TW202413292A - Method for manufacturing glass articles, method for manufacturing electronic components, and jig for substrate peeling - Google Patents

Method for manufacturing glass articles, method for manufacturing electronic components, and jig for substrate peeling Download PDF

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TW202413292A
TW202413292A TW112133955A TW112133955A TW202413292A TW 202413292 A TW202413292 A TW 202413292A TW 112133955 A TW112133955 A TW 112133955A TW 112133955 A TW112133955 A TW 112133955A TW 202413292 A TW202413292 A TW 202413292A
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substrate
knife
original
manufacturing
laminate
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TW112133955A
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Chinese (zh)
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小杉匡司
岡隆雄
伊藤茂嘉
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日商日本電氣硝子股份有限公司
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當自於下層側的基板3上貼附上層側的基板4而成的積層體1剝離上層側的基板4時,將刀5插入至兩基板3、4之間的界面X而生成剝離始點部6的剝離步驟中,使用具有引導刀5移動的引導面2f的夾具2,使刀5於與夾具2的引導面2f接觸的狀態下朝向積層體1移動,藉此將刀5插入至界面X。When peeling off the upper substrate 4 from the laminate 1 formed by attaching the upper substrate 4 to the lower substrate 3, in the peeling step of inserting the knife 5 into the interface X between the two substrates 3 and 4 to generate the peeling starting point 6, a clamp 2 having a guide surface 2f for guiding the movement of the knife 5 is used, and the knife 5 is moved toward the laminate 1 while being in contact with the guide surface 2f of the clamp 2, thereby inserting the knife 5 into the interface X.

Description

玻璃物品的製造方法、電子元件的製造方法以及基板剝離用夾具Method for manufacturing glass articles, method for manufacturing electronic components, and jig for removing substrates

本發明是有關於一種自包含玻璃等的基板的積層體剝離上層側的基板時的方法等所涉及的技術。The present invention relates to a method for peeling off an upper layer side substrate from a laminate including a substrate such as glass.

近年來,液晶顯示器、太陽電池、智慧型手機、平板型PC等電子元件的薄型化或輕量化得到了推進,伴隨於此,對於該電子元件中所使用的包含玻璃等的基板,薄板化的要求亦不斷提高。In recent years, electronic components such as liquid crystal displays, solar cells, smartphones, and tablet PCs have been increasingly thinned or lightweight, and along with this, there is an increasing demand for thinner substrates, such as glass, used in these electronic components.

如此於基板經薄壁化的情況下,難以順利地對基板實施各種處理,因此提出如下情況或者經實用化,即,將該基板貼附於加強用的其他基板上而製作積層體,於積層體的狀態下對該基板實施各種處理。In the case where the substrate is thinned, it is difficult to smoothly perform various treatments on the substrate. Therefore, the following situation has been proposed or put into practical use, that is, the substrate is attached to another substrate for reinforcement to produce a laminate, and various treatments are performed on the substrate in the state of the laminate.

然後,對該基板實施各種處理後,自積層體剝離該基板,藉此獲得作為產品的玻璃基板等。作為該情況下的剝離方法,例如根據專利文獻1或專利文獻2,揭示了使用刀自積層體剝離上層側的基板。Then, after various treatments are applied to the substrate, the substrate is peeled off from the laminate, thereby obtaining a glass substrate as a product. As a peeling method in this case, for example, according to Patent Document 1 or Patent Document 2, it is disclosed that the substrate on the upper layer side is peeled off from the laminate using a knife.

若詳細敘述,則於該些公報中揭示了如下內容,即,於積層體的下層側的基板與上層側的基板之間的界面插入刀而生成剝離始點部,以該剝離始點部為起點使剝離進展。Specifically, these publications disclose that a blade is inserted into the interface between the substrate on the lower layer side and the substrate on the upper layer side of the laminate to generate a peeling starting point, and peeling is advanced from the peeling starting point.

進而,於專利文獻2中揭示了藉由高度調整裝置來調整刀的高度方向的位置。 [現有技術文獻] [專利文獻] Furthermore, Patent Document 2 discloses that the height position of the knife is adjusted by a height adjustment device. [Prior Art Document] [Patent Document]

[專利文獻1]國際公開第2019/059057號 [專利文獻2]日本專利第6075567號公報 [Patent Document 1] International Publication No. 2019/059057 [Patent Document 2] Japanese Patent Gazette No. 6075567

[發明所欲解決之課題][The problem that the invention wants to solve]

且說,專利文獻2所揭示的高度調整裝置是刀處於與積層體分離的初始狀態時,調整刀的高度方向的位置的裝置(參照該文獻的段落[0064])。因此,於刀朝向積層體移動的過程中,有刀的高度方向的位置偏移或刀於上下方向上搖晃之虞。起因於此,難以將刀可靠地插入至下層側的基板與上層側的基板之間的界面。於該情況下,若至少一個基板為玻璃基板,則成為產生缺損或破裂等的因素。Furthermore, the height adjustment device disclosed in Patent Document 2 is a device for adjusting the height position of the knife when the knife is in the initial state of being separated from the laminate (see paragraph [0064] of the document). Therefore, in the process of the knife moving toward the laminate, there is a risk that the knife's height position may shift or the knife may wobble in the vertical direction. As a result, it is difficult to reliably insert the knife into the interface between the substrate on the lower layer side and the substrate on the upper layer side. In this case, if at least one of the substrates is a glass substrate, it becomes a factor that causes defects or cracks.

就以上的觀點而言,本發明的課題在於將刀可靠地插入至積層體的下層側的基板與上層側的基板之間的界面。 [解決課題之手段] From the above viewpoints, the subject of the present invention is to reliably insert the knife into the interface between the substrate on the lower layer side and the substrate on the upper layer side of the laminate. [Means for solving the problem]

(1) 為解決所述課題而創造的本發明的第一方面是一種玻璃物品的製造方法,包括剝離步驟,所述剝離步驟是自於下層側的基板上貼附有所述上層側的基板且所述兩基板的至少一者由玻璃形成的積層體剝離上層側的基板時,將刀插入至所述兩基板之間的界面而生成剝離始點部,所述玻璃物品的製造方法的特徵在於,於所述剝離步驟中,使用具有引導所述刀的移動的引導面的夾具,使所述刀於與所述引導面接觸的狀態下朝向所述界面移動。此處,所謂上層側的基板,不僅是指一張基板,而且是指亦包含多張基板相互貼附而成的積層體,下層側的基板亦同樣地,不僅是指一張基板,而且是指亦包含多張基板相互貼附而成的積層體(以下相同)。(1) The first aspect of the present invention created to solve the above-mentioned problem is a method for manufacturing a glass article, comprising a peeling step, wherein when peeling the upper substrate from a layered structure in which the upper substrate is attached to the lower substrate and at least one of the two substrates is formed of glass, a knife is inserted into the interface between the two substrates to generate a peeling starting point. The method for manufacturing the glass article is characterized in that, in the peeling step, a fixture having a guide surface for guiding the movement of the knife is used, so that the knife moves toward the interface while in contact with the guide surface. Here, the upper substrate refers not only to one substrate but also to a laminated body formed by a plurality of substrates attached to each other. Similarly, the lower substrate refers not only to one substrate but also to a laminated body formed by a plurality of substrates attached to each other (the same shall apply hereinafter).

根據此種方法,藉由使刀於與夾具的引導面接觸的狀態下朝向積層體的兩基板之間的界面移動,將刀插入至界面。因此,於刀移動時,不會產生刀的高度方向的位置偏移或刀於上下方向上搖晃的問題。因此,藉由將夾具的引導面的高度位置設定為與界面的高度位置對應,可使刀可靠地插入至界面。藉此,可避免於玻璃基板產生缺損或破裂等的情況。According to this method, the knife is moved toward the interface between the two substrates of the laminate while being in contact with the guide surface of the clamp, and the knife is inserted into the interface. Therefore, when the knife moves, there will be no problem of the knife's position shifting in the height direction or the knife shaking in the vertical direction. Therefore, by setting the height position of the guide surface of the clamp to correspond to the height position of the interface, the knife can be reliably inserted into the interface. In this way, it is possible to avoid the occurrence of defects or cracks in the glass substrate.

