WO2003002471A1

WO2003002471A1 - Device and method for breaking fragile material substrate

Info

Publication number: WO2003002471A1
Application number: PCT/JP2002/006544
Authority: WO
Inventors: Haruo Wakayama; Noboru Hasaka; Masahiro Fujii
Original assignee: Mitsuboshi Diamond Industrial Co., Ltd
Priority date: 2001-06-28
Filing date: 2002-06-27
Publication date: 2003-01-09
Also published as: JP4847513B2; CN1259264C; KR20030040392A; KR100835622B1; JPWO2003002471A1; TW559620B; JP2009101692A; JP4902631B2; JP2009078569A; JP2010000805A; CN1464866A; JP4482328B2

Abstract

A breaking device for a fragile material substrate, wherein a first product table (13) and a second product table (14) are disposed on a sliding table (11) and a tilting table (12), respectively, so that the edge parts thereof can provide specific angles, a substrate (G) having scribed both faces is put on the tables and fixedly pressed by a first clamp bar (15a) and a second clamp bar (16a), and a shearing force and a tension are applied to the substrate (G) at scribe lines (S) by the clamp bar as a pressing point when the second product table (14) is rotated, whereby, since the clamp bar with less clearance acts as a break point, the substrate (G) can be laterally divided into two parts.

Description

Description: Breaking device for brittle material substrate and breaking method thereof

The present invention relates to an apparatus and a method for breaking brittle material substrates used for cutting brittle material substrates such as glass, semiconductor wafers, and ceramics. Background art

FIG. 1 shows a state where a glass plate 1 is scribed using a glass cutting wheel 2. The scribe forms a scribe line S on the surface of the glass plate 1. In the figure, the enlarged cross section in the circle area is shown in the figure below. B shows the depth of the vertical crack formed by this scribe.

FIG. 2 schematically shows a conventional breaker that is generally used. In this breaking device, a glass plate 1 having a scribe line S formed on the back surface is set on a table 3 with a mat M therebetween. Above the glass plate 1, a break bar 4 is located. The break bar 4 is formed by joining a hard rubber 4 b having a V-shaped cross section to the lower surface of a rod-shaped metal material 4 a, and is held parallel to the glass plate 1 by a drive mechanism (not shown). And it can be moved up and down freely. Then, the lower end of the hard rubber 4 b of the break bar 4 is pressed from above the glass plate 1 via the glass plate 1 so as to match the scribe line S. In this way, the glass sheet 1 is slightly bent on the mat M, so that a vertical crack reaches the glass sheet surface, and the glass sheet 1 is divided along the scribe line S.

FIG. 3 shows another break method disclosed in Japanese Patent Application Laid-Open No. 4-28088 < The divided tables 3a and 3b are installed with a gap therebetween. The glass plate 1 is suction-fixed over both the tables 3a and 3b so that the scribe line S formed on the upper surface is located at the gap. Then, by slightly rotating one table 3a in the direction of the arrow along the rotation center axis 平行 parallel to the lower gap, the glass plate 1 is bent and divided. The glass plate 1 can be divided by simultaneously rotating both tables 3a and 3b. By rotating one of the tables 3a at the same time as separating it from the table 3, it can be divided so that the cut surface will not be damaged.However, as shown in the lower diagram of FIG. The depth is not uniform, and there are deep parts such as Da and Db. The scribe locations corresponding to Da and Db are indicated by Sa and Sb. When the glass sheet 1 is cut by the above-described method, even if a uniform cutting force is applied to the glass sheet 1, the cutting of the glass sheet 1 does not proceed uniformly, but S a, S b The cutting of the glass plate is completed first at the point indicated by. That is, a vertical crack reaches the lower surface of the glass sheet 1 at this position, and thereafter, the glass sheet 1 is divided in the scribe direction starting from the locations of Sa and Sb.

Therefore, in the conventional dividing method, the dividing of the glass plate 1 proceeds from a plurality of points of the scribe line as starting points, and as a result, the dividing section may be shaped like a folding screen or may be curved, thereby deteriorating the product value. Had the disadvantage of doing so. Laser scribing using a laser beam is also being studied because dust can be prevented during scribing. In laser scribing, a glass plate is moved while irradiating a laser beam, and spot cooling with a refrigerant is performed following the movement. In this way, a thin scribe line is formed on the glass plate by utilizing the thermal distortion of the glass plate. This scribe line is also called blind scribe because the scribe line is thin and invisible. However, when a glass plate that has been blind scribed is cut by a conventional breaking device, the depth of the cracks resulting from the blind scribe However, since it is shallow, a large dividing force is required. As a result, there have been problems that the device has become too large or cannot be completely separated. Disclosure of the invention

The present invention has been made in view of such a conventional problem, and it is possible to reduce a shearing force applied to a brittle material substrate having various shapes to the substrate, and to obtain a brittle material having a uniform sectional surface. An object of the present invention is to realize a substrate breaking device and a method thereof.

The breaking device according to the present invention comprises: a first and second product table for placing a brittle material substrate having a scribe line formed on at least one surface such that the scribe line is located between the gaps; When the edge of the first product table facing the product table is the first edge and the edge of the second product table facing the first product table is the second edge, the first edge of the brittle material substrate A first product clamp unit that presses and fixes a portion located at the edge of the second product clamp unit, a second product clamp unit that presses and fixes a portion located at the second edge of the brittle material substrate, and a brittle material substrate The first product table and the first product clamp unit are integrated into the scribe line at right angles to the scribe line. A tilting mechanism that makes the second product table and the second product clamp unit integrally rotatable using a tilting axis parallel to the scribe line of the brittle material substrate as a rotation axis, and a tilting mechanism. And a rotation control unit for controlling the rotation of the second product table and the second product clamp unit, wherein the first product table and the second product table are configured such that an edge facing each of the two tables is an edge. The second product table is arranged so as to be non-parallel, and the tilt axis of the second product table is within the thickness range of the substrate as viewed from the scribe line of the brittle material substrate.

In the breaking device of the present invention, a scribe line is formed on at least one surface. The first and second product tables on which the formed brittle material substrate is placed so that the scribe line is positioned between the gaps, and the edge of the first product table opposed to the second product table are shown in FIG. When the edge of the second product table facing the first product table is the second edge, the portion positioned at the first edge of the brittle material substrate is pressed and fixed. (1) The product clamp unit, the second product clamp unit that presses and fixes the portion located at the second edge of the brittle material substrate, and the tilt axis parallel to the scribe line of the brittle material substrate as the rotation axis A first tilting mechanism for integrally rotating the first product table and the first product clamp unit, and a second tilting axis parallel to a scribe line of the brittle material substrate, and a second tilting mechanism. Product table A second tilting mechanism for integrally rotating the first and second product clamp units, and controlling the first and second tilting mechanisms to control the first product table, the first product clamp unit and the second product clamp unit. And a rotation control unit for rotating the second product table and the second product clamp unit. The first product table and the second product table have opposite edges of both tables. The tilt axis of the first product table is located above the board near the scribe line of the brittle material board, and the tilt axis of the second product table is the scribe line of the brittle material board. It is characterized by being on the lower side of a nearby substrate.

Further, the breaking device of the present invention is a breaking device for breaking a brittle material substrate by fixing a scribed brittle material substrate on an upper surface to a table divided into two and rotating at least one of the tables. The center axis has a predetermined angle with respect to the scribe direction of the brittle material substrate.

Further, the breaking device of the present invention is a breaking device that breaks a brittle material substrate by fixing a scribed brittle material substrate on an upper surface to a table divided into two and rotating at least one of the tables. The other table includes three telescopic arms at least partially non-parallel, a universal joint provided at each end of the arm, and connecting the table and the fixed part at an arbitrary angle, And a control unit for controlling one position of the table by controlling the length of each arm.The method for breaking a brittle material substrate according to the present invention further comprises: The position of the brittle material substrate on which the scribe has been formed is fixed to the table according to the gap between the tables, and the scribe line is not parallel to the scribe line formed on the brittle material substrate. By rotating one of the tables along a rotation axis that is not coplanar with the scribe line, breaking the glass plate along the scribe line It is an butterfly.

Further, the method for breaking a brittle material substrate according to the present invention is a method for breaking a brittle material substrate, which divides a mother bonded substrate obtained by bonding two brittle material substrates and obtains a plurality of bonded substrates having a smaller shape. Forming a scribe line S 1 at a predetermined position on the surface of one of the mother bonded substrates using a first scribing device (1); A step (2) of forming a scribe line S 2 in the same direction as the scribe line S 1 using a second scribe device, and a laminating process in which scribe lines S 1 and S 2 are formed on both sides. The substrate is fixed to the two tables of the breaker, and at least one of the tables is rotated to apply tensile stress or shear stress to the scribe lines S 1 and S 2, and the mother-laminated substrate is divided into a plurality of substrates. Cutting process (3) And characterized in that:

Further, the method for breaking a brittle material substrate of the present invention includes a mother laminating method in which a first brittle material substrate having a scribe line not formed and a second brittle material substrate having a scribe line S2 formed in advance are bonded. This is a method for breaking a brittle material substrate by dividing the substrate and obtaining a plurality of smaller-sized bonded substrates, wherein the scribing is performed in the same direction as the scribe line S2 on the surface of the first brittle material substrate. Forming a scribe line S 1 using a cutting device (1), and fixing a mother-laminated substrate having scribe lines S 1 and S 2 on both sides to two tables of a breaking device, (2) applying a tensile stress or a shear stress to the scribe lines S l and S 2 by rotating at least one of them to divide the mother bonded substrate into a plurality of substrates. It does.

