201240927 六、發明說明： 【發明所屬之技術領域】 本發明係關於分斷玻璃基板'半導體基板等脆性材料 基板之分斷裝置。 · 【先前技術】 於將玻璃等脆性材料基板加以分斷之加工中，係使刀 輪（cutter wheel亦稱scribing wheel)轉動、或利用雷射光束 之.'、、射產生之熱變形於基板表面形成劃線（scribe iine) ^此 處，將包含刀輪及雷射光束之照射裝置、能在基板形成劃 線之加工手段稱為劃線工具（scribing t〇〇i)。在使用此等劃 線工具於基板表面形成劃線後，沿著該劃線施加外力使基 板撓曲即折斷（分斷）基板。此種組合劃線與折斷之分斷方 法已為一般所知，例如於專利文獻1中已有所揭露。 圖、11係顯示習知脆性材料基板之折斷方法的圖。 首先，如圖10(a)所示，將脆性材料基板w裝載於劃線 裝置之：載台40上，於其表面使用刀輪^形成劃線S。 〇 彡目10(b)所示’將脆性材料基板1W冑載於鋪有 彈性體緩衝片43之折斷裝置之裝載台42上L係將 基板W反轉成形成有劃線s之表面(表面側)朝向 而相反側之表面（背面側）為上面。 延伸朝下之劃線s之背面上方，降下-沿著劃線S 狀折斷桿44從脆性材料基板W之相反側按 藉由使脆性材料基板w在緩衝片43上以曲成口 201240927 形:據以使劃線s(裂痕）滲透於深度方向。據此，如圖 所不，脆性材料基板w即沿著劃線s被折斷。 、^述折斷方法中，在跪性材料基板w形成劃線8後， 為進行其次之折斷步驟而使脆性材料基板w反轉之作業β 不可或缺的。為進行此反轉作f，須有機械臂等 用I 轉裝置，且由於須確保使其反轉之空間因此裝置變 化，不僅設備成本高、作業效率亦低等之缺點。 工對象為大面積玻璃基板之情形時，欲將基板反轉二 上斷裂，因此皆期望能有一種無須反轉即能折斷之方法。 為此，申請人於專利文獻2揭示了一種 性材料基板反轉之㈣下加崎斷之折斷裝置。，、、、 該專利文獻2記載之折斷裝置，係針對形成在脆性材 板W上面之劃線s，作出一將該劃線s包含於中央、 覆蓋既定寬度帶狀區域的封閉空間，藉由對該封閉空間進 行減厂坠使脆性材料基板料弯曲成V字形，沿著割線8將 其折斷。 具體而言’如圖11⑷所示，在使劃線S朝上之狀態下 將脆性材料基板W裝載於裝載台45上，從劃線8之上方使 吸引裝置46之吸引構件47降下接觸於脆性材料基板w之 面吸引構件47具有於劃線方向細長延伸之長方體形 狀’下面形成有朝下之凹部48，於凹部之開口面貼有可變 形之彈f生吸引片49。於吸引片49設有吸引用的狭縫5〇。 於凹部48之上壁面設有空氣吸引孔51，藉由從此吸引孔 吸引工氣冑以如圖i ((b)所示，將凹部Μ内之封閉空 201240927 間予以減壓並與吸引片49 一起使脆性材料基板w彎曲成倒 V字形，使形成劃線S之裂痕擴大來加以折斷。 先行技術文獻 [專利文獻1]國際公開W02004/ 048058號公報 [專利文獻2]專利第3787489號公報 【發明内容】 發明欲解決之課題 根據專利文獻2之折斷方法，在脆性材料基板w之上 表面形成劃線S後，可在不使此脆性材料基板w反轉之情 形下移至其次之折斷步驟。然而，劃線步驟與折斷步驟分 開進行之點而言與習知相同，就分斷加工整體而言仍未達 大幅的合理化。 此折斷裒置中，為形成經減壓之封閉空間，必須 使吸引構件47接_性材料基板w表面1此，在接觸基 板面時須非常注意接觸壓力以避免損及脆性材料基板W表 但在封閉空間之減壓時會產生相對應之應力，此外， = 妾觸時之碰撞而時有於接觸部分產生損傷之情形。尤其 :性材料基板％表面形成有微細之積體 :問：於電路部分產生損傷即成為瑕疵品，而有良率 因此， 須反轉基板 系統之合理 本發明之目的在提供一種能消除上述課題201240927 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a breaking device for breaking a brittle material substrate such as a semiconductor substrate such as a semiconductor substrate. [Prior Art] In the process of dividing a brittle material substrate such as glass, the cutter wheel is also called a scribing wheel, or the laser beam is generated by the laser beam. The surface is formed with a scribe iine. Here, an irradiation device including a cutter wheel and a laser beam, and a processing means capable of forming a scribe line on the substrate are referred to as scribing tools. After the scribing is formed on the surface of the substrate by using these scribing tools, an external force is applied along the scribing line to deflect the substrate, thereby breaking (breaking) the substrate. Such a combination of scribing and breaking is known in the art, and is disclosed, for example, in Patent Document 1. Fig. 11 shows a diagram of a method of breaking a conventional brittle material substrate. First, as shown in Fig. 10 (a), the brittle material substrate w is placed on the stage 40 of the scribing apparatus, and a scribing line S is formed on the surface thereof using a cutter wheel. As shown in the item 10 (b), the brittle material substrate 1W is placed on the loading table 42 on which the breaking device of the elastic buffer sheet 43 is placed, and the substrate W is reversed to the surface on which the scribing s is formed (surface). The side (the side) faces the opposite side (back side) as the upper side. Extending the upper side of the downwardly directed scribe line s, descending - along the scribe line S-shaped breaking bar 44 from the opposite side of the brittle material substrate W, by making the brittle material substrate w on the buffer sheet 43 to be shaped into a shape of 201240927: According to this, the scribe line s (crack) is infiltrated in the depth direction. Accordingly, as shown in the figure, the brittle material substrate w is broken along the scribe line s. In the breaking method, after the scribing line 8 is formed on the inert material substrate w, the work β in which the