JP2016043688A - Break method for composite substrate and break device therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a break method capable of efficiently surely breaking a composite substrate in such a state that there is no remaining unbroken portion, and to provide a break device therefor.SOLUTION: There is provided a break method for a composite substrate W in which a resin layer 3 is formed on one side of a substrate body 1 comprising a brittle material via an adhesive layer 2 and plural rows of scribe line S are formed on the surface of the substrate body 1. The method comprises: a first break process of pressing the blade tip of a break bar 8 into a resin layer 3 and the adhesive layer 2 while cutting into by sticking the composite substrate W to an adhesive tape 5 placing the substrate body 1 at a lower side and by pressing the break bar 8 to the scribe line S from the upper face of the resin layer 3 and bowing down the substrate body 1 below to break the substrate body 1 along the scribe line S: and a second break process of bowing down again the broken line L broken in the first break process to break a remaining unbroken portion by placing the adhesive tape 5 on an upper side and press-rolling a roller 13 on overall width of the upper face of the composite substrate W.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a composite substrate breaking method and a breaking device in which a resin layer such as a silicone resin is formed on one surface of a substrate body made of a brittle material such as glass or ceramic via an adhesive layer.

  Conventionally, a scribe line is formed on a composite substrate using a cutter wheel (also called a scribing wheel) or a dicing saw in advance, and then the substrate is bent by applying an external force. A method of taking out a unit product such as a chip by breaking along the line is known. For example, Patent Document 1 and Patent Document 2 disclose the method.

FIG. 1 shows a composite substrate W in which a resin layer 3 such as a silicone resin is formed on one side of a substrate body 1 made of a brittle material such as glass or ceramic with a circuit pattern formed on the surface or inside. It is a figure for demonstrating a general break method.
As shown in FIG. 1B, by rolling the cutter wheel 4 against the substrate body 1 of the composite substrate W along the planned scribe line, a scribe line S composed of cracks of finite depth is formed. Process. Then, as shown in FIG. 1 (c), the composite substrate W is affixed to an elastic adhesive tape 5 supported by a dicing ring 10 (see FIG. 2) with the substrate body 1 facing downward. Attach it on the stage 6.
The stage 6 is formed with a pair of receiving blades 7 and 7 that receive the lower surface of the composite substrate W at the left and right positions across the scribe line S. The stage 6 is sharply above the portion of the substrate W facing the scribe line S. A break bar 8 having a sharp cutting edge is arranged.
The break bar 8 is pushed into the resin layer 3 while being cut into the resin layer 3 as shown in FIG. 1D, so that the resin layer 3 and the adhesive layer 2 are first divided, and then the composite substrate W is bent by further pressing to form the substrate body. 1 is also divided from the scribe line S.

  In addition, as shown in FIG. 1 (f), when the groove 9 is formed on the resin layer 3 with a dicing saw or the like, the adhesive layer 2 is divided by pushing the break bar 8 into the groove 9 at the same time. The composite substrate W is bent, and the substrate body 1 is also separated from the scribe line S.

JP 2012-131216 A JP 2011-212963 A

The break bar 8 used for dividing the resin layer 3 and the adhesive layer 2 requires a sharp cutting edge with a sharp tip to cut these layers. However, the break bar 8 not only divides the resin layer 3 and the adhesive layer 2, but also presses and flexes the substrate body 1 continuously after these divisions, and divides it along the scribe line S processed previously. Therefore, a large load is applied when the substrate is divided. Therefore, if the blade edge angle is too small, damage such as blade spillage or breakage occurs, so the blade edge angle is limited to about 10 degrees.
However, since the adhesive layer 2 of the composite substrate W is ductile even if the layer itself is thin, even if the edge angle of the break bar 8 is sharply formed to the limit of 10 degrees, the break bar 8 is pressed. Then there may be no break. Moreover, depending on the case, a part of the resin layer 3 may be left undivided, except when cutting with a dicing saw. If such a partial unsettled portion is generated, an adverse effect is caused in the next process that continues in the flow work, causing trouble.