Further, the method for breaking a brittle material substrate according to the present invention includes the steps of: dividing a mother bonded substrate obtained by bonding a first brittle material substrate and a second brittle material substrate having unformed scribe lines; The method for breaking a brittle material substrate to obtain a plurality of bonded substrates, wherein the scribe lines S 1 and S 2 are simultaneously formed on the surfaces of the first and second brittle material substrates using a double-side scribe device. Step (1) and fixing the mother-laminated substrate on which the scribe lines S 1 and S 2 are formed on both surfaces to two tables of a breaker, and rotating at least one of the tables to form a scribe line. (2) applying tensile stress or shear stress to S 1 and S 2 to divide the mother-laminated substrate into a plurality of substrates. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is an explanatory diagram showing a state of a vertical crack when scribing is performed on a glass plate.

FIG. 2 is a perspective view showing a configuration of a main part of a conventional break device using a break bar.

FIG. 3 is a perspective view showing a main configuration of a conventional breaking device that breaks by rotating a table.

FIG. 4 is a perspective view showing the overall configuration of the breaking device according to the first embodiment of the present invention.

FIG. 5 is an exploded perspective view showing the entire configuration of the breaking device according to the first embodiment. It is.

FIG. 6 is a plan view showing a state where a substrate is arranged on a table of the breaker.

FIG. 7 is a cross-sectional view showing a configuration of a main part of a scribe line section of the breaking device according to the first embodiment.

FIG. 8 is an explanatory view showing a modification of the substrate at the time of the break.

FIG. 9 is a cross-sectional view showing a state in which the substrate is divided in the breaker according to the first embodiment.

FIG. 10 is a plan view showing a state in which the substrate is divided in the breaking device according to the first embodiment.

FIG. 11 is a perspective view showing an overall configuration of a breaking device according to Embodiment 2 of the present invention.

FIG. 12 is an exploded perspective view showing the entire configuration of the breaking device according to the second embodiment.

FIG. 13 is a cross-sectional view showing a main configuration of a scribe line section of the breaking device according to the second embodiment.

FIG. 14 is a cross-sectional view showing a state in which the substrate is cut in the breaker according to the second embodiment.

FIG. 15 is a partially cutaway perspective view showing a main structure of a breaker according to Embodiment 3 of the present invention.

FIG. 16 is a top view showing a state in which a glass plate is arranged on a table in the breaker according to the third embodiment.

FIG. 17 is an explanatory diagram showing an operation at the time of a break in the break device according to the third embodiment.

FIG. 18 is an enlarged sectional view showing the layer structure of the liquid crystal panel.

FIG. 19 is a partially cutaway perspective view showing a main part structure of a breaker according to Embodiment 4 of the present invention. FIG. 20 is a side view showing a main structure of a breaker according to Embodiment 5 of the present invention.

FIG. 21 is a perspective view showing a state in which a glass plate is placed on a table in the breaker according to the fifth embodiment.

FIG. 22 is a side view showing the operation of the breaking device of the fifth embodiment when the glass plate is cut.

FIG. 23 is a side view showing the movement of the table after the glass plate is cut in the breaker of the fifth embodiment.

FIG. 24 is a side view showing an operation of moving the glass plate after cutting the glass plate in the breaker of the fifth embodiment.

FIG. 25 is an explanatory diagram of a liquid crystal mother-glass substrate automatic cutting line showing an example of a method of breaking a brittle material substrate according to Embodiment 3 of the present invention.

FIG. 26 is a process chart showing a conventional brittle material substrate breaking method.

FIG. 27 is a process chart showing an example of the breaking method according to the sixth embodiment. FIG. 28 is a sectional view of a liquid crystal mother glass substrate used in the breaking method according to the seventh embodiment of the present invention.

FIG. 29 is an explanatory diagram of a liquid crystal mother-glass substrate automatic cutting line showing an example of a method of breaking a brittle material substrate according to the seventh embodiment.

FIG. 30 is an explanatory diagram of a liquid crystal mother-glass substrate automatic cutting line showing an example of a method of breaking a brittle material substrate according to Embodiment 8 of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION

(Embodiment 1)

The break device according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 4 is an external perspective view showing the overall configuration of the breaker 10 according to the first embodiment. This breaking device 10 is referred to as a one-way tilting and breaking machine. The substrate G to be cut is a brittle material substrate such as a glass plate. For the sake of explanation, the spatial coordinates (X, y, z) are used, the table reference plane parallel to the installation floor of the breaker 10 is defined as (X, y, z.), And the table reference plane is perpendicular to the installation floor. The direction is the z-axis, and the cutting direction (break direction) of the substrate G is the y-axis. The breaking device 10 includes a slide table 11 capable of sliding in the X-axis direction and a tilt table 1 capable of tilting about a rotation axis parallel to the y-axis and capable of adjusting the slide in the X-axis direction. Has two.

FIG. 5 is a perspective view showing a state in which the left unit 10A and the right unit 10B of the breaking device 10 are separated. Assuming that the entire breaker 10 is mounted on the base 17 in FIG. 4, the left unit 10A is on the left side of the scribe line S on the board G as shown in FIG. The right unit 10B refers to a mechanism installed on the right side (+ x-axis direction) of the scriber line S of the substrate G.

Also, the first product table 13 is fixed to the slide table 11 and the second product table 14 is fixed to the tilting table 12 in order to place and hold the substrate G to be cut. ing. Also, a first product clamp unit 15 is mounted on the upper part of the first product table 13, and a second product clamp unit 16 is mounted on the upper part of the second product table 14. The scribe line S of the board G is made parallel to the y-axis. The area on the X-axis side (left side) of the board centered on the scribe line S is called the board left GL, and the area on the x-axis side (right side) is the board. Call it the right GR. The first product clamp unit 15 firmly presses the right end of the substrate left part GL to fix the substrate, and the second product clamp unit 16 firmly presses the left end of the substrate right part GR. It fixes the substrate. The left unit 10A is provided with a slide mechanism 11a. The slide mechanism 11a urges the slide table 11 in one X-axis direction, and is provided with an elastic member that applies an urging force, such as an air cylinder and a panel. In addition, the slide mechanism 11a is provided with a stopper 1 for regulating a slide range, a damper for regulating a slide speed, and the like (not shown). The right unit 10B is held by a pair of horizontal holding block upper portions 18 and a pair of horizontal holding block lower portions 19, which are pillars. The horizontal holding block lower part 19 is fixed to the base 17, and the horizontal holding block upper part 18 rotatably holds the tilting tape 12. A slide unit (not shown) is provided between the horizontal holding block upper part 18 and the horizontal holding block lower part 19 so that the horizontal holding block upper part 18 can be adjusted in the X-axis direction. The tilting shaft 18a is provided on the upper horizontal holding block 18 on the + y-axis side and the y-axis side, and the tilting table 12, the second product table 14, and the second product clamp are provided. The unit 16 is held so as to be tiltable with the tilt axis 18a as a rotation axis. The tilting shaft 18a is provided with a bearing housing, for example, on the upper part 18 of the horizontal block, and is held by a pole bearing press-fitted into the housing. Here, the upper part 18 of the horizontal holding block and the tilting shaft 18a are referred to as a tilting mechanism.

The first product clamp unit 15 fixes the left portion GL of the substrate and concentrates the shear stress and the bending stress on the scribe line of the substrate. The first product clamp unit 15 is provided with a first clamp bar 15a for pressing the substrate G near the scribe line S. The tip of the first clamp bar 15a is located at the right edge of the first product table 13 and is finely movable in the z-axis direction. Similarly, the second product clamping unit 16 fixes the right part GR of the substrate and concentrates the shear stress and the bending stress on the scribe line of the substrate. The second product clamp unit 16 is provided with a second clamp bar 16a for pressing the substrate G near the scribe line S. The tip of the second clamp bar 16a is located on the left edge of the second product table 14 and is finely movable in the z-axis direction.

FIG. 6 is a plan view showing the positional relationship with the first and second product tables 13 and 14. The main axis of the first product clamp unit 15, including the first clamp bar 15a, is installed at an angle-α + the y-axis side is inclined. You. In addition, the main shaft of the second product clamp unit 16 including the second clamp bar 16a is also mounted so as to be inclined so that the angle + only + the y-axis side is open. A gap is formed between the product tables 13 and 14.

