KR102114025B1 - Apparatus for cutting substrate - Google Patents

Abstract

Substrate cutting apparatus according to an embodiment of the present invention, a transfer unit for transferring a substrate; And an inverting unit for inverting the substrate transferred by the conveying unit, the inverting unit comprising: first and second picker modules spaced apart from each other; A picker elevating module that moves a pair of picker modules in the Z-axis direction; And a picker rotation module that rotates the pair of picker modules about an axis orthogonal to the Z axis, and the pair of picker modules is provided with a plurality of suction pads for adsorbing a substrate, respectively, and the first picker module. The adsorption pad provided and the adsorption pad provided on the second picker module may be arranged to face opposite directions.

Description

Substrate cutting device {APPARATUS FOR CUTTING SUBSTRATE}

The present invention relates to a substrate cutting device for cutting a substrate.

In general, liquid crystal display panels used in flat panel displays, organic electroluminescent display panels, inorganic electroluminescent display panels, transmissive projector substrates, reflective projector substrates, etc. are brittle mother glass panels (hereinafter referred to as 'substrates') ), A unit glass panel cut to a predetermined size (hereinafter referred to as a 'unit substrate') is used.

The process of cutting the substrate includes: a scribing process of forming a scribing line by pressing and moving a scribing wheel made of a diamond-like material along a cutting line to be cut, and a substrate along the scribing line And breaking the substrate by pressing to obtain a unit substrate.

Therefore, since the scribing process and the breaking process must be performed separately to cut the substrate, there is a problem that the number of processes increases.

Republic of Korea Patent Publication No. 10-2007-0070824 (2007.07.04)

The present invention is to solve the problems of the prior art described above, the object of the present invention is to provide a substrate cutting apparatus capable of efficiently cutting a substrate without performing a scribing process and a breaking process individually. have.

Substrate cutting apparatus according to an embodiment of the present invention, a transfer unit for transferring a substrate; And an inverting unit that inverts the substrate transferred by the conveying unit, the inverting unit comprising: first and second picker modules disposed to be spaced apart from each other in the Z axis direction; A picker elevating module for moving the first and second picker modules in the Z-axis direction; And a picker rotation module that rotates the first and second picker modules about an axis orthogonal to the Z axis, and the first and second picker modules are each provided with a plurality of adsorption pads that adsorb substrates. The adsorption pad provided in the 1 picker module and the adsorption pad provided in the second picker module may be arranged to face opposite directions, and the substrate is transferred to one picker module disposed above the first and second picker modules. Then, when one picker module is rotated while supporting the substrate and disposed below, the other picker module may be disposed above and receive another substrate.

The substrate cutting apparatus according to the embodiment of the present invention may further include a conveying unit that conveys the substrate inverted by the inverting unit to the outside, and the conveying unit includes one integral belt having a size corresponding to the size of the substrate. can do.

The substrate cutting apparatus according to the embodiment of the present invention may further include a vacuum source connected to a plurality of adsorption pads, and the first and second picker modules are raised after the substrate is seated on the plurality of adsorption pads. In the meantime, a vacuum can be applied to the plurality of adsorption pads.

The inversion unit may further include a pressure sensor that measures the pressure of each of the plurality of adsorption pads.

The inverting unit may further include a pad height adjuster that is respectively connected to the plurality of adsorption pads to adjust the heights of the plurality of adsorption pads.

A substrate cutting apparatus according to an embodiment of the present invention controls a pad height adjuster based on pressure changes in a plurality of adsorption pads measured by a pressure sensor to control a height of one or more adsorption pads among a plurality of adsorption pads. It may further include.

A substrate cutting apparatus according to an embodiment of the present invention includes: an alignment unit that determines a position of a substrate carried from the outside; A first cutting unit forming first and second X-axis cutting lines parallel to the X-axis direction on first and second surfaces of the substrate, respectively; A second cutting unit forming a first Y-axis cutting line parallel to the Y-axis direction on the first surface of the substrate; A third cutting unit for forming a second Y-axis cutting line parallel to the Y-axis direction on the second surface of the substrate may be further included.

The alignment unit includes a plurality of belts extending in the Y-axis direction and spaced apart at predetermined intervals in the X-axis direction; A belt elevating device connected to a plurality of belts to elevate the plurality of belts; A plurality of floatation devices disposed between the plurality of belts to support the substrate; And a pressing device that presses the side surfaces of the substrate lifted by the plurality of lifting devices.

The first cutting unit may include a first frame extending in the X-axis direction and a first frame movably installed in the X-axis direction and disposed to face each other in the Z-axis direction. And at least one pair of first heads are spaced apart in the Z-axis direction, and each of the first and second cutting wheel modules is provided with a cutting wheel, and the first and second rollers are spaced apart in the Z-axis direction. It may include a second roller module, the cutting wheel of the first cutting wheel module is arranged to coincide with the roller of the second roller module, the cutting wheel of the second cutting wheel module coincides with the roller of the first roller module Can be arranged.

The second cutting unit includes: a second frame extending in the X-axis direction and configured to be movable in the Y-axis direction; A second head movably installed in the X-axis direction on the second frame and having a cutting wheel; A belt on which the substrate is supported; And a support plate disposed to be movable in the Z-axis direction from the lower side of the belt to support the belt when the cutting wheel is pressed against the substrate to support the substrate.

The third cutting unit includes: a third frame extending in the X-axis direction and configured to be movable in the Y-axis direction; A third head movably installed in the X-axis direction on the third frame and having a cutting wheel; A belt on which the substrate is supported; And a support plate disposed to be movable in the Z-axis direction from the lower side of the belt to support the belt when the cutting wheel is pressed against the substrate to support the substrate.

According to the substrate cutting apparatus according to the embodiment of the present invention configured as described above, a plurality of cutting lines, that is, the first and second X-axis cutting line, the first Y-axis cutting line, the second Y-axis cutting line , The substrate may be cut while being sequentially formed by the first cutting unit, the second cutting unit, and the third cutting unit. Therefore, compared to the prior art in which the scribing process and the breaking process are separately performed to cut the substrate, the number of processes can be reduced to improve the efficiency in cutting the substrate.

1 is a block diagram schematically showing a substrate cutting apparatus according to an embodiment of the present invention.
2 is a schematic view showing a substrate cut by a substrate cutting apparatus according to an embodiment of the present invention.
3 is a side view schematically showing an alignment unit of a substrate cutting apparatus according to an embodiment of the present invention.
4 is a plan view schematically illustrating an alignment unit of a substrate cutting apparatus according to an embodiment of the present invention.
5 is a side view schematically showing an alignment unit of a substrate cutting apparatus according to an embodiment of the present invention.
6 is a plan view schematically illustrating a first transfer unit, a first cutting unit, and a second transfer unit of a substrate cutting apparatus according to an embodiment of the present invention.
7 and 8 are side views schematically illustrating a first transfer unit, a first cutting unit, and a second transfer unit of a substrate cutting apparatus according to an embodiment of the present invention.
9 is a side view schematically showing a pressing unit of the first transfer unit of the substrate cutting apparatus according to the embodiment of the present invention.
10 to 13 are views schematically illustrating first and second plates of a substrate cutting apparatus according to an embodiment of the present invention.
14 is a control block diagram of a substrate cutting apparatus according to an embodiment of the present invention.
15 to 25 are views sequentially showing an operation process of the first transfer unit, the first cutting unit, and the second transfer unit of the substrate cutting apparatus according to the embodiment of the present invention.
26 is a side view schematically illustrating a second transfer unit and a second cutting unit of a substrate cutting apparatus according to an embodiment of the present invention.
27 to 29 are views schematically illustrating a process of transferring a substrate from the second transfer unit to the second cutting unit of the substrate cutting apparatus according to the embodiment of the present invention.
30 is a plan view schematically illustrating a second cutting unit of a substrate cutting apparatus according to an embodiment of the present invention.
31 is a side view schematically showing a second cutting unit and a first inverting unit of the substrate cutting apparatus according to the embodiment of the present invention.
32 to 37 are views for explaining the operation of the first inversion unit of the substrate cutting apparatus according to the embodiment of the present invention.
38 is a side view schematically illustrating a first inverting unit and a third cutting unit of a substrate cutting apparatus according to an embodiment of the present invention.
39 is a plan view schematically illustrating a third cutting unit of a substrate cutting apparatus according to an embodiment of the present invention.
40 is a side view schematically showing a third transfer unit of the substrate cutting apparatus according to the embodiment of the present invention.
41 is a diagram schematically showing a third transfer unit of the substrate cutting apparatus according to the embodiment of the present invention.
42 is a control block diagram of a third transfer unit of the substrate cutting apparatus according to the embodiment of the present invention.
43 is a side view schematically showing a third transfer unit and a second inversion unit of the substrate cutting apparatus according to the embodiment of the present invention.
44 is a view schematically showing a second inversion unit of the substrate cutting apparatus according to the embodiment of the present invention.
45 is a control block diagram of a second inverting unit of the substrate cutting apparatus according to the embodiment of the present invention.
46 to 49 are views for explaining the operation of the second inversion unit of the substrate cutting apparatus according to the embodiment of the present invention.

