JP2018027666A - End material removal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique for properly removing an end material, even when the width of a divided end material is narrow.SOLUTION: An end material removal device related to a technique disclosed in the specification of the present invention, has a removal unit (16) including: an adsorption unit (16A) which presses a first substrate (10A), and adsorbs an end material (100) divided from the first substrate (10A) along a scribe line in that position; and a division unit (16B) which divides the first substrate (10A) along the scribe line by being pressed against a second substrate (10B). The adsorption unit (16A) and the division unit (16B) are integrally formed.SELECTED DRAWING: Figure 1

Description

  The technique disclosed in the present specification relates to a technique for removing an end material cut from a substrate.

  Generally, the manufacturing process of a liquid crystal panel includes a dividing step of cutting out a unit substrate of a desired size from a bonded substrate formed by bonding a first substrate and a second substrate.

  Here, for example, a color filter is formed on the first substrate. In addition, a thin film transistor (TFT) and a terminal for external connection are formed on the second substrate.

  The terminal for external connection in the second substrate needs to be exposed at the end of the bonded substrate. Therefore, in the above dividing step, in addition to the step of cutting each of the first substrate and the second substrate as a unit substrate, in order to expose the terminal region, which is a region where the terminal is formed on the second substrate, A step of cutting the end portion of the first substrate in the unit substrate is included.

  To divide the substrate, first, scribing is performed to form a scribe line that is a planned dividing line, and pressure is further applied from the back side of the portion where the scribe line is formed. In the case of a bonded substrate, for example, as described in Patent Document 1 (Japanese Patent Application Laid-Open No. 2003-241173), scribe lines are formed on both surfaces of the bonded substrate, and pressure is applied from the back side of each. Divide the substrate.

JP 2003-241173 A

  In recent years, as the liquid crystal display area is enlarged, the terminal area of the second substrate is being reduced. Therefore, even in the step of dividing the end portion of the first substrate in the unit substrate, the width of the end portion of the divided substrate, that is, the width of the end material is narrow.

  If the width of the end material is narrow, the end material tends to stick to the terminal region of the second substrate, and the end material may not be completely removed by air blowing or the like.

  The technology disclosed in the specification of the present application has been made in order to solve the problems described above, and the first substrate is divided when the end portion of the first substrate in the bonded substrate is divided. The present invention relates to a technique capable of appropriately removing the end material even when the width of the end material divided from the above is narrow.

  In the first aspect of the technology disclosed in the specification of the present application, a support portion that supports a lower surface of a bonded substrate in which a first substrate and a second substrate are bonded together, and an upper surface of the bonded substrate are pressed down. A pressing portion; and a removal portion that removes an end material cut from the first substrate at an end portion of the bonded substrate, and the first substrate is divided on a surface of the first substrate. A scribe line for defining a position is formed, and the pressing portion presses an upper surface of the bonded substrate on a first side of the scribe line in a plan view, and the removing portion presses the first substrate. And the suction part which can attract the end material divided from the first substrate along the scribe line at the position and the second substrate are pressed against the second substrate, Sukura A cutting portion that cuts along the brine, and the suction portion holds the first substrate on the second side opposite to the first side of the scribe line in plan view, and The end material separated from the first substrate is adsorbed at the position, and the divided portion is pressed against the second substrate at a position corresponding to the position where the scribe line is formed on the first substrate. As a result, the first substrate is divided, and the adsorption portion and the division portion are integrally formed.

  In addition, a second aspect of the technology disclosed in the specification of the present application relates to the first aspect, and the adsorption portion includes an adsorption member that is a porous substance attached to a place that contacts the end material. Have.

  A third aspect of the technique disclosed in the specification of the present application is related to the first aspect or the second aspect, and the support portion is movable in a direction of approaching or retracting from the removal portion. .

  Further, a fourth aspect of the technology disclosed in the specification of the present application is related to any one of the first aspect to the third aspect, and the end material removing device further includes the removing unit. And a moving mechanism for moving in a direction of approaching or retracting with respect to the support portion.

  A fifth aspect of the technology disclosed in the specification of the present application relates to the fourth aspect, wherein the moving mechanism rotatably supports the removal unit, and the removal unit includes the suction unit and the suction unit. It can be rotated around a direction intersecting with the direction connecting the divided portions.