As shown in FIG. 6, the first product table 13 can be rotated and adjusted on the slide table 11 in the (x, y) plane by a small angle in the CCW direction about the rotation axis 13a. The second product table 14 can also be rotated and adjusted on the tilting table 12 in the (x, y) plane by a small angle in the CW direction about the rotation axis 14a. At four corners of the first product table 13, screw holes 13 b to 13 e having a longer diameter in a tangential direction as viewed from the rotating shaft 13 a are provided. Similarly, the four corners of the second product table 14 are provided with screw holes 14b to 14e having a longer diameter in the tangential direction when viewed from the rotating shaft 14a. Therefore, the first product table 13 is rotated by one angle about the rotation shaft 13a, and the bolts of the screw holes 13b to 13e are fastened to the slide table 11 at that position. In this way, the first product table 13 and the first clamp bar 15a can be fixed from the position indicated by the two-dot chain line in FIG. 6 to the position indicated by the solid line. The same applies to the second product table 14. By such an angle adjustment, the opening angle of the first clamp bar 15a and the second clamp bar 16a can be set to 2α.

As a method for holding the substrate G, it can be fixed to the product table by vacuum suction or other means. When the substrate is glass and a resin film is formed on its surface, it can be fixed also by electrostatic attraction.

The tilting mechanism of the tilting table 12 will be described. As shown in Figs. 4 and 5, the tilt axis 18a of the upper horizontal holding block 18 is used as the rotation axis, and the entire right unit 10B excluding the lower horizontal holding block 19 is used in the CW direction or CCW direction. To be rotatable. FIG. 7 is a cross-sectional view of a main part of the breaking device showing a mounting position of the tilt shaft 18a. A rotation control unit 20 is provided to rotate the tilt table 12 via the tilt mechanism. The rotation control unit 20 rotates the tilting table 12 by a predetermined angle using the rotational force of the motor or the fluid cylinder. The tilt table 12 may be manually rotated through an arm-link. The tilting table 12 starts to rotate and moves in the + X direction at the same time.

In the initial setting of the breaker, it is assumed that the first product table 13 and the second product table 14 are positioned so as to have the same mounting surface with respect to one substrate G. The height of the tilting shaft 18a is adjusted so as to be at the center position when viewed from the upper and lower surfaces of the substrate G placed on the table.

Substrate G thickness 2 d. And The mounting surface of the first product table 13 is (X, y, 1d.), And the position of the tilt axis 18a is (0, y, 0). The position of the tilt axis 18a can be adjusted according to the thickness and the material of the substrate G. Further, assuming that the gap between the right edge of the first product table 13 and the left edge of the second product table 14 is 2 g, the pressing position of the first clamp bar 15 a against the substrate G, The gap between the clamp bar 16a and the pressing position of the substrate G against the substrate G is as shown in FIG. 7, and the interval between the pressing positions of the closest parts is preferably about 2 g. The tilt axis 18a is desirably located within the thickness range of the substrate, in parallel with the scribe line of the substrate G.

Next, the operation of the breaking device having such a mechanism will be described. The substrate G is a laminated glass substrate used for a liquid crystal panel, and as shown in Fig. 8 (a), an upper substrate G1 (0.7 mm thick) and a lower substrate G2 (thickness 0) having various electrodes formed inside. 7 mm) and the liquid crystal cell is sealed in these gaps (0.1 mm). Substrate thickness 2 d in this case. Is 1.50mm. Also, as shown in FIG. 8 (a), scribe lines S1 and S2 are previously formed on the upper surface of the upper substrate G1 and the lower surface of the lower substrate G2 at the same position as viewed from the (X, y) plane. Have been. The method of forming the scribe lines S l and S 2 is the same as that of the conventional example, and the portion where the shear stress or the tensile stress is high becomes the break point of the glass substrate.

Fig. 9 is a partially enlarged cross-sectional view of the breaking device centered on the scribe line S. It is. FIG. 10 is a plan view of a main part of the breaking device centered on a scribe line S indicated by a two-dot chain line. Here, the position after the division of the substrate G is shown using a solid line. The position (x, y, z) of the tilt axis 18a is (0, y, 0). As shown in FIG. 10, in the left GL of the substrate after division, let the end point on the + y axis side of the scribe line S2 in FIG. 8 be PL, and let the end point on the −y axis side be QL. In addition, let the end point on the + y-axis side of the line where the substrate left GL contacts the right edge of the first product table 13 be PL ', and the end point on the y-axis side be QL'. In the right GR of the substrate after the division, the end point on the + y-axis side of the scribe line S2 is PR, and the end point on one y-axis side is QR. The end point on the + y-axis side of the line where the right part GR of the substrate contacts the left edge of the second product table 14 is PR ', and the end point on the y-axis side is QR'. Before the substrate G is divided and cut, PR matches PL and QR matches QL.

As shown in FIG. 9 (a), when the second product table 14 is tilted by an angle 0 in the C CW direction, the position of the point PR ′ is changed from (X: L, y, Z) to (χ ₂ , y ₂ , Ζ Move to ₂ ). Here, each coordinate value is as follows.

X = g

y = y

z — d

x = do sin Θ + g ₂ cos Θ

y = y

Z a = do (1-cos Θ) + g ₂ sin Θ-do

By the pressing force of the second clamp bar 1 6 a, when a part of the PR point of the substrate right portion _{_{GR '(x 2, y 2}} , z 2) is fixed point with respect to the second product table 1 4, substrate right A shear force and a tensile force act on the break portion located at the point PR of the portion GR from the fixed point PR '.

Such a shearing force and a pulling force work similarly at the point QR in FIG. 9 (b). However, the position of scribe line S 2 viewed from point PR 'and the position viewed from point QR' The position of the scribe line S2 is different as shown in Fig. 9 and Fig. 10, and the shear stress and tensile stress are larger on the y-axis (front) than on the + y-axis (opposite side). Become. This means that even if the Young's modulus of the glass material is the same in both parts, the tip of the one-sided support of the right substrate GR with respect to the left substrate GL that does not move in rotation is larger than that in Fig. 9 (a). ) Is shorter. For this reason, the tip of the one-end support shown in FIG. 9 (b) is less likely to reduce the shear stress than in the case of FIG. 9 (a). Therefore, the points QR and QL become breakpoints, and the lower substrate G2 is divided. Next, when the second product table 14 is tilted in the CW direction, a shear stress and a tensile stress are applied to the scribe line S 1 of the upper substrate G 1 as in the case of the tilt in the C CW direction. Is divided. At the time of cutting the board G, a biasing force in the X-axis direction acts on the board left portion GL by the slide mechanism 11a, and the tilting table 12 starts rotating and moves in the + x direction at the same time. However, the right edge portion, which is a cut surface of the left substrate portion GL, retreats in the X-axis direction, and does not contact the left edge portion of the right substrate portion GR. For this reason, the glass substrate is not damaged in its section and a smooth section is obtained.

After cutting of the substrate G, the position of the point PR is moved to (χ _3, ya, za) from _{_{(χ 4, y 4, z}} 4). Here, each coordinate value is as follows.

X = 0

y = y a

z a = — d

x sin Θ

y ₄ = y

z ₄ . (1 —cos Θ)

When the horizontal movement amount x ₄ -x in this case is calculated, when S = 3 °, it becomes 0.039 mm.

Fig. 8 (b) shows the profile of the substrate deformation when the right GR of the substrate rotates in the C CW direction, and Fig. 8 (c) shows the profile of the substrate deformation when the right GR of the substrate rotates in the CW direction. The state of retreat is shown.

Substrates GR and GL can be removed from the product table by releasing the first clamp bar 15a and the second clamp bar 16a from the substrate G on the substrate divided into left and right by the scribe line S. . In the case of dividing a single substrate in a band shape in the X-axis direction into a plurality of substrates, scribe lines are provided at predetermined positions of the substrate G, respectively. Then, the substrate G is transported at a predetermined pitch in the X direction, the product clamp unit is set, and the tilt table 12 is tilted each time. By repeating such an operation, a plurality of substrates can be manufactured from one mother substrate.

(Embodiment 2)

Next, a breaking device according to a second embodiment of the present invention will be described with reference to the drawings. FIG. 11 is an external perspective view showing the overall configuration of a breaker 30 according to the second embodiment. This breaking device 30 is called a double tilting disconnector. Again, for convenience of explanation, let the reference plane parallel to the installation floor of the breaker 30 be (X, y), the direction perpendicular to the installation floor be the z-axis, and the break direction of the board be the y-axis. And The breaking device 30 has a rotation axis parallel to the y-axis and has first and second tilting tables 31 and 32 that can tilt. FIG. 12 is a perspective view showing a state where the left unit 30A and the right unit 30B of the breaking device 30 are separated. The entire breaking device 30 is attached to a base 37 shown in FIG. 11 via holding blocks 38 and 39. The first product table 33 is fixed to the first tilt table 31, and the second product table 34 is fixed to the second tilt table 32. Further, as in the first embodiment, a first product clamp unit 35 is mounted on the upper part of the first product table 33, and a second product clamp unit 36 is mounted on the upper part of the second product table 34. It is attached. The functions of these clamp units are the same as those in the first embodiment, and a description of the mechanism will be omitted.