Hereinafter, a substrate cutting apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

The object to be cut by the substrate cutting apparatus according to the embodiment of the present invention is a bonding substrate to which the first substrate and the second substrate are bonded. For example, the first substrate may include a thin film transistor, the second substrate may include a color filter, and vice versa. Hereinafter, the bonded substrate is simply referred to as a substrate, the surface of the first substrate exposed to the outside is referred to as a first surface, and the surface of the second substrate exposed to the outside is referred to as a second surface.

Meanwhile, a direction in which the substrate to be subjected to the substrate cutting process is transferred is defined as a Y-axis direction, and a direction crossing a direction in which the substrate is transferred (Y-axis direction) is defined as an X-axis direction. And, a direction perpendicular to the X-Y plane on which the substrate is placed is defined as a Z-axis direction.

1 and 2, a substrate cutting apparatus according to an embodiment of the present invention includes an alignment unit 100 for determining the position of a substrate carried from the outside, and a first surface S1 of the substrate S ) And a first cutting unit 200 forming first and second X-axis cutting lines XL1 and XL2 parallel to the X-axis direction on the second surface S2 and the first surface of the substrate S A second cutting unit 300 forming a first Y-axis cutting line YL1 parallel to the Y-axis direction in (S1) and a substrate S inverting the substrate S on which the first Y-axis cutting line YL1 is formed 1 inverting unit 400, a third cutting unit 500 forming a second Y-axis cutting line YL2 parallel to the Y-axis direction on the second surface S2 of the substrate S, and an alignment unit ( 100) and the first cutting unit 200 and the first cutting unit 600 for transferring the substrate from the alignment unit 100 to the first cutting unit 200, the first cutting unit 200 and the The second transfer unit 700 is disposed between the two cutting units 300 to transfer the substrate from the first cutting unit 200 to the second cutting unit 300, and the third cutting unit 500 cuts the A third transfer unit 800 for taking the substrate out, and a second reversing unit 1400 for reversing the substrate S so as to control the direction in which both surfaces of the substrate transferred by the third transfer unit 800 are directed. , A transfer unit 1500 for conveying the substrate S inverted by the second inversion unit 1400 to the outside, and a control unit 1000 for controlling the operation of the components of the substrate cutting device.

Alignment unit 100, first cutting unit 200, second cutting unit 300, first reversing unit 400, third cutting unit 500, second reversing unit 1400, conveying unit 1500 ) Are arranged horizontally and parallel to the ground. Therefore, the substrate S is the alignment unit 100, the first cutting unit 200, the second cutting unit 300, the first inversion unit 400, the third cutting unit 500, the second inversion unit ( 1400), while continuously transporting the transport unit 1500 horizontally, a process of cutting the substrate S may be performed.

2, the substrate cutting apparatus according to the embodiment of the present invention is the first and second X-axis cutting line (XL1) on the first surface (S1) and the second surface (S2) of the substrate (S), XL2) are respectively formed, the first Y-axis cutting line YL1 is formed on the first surface S1 of the substrate S, the substrate S is inverted, and the second surface S2 of the substrate S ), A second Y-axis cutting line YL2 is formed, and the substrate S is cut into a unit substrate.

3 to 5, the alignment unit 100 extends in the direction in which the substrate S is transported (Y-axis direction) and is disposed at a predetermined interval in the X-axis direction, a plurality of belts 110 ), A belt lifting device 120 connected to the plurality of belts 110 to elevate the plurality of belts 110, and a plurality of lifting devices disposed between the plurality of belts 110 to support the substrate S It may include a pressing device 140 for pressing the side surface of the substrate (S) supported by the plurality of flotation devices 130 and 130.

Each of the plurality of belts 110 may be supported by a plurality of pulleys 111. At least one of the plurality of pulleys 111 may be a drive pulley providing a driving force for rotating the belt 110.

The belt lifting device 120 may be composed of a pneumatic or hydraulically operated actuator connected to a plurality of pulleys 111, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism. .

The plurality of flotation devices 130 may include a plurality of gas injection nozzles 131 connected to a gas supply source (not shown). The plurality of gas injection nozzles 131 may be spaced apart at predetermined intervals in the Y-axis direction.

The pressing device 140 moves the pressing member 141 which presses the side surface of the substrate S, and the pressing member that moves the pressing member 141 in a direction toward the substrate S and a direction away from the substrate S Device 142 may be included. A plurality of pressing members 141 may be disposed to press at least two sides facing each other of the substrate S. The pressing member 141 may have a shape corresponding to the side surface of the substrate S so as to press the side surface of the substrate S. As another example, the pressing member 141 may have a shape corresponding to the corner portion of the substrate S so as to press the corner portion of the substrate S.

According to such a configuration, as shown in FIG. 3, in a process in which the substrate S is brought into the alignment unit 100 from the outside, a plurality of belts 110 are raised from the plurality of flotation devices 130 To maintain. And, as the plurality of belts 110 are rotated, the substrate S may be moved to a predetermined position between the plurality of pressing members 141.

And, as shown in Figures 4 and 5, when the substrate (S) is moved to a predetermined position on the plurality of belts 110, the plurality of belts 110 are lowered from the gas injection nozzle 131 at the same time Gas is injected toward the substrate S, and the substrate S is supported by the injected gas.

Then, in the state where the substrate S is floated, the pressing member 141 presses the side surface of the substrate S by the operation of the pressing member moving device 142, and accordingly, the substrate S is translated or The position and posture of the substrate S may be determined while rotating.

Then, after the position and posture of the substrate S are determined, the injection of the gas from the gas injection nozzle 131 is stopped, and at the same time, the plurality of belts 110 rises, and accordingly, the substrate S is The position may be supported on the plurality of belts 110 in a determined state.

And, the substrate S is taken out from the alignment unit 100 by rotation of the plurality of belts 110, and at the same time, while the first transfer unit 600 is operating, the substrate S is the first cutting unit ( 200).

6 to 9, the first transfer unit 600 is installed between the plurality of belts 610 supporting the substrate S and the alignment unit 100 and the first cutting unit 200. The first gripping unit 630 and the first gripping unit for gripping and transferring the trailing end of the substrate S supported on the plurality of belts 610, and the shuttle unit 620 which adsorbs and transports the substrate S The first guide rail 640 connected to the 630 and extending in the Y-axis direction, and the substrate S by pressing the trailing end of the substrate S when the substrate S is carried on the plurality of belts 610 ), And a first plate 660 disposed adjacent to the first cutting unit 200 to support or adsorb the substrate S.

The plurality of belts 610 may be spaced apart from each other in the X-axis direction. Each belt 610 is supported by a plurality of pulleys 611, and at least one of the plurality of pulleys 611 may be a drive pulley providing a driving force for rotating the belt 610.

The plurality of belts 610 of the first transfer unit 600 are disposed on the same plane adjacent to the plurality of belts 110 of the alignment unit 100 such that the substrate S is a plurality of belts of the alignment unit 100. It can be transferred directly from the 110 to a plurality of belts 610 of the first transfer unit 600.

As illustrated in FIG. 6, the shuttle unit 620 includes a rail 621 extending in the Y-axis direction, a shuttle member 622 configured to be movable along the rail 621, and a shuttle member 622. It may include a shuttle member lifting device 623 for lifting in the Z-axis direction.

Between the shuttle member 622 and the rail 621, a pneumatic or hydraulic actuator may be provided, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism. Therefore, the shuttle member 622 may be moved in the Y-axis direction along the rail 621 by a linear movement mechanism.

The rail 621 extends to the alignment unit 100, and accordingly, the shuttle member 622 may be moved from the alignment unit 100 to the first transfer unit 600.

The shuttle member 622 is connected to a vacuum source and is configured to adsorb the substrate S. Therefore, as the shuttle member 622 is moved in the Y-axis direction while the substrate S is adsorbed, the substrate S may be moved in the Y-axis direction.

The shuttle member 622 serves to transfer the substrate S from the alignment unit 100 to the first transport unit 600 while moving reciprocally between the alignment unit 100 and the first transport unit 600. do.

The shuttle member lifting device 623 may be composed of a shuttle member 622 and a pneumatic or hydraulic actuator, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism. The shuttle member lifting device 623 raises the shuttle member 622 when transferring the substrate S so that the shuttle member 622 can adsorb the substrate S. Then, after the substrate S is transferred to the first transfer unit 600 by the shuttle member 622, the shuttle member lifting device 623 lowers the shuttle member 622 so that the shuttle member 622 is transferred to the substrate. (S), the pusher 652 and the first gripping unit 630 to prevent interference.

Between the first gripping unit 630 and the first guide rail 640, a pneumatic or hydraulically actuated actuator, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism may be provided. have. Therefore, as the first gripping unit 630 is moved in the Y-axis direction by the linear movement mechanism while the first gripping unit 630 grips the substrate S, the substrate S is transferred in the Y-axis direction. Can be. At this time, the plurality of belts 610 may stably support the substrate S while rotating with the movement of the first gripping unit 630.

The first gripping unit 630 extends in the X-axis direction and is provided with a plurality of support bars 631 connected to the first guide rails 640 and support bars 631 to hold the substrate S. (632). The gripping member 632 may be a clamp that presses and holds the substrate S. As another example, the gripping member 632 may be configured to adsorb the substrate S by having a vacuum hole connected to a vacuum source.

