CN106466887B - Cutting device - Google Patents

Cutting device Download PDF

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Publication number
CN106466887B
CN106466887B CN201610270643.7A CN201610270643A CN106466887B CN 106466887 B CN106466887 B CN 106466887B CN 201610270643 A CN201610270643 A CN 201610270643A CN 106466887 B CN106466887 B CN 106466887B
Authority
CN
China
Prior art keywords
substrate
pressing
cutting
parallelism
scribe line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201610270643.7A
Other languages
Chinese (zh)
Other versions
CN106466887A (en
Inventor
冈岛康智
曽山正信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN106466887A publication Critical patent/CN106466887A/en
Application granted granted Critical
Publication of CN106466887B publication Critical patent/CN106466887B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/222—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by pressing, e.g. presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/20—Cutting beds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2628—Means for adjusting the position of the cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Forests & Forestry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)

Abstract

The invention provides a cutting device, which is provided with a cutting strip capable of simply adjusting the parallelism of a top ridge of a pressing blade and a substrate surface without using a base plate and the like. The cutting device (A) comprises: a table (1) on which a substrate (W) is placed; and a cutting bar (10) disposed above the table (1), wherein the cutting bar (10) has a plurality of linearly arranged pressing plates (14), and gaps are provided between the pressing plates (14).

