JP4985996B2 - Scribing apparatus, and substrate cutting apparatus and method using the same - Google Patents

Description

  The present invention relates to an apparatus and method used for manufacturing a flat panel display panel, and more particularly, a scribing apparatus that forms a scribe line on a mother board on which a plurality of unit boards are formed, and a mother board is cut using the scribing apparatus. The present invention relates to an apparatus and a method.

  Recently, information processing devices are rapidly developing to have various forms of functions and faster information processing speeds. Such an information processing device has a display for displaying information on operation. Conventionally, a cathode ray tube monitor has been mainly used as a display. Recently, a thin and thin space thin film transistor-liquid crystal display (ThinFilmTransistor-Liquid Crystal Display Panel) or an organic diode display (Organic Light Emitting Spatio display panel) is used. Use is increasing.

  In general, a panel used for a flat panel display or the like is usually manufactured by using a brittle substrate, and the panel is roughly divided into a single plate substrate constituted by one piece and a bonded substrate obtained by joining two substrates. The

Bonded substrates are processed and used in a variety of sizes, from small ones such as panels for mobile phone liquid crystal displays to large ones such as panels for televisions and displays. It is cut into unit substrates of a predetermined size and used as each panel.
As a method of cutting the mother substrate, there are a method of cutting using a laser beam, and a method of cutting using a scribe wheel (Scribe Wheel) in which fine diamonds are fitted.

  A method of cutting a mother substrate using a laser beam includes a scribing step of forming a scribe line by irradiating a scribe laser beam along a planned cutting line of the mother substrate, and quenching the heated scribe line, and a scribe line A break process of cutting a mother substrate into unit substrates by irradiating a laser beam for break along

  A method of cutting a mother substrate using a scribe wheel includes a scribing step of forming a scribe line (ScribeLine) having a predetermined depth along the planned cutting line after contacting the scribe wheel with the planned cutting line of the mother substrate. The method includes a breaking process of cutting the mother substrate into unit substrates by applying a physical impact to the mother substrate so that cracks propagate along the scribe lines.

An object of the present invention is to form a scribe line on one of the upper and lower surfaces of the mother substrate and maintain a scribe line on the other surface in order while maintaining the orientation of the upper and lower surfaces of the mother substrate. An apparatus, and a substrate cutting apparatus and method using the apparatus.
The object of the present invention is not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

  In order to achieve the above object, a scribing apparatus according to the present invention is an apparatus for performing a scribing process for separating a mother substrate on which a plurality of unit substrates are formed into unit substrates. A first scribe portion that forms a scribe line on one surface, and a scribe line that is formed on the other surface of the mother substrate transferred from the first scribe portion in a state in which the orientation of the upper surface and the lower surface is maintained. It includes 2 scribe parts.

  In the scribing apparatus according to the present invention having the above-described configuration, the first scribe unit includes a first support member that supports a lower surface of the mother substrate and a first scribe unit that forms a scribe line on the upper surface of the mother substrate. The second scribe part may include a second support member that supports the upper surface of the mother substrate and a second scribe unit that forms a scribe line on the lower surface of the mother substrate.

  The first scribe portion includes a first support member that supports an upper surface of the mother substrate and a first scribe unit that forms a scribe line on the lower surface of the mother substrate, and the second scribe portion includes the mother scriber. A second support member that supports the lower surface of the substrate and a second scribe unit that forms a scribe line on the upper surface of the mother substrate may be included.

  The mother substrate may be a flat panel display substrate.

  The flat panel display substrate may be a thin film transistor-liquid crystal display (TFT-LCD) panel in which a color filter substrate and a thin film transistor substrate are vertically stacked.

  In order to achieve the above object, a substrate cutting apparatus according to the present invention includes a load unit on which a mother substrate having a plurality of unit substrates is loaded, and an upper surface and a lower surface of the mother substrate transmitted from the load unit. A scribe line is formed on the other surface of the mother substrate transferred from the first scribe portion in a state where the orientation of the upper surface and the lower surface is maintained while the first scribe portion forms a scribe line on any one surface. A second scribe unit; a break unit that separates the mother substrate into unit substrates along a scribe line generated on the mother substrate; and an unload unit that unloads the separated unit substrates. Features.

  In the substrate cutting apparatus according to the present invention having the above-described configuration, the first scribe unit includes a first support member that supports a lower surface of the mother substrate, and a first scribe unit that forms a scribe line on the upper surface of the mother substrate. The second scribe part may include a second support member that supports the upper surface of the mother substrate and a second scribe unit that forms a scribe line on the lower surface of the mother substrate.

  The first scribe portion includes a first support member that supports an upper surface of the mother substrate and a first scribe unit that forms a scribe line on the lower surface of the mother substrate, and the second scribe portion is the mother substrate. A second support member that supports a lower surface of the first substrate, and a second scribe unit that forms a scribe line on the upper surface of the mother substrate.

  In order to achieve the above object, a substrate cutting method according to the present invention is a method of separating a mother substrate on which a unit substrate is formed into unit substrates, wherein a scribe line is formed on one of an upper surface and a lower surface of the mother substrate. A scribe line is formed on the other surface of the mother substrate while maintaining the orientation of the upper surface and the lower surface of the mother substrate.

  In the substrate cutting method according to the present invention having the above-described configuration, a scribe line is formed on the upper surface of the mother substrate while the lower surface of the mother substrate is supported, and the upper surface of the mother substrate on which the scribe line is formed is formed. A scribe line can be formed on the lower surface of the mother substrate in a state of being supported by suction.

  A scribe line is formed on the lower surface of the mother substrate with the upper surface of the mother substrate being sucked and supported, and a scribe line is formed on the upper surface of the mother substrate in a state of supporting the lower surface of the mother substrate on which the scribe line is formed. Can be formed.

