CN102049815A - Cut-off device - Google Patents
Cut-off device Download PDFInfo
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- CN102049815A CN102049815A CN2010102314931A CN201010231493A CN102049815A CN 102049815 A CN102049815 A CN 102049815A CN 2010102314931 A CN2010102314931 A CN 2010102314931A CN 201010231493 A CN201010231493 A CN 201010231493A CN 102049815 A CN102049815 A CN 102049815A
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Abstract
The invention provides a cut-off device, wherein a workpiece is cut off by applying a vertical load-carrying directly along the marking-out of the workpiece when the workpiece is held by a ring member with a diameter greater than that of a circular workpiece.The cut-off device comprises a pressing mechanism (22) and workpiece supporting mechanisms (23a, 23b). The pressing mechanism (22) is equipped with a linear pressing surface and a cut-off rod (36), wherein a workpiece is pressed from the side of an adhesion zone.The workpiece supporting mechanisms (23a, 23b) comprises a support member (46) with a resistance to the pressing force of the cut-off rod to support the workpiece.The cut-off rod divided into a block-fixing part (37) and a block-variable part (38a, 38b) is equipped with a pressing-face adjustment mechanism. The pressing face of the block-variable part is converted into a standby state by the pressing-face adjustment mechanism.The pressing face of the cut-off rod is adjusted to press down the workpiece according to the marking-out length of the workpiece to be cut off.
Description
Technical field
The present invention relates to a kind of disconnecting apparatus that workpiece such as semiconductor crystal wafer is separated into chip unit, more specifically, the workpiece of being opened on the adhesion zone of establishing that the present invention relates in a kind of ring that will be fixed in cut ring was located at the line on the workpiece and is separated into the disconnecting apparatus of chip unit along quarter.Among the present invention, workpiece as processing object mainly is the semiconductor crystal wafer of silicon etc., but so long as marking lengths can be according to the workpiece that fragile material constituted of the shape (for example circle or ellipse etc.) of the change in location on the workpiece, even glass substrate or ceramic substrate are also applicable.
Background technology
In the production stage of semiconductor device, comprise and to be arranged on the circular semiconductor crystal wafer in length and breadth and to be formed with the cutting step that a plurality of square chips are separated into chip unit.
Figure 21 is illustrated in the figure that keeps the ring element 10 of wafer in the cutting step, and Figure 21 (a) is its vertical view, and Figure 21 (b) is a front view.Ring element 10 is made of with cut ring 13 adhesion sheet 12.The rear side of wafer 11 is attached to adhesion sheet 12.And, around wafer 11, in order to be attached to identical adhesion sheet 12 to open the cut ring 13 (also being called wafer central) of establishing state support adhesion sheet 12.Cut ring 13 is that thickness is the metal product about 1.5mm.
In cutting step, the wafer 11 that ring element 10 is fixed uses cutting machine or laser beam to come to form in length and breadth many line 11a.The length of line 11a, near the central line 11a that crosses wafer 11 is longer, and it is shorter to cross near the line 11a of periphery.And wafer 11 is separated into chip unit at the 11a that respectively rules on the wafer 11 under the state that is attached at ring element 10.
Employed disconnecting apparatus is to utilize following method to apply bending moment when in the past, wafer 11 being separated into chip unit: from the rear side of adhesion sheet 12 spherical disconnection ball is rolled to push (for example with reference to patent documentation 1); Perhaps along line 11a compress with the contact-making surface of wafer 11 be that the wire pressing body (the following trip arm that also is called in this manual) of linearity or bar-shaped roller that contact-making surface is the side of cylinder are pushed (for example with reference to patent documentation 2).
[prior art document]
[patent documentation]
[patent documentation 1] Japanese kokai publication hei 10-74712 communique
[patent documentation 2] TOHKEMY 2006-66539 communique
Summary of the invention
The use of being put down in writing as patent documentation 1 disconnects ball as the method for pressing member as shown in figure 22, make disconnect ball 15 with certain spacing P wafer 11 upper edge positive directions, in the other direction alternately with turning back rolling apply load-carrying.Its result disconnects ball 15 and whenever draws a track, and then line is each disconnects one or disconnect many.