  According to the first to fifth aspects of the technology disclosed in the specification of the present application, the end material at the end of the first substrate divided along the scribe line can be adsorbed by the adsorbing part. . Therefore, even if the width of the divided end material is narrow, the end material can be appropriately removed.

  The objectives, features, aspects, and advantages of the technology disclosed in this specification will become more apparent from the detailed description and the accompanying drawings provided below.

It is a figure which illustrates roughly the composition of the end material removal device about an embodiment. It is a figure which illustrates a mode that a scribe line is formed in the 1st board | substrate in a bonded substrate regarding embodiment. It is a figure which illustrates a mode that a scribe line is formed in the 1st board | substrate in a bonded substrate regarding embodiment. It is a front view which illustrates the composition of the removal part about an embodiment. It is a side view which illustrates the composition of the removal part about an embodiment. It is a figure which illustrates the structure of the end material removal apparatus in an operation | movement process (parting) regarding embodiment. It is a figure which illustrates the structure of the end material removal apparatus in the operation | movement process (removal) regarding embodiment. It is a figure which illustrates the structure of the scrap material removal apparatus in the operation | movement process (discard) regarding embodiment.

  Embodiments will be described below with reference to the accompanying drawings.

  Note that the drawings are schematically shown, and the configuration is omitted or simplified as appropriate for the convenience of explanation. In addition, the mutual relationships between the sizes and positions of the configurations and the like shown in different drawings are not necessarily accurately described and can be changed as appropriate.

  Moreover, in the description shown below, the same code | symbol is attached | subjected and shown in the same component, and it is the same also about those names and functions. Therefore, detailed descriptions thereof may be omitted to avoid duplication.

  In the description described below, terms that mean a specific position and direction such as “top”, “bottom”, “side”, “bottom”, “front” or “back” may be used. Even if it exists, these terms are used for convenience in order to make it easy to understand the contents of the embodiment, and are not related to the direction in actual implementation.

  In addition, in the description described below, even if an ordinal number such as “first” or “second” is used, these terms mean that the contents of the embodiment are understood. It is used for the sake of convenience, and is not limited to the order that can be generated by these ordinal numbers.

<Embodiment>
Hereinafter, the scrap material removing apparatus according to the present embodiment will be described.

<About the configuration of the scrap material removal device>
FIG. 1 is a diagram schematically illustrating a configuration of a scrap material removing apparatus according to the present embodiment.

  As illustrated in FIG. 1, the edge material removing apparatus includes at least a support portion 12 that supports the lower surface of the bonded substrate 10, a pressing portion 14 that presses the upper surface of the bonded substrate 10, and an end of the bonded substrate 10. And a removal unit 16 that sandwiches the bonded substrate 10 from the upper and lower surfaces.

  Further, the scrap material removing apparatus can further include a moving mechanism 18 that controls the rotation and movement of the removing unit 16.

  The bonded substrate 10 is a substrate formed by bonding the first substrate 10A and the second substrate 10B. The first substrate 10A is, for example, a substrate on which a color filter is formed. The second substrate 10B is, for example, a substrate on which a TFT is formed. In addition, the second substrate 10B has a terminal region where terminals for external connection are formed at the end.

  As the bonded substrate 10, in addition to a glass substrate, for example, a ceramic substrate made of low-temperature fired ceramics or high-temperature fired ceramics, a silicon substrate, a compound semiconductor substrate, a sapphire substrate, or a quartz substrate may be used.

  The upper and lower arrangements of the first substrate 10A and the second substrate 10B in the bonded substrate 10 may be opposite to the case illustrated in FIG. That is, the first substrate 10A may be disposed on the lower side and the second substrate 10B may be disposed on the upper side.

  Here, a scribe line for defining a position at which the substrate is divided is formed on the surface of the bonded substrate 10 opposite to the surface of the first substrate 10A that contacts the second substrate 10B.

  FIGS. 2 and 3 are diagrams illustrating a state in which a scribe line is formed on the first substrate 10 </ b> A of the bonded substrate 10.