(2) 於所述(1)的結構中,較佳為將所述積層體與所述夾具配置成於所述刀的刀尖到達所述界面時,所述刀成為與所述引導面接觸的狀態。(2) In the structure of (1), the laminate and the clamp are preferably arranged so that when the tip of the knife reaches the interface, the knife is in contact with the guide surface.

若如此,則可使刀更可靠地插入至界面。If this is done, the knife can be inserted into the interface more reliably.

(3) 於所述(1)或(2)的結構中,亦可於所述兩基板之間介隔存在有厚度未滿1 μm的膜。此處,所述膜例如可列舉有機膜或無機膜。(3) In the structure of (1) or (2), a film having a thickness of less than 1 μm may be interposed between the two substrates. Here, the film may be, for example, an organic film or an inorganic film.

若如此,則不僅於兩基板以密接力於相互間發揮作用的方式直接接著的情況下,而且於兩基板之間介隔存在有厚度未滿1 μm的極薄膜的情況下,亦可適當地生成剝離始點部。於該情況下,於兩基板直接接著的情況下,下層側的基板的上表面與上層側的基板的下表面之間成為界面,將刀插入至該界面。另一方面,於兩基板之間介隔存在有膜的情況下,上層側的基板的下表面與下層側的基板的上表面之間的任一位置成為界面,將刀插入至該界面。If so, not only when the two substrates are directly connected in a manner that a close contact force is exerted on each other, but also when there is an extremely thin film with a thickness of less than 1 μm between the two substrates, a peeling starting point can be appropriately generated. In this case, when the two substrates are directly connected, the upper surface of the substrate on the lower layer side and the lower surface of the substrate on the upper layer side become an interface, and the knife is inserted into the interface. On the other hand, when there is a film between the two substrates, any position between the lower surface of the substrate on the upper layer side and the upper surface of the substrate on the lower layer side becomes an interface, and the knife is inserted into the interface.

(4) 於所述(1)至(3)的任一結構中,所述積層體的所述兩基板亦可於整周上不相互伸出。(4) In any of the structures (1) to (3), the two substrates of the laminate may not extend from each other over the entire circumference.

如此兩基板於整周上不相互伸出的情況下,特別是難以將刀插入至界面,但若如所述般使用夾具,則可避免此種問題。In this case, when the two substrates do not extend toward each other over the entire circumference, it is particularly difficult to insert a knife into the interface, but this problem can be avoided if a clamp is used as described.

(5) 於所述(1)至(4)的任一結構中,較佳為所述夾具的引導面的高度位置與所述界面的高度位置實質上相同或比其低,所述兩者的高低差比所述刀的厚度小。(5) In any one of the structures (1) to (4), it is preferred that the height position of the guide surface of the clamp is substantially the same as or lower than the height position of the interface, and the height difference between the two is smaller than the thickness of the knife.

若如此,則可於使刀可靠地與夾具的引導面接觸的狀態下將刀插入至界面。If so, the knife can be inserted into the interface while the knife is in reliable contact with the guide surface of the clamp.

(6) 於所述(1)至(5)的任一結構中,較佳為所述夾具與所述積層體於水平方向上的間隙的長度比所述刀的沿著移動方向的長度短。(6) In any one of the structures (1) to (5), it is preferred that the length of the gap between the clamp and the laminate in the horizontal direction is shorter than the length of the knife along the moving direction.

於此種情況下,亦可於使刀可靠地與夾具的引導面接觸的狀態下將刀插入至界面。In this case, the knife can also be inserted into the interface while the knife is reliably in contact with the guide surface of the clamp.

(7) 於所述(1)至(6)的任一結構中,較佳為所述夾具保持為能夠進行上下方向的位置調整。(7) In any one of the structures (1) to (6), it is preferred that the clamp is maintained so as to be able to be adjusted in the vertical direction.

若如此,則能夠進行夾具的上下方向的位置調整,因此可應對下層側的基板的厚度的差異等。This allows the vertical position adjustment of the jig, thereby being able to cope with differences in thickness of the substrate on the lower layer side.

(8) 於所述(1)至(7)的任一結構中,較佳為所述夾具保持為能夠進行水平方向的位置調整。(8) In any one of the structures (1) to (7), it is preferred that the clamp is maintained so as to be capable of horizontal position adjustment.

若如此,則能夠進行夾具的水平方向的位置調整,因此可調整夾具與積層體於水平方向上的間隙。If so, the position of the clamp can be adjusted in the horizontal direction, so the gap between the clamp and the laminate can be adjusted in the horizontal direction.

(9) 於所述(1)至(8)的任一結構中,較佳為所述夾具保持為能夠進行水平面內的角度調整。(9) In any one of the structures (1) to (8), it is preferred that the clamp is maintained so as to be capable of adjusting the angle within a horizontal plane.

若如此,則夾具能夠進行水平面內的角度調整,因此可應對自上側朝向下側觀察時的積層體的角部的角度的差異等。In this way, the angle of the jig can be adjusted in the horizontal plane, so it is possible to cope with the difference in the angle of the corner of the laminate when viewed from the upper side to the lower side.

(10) 於所述(1)至(9)的任一結構中,較佳為所述夾具形成為沿著所述下層側的基板的交叉的兩邊。(10) In any one of the structures (1) to (9), the clamp is preferably formed along two intersecting sides of the substrate on the lower layer side.

若如此,則可將刀可靠地插入至自上側朝向下側觀察時的積層體的角部的界面。In this way, the knife can be reliably inserted into the interface of the corner of the laminate when viewed from the upper side to the lower side.

(11) 於所述(1)至(10)的任一結構中,亦可於執行所述剝離步驟之前,進行如下準備步驟,即,藉由於下層側的原基板上貼附上層側的原基板且於所述上層側的原基板上實施處理而獲得原積層體,將所述原積層體切斷為多個,藉此獲得所述下層側的原基板成為所述下層側的基板且所述上層側的原基板成為所述上層側的基板的所述積層體。(11) In any of the structures (1) to (10), the following preparation step may be performed before executing the peeling step, namely, obtaining an original stacked body by attaching an original substrate on the upper side to an original substrate on the lower side and performing a process on the original substrate on the upper side, and cutting the original stacked body into a plurality of pieces, thereby obtaining the stacked body in which the original substrate on the lower side becomes the substrate on the lower side and the original substrate on the upper side becomes the substrate on the upper side.

若如此,則於所獲得的多個積層體中,如所述般可存在兩基板於整周上不相互伸出的積層體,但對於此種積層體亦可無問題地於兩基板之間插入刀。If so, among the plurality of laminates obtained, there may be laminates in which the two substrates do not extend from each other over the entire circumference as described above, but even for such laminates, a knife can be inserted between the two substrates without any problem.

(12) 為解決所述課題而創造的本發明的第二方面是一種電子元件的製造方法,其特徵在於包括:準備步驟,於下層側的原基板上貼附上層側的原玻璃基板後,製作包含所述原玻璃基板的原電子元件材料,藉此獲得原積層體;切斷步驟,藉由將所述原積層體切斷為多個,獲得所述原基板成為基板且所述原電子元件材料成為電子元件材料的多個積層體;以及剝離步驟,於自所述積層體剝離所述電子元件材料時,將刀插入至所述基板與所述電子元件材料之間的界面而生成剝離始點部,於所述剝離步驟中,使用具有引導所述刀的移動的引導面的夾具,使所述刀於與所述引導面接觸的狀態下朝向所述界面移動。(12) The second aspect of the present invention created to solve the above-mentioned problem is a method for manufacturing an electronic component, which is characterized by comprising: a preparation step, in which an original glass substrate on the upper layer side is attached to an original substrate on the lower layer side, and then an original electronic component material containing the original glass substrate is produced, thereby obtaining an original laminate; a cutting step, in which the original laminate is cut into a plurality of pieces, thereby obtaining the original substrate as a substrate and the original electronic component as a substrate; The sub-component material becomes a plurality of laminates of the electronic component material; and a peeling step, when peeling the electronic component material from the laminate, a knife is inserted into the interface between the substrate and the electronic component material to generate a peeling starting point, and in the peeling step, a clamp having a guide surface for guiding the movement of the knife is used to make the knife move toward the interface in a state of contact with the guide surface.