First tilt table 31, first product table 33, and first product table The lamp unit 35 is supported by a first holding block 38, which is a column. The second tilting table 32, the second product table 34, and the second product clamp unit 36 are columns. It is held by the second holding block 39. As shown in FIG. 11, the spacing between the columns of the second holding block 39 is wider than the spacing between the columns of the first holding block 38, and the left unit 30A and the right unit are positioned at regular positions (operating positions). When the bracket 30B is attached to the base 37, all the columns are almost aligned on the y-axis.

Assuming that the tilt axis of the first holding block 38 is 38a and the tilt axis of the second holding block 39 is 39a, as shown in FIG. 13, the tilt axis 38a and the tilt axis 39a Is a position near the scribe lines S1 and S2 that is substantially symmetrical in the z-axis direction when viewed from the reference position (x, y, z.) Of the breaker. Note that the reference position (x, y, z.) Is the intermediate position (0, y, 0) of the scribe lines S1, S2 on the substrate G, as in the first embodiment. When the center position of the thickness of the substrate G is z = 0, the position d on the z-axis of the tilt axis 38 a is preferably O mm ^ d ^ ≤ 2 O mm, and the tilt axis 39 a The position — d ₂ is preferably — ₂₀ mm ≤-d ₂ ≤ 0 mm.

The mounting positions of the first clamp bar 35a and the second clamp bar 36a are the same as those in the first embodiment. The first holding arm 38b is rotatable around the first tilt shaft 38a, and holds the first tilt table 31 at an arbitrary angle. Here, the first holding arm 38 b and the first tilt shaft 38 a are referred to as a first tilt mechanism. Similarly, the second holding arm 39b is rotatable about the second tilt shaft 39a, and holds the second tilt table 32 at an arbitrary angle. The second holding arm 39 b and the second tilt shaft 39 a are referred to as a second tilt mechanism.

The rotation control unit 40 may be configured to rotate the first tilting table 31 and the second tilting table 32 by a predetermined angle using the rotating force of the motor or the fluid cylinder, and may include an arm or a link. Rotate the tilting table 31, 32 manually through the It may move. The first holding arm 38 b and the second holding arm 39 b are set to the first tilt table 31 and the second tilt before cutting the substrate G by the initial setting of the rotation control unit 40. Table 32 is held parallel to the (x, y) plane, that is, horizontally.

Again, the main axis of the first product clamp unit 35, including the first clamp bar 35a, is mounted at an angle so that the y-axis side opens, and the second clamp bar 36a is included. The main shaft of the second product clamp unit 36 is also attached at an angle of + α so that the + y-axis side is open.

Substrate G thickness 2 d. Here, as an example, consider a case where a laminated glass substrate used for a liquid crystal panel is cut. Assuming that the mounting surface of the first product table 33 is (x, y, 1 d), the position of the tilting shaft 38a is (0, y, + d) as shown in FIG. This position can also be adjusted according to the thickness and material of the substrate. The position of the tilt axis 39 a is (0, y, —d ₂ ). This position is also adjustable. Incidentally, the tilt shaft 3 8 a, 3 9 a is preferably from the center of the substrate symmetrical positions, that is, d = d _2.

Further, assuming that the gap between the right edge of the first product table 33 and the left edge of the second product table 34 is 2 g, the pressing position of the first clamp bar 35 a against the substrate G, The pressing position of the second clamp bar 36a on the substrate G is preferably close to each edge as shown in FIG. 13, and the interval between the pressing positions of the closest parts is preferably about 2 g.

The operation of the breaker 30 having such a mechanism will be described. FIG. 14 is a partially enlarged cross-sectional view of the breaking device centered on the scribe line S. FIG. 10 is used as a plan view of a main part of the breaking device centered on the scribe line S. As described above the position of the first tilt shaft 3 8 a is (0, y), and the position of the second tilt shaft 3 9 a is _{(0, y, _ d 2} ) and that Do.

FIG. 14 (a) is a cross-sectional view near the PR point and the PL point in FIG. here The edge spacing between the first product table 33 and the second product table 34 is 2 g ₂ . FIG. 14 (b) is a cross-sectional view near the QR point and the QL point in FIG. Here, the edge interval between the first product table ₃₃ and the second product table ₃₄ is 2 _gl ( _gl <g ₂ ). As shown in FIG. 14, first, the second product table 34 is inclined at an angle of 0 in the CW direction, and then the first product table 33 is inclined at an angle of 0 in the CW direction. In the same manner as in the first embodiment, the pressing point of the right substrate GR on the second product table 34 is PR ′. This point PR ′ can be considered as a force point that gives a shear stress when the substrate G is cut along the scribe line S.

First, consider the case where the second product table 34 is rotated by an angle 0 in the CW direction. The position of PR 'is from (x ₅ , y ₅ , ζ 3) to (χ _β , y ₆

Go to Z e). Here, each coordinate value is as follows.

X 5 = g 2

y s = y s

Z 5 = _d o

x) sin Θ + g ₂ cos Θ

y 6 = y ₅

z one (d — do) (1 — cos Θ)-g ₂ sin Θ-d ₀

Thus part of the substrate right portion G scale _{_{(χ 6, y 6, z}} 6) becomes fixed point with respect to the second product table 3 4, relative blanking Lake portion located point PR of the substrate right portion GR Shear force and tensile force act from the fixed point.

Such shearing force and pulling force also act on the point QR shown in Fig. 14 (b). However, the distance from the point PR 'to the scribe line S2 differs from the distance from the point QR' to the scribe line S2 as shown in Fig. 10, and the QR is compared to the PR. Shear stress and tensile stress increase. This means that even if the Young's modulus of the glass material is the same in both parts, the shear stress, tensile stress, and bending stress at the tip of the one-sided support of the right side GR of the substrate with respect to the left side GL of the substrate are lower than those of the QR. Smaller than the value. This is because the end length of the one-end support is long as shown in Fig. 14 (a), so that the stress is relaxed by the elastic deformation. As a result, the high stress point QR becomes a break point, and the upper substrate G 1 is divided.Next, when the first product table 33 is tilted by an angle 0 in the CW direction, the shear stress is applied to the scribe line S 2. Then, the lower substrate G2 is divided. In this case, the same as described above occurs for the PL point and the QL point of the left GL of the substrate. In this way, the rotation of both product tables causes tensile stress to act in the + X-axis direction and −X-axis direction around the scribe line S, and shear stress in the + z-axis direction and one z-axis direction. Since it works, the substrate G can be easily divided. At the time of division, the left GL of the substrate and the right GR of the substrate are separated from each other. Also in this case, the right edge portion, which is a cross section, does not contact the left edge portion of the right substrate portion GR. For this reason, a smooth cross section is obtained without damaging the cross section of the glass substrate.

When calculating the horizontal shift amount of the point _{PR (d. + D 2)} sin 0 _{next, d 2 = 5. 0 mm,} d. = 0.75 mm and Θ = 3 °, it is 0.30 mm, which is much larger than the horizontal movement amount of 0.039 mm in the first embodiment. Further, when calculating the amount of movement in the vertical direction of the point _{PR, (d. + D 2} ) becomes (1 -cos θ), and substituting the numerical value, the vertical movement amount is 0. 0 0 7 9mm. This value contributes to the shearing force at the scribe line S.

The substrate divided right and left by the scribe line S can be removed from the product table by releasing the pressing of the first clamp bar 35a and the second clamp bar 36a. Although the first tilt table 31 and the second tilt table 32 are alternately tilted by the same angle 0, the tilt angles may be different for each tilt table. The tilting first does not affect the cutting characteristics of the substrate G.

As described above, with any of the breakers, the end face side in front of the substrate G Is the starting point of the division, and the division progresses from the near side to the back. In this breaker, since the starting point of the cutting of the substrate is one point, the magnitude of the force applied to the substrate can be significantly lower than that of the conventional break method. In addition, the divided end surface is finely finished, and the problem of the divided end surface as described in the related art does not occur. Also, the substrate scribed by the laser scribe device can be cut in the same manner. In the device of the present invention, the mounting position and the height of each holding block can be easily changed, and the rotation amount and the opening angle 2a of the product table can be arbitrarily set, so that the degree of freedom in design is increased. In the present embodiment, the case has been described where the scribe lines S 1 and S 2 formed on the laminated glass substrate used for the liquid crystal panel are at the same position when viewed from the (X, y) plane. Even if the positions of 1 and S2 are separated from each other by several millimeters due to the formation of the terminals of the liquid crystal panel, etc., the present breaker can be used to separate them without inconvenience.