  The scribing apparatus 200 forms a scribe line at a predetermined location on the bonded substrate 10 to be conveyed.

  As illustrated in FIG. 2, the scribing apparatus 200 includes a belt conveyor 200 a and a belt conveyor 200 b that are arranged along the transport direction, that is, the Y axis positive direction in FIG. 2. The scribing apparatus 200 includes a scribing unit 20 disposed between the belt conveyor 200a and the belt conveyor 200b. The scribe part 20 should just be arrange | positioned in the location in any one of the conveyance direction of the bonding board | substrate 10. FIG.

  When the bonded substrate 10 conveyed by the belt conveyor 200a and the belt conveyor 200b reaches the location where the scribe unit 20 is disposed, the bonded substrate 10 is scribed.

  As illustrated in FIG. 3, a scribe line is formed by the scribe unit 20 with respect to the first substrate 10 </ b> A of the bonded substrate 10 supported by the support unit 12.

  Specifically, the cutter wheel 20B held by the scribe head 20A in the scribe unit 20 rolls along the beam 20C extending in the X-axis direction in FIG. By doing so, a scribe line extending in the depth direction in FIG. 2 is formed on the first substrate 10A.

  Here, the cutter wheel 20B is made of, for example, cemented carbide, sintered diamond, or single crystal diamond. The cutter wheel 20B has a disk shape and has a ridge line that functions as a blade on the outer peripheral portion.

  The scribe line is formed, for example, several m in the depth direction on the paper surface in the first substrate 10A corresponding to the size of the substrate. On the other hand, the width W on the substrate end side of the scribe line corresponding to the exposed terminal region is, for example, 5 mm. Therefore, the width of the end material divided along the scribe line is relatively narrow.

  The bonded substrate 10 may be formed at a position where the scribe portion 20 in FIG. 2 is arranged, that is, a scribe line may be formed while the bonded substrate 10 is being transported, or a position at which an end material described later is removed, That is, a scribe line may be formed by a scribe portion arranged at the location at the most downstream position of the support portion 12 as exemplified in FIG.

  The support part 12 in FIG. 1 supports the lower surface of the bonded substrate 10. The support unit 12 may be a mechanism capable of transporting the bonded substrate 10. For example, in the case illustrated in FIG. 1, the support unit 12 can transport the bonded substrate 10 in the left-right direction in FIG. It is a conveyor. The support portion 12 itself can also move in a direction to approach or retract from the removal portion 16.

  The pressing unit 14 presses the upper surface of the bonded substrate 10 supported by the support unit 12. The pressing portion 14 is movable in the vertical direction.

  Since the pressing portion 14 is movable in the vertical direction, for example, when the support portion 12 is transporting the bonded substrate 10, it is retracted upward and the bonded substrate 10 is transferred to a predetermined position. The upper surface of the bonded substrate 10 can be pressed by moving downward at this point.

  FIG. 4 is a front view illustrating the configuration of the removal unit 16. FIG. 5 is a side view illustrating the configuration of the removal unit 16.

  The removing unit 16 holds the first substrate 10A of the bonded substrate 10 and holds the adsorbing unit 16A capable of adsorbing the end material divided along the scribe line, and the second substrate 10B of the bonded substrate 10 By being pressed, it includes a dividing portion 16B that divides the first substrate 10A along the scribe line, and a connecting portion 16C that integrally forms the adsorption portion 16A and the dividing portion 16B.

  In addition, when the vertical arrangement of the bonded substrate 10 is opposite to the case illustrated in FIGS. 1, 4, and 5, the vertical arrangement of the suction part 16 </ b> A and the dividing part 16 </ b> B in the removal part 16. Is the opposite arrangement.

  The suction portion 16A holds the first substrate 10A at a position closer to the substrate end than the scribe line in plan view.

  Moreover, the adsorption | suction part 16A has the adsorption | suction member 160 attached to the location which contacts an end material. The adsorbing member 160 is, for example, a porous material. The adsorbing portion 16A vacuum adsorbs the end material in a state where the adsorbing member 160, which is a porous material, is in contact with the divided end material.

  In addition, the adsorption | suction part 16A may adsorb | suck the part used as an end material in the step before dividing.