  Accordingly, an object of the present invention is to solve the above-described conventional problems, and to provide a novel breaking method capable of breaking the composite substrate reliably and efficiently in a state where there is no remaining separation.

  In order to achieve the above object, the present invention takes the following technical means. That is, according to the breaking method of the present invention, a resin layer such as a silicone resin is formed on one surface of a substrate body made of a brittle material via an adhesive layer, and a plurality of scribe lines are formed on the surface of the substrate body at a predetermined pitch. A composite substrate breaking method, wherein the composite substrate is attached to an elastic adhesive tape with the substrate body of the composite substrate facing down, and the scribe line is formed from the upper surface of the resin layer of the composite substrate. By pushing a break bar having a sharp edge toward the edge, the break bar edge is pushed into the resin layer and the adhesive layer while being pushed, and the substrate body is bent downward to thicken the cracks in the scribe line. A first breaking step of breaking the substrate body by penetrating in the direction, and the composite substrate with the adhesive tape facing upward By rolls while pressing the roller across the face the entire width, and a structure comprising a second breaking step of breaking the a portion of divided remaining flexed again break has been divided line in the first breaking process.

In the present invention, the edge angle of the break bar used in the first breaking step is preferably 10 to 50 degrees. Further, the present invention is suitable for a break of a composite substrate in which the substrate body of the composite substrate is glass or ceramic, and the resin layer is a laminated material of silicone or solder resist and silicone.
Furthermore, in the present invention, the breaking device for performing the second breaking step includes a table on which the composite substrate is placed, a portal beam provided across the table, and provided on both sides of the table. In the plane including the surface of the table, when the extending direction of the beam is the X direction, the beam extends in the Y direction perpendicular to the X direction, and the relative moving direction of the beam with respect to the table A rail that regulates the beam, a drive mechanism that drives the beam to move relative to the table along the rail, and an axis that extends in the X-axis direction and extends in the X-axis direction. A roller that is rotatably held by the beam, an adjusting means for adjusting the vertical position of the roller with respect to the beam, and restrains the roller from rising upward It can be used breaking apparatus provided with a fit of the pressing member.

  According to the present invention, in the second scribe process, the remaining part of the adhesive layer and the resin layer generated in the first breaking process can be reliably divided by pressing and rolling the roller. Trouble can be avoided. In addition, even if the adhesive layer and the resin layer are not completely separated in the preceding first breaking step, they are broken again by the pressing and rolling of the roller in the second breaking step, so that they are used in the first breaking step. Therefore, it is not necessary to sharpen the edge of the break bar to be sharpened, so that not only the strength of the break bar can be ensured but also the service life can be extended.

  Further, in the second breaking step, by rolling while pressing the roller over the entire width of the upper surface of the composite substrate, the divided portion of the composite substrate is continuously bent and broken, so the tact time can be shortened. There is also an advantage that it can be done.

Explanatory drawing which shows the breaking method of the composite substrate used as division | segmentation object. The perspective view which shows the sticking state of the composite substrate to the adhesive tape of a dicing ring. Sectional drawing of FIG. The whole perspective view which shows a 2nd break device. The partially expanded sectional view which shows the roller pressing member in a 2nd break device. Sectional drawing which shows the table mounting state of the composite substrate in a 2nd break process. FIG. 7 is a partially enlarged sectional view of FIG. 6. Sectional drawing which shows operation | movement of a 2nd break process. The schematic diagram explaining the relationship between a roller diameter and the quality of a division surface. Explanatory drawing of the opening angle (theta) of the depth direction in the parting line produced by a board | substrate bending.

Hereinafter, details of a breaking method and a breaking device according to the present invention will be described in detail with reference to the drawings illustrating an embodiment.
The structure of the composite substrate W to be a break target of the present invention is the same as that of the composite substrate W shown in FIG. 1A, and glass or ceramic having an electronic circuit pattern (not shown) formed on the upper surface or inside thereof. It is formed of a laminate in which a substrate body 1 made of a brittle material and a resin layer 3 such as silicone are laminated with an adhesive layer 2 interposed therebetween. The resin layer 3 may be a laminate of silicone and solder resist. The total thickness of the composite substrate W is about 0.1 to 1.0 mm. Further, as shown in FIG. 1B, a plurality of scribe lines S are formed on the surface of the substrate body 1 at a predetermined pitch by the cutter wheel 4 in the preceding scribe process.

