JP5281544B2 - Break device - Google Patents

Abstract

The invention provides a cut-off device, wherein a workpiece is cut off by applying a vertical load-carrying directly along the marking-out of the workpiece when the workpiece is held by a ring member with a diameter greater than that of a circular workpiece.The cut-off device comprises a pressing mechanism (22) and workpiece supporting mechanisms (23a, 23b). The pressing mechanism (22) is equipped with a linear pressing surface and a cut-off rod (36), wherein a workpiece is pressed from the side of an adhesion zone.The workpiece supporting mechanisms (23a, 23b) comprises a support member (46) with a resistance to the pressing force of the cut-off rod to support the workpiece.The cut-off rod divided into a block-fixing part (37) and a block-variable part (38a, 38b) is equipped with a pressing-face adjustment mechanism. The pressing face of the block-variable part is converted into a standby state by the pressing-face adjustment mechanism.The pressing face of the cut-off rod is adjusted to press down the workpiece according to the marking-out length of the workpiece to be cut off.

Description

  The present invention relates to a break device for separating a work such as a semiconductor wafer into chips, and more specifically, a work fixed on an adhesive tape stretched in a ring of a dicing ring is engraved on the work. The present invention relates to a break device that separates into chips along a scribe line. The workpiece to be processed in the present invention is mainly a semiconductor wafer such as silicon, but it may be a workpiece made of a brittle material having a shape in which the length of the scribe line changes depending on the position on the workpiece (for example, a circle or an ellipse). For example, even a glass substrate or a ceramic substrate is applicable.

The production process of a semiconductor device includes a dicing process of separating a large number of rectangular chips formed vertically and horizontally on a circular semiconductor wafer into chips.
20A and 20B are views showing the ring member 10 that holds the wafer in the dicing process, in which FIG. 20A is a plan view and FIG. 20B is a front view. The ring member 10 includes an adhesive sheet 12 and a dicing ring 13. The wafer 11 is attached to the adhesive sheet 12 on the back side. A dicing ring 13 (also referred to as a wafer ring) for supporting the adhesive sheet 12 in a stretched state is attached to the same adhesive sheet 12 around the wafer 11. The dicing ring 13 is a metal product having a thickness of about 1.5 mm.

  In the dicing process, a plurality of scribe lines 11a are formed vertically and horizontally on the wafer 11 fixed to the ring member 10 by using a dicing saw or a laser beam. The length of the scribe line 11a is long when crossing the vicinity of the center of the wafer 11 and short when crossing the vicinity of the periphery. Then, the wafer 11 is separated into chips along each scribe line 11 a on the wafer 11 while being attached to the ring member 10.

  The breaking device used when separating the wafer 11 into chips has hitherto been a method of rolling and pressing a spherical break ball from the back side of the adhesive sheet 12 (see, for example, Patent Document 1), or a contact surface with the wafer 11. A method of pressing and pressing a linear pressing body (hereinafter also referred to as a break bar in the present specification) or a bar-shaped roller whose contact surface is a cylindrical side surface along the scribe line 11a (for example, Patent Document 2) Bending moment was applied by the above method.

Japanese Patent Laid-Open No. 10-74712 JP 2006-66539 A

  As described in Patent Document 1, the method of using a break ball as a pressing member is such that the break ball 15 is alternately folded over the wafer 11 at a constant pitch P in the forward direction and the reverse direction, as shown in FIG. Roll to give a load. As a result, every time the break ball 15 draws a single trajectory, the scribe line is broken one by one or a plurality of stripes.

  When breaking one line at a time with respect to one line of the break ball 15, the break ball 15 can be rolled right above all the scribe lines, so that a vertical load is applied to each scribe line. Although cracks are formed, it is necessary to roll a considerably long distance before breaking all the scribe lines on the wafer, and a long time is required for processing. If you break the wafer with a break ball 15 with a larger diameter and break multiple lines along a single track, the processing time can be shortened, but if you break multiple scribe lines one by one, Since the break ball 15 is rolled at a position slightly apart from not directly above, the scribe line that does not roll directly above is subjected to an oblique load, which makes it difficult to penetrate the crack vertically. Soge is likely to occur.

  Further, as described in Patent Document 2, a bar-shaped roller 16 as shown in FIG. 22 or a break bar 17 (linear pressing body) as shown in FIG. In the method of pressing while sliding along the surface, there is no problem with the processing speed, but before the rod roller 16 or the like moves to a position directly below the scribe line to be broken, a load is applied from an oblique direction of the scribe line. If it breaks in such a state, cracks will not easily permeate in the vertical direction and soge will tend to occur.

