JP2017109910A - Parting apparatus - Google Patents

Parting apparatus Download PDF

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JP2017109910A
JP2017109910A JP2015247322A JP2015247322A JP2017109910A JP 2017109910 A JP2017109910 A JP 2017109910A JP 2015247322 A JP2015247322 A JP 2015247322A JP 2015247322 A JP2015247322 A JP 2015247322A JP 2017109910 A JP2017109910 A JP 2017109910A
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substrate
region
support
cutting
impact
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西尾 仁孝
Jinko Nishio
仁孝 西尾
生芳 高松
Ikuyoshi Takamatsu
生芳 高松
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三星ダイヤモンド工業株式会社
Mitsuboshi Diamond Industrial Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a parting apparatus capable of parting efficiently and reliably along a scribe line without reversing a substrate at the time of parting an adhered substrate.SOLUTION: A parting apparatus comprises a first support member 5 for supporting a first region and a second support member 6 for supporting a second region when one region across the scribe lines S1, D2 of a substrate M is defined as the first region and the other region is defined as the second region. The first support member 5 and the second support member 6 move vertically relative to each other so that the second support member 6 moves to a position for supporting the second region and a position not supporting the second region. An impact member 8 is provided which, in the state where the second support member 6 does not support the second region, collides downward against the second region by a free fall along a guide 10 thereby to separate the second region from the first region along the scribe lines S1, S2.SELECTED DRAWING: Figure 1

Description

本発明は、脆性材料基板をスクライブラインに沿って分断するための分断装置に関する。特に本発明は、液晶表示パネルのように、2枚のガラス基板を貼り合わせた貼り合わせ基板を、それぞれの基板の表裏両面に形成されたスクライブラインに沿って分断するのに適した分断装置に関する。   The present invention relates to a cutting apparatus for cutting a brittle material substrate along a scribe line. In particular, the present invention relates to a cutting apparatus suitable for cutting a bonded substrate obtained by bonding two glass substrates, such as a liquid crystal display panel, along scribe lines formed on both front and back surfaces of each substrate. .
液晶表示パネルの製造時には、2枚の大面積ガラス基板、すなわち、液晶を駆動する薄膜トランジスタTFT(Thin Film Transistor)等の電子デバイスが形成されたガラス基板と、対向電極が形成されたガラス基板とを貼り合わせて大判の貼り合わせ基板を形成する。そして、この大判の貼り合わせ基板を、スクライブ工程ならびにブレイク工程を経て1つ1つの単位表示パネルに分断することにより、製品となる単位基板が切り出される(特許文献1、特許文献2参照)。   When manufacturing a liquid crystal display panel, two large-area glass substrates, that is, a glass substrate on which an electronic device such as a thin film transistor TFT (Thin Film Transistor) that drives liquid crystal is formed, and a glass substrate on which a counter electrode is formed are provided. A large-sized bonded substrate is formed by bonding. The large-sized bonded substrate is divided into individual unit display panels through a scribe process and a break process, whereby a unit substrate to be a product is cut out (see Patent Document 1 and Patent Document 2).
図9は、後記特許文献等で開示された貼り合わせ基板の分断方法を示すものである。
まず、図9(a)に示すように、貼り合わせ基板Mの上側の第一基板1の表面にスクライブ予定ラインに沿ってカッターホイール(スクライビングホイールともいう)Kを圧接させながら相対移動させることにより第一スクライブラインS1を形成する。次いで図9(b)に示すように、貼り合わせ基板Mを表裏反転させ、上方からブレイクバー20を押し付けて基板Mを下方に撓ませることにより、スクライブラインS1の亀裂を厚み方向に浸透させて第一基板1をスクライブラインS1に沿ってブレイクする。続いて図9(c)に示すように、貼り合わせ基板Mの第二基板2の表面にカッターホイールKで第二スクライブラインS2を加工する。この後、図9(d)に示すように、貼り合わせ基板Mを再度反転させてブレイクバー20を押し付けることにより、第二基板2を第二スクライブラインS2に沿ってブレイクするようにしている。
FIG. 9 shows a method for dividing a bonded substrate disclosed in patent documents and the like described later.