  In order to achieve the above object, the scribing apparatus according to the present invention is a device for performing a scribing process for separating a mother substrate on which a plurality of unit substrates are formed into unit substrates, and among the upper and lower surfaces of the mother substrate, A first scribe part that forms a scribe line on any one surface, and a second scribe line that is disposed adjacent to the first scribe part and forms a scribe line on a different surface of the mother substrate transferred from the first scribe part. And a scribe portion.

  In the scribing apparatus according to the present invention having the above-described configuration, the first scribe portion supports a lower surface of the mother board and is capable of linear movement in a first direction, and the first support member. A first scribe unit provided on an upper part of a movement path of the member and forming a scribe line on an upper surface of the mother substrate.

  The second scribe unit includes a second scribe unit provided behind the first scribe unit along the first direction, and a straight line along the first direction from the top of the first and second scribe units. A second support member that is movable and moves up and down along a direction perpendicular to the first direction to adsorb the upper surface of the mother substrate placed on the first support member, and the second support member The scribe unit may form a scribe line on the lower surface of the mother substrate adsorbed by the second support member.

  The scribe wheel of the first scribe unit is aligned downward to face the upper surface of the mother board, and the scribe wheel of the second scribe unit is aligned upward to face the lower surface of the mother board. Can.

The second support member includes: a suction plate having a plurality of suction holes formed on a surface so as to suck the mother substrate; and a drive device that linearly moves the suction plate in the vertical direction and the first direction. Can be included.
The first scribe portion is provided at a lower portion of the first support member that adsorbs an upper surface of the mother substrate and is linearly movable in a first direction, and a lower movement path of the first support member. A first scribe unit that forms a scribe line.

  The second scribe unit is located behind the first scribe unit, and the mother board is transmitted from the first support member to support the lower surface of the mother board, and is linearly movable in the first direction. A second support member; and a second scribe unit provided on an upper part of a movement path of the second support member and forming a scribe line on an upper surface of the mother substrate.

  According to the present invention, it is possible to form a scribe line on either one of the upper and lower surfaces of the mother substrate while maintaining the orientation of the upper and lower surfaces of the mother substrate and sequentially form the scribe lines on the other surface.

  And according to this invention, since a scribe process can be advanced without inverting a board | substrate, process time can be shortened and productivity of the whole process can be improved.

  Further, according to the present invention, the equipment associated with the inversion of the substrate is omitted, whereby the equipment layout can be simplified and the equipment cost can be reduced.

It is a figure which shows an example of a motherboard. It is a figure which shows roughly the structure of the board | substrate cutting device by this invention. It is a figure which shows schematically the structure of the 1st and 2nd scribe part of FIG. FIG. 4 is a perspective view of a first scribe part of FIG. 3. It is a top view of the 1st scribe part of FIG. It is a side view of the supporting member of FIG. FIG. 5 is an enlarged view of a portion “A” in FIG. 4. It is sectional drawing which shows the coupling | bonding relationship between the bracket of FIG. 7, and a lead screw. It is sectional drawing which shows the coupling | bonding relationship between the bracket of FIG. 7, and a lead screw. It is a perspective view of the scriber of FIG. It is a fragmentary sectional view of the lower end part of the scriber of FIG. It is a top view of the scribe wheel of FIG. It is a figure which shows the process in which a scribe line is formed on a mother board | substrate using the 1st scribe part by this invention. It is a figure which shows the process in which a scribe line is formed on a mother board | substrate using the 1st scribe part by this invention. It is a figure which shows the process in which a scribe line is formed on a mother board | substrate using the 1st scribe part by this invention. It is a figure which shows the process in which a scribe line is formed on a mother board | substrate using the 1st scribe part by this invention. It is a figure which shows the process in which a scribe line is formed on a mother board | substrate using the 1st scribe part by this invention. It is a figure which shows the process in which a scribe line is formed on a mother board | substrate using the 1st scribe part by this invention. It is a figure which shows the process in which a scribe line is formed on a mother board | substrate using the 1st scribe part by this invention. It is a figure which shows the process in which a scribe line is formed on a mother board | substrate using the 1st scribe part by this invention. It is a figure which shows the process in which a scribe line is formed on a mother board | substrate using the 1st scribe part by this invention. It is a figure which shows the process in which a scribe line is formed on a mother board | substrate using the 1st scribe part by this invention. It is a figure which shows the process in which a scribe line is formed on a mother board | substrate using the 1st scribe part by this invention. It is a perspective view of the 2nd scribe part of FIG. It is an enlarged view of "C" part of FIG.

  Hereinafter, a scribing apparatus according to a preferred embodiment of the present invention and a substrate cutting apparatus and method using the scribing apparatus will be described in detail with reference to the accompanying drawings. First, it should be noted that the same reference numerals are given to the same constituent elements as much as possible even if they are displayed on different drawings. In the description of the present invention, if it is determined that a specific description of a related known configuration or function departs from the gist of the present invention, a detailed description thereof will be omitted.

  FIG. 1 is a diagram illustrating an example of a mother board.

  As shown in FIG. 1, a mother substrate 1 is a thin film transistor-liquid crystal display (TFT-LCD) panel for thin film transistor-liquid crystal display (TFT-LCD). The mother board 1 includes a first mother board 2 and a second mother board 3 having a substantially square plate shape. The first mother board 2 and the second mother board 3 are stacked one above the other. A plurality of unit substrates 2a and 3a are formed on the first and second mother substrates 2 and 3, and the unit substrates 2a and 3a are arranged in a grid pattern on the planes of the first and second mother substrates 2 and 3. The The first mother substrate 2 is a substrate on which a thin film transistor substrate is formed, and the second mother substrate 3 is a substrate on which a color filter substrate is formed. On the other hand, the mother board 1 is an organic light emitting diode (OLED) display panel, which is a kind of flat panel display panel.

