TW201929062A - Device for dividing substrate capable of maintaining the parallelism of a breaking bar with respect to a substrate while the device for dividing substrate rotates the breaking bar and changes its direction of the extension - Google Patents

Device for dividing substrate capable of maintaining the parallelism of a breaking bar with respect to a substrate while the device for dividing substrate rotates the breaking bar and changes its direction of the extension Download PDF

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Publication number
TW201929062A
TW201929062A TW107144430A TW107144430A TW201929062A TW 201929062 A TW201929062 A TW 201929062A TW 107144430 A TW107144430 A TW 107144430A TW 107144430 A TW107144430 A TW 107144430A TW 201929062 A TW201929062 A TW 201929062A
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Taiwan
Prior art keywords
substrate
base
rod
horizontal direction
respect
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TW107144430A
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Chinese (zh)
Inventor
中田勝喜
谷垣內平道
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日商三星鑽石工業股份有限公司
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Publication of TW201929062A publication Critical patent/TW201929062A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

The object of the present invention is to maintain the parallelism of a breaking bar with respect to a substrate in a device for dividing a substrate which rotates the breaking bar and changes its direction of the extension. A device for dividing the substrate 1 is configured to divide a substrate 100A formed with a plurality of first scribing lines S1 and a plurality of second scribing lines S2, both of which are orthogonal to each other. The breaking bar is a component configured to divide the substrate 100A by moving downward from a base 22, and has a base member 21 detachably supporting the base 22 and a bar member 23 coupled to the base member and configured to contact the substrate 100A. A second sliding drive mechanism 89 is configured to move the base in a first horizontal direction. A first sliding drive mechanism 85 is configured to move the base 22 in a second horizontal direction orthogonal to the first horizontal direction. A rotation mechanism 83 is configured to rotate the breaking bar 19 between a first posture extending in the first horizontal direction with respect to the base 22 and a second posture extending in the second horizontal direction. A tilt adjustment mechanism 27 is configured to adjust the tilt of the bar member 23 by moving at least one of the two ends of the bar member 23 up and down with respect to the base member 21.

Description

基板分斷裝置Substrate breaking device

本發明是關於基板分斷裝置,尤其是關於將由玻璃、陶瓷、半導體晶圓等脆性材料構成之基板分斷之基板分斷裝置。The present invention relates to a substrate breaking device, and more particularly to a substrate breaking device for dividing a substrate made of a brittle material such as glass, ceramics, or a semiconductor wafer.

以往,已知於脆性材料基板(以下,僅稱為「基板」)之表面使用刀輪(亦稱為刻劃輪)或雷射光束等,形成互相正交之X方向以及Y方向之刻劃線,之後,藉由沿著該刻劃線施加外力以進行裂斷,而將基板分斷為單位基板之方法(例如,參照專利文獻1)。Conventionally, it has been known to use a cutter wheel (also referred to as a scribing wheel) or a laser beam on the surface of a brittle material substrate (hereinafter simply referred to as "substrate") to form mutually orthogonal X and Y directions. A method of dividing a substrate into a unit substrate by applying an external force along the scribe line to perform cracking (for example, refer to Patent Document 1).

於專利文獻1記載之裂斷裝置A,具備載置基板W之水平的平台1。平台1,可在水平面內轉動,且,可於Y方向移動。於平台1之上方,設置有於X方向水平地延伸之樑23。於樑23,安裝有於X方向延伸之裂斷棒10,可透過藉由汽缸而被驅動之升降軸來進行升降。The cracking device A described in Patent Document 1 includes a stage 1 on which the substrate W is placed. The platform 1 is rotatable in a horizontal plane and is movable in the Y direction. Above the platform 1, a beam 23 extending horizontally in the X direction is provided. The beam 23 is attached with a split rod 10 extending in the X direction, and is lifted and lowered by a lifting shaft driven by a cylinder.

將基板W裂斷時,首先,以刻劃線S1成為平行於X方向之方式,將基板W載置於平台1。此時,刻劃線S1被配置於下面側。接著,使裂斷棒10從基板W之上方朝向刻劃線S1下降,相對於此,使作為衝擊構件之錘體落下而賦予衝擊。其結果,刻劃線S1之裂痕伸展,基板被裂斷。此外,所有的刻劃線S1之裂斷都完成後,使平台1旋轉90度,與上述同樣地藉由裂斷棒10將刻劃線S2依序裂斷。
[現有技術文獻]
[專利文獻]
When the substrate W is broken, first, the substrate W is placed on the stage 1 so that the scribe line S1 is parallel to the X direction. At this time, the score line S1 is disposed on the lower side. Then, the split rod 10 is lowered from the upper side of the substrate W toward the score line S1, whereas the hammer which is the impact member is dropped to give an impact. As a result, the crack of the score line S1 is stretched, and the substrate is broken. Further, after all the scribe lines S1 are broken, the stage 1 is rotated by 90 degrees, and the scribe lines S2 are sequentially broken by the split bars 10 in the same manner as described above.
[Prior Art Literature]
[Patent Literature]

[專利文獻1]日本特開2017-039271號公報[Patent Document 1] JP-A-2017-039271

[發明欲解決之課題][Questions to be solved by the invention]

