 10 on each holding surface 14 a of each holding table 14. The cutter 3 is driven between the pair of holding tables 14, 14 to form a groove 10 a on the lower surface of the glass substrate 10. The pressing body 18 is operated to press the upper surface side of the portion corresponding to the groove 10a of the glass substrate 10 downward. A pair of holders 14 for holding the respective portions on both sides of the groove 10a of the glass substrate 10 are pushed down. A pair of holding surfaces 14
Due to the pressing force of the pressing body 18, a and 14a move from a state in the same plane to a state in which they are not parallel to each other. Therefore, both sides of the glass substrate 10 having the groove 10a formed on the lower surface are subjected to an action of bending upward around the groove 10a, whereby the glass substrate 10 is folded in the groove 10a and cut into two pieces.

The glass substrate 1 with which the pressing body 18 contacts
By attaching a band-shaped adhesive tape along the groove 10a to the upper surface of the glass substrate 10, fine fragments of the glass substrate 10 generated when the glass substrate 10 is cut can be captured without scattering.

A third embodiment will be described with reference to FIG. The substrate cutting device 21 of the present embodiment is the same as the substrate cutting device 11 of the second embodiment except for the configuration of the pressing body. As shown in FIG. 3, the pressing body 22 of the present embodiment has a cavity 23 inside, and a plurality of suction holes 25 communicating with the cavity 23 are formed on both sides of the ridge 24. A suction means (not shown) is connected to the cavity 23. By driving the suction means, it is possible to suck fine particles of the glass substrate 10 generated at the time of cutting the glass substrate by sucking external air from the suction holes 25.

A fourth embodiment will be described with reference to FIG. The substrate cutting device 31 of the present embodiment
It has a holding portion 32 for holding 0, an external force applying means for applying an external force to the glass substrate 10, and a cutter 3 for processing the groove 10a in the glass substrate 10.

The holding section 32 has a pair of holding tables 34,34. Each holding table 34 has a substantially rectangular parallelepiped shape, and is arranged at a predetermined interval. An elastic body 35 is provided on the upper surface of each holding table 34. The flat upper surface of the elastic body 35 is a holding surface 35a for holding the glass substrate 10. Each holding surface 35a of each elastic body 35 is in the same plane when no external force is applied. Glass substrate 10
Is pressed from above, the elastic body 35 is
Deformed by an external force applied through the

As an external force loading means for pushing the glass substrate 10 from above, a pressing body 3 is provided above the pair of holding tables 34.
6 are provided. The pressing body 36 of the present embodiment is the same as the pressing bodies 18 and 22 of the second or third embodiment.

A cutter 3 for processing the groove 10a in the glass substrate 10 is provided between the pair of holding tables 34, 34. The cutter 3 is provided with a ridge 36 a of the pressing body 36.
Are moved in parallel along the longitudinal direction of the glass substrate 10 to form a groove 10a on the lower surface of the glass substrate 10 held on the holding table 34.

The operation of the above configuration will be described. One glass substrate 10 is placed over the elastic bodies 35 on the pair of holding tables 34. Glass substrate 1
0 is securely held without slipping on the holding surface 35a of the elastic body 35. The cutter 3 is driven between the pair of holding tables 34, 34 to form a groove 10 a on the lower surface of the glass substrate 10. The pressing body 36 is operated to press the upper surface side of the portion corresponding to the groove 10a of the glass substrate 10 downward. A pair of elastic bodies 35, 35 respectively holding the respective portions on both sides of the groove 10a of the glass substrate 10, are elastically deformed and pushed down. The holding surfaces 35a of the pair of elastic bodies 35, 35 move from a state in the same plane to a state not parallel to each other due to the pressing force of the pressing body 36. Therefore,
Both sides of the glass substrate 10 in which the groove 10a is formed on the lower surface,
The glass substrate 10 is bent in the groove 10a by the action of bending upward around the groove 10a.
It is cut into two pieces.

The pressing members 18, 22, and 36 in the second to fourth embodiments may have a structure as shown in FIGS. As shown in FIG. 5 (a), the pressing body 40 may have a protruding ridge 40a having a triangular cross section having a longitudinal length corresponding to the length of the glass substrate 10 to be cut. Alternatively, a pressing body 41 having a circular cross section having a longitudinal length corresponding to the length of the glass substrate 10 to be cut as shown in FIG. 5B may be used. Alternatively, a plate-shaped pressing body 42 having a length in the longitudinal direction corresponding to the length of the glass substrate 10 to be cut as shown in FIG. 5C may be used.