  The dividing portion 16B moves the break bar 161 up and down by air pressure and the break bar 161 pressed against the second substrate 10B at the location corresponding to the location where the scribe line is formed on the first substrate 10A of the bonded substrate 10. An air cylinder 162.

  The break bar 161 is in contact with the second substrate 10B at a position overlapping the scribe line in plan view, and applies pressure to the second substrate 10B by driving the air cylinder 162.

  The break bar 161 applies pressure from the second substrate 10B side to the bonded substrate 10 that is pressed by the pressing portion 14 and the suction portion 16A in FIG. 10A is divided along the scribe line.

  The connecting portion 16C may be extendable / contractible in a direction connecting the adsorbing portion 16A and the dividing portion 16B (see arrow X in FIGS. 1 and 5). In that case, the distance between the adsorption portion 16A and the dividing portion 16B can be changed by the expansion and contraction of the connecting portion 16C.

  The moving mechanism 18 in FIG. 1 moves the removing unit 16 in the horizontal direction (see arrow Y in FIG. 1) and the first moving unit 18A in the vertical direction (indicated by the arrow Z in FIG. 1). And a second moving part 18B to be moved.

  The first moving unit 18A has, for example, a rail unit that is linked to the removing unit 16 and extends in the horizontal direction. According to the first moving unit 18 </ b> A, the removing unit 16 can move in the direction of approaching or retracting from the support unit 12. The second moving unit 18B includes, for example, a rail unit that is linked to the first moving unit 18A and extends in the vertical direction.

  Further, the first moving unit 18A supports the connecting unit 16C in a rotatable manner. That is, the connecting portion 16 </ b> C has the rotation shaft 101. In the case illustrated in FIG. 1, the connecting portion 16 </ b> C has a rotation axis along the horizontal direction. That is, the rotation shaft 101 of the connecting portion 16C is an axis in a direction intersecting with the direction connecting the suction portion 16A and the dividing portion 16B.

<Operation of the scrap material removal device>
Next, the operation of the scrap material removing apparatus according to the present embodiment will be described with reference to FIGS. Here, FIGS. 6 to 8 are diagrams illustrating the configuration of the scrap material removing device in the operation process.

  First, the bonded substrate 10 in which the first substrate 10 </ b> A and the second substrate 10 </ b> B are bonded together is disposed on the upper surface of the support portion 12. Then, the pressing unit 14 presses the upper surface of the bonded substrate 10 disposed on the upper surface of the support unit 12. At this time, the bonded substrate 10 is disposed at a position slightly protruding from the end portion of the support portion 12 so that the end portion of the first substrate 10A can be easily divided later.

  On the other hand, the second moving unit 18B in the moving mechanism 18 adjusts the vertical position of the removing unit 16 by moving the first moving unit 18A along the rail unit in the vertical direction. Further, the first moving unit 18A in the moving mechanism 18 moves the removing unit 16 in the horizontal direction along the rail unit, so that the removing unit 16 can come into contact with the end of the bonded substrate 10. The horizontal position of the removal unit 16 is adjusted.

  And the adsorption | suction part 16A presses down the 1st board | substrate 10A by adjusting the up-and-down position of the adsorption | suction part 16A by the movement of 18 A of 1st moving parts, and also expansion / contraction of the connection part 16C.

  At this time, the adsorption unit 16A holds down the position of the scribe line on the substrate end side in plan view. By doing so, the pressing portion 14 and the suction portion 16A respectively press the first substrate 10A across the scribe line in plan view.

  In this state, as illustrated in FIG. 6, the break bar 161 in the dividing portion 16 </ b> B is pressed against the second substrate 10 </ b> B of the bonded substrate 10 by driving the air cylinder 162 in the dividing portion 16 </ b> B. Here, the position at which the break bar 161 is pressed is a position that overlaps with the portion where the scribe line is formed on the first substrate 10A in plan view. By doing so, the first substrate 10 </ b> A of the bonded substrate 10 is divided along the scribe line.

