JP2017039272A - Break device - Google Patents

Break device Download PDF

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Publication number
JP2017039272A
JP2017039272A JP2015162847A JP2015162847A JP2017039272A JP 2017039272 A JP2017039272 A JP 2017039272A JP 2015162847 A JP2015162847 A JP 2015162847A JP 2015162847 A JP2015162847 A JP 2015162847A JP 2017039272 A JP2017039272 A JP 2017039272A
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Prior art keywords
substrate
break
break bar
pressing
parallelism
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Granted
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JP2015162847A
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JP6627326B2 (en
Inventor
康智 岡島
Yasutomo Okajima
康智 岡島
正信 曽山
Masanobu Soyama
正信 曽山
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Priority to JP2015162847A priority Critical patent/JP6627326B2/en
Priority to TW105110890A priority patent/TWI695767B/en
Priority to KR1020160049368A priority patent/KR20170022856A/en
Priority to CN201610270643.7A priority patent/CN106466887B/en
Publication of JP2017039272A publication Critical patent/JP2017039272A/en
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Publication of JP6627326B2 publication Critical patent/JP6627326B2/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/222—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by pressing, e.g. presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/20—Cutting beds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2628—Means for adjusting the position of the cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Forests & Forestry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a break device including a break bar capable of easily adjusting parallelism between a tip ridge line of a pressing blade and a substrate surface without using shim plates etc.SOLUTION: A break device A comprises: a table 1 on which a substrate W is placed; and a break bar 10 arranged above the table 1. The break bar 10 includes pressing plates 14 arranged in a linear fashion, and a gap is provided between the adjacent pressing plates 14.SELECTED DRAWING: Figure 2

Description

本発明は、ガラス、セラミック、半導体ウエハなどの脆性材料からなる基板を分断するブレイク装置に関する。特に本発明は、前段工程でスクライブライン（切溝）が形成された基板を、そのスクライブラインの反対側の面から押圧して基板を撓ませることにより、スクライブラインに沿って基板を分断するブレイク装置のブレイクバーに関する。   The present invention relates to a break device for cutting a substrate made of a brittle material such as glass, ceramic, and semiconductor wafer. In particular, the present invention is a break that divides a substrate along the scribe line by pressing the substrate on which the scribe line (cut groove) is formed in the previous step from the opposite surface of the scribe line to bend the substrate. It relates to the break bar of the device.

従来から、脆性材料基板（以下、単に「基板」という）の表面にカッターホイール（スクライビングホイールともいう）やレーザビーム等を用いて、互いに直交するＸ方向並びにＹ方向のスクライブラインを形成し、その後、当該スクライブラインに沿って外力を印加してブレイクすることにより、基板を単位基板に分断する方法は知られており、例えば、特許文献１や特許文献２でも開示されている。   Conventionally, a scribe line in the X direction and the Y direction orthogonal to each other is formed on the surface of a brittle material substrate (hereinafter simply referred to as “substrate”) using a cutter wheel (also referred to as a scribing wheel), a laser beam, or the like. A method of dividing a substrate into unit substrates by applying an external force along the scribe line to break the substrate is known. For example, Patent Document 1 and Patent Document 2 disclose the method.

図５は、ブレイクバーを用いた従来の一般的なブレイク装置を概略的に示す斜視図である。
ブレイク装置２１は、加工対象となる基板Ｗを載置して保持する水平なテーブル２２を備えている。テーブル２２は、水平面内で回動できるようになっており、かつ、Ｙ方向に移動できるようになっている。テーブル２２の上方にはＸ方向に水平に延びるビーム（横枠）２３が設けられており、このビーム２３には、該ビーム２３と平行（Ｘ方向）に延びる板状のブレイクバー２４が取り付けられ、シリンダ２５によって駆動される昇降軸２７を介して昇降できるようになっている。 FIG. 5 is a perspective view schematically showing a conventional general break device using a break bar.
The breaking device 21 includes a horizontal table 22 that places and holds a substrate W to be processed. The table 22 can be rotated in a horizontal plane and can move in the Y direction. A beam (horizontal frame) 23 extending horizontally in the X direction is provided above the table 22, and a plate-like break bar 24 extending parallel to the beam 23 (X direction) is attached to the beam 23. It can be moved up and down via a lifting shaft 27 driven by a cylinder 25.