As another problem, when the bar roller 16 or the break bar 17 collides with the dicing ring 13 (FIG. 20) of the ring member 10 holding the wafer 11 during pressing, the wafer 11 cannot be pressed. . Assuming that the inner diameter of the dicing ring is a, as shown in FIG. 20, the width in the longitudinal direction of the bar-shaped roller 16 and the break bar 17 is set to a / √2 to maximize the area that can be pressed. . At this time, the diameter of the breakable wafer 11 needs to be a / √2 or less at the maximum.
For this reason, the adhesive sheet 12 and the dicing ring 13 having a sufficiently large diameter with respect to the diameter of the wafer 11 are required, and as a result, the breaking device itself has to be increased in size with respect to the wafer 11 to be processed.

  Therefore, the present invention follows the scribe line of the workpiece while the workpiece is held by a ring member using a dicing ring having a slightly larger diameter with respect to the diameter of a circular workpiece (wafer or the like) to be processed. Another object of the present invention is to provide a break device capable of breaking while applying a vertical load.

In order to achieve the above object, the following technical measures were taken. That is, the breaking device of the present invention is a breaking device that divides a workpiece along a plurality of scribe lines formed on the workpiece, and is used as a support member for holding the workpiece in the dicing ring and the dicing ring. A ring member composed of an adhesive tape stretched on the surface is used. And the workpiece | work is made into the state affixed on the adhesive tape of the ring member. In addition, the workpiece | work affixed on a ring member is a shape from which the length of the several scribe line formed on a workpiece | work changes with the position on a workpiece | work like circular or an ellipse.
The breaking device has a linear pressing surface and a pressing mechanism having a break bar that presses the workpiece from the adhesive tape side of the ring member along the back of the scribe line to be divided, and the workpiece is brought into contact with the workpiece side. And a work support mechanism including a support member that supports the work against the pressing force of the break bar.
The break bar is divided into a fixed block portion and a variable block portion along the longitudinal direction of the pressing surface, and the pressing force that changes the pressing surface of the variable block portion into a retracted state that is drawn more than the pressing surface of the fixed block portion. A surface adjustment mechanism is provided.
The break bar presses the workpiece in a state where the length of the pressing surface of the break bar is adjusted according to the length of the scribe line to be divided.

In other words, the length of the scribe line formed in a plurality of strips on a workpiece such as a circle is short near the periphery of the workpiece, is long at the center of the workpiece, and the pressing surface of the break bar is diced when dividing the vicinity of the workpiece Easy to collide with the ring. Therefore, when cutting a scribe line with a short peripheral edge, the work piece is pressed only with the pressing surface of the fixed block part in the retracted state where the pressing surface of the variable block part is pulled in, and a break occurs when the peripheral part is divided. Make sure that the bar does not touch the dicing ring. When the long scribe line at the center of the workpiece is cut, the pressing surface of the variable block portion is pressed with the pressing surface of the fixed block portion aligned.
In this way, the dividing is performed so that the variable block portion of the break bar is adjusted so as not to collide with the dicing ring in accordance with the position of the scribe line on the workpiece.

  The support member of the workpiece support mechanism is brought into contact with the workpiece on the side opposite to the break bar across the workpiece, but the support member is brought into contact with the vicinity of the back of a partial area pressed by the break bar. Alternatively, it may be in contact with the entire workpiece. As a result, when the break bar presses the adhesive tape on the back side of the workpiece, the adhesive tape is not stretched greatly in the pressing direction and is divided in almost the same state as before pressing, so it is accurate with respect to the scribe line at the planned cutting position. Good splitting is done.

  According to the present invention, division is performed by adjusting the variable block portion of the break bar so as not to collide with the dicing ring in accordance with the length of the scribe line that varies depending on the position on the workpiece. As a result, the workpiece can be broken by applying a load on the scribe line of the workpiece while the workpiece is held by a slightly larger ring member with respect to the diameter of a workpiece such as a circle (wafer or the like) to be processed. It becomes possible. Furthermore, since the support member is brought into contact with the opposite side of the break bar across the workpiece to suppress the stretching of the adhesive tape, the break bar can be pressed accurately and vertically along the scribe line. Can be divided by a simple crack.

In the above invention, the variable block portion of the break bar is divided into the same number of unit blocks on both sides in the longitudinal direction of the fixed block portion, and the unit blocks are attached so as to be symmetrical on both sides of the fixed block portion, The pressing surface adjusting mechanism may perform an adjustment to change the pressing surface of the block bar for each pair of unit blocks located in a symmetrical position.
By dividing the variable block into multiple blocks, the break bar length can be adjusted little by little according to the length of the scribe line to be processed, and the diameter of the dicing ring is the same. However, a work having a larger diameter can be stuck and divided without the break bar colliding with the dicing ring.