藉由此種方法,亦可將刀可靠地插入至基板與電子元件材料(玻璃基板)之間的界面。This method also allows the knife to be reliably inserted into the interface between the substrate and the electronic component material (glass substrate).

(13) 為解決所述課題而創造的本發明的第三方面是一種基板剝離用夾具,其特徵在於,於將刀插入至在下層側的基板上貼附有上層側的基板的積層體的所述兩基板之間的界面而生成剝離始點部時使用,所述基板剝離用夾具具有引導面,所述引導面與所述刀接觸且引導所述刀朝向所述界面移動。(13) The third aspect of the present invention created to solve the above-mentioned problem is a substrate stripping jig, which is characterized in that when a knife is inserted into the interface between the two substrates of a laminate in which an upper-layer substrate is attached to a lower-layer substrate to generate a stripping starting point, the substrate stripping jig has a guide surface that contacts the knife and guides the knife to move toward the interface.

若使用此種結構的基板剝離用夾具,則與所述情況同樣地可將刀可靠地插入至界面。 [發明的效果] If a substrate stripping jig of this structure is used, the knife can be reliably inserted into the interface in the same manner as in the above case. [Effect of the invention]

根據本發明,可將刀可靠地插入至積層體的下層側的基板與上層側的基板之間的界面。According to the present invention, the knife can be reliably inserted into the interface between the substrate on the lower layer side and the substrate on the upper layer side of the laminate.

以下,參照隨附圖式對本發明的實施形態的玻璃物品的製造方法及電子元件的製造方法以及基板剝離用夾具進行說明。Hereinafter, a method for manufacturing a glass article, a method for manufacturing an electronic component, and a jig for peeling a substrate according to an embodiment of the present invention will be described with reference to the accompanying drawings.

本實施形態的玻璃物品的製造方法包括用於自玻璃積層體剝離上層側的基板的剝離步驟。於實施剝離步驟時,可使用夾具(基板剝離用夾具)。The manufacturing method of the glass article of the present embodiment includes a peeling step for peeling the substrate on the upper layer side from the glass laminate. When performing the peeling step, a jig (substrate peeling jig) can be used.

圖1是例示玻璃積層體1與夾具2的立體圖。如該圖所示,玻璃積層體1是於作為下層側的基板的支撐玻璃基板3上貼附作為上層側的基板的玻璃膜4而構成。於該情況下,支撐玻璃基板3與玻璃膜4直接接著,於兩者3、4之間的界面X上作用有密接力。Fig. 1 is a perspective view showing a glass laminate 1 and a jig 2. As shown in the figure, the glass laminate 1 is formed by attaching a glass film 4 as an upper substrate to a supporting glass substrate 3 as a lower substrate. In this case, the supporting glass substrate 3 and the glass film 4 are directly in contact, and a close contact force acts on the interface X between the two 3 and 4.

支撐玻璃基板3及玻璃膜4於自上側朝向下側觀察的情況下(以下,稱為俯視)均呈矩形形狀,兩者3、4於整周上不相互伸出。玻璃膜4的厚度例如為300 μm以下,較佳為200 μm以下。另外,支撐玻璃基板3的厚度例如為1500 μm以下,較佳為700 μm以下,進而佳為500 μm以下。兩者3、4具有可撓性。The supporting glass substrate 3 and the glass film 4 are both rectangular in shape when viewed from the top to the bottom (hereinafter referred to as a top view), and the two 3 and 4 do not extend from each other over the entire circumference. The thickness of the glass film 4 is, for example, 300 μm or less, preferably 200 μm or less. In addition, the thickness of the supporting glass substrate 3 is, for example, 1500 μm or less, preferably 700 μm or less, and further preferably 500 μm or less. The two 3 and 4 are flexible.

該圖所示的夾具2於自玻璃積層體1剝離玻璃膜4時使用,與玻璃積層體1一起放置於同一作業面F上。該夾具2包括:與玻璃積層體1的俯視時的角部1a對應的角部2a、以及與玻璃積層體1的一邊(一端面)1b及和其連接的另一邊(另一端面)1c對應的一邊(一端面)2b及另一邊(另一端部)2c。玻璃積層體1的一邊1b及另一邊2c於俯視時的長度均例如為10 mm~900 mm,較佳為100 mm~500 mm。The jig 2 shown in the figure is used when peeling the glass film 4 from the glass laminate 1, and is placed on the same working surface F together with the glass laminate 1. The jig 2 includes: a corner 2a corresponding to the corner 1a of the glass laminate 1 when viewed from above, and a side (one end face) 2b and another side (the other end face) 2c corresponding to one side (one end face) 1b of the glass laminate 1 and the other side (the other end face) 1c connected thereto. The length of the one side 1b and the other side 2c of the glass laminate 1 when viewed from above is, for example, 10 mm to 900 mm, preferably 100 mm to 500 mm.

夾具2的以角部1a為界的一邊2b與另一邊2c實質上正交(正交或大致正交)。另外,夾具2的遠離玻璃積層體1之側的兩邊2d、2e亦實質上正交。夾具2的整體形狀呈於以角部2a為邊界正交的方向上分別以相同寬度延伸的形狀。夾具2可由玻璃、陶瓷、樹脂等形成,但於本實施形態中由玻璃形成。One side 2b of the clamp 2 bounded by the corner 1a is substantially orthogonal (or substantially orthogonal) to the other side 2c. In addition, the two sides 2d and 2e of the clamp 2 on the side away from the glass laminate 1 are also substantially orthogonal. The overall shape of the clamp 2 is a shape extending with the same width in directions orthogonal to the corner 2a. The clamp 2 can be formed of glass, ceramics, resin, etc., but is formed of glass in this embodiment.

圖2例示實施剝離步驟時的初始狀態。如該圖所示,夾具2的以角部2a為界的兩邊2b、2c配置成沿著玻璃積層體1的以角部1a為界的兩邊1b、1c(嚴格來說是支撐玻璃基板3的以角部1a為界的兩邊)。另外,夾具2的角部2a實質上與玻璃積層體1的角部1a接觸(接觸或大致接觸)。FIG2 illustrates an initial state when the peeling step is performed. As shown in the figure, the two sides 2b and 2c of the clamp 2 bounded by the corner 2a are arranged along the two sides 1b and 1c bounded by the corner 1a of the glass laminate 1 (strictly speaking, the two sides bounded by the corner 1a of the supporting glass substrate 3). In addition, the corner 2a of the clamp 2 is substantially in contact with the corner 1a of the glass laminate 1 (in contact or approximately in contact).

於該剝離步驟中,使用刀5。夾具2的上表面2f設為引導刀5朝向玻璃積層體1(其角部1a)移動(箭頭a方向的移動)的引導面。於本實施形態中,夾具2的引導面2f的高度位置與玻璃積層體1的界面X的高度位置設為實質上相同(相同或大致相同)。In this peeling step, a knife 5 is used. The upper surface 2f of the jig 2 is set as a guide surface for guiding the knife 5 to move toward the glass laminate 1 (its corner 1a) (movement in the direction of arrow a). In this embodiment, the height position of the guide surface 2f of the jig 2 and the height position of the interface X of the glass laminate 1 are set to be substantially the same (same or approximately the same).