  FIG. 2 is a drawing schematically showing a configuration of the substrate cutting apparatus 10 according to the present invention.

  As shown in FIG. 2, the substrate cutting apparatus 10 is for cutting a mother substrate (reference numeral 1 in FIG. 1) into a plurality of unit substrates, and includes a load unit 11, a first scribe unit 12, 2 scribe part 13, break part 14, and unload part 15. The load unit 11, the first scribe unit 12, the second scribe unit 13, the break unit 14, and the unload unit 15 can be sequentially arranged in a line. However, the arrangement structure of the substrate cutting apparatus 10 according to the present invention is not limited to this, and has various arrangement structures such as a U-shaped arrangement structure.

  The mother board 1 is carried into the board cutting device 10 via the load part 11, the first scribe part 12 forms a scribe line on the first mother board 2, and the second scribe part 13 is a second mother part. A scribe line is formed on the substrate 3. The break unit 14 separates the unit substrate from the mother substrate 1 by applying a force to a scribe line portion formed on the mother substrate 1 using a break bar (BreakBar, not shown), and the separated substrate is unloaded. It is carried out of the substrate cutting apparatus 10 through the part 15.

  FIG. 3 is a diagram schematically showing the configuration of the first and second scribe units of FIG.

  As shown in FIG. 3, the first scribe unit 12 includes a support member (first support member) 100 that supports the mother substrate 1, a scribe unit (first scribe unit) 200 that forms a scribe line, and a scribe unit 200. A moving unit 300 to be moved is included. The mother board 1 is supported in a state where the lower second mother board 3 is placed on the support member 100, and the scribe unit 200 is an upper layer of the mother board 1 placed on the support member 100, that is, the first mother board 1. A scribe line is formed on the substrate 2. The moving unit 300 linearly moves the scribe unit 200 along the planned cutting line on the first mother substrate 2 during the scribe process.

  The second scribe unit 13 includes a substrate transfer member (second support member) 100 ′, a scribe unit (second scribe unit) 200 ′, and a moving unit 300. The substrate transfer member 100 ′ transfers the mother substrate 1 from the first scribe unit 12 to the second scribe unit 13 with the second mother substrate 3 facing downward, and the scribe process proceeds in the second scribe unit 13. While being done, the mother board 1 is supported. The substrate transfer member 100 ′ supports the mother substrate 1 by adsorbing the upper layer of the mother substrate 1, that is, the first mother substrate 2. The scribing unit 200 ′ and the moving unit 300 are disposed under the substrate transfer member 100 ′. The scribe unit 200 ′ forms a scribe line on the lower layer of the mother substrate 1 supported by the substrate transfer member 100 ′, that is, on the second mother substrate 3. The moving unit 300 linearly moves the scribe unit 200 ′ along the planned cutting line on the second mother substrate 3 during the scribe process.

  With such a configuration, the substrate cutting apparatus 10 according to the present invention forms a scribe line on the upper layer of the mother substrate 1, that is, the first mother substrate 2, and the upper and lower surfaces of the mother substrate 1 without inverting the mother substrate 1. The scribe lines can be sequentially formed on the lower layer of the mother substrate 1, that is, on the second mother substrate 3 in a state where the directivity is maintained.

  In the conventional substrate cutting apparatus, after a scribe line is formed on one surface of the mother substrate, the substrate is turned over to form a scribe line on the other surface of the mother substrate. For this reason, there has been a problem that the layout of the apparatus becomes complicated, the equipment cost increases, and the process time becomes longer in connection with the inversion of the substrate. However, the present invention has advantages such that the configuration of the apparatus can be simplified and the process time can be shortened because the scribing process can be sequentially performed on both sides of the mother board without inverting the mother board.

  Hereinafter, the configuration of the first and second scribe units 12 and 13 will be described in more detail. First, the first scribe unit 12 will be described, and then the second scribe unit 13 will be described.

  4 is a perspective view of the first scribe portion of FIG. 3, FIG. 5 is a plan view of the first scribe portion of FIG. 4, and FIG. 6 is a side view of the support member of FIG. 7 is an enlarged view of a portion “A” in FIG. 4, and FIGS. 8A and 8B are cross-sectional views showing a coupling relationship between the bracket and the lead screw in FIG. 7.

  Hereinafter, the first direction I is a linear movement direction of the support member 100 described later, and the second direction II is a direction perpendicular to the first direction I on the planar arrangement structure of the first scribe portion 12, The direction III is a direction perpendicular to the first direction I and the second direction II. The first direction I and the second direction II correspond to any one of the arrangement directions of the unit substrates 2a and 3a arranged in a lattice pattern on the mother substrate 1, respectively.

  As shown in FIGS. 4 to 8B, the first scribe unit 12 includes a support member 100, a scribe unit 200 (200a-1, 200a-2, 200b), and a moving unit 300 (300a, 300b). The support member 100 supports the mother board 1 and linearly moves the mother board 1 along the first direction I. The scribe unit 200 is in contact with the first mother substrate 2 of the mother substrate 1 placed on the support member 100 to form a first direction I scribe line and a second direction II scribe line. The moving unit 300 moves the scribe unit 200 linearly in the second direction II.

  The moving unit 300a adjusts the interval between the scribe units 200a-1 and 200a-2 by moving the scribe units 200a-1 and 200a-2 in the second direction II. By adjusting the interval between the scribe units 200a-1 and 200a-2, the interval between the first direction I scribe lines is adjusted. When the first direction I scribe line is formed, the scribe units 200a-1 and 200a-2 are fixed, and the mother board 1 is moved in the first direction I.

  The moving unit 300b linearly moves the scribe unit 200b in the second direction II. At the time of forming the second direction II scribe line, the mother board 1 is fixed, and the scribe unit 200b is linearly moved in the second direction II by the moving unit 300b. The interval between the second direction II scribe lines is adjusted by moving the mother substrate 1 in the first direction I.