In the above invention, the maximum length L of the pressing surface of the break bar may be within the range of the following formula with respect to the ring inner diameter a of the dicing ring.
a>L> a / √2
As a result, even a workpiece having a workpiece diameter larger than a / √2 can be divided if the maximum diameter is up to the break bar length L.

In the above invention, the support member is composed of a pair of support bars that are in contact with the workpiece at both the left and right positions sandwiching the scribe line along the scribe line, and the pair of support bars includes a fixed block portion and a variable block portion, respectively. In addition, a contact surface adjustment mechanism that changes the contact surface of the variable block portion into a retracted state that is retracted from the contact surface of the fixed block portion may be provided.
Support the left and right sides where the break bar is pressed along the scribe line by making the support members a pair of support bars that contact the workpiece at the left and right sides of the scribe line along the scribe line. As a result, a bending moment is accurately applied on the scribe line, and cracks are easily penetrated vertically.
Furthermore, when dividing a scribe line with a short work peripheral edge, the work piece is supported with only the pressing surface of the fixed block portion in the retracted state in which the pressing surface of the variable block portion of the support bar is pulled in, and the peripheral edge is divided. Make sure that the support bar does not touch the dicing ring. When dividing the long scribe line at the center of the workpiece, the contact surface of the variable block portion of the support bar is aligned with the contact surface of the fixed block portion. Thereby, similarly to the break bar, the variable block portion of the support bar can be divided so as not to collide with the dicing ring according to the length of the scribe line on the workpiece.

Here, each variable block portion of the pair of support bars is divided into the same number of unit blocks on both sides in the longitudinal direction of the fixed block portion, and the unit blocks are paired on both sides of the fixed block portion and symmetrical The abutment surface adjusting mechanism may perform adjustment to change the abutment surface of the support bar for each pair of unit blocks located at symmetrical positions.
By dividing the variable block part of the support bar into multiple unit blocks, the length can be adjusted little by little like the break bar, even if the diameter of the dicing ring is the same. A workpiece having a larger diameter can be divided without the bar colliding with the dicing ring.

The support member includes a support bar that abuts along the scribe line. The support bar is divided into a fixed block portion and a variable block portion, and the abutment surface of the variable block portion abuts on the fixed block portion. A contact surface adjusting mechanism that changes the retracted state to be retracted from the surface may be provided.
By making the support member a support bar that abuts against the workpiece along the scribe line, the pressing force is accurately applied on the scribe line by supporting the position directly behind the break bar pressed along the scribe line. And can be divided by vertical cracks. In this case, one support bar can be used, but it is necessary to slightly increase the pressing force as compared with the case where the pair of support bars are brought into contact with the left and right sides of the scribe line.
The same is true in that the length can be divided by adjusting the length of the variable block portion of the support bar so as not to collide with the dicing ring according to the length of the scribe line on the workpiece.

  Also in this case, the variable block portion of the support bar is divided into the same number of unit blocks on both sides of the fixed block portion in the longitudinal direction, and the unit blocks are attached so as to be symmetrical on both sides of the fixed block portion. The abutment surface adjusting mechanism may perform an adjustment for changing the abutment surface of the support bar for each pair of unit blocks located at symmetrical positions.

Further, in the above invention, an input unit is provided for setting a break order for a plurality of scribe lines formed on the work, and the work transport mechanism is configured so that the pressing surface of the break bar and the pressing surface of the break bar are based on the set break order. You may make it adjust the position of a ring member so that the scribe line of division | segmentation object may come to the position which opposes sequentially.
When taking out the chips formed on the workpiece, even if there is a priority order, the scribe lines can be selected and divided according to the priority order.

The input unit may be provided with a progressive feed mode in which breaks are performed in the order in which a plurality of scribe lines formed on the workpiece are arranged as one of the break orders that can be set.
By setting the forward feed mode, the work transport mechanism only needs to align the pressing surface of the break bar with the adjacent scribe line, so that the position adjustment time can be shortened.

As one of the break orders that can be set, the input unit breaks the scribe lines formed on the workpiece from the left and right scribe lines closest to the periphery, and sequentially places the left and right scribe lines inside one. An outer priority mode may be provided in which a line break is performed and finally a central scribe line break is performed.
By setting the outer priority mode, the time to perform all breaks is slightly more than the forward feed mode, but on the other hand, since the breaks are performed in order from the scribe line on the side near the left and right edges of the work, It becomes possible to divide the left and right substantially equally in a balanced manner, and the movement of the center of gravity of the work stretched on the adhesive tape is reduced, so that the division at a more accurate position becomes possible.