近年來,相對於樑使裂斷機構可自由轉動且可於X方向移動之基板分斷裝置已被開發。在此裝置中,於將刻劃線S2分割時,使裂斷棒以於Y方向延伸之方式轉動,接著,一邊使裂斷棒沿著樑於X方向移動,一邊將刻劃線S2依序裂斷。
一般而言,裂斷棒之按壓刃之前端稜線,被要求相對於基板平行地對峙且涵蓋刻劃線全長均等地施加按壓力。其原因在於,若於平行度產生誤差,會無法涵蓋刻劃線全長以適當之按壓力均等地按壓,導致裂斷之精度降低。
然而,在上述之將裂斷棒轉動之基板分斷裝置中,在刻劃線S1分割時與刻劃線S2分割時裂斷棒會旋轉90度,故難以維持裂斷棒之相對於基板表面之平行度。其原因在於,通常被載置於平台之基板之傾斜在X方向與Y方向不同。
In recent years, a substrate breaking device that is freely rotatable relative to a beam and movable in the X direction has been developed. In this apparatus, when the scribe line S2 is divided, the split rod is rotated in the Y direction, and then the slash line S2 is sequentially moved while moving the split rod along the beam in the X direction. Broken.
In general, the front end ridge line of the pressing blade of the splitting bar is required to apply a pressing force equally to the entire length of the score line in parallel with respect to the substrate. The reason for this is that if an error occurs in the parallelism, it is impossible to cover the entire length of the score line and press it uniformly with an appropriate pressing force, resulting in a decrease in the accuracy of the crack.
However, in the above-described substrate breaking device for rotating the split bar, the split bar is rotated by 90 degrees when the score line S1 is divided and the score line S2 is divided, so that it is difficult to maintain the crack bar relative to the substrate surface. Parallelism. The reason for this is that the inclination of the substrate which is usually placed on the stage is different from the Y direction in the X direction.

本發明之目的,在於:於藉由使裂斷棒轉動來變更延伸之方向之基板分斷裝置中,將裂斷棒之相對於基板之平行度維持為高。
[用來解決課題之手段]
An object of the present invention is to maintain the parallelism of the split rod with respect to the substrate in the substrate breaking device that changes the direction of the extension by rotating the split rod.
[Means to solve the problem]

以下,作為用來解決課題之手段,說明複數個態樣。這些態樣可配合需要而任意組合。Hereinafter, a plurality of aspects will be described as means for solving the problem. These aspects can be combined arbitrarily as needed.

本發明之一態樣之基板分斷裝置,用來將形成有互相正交之複數個第一刻劃線及複數個第二刻劃線之基板分斷,其具備基座、裂斷棒、第一驅動機構、第二驅動機構、轉動機構、以及傾斜調整機構。
裂斷棒,可藉由從基座往下方移動而將基板分割,且具有可裝卸地支持於基座之基座構件、和連結於基座構件且用來接觸基板之棒構件。
第一驅動機構,使基座於第一水平方向移動。
第二驅動機構,使基座於正交於第一水平方向之第二水平方向移動。
轉動機構,使裂斷棒在相對於基座延伸於第一水平方向之第一姿勢與延伸於第二水平方向之第二姿勢之間轉動。
傾斜調整機構,藉由將棒構件之兩端之至少一方相對於基座構件上下動而可調整棒構件之傾斜。
利用此裝置,例如,裂斷棒在第一姿勢之狀態下,一邊於第二水平方向移動一邊將複數個第一刻劃線分割,接著,裂斷棒在第二姿勢之狀態下,一邊於第一水平方向移動一邊將複數個第二刻劃線分割。
利用此裝置,藉由以傾斜調整機構在第一刻劃線之分割時與第二刻劃線之分割時變更裂斷棒之傾斜,可將裂斷棒與基板之平行度維持為高。
A substrate breaking device according to an aspect of the present invention is for dividing a substrate formed with a plurality of first scribe lines and a plurality of second scribe lines which are orthogonal to each other, and has a pedestal, a split rod, a first drive mechanism, a second drive mechanism, a rotation mechanism, and a tilt adjustment mechanism.
The split bar is divided into a base member that is detachably supported by the base by moving downward from the base, and a rod member coupled to the base member for contacting the substrate.
The first driving mechanism moves the base in the first horizontal direction.
The second driving mechanism moves the base in a second horizontal direction orthogonal to the first horizontal direction.
The rotating mechanism rotates the split bar between a first posture extending in a first horizontal direction relative to the base and a second posture extending in a second horizontal direction.
The tilt adjustment mechanism adjusts the tilt of the rod member by moving at least one of both ends of the rod member up and down with respect to the base member.
With this device, for example, the split bar is divided into a plurality of first scribe lines while moving in the second horizontal direction in the state of the first posture, and then the split bar is in the second posture state, The plurality of second scribe lines are divided while moving in the first horizontal direction.
With this device, the inclination of the split rod can be maintained high by changing the inclination of the split rod when the first score line is divided and the second score line is divided by the tilt adjustment mechanism.

傾斜調整機構,也可以具有:馬達,固定於基座構件;以及動力傳達機構,將馬達之旋轉力變換為上下方向後往棒構件傳達。
利用此裝置,可以簡單之構成將棒構件相對於基座構件移動。
The tilt adjustment mechanism may include a motor fixed to the base member and a power transmission mechanism that converts the rotational force of the motor into the vertical direction and transmits the force to the rod member.
With this device, the rod member can be moved relative to the base member in a simple configuration.

基板分斷裝置,也可以進一步具備:導引部,將棒構件相對於基座構件於上下方向導引。
利用此裝置,棒構件之相對於基座構件之姿勢穩定。
The substrate cutting device may further include a guiding portion that guides the rod member in the vertical direction with respect to the base member.
With this device, the posture of the rod member with respect to the base member is stabilized.

基板分斷裝置,也可以進一步具備:上下驅動機構,使裂斷棒相對於基座上下動。
利用此裝置,裂斷棒可藉由相對於基座下降而接觸基板。
The substrate cutting device may further include: an up-and-down driving mechanism that moves the split bar up and down with respect to the base.
With this device, the split rod can contact the substrate by lowering relative to the base.

基板分斷裝置,也可以進一步具備:錘體,裝設於基座,藉由從基座落下而從上方衝撞裂斷棒,使裂斷棒分斷基板。
利用此裝置,可在裂斷棒之棒構件抵接於基板之狀態下,藉由錘體衝撞裂斷棒來將基板分斷。
The substrate cutting device may further include a hammer body that is attached to the susceptor and that is broken from the susceptor to collide with the rupture rod from above to break the substrate.
With this device, the substrate can be broken by the hammer colliding with the split rod in a state in which the rod member of the split rod abuts against the substrate.