  The support member 100 includes a table 120 and a drive unit 140. The mother board 1 is placed on the table 120. The drive unit 140 linearly moves the table 120 in the first direction I.

  The table 120 has an upper plate 122 and a lower plate 124. The upper plate 122 and the lower plate 124 have a substantially rectangular shape, and the upper plate 122 is positioned above the lower plate 124. The mother board 1 is placed on the upper plate 122. The upper plate 122 is the same as the mother board 1 or has an area larger than that. A plurality of holes (not shown) connected to a vacuum line (not shown) are formed on the upper surface of the upper plate 122, and the mother board 1 is fixed to the upper plate 122 by vacuum pressure. The upper plate 122 or the lower plate 124 is additionally provided with a clamp (not shown) that fixes the mother board 1 to the upper plate 122.

  The drive unit 140 linearly moves the table 120 in the first direction I. The drive unit 140 includes a guide 142, a bracket 144, and a drive machine (not shown). The guide 142 is provided with a long shape along the first direction I, and is attached to the center on the base B. The guide 142 has the same width along the length direction. The upper surface of the guide 142 is provided in a flat shape, and each of both side surfaces of the guide 142 is provided with a groove 141 having a long shape along the length direction.

  The table 120 is coupled to the guide 142 by a bracket 144. The bracket 144 includes a bottom plate 145, a support plate 147, and a coupling plate 149. The bottom plate 145 has a flat rectangular shape and is located on the guide 142. The support plate 147 is fixed vertically to the upper surface of the bottom plate 145 and is fixedly coupled to the lower plate 124 of the table 120 so as to support the table 120. Two support plates 147 are provided and are arranged in parallel on both sides of the upper surface of the bottom plate 145. The coupling plate 149 includes a side plate 149a that is vertically coupled to the bottom surface of the bottom plate 145, and an insertion plate 149b that extends vertically from the lower end of the side plate 149a. The insertion plate 149 b is inserted into a groove 141 formed on the side surface of the guide 142. Two coupling plates 149 are provided to face each other.

  The driving machine provides driving force so that the table 120 is guided by the guide 142 and moves linearly in the first direction I. An assembly including a motor and a screw is used as a driving machine. Optionally, an assembly composed of a combination of a motor, a belt and a pulley, or an assembly including a linear motor is used as a driving machine. The specific configurations of the various assemblies described above are well known to those skilled in the relevant art, and a detailed description thereof will be omitted.

  The scribe unit 200 includes first direction scribe units 200a-1 and 200a-2 and a second direction scribe unit 200b. The first direction scribing units 200 a-1 and 200 a-2 are provided in parallel in the second direction II on the path along which the support member 100 moves, and the second direction scribing unit 200 b is first along the first direction I. Provided on one side of directional scribing units 200a-1, 200a-2. The first direction scribe units 200a-1 and 200a-2 form a scribe line in the first direction I on the mother board 1, and the second direction scribe unit 200b is a scribe line in the second direction II on the mother board 1. Form.

  In the present embodiment, a case where two scribe units 200a-1 and 200a-2 are provided as the first direction scribe units 200a-1 and 200a-2 will be described as an example. Of course, scribe units can be arranged. The first direction scribing units 200a-1 and 200a-2 are moved in the second direction II by a first moving unit 300a described later, and the interval is adjusted.

  As shown in FIG. 7, the first direction scribe unit 200a-1 has two scribers 220a-1 and 240a-1 arranged in parallel in the second direction II, and the first direction scribe unit 200a-2 , Two scribers 220a-2 and 240a-2 arranged in parallel in the second direction II, and the second scribe unit 200b includes two scribers 220b and 240b arranged in parallel in the second direction II. Have Since the scribers 220a-1, 240a-1, 220a-2, 240a-2, 220b, and 240b have the same configuration, one scriber 220a-1 will be described below as an example, and the scriber 240a- The description about 1,220a-2, 240a-2, 220b, 240b is omitted.

  9 is a perspective view of the scriber of FIG. 7, FIG. 10 is a partial sectional view of a lower end portion of the scriber of FIG. 9, and FIG. 11 is a plan view of the scribe wheel of FIG.

  As illustrated in FIGS. 9 to 11, the scriber 220 a-1 includes a scribe wheel 222, a support 224, a pressing member 226, and a vibrator 228. The scribe wheel 222 forms a scribe line on the mother board 1 while rotating in contact with the mother board 1 during the scribe process. As the scribe wheel 222, a diamond wheel is used. A circular through hole 222a is formed at the center of the scribe wheel 222, and an edge 222b of the scribe wheel 222 is provided with a sharp shape.

  The scribe wheel 222 is supported by the support body 224. The support body 224 includes a main body 224a and a shaft pin 224b. A groove 225 penetrating the main body 224a in one direction is formed on the lower surface of the main body 224a. The shaft pin 224b has a long rod shape with a circular cross section. The shaft pin 224b is located in the groove 225 in a direction perpendicular to the length direction of the groove 225. Both ends of the shaft pin 224b are fixed to the main body 224a. The shaft pin 224 b passes through a through hole 222 a formed in the scribe wheel 222. When the scribe wheel 222 is supported by the shaft pin 224b, a part of the scribe wheel 222 is located in the groove 225, and the other part protrudes under the support 224.

  The pressing member 226 pressurizes the scribe wheel 222 so that the scribe wheel 222 can press the mother substrate 1 with a predetermined force when the scribe wheel 222 and the mother substrate 1 come into contact with each other. As an example, the pressing member 226 is positioned on the support 224 and presses the scribe wheel 222 by pressing the support 224 downward using air pressure.