Description

Cutting device
Technical Field
The present invention relates to a cutting device for dividing a substrate made of a brittle material such as glass, ceramic, or a semiconductor wafer. The present invention particularly relates to a dicing strip of a dicing apparatus that cuts a substrate along a scribe line (notch) by pressing the substrate on which the scribe line was formed in a previous step from a surface opposite to the scribe line to bend the substrate.
Background
The following methods are known in the art, for example, as disclosed in patent documents 1 and 2: a scribe line in the X direction and the Y direction perpendicular to each other is formed on the surface of a brittle material substrate (hereinafter, simply referred to as a "substrate") using a cutter wheel (also referred to as a scribe wheel), a laser beam, or the like, and then an external force is applied along the scribe line to cut the substrate, thereby dividing the substrate into unit substrates.
Fig. 5 is a perspective view schematically showing a conventional cutting device using a cutting string.
The cutting device 21 has a table 22 on which a substrate W to be processed is placed and held horizontally. The table 22 is rotatable in a horizontal plane and movable in the Y direction. A cross beam (transverse frame) 23 extending horizontally in the X direction is provided above the table 22, a plate-like cutting bar 24 extending parallel to the cross beam 23 (in the X direction) is attached to the cross beam 23, and the cutting bar 24 can be lifted and lowered via a lifting shaft 27 driven by a cylinder 25.
When the substrate W is cut by the cutting apparatus 21, first, either one of the scribe lines S1 and S2, for example, the scribe line S1 is placed on the table 22 with the buffer plate 26 made of an elastic material therebetween along the X direction. At this time, the substrate W is placed such that the scribe line S1 is positioned on the lower surface side. Then, the dicing tape 24 is lowered from the standby position above the substrate W toward the scribe line S1, and the substrate W is pressed by the pressing blade 24a at the lower end thereof to be slightly bent in a V-shape on the buffer plate 26, whereby the crack of the scribe line S1 is extended to cut the substrate W. After cutting of all the scribe lines S1 is completed, the table 22 is rotated by 90 degrees, and the scribe lines S2 are sequentially cut by the cutting bar 24 in the same manner as described above.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2014-080336;
patent document 2: japanese patent laid-open publication No. 2002-187098.
Problems to be solved by the invention
In general, in the dividing by the dicing tape, when the pressing amount of the dicing tape to the substrate is large, the substrate is largely bent, and there is a case where a damage or a crack is generated on the divided end faces due to the contact between the divided end faces and the like and extends in an unexpected direction. On the contrary, when the press-fitting amount is small, a failure such as an undivided portion occurs due to insufficient bending, and therefore it is necessary to secure an appropriate press-fitting amount of the cut piece. Further, it is necessary to face the tip ridge of the pressing blade of the cutting bar in parallel to the substrate and to apply a pressing force uniformly over the entire length of the scribe line.
However, since the cutting string of the conventional art is formed of a single long material, there is a case where the parallelism between the distal edge line of the pressing blade and the surface of the substrate is minutely deviated due to minute errors in the cutting string main body, the mounting portion thereof, the table, and the driving mechanism thereof. In particular, when a large substrate is cut, the size of the cut piece becomes further long, and thus the deviation of the parallelism also becomes large.
If the parallelism varies, the scribe line cannot be uniformly pressed with an appropriate pressing force over its entire length, and the scribe line cannot be cut perfectly. Then, in the prior art, as shown in fig. 6, a thin pad plate (shim) 28 is inserted to the lower side of the low portion of the substrate W to adjust the parallelism, but this operation is very troublesome and time-consuming.
Disclosure of Invention
In view of the above-described problems of the prior art, an object of the present invention is to provide a cutting device having a cutting blade capable of easily adjusting the parallelism between the distal edge of the pressing blade and the surface of the substrate without using a pad or the like.
Means for solving the problems
In order to achieve the above object, the present invention adopts the following technical means. That is, the cutting device of the present invention has the following configuration: a cutting apparatus that cuts a brittle material substrate formed with a scribe line along the scribe line, the cutting apparatus comprising: a table having a mounting surface on which the brittle material substrate is mounted; and a cutting bar arranged above the table, the cutting bar being composed of a plurality of pressing plates arranged in a straight line, and a gap being provided between adjacent pressing plates.
The above invention may adopt the following structure: each of the pressing plates has a parallelism adjusting mechanism for adjusting parallelism of the pressing plate with respect to the surface of the brittle material substrate.
Effects of the invention
According to the present invention, the parallelism of the pressing blade with respect to the surface of the substrate can be accurately and easily corrected by adjusting the vertical position and the rotational posture of the pressing plate of each pressing unit without using a conventional backing plate, and the substrate can be cut with high accuracy. Further, since the cutting string is formed using an aggregate of a plurality of pressing units, the number of pressing units can be increased or decreased according to the size of the substrate, and thus the cutting string having an effective and optimum length can be formed.
The following structure may be adopted in the present invention: the parallelism adjusting mechanism is formed of a pivot shaft that pivotally supports the pressing plate so as to be rotatable with respect to the support plate, and a fixing screw that locks the rotation.
Thereby, the adjustment operation can be performed easily and simply.
Drawings
Fig. 1 is a perspective view showing a schematic overall configuration of a cutting apparatus according to the present invention.
Fig. 2 is an enlarged perspective view of the cut-off strip of fig. 1.