As one of the break orders that can be set, the input unit breaks the workpiece into two scribe lines formed on the workpiece, then breaks the workpiece into quarters, and then breaks into quarters, A break mode is performed, and thereafter, an equal division mode may be provided in which each divided work is further equally divided.
By providing the equal division mode, as with the outer priority mode, the time until all breaks are slightly longer than in the forward feed mode, but on the other hand, the width of the left and right of the scribe line to be broken is almost the same. Since it becomes equal, it becomes possible to perform a break in a balanced manner, and a break at an accurate position becomes possible.

It is a figure which shows an example of the ring member which affixed the workpiece | work to break using the breaking apparatus of this invention. It is a perspective view which shows the whole structure seen from the press mechanism side of the breaking apparatus which is one Embodiment of this invention. It is a perspective view which shows the whole structure seen from the workpiece | work support mechanism side of the breaking apparatus which is one Embodiment of this invention. It is a front view (pressing mechanism side) of the breaking device of FIG. It is a rear view (work support mechanism side) of the breaking device of FIG. It is a top view of the breaking apparatus of FIG. It is a figure which shows the structure of a press mechanism. It is a figure which shows the structure of a break bar. It is a figure which shows the deformation | transformation pattern of a break bar. It is a figure which shows the cross section of the width direction of the press surface of a break bar. It is a figure which shows the structure of a workpiece | work support mechanism. It is a figure which shows the structure of a support bar. It is a figure which shows the cross section of the width direction of the contact surface of a support bar. It is the figure which showed the positional relationship of the press mechanism 22 and the workpiece | work support mechanisms 23a and 23b. It is the figure which showed the positional relationship of the press mechanism 22 and the workpiece | work support mechanism 23b. 4 is a schematic diagram showing a relationship between a break position on the ring member 10 and a pattern of a pressing surface of the break bar 36. FIG. It is a block diagram of a control system. It is a figure which shows the order of a break in progressive mode. It is a figure which shows the order of a break in outer side priority mode. It is a figure which shows the break order in equal division mode. It is a figure which shows a ring member. It is a figure which shows the breaking method by a break ball. It is a figure which shows the breaking method by a rod-shaped roller. It is a figure which shows the breaking method by a linear pressing body (break bar).

  Hereinafter, details of the break device according to the present invention will be described in detail with reference to the drawings. Here, a case where a wafer is broken along a plurality of scribe lines carved on a circular wafer will be described as an example.

(Ring member)
First, the relationship between the wafer to be processed and the ring member that holds the wafer will be described. FIG. 1 is a plan view showing an example of a ring member with a wafer attached thereto. The ring member 10 includes an adhesive sheet 12 and a dicing ring 13. The dicing ring 13 is a metal product having a thickness of about 1.5 mm. The wafer 11 is fixed by sticking the back surface side to the adhesive sheet 12.

  The diameter D of the wafer 11 that can be broken by the ring member 10 is not only smaller than a / √2, which is the maximum diameter that can be conventionally broken, when the inner diameter of the dicing ring 13 is a. Even with a large diameter of √2 or more, if the diameter is smaller than the maximum length L (where L <a) of a break bar, which will be described later, it can be broken.

(Structure of break device)
Next, the configuration of the break device of the present invention will be described. FIG. 2 is a perspective view showing an overall configuration of the breaking device 20 according to one embodiment of the present invention as viewed from one direction (pressing mechanism side). FIG. 3 is a diagram showing an overall configuration of the breaking device 20 as viewed from the direction opposite to that of FIG. 1 (work support mechanism side). 4 is a front view of the breaking device 20 (pressing mechanism side), FIG. 5 is a rear view (work support mechanism side), and FIG. 6 is a plan view.
For convenience of explanation, as shown in the drawing, the XYZ directions that are orthogonal to each other are defined with respect to the break device 20 as the X direction is the longitudinal direction of the device.

  The breaking device 20 mainly includes a base 21, a pressing mechanism 22, work support mechanisms 23 a and 23 b, a work transport mechanism 24, a cart 25, and an air plate 26.

  A pressing mechanism 22 and an air plate 26 are supported on one side of the base 21, and a pair of work support mechanisms 23 a and 23 b are supported on the other side. A workpiece transfer mechanism 24 is supported between the pressing mechanism 22 and the air plate 26.

  Next, the pressing mechanism 22 will be described. FIG. 7 is a view showing the pressing mechanism 22. The pressing mechanism 22 is fixed on the base 21 via a pedestal 31. A vertical arm 32 is fixed on the pedestal 31, thereby fixing the base plate 33 so as to stand vertically (Y direction). Two linear guides 34 are mounted in parallel on the base plate 33, and the movable plate 35 is supported by the linear guide 34 and a motor (not shown) so as to be slidable in the front-rear direction (Z direction). A break bar 36 that is unitized is attached to the movable plate 35 so that the tip of the break bar 36 is located at a position protruding outward from one end of the movable plate 35. This tip portion becomes a pressing surface for pressing the wafer 11.