  The vibrator 228 applies vibration to the scribe wheel 222 when the scribe process proceeds. The vibrator 228 is mounted inside the main body 224a, and an ultrasonic vibrator is used as the vibrator 228.

  4 to 8B, the moving unit 300 includes a first moving unit 300a and a second moving unit 300b. The first moving unit 300a moves the first direction scribing units 200a-1 and 200a-2 in the second direction II, and the first direction scribing unit 200a-1, Align 200a-2. The second moving unit 300b moves the second direction scribing unit 200b along the planned cutting line in the second direction II on the mother board 1. The linear movement of the first direction scribing units 200a-1 and 200a-2 and the linear movement of the second direction scribing unit 200b are guided by the guide member 370.

  The first moving unit 300a includes a first vertical support base 310a, first brackets 330a-1 and 330a-2, and a first driving member 350. The first vertical support bases 310a are disposed so as to be separated from each other by a certain distance in the second direction II. The first vertical support base 310a is arranged so that the base substrate 1 can pass between the first vertical support bases 310a when the base substrate 1 moves linearly along the first direction I. A guide member 370 is fixed to the upper end of the first vertical support base 310a, and the length direction of the guide member 370 is aligned with the second direction II. The upper and lower surfaces of the guide member 370 are provided with grooves 372 and 374 having a long shape along the length direction.

  The first direction scribe unit 200a-1 is coupled to the guide member 370 by the first bracket 330a-1, and the first direction scribe unit 200a-2 is coupled to the guide member 370 by the first bracket 330a-2. Since the first brackets 330a-1 and 330a-2 have the same structure, only the first bracket 330a-1 will be described below. As shown in FIG. 7, the first bracket 330 a-1 has a support plate 332 and a coupling plate 334. The support plate 332 has a flat rectangular plate shape and is located on one side surface of the guide member 370. The coupling plate 334 includes a side plate 334 a that protrudes perpendicularly to the support plate 332 from above and below the support plate 332, and an insertion plate 334 b that is inserted into a groove 372 formed in the guide member 370.

  The first driving member 350 provides a driving force so that the first brackets 330 a-1 and 330 a-2 move linearly along the guide member 370. The first driving member 350 includes first lead screws 352 and 354 that are arranged to be parallel to the guide member 370. As shown in FIG. 8A, the first bracket 330a-1 is mounted on the first lead screw 352 so as to be linearly movable, and the first bracket 330a-2 is linearly movable on the first lead screw 354. Installed. That is, the first lead screws 352 and 354 are inserted into the first bracket 330a-1, but the first lead screw 352 meshes with the female screw portion 335-1 formed on the bracket 330a-1. The first lead screw 354 is penetrated without being in contact with the hole 336-1 formed in the first bracket 330a-1. Similarly, the first lead screws 352 and 354 are inserted into the first bracket 330a-2, and the first lead screw 352 contacts the hole 336-2 formed in the first bracket 330a-2. The first lead screw 354 meshes with the female screw portion 335-2 formed in the bracket 330a-2, whereas the first lead screw 354 penetrates without being performed.

  The first bracket 330-1 moves linearly when the first lead screw 352 is driven, but the first bracket 330-2 does not move, and the first bracket 330-1 moves when the first lead screw 354 is driven. However, the first bracket 330-2 moves linearly. By such a driving method, the first direction scribe unit 200a-1 connected to the first bracket 330-1 and the first direction scribe unit 200a-2 connected to the first bracket 330-2 are along the second direction II. The distance between the first direction scribing units 200a-1 and 200a-2 is adjusted.

  One end of the first lead screw 352 is connected to a first drive unit 353 that provides a rotational force, and one end of the first lead screw 354 is connected to a first drive unit 355 that provides a rotational force. As the first and second driving machines 353 and 355, a driving machine such as a motor is used. The assembly including the motor and the lead screw has been described as an example of the first driving member 350. However, various other types of linear driving force can be provided to the first brackets 330a-1 and 330a-2, such as a cylinder. A simple driving machine is used.

  As shown in FIG. 7, the first direction scribing unit 200a-1 is mounted on the support plate 332 of the first bracket 330a-1 so that it can move up and down. As an example, the support plate 332 is formed with a slit-shaped guide groove 331 in the third direction III, and the scribers 220a-1 and 240a-1 of the first direction scribe unit 200a-1 are inserted into the guide groove 331. Each is coupled to a shaft (not shown). The first direction scribe unit 200a-2 is also connected to the first bracket 330a-2 so that the first direction scribe unit 200a-2 can move up and down, and the connection structure is the same as the connection structure of the first direction scribe unit 200a-1. Is omitted.

  The second moving unit 300b includes a second vertical support base 310b, a second bracket 330b, and a second driving member 350 '. The second vertical support bases 310b are disposed so as to be separated from each other in the second direction II. The second vertical support base 310b is arranged so that the base substrate 1 can pass between the second vertical support bases 310b when the base substrate 1 moves linearly along the first direction I. The second vertical support base 310b is disposed so that the upper end thereof is fixedly coupled to the guide member 370 fixed to the upper end of the first vertical support base 310a.

  The second direction scribing unit 200b is coupled to the guide member 370 by the second bracket 330b. Since the 2nd bracket 330b has the same structure as the above-mentioned 1st bracket 330a-1, description about this is abbreviate | omitted.

  The second driving member 350 ′ provides a driving force so that the second bracket 330 b moves linearly along the guide member 370. The second drive member 350 ′ has a second lead screw 352 ′ disposed so as to be parallel to the guide member 370. As shown in FIG. 8B, the second bracket 330b is mounted on the second lead screw 352 'so as to be linearly movable. That is, the female screw portion 335 'formed on the second bracket 330b and the second lead screw 352' are engaged with each other. By such a driving method, the second direction scribing unit 200b connected to the second bracket 330b is moved along the second direction II.