The fifth embodiment will be described with reference to FIG. The substrate cutting device 51 according to the present embodiment
It has a holding portion 52 for holding 0, an external force applying means for applying an external force to the glass substrate 10, and a cutter 3 for processing the groove 10a in the glass substrate 10.

The holding section 52 has a pair of holding tables 54, 54. Each holding table 54 has a substantially rectangular parallelepiped shape, and its flat upper surface is a holding surface 54a for holding the glass substrate 10. The pair of holding tables 54, 54 are supported on a mounting surface 56 by springs 55, which are elastic bodies, and are arranged at predetermined intervals.

As an external force loading means for pushing the glass substrate 10 from above, a pressing body 57 is provided above the pair of holding tables 54, 54. Pressing body 57 of the present embodiment
Are the same as the pressing bodies 18, 22, and 36 of the second to fourth embodiments.

Although not shown, the pair of holders 54,
Between the 54, the cutter 3 for processing the groove 10a in the glass substrate 10 is provided. The cutter 3 moves in parallel along the longitudinal direction of the ridge 57a of the pressing body 57, and a groove 10 is formed on the lower surface of the glass substrate 10 held on the holding table 54.
a is formed.

The operation of the above configuration will be described. One glass substrate 10 is placed over the pair of holding tables 54, 54. The cutter 3 is driven between the pair of holding tables 54, 54, and the groove 10 is formed on the lower surface of the glass substrate 10.
a is formed. The pressing body 57 is operated to press the upper surface side of the portion corresponding to the groove 10a of the glass substrate 10 downward. The pair of holders 54, 54, which respectively hold the respective portions on both sides of the groove 10a of the glass substrate 10, are pushed down. Each holding surface 54a of the pair of holding bodies 54, 54
Move from a state in the same plane to a state in which they are not parallel to each other due to the pressing force of the pressing body 57. Therefore, both sides of the glass substrate 10 in which the groove 10a is formed on the lower surface are
The glass substrate 10 is bent upward at the center a, whereby the glass substrate 10 is folded at the groove 10a and cut into two pieces.

The sixth embodiment will be described with reference to FIGS. The substrate cutting device 61 of the present embodiment has a bed 62 as a base. On the half of the bed 62, a fixed holding part 63 is fixedly mounted with the holding surface horizontal. On the other half of the bed 62, a movable holding part 64 is movably mounted via an arm 65.

The movable holding unit 6 set in a horizontal state
4 faces the holding part 63 on the fixed side at a predetermined interval in the same horizontal plane. On the lower surface of the substrate 10 placed on the holding portions 63 and 64 and held horizontally,
A groove 1 is formed in a portion corresponding to the position of the gap between the two holding portions 63 and 64.
0a is formed.

Arms 65, 65 are respectively connected to both ends of the movable holding portion 64. A pair of arc-shaped rails 66, 66 are attached to opposing wall surfaces of the bed 62. Each arm 65 is attached to each rail 66 via a curved movable bearing 67 as guide means. The center of the arc-shaped rail 66 is aligned with the groove 1 formed in the substrate 10 held by the holding portions 63 and 64.
0a. A stopper 68 is provided on at least one lower end of the rail 66, and the movable holding portion 64
Can move in a predetermined angular range between a horizontal position and a position above the horizontal position.

As shown in FIGS. 7 and 8, a pressing cylinder 69 as an external force loading means is attached to the wall surface of the bed 62. The rear end of the cylinder of the pressing cylinder 69 is rotatably connected to the bed 62.
The tip of the rod is rotatably connected to the arm 65. The pressing cylinder 69 is composed of, for example, an air cylinder,
The arm 65 is moved to the rail 66 by extending and retracting the rod.
, And the movable holding portion 64 is arbitrarily reciprocated between the horizontal position and a position above the center of the groove 10a of the substrate 10 held by the holding portions 63 and 64. Can be rotated.

As shown in FIG. 9, suction grooves 70 for holding the substrate 10 on the holding surfaces are formed on the holding surfaces of both holding portions 63 and 64. A suction hole 71 is provided at the bottom of the suction groove 70.
The suction hole 71, which is open, is connected to suction means (not shown) via a suction pipe 72. If the suction means sucks, the air in the suction groove 70 is sucked into the suction hole 71,
The substrate 10 placed on the holding surface is sucked and held on the holding surface.