Further, the breaker of the present embodiment can cut not only laminated glass but also brittle material substrates such as semiconductor wafers and ceramic substrates as well as single-pane glass. In particular, in the case of a laminated glass substrate such as a liquid crystal panel, the upper and lower glass plates can be alternately separated by alternate break operations, and a step of inverting the substrate is not required, thereby greatly improving work efficiency. Can be. The breaking device of the present invention can be applied to the cutting of a brittle material substrate in which a scribe line is formed by heating a brittle material substrate using a heating means such as a laser and utilizing thermal strain generated in the brittle material substrate.

(Embodiment 3)

Next, a description will be given of a breaking device according to a third embodiment of the present invention. FIG. 15 is a cutaway perspective view showing a part of the breaking device 50 in the present embodiment. In the present embodiment, the divided tables 51 a and 51 b are provided with a gap Z therebetween, and one table 51 b is fixed. Universal joints 52, 53, 54 are fixed to the back surface of the table 51a, and three support columns 56, 57, 58 are provided via these. The support columns 57 and 58 are provided along the end surface of the gap Z of the table 51a, and the support column 56 is provided behind the support column 57.

Universal joints 59, 60, 61 are attached to the lower portions of the support columns 56, 57, 58, respectively. The other ends of the universal joints 59 and 61 are fixed to a pedestal 62. The support column 57 is shorter than the other support columns. The other end of the universal joint 60 is fixed to the pedestal 62 via a telescopic arm 63. The telescopic arm 63 has a built-in linear motor or the like therein and is an arm that expands and contracts in the longitudinal direction according to a control signal from the outside.

Now, when cutting the glass plate H, which is one of the brittle material substrates, place the glass plate H on the table as shown in the top view in FIG. At this time, the glass plate H is stuck on and fixed to the tables 51a and 51b so that the scribe line S formed on the upper surface is positioned in the gap. After fixing the glass plate H in this way, the telescopic arm 63 is extended or compressed.

FIG. 17 is an explanatory view showing a state in which the telescopic arm 63 is extended, excluding the glass plate H. The table 51a rotates about the center line L1 with the line shown by the dashed line connecting the universal joints 59 and 61, but the direction of the rotation center axis is not parallel to the scribe direction, and has a certain angle. I have. That is, the scribe line S of the glass plate and the center axis L1 of the rotation of the table 51a are set so as not to be parallel. As a result, the amount of movement of the gap Z of the table 51a at the end face increases, as indicated by the arrows in the figure, toward the front in the figure. Also, as the angle increases, the tendency increases. As a result, the end face side in front of the glass sheet H becomes the starting point of the division of the glass sheet, and the division of the glass sheet H progresses from the near side to the back. In this breaking method, since the starting point of the breaking is one point, the magnitude of the breaking force acting on the glass plate is much lower than that of the conventional breaking method. Further, the break end face, that is, the cut section is finished finely, and the problem of the cut end face of the glass sheet H as described in the related art does not occur. Also, scribe with the laser scribing device described above. The same can be done for broken glass plates. In such a break method, the rotation amount and the rotation direction of the table 51a can be arbitrarily set by easily changing the mounting position and height of the support columns 56, 57 and 58. Therefore, the degree of freedom in design is high.

In the present embodiment, the other table 51b is fixed, but a similar rotation mechanism can be provided for this table 51b. In this case, it is necessary to reverse the rotation direction of the table 51b.

FIG. 18 shows an enlarged cross section of a liquid crystal mother glass substrate. As is well known, the liquid crystal mother glass substrate 70 is coated with an adhesive 72 on the periphery of one mother glass substrate 71 and the other mother glass substrate is sandwiched by a granular spacer 73. It has a structure in which mother and glass substrates are fixed to each other by superposing 74. Then, by injecting the liquid crystal 75 into the gap between the two mother and glass substrates from the small holes provided in the layer of the adhesive 72, a liquid crystal panel (not shown) can be obtained.

In order to form a liquid crystal mother glass substrate 70 using a mother glass substrate of a predetermined size and separate the liquid crystal panels into a plurality of liquid crystal panels, a scribe line S 1 is formed on the upper surface of the upper mother glass substrate 74. The scribe line S2 was already formed on the lower mother glass substrate 71. In the conventional break method, at the time of dividing the liquid crystal mother-glass substrate 70, one of the mother glass substrates is divided, and then the other mother-glass substrate is divided after turning over.

On the other hand, when the breaker of the present embodiment is used, the liquid crystal mother glass substrate 70 shown in FIG. 18 has the upper surface of the mother glass substrate 74 and the mother glass substrate 71 before being assembled. A scribe line is formed on the upper surface, and the upper and lower mother-glass substrates can be simultaneously cut by one rotation of the table. As a result, the step of reversing the mother glass substrate was not required, and the work efficiency was greatly improved. (Embodiment 4)

Next, a breaking device according to a fourth embodiment of the present invention will be described. FIG. 19 is a partially cutaway perspective view showing a main configuration of a breaker 80 according to the present embodiment. This breaker 80 has tables 81 a and 81 b similar to those of the third embodiment. Assuming that the gap between the tables is Z when the tables 81a and 81b are horizontal, that is, in a posture having the same mounting surface, the size of the gap Z is uniform in this state. In the same manner as in Embodiments 1 and 2, the center line of gap Z is set to the y-axis. Attach a bearing plate 82 that is not parallel to the y-axis with respect to the lower part of the table 81a and is perpendicular to the lower surface of the table 81a. Then, a shaft hole 83 is provided in the lower part of the bearing plate 82, a shaft passing through the shaft hole 83 is used as a rotation axis L2, and the table 81a is rotatably held. Then, the bearing plate 82 is rotated by a driving device (not shown). In this case, the same operation and effect as in the third embodiment can be obtained.

(Embodiment 5)

Next, a breaking device according to a fifth embodiment of the present invention will be described. FIG. 20 and FIG. 21 are explanatory diagrams showing the main configuration of the breaker 90 according to the present embodiment. FIG. 20 is a side view, and FIG. 21 is a perspective view. This breaker 90 is designed to increase the degree of freedom of dividing the glass plate by simultaneously controlling the six axes of the parallel link mechanism. This break device 90 has tables 92 a and 92 b similar to those in the third and fourth embodiments. The table 92a is a fixed table, and the table 92b is a movable table.

As shown in FIG. 20, the table 92a is fixed to the pedestal 91 by four support columns 93 to 96. The table 92b is arranged beside the table 92a. The lower surface of the table 92b is connected to a telescopic arm 103 to 108 via a universal joint 97 to 102. These telescopic arms 103 to 108 have the same function as the telescopic arm 63 of FIG. Telescopic arm A linear motor and the like are built in the inside, and the length in the longitudinal direction is controlled to be extendable and contractible by a control signal.

The lower part of each telescopic arm 103 to 108 is connected to the pedestal 91 via a universal joint 109 to 114. The lengths of the telescopic arms 103 to 108 are independently controlled by control signals from the control unit 115 shown in FIG. As shown in Fig. 21, the hexagon formed by the universal joints 97 to 102 on the lower surface of the table 92b and the universal joint 109 to 114 formed on the pedestal 91 Squares are different shapes from each other. The position of the table 92b and the angle of the mounting surface with respect to the horizontal plane can be arbitrarily and uniformly selected by controlling the expansion and contraction of the expansion arm. The mechanism for controlling the rotation amount of the controlled object and controlling the position using the 6-axis telescopic arm that moves in parallel in this way is realized by a parallel mechanism.

When the glass plate is cut, first, the posture of the table 92b is controlled so as to be flush with the table 92a with a predetermined gap as shown in FIG. Next, the glass plate H is placed over the table so that the scribe line S is on the upper surface and is located at the center of the gap. In this state, the glass plate H is fixed to the respective tables 92a and 92b by, for example, vacuum suction or other methods. When an insulating layer such as silicon is formed on the glass surface, fixing may be performed by electrostatic attraction.

By the way, the parallel link mechanism operates in the table 92b by expanding and contracting each extendable arm to have a predetermined length by a control signal from the control unit 115. As in the third embodiment, the table 92b rotates around the central axis L3 as a virtual axis. The center axis L3 is located below the table 92b and is not parallel to the scribing line S. That is, the central axis L3 and the scribe line S have a torsion relationship in the space coordinates.

FIG. 22 is a side view of the breaking device 90 showing a state in which the glass plate H is divided. As in Embodiment 3, the direction of the rotation axis is The table 9 2 b can be rotated to have a certain angle. Accordingly, the glass sheet H is sequentially divided from the near side with the near side as the starting point of the dividing of the glass sheet H. For this reason, the magnitude of the cutting force acting on the glass sheet H may be small, and the cross section of the glass sheet H can be finely finished. Also, even for a glass sheet on which a line of a blind crack by a laser is formed. It can be divided by applying a smaller dividing force than before.