The pressing unit 650 includes a rail 651 extending in the Y-axis direction, a pusher 652 configured to be movable along the rail 651, and a pusher lifting device for elevating the pusher 652 in the Z-axis direction ( 653).

Between the pusher 652 and the rail 651, a pneumatic or hydraulically actuated actuator, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism may be provided. Therefore, the pusher 652 can be moved in the Y-axis direction along the rail 651 by a linear movement mechanism.

The pusher hoisting device 653 may be composed of a pneumatic or hydraulically operated actuator connected to the pusher 652, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism. The pusher lifting device 653 raises the pusher 652 so that the pusher 652 can press the trailing end of the substrate S, and after the pusher 652 presses the trailing end of the substrate S, The pusher lifting device 653 lowers the pusher 652 to prevent the pusher 652 from interfering with the substrate S, the shuttle member 622, and the first gripping unit 630.

With the substrate S positioned on the plurality of belts 610, the pressing unit 650 pushes the trailing end of the substrate S so that the substrate S can be positioned at the correct position P.

As another example, in the process of the shuttle member 622 adsorbing the leading end of the substrate S and transferring it in the Y-axis direction, when the trailing end of the substrate S passes through the pusher 652, the pusher 652 Is moved at a higher speed than the movement speed of the substrate S, and then contacts the trailing end of the substrate S, and then the pusher 652 is synchronized with the movement speed of the substrate S by the shuttle member 622. It can be moved at the same speed as (S).

As another example, in the process in which the substrate S is transferred in the Y-axis direction by the rotation of the plurality of belts 610, the pusher 652 moves at a higher speed than the moving speed of the substrate S to move the substrate ( After contacting the trailing end of S), the pusher 652 can be moved at the same speed as the substrate S in synchronization with the movement speed of the substrate S.

The substrate S may be moved on the belt 610 without being shaken by the pusher 652 and positioned in a fixed position.

The first plate 660 may be configured to support or adsorb the substrate S. For example, a plurality of slots connected to a gas source and a vacuum source may be formed on the surface of the first plate 660. When gas is supplied from a gas supply source to a plurality of slots of the first plate 660, the substrate S may be lifted from the first plate 660. In addition, when gas is sucked into a plurality of slots of the first plate 660 by a vacuum source, the substrate S may be adsorbed to the first plate 660.

The substrate S may be moved without friction with the first plate 660 in a state where the substrate S is floated from the first plate 660. In addition, in the process of forming the first and second X-axis cutting lines XL1 and XL2 on the first surface S1 and the second surface S2 of the substrate S, the substrate S is the first plate ( 660) may be adsorbed and fixed.

6 to 8, the first cutting unit 200 includes first X-axis cutting lines XL1 and second on the first surface S1 and the second surface S2 of the substrate S. It is configured to form the X-axis cutting line (XL2), respectively.

The first cutting unit 200 includes a first frame 210 extending in the X-axis direction and a first head 220 movably installed in the X-axis direction on the first frame 210. The first frame 210 may be provided with a plurality of first heads 220 in the X-axis direction.

Also, at least one pair of first heads 220 may be installed on the first frame 210 so as to face each other in the Z-axis direction.

At least one pair of first heads 220 are arranged to be spaced apart in the Z-axis direction, and each of the first and second cutting wheel modules 221 including the cutting wheels 225 to be spaced apart in the Z-axis direction, respectively It may include a first and second roller module 222 having a roller 229.

The cutting wheel 225 of the first cutting wheel module 221 is arranged to coincide with the roller 229 of the second roller module 222, and the cutting wheel 225 of the second cutting wheel module 221 is made of The rollers 229 of the one roller module 222 are arranged to match each other.

The cutting wheel 225 of the first cutting wheel module 221 and the roller 229 of the first roller module may be pressed on the first surface S1, and the cutting wheel 225 of the second cutting wheel module 222 may be pressed. ) And the roller 229 of the second roller module may be pressed onto the second surface S2.

Accordingly, in a state in which the plurality of cutting wheels 225 and the plurality of rollers 229 are respectively pressed against the first surface S1 and the second surface S2, the first head 220 is attached to the substrate S. By relatively moving in the X-axis direction, first and second X-axis cutting lines XL1 and XL2 may be formed on the first surface S1 and the second surface S2, respectively.

Meanwhile, the cutting wheel 225 of the first cutting wheel module 221 and the cutting wheel 225 of the second cutting wheel module 221 may be spaced apart in the Y-axis direction, and the rollers of the first roller module 222 may be separated. 229 and the roller 229 of the second roller module 222 may be spaced apart in the Y-axis direction. Accordingly, the first and second X-axis cutting lines XL1 and XL2 may be spaced apart from each other in the Y-axis direction.

Therefore, as shown in FIG. 2, after the substrate S is cut, the first and second X-axis cutting lines XL1 and XL2 have Y-axis widths that are spaced apart from each other in the Y-axis direction. A stepped portion YS may be formed, and a wire and / or an electrode connected to the wire may be formed on the Y-axis stepped portion YS.

Each of the first and second cutting wheel modules 221 may include a wheel moving module 230 that moves the cutting wheel 225 in the Z-axis direction to press the cutting wheel 225 against the substrate S. have. The cutting wheel 225 may be brought into contact with the surface of the substrate S by the wheel movement module 230 and may be pressed against the surface of the substrate S with a predetermined pressing force. For example, the wheel movement module 230 moves the cutting wheel 225 vertically with respect to the substrate S by moving the cutting wheel module 221 perpendicular to the substrate S (Z-axis direction). I can do it. The wheel movement module 230 serves to adjust the position of the cutting wheel 225 with respect to the substrate (S).

The wheel movement module 230 may be an actuator that is connected to the cutting wheel module 221 and moves the cutting wheel module 221 in the Z-axis direction by hydraulic or pneumatic. However, the present invention is not limited to this configuration, and the wheel movement module 230 may be configured as a linear movement mechanism such as a linear motor or a ball screw mechanism operated by electromagnetic interaction.

On the other hand, as shown in Figures 15 to 25, the substrate cutting apparatus according to an embodiment of the present invention, the dummy portion (cullet), located on the edge of the leading edge and the trailing edge of the substrate (S), That is, the dummy removal unit 900 may be further included to hold the non-effective area that is not used as a unit substrate but is discarded after being cut and removed from the substrate S.

The dummy removal unit 900 may be disposed between the first transfer unit 600 and the second transfer unit 700.

The dummy removing unit 900 moves the clamp 910 vertically and horizontally through the clamp 910 gripping the ineffective area of the substrate S, and moves the clamp 910 horizontally (X-axis) and vertical axis (Z-axis). It may include a clamp driving device 920 to rotate about.

The clamp 910 may include a pair of clamp members that are moved adjacent to each other or spaced apart from each other. The substrate S can be held by the clamp member by moving a pair of clamp members adjacent to each other with the substrate S interposed therebetween.

For example, the clamp driving device 920 may be a multi-axis robot including a plurality of arms connected to the clamp 910.

6 to 25, the second transfer unit 700 is disposed adjacent to the first cutting unit 200 to support or support the second plate 760 by supporting the substrate S And a belt 710 connected to the second plate 760 and a moving device 730 moving the second plate 760 and the belt 710 reciprocally in the Y-axis direction.

In addition, the second transfer unit 700 may optionally include a lifting device 740 for lifting the belt 710.

The second plate 760 and the belt 710 may be configured to be movable in the Y-axis direction together. That is, the second plate 760 and the belt 710 may be configured to be movable together in a direction parallel to the direction in which the substrate S is transferred (Y-axis direction).

When the first and second X-axis cutting lines XL1 and XL2 are respectively formed on the first surface S1 and the second surface S2 of the substrate S by the first cutting unit 200, the second The plate 760 is moved toward the first plate 660, and the first head 220 may be positioned between the first plate 660 and the second plate 760. When the first and second X-axis cutting lines XL1 and XL2 are respectively formed on the first surface S1 and the second surface S2 of the substrate S by the first cutting unit 200, the second The plate 760 is moved toward the first plate 660 so that the substrate S can be supported on both the first plate 660 and the second plate 760.

A plurality of belts 710 may be provided, and the plurality of belts 710 may be spaced apart from each other in the X-axis direction. Each belt 710 is supported by a plurality of pulleys 711, and at least one of the plurality of pulleys 711 may be a drive pulley providing a driving force for rotating the belt 710.

The second plate 760 may be configured to support or adsorb the substrate S. For example, a plurality of slots connected to a gas source and a vacuum source may be formed on the surface of the second plate 760. When gas is supplied from a gas supply source to a plurality of slots of the second plate 760, the substrate S may be lifted from the second plate 760. In addition, when gas is sucked into the plurality of slots of the second plate 760 by the vacuum source, the substrate S may be adsorbed to the second plate 760.

In the process of transferring the substrate S to the second plate 760, gas is supplied to the slot of the second plate 760, and accordingly, the substrate S is to be moved without friction with the second plate 760. Can be.

In the process of forming the first and second X-axis cutting lines XL1 and XL2 on the first surface S1 and the second surface S2 of the substrate S, the substrate S is the second plate 760 It can be adsorbed on and fixed.