brittle material substrate w is reversed in order to perform the second breaking step is indispensable. In order to perform this reversal, it is necessary to use an I-turning device such as a robot arm, and the device is changed due to the space for reversing it, which is not only disadvantageous in terms of high equipment cost and low work efficiency. When the object is a large-area glass substrate, the substrate is to be reversed twice, so that it is desirable to have a method that can be broken without reversing. For this reason, the applicant disclosed in Patent Document 2 a breaking device for the reverse of the fourth substrate of the material substrate. The breaking device described in Patent Document 2 is a closed space in which the scribe line s is formed in the center and covers a predetermined width band-shaped region with respect to the scribe line s formed on the upper surface of the brittle material sheet W. The closed space is subjected to a reduced planting to bend the brittle material substrate material into a V shape, which is broken along the secant line 8. Specifically, as shown in Fig. 11 (4), the brittle material substrate W is placed on the loading table 45 with the scribe line S facing upward, and the suction member 47 of the suction device 46 is lowered from the scribe line 8 to be brittle. The surface suction member 47 of the material substrate w has a rectangular parallelepiped shape 48 formed in a rectangular parallelepiped shape extending in the direction of the scribe line, and a deformable elastic attraction piece 49 is attached to the opening surface of the concave portion. The suction piece 49 is provided with a slit 5〇 for suction. An air suction hole 51 is provided in the upper wall surface of the recessed portion 48, and the working air is sucked from the suction hole to decompress the closed space 201240927 in the concave portion and the suction piece 49 as shown in FIG. The brittle material substrate w is bent into an inverted V shape, and the crack forming the scribe line S is enlarged and broken. The prior art document [Patent Document 1] International Publication No. WO2004/048058 [Patent Document 2] Patent No. 3787489 Disclosure of the Invention Problems to be Solved by the Invention According to the breaking method of Patent Document 2, after the scribing S is formed on the surface of the brittle material substrate w, the brittle material substrate w can be moved to the next breaking step without inverting the brittle material substrate w. However, the point where the scribing step and the breaking step are performed separately is the same as the conventional one, and the breaking processing as a whole is still not substantially rationalized. In this breaking arrangement, in order to form a closed space under decompression, it is necessary to The attracting member 47 is connected to the surface of the material substrate w. When contacting the substrate surface, the contact pressure must be paid great attention to avoid damage to the brittle material substrate W table, but correspondingly occurs in the decompression of the closed space. Stress, in addition, when there is a collision at the time of contact, there is a case where the contact portion is damaged. In particular, the surface of the material substrate is formed with a fine body: Q: The damage occurs in the circuit part, which is a defective product. Therefore, it is necessary to reverse the substrate system. The purpose of the present invention is to provide an object capable of eliminating the above problems.