1、第一實施形態
(1)基板分斷裝置
使用圖1,說明第一實施形態之基板分斷裝置1。圖1係顯示本發明之第一實施形態之基板分斷裝置之立體圖。另外,於各圖中,箭頭X是第一水平方向,箭頭Y是第二水平方向。
基板分斷裝置1,是藉由將在前段步驟中形成有刻劃線(切槽)之基板100A(圖15),從該刻劃線之相反側之面按壓,使基板100A彎曲,而沿著刻劃線將基板100A分斷之裝置。具體而言,在基板100A,形成有互相正交之複數個第一刻劃線S1及複數個第二刻劃線S2。
1. First Embodiment (1) Substrate Breaking Apparatus A substrate cutting apparatus 1 according to a first embodiment will be described with reference to Fig. 1 . Fig. 1 is a perspective view showing a substrate cutting device according to a first embodiment of the present invention. In addition, in each figure, the arrow X is the first horizontal direction, and the arrow Y is the second horizontal direction.
The substrate cutting device 1 is formed by pressing the substrate 100A (FIG. 15) in which the scribe line (grooving) is formed in the previous step, from the opposite side of the scribe line, to bend the substrate 100A. A device for cutting the substrate 100A by scribe lines. Specifically, on the substrate 100A, a plurality of first scribe lines S1 and a plurality of second scribe lines S2 which are orthogonal to each other are formed.

基板分斷裝置1,具有帶式輸送機裝置3,該帶式輸送機裝置3具有用來載置基板100A之載置面3a。帶式輸送機裝置3,可將基板100A於第二水平方向搬送。
基板分斷裝置1,具有於第一方向延伸之樑(橫樑)9。樑9,配置於比帶式輸送機裝置3之載置面3a更上方之位置,藉由第二滑動驅動機構89(第二驅動機構之一例)而可沿著軌道15於第二水平方向移動。
The substrate cutting device 1 has a belt conveyor device 3 having a mounting surface 3a on which the substrate 100A is placed. The belt conveyor device 3 can transport the substrate 100A in the second horizontal direction.
The substrate breaking device 1 has a beam (beam) 9 extending in the first direction. The beam 9 is disposed above the mounting surface 3a of the belt conveyor device 3, and is movable in the second horizontal direction along the rail 15 by the second sliding drive mechanism 89 (an example of the second driving mechanism) .

(2)裂斷棒升降裝置
使用圖2~圖8,說明裂斷棒升降裝置11。圖2係圖1之部分擴大圖,是裂斷棒升降裝置之立體圖。圖3係裂斷棒升降裝置之前視圖。圖4係裂斷棒升降裝置之後視圖。圖5係裂斷棒之立體圖。圖6係圖5之部分擴大圖。圖7係裂斷棒升降裝置之側面圖。圖8係裂斷棒之前端部分之剖面圖。
(2) Split-bar lifting device The split-bar lifting device 11 will be described with reference to Figs. 2 to 8 . Fig. 2 is a partially enlarged view of Fig. 1 and is a perspective view of the split rod lifting device. Figure 3 is a front view of the split-bar lifting device. Figure 4 is a rear view of the split bar lifting device. Figure 5 is a perspective view of a split bar. Figure 6 is a partial enlarged view of Figure 5. Figure 7 is a side elevational view of the split bar lifting device. Figure 8 is a cross-sectional view of the front end portion of the splitting bar.

裂斷棒升降裝置11,具有裂斷棒19。裂斷棒19,保持於樑9,沿著例如第一水平方向延伸。裂斷棒19,在接觸基板100A之表面之位置靜止,在此狀態下對裂斷棒19使作為衝擊構件之錘體29落下,藉由其衝擊將基板100A沿著刻劃線裂斷(後述)。
裂斷棒19,是可藉由從樑9往下方移動而將基板100A分割之構件,具有可裝卸地支持於樑9之支持構件21(基座構件之一例)、連結於支持構件21且用來接觸基板100A之棒構件23、以及傾斜調整機構27(傾斜調整機構之一例)。
The split rod lifting device 11 has a split rod 19. The split rod 19, held in the beam 9, extends along, for example, the first horizontal direction. The split rod 19 is stationary at a position contacting the surface of the substrate 100A, and in this state, the hammer 29 as the impact member is dropped on the split rod 19, and the substrate 100A is broken along the score line by the impact (described later). ).
The split rod 19 is a member that can divide the substrate 100A by moving downward from the beam 9, and has a support member 21 (an example of a base member) that is detachably supported by the beam 9 and is coupled to the support member 21 and used. The rod member 23 of the substrate 100A and the tilt adjustment mechanism 27 (an example of the tilt adjustment mechanism) are brought into contact.

支持構件21,被支持為可相對於樑9之支持部22於上下方向移動。支持構件21,可藉由升降裝置81(圖13,上下驅動機構之一例)而升降。支持部22,透過轉動機構83(圖13,轉動機構之一例)而被支持於樑9。轉動機構83,將裂斷棒在相對於樑9於第一水平方向延伸之第一姿勢(圖15)與於第二水平方向延伸之第二姿勢(圖19)之間轉動。轉動機構83,藉由第一滑動驅動機構85(圖13,第一驅動機構之一例),可沿著樑9於第一水平方向移動。
支持構件21,具有板狀構件21a。板狀構件21a,例如於第一水平方向較長地延伸,且將主面朝向第二水平方向。
The support member 21 is supported to be movable in the vertical direction with respect to the support portion 22 of the beam 9. The support member 21 can be raised and lowered by the lifting device 81 (Fig. 13, an example of the upper and lower drive mechanisms). The support portion 22 is supported by the beam 9 via a rotation mechanism 83 (Fig. 13, an example of a rotation mechanism). The rotation mechanism 83 rotates the split rod between a first posture (Fig. 15) extending in the first horizontal direction with respect to the beam 9 and a second posture (Fig. 19) extending in the second horizontal direction. The rotation mechanism 83 is movable in the first horizontal direction along the beam 9 by the first slide drive mechanism 85 (Fig. 13, an example of the first drive mechanism).
The support member 21 has a plate member 21a. The plate-like member 21a extends, for example, in the first horizontal direction and faces the main surface in the second horizontal direction.

