JP2019196281A - Substrate dividing device - Google Patents

Substrate dividing device Download PDF

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Publication number
JP2019196281A
JP2019196281A JP2018090464A JP2018090464A JP2019196281A JP 2019196281 A JP2019196281 A JP 2019196281A JP 2018090464 A JP2018090464 A JP 2018090464A JP 2018090464 A JP2018090464 A JP 2018090464A JP 2019196281 A JP2019196281 A JP 2019196281A
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substrate
tilting
tilting table
guide rail
fixed table
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Inventor
酒井　敏行
Toshiyuki Sakai
敏行 酒井
成尾　徹
Toru Naruo
徹 成尾
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Priority to JP2018090464A priority Critical patent/JP2019196281A/en
Priority to TW108112250A priority patent/TW201947644A/en
Priority to KR1020190042534A priority patent/KR20190128990A/en
Priority to CN201910323633.9A priority patent/CN110466075A/en
Publication of JP2019196281A publication Critical patent/JP2019196281A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Materials Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

To provide a substrate dividing device including a tilt table allowing division corresponding to various substrates.SOLUTION: A substrate dividing device having substrate holding surfaces 1a and 2a holding a substrate W consists of a fixed table 1 and a tilt table 2 adjacent to each other at an interval so that the substrate holding surfaces 1a and 2a form the same horizontal plane. The tilt table 2 comprises: a tilt mechanism for tilting the tilt table 2 using a rotation shaft 3 formed in one end portion adjacent to the fixed table 1 as a fulcrum; a horizontal movement mechanism for moving the tilt table 2 so as to separate the fixed table 1 in the horizontal direction from the fixed table; and a lifting mechanism for lifting the tilt table 2.SELECTED DRAWING: Figure 1

Description

本発明は、脆性材料からなる基板の基板分断装置に関する。特に本発明は、基板上に形成した複数条のスクライブライン（スクライブ溝）に沿って短冊状あるいは格子状に基板を分断する基板分断装置に関する。   The present invention relates to a substrate cutting apparatus for a substrate made of a brittle material. In particular, the present invention relates to a substrate cutting apparatus for cutting a substrate into strips or grids along a plurality of scribe lines (scribe grooves) formed on the substrate.

一般に、マザー基板から単位基板を切り出す工程では、カッターホイールやレーザ光を用いた分断方法が利用される。この場合、マザー基板の分断予定位置にカッターホイールやレーザ光で互いに交差するスクライブラインを格子状に加工し、この後、分断装置によりスクライブラインに沿って基板を分断して単位基板を切り出す。   Generally, in the process of cutting out a unit substrate from a mother substrate, a cutting method using a cutter wheel or laser light is used. In this case, scribe lines intersecting each other with a cutter wheel or laser light are processed into a lattice shape at a planned division position of the mother substrate, and then the substrate is divided along the scribe lines by a cutting device to cut out a unit substrate.

基板を分断する手段としては、特許文献１、２に示すように、スクライブラインを形成した反対側の面からブレイクバーを押しつけて基板を撓ませることにより分断する方法や、特許文献３、４に示すように、傾動テーブルにより基板を曲げてスクライブラインに沿って分断する方法がある。   As a means for dividing the substrate, as shown in Patent Documents 1 and 2, a method of dividing the substrate by pressing the break bar from the opposite surface on which the scribe line is formed and bending the substrate, Patent Documents 3 and 4 As shown, there is a method in which a substrate is bent by a tilting table and divided along a scribe line.