In the process of moving the substrate S from the second plate 760 to a subsequent process, gas is supplied to the slots of the second plate 760, whereby the substrate S rubs against the second plate 760 Can be moved without.

In addition, the second transfer unit 700 may further include a plate elevating module 750 that elevates the second plate 760. The plate lifting module 750 may be installed at a lower portion of the rail 720 extending in the Y-axis direction to be configured to lift the second plate 760 and the belt 710 together. However, the present invention is not limited to this, and the plate lifting module 750 may be configured to be connected to the second plate 760 to elevate the second plate 760. According to an embodiment of the present invention, the second plate 760 may be raised or lowered by one plate lifting module 750. However, the present invention is not limited to this, and instead of the plate elevating module 750, the plate descending module 751 for lowering the second plate 760 or the plate elevating module 752 for raising the second plate 760 is provided. It may be provided.

With the plate lifting module 750, the plate lowering module 751, or the plate raising module 752, a linear movement such as an actuator operated by pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism Mechanisms can be applied.

As shown in FIG. 10, in the process of transferring the substrate S from the first plate 660 to the second plate 760, the second plate 760 is a predetermined distance by the plate lowering module 751 Can be lowered to Accordingly, when the leading end of the substrate S enters the upper portion of the second plate 760, collision with the leading end of the second plate 760 can be prevented.

In addition, as shown in FIG. 11, in the process where the second plate 760 is moved from the first plate 660 and the substrate S is divided, the second plate 760 is attached to the plate raising module 752. Can be raised to a predetermined distance. Accordingly, stress may be concentrated along the first and second X-axis cutting lines XL1 and XL2 formed on the substrate S, and accordingly, the substrate S may include the first and second X-axis cutting lines ( XL1, XL2).

In addition, when the plate elevating module 750 for elevating the second plate 760 is provided, in a process in which the substrate S is divided, the second plate 760 is moved to a predetermined distance by the plate elevating module 760. It can rise and fall. The rise and fall of the second plate 760 may be repeated a predetermined number of times. Accordingly, the stress may be concentrated along the first and second X-axis cutting lines XL1 and XL2 formed on the substrate S, and thus, the stress may be the first and second substrate S. It can be divided smoothly along the X-axis cutting lines (XL1, XL2).

This effect can occur equally not only when the substrate S is divided into unit substrates, but also when the dummy portion is removed from the substrate S.

Meanwhile, as illustrated in FIG. 12, the first plate 660 may be provided to be inclined at a predetermined angle A1 in the transfer direction of the substrate S. Similarly, the second plate 760 may also be provided to be inclined at a predetermined angle A2 in the transfer direction of the substrate S. That is, the first plate 660 and the second plate 760 may have surfaces inclined at a predetermined angle with respect to the substrate S.

In an embodiment of the present invention, both the first plate 660 and the second plate 760 may be provided to be inclined. At this time, the first plate 660 and the second plate 760 may be formed to be inclined in the same direction. However, the present invention is not limited thereto, and only one of the first plate 660 and the second plate 760 may be inclined.

For example, the first plate 660 may be provided to be inclined downward at a predetermined angle A1 in the transfer direction of the substrate S. As another example, the first plate 660 may be provided to be inclined upward at a predetermined angle A1 in the transfer direction of the substrate S.

In addition, the second plate 760 may be provided to be inclined downward at a predetermined angle A2 in the transport direction of the substrate S. As another example, the second plate 760 may be provided to be inclined upward at a predetermined angle A2 in the transfer direction of the substrate S.

In an embodiment of the present invention, the first plate 660 is provided to be inclined downward at a predetermined angle A1 in the transfer direction of the substrate S, and the second plate 760 is predetermined in the transfer direction of the substrate S It is provided to be inclined downward at an angle (A2).

According to this configuration, as shown in Figure 13, the second plate 760 is moved from the first plate 660, the first and second X-axis cutting line (XL1, XL2) substrate (S) is divided In the process, slip (friction) is prevented between the ends P1 and P2 of the two divided unit substrates. Accordingly, it is possible to prevent the substrate S from being damaged by slip (friction) between the divided ends of the two unit substrates P1 and P2 and scratches or static electricity caused by the slip.

This effect can occur equally not only when the substrate S is divided into unit substrates, but also when the dummy portion is removed from the substrate S.

The moving device 730 serves to reciprocally move the second plate 760 and the belt 710 along the rail 720 extending in the Y-axis direction in the Y-axis direction. As the moving device 730, a linear movement mechanism such as an actuator operated by pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism may be applied.

22, after the first and second X-axis cutting lines XL1 and XL2 are formed on the substrate S, the substrate S is attached to the first plate 660 and the second plate 760. In the adsorbed state, when the second plate 760 is moved away from the first plate 660 by the moving device 730, the substrate S is the first and second X-axis cutting lines (XL1, XL2) It can be divided along.

As illustrated in FIG. 14, the mobile device 730 may be connected to the control unit 1000 and controlled by the control unit 1000. A load measurement module 1100 for measuring a load of the mobile device 730 may be connected to the mobile device 730.

For example, when the moving device 730 is a linear moving mechanism including a rotating motor, the load of the moving device 730 may be torque. The load of the mobile device 730 will increase while the mobile device 730 moves the second plate 760 to divide the substrate S along the first and second X-axis cutting lines XL1 and XL2. Can be. In addition, the load of the mobile device 730 may be reduced at the time when the substrate S is divided.

The load of the moving device 730 moving the second plate 760 to divide the substrate S may vary according to the pressing force applied by the cutting wheel 225 to the substrate S. For example, when the pressing force of the cutting wheel 225 decreases, since the cutting depth of the cutting wheel 225 decreases, the substrate S becomes difficult to be divided, so the moving device 730 measured when the substrate S is divided ) Will increase the load. Conversely, when the pressing force of the cutting wheel 225 increases, the cutting depth of the cutting wheel 225 increases, so that the substrate S is easily divided, so that the moving device 730 measured when the substrate S is divided The load is reduced.

Accordingly, the pressing force applied by the cutting wheel 225 to the substrate S may be adjusted based on the load of the moving device 730 measured when the substrate S is divided.

For example, when the use of the cutting wheel 225 is increased because the cutting wheel 225 is repeatedly used, the cutting wheel 225 may be worn. As the cutting wheel 225 wears, the diameter of the cutting wheel 225 decreases, and the cutting depth of the cutting wheel 225 decreases. Accordingly, since the pressing force applied by the cutting wheel 225 to the substrate S is reduced, the load of the mobile device 730 measured when the substrate S is divided can be increased. In this case, by increasing the pressing force applied to the substrate S by the cutting wheel 225, even when the cutting wheel 225 is worn, the shape of the cutting line formed on the substrate S can be uniformly and uniformly maintained. . In addition, in order to increase the pressing force applied to the substrate S by the cutting wheel 225, the wheel movement module 230 may further move the cutting wheel 225 toward the substrate S.

The load measurement module 1100 measures the load of the mobile device 730 when the substrate S is divided. The control unit 1000 may adjust the pressing force applied by the cutting wheel 225 to the substrate S based on the load of the mobile device 730 measured by the load measuring module 1100. To this end, experiments or simulations of measuring the load of the mobile device 730 when the substrate S is divided while changing the pressing force applied to the substrate S may be preceded. By this experiment or simulation, data regarding a load change of the mobile device 730 according to a change in the pressing force applied by the cutting wheel 225 to the substrate S may be obtained.

Further, the load of the mobile device 730 when the substrate S is appropriately divided can be preset as a reference load. The reference load may vary depending on the characteristics of the substrate S, such as the thickness and material of the substrate S. Therefore, a plurality of reference loads according to the characteristics of the substrate S may be set in advance by experiment or simulation.

The control unit 1000 may compare the load of the mobile device 730 measured when the substrate S is divided with a reference load, and determine whether an appropriate pressing force is applied to the substrate S.

When the load measured when the substrate S is divided is within the range of the reference load, the control unit 1000 may determine that a pressing force for properly dividing the substrate S is applied to the substrate S. . In addition, when the measured load is outside the range of the reference load, the control unit 1000 may determine that an excessively large or small pressing force is applied to the substrate S.

When the load of the mobile device 730 measured when the substrate S is divided is less than the reference load, the control unit 1000 determines that a pressing force exceeding the appropriate pressing force is applied to the substrate S, and the wheel moves. By controlling the module 230, the cutting wheel 225 is moved in a direction away from the substrate S. Accordingly, the pressing force applied to the substrate S by the cutting wheel 225 is reduced, so that the load of the mobile device 730 required to divide the substrate S can be increased.

Further, when the load of the mobile device 730 measured when the substrate S is divided exceeds the reference load, the control unit 1000 determines that a pressing force less than an appropriate pressing force is applied to the substrate S, The wheel movement module 230 is controlled to further move the cutting wheel 225 toward the substrate S. Accordingly, the pressing force applied by the cutting wheel 225 to the substrate S increases, so that the load of the mobile device 730 required to divide the substrate S can be reduced.