棒構件23,具有支持板23a、按壓板23b、及複數個連結板23c。按壓板23b,透過複數個連結板23c,相對於支持板23a安裝成可上下位置調整。按壓板23b,於其下端具有例如沿著第一水平方向直線狀地延伸之按壓刃23d。
連結板23c,安裝為可沿著形成於支持板23a之於上下延伸之鳩尾槽而往上下方向移動,藉由轉動上下調整螺栓而可調整上下位置。
The rod member 23 has a support plate 23a, a pressing plate 23b, and a plurality of connecting plates 23c. The pressing plate 23b is inserted into the plurality of connecting plates 23c, and is attached to the support plate 23a so as to be vertically adjustable. The pressing plate 23b has a pressing blade 23d extending linearly in the first horizontal direction at its lower end, for example.
The connecting plate 23c is attached so as to be movable in the vertical direction along the dovetail groove formed on the support plate 23a so as to extend up and down, and the vertical position can be adjusted by rotating the upper and lower adjusting bolts.

傾斜調整機構27,是用來藉由調整相對於支持構件21之棒構件23之傾斜而調整棒構件23之按壓刃23d之相對於基板100A之平行度之機構。傾斜調整機構27會於之後說明。
錘體29,是裝設於支持部22,且藉由從支持部22落下並從上方衝撞棒構件23而使棒構件23將基板100A分斷之構件。錘體29,藉由支持部22透過鎖定機構87(圖13)而被支持。若鎖定機構87(圖13)之鎖定被解除,錘體29會往下方落下而衝撞棒構件23。另外,若裂斷棒19往上方移動,藉由被裂斷棒19舉高而錘體29亦上升,被鎖定機構87(圖13)鎖定。
The tilt adjustment mechanism 27 is a mechanism for adjusting the parallelism of the pressing blade 23d of the rod member 23 with respect to the substrate 100A by adjusting the inclination of the rod member 23 with respect to the support member 21. The tilt adjustment mechanism 27 will be described later.
The hammer body 29 is a member that is attached to the support portion 22 and that causes the rod member 23 to break the substrate 100A by dropping from the support portion 22 and colliding the rod member 23 from above. The hammer body 29 is supported by the support portion 22 through the lock mechanism 87 (Fig. 13). When the locking of the lock mechanism 87 (Fig. 13) is released, the hammer body 29 will fall downward and collide with the rod member 23. Further, when the split rod 19 moves upward, the hammer 29 rises by being lifted by the split rod 19, and is locked by the lock mechanism 87 (Fig. 13).

(3)傾斜調整機構
使用圖9~圖12,說明傾斜調整機構27。圖9係裂斷棒傾斜調整機構之立體圖。圖10係裂斷棒傾斜調整機構之前視圖。圖11係圖10之XI-XI剖面圖。圖12係圖10之XII-XII剖面圖。
傾斜調整機構27,於第一水平方向兩側具有用來調整相對於棒構件23之支持構件21之上下方向位置的一對機構。亦即,棒構件23,可將長度方向兩端分別獨立地相對於支持構件21升降,藉此可調整傾斜。
(3) Tilt Adjustment Mechanism The tilt adjustment mechanism 27 will be described with reference to Figs. 9 to 12 . Figure 9 is a perspective view of the split bar tilt adjustment mechanism. Figure 10 is a front view of the split bar tilt adjustment mechanism. Figure 11 is a cross-sectional view taken along line XI-XI of Figure 10. Figure 12 is a cross-sectional view taken along line XII-XII of Figure 10.
The tilt adjustment mechanism 27 has a pair of mechanisms for adjusting the position in the up-down direction of the support member 21 with respect to the rod member 23 on both sides in the first horizontal direction. That is, the rod member 23 can independently raise and lower the both ends in the longitudinal direction with respect to the support member 21, whereby the inclination can be adjusted.

以下,說明傾斜調整機構27的一對機構之一方。
傾斜調整機構27,具有馬達53、減速機構55、小齒輪57、齒條59、板體63、塊體65、滑動塊體67、以及滑動基座板體71。
Hereinafter, one of the pair of mechanisms of the tilt adjustment mechanism 27 will be described.
The tilt adjustment mechanism 27 includes a motor 53, a speed reduction mechanism 55, a pinion 57, a rack 59, a plate 63, a block 65, a slider block 67, and a slide base plate 71.

馬達53具有於第一方向延伸之旋轉軸,固定於支持構件21。
減速機構55,固定於支持構件21,有來自馬達53之力矩被輸入。
小齒輪57,連結於減速機構55之輸出軸。齒條59,於上下方向延伸,卡合於小齒輪57。藉由小齒輪57與齒條59,構成將馬達53之旋轉力變換為上下方向之力後往棒構件23傳達之動力傳達機構。
The motor 53 has a rotating shaft extending in the first direction and is fixed to the support member 21.
The speed reduction mechanism 55 is fixed to the support member 21, and a torque from the motor 53 is input.
The pinion gear 57 is coupled to the output shaft of the speed reduction mechanism 55. The rack 59 extends in the up and down direction and is engaged with the pinion 57. The pinion gear 57 and the rack 59 constitute a power transmission mechanism that converts the rotational force of the motor 53 into the vertical direction and transmits the force to the rod member 23.