As shown in FIG. 9, the suction groove 70 provided on the holding surface of each of the holding portions 63 and 64 is formed substantially along the outer periphery of the upper surface of the holding surface. Both suction grooves 70, at both edges of both holding portions 63, 64 facing each other at a predetermined interval,
The interval of 70 is narrower at one end A of the edge than at other portions. This portion includes both holding portions 63 and 64
Corresponds to the position where the groove 10a starts to be formed on the lower surface of the substrate 10 along the gap.

As shown in FIGS. 7, 10 and 11, the substrate cutting apparatus 61 has a groove 10a forming means for forming a groove 10a on the lower surface of the substrate 10. The groove forming means 73 is provided between the holding portions 63 and 64,
It has a cutter 74 that can be moved along the lower surface of the substrate 10 held by 3, 64. The cutter 74 is linked to a driving unit (not shown) and forms a groove 10 a on the lower surface of the substrate 10. The cutter 74 protrudes upward from an opening provided on the upper surface of the box-shaped chip collecting means 75. The chip collecting means 75 is connected to a suction mechanism (not shown). Chips of the substrate 10 cut by the cutter 74 are sucked from the opening by the chip collecting means 75 and collected. The cutter 74 is detachable from the box-shaped chip collecting means 75, and the worn cutter 74 can be easily replaced with a new one.

As shown in FIG. 9 (b), the upper side of the pair of holding portions 63 and 64 facing each other at a predetermined interval has a narrow upper side near the holding surface. Therefore, the distance between the holding portions 63 and 64 for holding the substrate 10 becomes narrower as the groove is closer to the groove 10 a formed in the substrate 10. The flow velocity of the air in the vicinity at the time of suction increases. Therefore, the cutting powder of the substrate 10 that tends to adhere to the groove 10a is reliably removed by suction.

As shown in FIG. 9A, a pair of holding portions 6
In the case where the groove forming means 73 forms the groove 10a on the lower surface of the substrate 10 held by 3, 64, the cutter 74 starts to cut into the lower surface of the substrate 10 from the lower area A in FIG. I will do it. The cutter 74 is the substrate 1
Since the cutting depth gradually increases at the position where the cutting is performed at 0, the cutting operation is not easily stabilized, and irregular cracks or the like are likely to occur in the formed groove 10a.
In this example, at the position where the cutter 74 starts to cut into the substrate 10, the spacing between the suction grooves 70, 70 of both holding portions 63, 64 for fixing the substrate 10 is small, and
Since both sides in the immediate vicinity of “a” can be securely fixed by the suction groove 70, there is little possibility that irregular cracks or the like will occur in the groove 10 a as described above.

In this example, the substrate 10 is a glass substrate for a display element, and has a size of about 370 mm × 470 mm to 550 mm × 650 mm and a thickness of 0.7 to 1.1 m.
m. Rail 6 on which curved movable bearing 67 moves
The radius of 6 is about 40 cm. The rotation range of the movable holding portion 64 is about 2 to 3 degrees in this example. The rotation speed of the movable-side holding unit 64 is, for example, 0.013 rad / sec.
It is about.

The substrate 10 is placed on both the holding portions 63 and 64, and the suction means is operated, and the two holding portions 6 are held by the suction groove 70.
The substrate 10 is adsorbed and fixed on 3, 64. By operating the groove forming means 73, a groove 10a is formed on the lower surface of the substrate 10 along the gap between the holding portions 63 and 64. Pressing cylinder 6
9 is driven to rotate the movable holding portion 64 upward by about 2 to 3 degrees from the horizontal state. At that time, the movable side holding unit 64
Is about 0.013 rad / sec.
The substrate 10 is accurately cut into the desired two shapes without breaking in an irregular direction at the groove 10a.

In the case where the groove 10a is formed in the substrate 10 and the substrate 10 is split into two, the speed of the rotation affects the way of breaking. If you slowly break it, it will not break regularly along the groove 10a,
Irregular cracks are likely to occur. According to this example, one portion of the substrate 10 with respect to the groove 10a is guided by the curved movable bearing 67 so that the groove 10a formed on the substrate 10 as the center of rotation has an appropriate speed around the groove 10a. , The substrate 10 was cut regularly along the groove 10a.