傾動テーブルを用いた分断方法は、基板を吸着保持する固定テーブルと傾動テーブルとが隙間をあけて隣接して設けられ、傾動テーブルが固定テーブル側に寄った端部下面で回動軸を介して下方に傾動するように形成されている。そして、固定テーブルと傾動テーブルとの隙間にスクライブラインを位置させた状態で両テーブルの上面に基板を吸着保持させて、傾動テーブルを傾斜させることにより基板に曲げモーメントを与えてスクライブラインに沿って分断するようにしている。
この傾動テーブルを用いた分断方法では、テーブルの傾動によって基板に曲げモーメントを与えるとともに、固定テーブルに隣接する傾動テーブルの先端部が、隣接する固定テーブルに対して離れる方向に変位して分断される基板の端面同士が引き離されるので、基板が互いに接触することによる損傷をなくすことができるといったメリットがある。 In the dividing method using the tilting table, the fixed table that holds the substrate by suction and the tilting table are provided adjacent to each other with a gap, and the tilting table is located on the lower surface of the end portion close to the fixed table side via the rotating shaft. It is formed so as to tilt downward. Then, with the scribe line positioned in the gap between the fixed table and the tilting table, the substrate is sucked and held on the upper surface of both tables, and the tilting table is tilted to give a bending moment to the substrate along the scribe line. I try to divide it.
In the dividing method using the tilting table, a bending moment is applied to the substrate by tilting the table, and the tip of the tilting table adjacent to the fixed table is displaced in a direction away from the adjacent fixed table. Since the end surfaces of the substrates are separated from each other, there is an advantage that damage due to the substrates contacting each other can be eliminated.

特開２０１７−１２８１３７号公報JP 2017-128137 A 特開２０１４−０８３８２１号公報Japanese Patent Application Laid-Open No. 2014-082821 特開平４−２８０８２８号公報JP-A-4-280828 特開２０１７−１７７４５３号公報JP 2017-177453 A

通常、分断加工対象基板としては、ガラス、シリコン、アルミナ、セラミックス等のそれぞれ物理的強度の異なる脆性材料で形成された１枚のみの単板や、２枚の基板を貼り合わせた貼り合わせ基板、あるいはガラス基板の両面に異なる材料からなる薄板を貼り合わせた３層構造の積層基板等、多種多様なタイプがあり、それぞれの厚みも、例えばガラス単板では０．１ｍｍから５ｍｍ以上のものがある。したがって、基板のタイプによっては、単に曲げモーメントを加えるだけでは分断できないものがあり、曲げモーメントと同時に引張り力を加えたり、あるいは上下方向に剪断力を加えたりすることが要求される場合がある。   Usually, as a substrate to be cut, only one single plate formed of a brittle material having different physical strength such as glass, silicon, alumina, ceramics, or a bonded substrate obtained by bonding two substrates together, Alternatively, there are various types such as a laminated substrate having a three-layer structure in which thin plates made of different materials are bonded to both surfaces of a glass substrate, and each thickness is, for example, 0.1 mm to 5 mm or more for a single glass plate . Therefore, some types of substrates cannot be divided by simply applying a bending moment, and it may be required to apply a tensile force at the same time as the bending moment or to apply a shearing force in the vertical direction.

しかし、従来の傾動テーブルでは、回動軸を介して単に傾動するだけの構成であるため、上記した多種多様な基板を分断するには限界があった。   However, since the conventional tilting table is simply configured to tilt through the rotating shaft, there is a limit to dividing the various substrates described above.

そこで本発明は、このような従来課題の解決を図り、多種多様な基板に対応して分断することのできる傾動テーブルを備えた基板分断装置を提供することを目的とする。   SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a substrate cutting apparatus including a tilting table that can solve such a conventional problem and can cut a substrate corresponding to various substrates.

上記目的を達成するために本発明では次のような技術的手段を講じた。すなわち、本発明では、脆性材料からなる基板の表面に形成されたスクライブラインに沿って前記基板を分断する基板分断装置であって、それぞれに基板を保持する基板保持面を備え、かつ、これら基板保持面が同一水平面を形成するように間隔をあけて隣接された固定テーブル並びに傾動テーブルとからなり、前記傾動テーブルは、当該傾動テーブルを前記固定テーブルに隣接する一端部に形成された回動軸を支点として傾動させる傾動機構と、前記傾動テーブルを前記固定テーブルから水平方向に離反するように移動させる水平移動機構と、前記傾動テーブルを昇降させる昇降機構とを備えている構成とした。   In order to achieve the above object, the present invention takes the following technical means. That is, in the present invention, a substrate cutting apparatus that divides the substrate along a scribe line formed on the surface of the substrate made of a brittle material, each of which includes a substrate holding surface that holds the substrate, and these substrates The holding table includes a fixed table and a tilting table which are adjacent to each other so as to form the same horizontal plane, and the tilting table has a rotating shaft formed at one end adjacent to the fixed table. A tilting mechanism that tilts around a fulcrum, a horizontal movement mechanism that moves the tilting table away from the fixed table in the horizontal direction, and a lifting mechanism that moves the tilting table up and down.