As described above, when the load of the moving device 730 when the substrate S is divided is outside the range of the reference load, the pressing force applied by the cutting wheel 225 to the substrate S is adjusted to move the moving device 730. Can keep the load of within the range of the reference load. Therefore, the substrate S can be divided while the mobile device 730 operates within an optimal reference load range. In addition, it is possible to prevent the load of the mobile device 730 from excessively increasing or decreasing.

In addition, even when the pressing force applied to the substrate S is changed due to wear of the cutting wheel 225 or the like, the wheel moving module 230 is controlled based on the load of the moving device 730, so that the cutting wheel 225 The pressing force can be adjusted automatically. Therefore, even when the cutting wheel 225 is worn, the degree to which the cutting wheel 225 is pressed against the substrate S may be kept constant, and accordingly, a uniform and constant cutting line may be formed on the substrate S. Can be.

On the other hand, when the pressing force applied to the substrate S due to the defect of the cutting wheel 225 is very low, the load of the mobile device 730 may increase excessively. In this case, the control unit 1000 may recognize this situation as a failure of the substrate cutting device and stop the operation of the substrate cutting device.

Hereinafter, operations of the first transfer unit 600, the first cutting unit 200, and the second transfer unit 700 will be described with reference to FIGS. 15 to 25.

As shown in FIG. 15, the substrate S is transferred to the first cutting unit 200 in a state where the dummy portion is not removed at the leading end of the substrate S. At this time, the substrate S may be floated from the first plate 660 by gas injected from the first plate 660.

Then, when the substrate S is positioned on the first plate 660, the substrate S is adsorbed to the first plate 660. At this time, after the cutting wheels 225 of the first and second cutting wheel modules 221 and 222 contact the substrate S, respectively, as they are moved in the X-axis direction, the first of the dummy portions of the substrate S And second X-axis cutting lines XL1 and XL2.

Then, as shown in FIGS. 16 and 17, the clamp 910 of the dummy removal unit 900 moves to the dummy portion of the substrate S on which the first and second X-axis cutting lines XL1 and XL2 are formed. do. Then, after the clamp 910 grips the dummy portion of the substrate S, while rotating or moving horizontally, the dummy portion is removed from the substrate S. The clamp 910 from which the dummy portion is removed returns to the original position that does not interfere with the movement of the cutting wheels 225 of the first and second cutting wheel modules 221 and 222.

And, as shown in FIG. 18, the second plate 760 moves in the Y-axis direction toward the first plate 660 while the first plate 660 is fixed. Accordingly, the distance between the first plate 660 and the second plate 760 is reduced, so that the substrate S can be supported on both the first plate 660 and the second plate 760.

Then, as shown in FIG. 19, the substrate S is transferred toward the second transfer unit 700. At this time, the substrate S may be supported from the first plate 660 and the second plate 760 by the gas supplied to the first plate 660 and the second plate 760.

And, as shown in Figure 20, when the substrate S is located on the first plate 660 and the second plate 760, the substrate S is the first plate 660 and the second plate 760 Is adsorbed on. At this time, after the cutting wheels 225 of the first and second cutting wheel modules 221 and 222 contact the substrate S, respectively, as they are moved in the X-axis direction, the first and second substrates S and 2 are moved. X-axis cutting lines XL1 and XL2 are formed.

Then, as shown in FIGS. 21 and 22, after the first and second X-axis cutting lines XL1 and XL2 are formed on the substrate S, the first and second cutting wheel modules 221 and 222 The cutting wheel 225 is moved away from the substrate (S). Then, in a state where the substrate S is adsorbed to the first plate 660 and the second plate 760, when the second plate 760 is moved away from the first plate 660, the substrate S It is divided along the first and second X-axis cutting lines XL1 and XL2.

On the other hand, as shown in FIG. 23, after dividing the middle portion of the substrate S, the substrate S is the first cutting unit 200 in a state where the dummy portion is not removed at the trailing end of the substrate S Is transferred to. At this time, it may be supported from the second plate 760 by the gas injected from the second plate 760.

Then, when the substrate S is positioned on the second plate 760, the substrate S is adsorbed to the second plate 760. At this time, after the cutting wheels 225 of the first and second cutting wheel modules 221 and 222 contact the substrate S, respectively, as they are moved in the X-axis direction, the first of the dummy portions of the substrate S And second X-axis cutting lines XL1 and XL2.

Then, as shown in FIGS. 24 and 25, the clamp 910 of the dummy removal unit 900 moves to the dummy portion of the substrate S on which the first and second X-axis cutting lines XL1 and XL2 are formed. do. Then, after the clamp 910 grips the dummy portion of the substrate S, while rotating or moving horizontally, the dummy portion is removed from the substrate S. The clamp 910 from which the dummy portion is removed returns to the original position that does not interfere with the movement of the cutting wheels 225 of the first and second cutting wheel modules 221 and 222.

Meanwhile, as illustrated in FIG. 26, the substrate S divided along the first and second X-axis cutting lines XL1 and XL2 is the second cutting unit 300 by rotation of the plurality of belts 710. Can be delivered to

At this time, as shown in FIG. 27, the second transfer unit 700 and the second cutting unit 300 are disposed at the same height, so that the substrate S can be directly transferred to the second cutting unit 300. . In this case, the substrate S is supported from the second plate 760 by the gas supplied from the second plate 760.

As another example, a picker unit (not shown) that is vertically movable while moving up and down is disposed between the second transfer unit 700 and the second cutting unit 300 to transfer the substrate S from the second transfer unit 700. It can be used to deliver to the second cutting unit 300. As shown in FIGS. 29 and 30, the second transfer unit 700 may be disposed at a lower position from the second cutting unit 300 by a predetermined height (H). In this case, the belt 710 is raised by a predetermined height H by the lifting device 740, so that the belt 710 may be positioned at the same height as the second cutting unit 300. At this time, when the belt 710 is raised by the lifting device 740, the substrate S is moved away from the second plate 760. As such, the belt 710 is raised relative to the second plate 760 by the lifting device 740, so that the substrate S may be spaced apart from the second plate 760. Therefore, it is not necessary to float the substrate S from the second plate 760 to prevent friction between the substrate S and the second plate 760.

30 and 31, the second cutting unit 300 is configured to form a first Y-axis cutting line YL1 on the first surface S1 of the substrate S.

The second cutting unit 300 extends in the X-axis direction and is installed to be movable in the X-axis direction on the second frame 310 and the second frame 310 configured to be movable in the Y-axis direction, and the cutting wheel ( A second head 320 having a 321, a second guide rail 330 for guiding the movement of the second frame 310, a belt 340 on which the substrate S is supported, and a belt 340 The support plate 350 which is arranged to be movable in the Z-axis direction from the lower side of the cutting wheel 321 to support the belt 340 when it is pressed against the substrate S, thereby supporting the substrate S, and the support It may include a support plate lifting device 360 for lifting the plate 350 in the Z-axis direction.

The second frame 310 may be provided with a plurality of second heads 320 in the X-axis direction.

Between the second frame 310 and the second guide rail 330, a pneumatic or hydraulic actuator may be provided, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism. . Accordingly, as the second frame 310 is moved in the Y-axis direction along the second guide rail 330 while the cutting wheel 321 is pressed against the substrate S, the first surface of the substrate S ( A first Y-axis cutting line YL1 may be formed in S1).

The belt 340 is supported by a plurality of pulleys 341, and at least one of the plurality of pulleys 341 may be a drive pulley providing a driving force for rotating the belt 340. The belt 340 is preferably an integral belt that is not divided into a plurality of parts so that the entire surface of the substrate S can be uniformly supported and transported.

When the belt 340 is rotated to move the substrate S, the support plate 350 is lowered by the support plate lifting device 360 to be separated from the belt 340 so that the belt 340 is the support plate 350 It should be able to move smoothly without friction with. And, when forming the first Y-axis cutting line (YL1) on the substrate (S), the support plate 350 is raised by the support plate lifting device 360 to support the lower surface of the belt 340, accordingly , Support the substrate (S). For example, the support plate 350 may be configured to have a vacuum hole connected to a vacuum source to adsorb the substrate S.

In the process of forming the first Y-axis cutting line YL1 on the first surface S1 of the substrate S, the second frame 310 in which the second head 320 having the cutting wheel 321 is installed is Since the substrate S is moved and supported by the support plate 350, the cutting wheel 321 can be pressed against the substrate S with a greater pressure, so that the substrate S can be easily separated.

In addition, since the substrate S is supported by the support plate 350, a roller for supporting the cutting wheel 321 is not required. Therefore, the width of the second head 320 can be reduced by the space from which the roller is removed, and accordingly, the cutting wheels of the plurality of second heads 320 when the plurality of second heads 320 are adjacent to each other ( 321) can reduce the distance between. Accordingly, a gap between the first Y-axis cutting lines YL1 that may be formed by the cutting wheel 321 can be reduced.

As shown in FIG. 31, the substrate S on which the first Y-axis cutting line YL1 is formed is transferred from the second cutting unit 300 to the first inversion unit 400 by rotation of the belt 340. Can be. As another example, a picker unit (not shown) that is vertically movable while moving up and down is disposed between the second cutting unit 300 and the first inverting unit 400 to move the substrate S from the second cutting unit 300. It can be used to transfer to the first inversion unit 400.