  One end of the second lead screw 352 'is connected to a second driver 353' that provides a rotational force. As the second driving machine 353 ', a driving machine such as a motor is used. The second driving member 350 ′ has been described by taking an assembly including a motor and a lead screw as an example, but there are various other driving machines that can provide a linear driving force to the second bracket 330b, such as a cylinder. Used.

  The second direction scribe unit 200b is connected to the second bracket 330b so as to be movable up and down, and the connection structure is the same as the connection structure of the first direction scribe unit 200a-1 described above. Omitted.

  The operations of the first and second moving units 300a and 300b described above are controlled by the control unit 400. The controller 400 controls the operations of the first drive units 353 and 355 of the first movement unit 300a and the second drive unit 353 'of the second movement unit 300b. The first direction scribing units 200a-1 and 200a-2 are moved in the second direction II by the control of the first drivers 353 and 355, and the interval between the first direction scribing units 200a-1 and 200a-2 is adjusted. The Then, the second direction scribe unit 200b can move in the second direction II under the control of the second driver 353 '.

  A process of forming a scribe line on the first mother board 2 of the mother board 1 using the first scribe part 12 according to the present invention having the above-described configuration will be described as follows.

  12A to 12K are views illustrating a process of forming a scribe line on a mother substrate using the first scribe unit according to the present invention.

  The mother board 1 is placed on the upper plate 122 of the table 120 so that the first mother board 2 faces upward. The table 120 is linearly moved in the first direction I by a driver (not shown) (FIG. 12A). When the table 120 moves to a predetermined position (that is, a position where the first planned cutting line a of the first mother board 2 is aligned with the second direction scribing unit 200b), the movement of the table 120 stops (FIG. 12B).

  Thereafter, the second driving unit 353 ′ of the second moving unit 300b is driven in a state where the second direction scribing unit 200b is aligned with the first cutting planned line a of the first mother board 2 along the second direction II. Then, the second direction scribing unit 200b is moved in one direction of the first mother board 2. At this time, one of the scribers 220b and 240b of the scriber 220b and 240b of the second direction scribing unit 200b is moved downward so as to be positioned at a height at which the scriber 220b and 240b can contact the first mother board 2 (FIG. 12C).

  In this state, the second driving unit 353 'of the second moving unit 300b is driven to move the second direction scribing unit 200b across the first mother board 2 along the second direction II. At this time, of the scribers 220 b and 240 b of the second direction scribing unit 200 b, the scriber that contacts the first mother substrate 2 forms a crack on the first mother substrate 2. A scribe line is formed on the first mother substrate 2 by continuously forming cracks along the planned cutting line a. After the scribe line is formed, the scribers 220b and 240b of the second direction scribe unit 200b are moved upward (FIG. 12D).

  The table 120 is linearly moved in the first direction I by a driving machine (not shown). When the table 120 moves to a preset position (that is, a position where the second scheduled cutting line b of the first mother board 2 is aligned with the second direction scribing unit 200b), the movement of the table 120 stops. Then, one of the scribers 220b and 240b of the scriber 220b and 240b of the second direction scribe unit 200b is moved downward so as to be positioned at a height at which the scriber 220b and 240b can contact the first mother board 2 (FIG. 12E).

  Thereafter, the second driving unit 353 'of the second moving unit 300b is driven to move the second direction scribing unit 200b across the first mother board 2 along the second direction II. At this time, of the scribers 220 b and 240 b of the second direction scribing unit 200 b, the scriber that contacts the first mother substrate 2 forms a crack on the first mother substrate 2. A scribe line is formed on the first mother substrate 2 by continuously forming cracks along the planned cutting line b. After the scribe line is formed, the scribers 220b and 240b of the second direction scribe unit 200b are moved upward (FIG. 12F).

  By repeating the process as described above, scribe lines are formed on the first mother board 2 along the remaining cut lines c and d. Thereafter, the table 120 is driven by a driver (not shown). It is linearly moved in one direction I. When the table 120 moves to the preset position, the table 120 stops moving (FIG. 12G).

  Thereafter, the driving units 353 and 355 of the first moving unit 300a are driven to adjust the interval between the first direction scribing units 200a-1 and 200a-2. The first moving unit 300a moves the first direction scribing unit 200a-1 to a preset position (that is, the position where the first direction scribing unit 200a-1 is aligned with the planned cutting line e of the first mother board 2). Then, the first direction scribing unit 200a-2 is moved to a preset position (that is, a position where the first direction scribing unit 200a-2 is aligned with the planned cutting line f of the first mother board 2). At this time, of the scribers 220 a-1 and 240 a-1 of the first direction scribe unit 200 a-1, the scribers 220 a-1 and 240 a-1 are positioned at a height where they can contact the first mother board 2. The scribers 220a-2 and 240a-2 of the scribers 220a-2 and 240a-2 of the first direction scribe unit 200a-2 are positioned at a height at which the scribers 220a-2 and 240a-2 can come into contact with the first mother board 2. (FIG. 12H).

  With the first direction scribing units 200a-1 and 200a-2 aligned with the planned cutting lines e and f of the first mother board 2 along the first direction I, the table 120 is driven by a driving machine (not shown). It is linearly moved in the first direction I. When the table 120 moves to a preset position (that is, a position where a scribe line is formed on the first mother board 2 along the scheduled cutting lines e and f of the first mother board 2), the table 120 moves. Stops (FIG. 12I).