  Next, the adsorbing part 16A adsorbs the end material 100 via the adsorbing member 160 in contact with the divided end material 100. Then, as illustrated in FIG. 7, the suction portion 16 </ b> A is attached to the bonded substrate 10 by adjusting the vertical position of the suction portion 16 </ b> A by the movement of the first moving portion 18 </ b> A and the expansion / contraction of the connecting portion 16 </ b> C. Retract from the end. That is, the end material 100 adsorbed by the adsorbing portion 16 </ b> A is removed from the end portion of the first substrate 10 </ b> A in the bonded substrate 10.

  Next, as illustrated in FIG. 8, the removal unit 16 is moved along the rail portion of the first moving unit 18 </ b> A, and the position where the removal unit 16 does not contact the end of the bonded substrate 10 even when the removal unit 16 rotates. The removal unit 16 is retracted until

  And in the said position, the connection part 16C is rotated centering around the rotating shaft 101. FIG. By doing so, the dividing portion 16B is retracted from the position in the vertical downward direction of the end material 100 adsorbed to the adsorbing portion 16A.

  Then, the adsorbing unit 16 </ b> A cancels the adsorption of the end material 100 and discards the end material 100 to the shooter 102.

<About the effects produced by the embodiment described above>
Next, effects produced by the embodiment described above will be exemplified. In the following description, the effect is described based on the specific configuration exemplified in the above-described embodiment, but is exemplified in the present specification within a range in which the same effect occurs. Other specific configurations may be substituted.

  According to the embodiment described above, the edge material removing device includes the support portion 12, the pressing portion 14, and the removing portion 16. The support unit 12 supports the lower surface of the bonded substrate 10 on which the first substrate 10A and the second substrate 10B are bonded. The pressing part 14 presses the upper surface of the bonded substrate 10. The removing unit 16 removes the end material 100 separated from the first substrate 10 </ b> A at the end of the bonded substrate 10. In addition, a scribe line that defines the dividing position of the first substrate 10A is formed on the surface of the first substrate 10A. Moreover, the pressing part 14 presses the upper surface of the bonded substrate 10 on the first side of the scribe line in plan view.

  Moreover, the removal part 16 is provided with the adsorption | suction part 16A and the parting part 16B. The adsorption unit 16A can hold the first substrate 10A and can adsorb the end material 100 separated from the first substrate 10A along the scribe line at the position. The dividing portion 16B is pressed against the second substrate 10B to divide the first substrate 10A along the scribe line.

  The adsorbing portion 16A holds the first substrate 10A on the second side, which is the opposite side of the first side of the scribe line, in plan view, and is an end material that is separated from the first substrate 10A at the position. Adsorb 100. Further, the dividing unit 16B divides the first substrate 10A by being pressed against the second substrate 10B at a position corresponding to the position where the scribe line is formed on the first substrate 10A. Here, the adsorption portion 16A and the dividing portion 16B are integrally formed.

  According to such a configuration, the end material 100 at the end portion of the first substrate 10A divided along the scribe line can be adsorbed by the adsorbing portion 16A. Therefore, even if the end material 100 to be divided is narrow, the end material 100 can be appropriately removed. That is, since the end material 100 is narrow, the end material 100 is likely to stick to the terminal region of the second substrate 10B, and even if the end material 100 cannot be completely removed by air blowing or the like, the end material 100 is removed. By adsorbing, the end material 100 can be peeled off from the second substrate 10B and removed.

  Other configurations exemplified in the present specification other than these configurations can be omitted as appropriate. In other words, the effects described above can be produced only with these configurations.

  However, when at least one of the other configurations exemplified in the present specification is appropriately added to the configuration described above, that is, the configuration described above is not exemplified as the configuration described above. Even when other configurations described above are added to the configurations described above, the effects described above can be similarly produced.

  Moreover, according to embodiment described above, adsorption part 16A has adsorption member 160 which is a porous substance attached to a part which contacts end material 100. According to such a configuration, the adsorbing portion 16 </ b> A can vacuum adsorb the end material 100 in a state where the adsorbing member 160 that is a porous substance is in contact with the end material 100 to be divided.