In the breaking method of the present invention, for the composite substrate W in which the scribe line S is formed on the substrate body 1, first, the same breaking process (first breaking process) as the procedure shown in FIGS. I do.
That is, the composite substrate W processed with the scribe line S is elastically supported by the dicing ring 10 with the substrate body 1 facing downward as shown in FIG. 1C and FIGS. Affixed to a certain adhesive tape 5 and placed on the stage 6 of the first breaking device.
A pair of receiving blades 7 and 7 that receive the lower surface of the composite substrate W across the scribe line S are disposed on the stage 6 of the first break device, and are opposed to the scribe line S of the composite substrate W. Above the portion, a break bar 8 having a sharp blade edge with a blade edge angle of 10 to 50 degrees, preferably 15 to 25 degrees, for example, 20 degrees is disposed. As shown in FIG. 1 (d), the break bar 8 is pushed into the resin layer 3 and the adhesive layer 2 while being pushed, and the substrate body 1 is bent downward to penetrate the cracks in the scribe line S in the thickness direction. Break the main body 1. A cushion sheet (not shown) can be used in place of the pair of receiving blades 7, 7.
In this first breaking step, the composite substrate W is broken along the scribe line S. As described above, in the first breaking step, the composite layer W is formed on the adhesive layer 2 or in some cases the resin layer 3. As shown in 1 (e), the remainder of the division occurs.

In the present invention, following the first breaking step, a second breaking step described below is performed to completely break the above-mentioned divided remaining portion.
FIG. 4 is a perspective view showing an example of a second breaking device for performing the second breaking step. The second breaker A includes a table 11 on which the composite substrate W supported by the dicing ring 10 is placed, and a portal beam 12 is provided so as to straddle the table 11. The beam 12 is installed so as to be movable along the left and right rails 18 and 18 extending in the Y direction, and is driven by a drive mechanism (not shown).

  In the above embodiment, the beam 12 is moved by the driving mechanism. Conversely, the beam may be fixed to the pedestal and the table may be moved along the rail.

  Further, a roller 13 extending horizontally in the X direction is rotatably held by the beam 12. The roller 13 is formed of a hard resin such as iron, aluminum, or acrylic having a diameter of 5 to 20 mm, and is formed with a length capable of pressing at least the entire width of the composite substrate W to be divided. In this embodiment, an iron material having a diameter of 10 mm is used. As will be described later, the diameter of the roller 13 is preferably selected according to the distance between adjacent scribe lines S (that is, the width of the unit substrate) and the thickness of the composite substrate W.

  The rollers 13 are held at both left and right ends of the beam 12 via adjustment screws 14, and are attached to the beam 12 so that the vertical position can be adjusted by the adjustment screws 14. Further, as shown in FIG. 5, the roller 13 is suppressed from being lifted upward by a pressing member 15 that can be adjusted up and down at an intermediate position. The vertical adjustment of the pressing member 15 is formed so as to be performed with the adjusting screw 16.

Following the first breaking step, as shown in FIGS. 6 and 7, the composite substrate W is placed on the table 11 of the second breaking device A with the adhesive tape 5 of the dicing ring 10 to which the composite substrate W is attached facing upward. Placed on. At this time, an elastic cushion sheet 17 is laid on the lower surface of the composite substrate W. The cushion sheet 17 is preferably a foamed resin such as rubber or sponge.
Next, by rolling while pressing the roller 13 against the upper surface of the composite substrate W, as shown in FIG. 8, the dividing line L previously broken in the first breaking step is bent again, and the adhesive layer 2 or The remaining part of the resin layer 3 is completely divided. The relative position and pressing force of the roller 13 with respect to the composite substrate W can be adjusted with the adjusting screw 14 in accordance with the thickness and composition material of the composite substrate W. And the unit board | substrate divided | segmented separately is taken out in the state affixed on the adhesive tape 5. FIG.