  Thereafter, the driving units 353 and 355 of the first moving unit 300a are driven so that the first direction scribing units 200a-1 and 200a-2 are aligned with the planned cutting lines g and h. , 200a-2 is moved. The first direction scribing unit 200a-1 is moved by the first moving unit 300a to the preset position (that is, the position where the first direction scribing unit 200a-1 is aligned with the planned cutting line g of the first mother board 2). The first direction scribing unit 200a-2 is moved to a preset position (that is, a position where the first direction scribing unit 200a-2 is aligned with the planned cutting line h of the first mother board 2). At this time, of the scribers 220 a-1 and 240 a-1 of the first direction scribe unit 200 a-1, the scribers 220 a-1 and 240 a-1 are positioned at a height where they can contact the first mother board 2. The scribers 220a-2 and 240a-2 of the scribers 220a-2 and 240a-2 of the first direction scribe unit 200a-2 are positioned at a height at which the scribers 220a-2 and 240a-2 can come into contact with the first mother board 2. (FIG. 12J).

  With the first direction scribing units 200a-1 and 200a-2 aligned with the planned cutting lines g and h of the first mother board 2 along the first direction I, the table 120 is driven by a driver (not shown). Move linearly in the first direction I. When the table 120 moves to a preset position (that is, a position where a scribe line is formed on the first mother board 2 along the scheduled cutting lines g and h of the first mother board 2), the table 120 is moved. It stops (FIG. 12K).

  Next, the configuration and operation of the second scribe unit 13 will be described.

  13 is a perspective view of the second scribe portion 13 of FIG. 3, and FIG. 14 is an enlarged view of a portion “C” of FIG. Here, elements having the same configurations as those shown in FIGS. 4 and 7 are denoted by the same reference numerals.

  The second scribe unit 13 includes a substrate transfer member 100 ′, a scribe unit 200 ′, and a moving unit 300.

  The substrate transfer member 100 ′ transfers the mother substrate 1 from the first scribe unit 12 to the second scribe unit 13 with the second mother substrate 3 facing downward, and the second scribe unit 13 performs a scribe process. The mother substrate 1 is supported during the process.

  The substrate transfer member 100 ′ transfers the mother substrate 1 in a state in which a scribe line is formed on the first mother substrate 2 and the second mother substrate 3 faces downward from the first scribe portion 12 to the second scribe portion 13. Transport. The substrate transfer member 100 ′ sucks and supports the first mother substrate 2 while the second scribing unit 13 performs the scribing process on the second mother substrate 3 of the mother substrate 1.

  The substrate transfer member 100 ′ includes a transfer body 110 ′ and a suction plate 120 ′. The transfer body 110 ′ includes a plate-like support plate 112 ′ and a plurality of support bases 114 ′ extending downward from the lower surface of the support plate 112 ′. A suction plate 120 'is coupled to the end of the support base 114'. The suction plate 120 ′ is for sucking and supporting the mother substrate 1, and a plurality of suction holes (not shown) are formed on the lower surface of the suction plate 120 ′ in contact with the mother substrate 1. A vacuum line (not shown) communicating with the suction hole (not shown) is formed inside the suction plate 120 ′. The substrate transfer member 100 ′ can be linearly moved in the first direction I or the third direction III by a driving device (not shown).

  The mother board 1 is sucked and supported on the suction plate 120 ′ of the substrate transfer member 100 ′. At this time, the first mother board 2 is attached to the suction plate 120 so that the second mother board 3 faces downward. It is supported while being in surface contact with '.

  A scribe unit 200 ′ and a moving unit 300 are provided below the substrate transfer member 100 ′. The scribe unit 200 ′ forms a scribe line on the lower layer of the mother substrate 1 supported by the substrate transfer member 100 ′, that is, the second mother substrate 3, and the moving unit 300 moves the second mother substrate during the scribe process. The scribe unit 200 ′ is linearly moved along the planned cutting line 3.

  Since the scribe unit 200 ′ and the moving unit 300 have the same configuration as the scribe unit 200 and the moving unit 300 of the first scribe unit 12, a detailed description thereof will be omitted. However, the scribe units 200 ′: 200′a-1, 200′a-2, 200′b of the second scribe unit 13 are the same as the scribe units 200: 200a-1, 200a-2, 200b of the first scribe unit 12. It is installed to make an inverted statue. That is, the scribe unit 200 ': 200'a-1,200'a-2,200'b has a scribe wheel 222' of the scribe unit 200 ': 200'a-1,200'a-2,200'b. It is installed so as to face the mother board 1 located at the top.

  The scribing process in the second scribe unit 13 having the above-described configuration proceeds in the same order as the scribe process in the first scribe unit 12, and a detailed description thereof can be easily inferred by those skilled in the related art. Therefore, the description about this is abbreviate | omitted here.

  On the other hand, in the above, the first scribe portion 12 forms a scribe line on the upper surface of the mother substrate 1, that is, the first mother substrate 2, and the second scribe portion 13 is formed on the lower surface of the mother substrate 1, that is, the second mother substrate 3. The substrate cutting apparatus configured to form a scribe line has been described as an example. However, the substrate cutting apparatus of the present invention is not limited to this, and in contrast, the first scribe unit 12 is provided on the mother substrate 1. A scribe line may be formed on the lower surface, that is, the second mother substrate 3, and the second scribe portion 13 may be configured to form a scribe line on the upper surface of the mother substrate 1, that is, the first mother substrate 2.

  The substrate cutting apparatus according to the present invention having the configuration described above forms a scribe line on one of the upper and lower surfaces of the mother substrate while maintaining the orientation of the upper surface and the lower surface of the mother substrate. A scribe line can be formed on one side.

  And since the board | substrate cutting device by this invention can advance a scribe process, without reversing a board | substrate, it can shorten process time and can improve the productivity of the whole process.

  Further, the substrate cutting apparatus according to the present invention can simplify the layout of the facility and reduce the facility cost by omitting the facility related to the inversion of the substrate.

  The above description is merely illustrative of the technical idea of the present invention, and a person having ordinary knowledge in the technical field to which the present invention belongs can be used without departing from the essential characteristics of the present invention. Various modifications and variations are possible. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for explanation. The scope of the technical idea of the present invention is limited by such an embodiment. It is not limited. The protection scope of the present invention should be analyzed by the claims, and all technical ideas within the equivalent scope should be analyzed as being included in the scope of the right of the present invention.