本発明は上記の構成としたので、基板の分断に際して、傾動テーブルを上方または下方に傾斜させて曲げモーメントを加えて分断したり、傾動テーブルを上方または下方に昇降させて剪断力により分断したり、あるいは、傾動テーブルを傾動させると同時に上下方向または、水平方向に移動させて曲げモーメントと同時に剪断力を加えたり、引張り力を加えたりして分断することができる。これにより、厚みや材料、積層構造の異なる各種タイプの基板に対応して、最も好ましい分断方法を選択して実施することができる。
また、傾動テーブルは水平方向に移動できるように形成されているので、基板分断後に分断された基板を傾動テーブルに載せたまま外部に搬出することができ、これにより、分断された基板を外部に搬出するためのコンベア等の搬出手段を省略することができるといった効果がある。 Since the present invention is configured as described above, when the substrate is divided, the tilting table is tilted upward or downward to bend by adding a bending moment, or the tilting table is lifted or lowered upward or downward to be sheared. Alternatively, it can be divided by tilting the tilting table and moving it vertically or horizontally and applying a shearing force simultaneously with a bending moment or applying a tensile force. Thereby, the most preferable cutting method can be selected and implemented corresponding to various types of substrates having different thicknesses, materials, and laminated structures.
In addition, since the tilting table is formed so as to be movable in the horizontal direction, the substrate that has been divided after the substrate cutting can be carried out while being placed on the tilting table. There is an effect that unloading means such as a conveyor for unloading can be omitted.

本発明において、前記傾動機構は、前記回動軸を介して前記傾動テーブルを回動可能に支持する支持アームと、前記傾動テーブルの他端部下面に連結され、前記回動軸を支点として前記傾動テーブルを上下に揺動させる流体シリンダとから構成するのがよい。
これにより、回動軸を支点として傾動テーブルを上向きまたは下向きの傾斜姿勢に揺動変位させることができる。 In the present invention, the tilt mechanism is connected to a support arm that rotatably supports the tilt table via the rotation shaft, and a lower surface of the other end of the tilt table, and the rotation shaft serves as the fulcrum. Preferably, the tilting table is composed of a fluid cylinder that swings up and down.
As a result, the tilting table can be swung and displaced in an upward or downward inclined posture with the rotation shaft as a fulcrum.

本発明において、前記水平移動機構は、前記支持アーム並びに前記流体シリンダを保持する走行部材と、ガイドレールを介して前記走行部材を水平方向に移動可能に保持する台板とからなり、前記ガイドレールは、前記傾動テーブルが前記固定テーブルから離反する方向に延長して形成され、前記走行部材が駆動機構を介して走行するように形成されている構成とするのがよい。
これにより、走行部材に保持させた傾動テーブルを固定テーブルから引き離す位置に移動させることができる。 In the present invention, the horizontal movement mechanism includes a traveling member that holds the support arm and the fluid cylinder, and a base plate that holds the traveling member so as to be movable in a horizontal direction via a guide rail. The tilting table may be formed to extend in a direction away from the fixed table, and the traveling member may be configured to travel via a drive mechanism.
Thereby, the tilting table held by the traveling member can be moved to a position where the tilting table is pulled away from the fixed table.