於刀5自該初始狀態以與夾具2的引導面2f接觸的狀態向箭頭a方向移動的情況下,首先,如圖3中實線所示,刀5的刀尖5a到達玻璃積層體1的界面X。若詳細敘述,則如圖4所示,刀5具有:厚度自刀刃根側朝向刀尖5a逐漸變小的刀刃部5b、以及厚度不發生變化的刀刃根側部位5c。而且,於僅刀5的刀刃部5b(其下表面)與夾具2的引導面2f接觸的狀態下移動,藉此刀5的刀尖5a準確地到達玻璃積層體1的界面X。再者,刀5的厚度(嚴格來說為刀刃根側部位5c的厚度)為50 μm~150 μm,較佳為80 μm~120 μm。When the knife 5 moves in the direction of arrow a from the initial state in a state of contacting the guide surface 2f of the fixture 2, first, as shown by the solid line in FIG3, the tip 5a of the knife 5 reaches the interface X of the glass laminate 1. In detail, as shown in FIG4, the knife 5 has: a blade portion 5b whose thickness gradually decreases from the blade root side toward the tip 5a, and a blade root side portion 5c whose thickness does not change. And, the knife 5 moves in a state in which only the blade portion 5b (the lower surface) of the knife 5 is in contact with the guide surface 2f of the fixture 2, so that the tip 5a of the knife 5 accurately reaches the interface X of the glass laminate 1. The thickness of the blade 5 (strictly speaking, the thickness of the blade root portion 5c) is 50 μm to 150 μm, preferably 80 μm to 120 μm.

自該狀態起,刀5於與夾具2的引導面2f接觸的狀態下進一步向箭頭a方向移動,藉此如圖5中實線所示,刀5插入至界面X。結果,於界面X生成剝離始點部6。該剝離始點部6以於圖6中附加了虛線的平行斜線的態樣生成。再者,刀5向箭頭a方向的移動藉由作業者或機械手臂等來進行。From this state, the knife 5 further moves in the direction of arrow a while in contact with the guide surface 2f of the fixture 2, thereby inserting the knife 5 into the interface X as shown by the solid line in FIG5. As a result, a peeling start point 6 is generated at the interface X. The peeling start point 6 is generated in the form of parallel oblique lines with dashed lines added in FIG6. In addition, the movement of the knife 5 in the direction of arrow a is performed by an operator or a robot arm, etc.

於形成剝離始點部6之後,於剝離始點部6插入特氟龍片材(Teflon sheet)(註冊商標)等片材構件(省略圖示),藉此以可防止再密接的狀態拔出刀5。進而之後,藉由使用吸附墊等的方法(公知的方法),使界面X的剝離進展。而且,藉由該剝離的進展完成,剝離步驟結束,獲得作為產品的玻璃膜4(玻璃物品)。After the peeling starting point 6 is formed, a sheet member (not shown) such as a Teflon sheet (registered trademark) is inserted into the peeling starting point 6, thereby pulling out the knife 5 in a state where re-adhesion can be prevented. Then, the peeling of the interface X is advanced by a method (known method) such as using an adsorption pad. And, the peeling step is completed by the progress of the peeling, and the glass film 4 (glass article) as a product is obtained.

於所述剝離步驟中,將夾具2的引導面2f的高度位置與玻璃積層體1的界面X的高度位置設為實質上相同。於該情況下,刀5的厚度如已例示般極薄。因此,即便引導面2f的高度位置比界面X的高度位置低,只要兩者2f、X的高低差比刀5的厚度小,則於使刀5的刀尖5a準確地到達界面X的方面不會造成問題。因此,引導面2f的高度位置較佳為與界面X的高度位置實質上相同,但即便引導面2f的高度位置比界面X的高度位置低,只要兩者2f、X的高低差比刀5的厚度小即可。In the peeling step, the height position of the guide surface 2f of the clamp 2 is set to be substantially the same as the height position of the interface X of the glass laminate 1. In this case, the thickness of the knife 5 is extremely thin as already illustrated. Therefore, even if the height position of the guide surface 2f is lower than the height position of the interface X, as long as the height difference between 2f and X is smaller than the thickness of the knife 5, there will be no problem in making the tip 5a of the knife 5 accurately reach the interface X. Therefore, the height position of the guide surface 2f is preferably substantially the same as the height position of the interface X, but even if the height position of the guide surface 2f is lower than the height position of the interface X, as long as the height difference between 2f and X is smaller than the thickness of the knife 5, it will be sufficient.

於所述剝離步驟中,於僅刀5的刀刃部5b與夾具2的引導面2f接觸的狀態下,使刀5向箭頭a方向移動,但如圖7所示,亦可於僅刀5的刀刃根側部位5c(其下表面)與引導面2f接觸的狀態下,使刀5移動。於以所述方式進行的情況下,引導面2f的高度位置較佳為比界面X的高度位置低僅刀5的厚度的1/2。再者,例如如圖8所示,刀5的形狀亦可為厚度於沿著移動方向的全長上自刀刃根側朝向刀尖5a逐漸變小的形狀等,並無特別限定。In the stripping step, the knife 5 is moved in the direction of arrow a with only the blade portion 5b of the knife 5 in contact with the guide surface 2f of the fixture 2, but as shown in FIG7 , the knife 5 may be moved with only the blade root portion 5c (its lower surface) of the knife 5 in contact with the guide surface 2f. In the case of the above-described method, the height position of the guide surface 2f is preferably lower than the height position of the interface X by only 1/2 of the thickness of the knife 5. Furthermore, for example, as shown in FIG8 , the shape of the knife 5 may be a shape in which the thickness gradually decreases from the blade root toward the knife tip 5a along the entire length along the moving direction, etc., and there is no particular limitation.

本實施形態的夾具2為了應對支撐玻璃基板3變更為厚度不同者的情況等,包括以下所示的結構。即,如圖9所示,於夾具2,於角部2a的周邊區域除外的多個部位(於圖例中為四個部位)形成有沿著上下方向的貫通孔2g。於該些貫通孔2g中插通有沿上下方向延伸的棒狀的引導構件7。藉此,夾具2被引導構件7引導而能夠上下移動。於該情況下,如圖10所示,亦可於夾具2的下方隔著間隙S配置基台板8,將引導構件7的下端固定於該基台板8上。若如此,則適宜變更厚度不同的間隔件並將其插入至夾具2的下方的間隙S,藉此可進行夾具2的上下方向的位置調整。另外,亦可使用LM引導件或氣缸等驅動部件,進行夾具2的上下方向的位置調整。取而代之,亦可不使用引導構件7,自上方將螺栓擰入形成於夾具2的多個部位的螺紋孔中,使螺栓旋轉,藉此進行夾具2的上下方向的位置調整。於該情況下,可設置基台板8或者亦可不設置基台板8。In order to cope with the situation where the supporting glass substrate 3 is changed to one with a different thickness, the clamp 2 of this embodiment includes the structure shown below. That is, as shown in FIG9 , through holes 2g are formed in the clamp 2 at multiple locations (four locations in the example) excluding the peripheral area of the corner 2a. Rod-shaped guide members 7 extending in the vertical direction are inserted into these through holes 2g. Thereby, the clamp 2 is guided by the guide member 7 and can move up and down. In this case, as shown in FIG10 , a base plate 8 may be arranged below the clamp 2 with a gap S between them, and the lower end of the guide member 7 may be fixed to the base plate 8. If so, the spacer with a different thickness is appropriately changed and inserted into the gap S below the clamp 2, thereby adjusting the position of the clamp 2 in the vertical direction. In addition, the position of the clamp 2 in the vertical direction may be adjusted by using a driving component such as an LM guide or an air cylinder. Alternatively, the guide member 7 may not be used, and bolts may be screwed into threaded holes formed at multiple locations of the clamp 2 from above, and the bolts may be rotated to adjust the position of the clamp 2 in the vertical direction. In this case, the base plate 8 may be provided or may not be provided.