1 Mother board
12 First scribe unit 13 Second scribe unit 100 Support member 200 Scribe unit 300 Moving unit 400 Control unit 100 ′ Substrate transfer member 200 ′ Scribe unit

Claims (18)

An apparatus for performing a scribe process for separating a mother substrate on which a plurality of unit substrates are formed into unit substrates,
A first scribe part for forming a scribe line on one of the upper surface and the lower surface of the mother substrate;
A scribing apparatus comprising: a second scribing unit that forms a scribing line on the other surface of the mother substrate transferred from the first scribing unit in a state in which the orientation of the upper surface and the lower surface is maintained. . The first scribe portion includes a first support member that supports a lower surface of the mother substrate, and a first scribe unit that forms a scribe line on the upper surface of the mother substrate,
The second scribe part includes a second support member that supports an upper surface of the mother substrate and a second scribe unit that forms a scribe line on the lower surface of the mother substrate. Scribing device. The first scribe unit includes a first support member that supports an upper surface of the mother substrate, and a first scribe unit that forms a scribe line on the lower surface of the mother substrate.
The second scribe part includes a second support member that supports a lower surface of the mother substrate and a second scribe unit that forms a scribe line on the upper surface of the mother substrate. Scribing device. The scribing apparatus according to claim 1, wherein the mother substrate is a flat panel display substrate. 5. The scribing apparatus according to claim 4, wherein the flat panel display substrate is a thin film transistor-liquid crystal display (TFT-LCD) panel in which a color filter substrate and a thin film transistor substrate are stacked in the vertical direction. A load unit on which a mother board on which a plurality of unit boards are formed is loaded;
A first scribe part for forming a scribe line on one of the upper surface and the lower surface of the mother board transmitted from the load part;
A second scribe part for forming a scribe line on the other surface of the mother substrate transferred from the first scribe part in a state in which the orientation of the upper surface and the lower surface is maintained;
A break part for separating the mother substrate into unit substrates along a scribe line generated on the mother substrate;
An unloading unit for unloading the separated unit substrate. The first scribe portion includes a first support member that supports a lower surface of the mother substrate, and a first scribe unit that forms a scribe line on the upper surface of the mother substrate,
The second scribe portion includes a second support member that supports an upper surface of the mother substrate and a second scribe unit that forms a scribe line on the lower surface of the mother substrate. Board cutting equipment. The first scribe unit includes a first support member that supports an upper surface of the mother substrate, and a first scribe unit that forms a scribe line on the lower surface of the mother substrate.
The second scribe portion includes a second support member that supports a lower surface of the mother substrate and a second scribe unit that forms a scribe line on the upper surface of the mother substrate. Board cutting equipment. A method of separating a mother substrate on which a unit substrate is formed into unit substrates,
A scribe line is formed on one of the upper surface and the lower surface of the mother substrate,
A substrate cutting method, wherein a scribe line is formed on the other surface of the mother substrate while maintaining the orientation of the upper surface and the lower surface of the mother substrate. In a state where the lower surface of the mother substrate is supported, a scribe line is formed on the upper surface of the mother substrate,
The substrate cutting method according to claim 9, wherein the scribe line is formed on the lower surface of the mother substrate in a state where the upper surface of the mother substrate on which the scribe line is formed is sucked and supported. With the upper surface of the mother substrate being sucked and supported, a scribe line is formed on the lower surface of the mother substrate,
The substrate cutting method according to claim 9, wherein the scribe line is formed on the upper surface of the mother substrate in a state where the lower surface of the mother substrate on which the scribe line is formed is supported. In an apparatus for performing a scribe process for separating a mother substrate on which a plurality of unit substrates are formed into unit substrates,
A first scribe part for forming a scribe line on one of the upper surface and the lower surface of the mother substrate;
And a second scribe unit that is disposed adjacent to the first scribe unit and forms a scribe line on a different surface of the mother substrate transferred from the first scribe unit. The first scribe unit is
A first support member that supports the lower surface of the mother substrate and is capable of linear movement in a first direction;
The scribing apparatus according to claim 12, further comprising: a first scribing unit provided on a moving path of the first support member and forming a scribing line on an upper surface of the mother substrate. The second scribe unit is
A second scribe unit provided behind the first scribe unit along the first direction;
The linear movement is possible along the first direction from the upper part of the first and second scribe units, and the vertical movement is performed along a direction perpendicular to the first direction, and the first scribe unit is placed on the first support member. A second support member that adsorbs the upper surface of the mother substrate,
The scriber according to claim 13, wherein the second scribe unit forms a scribe line on a lower surface of the mother substrate adsorbed by the second support member. The scribe wheel of the first scribe unit is aligned downward to face the upper surface of the mother board, and the scribe wheel of the second scribe unit is aligned upward to face the lower surface of the mother board. The scribing apparatus according to claim 14. The second support member is
A suction plate having a plurality of suction holes formed on the surface so as to suck the mother substrate;
The scribing device according to claim 14, further comprising: a driving device that linearly moves the suction plate in the vertical direction and the first direction. The first scribe unit is
A first support member that adsorbs an upper surface of the mother substrate and is linearly movable in a first direction;
The scribing apparatus according to claim 12, further comprising: a first scribing unit provided at a lower part of the moving path of the first support member and forming a scribe line on a lower surface of the mother board. The second scribe unit is
A second support member located behind the first scribe unit, wherein the mother board is transmitted from the first support member to support the lower surface of the mother board, and is linearly movable in the first direction;
The scribing apparatus according to claim 17, further comprising: a second scribing unit provided at an upper part of a movement path of the second support member and forming a scribe line on an upper surface of the mother substrate.

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