TWI593001B - Breaking method and breaking device of brittle material substrate - Google Patents

Description

Breaking method and breaking device for brittle material substrate

The present invention relates to a method and a breaking device for a substrate comprising a brittle material such as glass, ruthenium, alumina, ceramics, or a compound semiconductor. In particular, the present invention relates to a method of dividing a substrate into a wafer or the like in a short strip or grid shape along a plurality of scribe lines formed on a substrate, and a breaking device therefor.

Since the prior art, it is known to form a plurality of scribe lines using a dicing saw, a cutter wheel, and a laser beam on a brittle material substrate, and then apply an external force to bend the substrate along the scribe line. By breaking, a unit product such as a wafer is taken out (for example, Patent Document 1, Patent Document 2, etc.).

When the bending moment is applied to the brittle material substrate by applying a bending moment along the scribe line, in order to effectively generate the bending moment, it is preferably carried out by a three-point bending method as shown in the above-mentioned patent document or the like.

3 is a view showing an alumina substrate or a LTCC (Low Temperature Co-fired Ceramics) substrate (low temperature calcined ceramic substrate) in which a plurality of electronic components (fine electronic circuits) are formed on the surface, and is fractured by a three-point bending method. Take the usual breaking step of the electronic part.

The substrate W having a plurality of electronic components formed on its surface and covered with the protective tape 11 to cover its electronic component forming surface is attached to the lower surface of the elastic adhesive film 13 supported by the dicing ring 12 so as to face downward. On the electronic component forming surface of the substrate W, a plurality of scribe lines S are formed in the previous step, and one of the lower surfaces of the receiving substrate W is disposed at the left and right positions across the scribe line S. On the opposite side of the substrate W and the surface on which the scribe line S is provided, in contrast to the scribe line S The upper blade 15 is disposed above the portion. By pressing the upper blade 15 from above the adhesive film 13 to the substrate W, the substrate W is bent and is broken from the scribe line S.

Further, in order to accurately break the scribe line S, an alignment mark for alignment with the position of the upper blade 15 is provided on the substrate W, and the surface of the substrate W is imaged by an imaging device (not shown), thereby referring to the image taken. The alignment mark is positioned to locate the fracture. Positioning by the image pickup device may also be performed by referring to the scribe line itself instead of the alignment mark.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-212963

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2010-014945

When the upper surface of the substrate W is pressed against the upper blade 15 and the substrate W is bent and broken by the above-described three-point bending method, it is necessary to contact the upper surface of the substrate W from the upper surface of the substrate W until the scribe line is broken. Fixed press stroke (pressing amount). In the case of, for example, an alumina substrate having a thickness of 0.64 mm, the press-in amount must be about 0.1 mm.

Since the press-fitting operation by the upper blade 15 is performed only by the number of underlined one substrate, if the amount of press-fitting is large, the adhesive tape may be less "retracted" which cannot be restored. When such "wrinkles" occur, an error occurs in the alignment of the substrate by the above-described image pickup device, and it is impossible to accurately break from the scribe line S.

Further, if the amount of press-in of the upper blade is large, as shown in FIG. 4, the edge of the upper end surface 16 of the substrate W interferes with each other to make the portion lack, and the processing of the product is greatly impaired. The problem of quality.

Accordingly, an object of the present invention is to solve the above-mentioned problems, and to provide a substrate breaking method and a substrate breaking device which can reduce the amount of press of the upper blade at the time of fracture.

In order to achieve the above object, the present invention adopts the technical means as described below. That is, in the substrate cutting method of the present invention, the brittle material substrate is attached to the underside of the elastic adhesive film supported by the cutting ring, and a plurality of lines are formed under the open surface of the brittle material substrate. a pair of supporting knives are abutted on the lower surface of the substrate at the left and right positions, and the upper surface of the brittle material substrate opposite to the surface on which the scribe line is provided is disposed on the surface opposite to the scribe line. The upper blade is pressed against the brittle material substrate from above the adhesive film, whereby the brittle material substrate is broken along the scribe line by a three-point bending moment, and the adhesion of the brittle material substrate is maintained when the upper blade is broken. The film is subjected to a downward tension, and the pair of supporting blades are placed at a position where the adhesive film is pushed up to be broken.