In this embodiment, an arbitrary rotation axis can be set by the parallel link mechanism according to the thickness and shape of the target glass plate. After the division is completed, as shown in FIG. 23, the table 92b is made parallel to the table 92a so that the end surfaces of the glass plates H which have been divided again do not come into contact with each other, and a step is provided. This also facilitates the processing of the glass sheet H after the division.

Furthermore, as shown in FIG. 24, a vertically movable push-up pin 1 16 is arranged around the area where the glass plate is arranged in the table 9 2 b. After separating the glass plate and keeping the table 9 2b horizontal, release the suction of the separated glass plate and operate the push-up pins 1 16 to push the glass plate up from the table 9 2b. Can be. Next, as shown in FIG. 24, a removing hand 1 17 is inserted between the cut glass plate H and the table 92 b to lift the glass plate H, and transport the glass plate H after being cut. You can also. Therefore, the effect that the glass plate H can be easily transported to the next step is obtained.

In this embodiment, a case where one glass plate is cut is described. However, as shown in FIG. 18, scribe lines are formed on upper and lower mother-glass substrates which are examples of a brittle material substrate to be bonded. This embodiment can also be applied to a case where a liquid crystal mother glass substrate is divided. Also in this case, the mother glass substrate on both sides can be divided without turning over the liquid crystal mother glass substrate. (Embodiment 6)

Next, a breaking method according to the sixth embodiment of the present invention will be described. The method for breaking a brittle material substrate in the present embodiment refers to a method for dividing a single liquid crystal mother glass substrate 120 into a predetermined shape as the aforementioned substrate G and obtaining a plurality of liquid crystal glass substrates 121. Manufacturing method. Various manufacturing processes are required to obtain a liquid crystal panel that displays an image or text in pixel units from a single liquid crystal mother glass substrate 120 by a drive signal.

A substrate including a TFT, a scanning electrode, a signal electrode, and a pixel electrode is called a TFT substrate (also called an AM substrate), and a substrate including a color filter is called a counter substrate. It refers to the stage where both substrates are combined and liquid crystal is filled. The liquid crystal mother glass substrate 120 is a substrate (mother substrate) at a stage where a TFT substrate before division (referred to as a mother TFT substrate) and a counter substrate before division (referred to as a mother counter substrate) are bonded to each other. Bonded substrate). Therefore, the cut bonded substrate becomes the liquid crystal glass substrate 121 (bonded substrate). Then, the liquid crystal glass substrate 122 is filled with liquid crystal, the liquid crystal inlet is sealed, and the liquid crystal panel is in a state where a flat cable can be connected to the electrode at the edge of the substrate.

In order to clarify the position of the break method in the present embodiment in the manufacturing process of the liquid crystal panel, further explanation will be given. In order to obtain a plurality of liquid crystal glass substrates 121 from one liquid crystal mother glass substrate 120, a plurality of types of cutting steps are required. This is distinguished by where the scribe line or the section plane of the substrate is located on the liquid crystal panel. For example, (A) a step of dividing a liquid crystal mother glass substrate 120, which is a large-sized laminated substrate with multiple panels, into individual liquid crystal glass substrates 121 of a predetermined shape; Examples are a dividing step for exposing the electrode and (C) a dividing step for removing the electrode portion. The order of the above steps does not need to be determined in advance here, but at least the steps (A) and (B) are combined in this embodiment. Shall be accepted. Also, in the step (A), a plurality of cutting steps are required as long as the scribe lines S are formed in a grid pattern (also called cross scribe) on the liquid crystal mother glass substrate 120.

FIG. 25 shows a method of breaking the liquid crystal mother glass substrate 120 including such a dividing step. This break method consists of (1) cassette loader,

(2) a first substrate transfer device, (3) a first scribe device, (4) a second scribe device, (5) a second substrate transfer device, (6) a first break device.

(7) Including a second break device, a plurality of liquid crystal glass substrates 121 are manufactured via these devices. For this reason, such a dividing step is referred to as a liquid crystal mother-glass substrate automatic dividing line.

In FIG. 25, a cassette loader 122 holds and holds a large number of liquid crystal mother-glass substrates 120 in a cassette. The supply rod R1 takes out the liquid crystal mother glass substrate 120 from the cassette loader 122 and transfers it to the first substrate transfer device 123. The first substrate transfer device 123 positions the liquid crystal mother glass substrate 120 supplied from the supply rod R1 at a fixed position of the table. This positioning is performed by pressing the mutually orthogonal end faces of the liquid crystal mother glass substrate 120 against the positioning pins.

The transfer robot R2 transfers the liquid crystal mother glass substrate 120 placed on the table to a predetermined position of the first scribe device 124. Of the liquid crystal mother glass substrate 120, the mother TFT substrate is assumed to be 120a, and the mother one-way substrate is assumed to be 12Ob. The processed surface of the substrate is a surface parallel to the (X, y) plane as in the first and second embodiments. The first scribe device 124 forms the scribe lines S1 so as to be parallel to the X-axis or y-axis direction of the mother opposing substrate 120b, for example. Such a scribing method is used.

The transfer lopot R 3 is connected to the scribe line from the first scribing device 1 2 4 The liquid crystal mother-glass substrate 120 on which S1 is formed is taken out, and the upper surface and the lower surface are inverted and given to the transport robot R4. The transfer robot R 4 transfers the inverted liquid crystal mother glass substrate 120 to a predetermined position of the second scribe device 125. The second scribe devices 125 form scribe lines S2 so as to be parallel to the X-axis or y-axis direction of the mother TFT 120a. The positions and lengths (drawing data) of these scribe lines S 1 and S 2 are controlled by a control CPU (not shown).

The liquid crystal mother glass substrate 120 having the scribe lines formed on both sides is transferred to the second substrate transfer device 126 by the transfer robot R5. The second substrate transfer device 126 positions the liquid crystal mother glass substrate 120 supplied from the transfer robot R5 at a fixed position. The transfer robot R 6 transfers the liquid crystal mother glass substrate 120 placed on the second substrate transfer device 126 to a fixed position of the first break device 127.

The first breaker 127 and the second breaker 128 are the same as the breakers of the first or second embodiment, and a description of the structure is omitted. The first breaking device 127 presses the upper surface of the liquid crystal mother glass substrate 120 placed over the first table 127 a and the second table 127 b. The LCD motherboard is fixed and either table is rotated in the + z direction and -z direction as shown in Fig. 4 or both tables are simultaneously rotated in the same direction as shown in Fig. 11. One glass substrate 120 is divided into strips.

The transport robot R 7 takes out the liquid crystal mother-glass substrate 120 cut into strips from the table 127 b and puts it in the fixed position of the second breaker 128, that is, the two tables 1 28 a , And 128b. The second breaking device 128 breaks the liquid crystal mother glass substrate 120. The substrate obtained here is a liquid crystal glass substrate 1 2 1 of a predetermined shape. Become. The liquid crystal glass substrates 121 are transferred by the third substrate transfer device 129 by the transfer rod R8, and are further carried to the next liquid crystal panel manufacturing process.

The break method according to the present embodiment having the above steps will be described in comparison with a conventional break method. FIG. 26 is a process chart in a case where a liquid crystal mother and a glass substrate 120 are cut using a conventional breaker. FIG. 27 is a process chart in the case where the liquid crystal mother and the glass substrate 120 are divided using the breaker of the present invention. However, since FIG. 26 shows a case where there is one dividing step, the number does not match the number of dividing steps shown in FIG.

According to the method shown in FIG. 2, the conventional breaker forms a scribe line S on one surface of the glass plate 1 and presses the break bar 14 against the other surface of the glass plate 1 to bend the glass plate 1. As a result, the glass plate 1 was cut off. In addition, according to the method shown in FIG. 3, the glass plate 1 is bent so that a tensile stress acts on the portion where the scribe line S is formed, and the glass plate 1 is divided. When such a breaker is used, the steps shown in (b) to (g) of FIG. 26 are required for cutting the bonded glass substrate.