First, as shown in FIG. 9A, a cutter wheel (also referred to as a scribing wheel) K is moved relative to the surface of the first substrate 1 on the upper side of the bonded substrate M along a scheduled scribe line while being pressed. A first scribe line S1 is formed. Next, as shown in FIG. 9B, the bonded substrate M is turned upside down, and the break bar 20 is pressed from above to deflect the substrate M downward, so that the cracks in the scribe line S1 penetrate in the thickness direction. The first substrate 1 is broken along the scribe line S1. Subsequently, as shown in FIG. 9C, the second scribe line S <b> 2 is processed with the cutter wheel K on the surface of the second substrate 2 of the bonded substrate M. Thereafter, as shown in FIG. 9D, the bonded substrate M is reversed again and the break bar 20 is pressed, so that the second substrate 2 is broken along the second scribe line S2.
また、別の分断方法としては図10に示すものがある。すなわち、図10(a)に示すように、貼り合わせ基板Mの上下両面からカッターホイールK、Kを圧接させながら相対移動させることにより、第一基板1と第二基板2の表面に第一スクライブラインS1と第二スクライブラインS2を同時に加工する。次いで図10(b)に示すように、貼り合わせ基板Mに上方からブレイクバー20を押し付けて基板Mを下方に撓ませることにより、下側の第二基板2のスクライブラインS2の亀裂を厚み方向に浸透させて第二基板2をスクライブラインS2に沿ってブレイクする。続いて図10(c)に示すように、貼り合わせ基板Mを表裏反転させ、上方からブレイクバー20を押し付けて基板Mを撓ませることにより、第一基板1を第一スクライブラインS1に沿ってブレイクする。   Another dividing method is shown in FIG. That is, as shown in FIG. 10A, the first scribing is performed on the surfaces of the first substrate 1 and the second substrate 2 by moving the cutter wheels K and K relative to each other from both the upper and lower surfaces of the bonded substrate M. The line S1 and the second scribe line S2 are processed simultaneously. Next, as shown in FIG. 10 (b), the break bar 20 is pressed against the bonded substrate M from above to bend the substrate M downward, thereby causing the scribe line S2 of the lower second substrate 2 to crack in the thickness direction. The second substrate 2 is broken along the scribe line S2. Subsequently, as shown in FIG. 10C, the bonded substrate M is turned upside down, and the break bar 20 is pressed from above to bend the substrate M, whereby the first substrate 1 is moved along the first scribe line S1. Break.
特開2002−103295号公報JP 2002-103295 A 特開2006−137641号公報JP 2006-137441 A
上記した従来の貼り合わせ基板の分断方法では、いずれの場合も一方の基板をブレイクバー等でブレイクした後に、基板を反転させて反対側の基板をブレイクする工程、すなわち、貼り合わせ基板を表裏反転させる操作が必要となる。
しかし、このような基板の反転操作は、基板を反転させるための機構が必要であって装置が大型化するとともに装置コストも高くなる。加えて、反転操作に時間がかかるとともに、反転操作中に基板が傷付くリスクも有しているため生産性が低下するといった問題点もあった。
In the above-described conventional method for dividing a bonded substrate, in either case, after one substrate is broken with a break bar or the like, the substrate is reversed and the opposite substrate is broken, that is, the bonded substrate is reversed. Operation is required.
However, such a substrate reversal operation requires a mechanism for reversing the substrate, which increases the size of the apparatus and increases the cost of the apparatus. In addition, the reversing operation takes time, and there is a risk that the substrate is damaged during the reversing operation, resulting in a decrease in productivity.
そこで本発明は、上記した課題に鑑み、貼り合わせ基板の分断に際し、基板を表裏反転させることなく第一基板ならびに第二基板をスクライブラインに沿って一挙かつ確実に分断することができる分断装置を提供することを目的とする。   Therefore, in view of the above-described problems, the present invention provides a cutting apparatus capable of dividing the first substrate and the second substrate along the scribe line at once, without inverting the substrates when the bonded substrate is divided. The purpose is to provide.