  As described above, according to the present invention, in the second scribe process, the remaining undivided portion of the adhesive layer 2 and the resin layer 3 generated in the first break process can be reliably broken by the pressure rolling of the roller 13. Troubles in the subsequent next process can be avoided in advance. In addition, even if the adhesive layer 2 and the resin layer 3 are not completely separated in the preceding first breaking step, they are broken again by the pressing rolling of the roller 13 in the second breaking step. There is no need to sharpen the cutting edge of the break bar 8 used in the breaking process so sharply that not only the strength of the break bar 8 can be secured but also the service life can be extended.

(Selection of roller diameter)
In the above-described embodiment, the composite substrate W on which the scribe lines S are defined for each product chip on the substrate is broken using the roller 13 having a diameter of 10 mm.
However, when a break process is performed with the same roller 13 on a plurality of types of composite substrates W having different distances between adjacent scribe lines S (that is, the width of a unit substrate) or different substrate thicknesses, There was a composite substrate W in which the substrate body (glass) 1 was damaged. Thus, as a result of experiments conducted by the inventors to examine a solution for eliminating damage to the substrate body 1, it was found that selection of the roller diameter is important.

  That is, the roller 13 having a diameter of 5 mm to 20 mm is prepared, the width of the adjacent scribe line S (that is, the size of the product chip) is 1 mm to 3.5 mm, and the plate thickness is 0.8 mm to 1 mm (glass substrate 0). The composite substrate W having a thickness of 0.5 mm and a resin layer of 0.3 mm to 0.5 mm was subjected to an experiment.

  For example, if a composite substrate having a width of adjacent scribe lines of 1.5 mm, a glass substrate thickness of 0.5 mm, and a resin layer thickness of 0.45 mm is broken, the glass substrate is damaged at a roller diameter of 10 mm. However, when the roller diameter was 15 mm, it could be properly divided. On the other hand, when the roller diameter was 20 mm, the glass substrate was not damaged, but a parting residue (a state where the resin layer was not separated) occurred.

FIG. 9 is a schematic diagram for explaining the relationship between the roller diameter and the quality of the sectional surface.
As a result of investigating the cause of the above-mentioned problem, the glass substrate body that becomes a separation piece after dividing due to the large deflection of the composite substrate W during rolling when the roller 13 has a too small curvature (FIG. 9A). It turned out that one thing collided and was damaged. On the other hand, it was found that if the roller diameter is too large (FIG. 9C), the amount of bending of the composite substrate W becomes insufficient during rolling, and the resin layer 3 cannot be separated. Therefore, if an appropriate roller diameter between these (FIG. 9B) is used, the divided glass substrate main bodies 1 do not contact each other and the resin layer 3 can be separated, so that there is an appropriate roller diameter range. I understood.

  Therefore, a range is selected in which the value of the diameter of the roller 13 is smaller than the diameter at which an unseparated dividing line is generated after rolling, and larger than the diameter at which damage due to collision between the separated pieces occurs after rolling. As a result, it has become possible to divide with high quality and good reproducibility.

  This appropriate roller diameter range varies depending on the distance between adjacent scribe lines and the substrate thickness, so check the range of roller diameters that can be processed appropriately by conducting an experiment for each substrate to be processed in advance. It is desirable to keep it. The normal size of the product chip is 1 mm to 3.5 mm, and a composite substrate having a plate thickness of 0.8 mm to 1 mm (glass substrate 0.5 mm, resin layer 0.3 mm to 0.5 mm) is used. Within that range, if a roller having a diameter of 12 mm to 18 mm was used, it could be divided with good quality.

The inventors conducted further experiments to make it possible to objectively determine the range of roller diameters that can be divided with high quality. That is, the moving degree of the substrate when the roller rolls and passes through the scribe line is photographed, and as shown in FIG. 10, the opening angle in the depth direction in the dividing line L generated by bending the composite substrate W The maximum angle of θ was measured from the image.
As a result, it was found that when the opening angle θ is set to 5 ° <θ <15 °, high-quality division can be performed without causing damage to the substrate or unseparation of the resin layer (residual separation).