In the substrate cutting apparatus 61 of this embodiment, a groove 1 having a thickness of about 10 μm is formed on a glass substrate having a thickness of 0.7 to 1.1 mm.
0a is formed. In order to divide the glass substrate as much as possible and generate the dust accurately and along the groove 10a, it is desirable to reduce the depth of the groove 10a to be formed as much as possible. If the depth of the groove 10a to be formed is small, the cutter 74
The service life of the device is extended.

The groove 10a formed in the substrate 10 in the conventional glass cutting apparatus has a depth several times as large as the groove 10a formed in the substrate 10 in this example, so that cutting chips are easily generated and cracking is not easy. It is easy to become a rule and the groove 10a
The service life of the cutter 74 for forming was also short.

In order to split the substrate 10 accurately by the shallow groove 10a, the substrate 10 may be split by applying a rotational movement to the groove 10a as a fulcrum. That is, in the above-described embodiment, the groove 10a is formed on the lower surface of the substrate 10, one of the substrates 10 is fixed with respect to the groove 10a, and the other is rotated upward with the groove 10a as an axis. Specifically, the center of the rotational movement of the substrate 10 is a line on the upper surface of the substrate 10 corresponding to the groove 10a formed on the lower surface of the substrate 10.

According to this embodiment, since the cut surface of the substrate 10 is clean, even if the substrate 10 is used for an envelope of a display device such as a field emission device, the process of chamfering the cut surface of the substrate 10 can be performed. A part of the post-process can be omitted, for example, a cleaning process becomes unnecessary.

In the example described above, the holding portion 64 on the movable side is rotated by the pressing cylinder 69. However, the driving mechanism for rotating the movable holding portion 64 is an external force loading means such as an eccentric cam 76 which is connected to a driving source (not shown) and rotates in contact with the arm 65 as shown in FIG. You may.

In the example described above, the movable-side holding portion 64 is attached to the bed 62 by an arc-shaped rail 66 and a curved movable bearing 67. In addition, FIG.
As shown in FIG. 5, an arc-shaped rail 77 and a plurality of pairs of guide wheels 78, 78 for guiding the rail 77 from both sides may be provided between the arm 65 and the bed 62.

[0065]

According to the present invention, a substrate such as glass can be cut safely and efficiently with high quality in spite of being a compact apparatus. And can cope with fluctuations in plate thickness.

[Brief description of the drawings]

FIG. 1 is a diagram schematically showing the structure and operation of a first embodiment.

FIG. 2 is a diagram schematically showing the structure and operation of a second embodiment.

FIG. 3 is a cross-sectional view illustrating a structure of a pressing body according to a third embodiment.

FIG. 4 is a diagram schematically illustrating a structure according to a fourth embodiment;

FIG. 5 is a diagram showing another configuration example of the pressing body in the embodiment.

FIG. 6 is a diagram schematically illustrating a structure according to a fifth embodiment;

FIG. 7 is a perspective view schematically showing the entire structure of a sixth embodiment.

FIG. 8 is a front view showing the structure of the sixth embodiment.

FIG. 9A is a partial plan view of a holding unit according to a sixth embodiment, and FIG. 9B is a cross-sectional view taken along a cutting line in FIG.

FIG. 10 is a perspective view schematically illustrating a structure of a groove forming unit according to a sixth embodiment.

FIG. 11 is a sectional view of a groove forming unit according to a sixth embodiment.

FIG. 12 is a front view showing another example of the driving mechanism or the external force load unit in the sixth embodiment.

FIG. 13A is a front view showing another example of the guide means according to the sixth embodiment, and FIG. 13B is a cross-sectional view taken along a cutting line in FIG.

FIG. 14 is a front view showing the structure of a conventional sheet glass cutting apparatus.

FIG. 15 is a perspective view showing a problem in a conventional sheet glass cutting apparatus.

FIG. 16 is an enlarged perspective view of a sheet glass showing a conventional problem.