上記目的を達成するために本発明では次のような技術的手段を講じた。すなわち本発明の分断装置は、表面に形成されたスクライブラインに沿って基板を分断する分断装置であって、前記スクライブラインを境界とする前記基板の一方の領域を第一領域、他方の領域を第二領域としたときに、前記第一領域を支持する第一支持部材と、前記第二領域を支持する第二支持部材とを有し、前記第一支持部材と前記第二支持部材とが相対的に上下に移動することにより、前記第二支持部材が前記第二領域を支持する位置と支持しない位置とに変位するように構成されており、前記第二支持部材が前記第二領域を支持しない状態において、前記第二領域に対し上方からガイド部材に沿って自由落下により衝突して前記スクライブラインに沿って前記第二領域を前記第一領域から切り離すインパクト部材と、を備えている構成とした。   In order to achieve the above object, the present invention takes the following technical means. That is, the cutting apparatus according to the present invention is a cutting apparatus for cutting a substrate along a scribe line formed on the surface, wherein one region of the substrate with the scribe line as a boundary is a first region, and the other region is When it is set as the second region, it has a first support member that supports the first region and a second support member that supports the second region, and the first support member and the second support member are By relatively moving up and down, the second support member is configured to displace between a position that supports the second region and a position that does not support the second region, and the second support member moves the second region. And an impact member that collides with the second region from above along the guide member by free fall and separates the second region from the first region along the scribe line when not supported. And the.
本発明の分断装置では、インパクト部材を分断すべき基板の表面に衝突させて基板に剪断力を発生させるものであるから、単板の脆性材料基板や貼り合せ基板をスクライブラインに沿って確実に分断することができる。特に、分断すべき基板が第一基板と第二基板からなる貼り合わせ基板である場合には、インパクト部材の1回の下降で第一基板と第二基板をスクライブラインに沿って一挙に分断することが可能となる。これにより、一方の基板のスクライブラインをブレイク後に基板を反転させて、他方の基板のスクライブラインをブレイクするといった基板の表裏反転操作を省略して分断作業の効率化と装置のコンパクト化を図るとともに、反転操作中に基板が傷付くリスクも解消することができる。   In the cutting apparatus according to the present invention, the impact member is caused to collide with the surface of the substrate to be cut to generate a shearing force on the substrate. Can be divided. In particular, when the substrate to be divided is a bonded substrate composed of a first substrate and a second substrate, the first substrate and the second substrate are divided at a time along the scribe line by a single descent of the impact member. It becomes possible. As a result, the substrate is turned over after breaking the scribe line of one substrate and the scribe line of the other substrate is broken, thereby improving the efficiency of the dividing work and making the apparatus compact. The risk of the substrate being damaged during the reversing operation can also be eliminated.
上記発明において、インパクト部材により切り離されて第二支持部材上に落下した第二領域に対し、インパクト部材が接触することを防ぐストッパを設けるのがよい。これにより、分断後に第二支持部材上へ載置された第二領域にインパクト部材が接触して第二領域の表面が傷付くのを防止することができる。   In the above invention, it is preferable to provide a stopper for preventing the impact member from coming into contact with the second region which has been separated by the impact member and dropped onto the second support member. Thereby, it can prevent that an impact member contacts the 2nd area | region mounted on the 2nd support member after parting, and the surface of a 2nd area | region is damaged.
また、上記発明において、前記インパクト部材による衝突時に、前記第一領域を上方から押さえて当該第一領域の浮き上がりを阻止する押さえ部材を備えている構成とするのがよい。これにより、インパクト部材による衝突時に第一領域部分の浮き上がりを阻止して精度よく分断することができる。   Moreover, in the said invention, it is good to set it as the structure provided with the pressing member which hold | suppresses said 1st area | region from upper direction at the time of the collision by the said impact member, and prevents the lifting of the said 1st area | region. Thereby, at the time of the collision by an impact member, the lifting of a 1st area | region part can be blocked | prevented and can be divided accurately.