’能同時進行劃線步驟與分斷步驟以謀 化的分斷裝置 201240927 用以解決課題之手段 為解決上述課題而為 置，具備奘為之本如月之刀斷裝置之分斷裝 具備裝载加工對象$ 該月危性材料其4 觸·性材料基板的裝载台、用以將 ”茨脆性材科基板於該裝 配置友兮W 歡口上保持於疋位置的保持手段、 -置在該裝載台上方的 β . μ ^ 4 。卩、以及使该碩部相對該脆性材 科基板移動的掃描機構， 線之劃線工具应產生“ “列配置有用以形成劃 °上之吸引作用之吸引墊，藉由使該 ^ ^ 4s η n ^ i± # # & ^ ^ M a -tr ±, 4劃線工具為前導相對移動， 你洛 料土板形成劃線，接續於此以 後續之吸引塾沿著形成之劃線分斷脆性材料基板。 發明效果 根據本發明，僅需使—個頭部進行掃插即能在不反轉 反之情形下’連續同時進行劃線步驟與分斷步驟，如此 即迠達成分斷系統大幅的合理化。 此處，吸引墊可具備於其下面側產生向上之吸引作用 的減壓空間部、與夾著此減壓空間部至少在左右部位喷出 向下之空氣的喷出1 ’藉由吸引墊之減壓空間部於劃線上 進行吸引，同時藉由來自喷出孔之喷出空氣按壓劃線之左 右兩側部A，據以分斷該脆性材料基板。如此，即能確實 的’在不使脆性材料基板接觸吸引塾之情形下，以劃線為 頂點使其彎曲成倒V字形後加以分斷。 又’吸引墊亦可具備朝下開口之空氣吸引孔，藉由來 自此空氣吸引礼之吸引空氣形成減壓空間部。 又，吸引墊亦可於下面形成凹部，該凹部之外周側側 6 201240927 面形成有複數個空氣噴出孔’於該凹部中央形 往下方直徑越細之方式形成之圓錐狀側面的圓二卜以越 從該喷出孔吹出之空氣撞擊該圓錐狀側面後即形成：部， :邊迴旋-邊下降之迴旋下降流，藉由當該迴旋=方 成之虱旋效果於該凹部中央形成該減壓空 形 據此靖予 上述务明中，§亥保持手段包含形成於該裝載台之夕 個吸附孔或多孔質板，#由來自此吸附孔或多孔&板^數 引空氣吸附保持脆性材料基板，此吸附孔或多孔質板之吸 ^材料基板之吸附力，至少在吸引塾之動作時係設定= 容許脆性材料基板之倒v字形彎曲之範圍内。 如此，即能在將脆性材料基板確實的吸附保持在褒栽 台上之定位置之同時，於吸引墊之動作時，在不阻礙脆性 材料基板之倒V字形彎曲之形成的情形下，確實的加以八 斷。 刀 【實施方式】. 以下’根據圖之揭示詳細說明本發明之分斷裝置的詳 情。 圖1係顯示本發明之分斷裝置之一例的立體圖、圖2 係放大分斷裝置之主要部位的立體圖、圖3係圖2之裝戴 台部分的剖面圖。圖4係顯示以吸引墊使脆性材料基板分 斷之狀態的放大剖面圖，圖5則係吸引墊之仰視圖、顯示 空氣吸引孔及喷出孔之排列形態。 201240927 分斷裝置l，具備裝載待分斷之脆性材料基板w的裝 載台2。此裝載台2可沿水平軌道3, 3移動於γ方向，被 藉由馬達^!,旋轉之螺栓4驅動。又，裝載台2可藉由内裝 馬達之驅動部5在水平面内旋動。 裝載台2具備將裝载於其上脆性材料基板w保持於定 位置之保持手段。本實施例中，作為此保持手段設有於 裝載台2開口之多數個小的空氣吸附孔i【。此空氣吸附孔 11，如圖3戶斤示，係透過設在裝載台内部之共通的歧管 (manif〇ld)12及軟管（hose)連接口 13連通於未圖示之真空吸 引源（真空泵）。又，亦可取代空氣吸引孔u，於裝載台之吸 附面使用陶瓷製或燒結金屬製之多孔質板。 具備夾著裝载台2設置之兩側的支承柱6,6與延伸於乂 方向之導桿7的橋8，係跨在裝載台2上設置。頭部1〇設 置成能沿著形成在導桿7之導件9移動於X方向，被馬達 驅動於X方向藉由此等構件構成頭部Μ # X方向之 帚描機構此頭部！ 〇形成為能上下移動，且於其下部於父 方向直列配置安裝有作為劃線加工用劃線工具之刀輪3 ^、 與下端具備分斷用吸引墊21之吸引機構2〇。 吸引墊21 ’如圖4所示，設有在下面側產生向上之吸 引作用的減壓空間部p、與在將此減壓空間部p夾在内側之 P位喷出向下之空氣的喷出孔23。本實施例中，於吸 引墊21之下面中央設置空氣吸引孔22，藉由從此空氣吸引 孔22吸引空氣以形成前述減壓空間部p。具體而言，如圖 冷)所示，於吸引墊21之下面中心設置空氣吸引孔22,於 201240927 其左右位置配置彼此平行之長圓狀喷出孔23, 23。 又，如圖5(b)所示，可將空氣吸引孔22與喷出孔23 作成相同之長圓狀’或亦可如圖5(c)所示，將喷出礼23作 成圓弧狀之長孔配置成圍繞中心之空氣吸引孔U。 ^空氣吸引孔22透過吸引空氣通路25連通於未圖示之 空氣吸引源（真空栗），喷出孔23則透過喷出空氣通路26連 通於未圖示之空氣供應源(壓縮空氣供應裝置、高壓鋼瓶 等）。圖4所示之實施例中，係將支承吸引墊2ι之轴以 彼，隔著間隙配置之内筒28與外筒29之雙層管形成，以 筒8之内部為吸引空氣通路25、而以内筒μ與外筒μ 間2間隙為喷出空氣通路26。將此等吸引空氣通路25、喷 出空虱通路26與各自之空氣源相連接之管線設備，在圖】 中是省略的。 .又，如圖1所示，安裝有用以檢測脆性材料基板w之 位置的攝影機14，攝影機14拍攝之影像顯示於監視器15。 :乂攝衫機14拍攝設在裝載台2上之脆性材料基板w之角隅 P =面之位置特^用對準標記，據以進行脆性材料基板貿 °若對準標記是位於基準設定位置的話，即開始折 ^ °但若對準標記相對基準設定位置有㉟差的話，則 欢測遠偏差量’—邊觀察監視器之影 以機楠壬l 逆人于作業或 自動的使脆性材料基板W在裝載台2上移動直 ’、’、位置偏差為止，以修正該偏差。 其-人，說明此分斷叢置之動作。 於裝載台2上裝載脆性材料基板W，以裝載台2上形 201240927 成之空氣吸附孔1 1將其吸附保持於定位置。接著，使頭部 降下將刀輪31壓接於脆性材料基板w、一邊以刀輪3 1為 前導移動頭部10，來以刀輪31於脆性材料基板w形成劃 線S。 接著，後續之吸引墊21沿著形成之劃線s於其正上方 移動。此時，已形成左右之喷出孔23, 23位於劃線s之左 右的狀態。藉由吸引墊21之移動，如圖4所示，脆性材料 基板W即被來自吸引墊2 1之空氣吸引孔22之吸引空氣吸 起在前一刻形成劃線S之部分，同時劃線S之兩側部分被 來自喷出孔23之喷出空氣（降流）按壓，因此即以劃線s為 頂點而略被彎曲成倒V字形，沿著劃線S被分斷。為避免 基板W考曲時脆性材料基板W接觸吸弓丨墊2 1，脆性材料基 板W與吸引墊21之間隔係被預先設定。如此，即能在吸引 塾2 1不接觸脆性材料基板w之情形下，沿著劃線s依序分 斷基板W。 又，使用吸引墊2 1進行脆性材料基板w之分斷時，於 裝載台2上吸附保持脆性材料基板w之空氣吸附孔丨！之吸 附力’必須設定在容許以吸引墊21之空氣吸引孔22使脆 性材料基板進行倒V字形彎曲之範圍内。因此，最好是能 與吸引墊21之吸引動作連動，使裝載台2之空氣吸附孔i i 之吸附力弱至容許倒V字形彎曲之範圍内，或將空氣吸附 孔11之吸附力設定在恆容許倒V字形彎曲之範圍内。具體 而言’將吸引墊21之空氣吸引孔22之向上的吸引力設定 為大於裝载台2之空氣吸附孔2 1之向下的吸附力，以能暫 201240927 時且局部的吸起之方式調整空氣吸附力之平衡。 上述實施例中’係使用刀輪31作為劃線卫具，但亦可 視基板種類使用其他機械性的工具以形成劃線。例如，在 基板表面附著有保護片之情形時，可取代此而使用具有方 向性之固定刃、或組合因中的也# π狀 口疋刀與^疋轉刀4將複數個劃線工 具排成直列使用。此外，亦可取代刀輪及固定刀等之機械 性工具，而如圖6所示’利用照射雷射光束31a產生之熱應 力（較佳是如圖所示’亦利用照射後之冷媒喷射帶來的急速 冷卻），來形賴線。再者，視脆性㈣基板之種類亦可以 雷射剝蝕（laser ablation)加工形成劃線。 又’上述實施例中，作為將脆性材料基板W於裳載台 2上保持於疋位置之手段’雖係利用线吸附孔η之吸附 力，但不限於此。亦可例如® 7所示，於裝載台2上設置 抵接於.脆性㈣基板^料之定㈣％料衫位，並 保持成在吸引塾21之動作時脆性材料基板w不至產生X 方向及Y方向之橫向偏移。此場合，由於並無向下吸附力 之作用因此吸引塾21之吸引力亦可設定得較上述實施例 J此外’雖未圖不，但亦可作成於吸引墊2丨之動作時， 在容許脆性材料基板％之倒V字形f曲之範圍内以子等 之夹具輕輕的保持脆性材料基板W之緣部。 又，上述實施例中，雖係作成使吸引墊21相對裝載脆 _ #料基板W之褒載台2移動，但亦可相反的使吸引塾2丄 同時於定位置而移動裝載台2。 接著5兒明吸引墊之其他實施例。圖8及圖9係顯示 201240927 於吸引墊之減壓空間部P之形成，使用迴旋下降流之實施 例的圖。 此吸引整21b於下面形成有凹部25，於凹部25之外周 側側面形成有複數個喷出孔23b。空氣從喷出孔23b朝著半 徑方向内側吹出。於凹部25之中央形成有具越往下方越細 徑之方式形成之圓錐狀側面26的圓柱狀凸部27，並作成從 噴出孔23b吹出之空氣撞擊圓錐狀側面26。藉由作成此種 構造，從喷出孔23b喷出之空氣會成為渦流而一邊迴旋一 邊向下方喷出，形成迴旋下降流。藉由此迴旋下降流形成 之「氣旋效果」，迴旋流之令心部減壓，其結果於中央形成 具有吸引力之減壓空間部P，且其周圍存在下降流。 