板體63,可相對於支持構件21於上下方向移動,固定於齒條59。
此外,板體63,藉由LM導引部64(導引部之一例),以相對於支持構件21於上下方向移動之方式受導引。因此,板體63之相對於支持構件21之姿勢穩定。
The plate body 63 is movable in the vertical direction with respect to the support member 21, and is fixed to the rack 59.
Further, the plate body 63 is guided by the LM guide portion 64 (an example of the guide portion) so as to move in the vertical direction with respect to the support member 21. Therefore, the posture of the plate body 63 with respect to the support member 21 is stabilized.

塊體65,被配置成接近板體63。
滑動塊體67,固定於塊體65之上下兩端,於板體63之孔內延伸。
The block 65 is disposed close to the plate body 63.
The sliding block 67 is fixed to the upper and lower ends of the block 65 and extends in the hole of the plate 63.

滑動基座板體71,被配置成接近塊體65。於滑動基座板體71,藉由固定部75固定有棒構件23。藉由以上之構成,板體63、塊體65、滑動塊體67、滑動基座板體71及棒構件23成為一體,可相對於支持構件21相對地上下動。
其中,棒構件23與滑動基座板體71可在既定範圍內相對地上下動,於兩者之間設置有LM導引部70。
軸部73,固定於滑動基座板體71,被插入塊體65之孔內。藉此,滑動基座板體71,可相對於塊體65繞例如於第一水平方向延伸之旋轉軸轉動。
The slide base plate 71 is disposed to be close to the block 65. The rod member 23 is fixed to the slide base plate 71 by a fixing portion 75. According to the above configuration, the plate body 63, the block body 65, the slide block body 67, the slide base plate body 71, and the rod member 23 are integrated, and can be relatively moved up and down with respect to the support member 21.
Among these, the rod member 23 and the slide base plate 71 are relatively movable up and down within a predetermined range, and the LM guide portion 70 is provided therebetween.
The shaft portion 73 is fixed to the slide base plate body 71 and inserted into the hole of the block body 65. Thereby, the slide base plate body 71 is rotatable relative to the block body 65 about a rotation axis extending, for example, in the first horizontal direction.

藉由以上之構成,若馬達53旋轉,則小齒輪57、板體63、塊體65、滑動塊體67、滑動基座板體71升降,棒構件23之長度方向一端亦跟隨升降。
如上述,棒構件23之長度方向兩端,可藉由傾斜調整機構27的一對機構而於上下方向移動。為了調整棒構件23之傾斜,可將一對機構之雙方驅動,或將一方作為基準側固定而將另一方作為補正側使其移動亦可。在後者之方法中,傾斜調整之控制變簡單。
According to the above configuration, when the motor 53 rotates, the pinion gear 57, the plate body 63, the block body 65, the slide block body 67, and the slide base plate body 71 move up and down, and the one end of the rod member 23 in the longitudinal direction also follows.
As described above, both ends in the longitudinal direction of the rod member 23 can be moved in the vertical direction by the pair of mechanisms of the tilt adjusting mechanism 27. In order to adjust the inclination of the rod member 23, both of a pair of mechanisms may be driven, or one of them may be fixed as a reference side and the other may be moved as a correction side. In the latter method, the control of the tilt adjustment becomes simple.

(4)基板分斷裝置之控制構成
使用圖13,說明基板分斷裝置1之控制構成。圖13係顯示基板分斷裝置之控制構成之方塊圖。
基板分斷裝置1,具有控制器50。控制器50,是具有處理器(例如,CPU)、記憶裝置(例如,ROM、RAM、HDD、SSD等)、各種介面(例如,類比/數位轉換器、數位/類比轉換器、通信介面等)之電腦系統。控制器50,藉由執行保存於記憶部(對應於記憶裝置之記憶區域之一部分或全部)之程式,進行各種控制動作。
(4) Control Configuration of Substrate Breaking Device The control configuration of the substrate breaking device 1 will be described with reference to Fig. 13 . Figure 13 is a block diagram showing the control structure of the substrate breaking device.
The substrate breaking device 1 has a controller 50. The controller 50 has a processor (for example, a CPU), a memory device (for example, a ROM, a RAM, an HDD, an SSD, etc.), various interfaces (for example, an analog/digital converter, a digital/analog converter, a communication interface, etc.). Computer system. The controller 50 performs various control operations by executing a program stored in the memory unit (corresponding to part or all of the memory area of the memory device).

控制器50,可以以單一之處理器構成,或也可以為了各控制而由獨立之複數個處理器構成。
控制器50之各要素之功能的一部分或全部,作為可以以構成控制器50之電腦系統執行之程式來實現亦可。另外,控制器50之各要素之功能的一部分,由訂製IC(Custom IC)構成亦可。
The controller 50 may be constituted by a single processor or may be composed of a plurality of independent processors for each control.
A part or all of the functions of the respective elements of the controller 50 may be implemented as a program executable by the computer system constituting the controller 50. Further, a part of the functions of the respective elements of the controller 50 may be configured by a custom IC (Custom IC).

於控制器50,連接有升降裝置81、轉動機構83、第一滑動驅動機構85、鎖定機構87、及第二滑動驅動機構89。
於控制器50,雖不圖示,但連接有進行基板之大小、形狀及位置檢測之感測器、用來檢測各裝置之狀態之感測器及開關,以及資訊輸入裝置。
The controller 50 is connected to a lifting device 81, a rotating mechanism 83, a first sliding drive mechanism 85, a locking mechanism 87, and a second sliding drive mechanism 89.
The controller 50 is connected to a sensor for detecting the size, shape, and position of the substrate, a sensor and a switch for detecting the state of each device, and an information input device, although not shown.