本発明に係る分断装置を概略的に示す側面図。The side view which shows roughly the cutting device which concerns on this invention. 図1の分断装置の要部を示す斜視図。The perspective view which shows the principal part of the cutting device of FIG. 図1の分断装置による分断工程の第一段階を示す説明図。Explanatory drawing which shows the 1st step of the cutting process by the cutting apparatus of FIG. 図1の分断装置による分断工程の第二段階を示す説明図。Explanatory drawing which shows the 2nd step of the cutting process by the cutting apparatus of FIG. 図1の分断装置による分断工程の第三段階を示す説明図。Explanatory drawing which shows the 3rd step of the cutting process by the cutting apparatus of FIG. 図1の分断装置による分断工程の第四段階を示す説明図。Explanatory drawing which shows the 4th step of the cutting process by the cutting apparatus of FIG. 分断対象となる貼り合わせ基板の一例を示す平面図と断面図。The top view and sectional drawing which show an example of the bonding board | substrate used as the division | segmentation object. 分断後の短冊状基板ならびに単位基板を示す平面図。The top view which shows the strip-shaped board | substrate and unit substrate after a division | segmentation. 従来の貼り合わせ基板の分断方法の一例を示す説明図。Explanatory drawing which shows an example of the conventional dividing method of a bonded substrate board. 従来の貼り合わせ基板の分断方法の別の一例を示す説明図。Explanatory drawing which shows another example of the conventional dividing method of a bonded substrate board.
本発明に係る分断装置の実施例を、図1〜8に基づいて説明する。
図7は本発明に係る分断装置の分断対象となる貼り合わせ基板の一例を示しており、(a)は平面図、(b)は断面図である。貼り合わせ基板Mは、上側の第一基板1と下側の第二基板2とが貼り合わされて構成されている。第一基板1の表面には第一スクライブラインS1が、第二基板2の表面には第二スクライブラインS2が平面視において同じ位置でそれぞれX−Y方向に沿って形成されている。これらのスクライブラインS1、S2によって複数の単位基板M1となる領域が格子状に区分けされている。
An embodiment of a cutting apparatus according to the present invention will be described with reference to FIGS.
7A and 7B show an example of a bonded substrate that is a cutting target of the cutting apparatus according to the present invention, where FIG. 7A is a plan view and FIG. 7B is a cross-sectional view. The bonded substrate M is configured by bonding an upper first substrate 1 and a lower second substrate 2 together. A first scribe line S1 is formed on the surface of the first substrate 1, and a second scribe line S2 is formed on the surface of the second substrate 2 along the XY direction at the same position in plan view. A region to be a plurality of unit substrates M1 is divided into a lattice shape by these scribe lines S1 and S2.
本発明に係る分断装置Aは、相対的に上下に移動する第一支持部材5と第二支持部材6とを備えている。本実施例では、第一支持部材5ならびに第二支持部材6がベルトコンベアで構成され、第一支持部材5が上流側、第二支持部材6が下流側となり、上流側の第一支持部材5から下流側の第二支持部材6に向かって分断すべき貼り合わせ基板Mが搬送されるようになっている。   The cutting apparatus A according to the present invention includes a first support member 5 and a second support member 6 that move relatively up and down. In the present embodiment, the first support member 5 and the second support member 6 are configured by a belt conveyor, the first support member 5 is the upstream side, the second support member 6 is the downstream side, and the first support member 5 on the upstream side. Then, the bonded substrate M to be divided is transported toward the second support member 6 on the downstream side.
第一支持部材5と第二支持部材6は、水平状態において互いに近接した位置に配置されており、この位置から第二支持部材6がシリンダ7等の昇降機構により下方に移動できるようになっている。   The first support member 5 and the second support member 6 are disposed at positions close to each other in the horizontal state, and the second support member 6 can be moved downward from this position by a lifting mechanism such as a cylinder 7. Yes.