When disconnecting a line at a track that disconnects ball 15 is each, disconnect ball 15 rollings owing to can directly over all line, make, therefore each line is vertically applied load-carrying and forms vertical crack, but till all line that disconnect on the wafer, need to make the quite long distance of disconnection ball 15 rollings, and feasible the processing need be than the long time.The disconnection ball 15 that has increased diameter when utilization makes the wafer bending, when many of each disconnections are rule on a track, processing time can be shortened, but if many line of each disconnection, for arbitrary line, promptly all directly over it and on the position of departing from a little, do not make to disconnect ball 15 rollings so, therefore the line that disconnects ball of not rolling is obliquely applied load-carrying directly over it, the result is difficult to make the crack vertically to be permeated, and is easy to generate burr.
Again, such as patent documentation 2 record, use as shown in figure 23 bar-shaped roller 16 or trip arm as shown in figure 24 17 (wire pressing body) as pressing member, in sliding the method push while the face that makes these along adhesion sheet 12, processing speed does not have problems, but if bar-shaped roller 16 grades move to the line that promptly will disconnect under the position before, under the state that is subjected to load-carrying from the incline direction of ruling, disconnect, so the crack will be difficult to permeate on vertical direction, and be easy to generate burr.
As other problem, when pushing,, so can't push wafer 11 if bar-shaped roller 16 or trip arm 17 collide the cut ring 13 (Figure 21) of the ring element 10 that keeps wafer 11 again.If the ring internal diameter of cut ring is made as a, promptly as shown in figure 21, the width of the long side direction of bar-shaped roller 16 or trip arm 17 is made as for making depressible area become maximum
The diameter maximum of the wafer 11 that can disconnect at this moment, also must
Below.
Therefore, need diameter adhesion sheet 12 or the cut ring 13 enough big, and then disconnecting apparatus itself also must be with respect to as the wafer 11 of processing object and whole maximization with respect to the diameter of wafer 11.
Therefore, the object of the present invention is to provide a kind of disconnecting apparatus, this disconnecting apparatus can be that the ring element of cut ring of the diameter of round piece (wafer etc.) keeps under the state of workpiece by using diameter to be a bit larger tham processing object, applies vertical load-carrying along the line of workpiece, thereby disconnects workpiece.
In order to reach aforementioned purpose, take following technological means.That is, disconnecting apparatus of the present invention is to come the disconnecting apparatus of disjunction workpiece along being formed at many line on the workpiece, and use by cut ring with in the ring of cut ring, open the ring element that adhesion zone the constituted conduct of establishing supporting member in order to the maintenance workpiece.Again, workpiece is in the state of the adhesion zone that is attached to ring element.In addition, the workpiece that is attached at ring element is as circle or the ellipse, is formed at the shape that the length of many line on the workpiece can change according to the position on the workpiece.
Be provided with in the disconnecting apparatus: pressing mechanism, it possesses trip arm, and this trip arm has the press surface of linearity, and pushes workpiece along the positive behind of the line of disjunction object from the adhesion zone side of ring element; And work mounting s mechanism, it possesses the workpiece side of being connected to and the opposing pressing force of trip arm and the supporting member of holding workpieces;
Trip arm is divided into fixedly block portion and variable block portion along the long side direction of press surface, and is provided with the press surface that makes variable block portion and is changed to the press surface guiding mechanism of keeping out of the way state that the fixing press surface of block portion is more shunk back.
Again, trip arm is pushed workpiece under the state of the press surface length of having adjusted trip arm according to the marking lengths of disjunction object.
That is the length of many line of workpiece that is formed at circle etc. is shorter near the periphery of workpiece, central elongated at workpiece, and when near the periphery of disjunction workpiece, the press surface of trip arm collides cut ring easily.Therefore, when the disjunction periphery than dash line the time, be to push workpiece with the fixing press surface of block portion in only keeping out of the way under the state that the press surface of variable block portion is shunk back, when the disjunction periphery, make trip arm not be contacted with cut ring.When disjunction workpiece central authorities than dash line the time, be with the press surface of variable block portion and fixedly push under the corresponding to state of press surface of block portion.