於所述剝離步驟中,使夾具2的角部2a實質上與玻璃積層體1的角部1a接觸,但由於夾具2與玻璃積層體1的形狀於俯視時相互不一致等理由,有時無法使兩角部1a、2a實質上接觸。另外,亦有欲增大夾具2與玻璃積層體1的佈局的自由度的要求。為了應對該些,本實施形態的夾具2包括以下所示的結構。即,如圖11所示,夾具2被保持為藉由配置於其下方的多條(於圖例中為兩條)導軌9能夠沿刀5的移動方向及與其相反的方向滑動。於該情況下,如圖12所示,於夾具2的下方隔著間隙T配置基台板10,將導軌9固定於該基台板10上。而且,亦可藉由將形成於夾具2的下部的槽2h嵌入至該導軌9,夾具2被導軌9引導而移動。於該情況下,亦可使用LM引導件或氣缸等驅動部件。若如此,則可調整夾具2於水平方向上的位置。詳細而言,可調整夾具2與玻璃積層體1之間的水平方向上的間隙的長度。此時調整的間隙的長度較佳為限制於比刀5的沿著移動方向的長度短的範圍內。此處,所謂間隙的長度是指於兩者1、2的角部1a、2a的相互間的沿著刀5的移動方向的間隙的長度。若如此,則可於使刀5可靠地與夾具2的引導面2f接觸的狀態下使其刀尖5a到達玻璃積層體1的界面X。In the stripping step, the corner 2a of the clamp 2 is brought into substantial contact with the corner 1a of the glass laminate 1. However, due to the fact that the shapes of the clamp 2 and the glass laminate 1 are inconsistent with each other when viewed from above, it is sometimes impossible to bring the two corners 1a, 2a into substantial contact. In addition, there is also a demand to increase the degree of freedom in the layout of the clamp 2 and the glass laminate 1. In order to cope with these, the clamp 2 of this embodiment includes the structure shown below. That is, as shown in FIG11, the clamp 2 is maintained so as to be able to slide in the moving direction of the knife 5 and in the opposite direction thereof by a plurality of (two in the example) guide rails 9 arranged thereunder. In this case, as shown in FIG. 12, a base plate 10 is disposed below the clamp 2 with a gap T therebetween, and a guide rail 9 is fixed to the base plate 10. Furthermore, the clamp 2 can be moved by being guided by the guide rail 9 by inserting a groove 2h formed at the bottom of the clamp 2. In this case, a driving component such as an LM guide or a cylinder can also be used. In this way, the position of the clamp 2 in the horizontal direction can be adjusted. Specifically, the length of the gap in the horizontal direction between the clamp 2 and the glass laminate 1 can be adjusted. At this time, the length of the gap to be adjusted is preferably limited to a range shorter than the length of the knife 5 along the moving direction. Here, the length of the gap refers to the length of the gap between the corners 1a and 2a of the two 1 and 2 along the moving direction of the knife 5. In this way, the knife 5 can reach the interface X of the glass laminate 1 with its tip 5a in a state where the knife 5 is reliably in contact with the guide surface 2f of the clamp 2.

於所述剝離步驟中,將夾具2的角部2a設定為實質上為直角,但玻璃積層體1的角部1a的角度有時因誤差等而實質上並非直角。為了應對此情況,本實施形態的夾具2包括以下所示的結構。即,如圖13所示,夾具2以角部2a為界進行二分割。而且,被分割的各個夾具片2i被保持為藉由配置於該些的下方的呈圓弧狀的導軌11能夠於沿著圓弧的方向滑動。詳細而言,該些導軌11仿照以夾具2的角部2a為中心的圓弧而彎曲。於該情況下,與所述情況同樣地,亦可於夾具片2i的下方配置基台板,並且將導軌固定於基台板上,且將形成於夾具片2i的下部的槽2j嵌入至導軌。另外,亦可使用LM引導件或氣缸等驅動部件。而且,藉由使其中一夾具片2i或兩夾具片2i以角部2a為中心沿著導軌11移動,夾具2能夠進行於水平面內的角度調整。In the stripping step, the corner 2a of the clamp 2 is set to be substantially a right angle, but the angle of the corner 1a of the glass laminate 1 is sometimes not substantially a right angle due to errors or the like. In order to cope with this situation, the clamp 2 of the present embodiment includes the structure shown below. That is, as shown in FIG13 , the clamp 2 is divided into two parts with the corner 2a as a boundary. Moreover, each of the divided clamp pieces 2i is maintained so as to be able to slide along the direction of the arc by means of an arc-shaped guide rail 11 disposed below them. Specifically, the guide rails 11 are bent to imitate an arc centered at the corner 2a of the clamp 2. In this case, as in the above case, a base plate may be arranged below the clamp piece 2i, and a guide rail may be fixed to the base plate, and a groove 2j formed at the bottom of the clamp piece 2i may be embedded in the guide rail. Alternatively, a driving component such as an LM guide or a cylinder may be used. Furthermore, by moving one or both of the clamp pieces 2i along the guide rail 11 with the corner 2a as the center, the clamp 2 can be adjusted in angle in the horizontal plane.

本實施形態的玻璃物品的製造方法包括準備步驟與切斷步驟作為進行所述的剝離步驟之前的步驟。The manufacturing method of the glass article of this embodiment includes a preparation step and a cutting step as steps before performing the stripping step.

於準備步驟中,首先,如圖14所示,藉由直接接著將上層側的原玻璃膜4A貼附於下層側的原支撐玻璃基板3A上。於該情況下,原支撐玻璃基板3A的四個邊3Aa自原玻璃膜4A的四個邊4Aa向外側伸出。之後,於原玻璃膜4A上實施透明導電膜(例如ITO膜)的成膜處理,並且對該膜實施基於蝕刻等的圖案化處理。藉此,獲得原玻璃積層體1A。In the preparation step, first, as shown in FIG. 14 , the original glass film 4A on the upper layer side is directly attached to the original supporting glass substrate 3A on the lower layer side. In this case, the four sides 3Aa of the original supporting glass substrate 3A extend outward from the four sides 4Aa of the original glass film 4A. After that, a transparent conductive film (e.g., an ITO film) is formed on the original glass film 4A, and the film is patterned by etching or the like. In this way, the original glass laminate 1A is obtained.

於切斷步驟中,藉由雷射等將所述原玻璃積層體1A沿著該圖所示的虛線L切斷為多個(於圖例中為九個)。藉由自該切斷後的多個取出存在於中央的一個,獲得玻璃積層體1(圖1及圖2所示的玻璃積層體1)。對該玻璃積層體1執行所述的剝離步驟。In the cutting step, the original glass laminate 1A is cut into a plurality of pieces (nine pieces in the example) along the dotted line L shown in the figure by laser or the like. A glass laminate 1 (glass laminate 1 shown in FIGS. 1 and 2 ) is obtained by taking out one piece in the center from the plurality of pieces after the cutting. The stripping step is performed on the glass laminate 1.

再者,於所述的剝離步驟中自該玻璃積層體1剝離的玻璃膜4是作為電子元件材料的玻璃物品。因此,以上說明的玻璃物品的製造方法的含義與電子元件的製造方法相同。Furthermore, the glass film 4 peeled off from the glass laminate 1 in the peeling step is a glass article as an electronic component material. Therefore, the meaning of the manufacturing method of the glass article described above is the same as the manufacturing method of the electronic component.

接下來,對本實施形態的電子元件的製造方法的另一例進行說明。Next, another example of the method for manufacturing the electronic device according to the present embodiment will be described.

於該製造方法的準備步驟中,首先,藉由直接接著將原玻璃膜4A貼附於原支撐玻璃基板3A上,獲得圖14所示的原玻璃積層體1A。繼而,於原玻璃積層體1A的原玻璃膜4A上貼附另一原玻璃膜4A。之後,藉由實施於原玻璃膜4A與其上方的另一原玻璃膜4A之間封入液晶的處理以及其他必要的處理,於原支撐玻璃基板3A上製作原液晶面板12A。藉此,獲得圖15所示的原玻璃積層體1A。In the preparation step of the manufacturing method, first, by directly attaching the original glass film 4A to the original supporting glass substrate 3A, the original glass laminate 1A shown in FIG. 14 is obtained. Then, another original glass film 4A is attached to the original glass laminate 1A. After that, by performing a process of sealing liquid crystal between the original glass film 4A and another original glass film 4A above it and other necessary processes, the original liquid crystal panel 12A is manufactured on the original supporting glass substrate 3A. In this way, the original glass laminate 1A shown in FIG. 15 is obtained.

於切斷步驟中,藉由雷射等將所述原玻璃積層體1A沿著該圖所示的虛線M切斷為多個(於圖例中為九個)。藉由自該切斷後的多個取出存在於中央的一個,獲得於支撐玻璃基板3上貼附有具有兩張玻璃膜4的液晶面板12的玻璃積層體1。In the cutting step, the original glass laminate 1A is cut into a plurality of pieces (nine pieces in the example) along the dotted line M shown in the figure by laser or the like. By taking out one piece in the center from the plurality of pieces after the cutting, a glass laminate 1 having a liquid crystal panel 12 having two glass films 4 attached to a supporting glass substrate 3 is obtained.