That is, the mother TFT substrate 120a of the liquid crystal mother glass substrate 120 shown in (a) of FIG. 26 is turned up, and a mother substrate TFT substrate 120a as shown in FIG. Insert scribe line S1 into Next, as shown in (c), the liquid crystal mother glass substrate 120 is inverted using an inverting device. And

As shown in (d), the break bar is pressed against the mother opposing substrate 120b, and a vertical crack is developed on the mother TFT substrate 120a to divide the mother TFT substrate 120a. I do. Next, the liquid crystal mother glass substrate 120 is held, and a scribe line S2 is inserted into the mother opposing substrate 12 Ob using a scribe device as shown in FIG. Then, the liquid crystal mother glass substrate 120 is again inverted using an inverting device as shown in (f). Next, as shown in (g), a break bar is pressed against the mother TFT substrate 120a, and the vertical cladding is pressed against the mother TFT substrate 120b. Make progress. Next, by separating the liquid crystal mother glass substrate 120 left and right, the liquid crystal mother glass substrate 120 can be divided into a plurality of liquid crystal glass substrates 121 as shown in (h). However, in this method, the substrate inversion step is required twice. <However, when the breaker of the first or second embodiment is used, the liquid crystal mother glass substrate 120 is compared with the liquid crystal mother glass substrate 120 in FIG. The process shown in f) is sufficient. That is, the liquid crystal mother-glass substrate 120 shown in (a) of FIG. 27 and the opposing substrate 12 Ob of the glass substrate 120 are turned up, and the first scribing device 124 of FIG. The scribe line S1 is inserted into the mother opposing substrate 120b. Next, as shown in (c), the liquid crystal mother-glass substrate 120 is inverted using an inversion device. Then, as shown in (d), a scribe line S2 is formed on the mother TFT substrate 120a by using the second scribe device 125.

Then, the liquid crystal mother glass substrate 120 having scribe lines on both sides is set in the first breaker 127 of FIG. 25, and one of the tables is rotated upward and downward. As shown in e) and (f), vertical cracks propagate in the thickness direction of the mother TFT substrate 120a and the mother counter substrate 120b, respectively, and penetrate the respective substrates. This causes a so-called crack. Then, when the liquid crystal mother glass substrate 120 is separated into right and left, the liquid crystal glass substrate 121 divided as shown in (g) is obtained. According to this method, the substrate inversion process only needs to be performed once.

The above steps are for a case where the liquid crystal mother glass substrate 120 is cut into, for example, strips. As described in FIG. 25, when scribe lines are formed in a grid pattern on the liquid crystal mother glass substrate 120, and the liquid crystal mother glass substrate 120 is further divided into small-sized liquid crystal glass substrates 121, FIG. 27 is further increased, and the breaking method according to the present embodiment has an effect that the inversion step of the substrate can be omitted in addition to the smoothness of the cross section of the substrate.

(Embodiment 7)

Next, a breaking method according to the seventh embodiment of the present invention will be described. Book The method for breaking a brittle material substrate according to the embodiment is a method for dividing a liquid crystal mother glass substrate 130 into a plurality of liquid crystal glass substrates 131, as shown in FIG. A mother substrate including a TFT, a scanning electrode, a signal electrode, and a pixel electrode is referred to as a mother TFT substrate, and a mother substrate including a color filter is referred to as a mother counter substrate. The liquid crystal mother glass substrate 130 includes a mother opposing substrate 130b which is a first brittle material substrate on which scribe lines are not formed, and a second brittle material substrate on which scribe lines S2 are formed in advance. This is a substrate obtained by bonding a mother TFT substrate 130a with a sealing agent 132.

FIG. 29 is a configuration diagram of a liquid crystal mother-glass substrate automatic cutting line showing a method of breaking such a liquid crystal mother-glass substrate 130. As shown in FIG. This breaking method includes (1) a cassette loader, (2) a first substrate transfer device, (3) a scribing device, (4) a first break device, (5) a second substrate transfer device,

(6) A second breaking device, (7) a third substrate transport device, and a plurality of liquid crystal glass substrates 131 are manufactured via these devices.

In FIG. 29, the cassette loader 133 of (1) holds a large number of liquid crystal motherboards 130 in a cassette. The material supply robot R1 is to take out the liquid crystal mother glass substrate 130 from the cassette 133 and transfer it to the first substrate transfer device 134 shown in (2). The first substrate transfer device 134 positions the transferred liquid crystal mother glass substrate 130 at a fixed position on the table.

The transport rod R2 transports the liquid crystal mother-glass substrate 130 placed on the table to a predetermined position of the scribe device 135 of (3). The scribe device 135 forms a scribe line S1 on the upper surface of the mother opposed substrate 130b shown in FIG.

The transfer robot R 3 takes out the liquid crystal mother substrate 130 on which the scribe line S 1 is formed from the scribe device 135 and transfers it to the home position of the first break device 133 in (4). Things. First breaker 1 3 For 6, the breaking device described in the first to fifth embodiments is applied. FIG. 29 shows a case where the breaking device according to the first or second embodiment is applied, and the liquid crystal placed over the first table 1336a and the second table 1336b is shown. The liquid crystal mother glass substrate 130 is cut into strips by pressing and fixing the upper surface of the mother glass substrate 130 and rotating one of the tables or simultaneously rotating both tables. It is.

The transfer robot R 4 takes out the liquid crystal mother-glass substrate 130 cut into strips and places it on the table of the second substrate transfer device 133 in (5). The transport rod R5 is for transporting the liquid crystal mother-glass substrate 130 cut into strips to a fixed position of the second breaker 138 in (6). The second breaker 1338 divides the liquid crystal mother glass substrate 130 into a prescribed shape to obtain a plurality of liquid crystal glass substrates 131. The divided liquid crystal glass substrate 13 1 is transferred by the third substrate transfer device 13 9 by the transfer robot R 6, and is further carried to the next liquid crystal panel manufacturing process. Incidentally, as the second breaking device, the breaking device described in the first to fifth embodiments is applied.

Such a breaking method does not require a reversing device for the liquid crystal mother-glass substrate 130, and requires only one scribing device as shown in (3) of FIG. 29 (Eighth Embodiment)

Next, a breaking method according to the eighth embodiment of the present invention will be described. The method for breaking a brittle material substrate in the present embodiment is characterized by using a double-sided scribe device. The liquid crystal mother-glass substrate of the present embodiment

Unlike the mother-to-glass substrate 130 of the seventh embodiment, the mother-to-mother glass substrate 130 and the mother-to-mother counter substrate have no scribe line S formed in advance.

FIG. 30 is a configuration diagram of a liquid crystal mother-glass substrate automatic cutting line showing a method of breaking such a liquid crystal mother-glass substrate 140. This break method (1) cassette loader 144, (2) first substrate transfer device 143, (3) first double-sided scribe device 144, (4) second substrate transfer device 14

7, (5) First breaker 148, (6) Third substrate transporter 149 (7) Second double-sided scriber 150, (8) Fourth substrate transporter 1, 5, 3, (9 ) Second breaker 154, (10) Fifth substrate transporter 15

5, a plurality of liquid crystal glass substrates 141 are manufactured via these devices.

Material supply robot R1, transfer robot R2 to R7, substrate transfer device 143, 1

The functions of 47, 149, 153, and 155 are the same as those described in the sixth and seventh embodiments, and thus description thereof is omitted.

The first double-sided scribing device 144 includes a plurality of tables 144 a and 14

5b, a scribe head mount 146a provided at the center of the device, and upper and lower scribe heads 146b movably held by a scribe head mount 146a. When the liquid crystal mother glass substrate 140 is transferred to the scribe head mount 146a by the table 145a, the liquid crystal mother glass substrate 140 is held in a ridge state so that a part of both upper and lower surfaces of the liquid crystal mother glass substrate 140 enters the processing area. . The scribe head 146b scribes the upper and lower sides by scanning this bridge portion.

As described in the conventional example, the scribing apparatus includes an apparatus using a hard metal or diamond wheel cutter and an apparatus using a laser scribe by a laser beam. In the wheel cutting method, the scribe lines S 1 and S 2 are formed by rotating and rolling (rolling) by pressing both surfaces of the liquid crystal mother glass substrate 140 in synchronization with the two wheel forces. Form simultaneously. The laser scribe type scans while irradiating two beam spots on both surfaces of the liquid crystal mother glass substrate 140, and performs spot cooling using a coolant following the irradiated portions. In this way, blind scribe is performed using the thermal distortion of the glass material. Second double-sided scribe device 1 50 Is also the same as the first double-sided scribe device 144.

The first breaking device 1 48 and the second breaking device 1 54 are devices that divide the substrate so that the scribe lines S formed on both surfaces of the liquid crystal mother-glass substrate 140 have a section. . As described in the first or second embodiment, there is a method in which the left and right tables are held so that their gaps are non-parallel, and at least one of the left and right tables is rotated. In FIG. 30, this type of breaker is used, and in the first breaker 148, the gaps of the tables 148 a and 148 b are illustrated so as to be non-parallel. As for the device 154, the gaps of the tables 154a and 154b are not parallel.

As the first breaking device 148 and the second breaking device 154, there are devices using other methods. As described in the fifth embodiment, one of the two tables on which the liquid crystal mother and the glass substrate 140 are placed and fixed is one of the parallel tables shown in FIGS. Hold using a link mechanism. Then, when the substrate is cut, the table is rotated by using an axis at a position away from the scribe line as a rotation axis to cut the substrate. In the case of this method, the gaps of the tables 148a and 148b and the gaps of the tables 154a and 154b shown in FIG. 30 are parallel.