Fig. 3 is an enlarged front view showing a pressing unit portion of the cut-off bar in fig. 1.
Fig. 4 is a sectional view taken along line B-B of fig. 3.
Fig. 5 is a perspective view showing a schematic configuration of a cutting apparatus using a conventional cutting blade.
Fig. 6 is an explanatory diagram showing a conventional mechanism for adjusting the parallelism between a dicing tape and the surface of a substrate.
Detailed Description
The cutting device of the present invention will be described in detail below with reference to the accompanying drawings. Fig. 1 is a perspective view showing a schematic overall configuration of a cutting device of the present invention, and fig. 2 to 4 are views showing details of a cutting bar shown in fig. 1.
As shown in fig. 1, the cutting apparatus a of the present invention includes a table 1, the table 1 having a mounting surface 1a on which a substrate W is mounted, and a plurality of suction holes (not shown) provided in a surface of the table 1, the substrate W being sucked and held by suction through the suction holes.
Further, the table 1 is movable in the Y direction along the horizontal rail 2 by a screw shaft 4 rotated by a motor 3. Further, the table 1 can be rotated in a horizontal plane by a rotation driving unit 5 having a built-in motor.
The gantry support is formed by support columns 6, 6 provided on both sides of the table 1, and a beam (beam)7 bridging the support columns 6, 6 and extending in the X direction. The beam 7 holds a cutting string 10 extending in the extending direction (X direction) of the beam 7. In the present embodiment, the cutting bar 10 is formed to be capable of being lifted and lowered with respect to the substrate W via the lift shaft 8 and the cylinder 9 from a standby position above the substrate W.
As shown in fig. 2 to 4, the cutting blade 10 is composed of a support member 11 and a plurality of (5 in the present embodiment) pressing units 12 supported by the support member 11, and the support member 11 is held on the cross beam 7 of the cutting device a so as to be movable up and down via the lifting shaft 8. The pressing unit 12 includes a support plate 13 and a pressing plate 14 attached to a lower end of the support plate 13, and the support plate 13 is attached to be adjustable in vertical position with respect to the support member 11.
The support plate 13 is attached to be movable in the vertical direction along a dovetail groove 11a formed in the support member 11 and extending vertically, and the vertical position can be adjusted by rotating a bolt 15 for vertical adjustment.
The pressing plates 14 have pressing blades 14a at their lower ends that linearly extend along the extending direction of the cross beam 7, and are arranged on a straight line such that the side end surfaces of the pressing plates 14 are adjacent to each other.
Further, the pressing plate 14 is attached to the support plate 13 via a parallelism adjusting mechanism 16 so that the parallelism of the pressing blade 14a can be adjusted with respect to the surface of the substrate W. In the present embodiment, the parallelism adjusting mechanism 16 is formed by a pivot shaft 16a that pivotally supports the pressing plate 14 in a freely rotatable manner with respect to the support plate 13, and a fixing screw 16b that locks the rotation. The fixing screw 16b is screwed to the support plate 13 through an arc-shaped elongated hole 16c provided in the pressing plate 14 with the pivot shaft 16a as the center.
Further, a gap L of about 0.3 to 1mm that allows adjustment of parallelism is provided between the side end surfaces of the adjacent pressing plates 14, 14.
The cutting blade 10 configured as described above can easily correct the parallelism of the pressing blades 14a with respect to the front surface of the substrate W by the following method.
First, before the cutting operation of the substrate W, the fixing screws 16b are loosened to allow the pressing plates 14 to be in a rotatable state, and then the upper and lower adjusting bolts 15 are rotated to lower all the pressing plates 14 from the upper standby position to a position where they are in contact with the surface of the substrate W. The posture of the pressing plate 14 is fixed by screwing the fixing screw 16b in a state where the pressing blade 14a of the pressing plate 14 is in a parallel posture along the front surface of the substrate W. Then, the upper and lower adjusting bolts 15 are turned to return the pressing plate 14 to the original standby position. This makes it possible to easily correct the parallelism of all the pressing blades 14a with respect to the front surface of the substrate W.
According to the present invention as described above, the parallelism of the pressing blade 14a with respect to the front surface of the substrate W can be accurately and easily corrected by adjusting the vertical position and the rotational posture of the pressing plate 14 of each pressing unit 12 without using the pad plate 28 as in the conventional technique, and the substrate W can be cut with high accuracy. Further, since the cutting string 10 has a structure of an aggregate of a plurality of pressing units 12, the number of the pressing units 12 is increased or decreased according to the size of the substrate W, and thus the cutting string 10 having an effective and optimum length can be always formed.
Although the representative embodiments of the present invention have been described above, the present invention is not limited to the above embodiments. For example, in the above-described embodiment, the example in which the substrate W is bent and cut along the scribe line by pressing the cutting bar 10 from the upper standby position toward the substrate W has been described, but instead, the cutting bar 10 may be stopped at a position in contact with the surface of the substrate W, a hammer may be dropped to the cutting bar 10 in this state, and the substrate W may be cut along the scribe line by the impact of the hammer. In addition, the present invention can be modified and changed as appropriate without departing from the scope of the claims to achieve the object of the present invention.
Industrial applicability of the invention
The present invention can be used for a cutting device for dividing a substrate along a scribe line formed on the substrate.
Description of the reference numerals
A: a cutting device;
w: a substrate;
1: a work table;
1 a: a carrying surface;
7: a cross beam;
8: a lifting shaft;
10: cutting the strips;
11: a support member;
12: a pressing unit;
13: a support plate;
14: a pressing plate;
14 a: pressing the blade;
15: a bolt for adjusting the upper and lower parts;
16: a parallelism adjusting mechanism;
16 a: a pivot;
16 b: and fixing the screw.