於剝離步驟中,自所述的玻璃積層體1剝離液晶面板12。若詳細敘述,則於該情況下,如圖16所示,支撐玻璃基板3與液晶面板12之間成為界面X,將刀5插入至該界面X,藉此生成剝離始點部6。再者,於該情況下,亦可使支撐玻璃基板3與液晶面板12的上下反轉而生成剝離始點部6。然後,藉由剝離步驟完成,可獲得於液晶顯示器等電子元件的製造中所使用的液晶面板12。In the peeling step, the liquid crystal panel 12 is peeled off from the glass laminate 1. In detail, in this case, as shown in FIG. 16, the interface X is formed between the supporting glass substrate 3 and the liquid crystal panel 12, and the knife 5 is inserted into the interface X to generate the peeling starting point 6. Furthermore, in this case, the supporting glass substrate 3 and the liquid crystal panel 12 may be reversed up and down to generate the peeling starting point 6. Then, by completing the peeling step, the liquid crystal panel 12 used in the manufacture of electronic components such as liquid crystal displays can be obtained.

於該製造方法中,有時於製作圖15所示的原玻璃積層體1A之後,藉由直接接著進而於原液晶面板12A的上側的原玻璃膜4A上貼附另一原支撐玻璃基板3A。於該情況下,於剝離步驟中,自經過與所述相同的切斷步驟而獲得的玻璃積層體1,首先,剝離支撐玻璃基板3。若詳細敘述,則於該情況下,如圖17所示,上側的支撐玻璃基板3與液晶面板12之間成為界面X,將刀5插入至該界面X,藉此生成剝離始點部6。於該剝離作業完成後,進而於所述的圖16所示的態樣(或上下反轉的態樣)下進行液晶面板12的剝離。於該情況下,夾具2的引導面2f的高度位置得到變更。In this manufacturing method, after the original glass laminate 1A shown in FIG. 15 is manufactured, another original supporting glass substrate 3A is directly attached to the original glass film 4A on the upper side of the original liquid crystal panel 12A. In this case, in the peeling step, the supporting glass substrate 3 is first peeled off from the glass laminate 1 obtained through the same cutting step as described above. If described in detail, in this case, as shown in FIG. 17, the upper supporting glass substrate 3 and the liquid crystal panel 12 become an interface X, and the knife 5 is inserted into the interface X, thereby generating a peeling starting point 6. After the peeling operation is completed, the liquid crystal panel 12 is peeled off in the state shown in Figure 16 (or the state of upside down). In this case, the height position of the guide surface 2f of the clamp 2 is changed.

再者,於所述實施形態中,藉由直接接著將玻璃膜4貼附於支撐玻璃基板3上,但亦可於支撐玻璃基板3與玻璃膜4之間介隔存在有如圖18所示的膜13。該膜13是有機膜或無機膜,其厚度未滿1 μm。此時的剝離步驟中,如該圖所示,膜13的上表面與玻璃膜4的下表面之間成為界面X,利用刀5生成剝離始點部6。再者,界面X可為膜13的下表面與支撐玻璃基板3的上表面之間,亦可為玻璃膜4的下表面與支撐玻璃基板3的上表面之間的任意位置。Furthermore, in the above-mentioned embodiment, the glass film 4 is directly attached to the supporting glass substrate 3, but a film 13 as shown in FIG. 18 may be interposed between the supporting glass substrate 3 and the glass film 4. The film 13 is an organic film or an inorganic film, and its thickness is less than 1 μm. In the peeling step at this time, as shown in the figure, the upper surface of the film 13 and the lower surface of the glass film 4 form an interface X, and a peeling starting point 6 is generated by a knife 5. Furthermore, the interface X may be between the lower surface of the film 13 and the upper surface of the supporting glass substrate 3, or may be any position between the lower surface of the glass film 4 and the upper surface of the supporting glass substrate 3.

另外,於所述實施形態中,如圖17例示般,液晶面板12與支撐玻璃基板3之間亦藉由直接接著進行貼附,但亦可如圖19所示,於液晶面板12與支撐玻璃基板3之間介隔存在有與所述相同的膜13。此時的剝離步驟中,如該圖所示,上側的膜13的下表面與液晶面板12的上表面之間成為第一界面X1,下側的膜13的上表面與液晶面板12的下表面之間成為第二界面X2。該圖例示了對於第一界面X1利用刀5生成剝離始點部6的態樣,對於第二界面X2亦以相同的態樣(或上下反轉的態樣)生成剝離始點部。另外,於玻璃積層體1不存在上側的支撐玻璃基板3的情況下,亦以與此相同的態樣(或上下反轉的態樣)生成剝離始點部。In addition, in the embodiment, as shown in FIG. 17 , the liquid crystal panel 12 and the supporting glass substrate 3 are also directly attached, but as shown in FIG. 19 , a film 13 as described above may be interposed between the liquid crystal panel 12 and the supporting glass substrate 3. In the peeling step at this time, as shown in the figure, the lower surface of the upper film 13 and the upper surface of the liquid crystal panel 12 form a first interface X1, and the upper surface of the lower film 13 and the lower surface of the liquid crystal panel 12 form a second interface X2. The figure illustrates a mode in which a peeling starting point 6 is generated for the first interface X1 using a knife 5, and a peeling starting point is generated for the second interface X2 in the same mode (or in a reversed mode). In addition, when the glass laminate 1 does not have the upper supporting glass substrate 3, the peeling starting point portion is generated in the same manner (or in a reversed manner).

所述實施形態的夾具2以角部2a為界具有兩個邊2b、2c,但如圖20所示,亦可不具有角部而沿著一直線上。換言之,該圖所示的夾具2僅沿著玻璃積層體1的一邊1b(嚴格來說僅支撐玻璃基板3的一邊)。於該情況下,如該圖所示,較佳為夾具2的一邊2b自玻璃積層體1的角部1a伸出。The clamp 2 of the embodiment has two sides 2b and 2c bounded by a corner 2a, but as shown in FIG20, it may also be along a straight line without a corner. In other words, the clamp 2 shown in the figure only extends along one side 1b of the glass laminate 1 (strictly speaking, only supports one side of the glass substrate 3). In this case, as shown in the figure, it is preferred that one side 2b of the clamp 2 extends from the corner 1a of the glass laminate 1.

所述實施形態的玻璃積層體1中,支撐玻璃基板3與玻璃膜4於整周上不相互伸出,但即便支撐玻璃基板3與玻璃膜4中的任一者自另一者伸出,於其伸出尺寸短的情況下,亦可同樣地適用本發明。因此,例如於圖14所示的原玻璃積層體1A中,於原支撐玻璃基板3A自原玻璃膜4A的伸出尺寸短的情況下,對於切斷該原玻璃積層體1A而獲得的多個所有的玻璃積層體1,可適用本發明(對於圖15所示的原玻璃積層體1A亦同樣)。In the glass laminate 1 of the embodiment, the supporting glass substrate 3 and the glass film 4 do not extend from each other over the entire circumference. However, even if one of the supporting glass substrate 3 and the glass film 4 extends from the other, the present invention can be applied in the same manner if the extending length is short. Therefore, for example, in the original glass laminate 1A shown in FIG. 14 , if the extending length of the original supporting glass substrate 3A from the original glass film 4A is short, the present invention can be applied to all of the plurality of glass laminates 1 obtained by cutting the original glass laminate 1A (the same applies to the original glass laminate 1A shown in FIG. 15 ).

所述實施形態的玻璃積層體1的下層側的基板與上層側的基板均由玻璃形成,但任一者可由陶瓷或樹脂等其他材質形成,進而兩者亦可由陶瓷或樹脂等其他材質形成。The lower substrate and the upper substrate of the glass laminate 1 of the above-described embodiment are both made of glass, but either one of them may be made of other materials such as ceramics or resins, or both of them may be made of other materials such as ceramics or resins.