FIG. 8 is a diagram showing the configuration of the break bar 36. FIG. 8 (a) is a perspective view, FIG. 8 (b) is a front view, FIG. 8 (c) is a plan view, and FIG. 8 (d) is a side view. is there.
The break bar 36 is divided into a fixed block 37 at the center and variable blocks 38a and 38b on the left and right sides thereof. The variable blocks 38a and 38b are further divided into small unit blocks 39, respectively. Each unit block 39 is supported by a support member 37 a fixed integrally with the fixed block 37. Each unit block 39 includes an elevating mechanism 40 by air operation using a pneumatic valve, and the elevating mechanism 40 determines the position of each pressing surface (the tip portion of each unit block 39) on the pressing surface of the fixed block 37. It works as a pressing surface adjusting mechanism 71 (FIG. 17) for retracting to a position where it is retracted from the position. Further, the same number of unit blocks 39 are provided on both the left and right sides of the fixed block 37, and the unit blocks 39 are mounted symmetrically, and the unit blocks 39 located at symmetrical positions are paired (four pairs in total) to perform the retreat operation. . FIG. 9 is a diagram showing a deformation pattern of the pressing surface of the break bar 36. By changing the position of the unit block 39, the pressing surface can be changed into five patterns P1 to P5.

  The longitudinal dimension of the pressing surface of the fixed block 37 in the break bar 36 and the longitudinal dimension of the pressing surface of the unit block 39 are appropriately set according to the size of the wafer 11 to be processed. In the present embodiment, for example, the length in the longitudinal direction is about 100 mm for the fixed block 37 and about 12.5 mm for the unit block 39 (8 in total), and the longest length L as the break bar 36 is about 200 mm. It is like that. Therefore, the length L of the break bar 36 becomes about 100 mm, about 125 mm, about 150 mm, about 175 mm, and about 200 mm according to the change of the patterns P1 to P5. As a result, a wafer 11 having a maximum size of 200 mm (8 inches) can be broken.

  FIG. 10 is a cross section in the width direction of the pressing surface of the break bar 36 (fixed block 37 and unit block 39). The dimension of the pressing surface in the width direction is such that the tip has a tapering shape of about 0.1 μm to 3 mm, and the load is concentrated in a linear manner so as to contact the wafer 11 with a narrow width.

  The break bar 36 (fixed block 37 and unit block 39) is preferably made of a hard material that is difficult to be deformed when pressed, for example, tool steel.

Next, the work support mechanisms 23a and 23b will be described. FIG. 11 is a diagram showing the configuration of the work support mechanisms 23a and 23b, in which FIG. 11 (a) is a perspective view and FIG. 11 (b) is a front view. The work support mechanisms 23a and 23b are mounted on the pedestals 41a and 41b, respectively, and the pedestals 41a and 41b are movable on the rails 41c by a support bar drive mechanism 41d using a ball screw and a motor.
In the work support mechanisms 23a and 23b, the same mechanism as the pressing mechanism 22 described in FIG. 7 is adopted except for the support bar 46 (corresponding to the break bar 36 in FIG. 7). Accordingly, the parts of the work support mechanisms 23a and 23b other than the support bar 46 are the same as those in FIG.

12A and 12B are views showing the configuration of the support bar 46. FIG. 12A is a perspective view, FIG. 12B is a front view, FIG. 12C is a plan view, and FIG. 12D is a side view. is there.
The support bar 46 is divided into a fixed block 47 at the center and variable blocks 48a and 48b on the left and right sides thereof. The variable blocks 48a and 48b are further divided into small unit blocks 49, respectively. Each unit block 49 is supported by a support member 47 a fixed integrally with the fixed block 47.
Each unit block 49 includes an elevating mechanism 50 that is operated by air using a pneumatic valve. The elevating mechanism 50 determines the position of each abutment surface (the tip portion of each unit block 49) with the abutment of the fixed block 47. The abutting surface adjusting mechanism 72 (FIG. 17) is retracted to a retracted position from the surface position. Further, the same number of unit blocks 49 are provided on both the left and right sides of the fixed block 47, and the unit blocks 49 are attached symmetrically, and the unit blocks 49 at symmetrical positions are paired (four pairs in total) to perform the retreat operation. .