承上所述，藉由將此吸引墊2丨b相對脆性材料基板W 在略上方隔一距離的狀態下相對移動，即能與圖4所說明 之實施例同樣的，以迴旋流中心部之吸引力吸引形成在脆 性材料基板W之劃線S之上方部分，並藉由向下之迴旋下 降流將吸引部分之周邊壓向下方。如此，即能確實的在脆 性材料基板W與吸引墊21b不接觸之情形下，以劃線s為 頂點使基板W彎曲成倒V字形，沿著劃線s折斷脆性材料 基板W。根據此方法，由於僅藉由喷$空氣即能形成減空 間部P，因此只要有空氣供應源即可，不再需要真空泵等之 空氣吸引機構。 以上，雖係針對本發明之代表性的實施例作了說明， 但本發明當然不受限於上述實施例之構成，在可達成其目 的且不脫離申請專利範圍之範圍内，適當的進行各種修 12 201240927 正、變更。 產業上之可利用性 本發明可適用於能進行於玻璃基板、半導體基板等脆 性材料基板形成劃線、與從此劃線進行分斷之分斷裝置。 【圖式簡單說明】 圖1係顯示本發明之分斷裝置之一例的立體圖。 圖2係放大分斷裝置之主要部位的立體圖。 圖3係圖2之裝載台部分的剖面圖。 圖4係顯示以吸引墊使脆性材料基板分斷之狀態的放 大别面圖。 圖5係顯示吸引墊之空氣吸引孔及喷出孔之排列形態 例的仰視圖1 圖6係顧示劃線工具之另—實施例的立體圖。 圖7係顯示脆性材料基板之保持手段之另一例的立體 圖。 圖8係顯示吸引墊之再—實施例的立體圖。 圖9係圖8所示之吸引墊的剖面圖。 圖10係顯示習知一般折斷方法的圖。 圖11係顯示使用吸引機構之習知折斷方法的圖。 【主要元件代表符號】 1 分斷裝置 2 裝載台 201240927 3 水平執 4 螺栓軸 5 驅動部 6 支承柱 7 導桿 8 橋 9 導件 10 頭部 11 裝載台之吸附孔（保持手段） 12 歧管 13 軟管連接口 14 攝影機 15 監視器 20 吸引機構 21 > 21b 吸引墊 22 空氣吸引孔 23 、 23b 喷出孔 25 吸引空氣通路 26 喷出空氣通路 27 轴 28 内筒 29 外筒 30 定位銷 31 劃線工具（刀輪） 14 201240927 41 刀輪 42 ' 45 裝載台 43 緩衝片 44 折斷桿 46 吸引裝置 47 吸引構件 48 凹部 49 彈性吸引片 50 吸引用狹缝 51 空氣吸引孔 P 減壓空間部 S 劃線 W 脆性材料基板 15'The breaking device that can perform the scribing step and the breaking step at the same time 201240927 The means for solving the problem is to solve the above problem, and the breaking device with the cutting device such as the moon has the loading. The object to be processed is a loading platform for the four-touch material substrate of the monthly hazardous material, and a holding means for holding the "cracking material substrate" in the 配置 position of the 配置 兮 兮 、 、 、 、 、 、 、 、 - At the top of the loading table, β . μ ^ 4 , and the scanning mechanism for moving the skeleton relative to the brittle material substrate, the line scribing tool should produce "the column arrangement is useful to form the attractive attraction of the stroke. Pad, by making the ^^4s η n ^ i± # # & ^ ^ M a -tr ±, 4 scribing tool for the relative movement of the preamble, you will form a scribe line, followed by this to follow The attracting crucible separates the brittle material substrate along the formed scribe line. Advantageous Effects of Invention According to the present invention, it is only necessary to perform sweeping of one head, and it is possible to continuously perform the scribing step and the breaking step without reverse reversal. So that the Tatda component system is large Here, the suction pad may include a decompression space portion that generates an upward suction function on the lower surface side thereof, and a discharge 1' that ejects the downward air at least in the left and right portions with the decompression space portion interposed therebetween. The decompression space portion of the pad is sucked on the scribe line, and the left and right side portions A of the scribe line are pressed by the ejection air from the ejection hole, thereby breaking the brittle material substrate. Thus, the sturdy material substrate can be surely When the brittle material substrate is not brought into contact with the suction ridge, the scribe line is vertices to be bent into an inverted V shape and then broken. The 'adsorption pad may also have an air suction hole that opens downward, and is attracted by the air. The attraction air is formed into a decompression space portion. Further, the suction pad may form a concave portion on the lower side, and the outer peripheral side side 6 201240927 surface of the concave portion is formed with a plurality of air ejection holes 'the finer diameter in the center of the concave portion toward the lower side. The circle formed by the conical side surface is formed by the air blown from the ejection hole striking the conical side surface: a portion, a side-swing-side falling convoluted downward flow, by which the convolution = square The effect of the