Thus, according to the position of the line on the workpiece, be adjusted to the variable block portion that makes trip arm and can not collide cut ring and carry out disjunction.
In addition, though make the supporting member of work mounting s mechanism be connected to workpiece across the workpiece side opposite with trip arm, supporting member also can be connected near the positive behind in the part zone of being pushed by trip arm, also can be connected to whole workpiece.Thus, when trip arm was pushed the adhesion zone of rear side of workpiece, adhesion zone can significantly not extend in pushing on the direction, but with push before under the roughly the same state by disjunction, so can carry out high-precision disjunction to the line in disjunction precalculated position.
According to the present invention, the mode that can become the variable block portion of trip arm can not collide cut ring according to the length adjustment of the line that changes according to the position on the workpiece is carried out disjunction.Thus, can keep in the line of workpiece, applying load-carrying and disconnecting under the state of workpiece by diameter as the ring element of the slightly larger in diameter of the round piece (wafer etc.) of processing object.And then, supporting member is connected to across workpiece and the side opposite with trip arm suppresses the extension of adhesion zone, trip arm accurately and is vertically pushed along line, and can carry out disjunction with vertical crack.
Preferred mode is in the foregoing invention, the variable block portion of trip arm is divided into the unit block of equal number respectively in the fixing long side direction both sides of block portion, and the unit block is mounted in the both sides of fixing block portion and becomes left-right symmetry, and the press surface guiding mechanism is the adjustment that the press surface of trip arm is changed according to the every pair of unit block that is positioned at symmetrical position.
By variable block portion is divided into a plurality of blocks lessly, and can be according to as the length of the line of processing object and adjust the length of trip arm gradually, even if the diameter of cut ring is identical, trip arm also can not collide cut ring, carries out disjunction and can attach the bigger workpiece of diameter.
Preferred mode is in foregoing invention, makes the maximum length L of the press surface of aforementioned trip arm compare the ring internal diameter a of cut ring in the scope of following formula
Thus, for diameter of work greater than
Workpiece, as long as maximum gauge is no more than the trip arm length L, can carry out disjunction.
Preferred mode is in foregoing invention, supporting member, be by constituting along line and across a pair of cramp bar that the position of the left and right sides of line is connected to workpiece respectively, a pair of cramp bar is divided into fixedly block portion and variable block portion respectively, and is provided with the bearing surface that makes variable block portion and is changed to the bearing surface guiding mechanism of keeping out of the way state that the fixing bearing surface of block portion is more shunk back.
By supporting member being made as along line at a pair of cramp bar that on the position of the left and right sides of ruling, is connected to workpiece respectively, with the left and right sides of being pushed along line supporting trip arm, in line, apply bending moment exactly thus, and make the crack be easy to vertically permeate.
And then, when disjunction workpiece periphery than dash line the time, be to keep out of the way state only with the fixing press surface holding workpieces of block portion, so that cramp bar also can not contact cut ring when the disjunction periphery with what the press surface of the variable block portion of cramp bar was shunk back.When disjunction workpiece central authorities than dash line the time, form the bearing surface of the variable block portion make cramp bar and the fixing corresponding to state of bearing surface of block portion.Thus, with trip arm in the same manner, can be according to the length of the line on the workpiece do not carry out disjunction so that the variable block portion of cramp bar does not collide mode adjusted of cut ring.
Preferred mode is herein, the variable block portion of a pair of cramp bar is divided into the unit block of equal number respectively in the fixing both sides of the long side direction of block portion, and the unit block is mounted in the both sides of fixing block portion in pairs and left-right symmetry, and this press surface guiding mechanism is the adjustment that the press surface of cramp bar is changed according to the every pair of unit block that is positioned at symmetrical position.
Be divided into a plurality of units block by the variable block portion with cramp bar lessly, and can similarly adjust length gradually with trip arm, even if the diameter of cut ring is identical, cramp bar also can not collide cut ring, carries out disjunction and can attach the bigger workpiece of diameter.
Again, preferred mode is, supporting member is made of the cramp bar along the line butt, and cramp bar is divided into fixedly block portion and variable block portion, and is provided with the bearing surface that makes variable block portion and is changed to the bearing surface guiding mechanism of keeping out of the way state of more shrinking back than the fixing bearing surface of block portion.