このブレイク装置２１で基板Ｗをブレイクする際は、まず、スクライブラインＳ１、Ｓ２のいずれか一方、例えばスクライブラインＳ１がＸ方向に沿うようにして、弾性材からなるクッションシート２６を挟んでテーブル２２上に載置する。このとき、スクライブラインＳ１が下面側となるように基板Ｗを載置する。そして、基板Ｗの上方の待機位置からスクライブラインＳ１に向かってブレイクバー２４を下降させ、その下端の押圧刃２４ａにより基板Ｗを押圧し、クッションシート２６上で僅かにＶ字状に撓ませることにより、スクライブラインＳ１のクラックを伸展させて基板Ｗをブレイクする。また、全てのスクライブラインＳ１のブレイク完了後はテーブル２２を９０度回転させて、上記同様にブレイクバー２４によりスクライブラインＳ２を順次ブレイクする。   When the substrate W is broken by the break device 21, first, the table 22 is sandwiched between one of the scribe lines S1 and S2, for example, the scribe line S1 along the X direction and a cushion sheet 26 made of an elastic material. Place on top. At this time, the substrate W is placed so that the scribe line S1 is on the lower surface side. Then, the break bar 24 is lowered from the standby position above the substrate W toward the scribe line S1, the substrate W is pressed by the pressing blade 24a at the lower end thereof, and the substrate is bent slightly in a V shape on the cushion sheet 26. Thus, the crack of the scribe line S1 is extended to break the substrate W. Further, after the break of all the scribe lines S1 is completed, the table 22 is rotated by 90 degrees, and the scribe lines S2 are sequentially broken by the break bar 24 as described above.

特開２０１４−０８０３３６号公報JP 2014-080336 A 特開２００２−１８７０９８号公報JP 2002-187098 A

一般に、ブレイクバーによる分断では、基板に対する押し込み量が大きいと基板の撓みが大きくなり、分断側端面同士の接触等により分断端面に欠けが生じたり、亀裂が予期しない方向に走ったりすることがある。また、逆に押し込み量が少ないと、撓み不足により分断されない部分が発生する等の不具合が生じるため、ブレイクバーの適正な押し込み量を確保する必要がある。さらに、ブレイクバーの押圧刃の先端稜線は、基板に対して平行に対峙させるとともにスクライブライン全長にわたって均等に押圧力を加えることも要求される。
しかし、従来のブレイクバーは、一本の長尺材で形成されているため、ブレイクバー本体やその取付部、またテーブルやその駆動機構を含む各部材の僅かな誤差により、押圧刃の先端稜線と基板表面との平行度が微妙に狂うことがある。特に大型の基板をブレイクする際には、ブレイクバーはさらに長尺となるため、これに伴って平行度の狂いも大きくなる。
平行度に狂いが生じると、スクライブライン全長にわたって適正な押圧力で均等に押圧することができず、きれいにブレイクすることができない。そこで従来は、図６に示すように薄いシム板（スペーサ）２８を基板Ｗの低い部分の下側に差し込んで平行度を調整しているが、この作業は大変面倒であるとともに時間を要する。 In general, when cutting with a break bar, if the amount of pushing into the substrate is large, the substrate will bend greatly, the cut end surfaces may be chipped due to contact between the cut end surfaces, and cracks may run in unexpected directions. . On the other hand, if the amount of push-in is small, problems such as occurrence of a portion that is not divided due to insufficient bending occur, and therefore it is necessary to secure an appropriate push-in amount of the break bar. Furthermore, it is required that the tip ridge line of the pressing blade of the break bar faces the substrate in parallel and applies a pressing force evenly over the entire length of the scribe line.
However, since the conventional break bar is formed of a single long material, the tip ridge of the pressing blade is caused by slight errors in each member including the break bar main body, its mounting part, table and its drive mechanism. The degree of parallelism between the substrate and the substrate surface may be slightly different. In particular, when breaking a large substrate, the break bar is further elongated, and accordingly, the parallelism becomes large.
When the parallelism is out of order, the scribe line cannot be evenly pressed with an appropriate pressing force over the entire length of the scribe line and cannot be broken cleanly. Conventionally, as shown in FIG. 6, a thin shim plate (spacer) 28 is inserted below the lower portion of the substrate W to adjust the parallelism. However, this operation is very troublesome and requires time.