swirling is formed in the center of the recessed portion. According to the above-mentioned law, the method of retaining the hoist includes forming an adsorption hole or a porous plate formed on the loading platform, #from the adsorption hole or the porous hole The plate absorbs the air to adsorb the substrate of the brittle material, and the adsorption force of the substrate of the adsorption hole or the porous plate is set at least in the action of attracting the crucible = the range of the inverted v-shaped bending of the substrate for allowing the brittle material In this way, the positive adsorption of the brittle material substrate can be maintained at a fixed position on the sputum table, and at the same time as the action of the suction pad, without hindering the formation of the inverted V-shaped curvature of the brittle material substrate, It is true that it is broken. Knives [Embodiment] The following details of the breaking device of the present invention will be described in detail based on the disclosure of the drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an example of a breaking device of the present invention, Fig. 2 is a perspective view showing a main part of the breaking and breaking device, and Fig. 3 is a cross-sectional view showing a mounting portion of Fig. 2. Fig. 4 is an enlarged cross-sectional view showing a state in which the brittle material substrate is cut by the suction pad, and Fig. 5 is a bottom view of the suction pad, showing the arrangement of the air suction holes and the ejection holes. The 201240927 breaking device 1 is provided with a loading table 2 on which a brittle material substrate w to be broken is loaded. This loading table 2 is movable in the gamma direction along the horizontal rails 3, 3, and is driven by the rotating bolts 4 by the motor. Further, the loading table 2 can be rotated in the horizontal plane by the driving portion 5 of the built-in motor. The loading table 2 is provided with holding means for holding the brittle material substrate w placed thereon in a predetermined position. In the present embodiment, as the holding means, a plurality of small air suction holes i are provided in the opening of the loading table 2. The air suction hole 11 is connected to a vacuum suction source (not shown) through a common manifold 12 and a hose connection port 13 provided in the interior of the loading platform. Vacuum pump). Further, instead of the air suction hole u, a porous plate made of ceramic or sintered metal may be used for the suction surface of the loading table. A bridge 8 having a support post 6, 6 sandwiching both sides of the loading table 2 and a guide rod 7 extending in the 乂 direction is provided across the loading platform 2. The head 1 is disposed so as to be movable in the X direction along the guide 9 formed on the guide bar 7, and is driven by the motor in the X direction to form the head of the head Μ #X direction by such members! The crucible is formed so as to be movable up and down, and a cutter wheel 3^ as a scribing tool for scribing is attached to the lower portion in the parent direction, and a suction mechanism 2B having a suction suction pad 21 at the lower end is disposed. As shown in FIG. 4, the suction pad 21' is provided with a decompression space portion p that generates an upward suction on the lower side, and a spray that ejects downward air to the P position on the inner side of the decompression space portion p. Outlet 23. In the present embodiment, an air suction hole 22 is provided in the center of the lower surface of the suction pad 21, and air is sucked from the air suction hole 22 to form the decompression space portion p. Specifically, as shown in Fig. 