  That is, the same mechanism as the pressing surface adjustment mechanism of the break bar 36 in FIG. 8 is configured to function as the contact surface adjustment mechanism of the support bar 46 in FIG. Further, the deformation pattern of the support bar 46 by the unit block 49 is also P1 to P5 (FIG. 9) which is the same as the deformation pattern of the break bar 36.

The support bar 46 is basically the same size as the break bar 36, but the shape and material of the tip portion that contacts the wafer 11 are different.
FIG. 13 is a cross section in the width direction of the support bar 46 (the fixed block 47 and the unit block 49). The front end surface of the support bar 46 is flat. However, it is not limited to this, and a curved surface may be used. The material of the tip portion of the support bar 46 is made of elastic rubber so as to come into soft contact with the wafer 11 when pressed.

Next, the workpiece conveyance mechanism 24 and the cart 25 will be described with reference to FIGS. 2 to 6 again. The work transport mechanism 24 is provided with linear guides 62 for supporting and transporting the cart 25 above and below a frame 61 having a vertically standing frame structure. The cart 25 is supported by a linear motor (not shown). It is designed to move in the horizontal direction (X direction). A hole for attaching the ring member 10 is formed in the center of the cart 25.
The ring member 10 attached to the cart 25 is transported between the pressing mechanism 22 and the work support mechanisms 23a and 23b by the work transport mechanism 24, and the scribe line engraved on the wafer 11 is a break directly behind the break bar 36. To be in position. Then, when breaking a plurality of scribe lines one after another, position adjustment is performed so that each scribe line is sequentially at the break position.

  The position adjustment is performed by a known method such as a positioning method using a camera or a mechanical positioning method. For example, an alignment mark engraved on the wafer 11 may be captured in advance with a camera (not shown) attached to the apparatus 20 and positioned by image processing. Further, when the wafer 11 is attached to the ring member 10 with high accuracy and the ring member 10 is attached to the cart 25 with high accuracy, the position coordinates of the cart 25 with respect to the origin position set in the break device 20 in advance are set. Positioning may be performed based on this.

Next, the air plate 26 will be described. The wafer 11 to be processed is supported in a vertically standing state by the ring member 10, the cart 25, and the workpiece transfer mechanism 24, and a break process can be performed by the support by these members. However, on the ring member 10, the wafer 11 is attached to an adhesive sheet 12 that is susceptible to vibration, and if the adhesive sheet 12 vibrates, the wafer 11 itself is also affected. Therefore, in order to perform a break process with higher accuracy along the scribe line engraved on the wafer 11, it is desirable to take measures against vibration.
Therefore, in this embodiment, a square air plate 26 is further attached around the pressing mechanism 22. The air plate 26 has a large number of nozzle holes formed at positions facing the ring member 10. The air plate 26 blows dry air from some nozzle holes and sucks it through some nozzle holes. When 25 is set at the break position, the adhesive sheet 12 and the wafer 11 affixed to the adhesive sheet 12 are stabilized in a vertical state in a non-contact state.

  Next, the positional relationship between the pressing mechanism 22 and the work support mechanisms 23a and 23b during break will be described. FIG. 14 is a diagram showing the positional relationship between the pressing mechanism 22 and the work support mechanisms 23a and 23b, omitting the work transport mechanism 24, the cart 25, and the air plate 26 for convenience of explanation. As shown in FIG. 14A, the pressing mechanism 22 and the pair of work support mechanisms 23a and 23b are opposed to each other with the ring member 10 interposed therebetween.

  The break bar 36 and the support bar 46 (the back side of the ring member 10) are aligned in the height direction (Y direction). Then, the position of the support bar 46 in the lateral direction (X direction) is adjusted by the support bar drive mechanism 41d, and as shown in FIG. 14 (b), the support bar 46 is slightly separated from the left and right sides with the scribe line S interposed therebetween. They are in contact with each other. The break bar 36 is located directly behind the scribe line S. Thereby, when the break bar 36 presses the wafer 11, the bending moment works symmetrically along the scribe line S.

As another contact method of the support bar 46, as shown in FIG. 15A, the work support mechanism 23a is retracted (or the work support mechanism 23a is not mounted from the beginning), and only the work support mechanism 23b is provided. May be used.
In this case, as shown in FIG. 15B, the support bar 46 is brought into contact along the scribe line S of the wafer 11. Note that the break bar 36 is located directly behind the scribe line S. As a result, when the break bar 36 presses the wafer 11, the wafer 11 is bent by the deformation of the support bar 46 due to the elastic force, and a bending moment is applied.

(Break pattern)
FIG. 16 is a schematic diagram showing the relationship between the break position on the ring member 10 and the pattern of the pressing surface of the break bar 36.
For the peripheral edge with a short scribe line, break is caused by the pattern P1 having a short pressing surface, and is sequentially deformed to P2, P3, and P4. The wafer 11 can be broken without colliding with the dicing ring 13.