(5)基板分斷動作
(5-1)基板分斷之原理
使用圖14,說明基板分斷之原理。圖14係顯示基板分斷動作之示意圖。
最初,裂斷棒19被配置於刻劃線之正上方。
其次,裂斷棒19藉由升降裝置81而從樑9之支持部22下降,棒構件23之按壓刃23d接觸基板之表面。
(5) Substrate Breaking Operation (5-1) Principle of Substrate Breaking The principle of substrate breaking will be described using FIG. Fig. 14 is a view showing the breaking operation of the substrate.
Initially, the splitting bar 19 is placed directly above the score line.
Next, the split rod 19 is lowered from the support portion 22 of the beam 9 by the lifting device 81, and the pressing blade 23d of the rod member 23 contacts the surface of the substrate.

接著,支持構件21藉由升降裝置81而往下方移動,從棒構件23往下方離開。
接著,錘體29藉由鎖定機構87而下降,對棒構件23賦予衝擊。藉此,刻劃線被分斷。
最後,支持構件21藉由升降裝置81而往上方移動,從下方抵接於棒構件23。之後,進行裂斷棒19之上升。
Next, the support member 21 is moved downward by the lifting device 81, and is separated downward from the rod member 23.
Next, the hammer body 29 is lowered by the lock mechanism 87 to give an impact to the rod member 23. Thereby, the score line is broken.
Finally, the support member 21 is moved upward by the lifting device 81, and abuts against the rod member 23 from below. Thereafter, the rise of the split rod 19 is performed.

(5-2)基板分斷之動作
使用圖15~圖20,說明基板分斷動作。圖15~圖20係顯示基板分斷動作之一狀態之俯視圖。以下,針對各圖說明動作。
於圖15所示之狀態中,裂斷棒19是於第一水平方向延伸之第一姿勢之狀態。
最初,藉由以傾斜調整機構27將裂斷棒19之傾斜變更,使裂斷棒19之按壓刃23d相對於基板100A之表面平行。
如圖16所示,樑9藉由第二滑動驅動機構89而於第二水平方向移動,裂斷棒19以第一姿勢之狀態將複數個第一刻劃線S1依序分斷。藉此,形成短條狀基板111。另外,如上述,裂斷棒19之按壓刃23d與基板100A之表面的平行度高,故第一刻劃線S1精度良好地被分斷。
(5-2) Operation of Substrate Breaking The substrate breaking operation will be described with reference to Figs. 15 to 20 . 15 to 20 are plan views showing one state of the substrate breaking operation. Hereinafter, the operation will be described with respect to each drawing.
In the state shown in Fig. 15, the splitting bar 19 is in a state of the first posture extending in the first horizontal direction.
First, by changing the inclination of the split rod 19 by the tilt adjustment mechanism 27, the pressing edge 23d of the split rod 19 is made parallel with respect to the surface of the substrate 100A.
As shown in Fig. 16, the beam 9 is moved in the second horizontal direction by the second slide driving mechanism 89, and the split bar 19 sequentially divides the plurality of first scribe lines S1 in the state of the first posture. Thereby, the short strip substrate 111 is formed. Further, as described above, since the parallelism between the pressing blade 23d of the splitting bar 19 and the surface of the substrate 100A is high, the first scribe line S1 is accurately divided.

如圖17所示,樑9藉由第二滑動驅動機構89而於第二水平方向移動,將裂斷棒19配置於基板100A之第二水平方向中間。
如圖18所示,裂斷棒19藉由轉動機構83而旋轉90度,採取於第二水平方向延伸之第二姿勢。
如圖19所示,裂斷棒19藉由第一滑動驅動機構85而往第一水平方向單側移動。接著,在此狀態下,藉由傾斜調整機構27,將裂斷棒19之傾斜變更。因此,可使裂斷棒19與複數個短條狀基板111之平行度變高。
As shown in FIG. 17, the beam 9 is moved in the second horizontal direction by the second slide drive mechanism 89, and the split rod 19 is disposed in the middle of the second horizontal direction of the substrate 100A.
As shown in Fig. 18, the split rod 19 is rotated by 90 degrees by the rotating mechanism 83, and is taken in the second posture extending in the second horizontal direction.
As shown in FIG. 19, the split rod 19 is moved to the one side in the first horizontal direction by the first slide driving mechanism 85. Next, in this state, the inclination of the split rod 19 is changed by the tilt adjustment mechanism 27. Therefore, the parallelism of the split rod 19 and the plurality of short strip substrates 111 can be made high.

如圖20所示,裂斷棒19藉由第一滑動驅動機構85而於第一水平方向移動,接著,裂斷棒19以第二姿勢之狀態將複數個第二刻劃線S2依序分斷。藉此,形成單位基板113。另外,如上述,裂斷棒19之按壓刃23d與基板100A之表面的平行度高,故第二刻劃線S2精度良好地被分斷。
利用此裝置,藉由以傾斜調整機構27在第一刻劃線S1之分割時與第二刻劃線S2之分割時變更裂斷棒19之傾斜,可使裂斷棒19與基板100A之平行度變高。若為習知技術,在刻劃線S1分割時與刻劃線S2分割時裂斷棒會旋轉90度,故難以維持裂斷棒之相對於基板表面之平行度。其原因在於,通常被載置於載置部之基板之傾斜在X方向與Y方向不同。
As shown in FIG. 20, the split rod 19 is moved in the first horizontal direction by the first slide driving mechanism 85, and then the split rod 19 sequentially divides the plurality of second score lines S2 in the state of the second posture. Broken. Thereby, the unit substrate 113 is formed. Further, as described above, since the parallelism between the pressing blade 23d of the splitting bar 19 and the surface of the substrate 100A is high, the second scribe line S2 is accurately divided.
With this device, by the inclination adjustment mechanism 27 changing the inclination of the split rod 19 at the time of division of the first scribe line S1 and the division of the second scribe line S2, the split rod 19 can be parallel to the substrate 100A. The degree becomes higher. In the conventional technique, when the scribe line S1 is divided and the scribe line S2 is divided, the rupture rod is rotated by 90 degrees, so that it is difficult to maintain the parallelism of the rupture rod with respect to the substrate surface. The reason for this is that the inclination of the substrate which is usually placed on the placing portion is different from the Y direction in the X direction.