[Explanation of symbols]

 1, 11, 21, 31, 51, 61 Substrate cutting device 2, 12, 32, 52 Holder 63 Holder on fixed side 64 Holder on movable side 4, 14, 34, 54 Holder 4a, 14a, 35a, 54a Holding surface 9 Drive cylinder as external force applying means 69 Pressing cylinder as external force applying means 76 Cam as external force applying means 18, 22, 36, 57 Pressing body as external force applying means 10 Glass substrate 10 as substrate 10 10a Groove 10a

──────────────────────────────────────────────────続 き Continued on the front page (72) Katsunosuke Ozawa, Incorporated company 629 Oshiba, Mobara-shi, Chiba Futaba Electronics Industry Co., Ltd. (72) Inventor Koji Ueki 629 Oshiba, Mobara-shi, Chiba prefecture (72) Inventor Satoshi Yoshikata 629 Oshiba, Mobara-shi, Chiba Futaba Electronics Industry Co., Ltd. (56) References JP-A-4-280828 (JP, A) JP-A-4-238827 (JP, A) Hei 1-246155 (JP, A) (58) Field surveyed (Int. Cl. ⁶ , DB name) C03B 33/033

Claims (7)

(57) [Claims] 1. A by processing a groove on the substrate the substrate cutting device for cutting the substrate along the groove, the groove in the bottom surface of the substrate
And a substrate formed by the cutter
Swarf collecting means for sucking and collecting swarf generated from
And a pair of holding portions for fixing the bottom surfaces of the respective portions on both sides of the groove of the substrate, and at least one of the pair of holding portions is formed with the groove.
An external force loading means for moving the substrate upward along the center to cut the substrate along the groove. 2. A machined grooves in the substrate in the substrate cutting device for cutting the substrate along the groove, the groove in the bottom surface of the substrate
And a substrate formed by the cutter
Swarf collecting means for sucking and collecting swarf generated from
And a pair of holding portions that respectively hold the bottom surfaces of the respective portions on both sides of the groove of the substrate so as to be movable within a predetermined range, and the respective portions of the substrate held by the holding portion around the groove.
And an external force loading means for moving the substrate upward . 3. A processing a groove on the substrate in the substrate cutting device for cutting the substrate along the groove, the groove in the bottom surface of the substrate
And a substrate formed by the cutter
Swarf collecting means for sucking and collecting swarf generated from
If, spaced a predetermined distance in which a pair of holding surface for holding the bottom surface of each portion of each side of the groove of the substrate each of which is movable between a state not parallel to each other and a state in the same plane medium and a pair of holder, holding means for holding the substrate to the holding table of the holding surface, the said holder said groove
A substrate cutting device, comprising: a driving mechanism for moving the center upward . 4. A processing the groove on the substrate in the substrate cutting device for cutting the substrate along the groove, the groove in the bottom surface of the substrate
And a substrate formed by the cutter
Swarf collecting means for sucking and collecting swarf generated from
And a pair of holding surfaces respectively holding the bottom surfaces of the respective portions on both sides of the groove of the substrate are movable upward in the center of the groove between a state where they are in the same plane and a state where they are not parallel to each other. A pair of holding tables provided at predetermined intervals, holding means for holding the substrate on the holding surface of the holding table, and a pressing body for applying an external force to the substrate held by the holding table along the groove. The substrate is cut by being provided on the pressing body.
Suction removal that sucks and removes substrate fragments generated when
A substrate cutting device , comprising: a removing unit. 5. A groove is formed in a substrate, and the substrate is formed along the groove.
In the substrate cutting apparatus, the groove is formed on the bottom surface of the substrate.
And a substrate formed by the cutter
Swarf collecting means for sucking and collecting swarf generated from
And a pair of bases provided at predetermined intervals, and each base
The bottom of each part on both sides of the groove of the substrate is
A pair of holding surfaces, each holding a pair, are in the same plane.
An elastic body, and the groove formed on an upper surface of the substrate held by the elastic body.
A pressing body for applying an external force along the pressing body;
To remove the substrate fragments generated when the substrate is cut
Board cutting device you; and a suction removal means for removed by. 6. processed grooves in the substrate in the substrate cutting device for cutting the substrate along the groove, the groove in the bottom surface of the substrate
And a substrate formed by the cutter
Swarf collecting means for sucking and collecting swarf generated from
And the bottom surface of one part of the substrate bordering the groove
The holding part on the fixed side to hold and the other side of the substrate
Turn that holds the bottom of the part and substantially matches the groove
A movable holding portion that is rotatable about a rotation axis;
And a drive mechanism for rotating the holding part on the upper side upward . 7. A holding unit on which the substrate is placed.
A holding surface, a suction groove formed in the holding surface, and the suction groove
Suction means for sucking the inside, wherein the suction groove is
Near the position where the groove forming means starts forming a groove in the substrate.
7. The substrate cutting device according to claim 6 , wherein the substrate cutting device is formed closer to the groove than other portions .