第二支持部材6の上方には、第一支持部材5寄りの位置にインパクト部材8が設けられている。インパクト部材8はベルト幅方向に長く形成され、索引紐9で吊り上げられた位置からガイド10に沿って自重により垂直に自由落下できるように形成されている。また、第一支持部材5の上方には、第二支持部材6寄りの位置に、分断時の基板Mの浮き上がりを阻止する押さえ部材11が設けられている。この押さえ部材11およびインパクト部材8の下面には、基板Mの表面へ接触したときに傷が付くことを防止するためのウレタン等の軟質シート11a、8aが貼り付けられている。   An impact member 8 is provided above the second support member 6 at a position near the first support member 5. The impact member 8 is formed long in the belt width direction, and is formed so that it can freely fall vertically by its own weight along the guide 10 from the position lifted by the index string 9. Further, above the first support member 5, a pressing member 11 is provided at a position near the second support member 6 to prevent the substrate M from being lifted at the time of division. Soft sheets 11a, 8a such as urethane for preventing scratches when contacting the surface of the substrate M are attached to the lower surfaces of the pressing member 11 and the impact member 8.
さらに、インパクト部材8の落下ストロークを制限するストッパ4が設けられている。このストッパ4は、第二支持部材6を挟んだ左右両脇部分に配置され、分断装置Aのフレーム(図示せず)に固定されている。また、ストッパ4に当接する当接片8bが、インパクト部材8に連なって形成されている。このストッパ4は、後述する分断工程中において、インパクト部材8により切り離されて第二支持部材6上に落下した基板M1、M2に対し、インパクト部材8が接触するのを防ぐ役目をする。   Furthermore, a stopper 4 is provided for limiting the drop stroke of the impact member 8. This stopper 4 is arrange | positioned at the both right and left side parts on both sides of the 2nd supporting member 6, and is being fixed to the flame | frame (not shown) of the parting apparatus A. As shown in FIG. A contact piece 8 b that contacts the stopper 4 is formed continuously to the impact member 8. The stopper 4 serves to prevent the impact member 8 from coming into contact with the substrates M1 and M2 that have been separated by the impact member 8 and dropped onto the second support member 6 during the cutting step described later.
次に、分断装置Aの動作について説明する。
先行するスクライブ工程で第一、第二スクライブラインS1、S2が予め加工された貼り合わせ基板Mを、いずれか一方のスクライブライン、例えばX方向のスクライブラインがベルト幅方向に沿うようにして第一支持部材5に載置し、下流側の第二支持部材6に向かって搬送する(図1〜3参照)。そして、図4に示すように、最初のスクライブラインS1、S2が第一支持部材5から少し離れた位置まで移動したときに貼り合わせ基板Mの搬送を停止させる。このとき、貼り合わせ基板MのスクライブラインS1、S2を境界として、第一支持部材5によって支持されている領域を第一領域といい、第二支持部材6によって支持されている領域を第二領域という。
Next, the operation of the cutting apparatus A will be described.
The bonded substrate M on which the first and second scribe lines S1 and S2 have been processed in advance in the preceding scribe process is set so that one of the scribe lines, for example, the scribe line in the X direction is along the belt width direction. It is placed on the support member 5 and conveyed toward the second support member 6 on the downstream side (see FIGS. 1 to 3). Then, as shown in FIG. 4, the transport of the bonded substrate M is stopped when the first scribe lines S <b> 1 and S <b> 2 move to a position slightly away from the first support member 5. At this time, the region supported by the first support member 5 with the scribe lines S1 and S2 of the bonded substrate M as boundaries is referred to as a first region, and the region supported by the second support member 6 is a second region. That's it.
次いで、図5、6に示すように、押さえ部材11を下降させて貼り合わせ基板Mの第一領域の表面に軽く接触させる。この状態で、インパクト部材8を上方の待機位置から自由落下させると、自由落下の衝突で生じる剪断力によって、貼り合わせ基板Mの上下のスクライブラインS1、S2は同時にブレイクされ、第二領域が第一領域から分離されて図8(a)に示す短冊状基板M1となる。このとき、貼り合わせ基板Mの第一領域は押さえ部材11によって押さえられているので、分断時の第一領域部分の浮き上がりを防ぐことができる。   Next, as shown in FIGS. 5 and 6, the pressing member 11 is lowered to lightly contact the surface of the first region of the bonded substrate M. In this state, when the impact member 8 is freely dropped from the upper standby position, the upper and lower scribe lines S1 and S2 of the bonded substrate M are simultaneously broken by the shearing force generated by the free fall collision, and the second region is the first region. A strip-shaped substrate M1 shown in FIG. At this time, since the first region of the bonded substrate M is pressed by the pressing member 11, it is possible to prevent the first region portion from being lifted at the time of division.