本発明において、前記昇降機構は、前記台板を昇降可能に保持する支柱と、前記台板の下面に設けられた滑車と、この滑車を受ける傾斜受け面を備えたスライド部材と、ガイドレールを介して前記スライド部材を水平方向に摺動可能に保持する基盤とからなり、前記ガイドレールは、前記傾動テーブルが前記固定テーブルから離反する方向に延長して形成され、前記傾斜受け面の傾斜方向が前記ガイドレールの方向に沿って形成され、前記スライド部材が駆動機構により摺動するように形成されている構成とするのがよい。
これにより、台板に保持された傾動テーブルを固定テーブルに対して上動または下動させることができる。 In the present invention, the elevating mechanism includes: a column that holds the base plate so that the base plate can be raised and lowered; a pulley provided on a lower surface of the base plate; a slide member that includes an inclined receiving surface that receives the pulley; and a guide rail. And the guide rail is formed by extending the tilting table in a direction away from the fixed table, and the tilting direction of the tilt receiving surface. Is formed along the direction of the guide rail, and the slide member is preferably slid by a drive mechanism.
Thereby, the tilting table held by the base plate can be moved up or down with respect to the fixed table.

本発明の基板分断装置を示す側面図。The side view which shows the board | substrate cutting device of this invention. 図１に示す基板分断装置の背面図。The rear view of the board | substrate cutting apparatus shown in FIG. 本発明における傾動テーブルの傾動状態を示す側面図。The side view which shows the tilting state of the tilting table in this invention. 本発明における傾動テーブルの水平方向への移動状態を示す側面図。The side view which shows the movement state to the horizontal direction of the tilting table in this invention. 本発明における傾動テーブルの昇降状態を示す側面図。The side view which shows the raising / lowering state of the tilting table in this invention. 本発明の基板分断装置における傾動テーブルの動作を示す説明図。Explanatory drawing which shows operation | movement of the tilting table in the board | substrate cutting apparatus of this invention.

以下において、本発明に係る基板分断装置の詳細を図１〜図５で示した実施例に基づき説明する。
本発明に係る基板分断装置は、脆性材料からなる基板Ｗを保持する基板保持面１ａ、２ａを有する固定テーブル１並びに傾動テーブル２を備えている。これら両テーブル１、２は、基板保持面１ａ、２ａが同一水平面を形成するように間隔をあけて隣接して設けられている。基板保持面１ａ、２ａは、本実施例ではテーブル１、２の表面に多数の吸引孔（図示外）を設けて吸引エアにより基板Ｗを吸着保持できるように形成されている。 Details of the substrate cutting apparatus according to the present invention will be described below based on the embodiments shown in FIGS.
The substrate cutting apparatus according to the present invention includes a fixed table 1 and a tilting table 2 having substrate holding surfaces 1a and 2a for holding a substrate W made of a brittle material. These tables 1 and 2 are provided adjacent to each other with an interval so that the substrate holding surfaces 1a and 2a form the same horizontal plane. In this embodiment, the substrate holding surfaces 1a and 2a are formed so that a large number of suction holes (not shown) are provided on the surfaces of the tables 1 and 2 so that the substrate W can be sucked and held by suction air.

傾動テーブル２は、固定テーブル１に隣接する一端側の下面で回動軸３を介して支持アーム４に回動可能に保持されており、他端側はその下面で上下方向に沿って配置された流体シリンダ５のシャフト５ａの先端に枢軸６を介して連結されている。支持アーム４は、その下端部で走行部材７に固定されており、流体シリンダ５も枢軸５ｂを介して変位自在に走行部材７に保持されている。
上記の構成により、傾動テーブル２を傾動させることが可能な傾動機構が形成されている。すなわち、流体シリンダ５を駆動してシャフト５ａを上下動させることにより、回動軸３を支点として傾動テーブル２を揺動させて、図６（ａ）、（ｂ）で示すような上向きまたは下向きの傾斜姿勢にすることができる。 The tilting table 2 is rotatably held on the support arm 4 via the rotation shaft 3 on the lower surface on one end side adjacent to the fixed table 1, and the other end side is arranged on the lower surface along the vertical direction. The fluid cylinder 5 is connected to the tip of the shaft 5 a via the pivot 6. The support arm 4 is fixed to the traveling member 7 at the lower end thereof, and the fluid cylinder 5 is also held by the traveling member 7 so as to be displaceable via the pivot 5b.
With the above configuration, a tilting mechanism capable of tilting the tilting table 2 is formed. That is, by driving the fluid cylinder 5 and moving the shaft 5a up and down, the tilting table 2 is swung with the rotating shaft 3 as a fulcrum, so that the upward or downward direction as shown in FIGS. It can be in the inclined posture.