By supporting member being made as the cramp bar that is connected to workpiece along line, the position with the positive behind of being pushed along line supporting trip arm applies pressing force exactly thus, and can carry out disjunction with vertical fracture in line.In addition, in this case, can make cramp bar is one, but compares along the situation of the left and right sides butt of line with making a pair of cramp bar, need strengthen pressing force a little.
Similarly, can be according to the length of the line on the workpiece, with the length adjustment Cheng Buyu cut ring collision of the variable block portion of cramp bar, to carry out disjunction.
Preferred case is in this case, the variable block portion of cramp bar is divided into the unit block of equal number respectively in the fixing both sides of the long side direction of block portion, and the unit block is mounted in the both sides of fixing block portion in pairs and left-right symmetry, and this press surface guiding mechanism is the adjustment that the press surface of cramp bar is changed according to the every pair of unit block that is positioned at symmetrical position.
Again, preferred mode is in the foregoing invention, possesses in order to set the input part to the disconnection order that is formed at many line on the workpiece; Work transporting mechanism is according to the disconnection that sets order, and the line that the position of ring element is adjusted to the disjunction object can be come the position with the press surface subtend of trip arm in regular turn.
When taking-up is formed at chip on the workpiece, exist under the situation of priority, also can select line carry out disjunction according to priority.
Preferred mode is, input part is provided with feeding pattern in regular turn as one of the disconnection order that can set, and this feeding pattern in regular turn is to disconnect according to the putting in order of many line that is formed on the workpiece.
By setting feeding pattern in regular turn, because therefore work transporting mechanism can shorten the time that the position is adjusted as long as make the line of the press surface aligned abutment of trip arm successively.
Preferred mode is, input part is provided with outside mode of priority as one of the disconnection order that can set, this outside mode of priority is to being formed at many line on the workpiece, from disconnecting near line about periphery, carry out one by one successively inboard about the disconnection of line, carry out the disconnection of the line of central authorities at last.
By outside mode of priority is set, slightly many to the time feeding pattern more in regular turn of carrying out being spent till all disconnections, but then, owing to disconnect successively from line near the side of the periphery of the workpiece left and right sides, but therefore left and right sides approximate equality ground and carry out disjunction more evenly, the mobile of center of gravity that opens the workpiece of establishing on the adhesion zone diminishes, and can realize cutting apart on the more accurate location.
Preferred mode is, input part is provided with etc. cuts apart pattern as one of the disconnection order that can set, the described pattern of cutting apart is that many line that are formed on the workpiece are carried out workpiece is divided into the disconnection of two parts, then be divided into tetrameric disconnection, then be divided into the disconnection of eight parts, again each workpiece through cutting apart waited respectively afterwards and cut apart.
Cut apart pattern by being provided with etc., with outside mode of priority similarly, slightly many to the time feeding pattern more in regular turn of carrying out being spent till all disconnect, but then, the approximate equality because the width about the line that will disconnect becomes, therefore can disconnect more evenly, and can realize locational accurately disconnection.
Description of drawings
Below, describe the details of disconnecting apparatus of the present invention with reference to the accompanying drawings in detail.Herein, the situation that disconnects wafer with many line of establishing of being carved on the wafer of circle is that example describes, wherein:
Fig. 1 is the figure that expression has attached an example of the ring element that uses the workpiece that disconnecting apparatus of the present invention disconnects.
Fig. 2 is the stereogram of expression from the integral body formation of the disconnecting apparatus of the viewed example of the present invention of dipper crowding gear side.
Fig. 3 is the stereogram of expression from the integral body formation of the disconnecting apparatus of the viewed example of the present invention of work mounting s mechanism side.
Fig. 4 is the front view (pressing mechanism side) of the disconnecting apparatus of Fig. 1.
Fig. 5 is the rearview (work mounting s mechanism side) of the disconnecting apparatus of Fig. 1.
Fig. 6 is the vertical view of the disconnecting apparatus of Fig. 1.
Fig. 7 is the figure of the formation of expression pressing mechanism.
Fig. 8 is the figure of the formation of expression trip arm.
Fig. 9 is the figure of the distortion pattern of expression trip arm.