25, the air suction holes 22 are provided at the center of the lower surface of the suction pad 21, and the elongate discharge holes 23, 23 which are parallel to each other are disposed at right and left positions in 201240927. Further, as shown in FIG. 5(b), the air suction hole 22 and the discharge hole 23 may be formed in the same elongated shape or as shown in FIG. 5(c), the discharge ceremony 23 may be formed in an arc shape. The long hole is configured to surround the center air suction hole U. The air suction hole 22 communicates with an air suction source (vacuum pump) (not shown) through the suction air passage 25, and the discharge hole 23 communicates with an air supply source (not shown) through the discharge air passage 26 (compressed air supply device, High pressure cylinders, etc.). In the embodiment shown in FIG. 4, the shaft supporting the suction pad 2i is formed by the double tube of the inner cylinder 28 and the outer cylinder 29 disposed with the gap therebetween, and the inside of the cylinder 8 is the suction air passage 25, and The gap between the inner cylinder μ and the outer cylinder μ is the discharge air passage 26. The pipeline equipment for connecting the suction air passage 25 and the discharge air passage 26 to the respective air sources is omitted in the drawings. Further, as shown in Fig. 1, a camera 14 for detecting the position of the brittle material substrate w is mounted, and an image taken by the camera 14 is displayed on the monitor 15. : 乂 乂 机 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 If you start to fold ^ °, but if there is a 35 difference between the alignment mark and the reference setting position, then the far deviation amount will be measured. - Observe the shadow of the monitor to make the machine work or automatically make the brittle material. The substrate W is moved on the loading table 2 by a straight ', ' and a positional deviation to correct the deviation. Its - person, explain the action of this splitting. The brittle material substrate W is placed on the loading table 2, and the air is adsorbed and held in a fixed position by the air suction hole 11 formed in the upper surface of the loading table 2. Then, the head is lowered, the cutter wheel 31 is pressed against the brittle material substrate w, and the head 10 is guided by the cutter wheel 3 1 to form the scribe line S on the brittle material substrate w by the cutter wheel 31. Next, the subsequent attraction pad 21 moves directly above the formed scribe line s. At this time, the left and right discharge holes 23, 23 are formed in the state of the left and right of the scribe line s. By the movement of the attraction pad 21, as shown in Fig. 4, the brittle material substrate W is sucked by the suction air from the air suction hole 22 of the attraction pad 21, and the portion where the scribe line S is formed at the previous moment, while the scribe line S is The both side portions are pressed by the ejected air (downflow) from the ejection holes 23, and thus are slightly bent into an inverted V shape with the scribe line s as a vertex, and are separated along the scribe line S. In order to prevent the brittle material substrate W from contacting the suction pad 2 when the substrate W is smeared, the interval between the brittle material substrate W and the attraction pad 21 is set in advance. Thus, the substrate W can be sequentially separated along the scribe line s in the case where the attraction 塾2 1 does not contact the brittle material substrate w. Further, when the brittle material substrate w is separated by the suction pad 21, the air adsorption hole of the brittle material substrate w is adsorbed and held on the loading table 