Further, the substrate cutting device of the present invention has a configuration in which a substrate of a brittle material is attached to an underside of an elastic adhesive film supported by a cutting ring, and a cross-sectional line formed on the lower surface of the brittle material substrate is formed. Locating a pair of supporting blades on the lower surface of the substrate abutting on the left and right positions, on the opposite side of the surface of the brittle material substrate on which the scribe line to be divided is provided, above the portion opposite to the scribe line The upper blade is disposed, and the brittle material substrate is pressed by the upper blade from above the adhesive film, thereby breaking the brittle material substrate along the scribe line by a three-point bending moment, and maintaining the above-mentioned rupture by the upper blade The pair of supporting blades are disposed at a position where the adhesive film of the brittle material substrate generates a downward tension.

According to the present invention, the adhesive film of the holding substrate is lifted by the support blade to generate a downward tension, so that the substrate is always subjected to a force such as a tear line by the adhesive film, and as a result, even if the upper blade presses the substrate The amount is small, and it can also be broken from the score line. Therefore, the amount of pressing of the upper blade to the substrate can be reduced as compared with the prior method, so that deformation due to small wrinkles and the like of the adhesive film can be suppressed due to the reverse lifting of the upper blade, thereby eliminating the breaking of the substrate. Position offset Health. Moreover, the amount of press-fitting of the upper blade to the substrate is small, and the substrate is subjected to a tensile force in the direction of tearing from the scribe line by the adhesive film, and therefore has the following effect: at the time of the break, the edge of the upper end of the split end face is mutually Without interference, it can produce high-quality products without defects.

In the substrate cutting device of the present invention, it is preferable that the support blade is formed to be vertically adjustable by a movable stage that can be moved up and down.

Thereby, the amount of lift of the adhesive film lifted by the support blade can be finely adjusted at an appropriate position according to the substrate to be broken.

1‧‧‧ cutting ring

2‧‧‧Adhesive film

3‧‧‧Protection tape

4‧‧‧Support knife

6‧‧‧Upper knife

S‧‧‧

W‧‧‧Substrate

Fig. 1 is a perspective view showing a state in which an alumina substrate to be a breaking target is attached to an adhesive film supported by a cutting ring.

Figure 2 is a cross-sectional view of the substrate breaking device of the present invention.

Fig. 3 is a cross-sectional view showing an example of a previous breaking step by a three-point bending moment.

Fig. 4 is a cross-sectional view showing a state in which the substrate is broken by a three-point bending moment.

Hereinafter, details of the substrate cutting method and the substrate cutting device of the present invention will be described in detail based on the drawings showing one embodiment. Here, a case where the aluminum substrate in which a plurality of electronic components are integrally formed is broken and the electronic component is taken out will be described as an example.

Fig. 1 is a perspective view showing a state in which an alumina substrate to be a breaking target is attached to an adhesive film supported by a cutting ring, and Fig. 2 is a cross-sectional view showing the substrate cutting device of the present invention.

As shown in FIG. 1, the substrate W to be processed is attached to the adhesive surface of the adhesive film 2 supported by the dicing ring 1 in a state in which the electronic component forming surface faces upward. The adhesive film 2 is formed of a resin sheet having elasticity, and is fixed around the cut ring 1 in a state of being opened. On the electronic component forming surface of the substrate W, a plurality of scribe lines S are processed in the previous step, and the surface thereof is covered and protected by the protective tape 3. At the time of the fracture processing, the protective tape 3 is reversed so that the cutting ring 1 is placed on the fixed stage 5 of the substrate breaking device described below.

As shown in FIG. 2, the substrate cutting device includes: a pair of right and left support knives 4, 4 which are placed under the substrate at the left and right positions of the scribe line S formed under the inverted substrate W; The stage 5 is provided with a cutting ring 1 and an upper blade 6 disposed above a portion of the substrate W opposite to the scribe line S. The upper surfaces of the support blades 4, 4 are formed by flat faces.

When the cutting ring 1 is placed on the fixed stage 5, the adhesive film 2 holding the substrate W underneath is lifted by the supporting blades 4, 4 to generate a downward tension (elastic restoring force), in advance The positions of the pair of support blades 4, 4 described above are set. The amount of lift H is preferably about 1.3 mm when the inner diameter of the cutting ring 1 is 250 mm and the thickness of the substrate W is 0.64 mm.

Further, in the present embodiment, the support base 7 is attached via an adjustment mechanism (not shown) so that the distance between the right and left support blades 4, 4 can be adjusted. Further, the support table 7 is attached to the moving stage 8, and the moving stage 8 is formed to be movable up and down by a moving mechanism (not shown), thereby being formed to be able to support the blades 4, 4 The height position is finely adjusted.

In addition, in the substrate W, an alignment mark for alignment with the upper blade 6 is provided on the substrate W, and an alignment mark is imaged by an imaging device (not shown), thereby performing breakage. The position is positioned and fractured. In this case, the positioning of the fracture position may be performed with reference to the scribe line itself without using the alignment mark.