そこで本発明は、上記した従来課題に鑑み、シム板等を用いることなく押圧刃の先端稜線と基板表面との平行度を簡単に調整することのできるブレイクバーを備えたブレイク装置を提供することを目的とする。   Therefore, in view of the above-described conventional problems, the present invention provides a break device provided with a break bar that can easily adjust the parallelism between the tip edge line of the pressing blade and the substrate surface without using a shim plate or the like. With the goal.

上記目的を達成するために本発明では次のような技術的手段を講じた。すなわち、本発明のブレイク装置では、スクライブラインが形成された脆性材料基板を前記スクライブラインに沿ってブレイクするブレイク装置であって、前記脆性材料基板を載置する載置面を有するテーブルと、前記テーブルの上方に配置されたブレイクバーとからなり、前記ブレイクバーは、直線状に並べられた複数の押圧板から構成され、隣り合う各押圧板の間には隙間が設けられている構成とした。
上記発明において、前記押圧板のそれぞれは、前記脆性材料基板の表面に対する平行度を調整するための平行度調整機構を有している構成とするのがよい。 In order to achieve the above object, the present invention takes the following technical means. That is, in the breaking device of the present invention, the breaking device breaks a brittle material substrate on which a scribe line is formed along the scribe line, the table having a placement surface on which the brittle material substrate is placed; The break bar is arranged above the table, and the break bar is composed of a plurality of press plates arranged in a straight line, and a gap is provided between adjacent press plates.
In the above invention, each of the pressing plates may have a parallelism adjusting mechanism for adjusting parallelism with the surface of the brittle material substrate.

本発明によれば、従来のようなシム板を用いることなく、各押圧ユニットの押圧板の上下位置や回動姿勢を調整することにより、押圧刃の基板表面に対する平行度を正確かつ容易に修正することが可能となり、基板を精度よくブレイクすることができる。また、ブレイクバーを複数の押圧ユニットからなる集合体で構成しているので、基板のサイズに合わせて押圧ユニットの数を増減することにより、常に無駄のない最適な長さのブレイクバーを形成することができるといった効果がある。   According to the present invention, the parallelism of the pressing blade with respect to the substrate surface can be corrected accurately and easily by adjusting the vertical position and rotational position of the pressing plate of each pressing unit without using a conventional shim plate. This makes it possible to break the substrate with high accuracy. In addition, since the break bar is composed of an assembly of a plurality of pressing units, the number of pressing units is increased / decreased in accordance with the size of the substrate to always form a break bar having an optimal length with no waste. There is an effect that can be.

本発明において、前記平行度調整機構は、前記押圧板を前記支持プレートに対して回動自在に枢支する枢軸と、回動をロックする固定ビスとにより形成するのがよい。
これにより、簡潔に形成できるとともに調整操作を容易に行うことができる。 In the present invention, the parallelism adjusting mechanism may be formed by a pivot that pivotally supports the pressing plate with respect to the support plate, and a fixed screw that locks the rotation.
Thereby, it can form simply and adjustment operation can be performed easily.

本発明に係るブレイク装置の概略的な全体構成を示す斜視図。The perspective view which shows the schematic whole structure of the breaking apparatus which concerns on this invention. 図１におけるブレイクバーの拡大斜視図。The expansion perspective view of the break bar in FIG. 図１におけるブレイクバーの押圧ユニット部分を示す拡大正面図。The enlarged front view which shows the press unit part of the break bar in FIG. 図３におけるＢ−Ｂ線断面図。BB sectional drawing in FIG. 従来のブレイクバーを用いたブレイク装置の概略構成を示す斜視図。The perspective view which shows schematic structure of the break device using the conventional break bar. 従来のブレイクバーと基板表面との平行度の調整手段を示す説明図。Explanatory drawing which shows the adjustment means of the parallel degree of the conventional break bar and a substrate surface.