31 to 38, the first reversing unit 400 includes a plurality of belts 410 disposed apart from each other in the X-axis direction, a support 420 extending in the Z-axis direction, and a first A first adsorption plate 430 having an adsorption nozzle 431, a second adsorption plate 440 having a second adsorption nozzle 441, a first adsorption plate 430 and a second adsorption plate 440 ) Includes an adsorption plate lifting device 450 that moves the Z-axis direction along the support 420, and an adsorption plate rotating device 460 that rotates the first adsorption plate 430 and the second adsorption plate 440. can do.

The belt 410 is supported by a plurality of pulleys 411, and at least one of the plurality of pulleys 411 may be a drive pulley providing a driving force for rotating the belt 410.

The adsorption plate lifting device 450 may be composed of a pneumatic or hydraulically actuated actuator, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism.

The suction plate rotating device 460 may be configured as an electric motor.

The first adsorption plate 430 and the second adsorption plate 440 are spaced apart from each other in the Z-axis direction so that the substrate S is positioned therebetween. The first adsorption nozzle 431 of the first adsorption plate 430 and the second adsorption nozzle 441 of the second adsorption plate 440 may be disposed to face each other.

Hereinafter, the operation of inverting the substrate S will be described. For convenience of description, description will be made based on a state in which the first adsorption plate 430 is positioned above the second adsorption plate 440.

First, as shown in FIG. 32, when the substrate S is not positioned on the belt 410, the first adsorption plate 430 and the second adsorption plate 440 are located in the space between the belts 410. do. And, as shown in FIG. 33, when the substrate S is carried on the belt 410, the substrate S is positioned between the first adsorption plate 430 and the second adsorption plate 440.

Then, as illustrated in FIG. 34, as the first and second adsorption plates 430 and 440 rise, the substrate S contacts the second adsorption nozzle 441 of the second adsorption plate 440. Then, as the first and second adsorption plates 430 and 440 continue to rise, the substrate S rises in contact with the second adsorption nozzle 441 of the second adsorption plate 440. At this time, since the substrate S is supported by the second adsorption nozzle 441 by gravity, the posture of the substrate S can be maintained even when no adsorption force is applied to the second adsorption nozzle 441.

On the other hand, when an adsorption force is applied to the first adsorption nozzle 431 or the second adsorption nozzle 441, a predetermined time is required to increase the strength of the adsorption force to a strength capable of properly adsorbing the substrate S. do. In the case of the present invention, the substrate S is first adsorbed by the first adsorption nozzle 431 or by gravity even during a time when the adsorption force is increased to a predetermined intensity by the first adsorption nozzle 431 or the second adsorption nozzle 441. 2 The substrate S may be raised by being supported by the adsorption nozzle 441. Accordingly, it is possible to prevent the problem of waiting without raising the substrate S for a time during which the strength of the adsorption force increases to a strength capable of properly adsorbing the substrate S. As a result, the time required to raise the substrate S can be reduced.

When the second adsorption nozzle 441 of the second adsorption plate 440 adsorbs the substrate S while the substrate S is raised, as shown in FIG. 35, the first adsorption plate 430 and the second The adsorption plate 440 is rotated by the adsorption plate rotating device 460.

Then, as illustrated in FIG. 36, the substrate S is lowered to the state adsorbed by the second adsorption nozzle 441 of the second adsorption plate 440.

And, as shown in FIG. 37, when the first adsorption plate 430 is inserted into the space between the belts 410, the substrate S is placed on the belt 410 and separated from the second adsorption nozzle 441. do. In this state, since the first adsorption plate 430 is located under the second adsorption plate 440, the operation of inverting the substrate S in the next order can be performed immediately, and accordingly, it is required for the process. Save time.

In this state, as shown in FIG. 38, the inverted substrate S may be transferred from the first inversion unit 400 to the third cutting unit 500 by rotation of the belt 410. As another example, a picker unit (not shown) that is vertically movable while moving up and down is disposed between the first inversion unit 400 and the third cutting unit 500 to move the substrate S from the first inversion unit 400. It can be used to deliver to the third cutting unit 500.

38 and 39, the third cutting unit 500 is configured to form a second Y-axis cutting line YL2 on the second surface S2 of the substrate S.

The third cutting unit 500 extends in the X-axis direction and is installed to be movable in the X-axis direction on the third frame 510 and configured to be movable in the Y-axis direction, and the cutting wheel ( A third head 520 having 521, a third guide rail 530 for guiding movement of the third frame 510, a belt 540 on which the substrate S is supported, and a belt 540 The support plate 550 which is disposed to be movable in the Z-axis direction from the lower side of the cutting wheel 521 to support the belt 540 when it is pressed against the substrate S, thereby supporting the substrate S, and the support It may include a support plate lifting device 560 for lifting the plate 550 in the Z-axis direction.

The third frame 510 may be provided with a plurality of third heads 520 in the X-axis direction.

Between the third frame 510 and the third guide rail 530, a pneumatic or hydraulically actuated actuator, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism may be provided. . Accordingly, as the third frame 510 is moved in the Y-axis direction along the third guide rail 530 while the cutting wheel 521 is pressed against the substrate S, the second surface of the substrate S ( A second Y-axis cutting line YL2 may be formed in S2).

The belt 540 is supported by a plurality of pulleys 541, and at least one of the plurality of pulleys 541 may be a drive pulley providing a driving force for rotating the belt 540. The belt 540 is preferably an integral belt that is not divided into a plurality of parts so that the entire surface of the substrate S can be uniformly supported and transported.

When the belt 540 is rotated to move the substrate S, the support plate 550 is lowered by the support plate lifting device 560 to be spaced apart from the belt 540 so that the belt 540 is the support plate 550 It should be able to move smoothly without friction with. In addition, when forming the second Y-axis cutting line YL2 on the substrate S, the support plate 550 is raised by the support plate lifting device 560 to support the lower surface of the belt 540, and accordingly , Support the substrate (S). For example, the support plate 550 may be configured to have a vacuum hole connected to a vacuum source to adsorb the substrate S.

In the process of forming the second Y-axis cutting line YL2 on the second surface S2 of the substrate S, the third frame 510 where the third head 520 having the cutting wheel 521 is installed moves. Since the substrate S is supported by the support plate 550, the cutting wheel 521 can be pressed against the substrate S with a greater pressure, so that the substrate S can be easily separated.

In addition, since the substrate S is supported on the support plate 550, a roller for supporting the cutting wheel 521 is not required. Therefore, the width of the third head 520 can be reduced by the space from which the roller is removed, and accordingly, the cutting wheels of the plurality of third heads 520 when the plurality of third heads 520 are adjacent to the maximum ( 521). Accordingly, a gap between the second Y-axis cutting lines YL2 that may be formed by the cutting wheel 521 can be reduced.

As the second Y-axis cutting line YL2 is formed on the second surface S2 of the substrate S, the first Y-axis cutting line YL1 and the second Y-axis cutting line YL2 are connected to each other, The substrate S may be cut along the first and second Y-axis cutting lines YL1 and YL2.

Therefore, after the substrate S is cut, the X-axis step portion XS having widths equal to the distances between the first and second Y-axis cutting lines YL1 and YL2 spaced apart from each other in the X-axis direction is formed. The X-axis step portion XS may include wires and / or electrodes connected to the wires.

The cut substrate S may be transferred from the third cutting unit 500 to the third transfer unit 800 by rotation of the belt 540.

40 to 42, the third transfer unit 800 is a belt 810 for receiving the substrate S transferred from the third cutting unit 500, and the substrate S is gripped and transferred A picker module 820 for supporting, a support frame 830 in which the picker module 820 is movably supported in the Y-axis direction, and a moving module 840 for moving the picker module 820 along the support frame 830 ) And a lifting module 850 for moving the picker module 820 in the Z-axis direction.

The belt 810 is supported by a plurality of pulleys 811, and at least one of the plurality of pulleys 811 may be a drive pulley providing a driving force for rotating the belt 810. The belt 810 of the third transfer unit 800 is formed at the same height as the belt 540 of the third cutting unit 500 so that the substrate S is transferred from the third cutting unit 500 to the third transfer unit 800 ).

The moving module 840 and the lifting module 850 may be constituted by a pneumatic or hydraulic actuator, a linear motor operated by electromagnetic interaction, or a linear moving mechanism such as a ball screw mechanism.

The picker module 820 is connected to a plurality of adsorption pads 821 and a plurality of adsorption pads 821 connected through a vacuum source 860 and a vacuum line 861 to elevate the adsorption pads 821. A pad height adjuster 822 and a plurality of adsorption pads 821 may be connected to each other, and may include a pressure sensor 823 measuring pressure in the adsorption pads 821.

The pad height adjuster 822 may be configured to allow a user to manually adjust the heights of the plurality of adsorption pads 821. In addition, so that the height of the plurality of adsorption pads 821 can be automatically adjusted, the pad height adjuster 822 is an actuator operated by pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism. It may be configured as a linear movement mechanism.

As another example, the plurality of pad height adjusters 822 are not connected to the plurality of adsorption pads 821, respectively, and designate two or more adsorption pads 821 as one group to select the plurality of adsorption pads 821. It can be configured to designate and adjust the height of each group of adsorption pads 821.