(Control system)
Next, the control system of the break device 20 will be described. FIG. 17 is a block diagram showing a control system of the break device 20. The control unit 70 includes a computer including a CPU 71, a memory 72, an input unit 73, and a display unit 74. These are provided as a control unit (not shown) on or near the apparatus. A workpiece transfer mechanism 24 for carrying the cart and positioning, an air plate 26 for stabilizing the wafer 11, a pressing mechanism 22 for pressing the break bar 36, a pressing surface adjusting mechanism 71 for adjusting the length of the pressing surface of the break bar 36, and a support bar The parts of the work support mechanisms 23a and 23b for contacting 46 and the contact surface adjusting mechanism 72 for adjusting the length of the support bar are used for programs and parameters stored in the memory 72, parameters input from the input unit 73, and commands. The operation state is monitored by the display unit 74.

(Break order)
In the break device 20, when a plurality of scribe lines formed on the wafer 11 are to be broken, the break order is arbitrarily set from the input unit 73 and stored in the memory 72 (referred to as an arbitrary designation mode). Each scribe line can be broken in the stored break order.
In addition to “Optional mode”, “Sequential feed mode”, “Outer priority mode”, and “Equal division mode” are provided to facilitate the break order setting input work. It is made possible to select by inputting.

  Of these, when the “sequential feed mode” is selected, breaks are sequentially performed from one end of the wafer 11 as shown in FIG. In this case, the break bar 36 changes in the order of P1, P2, P3, P4, P5, P4, P3, P2, and P1 according to the change in the length of the scribe line. Breaking in the forward feed mode can minimize the time required for workpiece conveyance, thereby shortening the processing time.

On the other hand, when the “outer priority mode” is selected, as shown in FIG. 19, the left and right scribe lines on the outermost side of the wafer 11 are broken, and then the left and right scribe lines on the outer side. After that, the left and right scribe lines inside are sequentially broken. Finally, the longest scribe line in the center is broken. In this case, the break bar 36 changes in the order of P1, P2, P3, P4, and P5 in accordance with the change in the length of the scribe line.
By breaking in the outer priority mode, the time required for workpiece transfer is slightly longer than in the forward feed mode, but the wafer 11 is broken in a state that is nearly symmetrical even when part of the wafer 11 is broken. Therefore, the movement of the center of gravity of the wafer 11 is reduced, and a more accurate break is possible.

When the “equal division mode” is selected, the wafer divided into two at the center scribe line of the wafer 11 (when the scribe line is an even number, the scribe line is the closest to the center) as shown in FIG. Next, each partial wafer divided into two parts is further divided into two parts by dividing each partial wafer by a central scribe line, and then the partial wafer is divided into four parts. Break into six equal parts ... The length of the break bar in this case is P5 because the longest scribe line at the center is first broken, and thereafter, the length changes depending on the length of the scribe line to be broken next.
By breaking in the equal division mode, it is divided by the scribe line at the center of the partial wafer at that time, so that the width on both the left and right sides is equal, and it is possible to break in a balanced manner. Breaks.

  The above is a case of breaking a plurality of scribe lines arranged in one direction (Y direction). However, a lattice-shaped scribe line, that is, a break of a plurality of scribe lines arranged in two directions (XY direction) is described. When performing, the ring member is rotated 90 degrees and the same operation is repeated. In that case, if the cart 25 is provided with a rotation mechanism that rotates the ring member 10 by 90 degrees, the two-way break can be efficiently performed.

  In the above embodiment, the four pairs of unit blocks 39 have the same shape, but the length of the unit blocks in the longitudinal direction may be changed for each pair. Further, when the workpiece shape is asymmetric, the lengths of the paired unit blocks in the longitudinal direction may be different.

  Further, in the above embodiment, since the back side of the break bar 36 is supported with the wafer 11 in between so that one or a pair of support bars 46 are brought into contact with each other, an accurate break is made. As long as the support member can support the wafer 11, it may have other shapes. For example, instead of the support bar 46, it may be supported by a flat support member that contacts the entire surface of the wafer 11.

  Moreover, in the said embodiment, although the circular wafer was broken, the workpiece | work shape is not restricted to a circle. The present invention can be used effectively even in other shapes such as an ellipse, as long as it is a workpiece that can be affixed in a ring of a dicing ring and in which a plurality of scribe lines having different lengths are engraved. .

  Moreover, in the said embodiment, although the ring member 10 was supported vertically, you may make it the general conventional break device which supports the ring member 10 horizontally, and processes it.

The breaking device of the present invention can be used for breaking a wafer or the like attached to a ring member.