以下、本発明に係るブレイク装置の詳細を、実施図面に基づいて説明する。図１は本発明に係るブレイク装置の概略的な全体構成を示す斜視図であり、図２〜４は図１に示すブレイクバーの詳細図を示すものである。   Hereinafter, the details of the breaking device according to the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a schematic overall configuration of a break device according to the present invention, and FIGS. 2 to 4 are detailed views of the break bar shown in FIG.

本発明に係るブレイク装置Ａは、図１に示すように、基板Ｗを載置するための載置面１ａを有するテーブル１を備えており、テーブル１の表面には多数のエア吸引孔（図示外）が設けられ、この吸引孔によりエア吸引することによって基板Ｗが吸着保持されるように形成されている。
また、テーブル１は、モータ３によって回転するネジ軸４により水平なレール２に沿ってＹ方向に移動できるようになっている。さらに、テーブル１は、モータを内蔵する回転駆動部５により水平面内で回動できるようになっている。 As shown in FIG. 1, the breaking device A according to the present invention includes a table 1 having a mounting surface 1 a for mounting a substrate W, and a number of air suction holes (illustrated) The substrate W is sucked and held by sucking air through the suction holes.
The table 1 can be moved in the Y direction along a horizontal rail 2 by a screw shaft 4 rotated by a motor 3. Furthermore, the table 1 can be rotated in a horizontal plane by a rotation driving unit 5 incorporating a motor.

テーブル１を挟んで設けてある両側の支持柱６、６と、この支持柱６、６に橋架されたＸ方向に延びるビーム（横梁）７とによって門型の支持体が形成される。そして、ビーム７には、ビーム７の延在方向（Ｘ方向）に延びるブレイクバー１０が保持されている。本実施例では、ブレイクバー１０は、基板Ｗ上方の待機位置から昇降シャフト８とシリンダ９を介して基板Ｗに対し昇降可能に形成されている。   The support pillars 6 and 6 on both sides provided with the table 1 interposed therebetween and a beam (lateral beam) 7 extending in the X direction bridged by the support pillars 6 and 6 form a gate-shaped support body. The beam 7 holds a break bar 10 extending in the extending direction (X direction) of the beam 7. In the present embodiment, the break bar 10 is formed so as to be movable up and down with respect to the substrate W via the lifting shaft 8 and the cylinder 9 from a standby position above the substrate W.

ブレイクバー１０は、図２〜４に示すように、ブレイク装置Ａのビーム７に昇降シャフト８を介して昇降可能に保持された支持部材１１と、この支持部材１１により支持される複数（本実施例では５個）の押圧ユニット１２とから構成される。また、押圧ユニット１２は、支持部材１１に対して上下位置調整可能に取り付けられた支持プレート１３と、この支持プレート１３の下端に取り付けられた押圧板１４とにより構成される。   As shown in FIGS. 2 to 4, the break bar 10 includes a support member 11 that is held up and down by a beam 7 of the breaker A via a lift shaft 8, and a plurality of (this embodiment) supported by the support member 11. In the example, it is composed of five pressing units 12. The pressing unit 12 includes a support plate 13 attached to the support member 11 so that the vertical position can be adjusted, and a pressing plate 14 attached to the lower end of the support plate 13.

支持プレート１３は、支持部材１１に形成された上下に延びるアリ溝１１ａに沿って上下方向へ移動可能に取り付けられており、上下調整ボルト１５を回動することにより上下位置が調整できるようになっている。   The support plate 13 is attached so as to be movable in the vertical direction along the dovetail groove 11a formed in the support member 11 and extending vertically, and the vertical position can be adjusted by rotating the vertical adjustment bolt 15. ing.