このようにして順次X方向のスクライブラインに沿って貼り合わせ基板Mを短冊状基板M1に分断した後、この短冊状基板M1のY方向のスクライブラインがベルト幅方向に沿うようにして第一支持部材5に載置し、上記同様に、インパクト部材8によって短冊状基板M1をスクライブラインに沿って順次分断して、図8(b)に示す単位基板M2を切り離す。   In this way, the bonded substrate M is sequentially divided into strip-like substrates M1 along the scribe line in the X direction, and then the first support is made so that the scribe line in the Y direction of the strip-like substrate M1 is along the belt width direction. Like the above, it mounts on the member 5, and the strip board | substrate M1 is cut | disconnected sequentially along a scribe line by the impact member 8, and the unit board | substrate M2 shown in FIG.8 (b) is cut | disconnected.
分断対象となる貼り合わせ基板Mの素材や厚みにより、分断時における第二支持部材6の下降ストロークL1、ならびに、インパクト部材8の自重および落下ストロークL2が好ましい値に設定される。例えば、貼り合わせ基板Mの第一基板1および第二基板2が、0.2〜0.4mmの厚さのガラス板である場合、第二支持部材6の下降ストロークL1は4〜10mm、インパクト部材8の下降ストロークL2は3〜9mmとするのがよい。また、インパクト部材8が最下端まで落下したときの第二支持部材6上の第二領域との間隔L3は1〜5mmとするのが好ましい。   Depending on the material and thickness of the bonded substrate M to be divided, the descending stroke L1 of the second support member 6 at the time of dividing, the own weight of the impact member 8, and the falling stroke L2 are set to preferable values. For example, when the first substrate 1 and the second substrate 2 of the bonded substrate M are glass plates having a thickness of 0.2 to 0.4 mm, the descending stroke L1 of the second support member 6 is 4 to 10 mm, the impact. The descending stroke L2 of the member 8 is preferably 3 to 9 mm. Moreover, it is preferable that the space | interval L3 with the 2nd area | region on the 2nd support member 6 when the impact member 8 falls to the lowest end shall be 1-5 mm.
このように、インパクト部材8を自由落下させて衝突させることにより生じる剪断力によって貼り合わせ基板Mを分断するため、一方の基板のスクライブラインをブレイク後に基板を反転させて他方の基板のスクライブラインをブレイクするといった煩雑な基板反転操作を省略して、インパクト部材の1回の落下によって第一基板1と第二基板2をスクライブラインS1、S2に沿って一挙に分断することが可能となる。これにより、分断作業の効率化と装置のコンパクト化を図るとともに、反転操作中に基板が傷付くリスクも解消することができる。
また、インパクト部材8により切り離されて短冊状基板M1や単位基板M2となる第二領域は、第二支持部材6上へ落下後に第二支持部材6で順次下流側へ搬送することにより、貼り合わせ基板Mの分断工程を流れ作業で連続的に行うことができる。
Thus, in order to divide the bonded substrate M by the shearing force generated by causing the impact member 8 to freely fall and collide, the substrate is reversed after breaking the scribe line of one substrate, and the scribe line of the other substrate is formed. It is possible to omit the complicated substrate reversal operation such as breaking, and to divide the first substrate 1 and the second substrate 2 at a time along the scribe lines S1 and S2 by a single drop of the impact member. As a result, the efficiency of the division work and the compactness of the apparatus can be improved, and the risk of the substrate being damaged during the reversing operation can be eliminated.
In addition, the second region that is separated by the impact member 8 and becomes the strip-shaped substrate M1 or the unit substrate M2 is bonded onto the second support member 6 by being sequentially transported downstream by the second support member 6 after dropping. The dividing process of the substrate M can be continuously performed by a flow operation.