さらに、上記した走行部材７は、ガイドレール８を介して水平方向へ移動可能に台板９に保持されている。ガイドレール８は、傾動テーブル２が固定テーブル１から離反する方向に沿って延長して形成されており、走行部材７は、駆動機構（図示外）により走行できるように形成されている。
この構成により傾動テーブル２の水平移動機構が形成されている。ここでは、走行部材７をガイドレール８に沿って移動させることにより、図６（ｅ）に示すように傾動テーブル２を固定テーブル１から引き離された方向に移動させることができる。 Further, the traveling member 7 described above is held on the base plate 9 so as to be movable in the horizontal direction via the guide rail 8. The guide rail 8 is formed to extend along the direction in which the tilting table 2 is separated from the fixed table 1, and the traveling member 7 is formed to be able to travel by a drive mechanism (not shown).
With this configuration, a horizontal movement mechanism for the tilting table 2 is formed. Here, by moving the traveling member 7 along the guide rail 8, the tilting table 2 can be moved in the direction separated from the fixed table 1 as shown in FIG.

また、上記した台板９は、その中間部の左右で支柱１０にガイド１０ａを介して昇降可能に支持されている。さらに、台板９の下面には、その前後および左右に滑車１１が設けられており、滑車１１はスライド部材１２に設けられた傾斜受け面１３によって受け止められている。スライド部材１２は、基盤１４のガイドレール１５にスライド可能に保持されており、駆動機構（図示外）により移動できるようにしてある。ガイドレール１５は、傾動テーブル２が固定テーブル１から離反する方向に沿って形成されており、傾斜受け面１３の傾斜方向は、ガイドレール１５の延長方向に沿って形成されている。なお、図１では傾斜受け面１３の左側が傾斜上位となるように示したが、その逆であってもよい。
この構成により、傾動テーブル２の昇降機構が形成されている。ここでは、スライド部材１２をガイドレール１５に沿って移動させることにより、傾斜受け面１３もこれに伴って移動し、台板９の滑車１１を、図５に示すように傾斜受け面１３の傾斜上位側に持ち上げ、あるいは傾斜下位側に降下させる。これにより、台板９に保持された傾動テーブル２を固定テーブル１に対して上動または下動させることができる（図５並びに図６（ｃ）、（ｄ）参照）。 Moreover, the above-mentioned base plate 9 is supported by the support | pillar 10 at right and left of the intermediate part so that raising / lowering is possible via the guide 10a. Furthermore, pulleys 11 are provided on the lower surface of the base plate 9 on the front and rear sides and on the left and right sides thereof, and the pulleys 11 are received by an inclined receiving surface 13 provided on the slide member 12. The slide member 12 is slidably held on the guide rail 15 of the base 14 and can be moved by a drive mechanism (not shown). The guide rail 15 is formed along the direction in which the tilt table 2 is separated from the fixed table 1, and the tilt direction of the tilt receiving surface 13 is formed along the extending direction of the guide rail 15. In FIG. 1, the left side of the inclined receiving surface 13 is shown to be the upper inclined position, but the opposite may be possible.
With this configuration, an elevating mechanism for the tilting table 2 is formed. Here, by moving the slide member 12 along the guide rail 15, the inclined receiving surface 13 is also moved accordingly, and the pulley 11 of the base plate 9 is inclined as shown in FIG. 5. Raise it to the upper side or lower it to the lower side. As a result, the tilting table 2 held on the base plate 9 can be moved up or down relative to the fixed table 1 (see FIGS. 5 and 6C and 6D).