押圧板１４は、その下端にビーム７の延在方向に沿って直線状に延びる押圧刃１４ａを有し、かつ、各押圧板１４の側端面同士が互いに隣り合うように一直線上に配置されている。
さらに、押圧板１４は、基板Ｗの表面に対して押圧刃１４ａの平行度が調整できるように平行度調整機構１６を介して支持プレート１３に取り付けられている。本実施例において、平行度調整機構１６は、押圧板１４を支持プレート１３に対して回動自在に枢支する枢軸１６ａと、回動をロックする固定ビス１６ｂとにより形成されている。また、固定ビス１６ｂは、押圧板１４に設けられた枢軸１６ａを中心とする円弧状の長孔１６ｃを介して支持プレート１３に螺合されている。
なお、隣り合う押圧板１４、１４の側端面同士の間には、平行度の調整を許容する０．３〜１ｍｍ程度の隙間Ｌが予め設けられている。 The pressing plate 14 has a pressing blade 14a extending linearly along the extending direction of the beam 7 at the lower end thereof, and is arranged on a straight line so that the side end surfaces of the pressing plates 14 are adjacent to each other. Yes.
Furthermore, the pressing plate 14 is attached to the support plate 13 via the parallelism adjusting mechanism 16 so that the parallelism of the pressing blade 14a can be adjusted with respect to the surface of the substrate W. In this embodiment, the parallelism adjusting mechanism 16 is formed by a pivot 16a that pivotally supports the pressing plate 14 with respect to the support plate 13, and a fixed screw 16b that locks the rotation. The fixing screw 16b is screwed to the support plate 13 through an arc-shaped long hole 16c centered on a pivot 16a provided on the pressing plate 14.
Note that a gap L of about 0.3 to 1 mm that allows adjustment of parallelism is provided in advance between the side end surfaces of the adjacent pressing plates 14 and 14.

上記のごとく構成されたブレイクバー１０は、次の手法により、基板Ｗ表面に対する各押圧刃１４ａの平行度の修正を簡単に行うことができる。
まず、基板Ｗのブレイク動作に先立って、固定ビス１６ｂを緩めて押圧板１４を回動自在の状態としてから上下調整ボルト１５を回動し、全ての押圧板１４を上方の待機位置から基板Ｗの表面に当接する位置まで降下させる。押圧板１４の押圧刃１４ａが基板Ｗ表面に沿った平行姿勢となった状態で、固定ビス１６ｂを締め付けて押圧板１４の姿勢を固定する。そして、上下調整ボルト１５を回動して押圧板１４を元の待機位置に戻す。このようにして、全ての押圧刃１４ａの基板Ｗ表面に対する平行度を簡単に修正することができる。 The break bar 10 configured as described above can easily correct the parallelism of each pressing blade 14a with respect to the surface of the substrate W by the following method.
First, prior to the breaking operation of the substrate W, the fixing screw 16b is loosened so that the pressing plate 14 is rotatable, and then the vertical adjustment bolt 15 is rotated, so that all the pressing plates 14 are moved from the upper standby position to the substrate W. Lower to a position where it contacts the surface of With the pressing blade 14a of the pressing plate 14 in the parallel posture along the surface of the substrate W, the fixing screw 16b is tightened to fix the posture of the pressing plate 14. Then, the vertical adjustment bolt 15 is rotated to return the pressing plate 14 to the original standby position. In this way, the parallelism of all the pressing blades 14a with respect to the surface of the substrate W can be easily corrected.

以上のごとく本発明によれば、従来のようなシム板２８を用いることなく、各押圧ユニット１２の押圧板１４の上下位置や回動姿勢を調整することにより、押圧刃１４ａの基板Ｗ表面に対する平行度を正確かつ容易に修正することが可能となり、基板Ｗを精度よくブレイクすることができる。また、ブレイクバー１０を複数の押圧ユニット１２からなる集合体による構成としたので、基板Ｗのサイズに合わせて押圧ユニット１２の数を増減することにより、常に無駄のない最適な長さのブレイクバー１０を形成することができる。   As described above, according to the present invention, by adjusting the vertical position and rotation posture of the pressing plate 14 of each pressing unit 12 without using the conventional shim plate 28, the pressing blade 14a with respect to the surface of the substrate W is adjusted. The parallelism can be corrected accurately and easily, and the substrate W can be broken with high accuracy. In addition, since the break bar 10 is configured by an assembly of a plurality of pressing units 12, the number of the pressing units 12 is increased or decreased according to the size of the substrate W, so that a break bar having an optimal length without waste is always obtained. 10 can be formed.