2! The suction force ' must be set within a range that allows the air suction hole 22 of the suction pad 21 to bend the brittle material substrate in an inverted V shape. Therefore, it is preferable to be able to interlock with the suction operation of the suction pad 21 so that the adsorption force of the air suction hole ii of the loading table 2 is weak to the extent of allowing the inverted V-shaped bending, or the adsorption force of the air adsorption hole 11 is set to be constant. It is allowed to be in the range of inverted V-shaped bending. Specifically, the suction force in the upward direction of the air suction hole 22 of the suction pad 21 is set to be larger than the downward suction force of the air suction hole 2 1 of the loading table 2, so as to be able to temporarily absorb the tire at the time of 201240927. Adjust the balance of air adsorption. In the above embodiment, the cutter wheel 31 is used as the scribing aid, but other mechanical tools may be used depending on the type of the substrate to form the scribing line. For example, when a protective sheet is attached to the surface of the substrate, a fixed blade having a directivity or a combination of a #ππ-shaped boring tool and a rotary cutter 4 may be used instead. Used inline. In addition, it is also possible to replace the mechanical tools such as the cutter wheel and the fixed knife, and as shown in FIG. 6 'the thermal stress generated by the irradiation of the laser beam 31a (preferably as shown in the figure 'also uses the refrigerant spray belt after the irradiation Come to the rapid cooling), to shape the line. Further, the type of the brittle (four) substrate may be processed by laser ablation to form a scribe line. Further, in the above-described embodiment, the means for holding the brittle material substrate W on the side of the skirt 2 is the suction force of the line adsorption hole η, but the invention is not limited thereto. For example, as shown in FIG. 7, the loading table 2 is provided with a (four)% of the position of the brittle (four) substrate, and is maintained so that the brittle material substrate w does not generate the X direction when the suction cymbal 21 is actuated. And lateral offset in the Y direction. In this case, since there is no downward suction force, the attraction force of the suction cymbal 21 can be set to be larger than that of the above-described embodiment J, although it is not shown, but it can also be used when the suction pad 2 is operated. The edge of the brittle material substrate W is gently held by the jig of the sub-such as the inverted V-shape of the brittle material substrate. Further, in the above embodiment, the suction pad 21 is moved relative to the stacking table 2 on which the fragile substrate W is loaded. Alternatively, the loading cassette 2 may be moved at the same time by the suction position. Next, 5 other embodiments of the attraction pad are shown. Fig. 8 and Fig. 9 are views showing an example in which the decompression space portion P of the suction pad is formed in 201240927, and a swirling downflow is used. The suction portion 21b is formed with a concave portion 25 on the lower surface, and a plurality of discharge holes 23b are formed on the outer circumferential side surface of the concave portion 25. Air is blown from the discharge hole 23b toward the inner side in the radial direction. A cylindrical convex portion 27 having a conical side surface 26 formed to have a smaller diameter toward the lower side is formed in the center of the concave portion 25, and the air blown from the discharge hole 23b is struck against the conical side surface 26. With such a structure, the air ejected from the discharge