2、其他實施形態
以上,雖針對本發明之一實施形態進行了說明,但本發明並非限定於上述實施形態者,在不脫離發明之要旨之範圍內可進行各種變更。尤其是,記載於本說明書之複數個實施形態及變形例可配合需要而任意組合。

[產業上之可利用性]
2. Other Embodiments Although the embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above, and various modifications can be made without departing from the scope of the invention. In particular, the plurality of embodiments and modifications described in the present specification can be arbitrarily combined as needed.

[Industrial availability]

本發明可廣泛適用於將由玻璃、陶瓷、半導體晶圓等脆性材料構成之基板分斷之基板分斷裝置。The present invention can be widely applied to a substrate breaking device that breaks a substrate made of a brittle material such as glass, ceramics, or a semiconductor wafer.

1‧‧‧基板分斷裝置1‧‧‧Substrate breaking device

3‧‧‧帶式輸送機裝置 3‧‧‧Band conveyor device

9‧‧‧樑 9‧‧‧ beams

11‧‧‧裂斷棒升降裝置 11‧‧‧Cracking rod lifting device

19‧‧‧裂斷棒 19‧‧‧Break

21‧‧‧支持構件 21‧‧‧Support components

21a‧‧‧板狀構件 21a‧‧‧Plate members

22‧‧‧支持部 22‧‧‧Support Department

23‧‧‧棒構件 23‧‧‧ rod components

27‧‧‧傾斜調整機構 27‧‧‧ tilt adjustment mechanism

29‧‧‧錘體 29‧‧‧ Hammer

50‧‧‧控制器 50‧‧‧ Controller

71‧‧‧滑動件基座板 71‧‧‧Slider base plate

75‧‧‧固定部 75‧‧‧Fixed Department

100A‧‧‧基板 100A‧‧‧Substrate

圖1係顯示本發明之第一實施形態之基板分斷裝置之立體圖。Fig. 1 is a perspective view showing a substrate cutting device according to a first embodiment of the present invention.

圖2係圖1之部分擴大圖,是裂斷棒升降裝置之立體圖。 Fig. 2 is a partially enlarged view of Fig. 1 and is a perspective view of the split rod lifting device.

圖3係裂斷棒升降裝置之前視圖。 Figure 3 is a front view of the split-bar lifting device.

圖4係裂斷棒升降裝置之後視圖。 Figure 4 is a rear view of the split bar lifting device.

圖5係裂斷棒之立體圖。 Figure 5 is a perspective view of a split bar.

圖6係圖5之部分擴大圖。 Figure 6 is a partial enlarged view of Figure 5.

圖7係裂斷棒升降裝置之側面圖。 Figure 7 is a side elevational view of the split bar lifting device.

圖8係裂斷棒之前端部分之剖面圖。 Figure 8 is a cross-sectional view of the front end portion of the splitting bar.

圖9係裂斷棒傾斜調整機構之立體圖。 Figure 9 is a perspective view of the split bar tilt adjustment mechanism.

圖10係裂斷棒傾斜調整機構之前視圖。 Figure 10 is a front view of the split bar tilt adjustment mechanism.

圖11係圖10之XI-XI剖面圖。 Figure 11 is a cross-sectional view taken along line XI-XI of Figure 10.

圖12係圖10之XII-XII剖面圖。 Figure 12 is a cross-sectional view taken along line XII-XII of Figure 10.

圖13係顯示基板分斷裝置之控制構成之方塊圖。 Figure 13 is a block diagram showing the control structure of the substrate breaking device.

圖14係顯示基板分斷動作之示意圖。 Fig. 14 is a view showing the breaking operation of the substrate.

圖15係顯示基板分斷動作之一狀態之俯視圖。 Fig. 15 is a plan view showing one state of the substrate breaking operation.

圖16係顯示基板分斷動作之一狀態之俯視圖。 Fig. 16 is a plan view showing one state of the substrate breaking operation.

圖17係顯示基板分斷動作之一狀態之俯視圖。 Fig. 17 is a plan view showing one state of the substrate breaking operation.

圖18係顯示基板分斷動作之一狀態之俯視圖。 Fig. 18 is a plan view showing one state of the substrate breaking operation.

圖19係顯示基板分斷動作之一狀態之俯視圖。 Fig. 19 is a plan view showing one state of the substrate breaking operation.

圖20係顯示基板分斷動作之一狀態之俯視圖。 Fig. 20 is a plan view showing one state of the substrate breaking operation.

Claims (6)