本発明において、上記実施例では貼り合わせ基板Mに対し、インパクト部材8を自重による自由落下で衝突させることにより基板Mへの剪断力が生じるようにしたが、これと同等の剪断力が生じるのであれば、例えばプレス機のような機械的手段でインパクト部材8を下降させるようにしてもよい。   In the present invention, in the above embodiment, the impact member 8 is caused to collide with the bonded substrate M by free fall due to its own weight, so that a shearing force is generated on the substrate M, but a shearing force equivalent to this is generated. If present, the impact member 8 may be lowered by mechanical means such as a press.
以上本発明の代表的な実施例について説明したが、本発明は必ずしも上記の実施形態に特定されるものではない。例えば、上記実施例では、第一基板と第二基板を貼り合わせた貼り合わせ基板を分断対象として説明したが、単板の脆性材料基板の分断にも適用できることは言うまでもない。   While typical examples of the present invention have been described above, the present invention is not necessarily limited to the above embodiments. For example, in the above embodiment, the bonded substrate obtained by bonding the first substrate and the second substrate has been described as the object to be divided, but it goes without saying that the present invention can also be applied to the division of a single brittle material substrate.
本発明の分断装置は、大判の脆性材料基板をスクライブラインに沿って分断して単位基板を切り出すときに利用することができる。   The cutting apparatus of the present invention can be used when a large-sized brittle material substrate is cut along a scribe line to cut out a unit substrate.
A 分断装置
M 貼り合わせ基板
S1 第一スクライブライン
S2 第二スクライブライン
1 第一基板
2 第二基板
4 ストッパ
5 第一支持部材
6 第二支持部材
8 インパクト部材
11 押さえ部材
A cutting device M bonded substrate S1 first scribe line S2 second scribe line 1 first substrate 2 second substrate 4 stopper 5 first support member 6 second support member 8 impact member 11 holding member

Claims (3)

  1. 表面に形成されたスクライブラインに沿って基板を分断する分断装置であって、
    前記スクライブラインを境界とする前記基板の一方の領域を第一領域、他方の領域を第二領域としたときに、前記第一領域を支持する第一支持部材と、前記第二領域を支持する第二支持部材とを有し、
    前記第一支持部材と前記第二支持部材とが相対的に上下に移動することにより、前記第二支持部材が前記第二領域を支持する位置と支持しない位置とに変位するように構成されており、
    前記第二支持部材が前記第二領域を支持しない状態において、前記第二領域に対し上方からガイド部材に沿って自由落下により衝突して前記スクライブラインに沿って前記第二領域を前記第一領域から切り離すインパクト部材と、を備えたことを特徴とする分断装置。
    A cutting device for cutting a substrate along a scribe line formed on a surface,
    A first support member that supports the first region and the second region when one region of the substrate with the scribe line as a boundary is a first region and the other region is a second region. A second support member,
    When the first support member and the second support member move relatively up and down, the second support member is configured to displace between a position that supports the second region and a position that does not support the second region. And
    In a state where the second support member does not support the second region, the second region collides with the second region along the scribe line by colliding with the second region along the guide member from above. A cutting device comprising: an impact member that is separated from the cutting member.
  2. 前記インパクト部材により切り離されて前記第二支持部材上に落下した前記第二領域に対し、前記インパクト部材が接触することを防ぐストッパを備えたことを特徴とする請求項1に記載の分断装置。   The cutting apparatus according to claim 1, further comprising a stopper that prevents the impact member from coming into contact with the second region that has been separated by the impact member and dropped onto the second support member.
  3. 前記インパクト部材による衝突時に、前記第一領域を上方から押さえて当該第一領域の浮き上がりを阻止する押さえ部材を備えている請求項1または2に記載の分断装置。   The cutting apparatus according to claim 1, further comprising a pressing member that presses the first region from above and prevents the first region from being lifted when the impact member collides.
JP2015247322A 2015-12-18 2015-12-18 Parting apparatus Pending JP2017109910A (en)

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