holes 23b is vortexed and ejected downward while swirling, thereby forming a swirling downflow. By the "cyclonic effect" formed by the swirling downflow, the core is decompressed by the swirling flow, and as a result, the attractive decompression space portion P is formed at the center, and the downward flow is present around the center. As described above, by relatively moving the suction pad 2丨b relative to the brittle material substrate W at a distance from the bridging material substrate W, the center of the swirling flow can be similar to that of the embodiment illustrated in FIG. The attraction attraction is formed on the upper portion of the scribe line S of the brittle material substrate W, and the periphery of the attraction portion is pressed downward by the downward swirling downward flow. In this way, when the brittle material substrate W and the suction pad 21b are not in contact with each other, the substrate W is bent into an inverted V shape with the scribe line s as the apex, and the brittle material substrate W is broken along the scribe line s. According to this method, since the space-reducing portion P can be formed only by the injection of air, it is not necessary to have an air suction mechanism such as a vacuum pump as long as there is an air supply source. The above is a description of the representative embodiments of the present invention, but the present invention is of course not limited to the constitution of the above-described embodiments, and various types can be appropriately performed within the scope of achieving the object without departing from the scope of the claims. Repair 12 201240927 Positive, change. Industrial Applicability The present invention is applicable to a breaking device which can form a scribe line on a brittle material substrate such as a glass substrate or a semiconductor substrate, and can be separated from the scribe line. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an example of a breaking device of the present invention. Figure 2 is a perspective view of the main part of the enlarged breaking device. Figure 3 is a cross-sectional view of the loading station portion of Figure 2. Fig. 4 is an enlarged plan view showing a state in which the substrate of the brittle material is separated by the attraction pad. Fig. 5 is a perspective view showing an arrangement of an air suction hole and a discharge hole of an attraction pad. Fig. 6 is a perspective view showing another embodiment of the scribing tool. Fig. 7 is a perspective view showing another example of the holding means of the brittle material substrate. Figure 8 is a perspective view showing a further embodiment of the attraction pad. Figure 9 is a cross-sectional view of the attraction pad shown in Figure 8. Figure 10 is a diagram showing a conventional general breaking method. Fig. 11 is a view showing a conventional breaking method using an attraction mechanism. [Main component representative symbol] 1 Breaking device 2 Loading table 201240927 3 Horizontal holding 4 Bolt shaft 5 Driving part 6 Support column 7 Guide rod 8 Bridge 9 Guide 10 Head 11 Adsorption hole of the loading table (holding means) 12 Manifold 13 Hose connection port 14 Camera 15 Monitor 20 Suction mechanism 21 > 21b Suction pad 22 Air suction hole 23, 23b Injection hole 25 Suction air passage 26 Discharge air passage 27 Shaft 28 Inner cylinder 29 Outer cylinder 30 Locating pin 31 Marking tool (cutter wheel) 14 201240927 41 Cutter wheel 42 ' 45 Loading table 43 Buffer sheet 44 Broken rod 46 Suction device 47 Suction member 48 Concave portion 49 Elastic suction piece 50 Suction slit 51 Air suction hole P Decompression space portion S Scribing W brittle material substrate 15