In the substrate cutting device formed as described above, by pressing the upper blade 6 from above the adhesive film 2 to the substrate W, the substrate W is scribed by the three-point bending moment formed by the supporting knives 4, 4. fracture.

During the breaking operation, the adhesive film 2 holding the substrate W underneath is lifted by the support knives 4, 4 to generate a downward tension, so that the substrate W is oriented by the direction of the adhesive film 2 as indicated by the arrow in the figure. The tensile force is always subjected to a force such as a tear line S. As a result, even if the amount of pressing of the upper blade 6 to the substrate is small, the line S can be broken.

In order to actually confirm the effect of the present invention, the inner diameter of the cutting ring 1 is 250 mm, the thickness of the substrate W is 0.64 mm, and the lifting amount H of the adhesive film 2 is 1.3 mm. As a result of the crack test, the amount of the upper blade press-fitting in the case where the adhesive film having the cut ring 1 opened is horizontal (the state in which the tension is not applied) is 0.1 mm, whereas the method of the present invention is used. In the case of implementation, the fracture can be carried out at a reduction of about half of 0.05 mm.

As described above, according to the present invention, the amount of pressing of the upper blade 6 to the substrate W at the time of the fracture can be reduced to about half by the prior method, so that the occurrence of the adhesive film 2 due to the reverse lifting of the upper blade 6 can be suppressed. The deformation of the smaller wrinkles or the like can eliminate the occurrence of positional displacement of the substrate after alignment by the imaging device. Further, the amount of press-fitting of the upper blade 6 to the substrate W is small, and the substrate is subjected to a force in the direction of tearing from the scribe line S by the tensile force of the adhesive film 2 in the outward direction, and thus is broken at the time of the breakage. The upper edges of the end faces do not interfere with each other, and a high-quality product without defects can be produced.

The representative embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments. For example, the protective tape 3 covering the electronic component forming surface of the substrate W may be provided on the upper surface of the supporting blades 4, 4, or the protective tape itself may be omitted. Further, the support knives 4, 4 can also receive the scribe line S and receive a portion of the lower surface of the substrate W. Further, in the present embodiment, the alumina substrate is exemplified as the substrate to be processed, but may be an LTCC substrate, a glass substrate, or a tantalum substrate.

Further, in the present invention, it is possible to appropriately modify and change the scope of the invention without departing from the scope of the invention.

[Industrial availability]

The breaking method and the breaking device of the present invention are used for the separation of an alumina substrate, an LTCC substrate, a glass substrate, and a substrate made of a brittle material such as tantalum, ceramics, or a compound semiconductor.

1‧‧‧ cutting ring

2‧‧‧Adhesive film

3‧‧‧Protection tape

4‧‧‧Support knife

5‧‧‧Fixed stage

6‧‧‧Upper knife

7‧‧‧Support table

8‧‧‧Mobile stage

H‧‧‧ Lifting volume

S‧‧‧

Claims (3)

A substrate breaking method is attached to a substrate of a brittle material attached to an elastic adhesive film supported by a cutting ring, and after forming a plurality of scribe lines under the open surface of the brittle material substrate, a pair of supporting knives are abutted on the lower surface of the substrate at the left and right positions, and the upper surface of the brittle material substrate opposite to the scribe line is disposed on the surface opposite to the scribe line. The adhesive film is pressed against the brittle material substrate to break the brittle material substrate along the scribe line by a three-point bending moment, and to maintain the adhesion film of the brittle material substrate when the rupture is performed by the upper blade. In the manner of the lower tension, the pair of support knives are placed at the position of the push-up adhesive film to be broken. A substrate cutting device for attaching a brittle material substrate to an underside of an elastic adhesive film supported by a cutting ring, and arranging against a left and right scribe line formed on a lower surface of the brittle material substrate a pair of support knives on the lower surface of the substrate, the surface of the brittle material substrate opposite to the surface on which the scribe line to be divided is provided, and the upper knives disposed above the portion facing the scribe line The brittle material substrate is pressed by the upper blade above the adhesive film, whereby the brittle material substrate is broken along the scribe line by a three-point bending moment, and the adhesive film of the brittle material substrate is maintained when the upper blade is broken. The pair of support knives are disposed at a position to push up the adhesive film in such a manner as to generate a downward tension. The substrate breaking device of claim 2, wherein the supporting blade is formed to be vertically adjustable by a movable stage that can be moved up and down.