DESCRIPTION OF SYMBOLS 10 Ring member 11 Wafer 12 Adhesive tape 13 Dicing ring 20 Break device 22 Press mechanism 23a, 23b Work support mechanism 24 Work conveyance mechanism 25 Cart 26 Air plate 33 Fixed plate 35 Movable plate 36 Break bar 37 Fixed block 38a, 38b Variable block 39 Unit block 40 Elevating mechanism (pressing surface adjusting mechanism 71)
46 Support bar 47 Fixed block 48a, 48b Variable block 49 Unit block 50 Elevating mechanism (abutment surface adjusting mechanism 72)
61 frame 62 linear guide 70 control unit 71 CPU
72 Memory 73 Input unit 74 Display unit

Claims (11)

As a support member for holding the workpiece, a ring member composed of a dicing ring and an adhesive tape stretched in the ring of the dicing ring is used,
In a state where the work is affixed to the adhesive tape of the ring member, a break device that divides the work along a plurality of scribe lines formed on the work,
A pressing mechanism having a linear pressing surface and having a break bar that presses the workpiece from the adhesive tape side along the back of the scribe line to be divided;
A workpiece support mechanism provided with a support member that contacts the workpiece side and supports the workpiece against the pressing force of the break bar;
The break bar is divided into a fixed block portion and a variable block portion along the longitudinal direction of the pressing surface, and changes the pressing surface of the variable block portion into a retracted state that is drawn more than the pressing surface of the fixed block portion. A pressing surface adjustment mechanism is provided,
The break bar is configured to press a work in a state in which a pressing surface of the break bar is adjusted according to a length of a scribe line to be divided.   The variable block portion of the break bar is divided into the same number of unit blocks on both sides in the longitudinal direction of the fixed block portion, and the unit blocks are attached so as to be symmetrical on both sides of the fixed block portion, and the pressing surface The break device according to claim 1, wherein the adjustment mechanism performs an adjustment for changing a pressing surface of the break bar for each pair of unit blocks at symmetrical positions. The breaking device according to claim 1, wherein the maximum length L of the pressing surface of the break bar is in the range of the following formula with respect to the ring inner diameter a of the dicing ring.
a>L> a / √2   The support member includes a pair of support bars that are in contact with the workpiece at positions on both the left and right sides of the scribe line along the scribe line, and the pair of support bars are divided into a fixed block portion and a variable block portion, respectively. And a contact surface adjusting mechanism for changing the contact surface of the variable block portion to a retracted state in which the contact surface of the variable block portion is retracted from the contact surface of the fixed block portion. Break device.   The variable block portions of the pair of support bars are divided into the same number of unit blocks on both sides of the fixed block portion in the longitudinal direction, and the unit blocks are paired on both sides of the fixed block portion so as to be symmetrical. The break device according to claim 4, wherein the abutment surface adjustment mechanism is attached and performs adjustment to change the abutment surface of the support bar for each pair of unit blocks in a symmetrical position.   The support member includes a support bar that abuts along a scribe line. The support bar is divided into a fixed block portion and a variable block portion, and an abutment surface of the variable block portion abuts on the fixed block portion. The break device according to any one of claims 1 to 3, further comprising a contact surface adjustment mechanism that changes the retracted state to be retracted from the surface.   The variable block portion of the support bar is divided into the same number of unit blocks on both sides in the longitudinal direction of the fixed block portion, and the unit blocks are attached so as to be symmetric in pairs on both sides of the fixed block portion. The break device according to claim 6, wherein the contact surface adjustment mechanism performs adjustment to change the contact surface of the support bar for each pair of unit blocks located in a symmetrical position. It has an input unit that sets the order of breaks for multiple scribe lines formed on the workpiece,
The workpiece conveying mechanism adjusts the position of the ring member based on a set break order so that a scribe line to be divided sequentially comes to a position facing the pressing surface of the break bar. The break device according to any one of claims 1 to 7.   9. The break according to claim 8, wherein the input unit is provided with a progressive feed mode in which breaks are performed in the order in which a plurality of scribe lines formed on the workpiece are arranged as one of break orders that can be set. apparatus.   As one of the break orders that can be set, the input unit breaks the scribe lines formed on the workpiece from the left and right scribe lines closest to the periphery, and sequentially places the left and right scribe lines inside one. 9. The break device according to claim 8, wherein an outer priority mode is provided in which a line break is performed and a center scribe line is finally broken.   As one of the break orders that can be set, the input unit breaks the workpiece into two scribe lines formed on the workpiece, then breaks the workpiece into quarters, and then breaks into quarters, The break device according to claim 8, further comprising an equal division mode in which breaks are performed and thereafter each divided work is further equally divided.

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