In this case, the control unit 1000 may control the pad height adjuster 822 based on the pressure change in the adsorption pad 821 measured by the pressure sensor 823 to elevate the plurality of adsorption pads 821. have.

When the substrate S is transferred to the belt 810 of the third transfer unit 800, the substrate S is adsorbed to the picker module 820, and the substrate (S) is moved by vertical and horizontal movement of the picker module 820. S) can be transferred to a subsequent process.

In this process, it is required that the substrate S is uniformly adsorbed on all of the plurality of adsorption pads 821 of the picker module 820. By the way, due to the change in the flatness of the substrate S due to the height change of the belt 810 of the third transfer unit 800, and the vertical position of the plurality of adsorption pads 821 of the picker module 820, the substrate ( S) may not be uniformly adsorbed on all of the plurality of adsorption pads 821 of the picker module 820. When the picker module 820 moves vertically and horizontally while the substrate S is not uniformly adsorbed on all of the plurality of adsorption pads 821, the substrate S is detached from the plurality of adsorption pads 821 Problems can occur.

Accordingly, in the case of the third transfer unit 800 according to the embodiment of the present invention, the picker module 820 is gradually moved toward the substrate S before the picker module 820 completely adsorbs the substrate S The pressure in the plurality of adsorption pads 821 is measured by the pressure sensor 823.

As the picker module 820 is gradually moved toward the substrate S, the substrate S is adsorbed to the adsorption pad 821, and the flatness of the substrate S is constant and the plurality of adsorption pads 821 are vertical. When the positions are uniform, the pressure in the plurality of adsorption pads 821 changes simultaneously when the substrate S is adsorbed to the plurality of adsorption pads 821.

However, when the flatness of the substrate S is not constant or the vertical positions of the plurality of adsorption pads 821 are not uniform, only a part of the substrate S adsorbs some of the plurality of adsorption pads 821 The pad 821 is adsorbed and the rest of the substrate S is not adsorbed on the pad 821. In this case, the pressure of some of the plurality of adsorption pads 821 changes, but the pressure of the adsorption pads 821 on which the substrate S is not adsorbed does not change.

From this, it can be seen that there is a relative height difference with respect to the substrate S between the adsorption pad 821 where the pressure is changed and the adsorption pad 821 where the pressure is not changed. This relative height difference can be eliminated by adjusting the height or adjusting the height of the adsorption pad 821 where the pressure has not changed.

The control unit 1000 controls the pad height adjuster 822 based on the pressure (pressure change) of the plurality of adsorption pads 821 measured by the plurality of pressure sensors 823, so that the pressure changes in the adsorption pads 821 ) May be adjusted or the height of the adsorption pad 821 whose pressure has not changed.

Accordingly, a relative height difference relative to the substrate S between the plurality of adsorption pads 821 may be removed, and accordingly, the entire surface of the substrate S may be uniformly adsorbed to the plurality of adsorption pads 821. .

According to this configuration, since the entire surface of the substrate S can be uniformly adsorbed to the plurality of adsorption pads 821, the substrate S can be stably transferred to a subsequent process by the picker module 820. .

43 to 45, the second inversion unit 1400 serves to invert the substrate S to adjust the direction in which the upper or lower surface of the substrate S is directed. The reversing unit 1400 includes a support 1420 extending in the Z-axis direction, a first picker module 1430 having a plurality of first suction pads 1431, and a plurality of second suction pads 1442. The second picker module 1440 and the first and second picker modules 1430 and 1440 move the picker lift module 1450 along the support 1420 in the Z-axis direction, and the first and second picker modules A picker rotation module 1460 that rotates (1430, 1440) about an axis orthogonal to the Z axis (eg, the X axis) may be included.

The picker elevating module 1450 may be composed of a pneumatic or hydraulic actuator, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism.

The picker rotation module 1460 may include a rotation device 460 of an electric motor.

The first and second picker modules 1430 and 1440 are spaced apart from each other in the Z-axis direction. The first adsorption pad 1431 of the first picker module 1430 and the second adsorption pad 1441 of the second picker module 1440 may be arranged to face opposite directions. That is, when the first adsorption pad 1431 of the first picker module 1430 is disposed upward, the second adsorption pad 1441 of the second picker module 1440 may be disposed downward. When the first and second picker modules 1430 and 1440 are rotated by the picker rotation module 1460, the first adsorption pad 1431 of the first picker module 1430 and the second of the second picker module 1440 The direction in which the adsorption pad 1401 is directed may be changed.

Meanwhile, the transport unit 1500 may include one integral belt 1510 having a size corresponding to the width of the substrate S. The belt 1510 is preferably a single integral belt that is not divided into a plurality of parts so that the entire surface of the substrate S can be uniformly supported and transported.

The belt 1510 is supported by a plurality of pulleys 1511, and at least one of the plurality of pulleys 1511 may be a drive pulley providing a driving force for rotating the belt 1510.

Since the first adsorption pad 1431 of the first picker module 1430 and the second adsorption pad 1441 of the second picker module 1440 are arranged to face opposite directions, the substrate S is the third transfer unit After being transferred from the 800 to the first adsorption pad 1431 or the second adsorption pad 1441, and after the substrate S is inverted, the conveying unit (from the first adsorption pad 1431 or the second adsorption pad 1441) 1500) of the belt 1510. According to this configuration, the belt 1510 may be formed of one integral belt having a size corresponding to the width of the substrate S. Accordingly, the substrate S transferred from the first and second picker modules 1430 and 1440 can be stably supported without sagging on the upper surface of one unified belt 1510.

44 and 45, the first and second adsorption pads 1431 and 1441 of the first and second picker modules 1430 and 1440 are through a vacuum source 1480 and a vacuum line 1801. Can be connected. In addition, the first and second picker modules 1430 and 1440 are connected to the first and second adsorption pads 1431 and 1441, respectively, to raise and lower the first and second adsorption pads 1431 and 1441. The regulator 1470 may include a pressure sensor 1485 connected to the first and second adsorption pads 1431 and 1441 to measure pressure in the first and second adsorption pads 1431 and 1441, respectively.

The pad height adjuster 1470 may be configured to allow a user to manually adjust the heights of the first and second adsorption pads 1431 and 1441. In addition, so that the height of the first and second adsorption pads 1431 and 1441 can be automatically adjusted, the pad height adjuster 1470 is an actuator operated by pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction. , Or a linear movement mechanism such as a ball screw mechanism.

As another example, a plurality of pad height adjusters 1470 are not connected to the first and second adsorption pads 1431 and 1441, respectively, and two or more adsorption pads 1431 of the first and second adsorption pads 1431 and 1441 are not connected. , 1441) as a group to designate a plurality of groups of adsorption pads 1431 and 1441 and to adjust the height of each group of adsorption pads 1431 and 1441.

In this case, the control unit 1000 controls the pad height adjusters 1470 based on pressure changes in the first and second adsorption pads 1431 and 1441 measured by the pressure sensor 1485 to control the first and second. The adsorption pads 1431 and 1441 can be individually raised and lowered.

When the substrate S is seated on the first picker module 1430 or the second picker module 1440, the substrate S is adsorbed to the first picker module 1430 or the second picker module 1440, and the first And the substrate S may be inverted by rotating the second picker modules 1430 and 1440.

In this process, the substrate S is required to be uniformly adsorbed on all of the plurality of adsorption pads 1431 and 1441. However, due to a change in flatness of the substrate S and a change in vertical positions of the plurality of adsorption pads 1431 and 1441, the substrate S may not be uniformly adsorbed to all of the plurality of adsorption pads 1431 and 1441. . When the substrate S is not uniformly adsorbed to all of the plurality of adsorption pads 1431 and 1441, when the first picker module 1430 or the second picker module 1440 is vertically moved or rotated, the substrate ( A problem may arise in which S) deviates from the plurality of adsorption pads 1431 and 1441.

Therefore, in the case of the second inverting unit 1400 according to the embodiment of the present invention, the first picker module 1430 before the first picker module 1430 or the second picker module 1440 completely adsorbs the substrate S ( 1430) or the second picker module 1440 is gradually moved toward the substrate S while the pressure in the plurality of adsorption pads 1431 and 1441 is measured by the pressure sensor 1485.

As the first picker module 1430 or the second picker module 1440 is gradually moved toward the substrate S, the substrate S is adsorbed on the adsorption pads 1431 and 1441, and the flatness of the substrate S When is constant and the vertical positions of the plurality of adsorption pads 1431 and 1441 are uniform, the pressure in the plurality of adsorption pads 1431 and 1441 when the substrate S is adsorbed to the plurality of adsorption pads 1431 and 1441 This will change at the same time.

However, when the flatness of the substrate S is not constant, or when the vertical positions of the plurality of adsorption pads 1431 and 1441 are not uniform, only a part of the substrate S has a plurality of adsorption pads 1431 and 1441. Some of the adsorption pads 1431 and 1441 are adsorbed, and the rest of the substrate S is not adsorbed on the adsorption pads 1431 and 1441. In this case, the pressure of some of the plurality of adsorption pads 1431 and 1441 changes, but the pressure of the adsorption pads 1431 and 1441 to which the substrate S is not adsorbed does not change.