As described above, according to the breaking method of the present embodiment, there is no need for a step of inverting the upper and lower surfaces of the liquid crystal mother glass substrate 140, and there is no need to install a substrate inverting device. The installation area of the substrate cutting line can be reduced.

Industrial applicability

According to the brittle material substrate breaking device of the present application, a breaking force is applied to one end of a scribe line when the substrate is cut, when the substrate is cut. Therefore, the division of the substrate progresses in order from one end side to the other end side, and the end surface where the substrate is divided can be cleaned. Further, the breaking force to be applied is much smaller than that of the conventional breaking method, and the size of the breaking device body can be reduced.

Further, according to the method for breaking a brittle material substrate of the present application, in a step of dividing one liquid crystal mother glass substrate into a plurality of liquid crystal glass substrates, the liquid crystal mother substrate can be formed in one process without inverting the substrate. Both sides of the glass substrate can be separated. For this reason, the inversion step for cutting the substrate is reduced.

Claims

The scope of the claims

1. A first and second product table on which a brittle material substrate having a scribe line formed on at least one surface is placed so that the scribe line is located between the gaps.

An edge of the first product table facing the second product table is a first edge, and an edge of the second product table facing the first product table is a second edge. A first product clamp unit that presses and fixes a portion of the brittle material substrate located at the first edge;

A second product clamp unit that presses and fixes a portion of the brittle material substrate located at the second edge;

A slide mechanism for applying a pressure in a direction perpendicular to a scribe line of the brittle material substrate, such that the first product table and the first product clamp unit are integrated and retreated from the scribe line;

A tilting mechanism that makes the second product table and the second product clamp unit integrally rotatable with a tilt axis parallel to a scribe line of the brittle material substrate as a rotation axis;

A rotation control unit that controls the tilting mechanism to rotate the second product table and the second product clamp unit,

The first product table and the second product table are arranged such that opposite edges of both tables are not parallel to each other,

The brittle material substrate breaking device, wherein the tilt axis of the second product table is within a thickness range of the substrate as viewed from the brittle material substrate scribe line.

2. The first product clamp unit has a first clamp bar that presses near the scribe line of the brittle material substrate, The second product clamp unit has a second clamp bar that presses the brittle material substrate near a scribe line,

2. The method according to claim 1, wherein when the second product table is rotated, the second clamp bar acts as a force point for applying a shearing force to the substrate near the scribe line. A breaker for a brittle material substrate as described in the above.

3. The breaking device for a brittle material substrate according to claim 1, wherein the tilt axis of the second product table is located at the center between the upper surface and the lower surface of the brittle material substrate.

4. first and second product tables on which a brittle material substrate having a scribe line formed on at least one surface is placed so that the scribe line is located between the gaps;

An edge of the first product table facing the second product table is a first edge, and an edge of the second product table facing the first product table is a second edge. At this time, a first product clamp unit that presses and fixes a portion of the brittle material substrate located at the first edge and a second product that presses and fixes a portion of the brittle material substrate located at the second edge. Product clamp unit 2

A first tilting mechanism that makes the first product table and the first product clamp unit integrally rotatable with a tilt axis parallel to a scribe line of the brittle material substrate as a rotation axis;

A second tilting mechanism for rotating the second product table and the second product clamp unit integrally by using a tilt axis parallel to a scribe line of the brittle material substrate as a rotation axis; and

A rotation control unit that controls the first and second tilt mechanisms to rotate the first product table and the first product clamp unit, and the second product table and the second product clamp unit; , And The first product table and the second product table are arranged such that opposing edges of both tables are not parallel to each other,

The tilt axis of the first product table is on the upper side of the brittle material substrate near the scribe line,

A breaking axis for the brittle material substrate, wherein the tilt axis of the second product table is located below the substrate in the vicinity of the scribe line of the brittle material substrate;

5. The first product clamp unit has a first clamp bar that presses near the scribe line of the brittle material substrate,

The second product clamp unit has a second clamp bar that presses the brittle material substrate near a scribe line,

When the first product table or the second product table is rotated, a force point at which the first clamp bar or the second clamp bar applies a shearing force and a tensile force to a substrate portion near the scribe line. 5. The breaking device for a brittle material substrate according to claim 4, wherein the breaking device is configured to function as a slab.

6. The tilt axis of the first product table and the tilt axis of the second product table are vertically symmetric when viewed from the center of thickness of the brittle material substrate. Breaker for brittle material substrate.

7.2 A scribing material substrate, which has been scribed on its upper surface, is fixed to the divided table, and at least one of the tables is rotated so that the brittle material substrate is divided.

A brittle material substrate breaking device, wherein a rotation center axis of the table is provided at a predetermined angle with respect to a scribe direction of the brittle material substrate.

8. The breaking device for a brittle material substrate according to claim 7, wherein the table is swingably supported by two support columns aligned in a direction forming a predetermined angle with respect to the scribe direction.

9. The method according to claim 8, wherein a third support column is provided so as to support the table at three points, and a mechanism for raising and lowering the support column is further provided. Breaker for brittle material substrate.

A breaker that breaks the brittle material substrate by fixing the scribed brittle material substrate on the upper surface of the table divided into 0.2 and rotating at least one of the tables.

The at least one table includes six extensible arms at least partially non-parallel,

A universal joint provided at each of both ends of the arm and connecting the table and one end of the arm at an arbitrary angle;

And a control unit for controlling one position of the table by controlling the length of each of the arms.

11. A breaking method in a brittle material substrate breaking apparatus according to claim 10,

Controlling the position of the table so as to be on the same plane via a predetermined gap, fixing a brittle material substrate on which scribes have been formed in advance to the table according to the gap between the tables,

By rotating the one table along a rotation axis that is non-parallel to the scribe line formed on the brittle material substrate and that is not coplanar with the scribe line, the brittle material substrate is moved along the scribe line. A method for breaking a brittle material substrate, which comprises dividing the substrate.

12. A brittle material substrate breaking method in which a mother bonded substrate in which two brittle material substrates are bonded is divided, and a plurality of smaller bonded substrates are obtained.

Forming a scribe line S1 at a predetermined position on one substrate surface of the mother-laminated substrate using a first scribe device (1);

A scribe line on the other substrate surface of the mother-laminated substrate;

A scribe line S 2 is formed using a second scribe device in the same direction as S 1. Forming (2),

The mother bonded substrate having the scribe lines S 1 and S 2 formed on both sides is fixed to two tables of a breaking device, and at least one of the tables is rotated to form the scribe lines S 1 and S 2. A method of applying a tensile stress or a shear stress to divide the mother-laminated substrate into a plurality of substrates (3).

13. The brittle material substrate breaking method according to claim 12, wherein an inverting device for inverting the scribed surface of the mother-laminated substrate is provided between the step (1) and the step (2).

14. The method for breaking a brittle material substrate according to claim 12, wherein the breaking device in the step (3) is the breaking device according to claim 1 or 4.

15 5. A mother substrate in which the first brittle material substrate with no scribe line formed and the second brittle material substrate with the scribe line S2 formed in advance is cut off. A brittle material substrate breaking method for obtaining a plurality of bonded substrates,

Forming a scribe line S1 on the surface of the first brittle material substrate using a scribe device in the same direction as the scribe line S2 (1),

The mother bonded substrate having the scribe lines S 1 and S 2 formed on both sides is fixed to two tables of a breaking device, and at least one of the tables is rotated to form the scribe lines S 1 and S 2. A method of applying a tensile stress or a shear stress to divide the mother-laminated substrate into a plurality of substrates (2).

16. The method for breaking a brittle material substrate according to claim 15, wherein the breaking device in the step (2) is the breaking device according to any one of claims 1 to 10. <17. Formation of first brittle material substrate and second brittleness A method of breaking a brittle material substrate, which divides a mother bonded substrate bonded to a material substrate and obtains a plurality of smaller bonded substrates.

A step (1) of simultaneously forming scribe lines S 1 and S 2 on the surfaces of the first and second brittle material substrates using a double-side scribe device; and forming scribe lines S 1 and S 2 on both sides. Fixing the mother bonded substrate to the two tables of the breaking device, and applying a tensile stress or a shear stress to the scribe lines S 1 and S 2 by rotating at least one of the tables. A method for breaking a brittle material substrate comprising: (2) a step of dividing the mother bonded substrate into a plurality of substrates.

18. The breaking method for a brittle material substrate according to claim 17, wherein the breaking device in the step (2) is the breaking device according to claim 1 or 4.

1 9. The double-sided scribe device in the above step (1)

18. The method according to claim 17, wherein the mother bonding substrate is fixed, and the surfaces of the first and second brittle material substrates are scrubbed using a hard metal or diamond wheel cutter. The method for breaking a brittle material substrate according to the above.

20. The double-sided scribe device in the step (1)

The blind scribing is performed by fixing the mother bonding substrate and performing heating by a laser beam and local cooling by a coolant on surfaces of the first and second brittle material substrates. 7. The method for breaking a brittle material substrate according to 7.