以上本発明の代表的な実施例について説明したが、本発明は必ずしも上記の実施形態に特定されるものではない。例えば、上記した実施例では、ブレイクバー１０を上方の待機位置から基板Ｗに向かって押し下げて、基板Ｗを撓ませることによりスクライブラインに沿ってブレイクする例を示したが、これに代えて、ブレイクバー１０を基板Ｗの表面に接触した位置で静止させて、この状態でブレイクバー１０に錘を落下させ、その衝撃により基板Ｗをスクライブラインに沿ってブレイクすることも可能である。その他本発明では、本発明の目的を達成し、請求の範囲を逸脱しない範囲内で適宜修正、変更することができる。   While typical examples of the present invention have been described above, the present invention is not necessarily limited to the above embodiments. For example, in the above-described embodiment, an example in which the break bar 10 is pushed down from the upper standby position toward the substrate W and the substrate W is bent to break along the scribe line is shown. It is also possible to stop the break bar 10 at a position in contact with the surface of the substrate W, drop a weight onto the break bar 10 in this state, and break the substrate W along the scribe line by the impact. In addition, in the present invention, the object of the present invention can be achieved and can be appropriately modified and changed without departing from the scope of the claims.

本発明は、基板上に形成したスクライブラインに沿って基板を分断するブレイク装置に利用される。   The present invention is used in a break device that divides a substrate along a scribe line formed on the substrate.

Ａ ブレイク装置
Ｗ 基板
１ テーブル
１ａ 載置面
７ ビーム
８ 昇降シャフト
１０ ブレイクバー
１１ 支持部材
１２ 押圧ユニット
１３ 支持プレート
１４ 押圧板
１４ａ 押圧刃
１５ 上下調整ボルト
１６ 平行度調整機構
１６ａ 枢軸
１６ｂ 固定ビス
A Break device W Substrate 1 Table 1a Placement surface 7 Beam 8 Lift shaft 10 Break bar 11 Support member 12 Press unit 13 Support plate 14 Press plate 14a Press blade 15 Vertical adjustment bolt 16 Parallelism adjustment mechanism 16a Pivot 16b Fixing screw

Claims (3)

スクライブラインが形成された脆性材料基板を前記スクライブラインに沿ってブレイクするブレイク装置であって、
前記脆性材料基板を載置する載置面を有するテーブルと、
前記テーブルの上方に配置されたブレイクバーとからなり、
前記ブレイクバーは、直線状に並べられた複数の押圧板から構成され、
隣り合う各押圧板の間には隙間が設けられていることを特徴とするブレイク装置。 A breaking device for breaking a brittle material substrate on which a scribe line is formed along the scribe line,
A table having a mounting surface for mounting the brittle material substrate;
A break bar disposed above the table;
The break bar is composed of a plurality of pressing plates arranged in a straight line,
A break device characterized in that a gap is provided between adjacent pressing plates. 前記押圧板のそれぞれは、前記脆性材料基板の表面に対する平行度を調整するための平行度調整機構を有している請求項１に記載のブレイク装置。   The break device according to claim 1, wherein each of the pressing plates has a parallelism adjusting mechanism for adjusting the parallelism with respect to the surface of the brittle material substrate. 前記平行度調整機構が、前記押圧板を支持プレートに対して回動自在に枢支する枢軸と、回動をロックする固定ビスとにより形成されている請求項２に記載のブレイク装置。

The break device according to claim 2, wherein the parallelism adjusting mechanism is formed by a pivot that pivotally supports the pressing plate with respect to a support plate, and a fixed screw that locks the rotation.

JP2015162847A 2015-08-20 2015-08-20 Break device Expired - Fee Related JP6627326B2 (en)

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