上記の基板分断装置で基板Ｗを分断する際は、前工程で加工したスクライブラインＳを傾動テーブル２と固定テーブル１との間隔内に位置させた状態で基板Ｗを両テーブル１、２に吸着保持させる。この状態で傾動テーブル２を図６（ａ）、（ｂ）のように上方または下方に傾斜させて曲げモーメントを加えて分断したり、図６（ｃ）、（ｄ）のように傾動テーブル２を上方または下方に昇降させて剪断力により分断したりすることができる。また、基板の種類によっては、傾動テーブル２を傾動させると同時に昇降機構によって上下方向に移動させたり、または水平移動機構によって水平方向に移動させたりすることにより、曲げモーメントと同時に剪断力を加えたり、引張り力を加えたりして効果的に分断することができる。   When the substrate W is cut by the above-described substrate cutting apparatus, the substrate W is attracted to both the tables 1 and 2 while the scribe line S processed in the previous process is positioned within the interval between the tilting table 2 and the fixed table 1. Hold. In this state, the tilting table 2 is tilted upward or downward as shown in FIGS. 6A and 6B and divided by applying a bending moment, or as shown in FIGS. 6C and 6D. Can be lifted up or down and divided by shearing force. Depending on the type of substrate, the tilting table 2 may be tilted and simultaneously moved up and down by an elevating mechanism, or moved horizontally by a horizontal moving mechanism, thereby applying a shearing force simultaneously with a bending moment. It can be divided effectively by applying a tensile force.

また、傾動テーブル２は水平移動機構のガイドレール８に沿って水平方向に移動させることができるので、分断後の基板Ｗを傾動テーブル２に載せたまま外部に搬出することが可能となる。これにより、分断された基板を外部に搬出するためのコンベア等の搬出手段を省略することができる。   Further, since the tilting table 2 can be moved in the horizontal direction along the guide rails 8 of the horizontal moving mechanism, the divided substrate W can be carried out while being placed on the tilting table 2. Thereby, carrying-out means, such as a conveyor, for carrying out the divided substrate to the outside can be omitted.

なお、傾動テーブル２を傾動させて基板Ｗを分断する際に、図３に示すように傾動テーブル２の固定テーブル１に隣接する先端部が、回動軸３を中心とする回動によって固定テーブル１に対して上方または下方に変位するので、分断された基板Ｗの端面同士が引き離されて、基板同士の接触による端面の損傷を防ぐことができる。   When the tilting table 2 is tilted to divide the substrate W, as shown in FIG. 3, the tip portion adjacent to the fixed table 1 of the tilting table 2 is rotated around the rotating shaft 3 to fix the fixed table. Since the substrate 1 is displaced upward or downward with respect to 1, the end surfaces of the divided substrates W are separated from each other, and damage to the end surfaces due to contact between the substrates can be prevented.

以上、本発明の代表的な実施例について説明したが、本発明は必ずしも上記の実施形態に特定されるものではなく、本発明の目的を達成し、請求の範囲を逸脱しない範囲内で適宜修正、変更することが可能である。   As described above, the representative examples of the present invention have been described. However, the present invention is not necessarily limited to the above-described embodiments, and can be appropriately modified within the scope of achieving the object of the present invention and not departing from the scope of the claims. It is possible to change.

本発明は、脆性材料からなる基板をスクライブラインに沿って分断する基板分断装置に利用することができる。   INDUSTRIAL APPLICABILITY The present invention can be used for a substrate cutting apparatus that cuts a substrate made of a brittle material along a scribe line.