From this, it can be seen that there is a relative height difference with respect to the substrate S between the adsorption pads 1431 and 1441 whose pressure is changed and the adsorption pads 1431 and 1441 whose pressure is not changed, and the adsorption pads whose pressure is changed. This relative height difference can be eliminated by adjusting the height of the (1431, 1441) or by adjusting the height of the adsorption pads (1431, 1441) where the pressure has not changed.

The control unit 1000 controls the pad height adjuster 1470 based on the pressure (pressure change) of the plurality of adsorption pads 1431 and 1441 measured by the plurality of pressure sensors 1485 to adjust the pressure of the adsorption pad. The heights of the (1431, 1441) may be adjusted or the heights of the adsorption pads (1431, 1441) whose pressure has not changed.

Accordingly, a relative height difference relative to the substrate S between the plurality of adsorption pads 1431 and 1441 can be removed, and accordingly, the entire surface of the substrate S is uniformly applied to the plurality of adsorption pads 1431 and 1441. Can be adsorbed.

According to this configuration, since the entire surface of the substrate S can be uniformly adsorbed to the plurality of adsorption pads 1431 and 1441, the substrate S is the first picker module 1430 or the second picker module 1440 ) And then inverted after being stably adsorbed.

Hereinafter, an operation of inverting the substrate S will be described with reference to FIGS. 43 and 46 to 49. For convenience of description, the first picker module 1430 will be described based on the state located above the second picker module 1440.

First, as shown in FIG. 43, after the substrate S transferred to the belt 810 of the third transfer unit 800 is gripped by the picker module 820, toward the second inversion unit 1400 Is transferred.

And, as shown in FIG. 46, after the substrate S is positioned on the first picker module 1430 by the third transfer unit 800, the first adsorption pad of the first picker module 1430 (1431).

In addition, as shown in FIG. 47, the picker module 820 of the third transfer unit 800 may return to its original position to grip the new substrate S transferred to the belt 810. Then, the first and second picker modules 1430 and 1440 are raised by the picker elevating module 1450. At this time, since the substrate S is supported by the first picker module 1430 by gravity, the posture of the substrate S even when no vacuum is applied to the first adsorption pad 1431 of the first picker module 1430 Can be maintained.

On the other hand, when a vacuum is applied to the first adsorption pad 1431 or the second adsorption pad 1441, a predetermined time is required to increase the strength of the vacuum to a strength capable of properly adsorbing the substrate S. do. In the case of the present invention, the substrate S is the first adsorption pad (G) due to gravity even during a time period when the intensity of the vacuum applied to the first adsorption pad 1431 or the second adsorption pad 1441 is increased to a predetermined intensity. 1431) or the substrate S may be raised while being supported by the second adsorption pad 1441. That is, after the substrate S is seated on the first adsorption pad 1431 or the second adsorption pad 1441, the first and second picker modules 1430 and 1440 start to rise in the vacuum source 1480. It may be configured to apply a vacuum to the first adsorption pad 1431 or the second adsorption pad 1441 at a point in time or during an ascent.

Therefore, according to the configuration of the present invention, it is possible to prevent the problem of waiting without raising the substrate S for a time period during which the strength of the vacuum increases to a strength capable of properly adsorbing the substrate S. As a result, the time required to raise the substrate S can be reduced.

And, as shown in FIG. 47, the first and second picker modules 1430 and 1440 are rotated by the picker rotation module 1460. Meanwhile, the first and second picker modules 1430 and 1440 may be rotated simultaneously with being raised. As the first and second picker modules 1430 and 1440 are rotated, the substrate S may be inverted.

And, as illustrated in FIG. 48, the first and second picker modules 1430 and 1440 are lowered by the picker elevating module 1450. Accordingly, the substrate S may be transferred toward the belt 1510 of the transfer unit 1500.

And, as shown in FIG. 49, the substrate S is transferred from the first picker module 1430 to the belt 1510 of the transfer unit 1500, and the substrate S transferred to the belt 1510 is subsequently Can be transferred to the process.

Then, the first and second picker modules 1430 and 1440 return to their original positions. At this time, since the second picker module 1440 is located above the first picker module 1430, the substrate S may be transferred to the second picker module 1440 by the third transfer unit 800 immediately. , The substrate S may be inverted by rising and falling of the first and second picker modules 1430 and 1440. Therefore, the time required for the process of inverting the substrate S by such a continuous operation can be reduced.

According to the substrate cutting apparatus according to the embodiment of the present invention configured as described above, a plurality of cutting lines, that is, the first and second X-axis cutting line (XL1, XL2), the first Y-axis cutting line (YL1) When the second Y-axis cutting line YL2 is sequentially formed by the first cutting unit 200, the second cutting unit 300, and the third cutting unit 400, the substrate S is sequentially formed. Can be cut. Therefore, the number of processes can be reduced and the efficiency in cutting the substrate can be improved as compared to the prior art in which the scribing process and the breaking process must be performed separately to cut the substrate.

Although a preferred embodiment of the present invention has been described by way of example, the scope of the present invention is not limited to such a specific embodiment, and may be appropriately changed within the scope described in the claims.

100: alignment unit 200: first cutting unit
300: second cutting unit 400: first reversing unit
500: third cutting unit 600: first conveying unit
700: second transfer unit 800: third transfer unit
900: dummy removal unit 1400: second inversion unit

Claims (11)

A transfer unit for transferring the substrate; And
Inverting unit for inverting the substrate transferred by the transfer unit,
The reversing unit,
First and second picker modules spaced apart from each other in the Z-axis direction;
A picker elevating module for moving the first and second picker modules in the Z-axis direction; And
And a picker rotation module for rotating the first and second picker modules about an axis orthogonal to the Z axis,
The first and second picker modules are each provided with a plurality of suction pads that adsorb the substrate, and the suction pads provided in the first picker module and the suction pads provided in the second picker module face opposite directions. Arranged to
When the substrate is transferred to one picker module disposed above the first and second picker modules, and then one picker module is rotated while supporting the substrate and disposed below, the other picker module A device for cutting a substrate, which is disposed above and receives subsequent substrates. The method according to claim 1,
Further comprising a conveying unit for conveying the substrate inverted by the inverting unit to the outside,
The transfer unit comprises a belt having a size corresponding to the size of the substrate substrate cutting apparatus. The method according to claim 1,
Further comprising a vacuum source connected to the plurality of adsorption pads,
The vacuum source applies a vacuum to the plurality of adsorption pads while the first and second picker modules are raised after the substrates are seated on the plurality of adsorption pads. The method according to claim 1,
The inverting unit, further comprising a pressure sensor for measuring the pressure of each of the plurality of adsorption pads substrate cutting device. The method according to claim 4,
The inverting unit, further comprising a pad height adjuster that is connected to each of the plurality of adsorption pads to adjust the height of the plurality of adsorption pads. The method according to claim 5,
And a control unit that controls the height of at least one of the plurality of adsorption pads by controlling the pad height adjuster based on the pressure change in the plurality of adsorption pads measured by the pressure sensor. The method according to any one of claims 1 to 6,
An alignment unit that determines the position of the substrate brought in from the outside;
A first cutting unit for forming first and second X-axis cutting lines parallel to the X-axis direction on first and second surfaces of the substrate;
A second cutting unit forming a first Y-axis cutting line parallel to the Y-axis direction on the first surface of the substrate; And
And a third cutting unit forming a second Y-axis cutting line parallel to the Y-axis direction on the second surface of the substrate. The method according to claim 7,
The alignment unit,
A plurality of belts extending in the Y-axis direction and spaced apart at predetermined intervals in the X-axis direction;
A belt elevating device connected to the plurality of belts to elevate the plurality of belts;
A plurality of lifting devices disposed between the plurality of belts to support the substrate; And
And a pressing device that presses a side surface of the substrate lifted by the plurality of lifting devices. The method according to claim 7,
The first cutting unit includes a first frame extending in the X-axis direction, a first frame movably installed in the X-axis direction, and at least one pair of first heads disposed to face each other in the Z-axis direction. and,
The at least one pair of first heads are arranged to be spaced apart in the Z-axis direction, and each of the first and second cutting wheel modules is provided to have a cutting wheel, and the first and second rollers are spaced apart in the Z-axis direction, respectively Includes 2 roller modules,
The cutting wheel of the first cutting wheel module is arranged to coincide with the roller of the second roller module, and the cutting wheel of the second cutting wheel module is arranged to coincide with the roller of the first roller module. Substrate cutting device. The method according to claim 7,
The second cutting unit,
A second frame extending in the X-axis direction and configured to be movable in the Y-axis direction;
A second head movably installed in the X-axis direction on the second frame and having a cutting wheel;
A belt on which the substrate is supported; And
And a support plate supporting the substrate by supporting the belt when the cutting wheel is pressed against the substrate by being movably disposed in the Z-axis direction from the lower side of the belt. The method according to claim 7,
The third cutting unit,
A third frame extending in the X-axis direction and configured to be movable in the Y-axis direction;
A third head movably installed in the X-axis direction on the third frame and having a cutting wheel;
A belt on which the substrate is supported; And
And a support plate supporting the substrate by supporting the belt when the cutting wheel is pressed against the substrate by being movably disposed in the Z-axis direction from the lower side of the belt.

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