Claims (1)

1. A cutting apparatus that cuts a brittle material substrate formed with a scribe line along the scribe line, the cutting apparatus comprising:
a table having a mounting surface on which the brittle material substrate is mounted; and
a cutting strip arranged above the worktable,
the cutting strip is composed of a plurality of pressing plates, each of which is arranged on a straight line in a manner that side end surfaces thereof are adjacent to each other,
gaps are arranged between every two adjacent pressing plates,
each of the pressing plates has a parallelism adjusting mechanism for adjusting parallelism of the pressing plate with respect to a surface of the brittle material substrate,
the parallelism adjusting mechanism is formed by a pivot and a set screw,
the pivot shaft pivotally supports the pressing plate so as to be rotatable with respect to the support plate, and the fixing screw locks the rotation.
CN201610270643.7A 2015-08-20 2016-04-27 Cutting device Expired - Fee Related CN106466887B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015162847A JP6627326B2 (en) 2015-08-20 2015-08-20 Break device
JP2015-162847 2015-08-20

Publications (2)

Publication Number Publication Date
CN106466887A CN106466887A (en) 2017-03-01
CN106466887B true CN106466887B (en) 2020-05-26

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JP (1) JP6627326B2 (en)
KR (1) KR20170022856A (en)
CN (1) CN106466887B (en)
TW (1) TWI695767B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6949371B2 (en) * 2017-12-15 2021-10-13 三星ダイヤモンド工業株式会社 Board divider
CN108724482B (en) * 2018-08-01 2022-05-27 上海祖强能源有限公司 Pressure applying device
CN109336376B (en) * 2018-11-09 2020-04-28 深圳市华星光电半导体显示技术有限公司 Substrate splitting device
CN109822767B (en) * 2019-04-03 2021-01-29 南通苏东新型外墙保温板有限公司 Building insulation material processing system with practical structure

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CN102218777A (en) * 2010-03-31 2011-10-19 三星钻石工业股份有限公司 Disjunction method of brittle material substrate
CN102636890A (en) * 2012-04-11 2012-08-15 南京理工大学常熟研究院有限公司 Structure with adjustable parallelism
CN204183493U (en) * 2014-09-16 2015-03-04 中国建材国际工程集团有限公司 Valve plate dip angle regulating device
CN104552614A (en) * 2013-10-25 2015-04-29 三星钻石工业股份有限公司 Cutting method and device of substrate made of fragile material

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JP3792508B2 (en) 2000-12-19 2006-07-05 三星ダイヤモンド工業株式会社 Method for dividing bonded brittle substrates
JP4629795B2 (en) * 2007-12-04 2011-02-09 パナソニック株式会社 Component crimping apparatus and method
KR101181170B1 (en) * 2010-07-30 2012-09-18 강두석 Mill machine for grain
JP5981791B2 (en) * 2012-07-18 2016-08-31 三星ダイヤモンド工業株式会社 Breaking device for brittle material substrate
JP2014080336A (en) 2012-10-17 2014-05-08 Mitsuboshi Diamond Industrial Co Ltd Substrate dividing device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102218777A (en) * 2010-03-31 2011-10-19 三星钻石工业股份有限公司 Disjunction method of brittle material substrate
CN102636890A (en) * 2012-04-11 2012-08-15 南京理工大学常熟研究院有限公司 Structure with adjustable parallelism
CN104552614A (en) * 2013-10-25 2015-04-29 三星钻石工业股份有限公司 Cutting method and device of substrate made of fragile material
CN204183493U (en) * 2014-09-16 2015-03-04 中国建材国际工程集团有限公司 Valve plate dip angle regulating device

Also Published As

Publication number Publication date
JP6627326B2 (en) 2020-01-08
TW201707909A (en) 2017-03-01
CN106466887A (en) 2017-03-01
KR20170022856A (en) 2017-03-02
JP2017039272A (en) 2017-02-23
TWI695767B (en) 2020-06-11

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