  Further, according to the embodiment described above, the support part 12 is movable in a direction in which the support part 12 approaches or retreats with respect to the removal part 16. According to such a configuration, the suction portion 16A can be retracted from the end portion of the bonded substrate 10 while the end material 100 is sucked by the suction portion 16A. Therefore, the end material 100 adsorbed by the adsorbing portion 16 </ b> A can be removed from the end portion of the bonded substrate 10.

  Further, according to the embodiment described above, the scrap material removing device includes the moving mechanism 18 that moves the removing unit 16 in a direction in which the removing unit 16 approaches or retracts from the support unit 12. According to such a configuration, the suction portion 16A can be retracted from the end portion of the bonded substrate 10 while the end material 100 is sucked by the suction portion 16A. Therefore, the end material 100 adsorbed by the adsorbing portion 16 </ b> A can be removed from the end portion of the bonded substrate 10. In addition, if the support portion 12 can move in a direction away from the removal portion 16, the degree of freedom of the retracted position of the removal portion 16 when removing the end material 100 can be increased.

  Moreover, according to embodiment described above, the moving mechanism 18 supports the removal part 16 rotatably. And the removal part 16 can rotate centering | focusing on the direction which cross | intersects the direction which connects 16 A of adsorption | suction parts, and the part 16B. According to such a configuration, the connecting portion 16C rotates about the rotation shaft 101, whereby the position of the dividing portion 16B can be retracted from the vertically downward direction of the suction portion 16A. Therefore, when discarding the end material 100 adsorbed by the adsorbing portion 16A to the shooter 102, it is possible to avoid the end material 100 falling from the adsorbing portion 16A from coming into contact with the dividing portion 16B.

<Modifications in Embodiments Described above>
In the embodiment described above, the material, material, dimension, shape, relative arrangement relationship, or implementation condition of each component may be described, but these are examples in all aspects. Thus, it is not limited to those described in this specification.

  Accordingly, countless variations and equivalents not illustrated are envisioned within the scope of the technology disclosed in this specification. For example, the case where at least one component is modified, the case where it is added, or the case where it is omitted are included.

DESCRIPTION OF SYMBOLS 10 Bonded board | substrate 10A 1st board | substrate 10B 2nd board | substrate 12 Support part 14 Pressing part 16 Removal part 16A Adsorption part 16B Separation part 16C Connection part 18 Movement mechanism 18A 1st movement part 18B 2nd movement part 20 Scribing part 20A Scribe head 20B Cutter wheel 20C Beam 100 End material 101 Rotating shaft 102 Shooter 160 Adsorption member 161 Break bar 162 Air cylinder 200 Scribing device 200a, 200b Belt conveyor X, Y, Z Arrow W Width

Claims (5)

A support unit for supporting the lower surface of the bonded substrate in which the first substrate and the second substrate are bonded together;
A pressing part for pressing the upper surface of the bonded substrate;
A removal unit that removes the end material cut from the first substrate at an end of the bonded substrate;
On the surface of the first substrate, a scribe line for defining a dividing position of the first substrate is formed,
The pressing portion presses the upper surface of the bonded substrate on the first side of the scribe line in plan view,
The removing unit is
An adsorbing portion that holds the first substrate and can adsorb the end material that is separated from the first substrate along the scribe line at the position;
A pressing portion that is pressed against the second substrate to divide the first substrate along the scribe line;
The suction part holds the first substrate on the second side opposite to the first side of the scribe line in plan view, and is separated from the first substrate at the position. Adsorb the end material,
The dividing portion is divided into the first substrate by being pressed against the second substrate at a position corresponding to a position where the scribe line is formed on the first substrate,
The adsorbing part and the dividing part are integrally formed.
Mill material removal device. The adsorbing portion has an adsorbing member that is a porous substance attached to a location that comes into contact with the end material.
The scrap material removing apparatus according to claim 1. The support portion is movable in a direction of approaching or retreating with respect to the removal portion.
The scrap material removing device according to claim 1 or 2. The scrap material removing device further includes:
A moving mechanism for moving the removal unit in a direction of approaching or retracting the support unit;
The scrap material removing apparatus according to any one of claims 1 to 3. The moving mechanism rotatably supports the removing unit,
The removal part is rotatable about a direction intersecting a direction connecting the suction part and the dividing part.
The scrap material removing apparatus according to claim 4.

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