所述實施形態的玻璃積層體1包括一個界面X或兩個界面X1、X2,但亦可包括三個以上的界面。The glass laminate 1 of the embodiment includes one interface X or two interfaces X1, X2, but may also include three or more interfaces.

1:玻璃積層體(積層體) 1A:原玻璃積層體 1a:積層體的角部 1b:積層體的邊(下層側的基板的邊/一端面) 1c:積層體的邊(下層側的基板的邊/另一端面) 2:夾具(基板剝離用夾具) 2a:夾具的角部 2b:夾具的邊(一端面) 2c:夾具的邊(另一端部[端面]) 2d:邊 2e:邊 2f:夾具的引導面(上表面) 2g:貫通孔 2h:槽 2i:夾具片 2j:槽 3:支撐玻璃基板(下層側的基板) 3A:原支撐玻璃基板(下層側的原基板) 3Aa:邊 4:玻璃膜(上層側的基板) 4A:原玻璃膜(上層側的原基板) 4Aa:邊 5:刀 5a:刀的刀尖 5b:刀刃部 5c:刀刃根側部位 6:剝離始點部 7:引導構件 8:基台板 9:導軌 10:基台板 11:導軌 12:液晶面板 12A:原液晶面板 13:膜 A-A:線 a:箭頭 B-B:線 C-C:線 F:作業面 L:虛線 M:虛線 S:間隙 T:間隙 X:界面 X1:界面(第一界面) X2:界面(第二界面) 1: Glass laminate (laminate) 1A: Original glass laminate 1a: Corner of laminate 1b: Edge of laminate (edge of substrate on lower layer side/one end face) 1c: Edge of laminate (edge of substrate on lower layer side/other end face) 2: Clamp (clamp for substrate peeling) 2a: Corner of clamp 2b: Edge of clamp (one end face) 2c: Edge of clamp (other end [end face]) 2d: Edge 2e: Edge 2f: Guide surface of clamp (upper surface) 2g: Through hole 2h: Groove 2i: Clamp piece 2j: Groove 3: Supporting glass substrate (substrate on the lower side) 3A: Original supporting glass substrate (original substrate on the lower side) 3Aa: Edge 4: Glass film (substrate on the upper side) 4A: Original glass film (original substrate on the upper side) 4Aa: Edge 5: Knife 5a: Tip of knife 5b: Blade 5c: Blade root 6: Peeling start 7: Guide member 8: Base plate 9: Guide rail 10: Base plate 11: Guide rail 12: LCD panel 12A: Original LCD panel 13: Film A-A: Line a: Arrow B-B: Line C-C: Line F: Working surface L: Dotted line M: Dotted line S: gap T: gap X: interface X1: interface (first interface) X2: interface (second interface)

圖1是表示本發明的實施形態的玻璃物品的製造方法中所使用的積層體及基板剝離用夾具的立體圖。 圖2是表示實施本發明的實施形態的玻璃物品的製造方法中的剝離步驟時的初始狀態的立體圖。 圖3是表示實施本發明的實施形態的玻璃物品的製造方法中的剝離步驟的狀態,並且相當於圖2的A-A線剖面圖的剖面圖(省略影線)。 圖4是表示實施本發明的實施形態的玻璃物品的製造方法中的剝離步驟的狀態,並且相當於圖2的A-A線剖面圖的剖面圖(省略影線)。 圖5是表示實施本發明的實施形態的玻璃物品的製造方法中的剝離步驟的狀態,並且相當於圖2的A-A線剖面圖的剖面圖(省略影線)。 圖6是表示實施本發明的實施形態的玻璃物品的製造方法中的剝離步驟的狀態的平面圖。 圖7是表示實施本發明的實施形態的玻璃物品的製造方法中的剝離步驟的第一變形例的狀態,並且相當於圖2的A-A線剖面圖的剖面圖(省略影線)。 圖8是表示實施本發明的實施形態的玻璃物品的製造方法中的剝離步驟的第二變形例的狀態,並且相當於圖2的A-A線剖面圖的剖面圖(省略影線)。 圖9是表示於本發明的實施形態的玻璃物品的製造方法中的剝離步驟中所使用的基板剝離用夾具的第一變形例的立體圖。 圖10是根據圖9的B-B線切斷的剖面圖。 圖11是表示於本發明的實施形態的玻璃物品的製造方法中的剝離步驟中所使用的基板剝離用夾具的第二變形例的平面圖。 圖12是根據圖11的C-C線切斷的剖面圖。 圖13是表示於本發明的實施形態的玻璃物品的製造方法中的剝離步驟中所使用的基板剝離用夾具的第三變形例的平面圖。 圖14是用於說明本發明的實施形態的玻璃物品的製造方法中的準備步驟及切斷步驟的立體圖。 圖15是用於說明本發明的實施形態的電子元件的製造方法中的準備步驟及切斷步驟的立體圖。 圖16是表示實施本發明的實施形態的電子元件的製造方法中的剝離步驟的狀態,並且與圖2的A-A線剖面圖對應的剖面圖(省略影線)。 圖17是表示實施本發明的實施形態的電子元件的製造方法中的剝離步驟的第一變形例的狀態,並且與圖2的A-A線剖面圖對應的剖面圖(省略影線)。 圖18是表示實施本發明的實施形態的玻璃物品的製造方法中的剝離步驟的第三變形例的狀態,並且相當於圖2的A-A線剖面圖的剖面圖(省略影線)。 圖19是表示實施本發明的實施形態的電子元件的製造方法中的剝離步驟的第二變形例的狀態,並且與圖2的A-A線剖面圖對應的剖面圖(省略影線)。 圖20是表示於本發明的實施形態的玻璃物品的製造方法中的剝離步驟中所使用的基板剝離用夾具的第四變形例的立體圖。 FIG. 1 is a perspective view of a laminate and substrate peeling jig used in a method for manufacturing a glass article according to an embodiment of the present invention. FIG. 2 is a perspective view showing an initial state during a peeling step in a method for manufacturing a glass article according to an embodiment of the present invention. FIG. 3 is a cross-sectional view (hatching omitted) showing a state of a peeling step in a method for manufacturing a glass article according to an embodiment of the present invention and corresponding to the A-A line cross-sectional view of FIG. 2. FIG. 4 is a cross-sectional view (hatching omitted) showing a state of a peeling step in a method for manufacturing a glass article according to an embodiment of the present invention and corresponding to the A-A line cross-sectional view of FIG. 2. FIG. 5 is a cross-sectional view (hatching omitted) showing the state of the peeling step in the method for manufacturing a glass article in the embodiment of the present invention, and is equivalent to the cross-sectional view of the A-A line in FIG. 2. FIG. 6 is a plan view showing the state of the peeling step in the method for manufacturing a glass article in the embodiment of the present invention. FIG. 7 is a cross-sectional view (hatching omitted) showing the state of the first variant of the peeling step in the method for manufacturing a glass article in the embodiment of the present invention, and is equivalent to the cross-sectional view of the A-A line in FIG. 2. FIG. 8 is a cross-sectional view (hatching omitted) showing the state of the second variant of the peeling step in the method for manufacturing a glass article in the embodiment of the present invention, and is equivalent to the cross-sectional view of the A-A line in FIG. 2. FIG. 9 is a perspective view showing a first variant of a substrate peeling jig used in a peeling step in a method for manufacturing a glass article in an embodiment of the present invention. FIG. 10 is a cross-sectional view cut along the B-B line of FIG. 9 . FIG. 11 is a plan view showing a second variant of a substrate peeling jig used in a peeling step in a method for manufacturing a glass article in an embodiment of the present invention. FIG. 12 is a cross-sectional view cut along the C-C line of FIG. 11 . FIG. 13 is a plan view showing a third variant of a substrate peeling jig used in a peeling step in a method for manufacturing a glass article in an embodiment of the present invention. FIG. 14 is a perspective view for explaining the preparation step and the cutting step in the manufacturing method of the glass article of the embodiment of the present invention. FIG. 15 is a perspective view for explaining the preparation step and the cutting step in the manufacturing method of the electronic component of the embodiment of the present invention. FIG. 16 is a cross-sectional view (hatching omitted) corresponding to the A-A line cross-sectional view of FIG. 2, showing the state of the peeling step in the manufacturing method of the electronic component of the embodiment of the present invention. FIG. 17 is a cross-sectional view (hatching omitted) corresponding to the A-A line cross-sectional view of FIG. 2, showing the state of the first variant of the peeling step in the manufacturing method of the electronic component of the embodiment of the present invention. FIG. 18 is a cross-sectional view (hatching omitted) showing the state of the third variant of the peeling step in the method for manufacturing a glass article according to the embodiment of the present invention, and is equivalent to the cross-sectional view along the line A-A of FIG. 2 . FIG. 19 is a cross-sectional view (hatching omitted) showing the state of the second variant of the peeling step in the method for manufacturing an electronic component according to the embodiment of the present invention, and is equivalent to the cross-sectional view along the line A-A of FIG. 2 . FIG. 20 is a perspective view showing a fourth variant of the substrate peeling jig used in the peeling step in the method for manufacturing a glass article according to the embodiment of the present invention.