一種基板分斷裝置,用來將形成有互相正交之複數個第一刻劃線及複數個第二刻劃線之基板分斷,其特徵在於,具備: 基座; 裂斷棒,可藉由從前述基座往下方移動而將基板分割,且具有可裝卸地被支持於前述基座之基座構件、和連結於前述基座構件且用來接觸前述基板之棒構件; 第一驅動機構,使前述基座於第一水平方向移動; 第二驅動機構,使前述基座於正交於第一水平方向之第二水平方向移動; 轉動機構,使前述裂斷棒在相對於前述基座延伸於第一水平方向之第一姿勢與延伸於第二水平方向之第二姿勢之間轉動;以及 傾斜調整機構,藉由將前述棒構件之兩端之至少一方相對於前述基座構件上下動而可調整前述棒構件之傾斜。A substrate breaking device for dividing a substrate formed with a plurality of first scribe lines and a plurality of second scribe lines orthogonal to each other, wherein: Pedestal a split bar that can be divided by a base member that is detachably supported by the base by moving downward from the base, and a rod that is coupled to the base member and that contacts the substrate member; a first driving mechanism that moves the base in a first horizontal direction; a second driving mechanism, the base is moved in a second horizontal direction orthogonal to the first horizontal direction; a rotating mechanism that rotates the split bar between a first posture extending in a first horizontal direction relative to the base and a second posture extending in a second horizontal direction; The tilt adjustment mechanism adjusts the tilt of the rod member by moving at least one of both ends of the rod member up and down with respect to the base member. 如申請專利範圍第1項記載之基板分斷裝置,其中, 前述傾斜調整機構,具有: 馬達,固定於前述基座構件;以及 動力傳達機構,將前述馬達之旋轉力變換為上下方向後往前述棒構件傳達。The substrate breaking device according to the first aspect of the patent application, wherein The aforementioned tilt adjustment mechanism has: a motor fixed to the aforementioned base member; The power transmission mechanism converts the rotational force of the motor into a vertical direction and transmits the torque to the rod member. 如申請專利範圍第1項記載之基板分斷裝置,其進一步具備: 導引部,將前述棒構件相對於前述基座構件於上下方向導引。The substrate breaking device according to claim 1, further comprising: The guide portion guides the rod member in the vertical direction with respect to the base member. 如申請專利範圍第2項記載之基板分斷裝置,其進一步具備: 導引部,將前述棒構件相對於前述基座構件於上下方向導引。The substrate breaking device according to claim 2, further comprising: The guide portion guides the rod member in the vertical direction with respect to the base member. 如申請專利範圍第1至4項中任一項記載之基板分斷裝置,其進一步具備: 上下驅動機構,使前述裂斷棒相對於前述基座上下動。The substrate breaking device according to any one of claims 1 to 4, further comprising: The upper and lower drive mechanisms move the split rod up and down with respect to the base. 如申請專利範圍第5項記載之基板分斷裝置,其進一步具備: 錘體,裝設於前述基座,藉由從前述基座落下而從上方衝撞前述裂斷棒,使前述裂斷棒分斷前述基板。The substrate breaking device according to claim 5, further comprising: The hammer body is mounted on the susceptor, and is dropped from the susceptor to collide with the rupture rod from above, and the rupture rod is divided into the substrate.
TW107144430A 2017-12-15 2018-12-11 Device for dividing substrate capable of maintaining the parallelism of a breaking bar with respect to a substrate while the device for dividing substrate rotates the breaking bar and changes its direction of the extension TW201929062A (en)

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Publication number Priority date Publication date Assignee Title
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Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3601296A (en) * 1968-12-30 1971-08-24 Texas Instruments Inc Device for breaking scribed slices of semiconductor material
US4068788A (en) * 1975-09-29 1978-01-17 Rca Corporation Method for cracking brittle material
JPH03192753A (en) * 1989-12-21 1991-08-22 Sharp Corp Wafer braking device
JP3779237B2 (en) * 2002-07-04 2006-05-24 住友電気工業株式会社 Substrate cutting method and substrate cutting apparatus
CN101596723B (en) * 2002-11-22 2012-05-30 三星钻石工业股份有限公司 Substrate-cutting method
DE10311693B3 (en) * 2003-03-17 2004-12-02 Baumann Gmbh Breaking unit for separating ceramic circuit boards, supports board on pivoted plates and has positioner aligning breaker bar with lines of weakness
TWI249762B (en) * 2003-12-03 2006-02-21 Ind Tech Res Inst Sheet cutting device
JP5353085B2 (en) * 2008-06-23 2013-11-27 三星ダイヤモンド工業株式会社 Holder joint, holder unit, scribe head, and scribe device
JP2010023071A (en) * 2008-07-18 2010-02-04 Mitsuboshi Diamond Industrial Co Ltd Method for machining terminal of laminated substrate
JP5284726B2 (en) * 2008-08-29 2013-09-11 三星ダイヤモンド工業株式会社 Brittle material break device
JP5284725B2 (en) * 2008-08-29 2013-09-11 三星ダイヤモンド工業株式会社 Brittle material break device
JP5438422B2 (en) * 2009-07-31 2014-03-12 三星ダイヤモンド工業株式会社 Method and apparatus for processing brittle material substrate
TWI462885B (en) * 2010-12-13 2014-12-01 Mitsuboshi Diamond Ind Co Ltd Method of breaking the substrate
TWI476163B (en) * 2011-10-07 2015-03-11 Mitsuboshi Diamond Ind Co Ltd Scribe device
JP2014019604A (en) * 2012-07-18 2014-02-03 Mitsuboshi Diamond Industrial Co Ltd Fragile material substrate breaking device
JP5981791B2 (en) * 2012-07-18 2016-08-31 三星ダイヤモンド工業株式会社 Breaking device for brittle material substrate
JP6119550B2 (en) * 2013-10-16 2017-04-26 三星ダイヤモンド工業株式会社 Expander, breaking device and cutting method
JP6243699B2 (en) * 2013-10-25 2017-12-06 三星ダイヤモンド工業株式会社 Fragment material substrate cutting device
JP6481465B2 (en) * 2014-08-21 2019-03-13 三星ダイヤモンド工業株式会社 Breaking method of composite substrate
JP6540272B2 (en) * 2015-06-26 2019-07-10 三星ダイヤモンド工業株式会社 Breaking apparatus and breaking method
JP6627326B2 (en) * 2015-08-20 2020-01-08 三星ダイヤモンド工業株式会社 Break device
JP2017039266A (en) * 2015-08-20 2017-02-23 三星ダイヤモンド工業株式会社 Break device
JP2017039271A (en) 2015-08-20 2017-02-23 三星ダイヤモンド工業株式会社 Break device
JP6716900B2 (en) * 2015-12-04 2020-07-01 三星ダイヤモンド工業株式会社 Cutting device
JP6085384B2 (en) * 2016-03-23 2017-02-22 三星ダイヤモンド工業株式会社 Breaking device for brittle material substrate

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