Ｓ スクライブライン
Ｗ 基板
１ 固定テーブル
１ａ 基板保持面
２ 傾動テーブル
２ａ 基板保持面
３ 回動軸
４ 支持アーム
５ 流体シリンダ
５ａ シャフト
６ 枢軸
７ 走行部材
８ ガイドレール
９ 台板
１０ 支柱
１１ 滑車
１２ スライド部材
１３ 傾斜受け面
１４ 基盤
１５ ガイドレール S Scribe line W Substrate 1 Fixed table 1a Substrate holding surface 2 Tilt table 2a Substrate holding surface 3 Rotating shaft 4 Support arm 5 Fluid cylinder 5a Shaft 6 Axis 7 Traveling member 8 Guide rail 9 Base plate 10 Post 11 Pulley 12 Puller 13 Slide member 13 Inclined receiving surface 14 Base 15 Guide rail

Claims (4)

脆性材料からなる基板の表面に形成されたスクライブラインに沿って前記基板を分断する基板分断装置であって、
それぞれに基板を保持する基板保持面を備え、かつ、これら基板保持面が同一水平面を形成するように間隔をあけて隣接された固定テーブル並びに傾動テーブルとからなり、
前記傾動テーブルは、当該傾動テーブルを前記固定テーブルに隣接する一端部に形成された回動軸を支点として傾動させる傾動機構と、
前記傾動テーブルを前記固定テーブルから水平方向に離反するように移動させる水平移動機構と、
前記傾動テーブルを昇降させる昇降機構とを備えている基板分断装置。 A substrate cutting device for cutting the substrate along a scribe line formed on a surface of a substrate made of a brittle material,
Each comprising a substrate holding surface for holding the substrate, and a fixed table and a tilting table adjacent to each other so as to form the same horizontal plane.
The tilting table includes a tilting mechanism that tilts the tilting table around a pivot shaft formed at one end adjacent to the fixed table,
A horizontal movement mechanism for moving the tilting table away from the fixed table in the horizontal direction;
A substrate cutting apparatus comprising a lifting mechanism for lifting and lowering the tilting table. 前記傾動機構は、前記回動軸を介して前記傾動テーブルを回動可能に支持する支持アームと、前記傾動テーブルの他端部下面に連結され、前記回動軸を支点として前記傾動テーブルを上下に揺動させる流体シリンダとからなる請求項１に記載の基板分断装置。   The tilting mechanism is connected to a support arm that rotatably supports the tilting table via the rotating shaft, and a lower surface of the other end of the tilting table. The tilting table is moved up and down with the rotating shaft as a fulcrum. The substrate cutting apparatus according to claim 1, further comprising a fluid cylinder that swings at a distance. 前記水平移動機構は、前記支持アーム並びに前記流体シリンダを保持する走行部材と、ガイドレールを介して前記走行部材を水平方向に移動可能に保持する台板とからなり、前記ガイドレールは、前記傾動テーブルが前記固定テーブルから離反する方向に延長して形成され、前記走行部材が駆動機構を介して走行するように形成されている請求項２に記載の基板分断装置。   The horizontal movement mechanism includes a traveling member that holds the support arm and the fluid cylinder, and a base plate that holds the traveling member so as to be movable in a horizontal direction via a guide rail, and the guide rail is tilted. The substrate cutting apparatus according to claim 2, wherein a table is formed to extend in a direction away from the fixed table, and the traveling member is configured to travel via a drive mechanism. 前記昇降機構は、前記台板を昇降可能に保持する支柱と、前記台板の下面に設けられた滑車と、この滑車を受ける傾斜受け面を備えたスライド部材と、ガイドレールを介して前記スライド部材を水平方向に摺動可能に保持する基盤とからなり、前記ガイドレールは、前記傾動テーブルが前記固定テーブルから離反する方向に延長して形成され、前記傾斜受け面の傾斜方向が前記ガイドレールの方向に沿って形成され、前記スライド部材が駆動機構により摺動するように形成されている請求項３に記載の基板分断装置。   The elevating mechanism includes a column that holds the base plate so that the base plate can be moved up and down, a pulley provided on a lower surface of the base plate, a slide member having an inclined receiving surface that receives the pulley, and the slide via a guide rail. The guide rail is formed by extending the tilting table in a direction away from the fixed table, and the tilt direction of the tilt receiving surface is the guide rail. 4. The substrate cutting apparatus according to claim 3, wherein the slide member is formed so as to slide along a direction in which the slide member is slid by a drive mechanism.
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