  As mentioned above, although the typical Example of this invention was described, this invention is not necessarily specified only by said Example structure, In the range which achieves the objective of this invention and does not deviate from a claim. It can be modified and changed as appropriate.

  The present invention is suitably used for dividing a composite substrate in which a resin layer such as a silicone resin is formed on one side of a substrate body made of a brittle material such as glass or ceramic via an adhesive layer.

A 2nd break device L Cutting line S Scribe line W Composite substrate 1 Substrate body 2 Adhesive layer 3 Resin layer 4 Cutter wheel 5 Adhesive tape 8 Break bar 10 Dicing ring 11 Table 12 Beam 13 Roller

Claims (11)

A composite substrate breaking method in which a resin layer such as a silicone resin is formed on one surface of a substrate body made of a brittle material via an adhesive layer, and a plurality of scribe lines are formed at a predetermined pitch on the surface of the substrate body. There,
With the substrate body of the composite substrate facing down, the composite substrate is attached to an elastic adhesive tape, and a break bar having an acute blade edge is pressed from the upper surface of the resin layer of the composite substrate toward the scribe line. Thus, the cutting edge of the break bar is pushed in while cutting into the resin layer and the adhesive layer, and the substrate body is bent downward to penetrate the cracks in the scribe line in the thickness direction to break the substrate body. One break process,
By rolling while pressing the roller over the entire upper surface of the composite substrate with the adhesive tape facing upward, the parting line that was broken in the first breaking step is bent again to break the part that was left behind. A method of breaking a composite substrate comprising a two-break process.   The method for breaking a composite substrate according to claim 1, wherein the edge angle of the break bar used in the first breaking step is 10 to 50 degrees.   The breaking method according to claim 1 or 2, wherein the substrate body of the composite substrate is glass or ceramic, and the resin layer is silicone or a laminate of solder resist and silicone.   The diameter of the roller used in the second breaking step is smaller than the diameter at which a dividing line in which the resin layer is not separated after rolling is generated, and the diameter at which the substrate body is damaged due to collision between the separated pieces after rolling. The break method according to any one of claims 1 to 3, wherein the break method is selected so as to be in a larger range.   The diameter of the roller used in the second breaking step is selected so that the opening angle in the depth direction in the dividing line is larger than 5 degrees and smaller than 15 degrees due to bending of the substrate during rolling. The breaking method according to any one of claims 1 to 3. A breaking device for performing a second breaking step in the breaking method according to claim 1,
A table on which the composite substrate is placed;
A portal beam provided to straddle the table;
The table of the beam is provided on both sides of the table and extends in the Y direction perpendicular to the X direction when the beam extending direction is the X direction in a plane including the surface of the table. A rail that regulates the direction of movement relative to
A drive mechanism for driving the beam to move relative to the table along the rail;
A roller extending in the X-axis direction and rotatably held by the beam about an axis extending in the X-axis direction as a rotation axis;
Adjusting means for adjusting the vertical position of the roller with respect to the beam;
A pressing member for suppressing upward lifting of the roller;
Break device equipped with. A table on which the substrate is placed;
A portal beam provided to straddle the table;
The table of the beam is provided on both sides of the table and extends in the Y direction perpendicular to the X direction when the beam extending direction is the X direction in a plane including the surface of the table. A rail that regulates the direction of movement relative to
A drive mechanism for driving the beam to move relative to the table along the rail;
A roller extending in the X-axis direction and rotatably held by the beam about an axis extending in the X-axis direction as a rotation axis;
Adjusting means for adjusting the vertical position of the roller with respect to the beam;
A pressing member for suppressing upward lifting of the roller;
Break device equipped with. The roller is held via an adjustment screw that functions as the adjustment means, and the adjustment screw is attached to both left and right ends of the beam,
The break according to claim 6 or 7, wherein a pressing member having a biasing member is attached to a central position of the beam, and the pressing member biases the roller to prevent the roller from being lifted. apparatus.   The break device according to any one of claims 6 to 8, wherein the roller has a diameter of 12 mm to 18 mm.   The break device according to claim 6, wherein the drive mechanism moves the beam along the rail.   The break device according to any one of claims 6 to 9, wherein the drive mechanism moves the table along the rail.

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