1:玻璃積層體 1: Glass laminate

1a:角部 1a: Corner

1b:邊 1b: Edge

1c:邊 1c: Edge

2:夾具 2: Clamp

2a:角部 2a: Corner

2b:邊 2b: Edge

2c:邊 2c: Edge

2d:邊 2d:edge

2e:邊 2e: Edge

2f:上表面(引導面) 2f: Upper surface (guiding surface)

4:玻璃膜 4: Glass film

5:刀 5: Knife

5a:刀尖 5a: Knife tip

A-A:線 A-A: Line

a:箭頭 a:arrow

F:作業面 F: Work surface

X:界面 X: Interface

Claims (13)

一種玻璃物品的製造方法,其特徵在於,包括剝離步驟,所述剝離步驟是自於下層側的基板上貼附有所述上層側的基板且所述兩基板的至少一者由玻璃形成的積層體剝離上層側的基板時,將刀插入至所述兩基板之間的界面而生成剝離始點部,所述玻璃物品的製造方法中, 於所述剝離步驟中,使用具有引導所述刀的移動的引導面的夾具,使所述刀於與所述引導面接觸的狀態下朝向所述界面移動。 A method for manufacturing a glass article, characterized in that it includes a peeling step, wherein when peeling the upper substrate from a laminated body in which the upper substrate is attached to the lower substrate and at least one of the two substrates is formed of glass, a knife is inserted into the interface between the two substrates to generate a peeling starting point. In the method for manufacturing the glass article, in the peeling step, a fixture having a guide surface for guiding the movement of the knife is used, so that the knife moves toward the interface in a state of contact with the guide surface. 如請求項1所述的玻璃物品的製造方法,其中將所述積層體與所述夾具配置成於所述刀的刀尖到達所述界面時,所述刀成為與所述引導面接觸的狀態。The method for manufacturing a glass article as described in claim 1, wherein the laminate and the fixture are configured so that when the tip of the knife reaches the interface, the knife is in contact with the guide surface. 如請求項1或2所述的玻璃物品的製造方法,其中於所述兩基板之間介隔存在有厚度未滿1 μm的膜。The method for manufacturing a glass article as described in claim 1 or 2, wherein a film having a thickness of less than 1 μm is interposed between the two substrates. 如請求項1或2所述的玻璃物品的製造方法,其中所述積層體的所述兩基板於整周上不相互伸出。A method for manufacturing a glass article as described in claim 1 or 2, wherein the two substrates of the laminate do not extend from each other over the entire circumference. 如請求項1或2所述的玻璃物品的製造方法,其中所述夾具的引導面的高度位置與所述界面的高度位置實質上相同或比其低,所述兩者的高低差比所述刀的厚度小。A method for manufacturing a glass article as described in claim 1 or 2, wherein the height position of the guide surface of the clamp is substantially the same as or lower than the height position of the interface, and the height difference between the two is smaller than the thickness of the knife. 如請求項1或2所述的玻璃物品的製造方法,其中所述夾具與所述積層體於水平方向上的間隙的長度比所述刀的沿著移動方向的長度短。A method for manufacturing a glass article as described in claim 1 or 2, wherein the length of the gap between the clamp and the laminate in the horizontal direction is shorter than the length of the knife along the moving direction. 如請求項1或2所述的玻璃物品的製造方法,其中所述夾具保持為能夠進行上下方向的位置調整。A method for manufacturing a glass article as described in claim 1 or 2, wherein the clamp is held so as to be able to be adjusted in the vertical direction. 如請求項1或2所述的玻璃物品的製造方法,其中所述夾具保持為能夠進行水平方向的位置調整。A method for manufacturing a glass article as described in claim 1 or 2, wherein the clamp is maintained so as to be able to adjust its position in the horizontal direction. 如請求項1或2所述的玻璃物品的製造方法,其中所述夾具保持為能夠進行水平面內的角度調整。A method for manufacturing a glass article as described in claim 1 or 2, wherein the clamp is maintained so as to be able to adjust the angle within a horizontal plane. 如請求項1或2所述的玻璃物品的製造方法,其中所述夾具形成為沿著所述下層側的基板的交叉的兩邊。A method for manufacturing a glass article as described in claim 1 or 2, wherein the clamp is formed along two intersecting sides of the substrate on the lower layer side. 如請求項1或2所述的玻璃物品的製造方法,其中於執行所述剝離步驟之前,進行如下準備步驟,即,藉由於下層側的原基板上貼附上層側的原基板且於所述上層側的原基板上實施處理而獲得原積層體,將所述原積層體切斷為多個,藉此獲得所述下層側的原基板成為所述下層側的基板且所述上層側的原基板成為所述上層側的基板的所述積層體。A method for manufacturing a glass article as described in claim 1 or 2, wherein before executing the peeling step, the following preparation step is performed, namely, an original laminate is obtained by attaching an original substrate on the upper side to an original substrate on the lower side and performing a process on the original substrate on the upper side, and the original laminate is cut into multiple pieces to obtain the laminate in which the original substrate on the lower side becomes the substrate on the lower side and the original substrate on the upper side becomes the substrate on the upper side. 一種電子元件的製造方法,其特徵在於包括: 準備步驟,於下層側的原基板上貼附上層側的原玻璃基板後,製作包含所述原玻璃基板的原電子元件材料,藉此獲得原積層體; 切斷步驟,藉由將所述原積層體切斷為多個,獲得所述原基板成為基板且所述原電子元件材料成為電子元件材料的多個積層體;以及 剝離步驟,於自所述積層體剝離所述電子元件材料時,將刀插入至所述基板與所述電子元件材料之間的界面而生成剝離始點部, 於所述剝離步驟中,使用具有引導所述刀的移動的引導面的夾具,使所述刀於與所述引導面接觸的狀態下朝向所述界面移動。 A method for manufacturing an electronic component, characterized in that it includes: a preparation step, after attaching an original glass substrate on the upper layer side to an original substrate on the lower layer side, preparing an original electronic component material including the original glass substrate, thereby obtaining an original laminate; a cutting step, by cutting the original laminate into multiple pieces, obtaining multiple laminates in which the original substrate becomes a substrate and the original electronic component material becomes an electronic component material; and a peeling step, when peeling the electronic component material from the laminate, inserting a knife into the interface between the substrate and the electronic component material to generate a peeling starting point, In the stripping step, a fixture having a guide surface for guiding the movement of the knife is used, so that the knife moves toward the interface while in contact with the guide surface. 一種基板剝離用夾具,其特徵在於,於將刀插入至在下層側的基板上貼附上層側的基板而成的積層體的所述兩基板之間的界面而生成剝離始點部時使用, 所述基板剝離用夾具具有引導面,所述引導面與所述刀接觸且引導所述刀朝向所述界面移動。 A substrate stripping jig is characterized in that it is used when a knife is inserted into the interface between the two substrates of a laminated body formed by attaching an upper substrate to a lower substrate to generate a stripping starting point. The substrate stripping jig has a guide surface that contacts the knife and guides the knife to move toward the interface.
TW112133955A 2022-09-14 2023-09-07 Method for manufacturing glass articles, method for manufacturing electronic components, and jig for substrate peeling TW202413292A (en)

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