Figure 10 is the figure in cross section of width of the press surface of expression trip arm.
Figure 11 is the figure of the formation of expression work mounting s mechanism.
Figure 12 is the figure of the formation of expression cramp bar.
Figure 13 is the figure in cross section of width of the bearing surface of expression cramp bar.
Figure 14 is the figure of the position relation of expression pressing mechanism 22 and the 23a of work mounting s mechanism, 23b.
Figure 15 is the figure of the position relation of expression pressing mechanism 22 and the 23b of work mounting s mechanism.
Figure 16 is the schematic diagram of relation of pattern of the press surface of open position on the representative ring member 10 and trip arm 36.
Figure 17 is the calcspar of control system.
Figure 18 is the figure that represents the disconnection order of feeding pattern in regular turn.
Figure 19 is the figure of the disconnection order in the mode of priority of the expression outside.
Figure 20 is the figure that expression waits the disconnection order of cutting apart in the pattern.
Figure 21 is the figure of representative ring member.
Figure 22 is the figure that expression utilization disconnects the disconnect method of ball.
Figure 23 is the figure that expression utilizes the disconnect method of bar-shaped roller.
Figure 24 is the figure that expression utilizes the disconnect method of wire pressing body (trip arm).
The specific embodiment
(ring element)
At first, to describing as the wafer of processing object relation with the ring element that keeps wafer.Fig. 1 is the vertical view that expression has attached an example of the ring element under the state of wafer.Ring element 10 is made of with cut ring 13 adhesion sheet 12.Cut ring 13 is that thickness is the metallic article about 1.5mm.The rear side of wafer 11 is attached on the adhesion sheet 12 and fixes.
When the internal diameter with cut ring 13 is made as a, not only at the diameter D of the wafer 11 that can utilize this ring element 10 to disconnect more in the past as the maximum gauge that can disconnect
More hour can disconnect, even and if diameter D be
Above than major diameter, (wherein L＜a) littler also can disconnect as long as the maximum length L of more following trip arm.
(structure of disconnecting apparatus)
Secondly, the formation to disconnecting apparatus of the present invention describes.Fig. 2 is the stereogram of expression from the integral body formation of the disconnecting apparatus 20 of a direction (pressing mechanism side) observation example of the present invention.Again, Fig. 3 is the integral body formation of disconnecting apparatus 20 is observed in expression from the direction opposite with Fig. 1 (work mounting s mechanism side) figure.In addition, Fig. 4 is the front view (pressing mechanism side) of disconnecting apparatus 20, and Fig. 5 is rearview (a work mounting s mechanism side), and Fig. 6 is a vertical view.
For ease of explanation, as shown in FIG.,, the long side direction that installs is made as directions X stipulates mutually orthogonal XYZ direction for disconnecting apparatus 20.
Disconnecting apparatus 20 mainly is made of substrate 21, pressing mechanism 22, the 23a of work mounting s mechanism, 23b, work transporting mechanism 24, go-cart 25, air plates 26.
Side bearing pressing mechanism 22 and air plates 26 in substrate 21 supports a pair of work mounting s 23a of mechanism, 23b in opposite side.Pressing mechanism 22 is holding workpieces transport mechanisms 24 with the centre of air plates 26.
Secondly, pressing mechanism 22 is described.Fig. 7 is the figure of expression pressing mechanism 22.Pressing mechanism 22 is fixed in the substrate 21 via pedestal 31.Be fixed with upright arm 32 on pedestal 31, thus, the mode that base plate 33 is erect with vertical (Y direction) is fixed.Parallel on base plate 33 2 linear guides 34 are installed, movable platen 35 are supported to and can slide at fore-and-aft direction (Z direction) by linear guide 34 and motor (not icon).In movable platen 35 trip arm 36 through blocking is installed, the front end of trip arm 36 is come the position side-prominent than a side of movable platen 35 more outwardly.This fore-end becomes the press surface of pushing wafer 11.
Fig. 8 is the figure of the formation of expression trip arm 36, and Fig. 8 (a) is a stereogram, and Fig. 8 (b) is a front view, and Fig. 8 (c) is a vertical view, and Fig. 8 (d) is a side view.
According to size, suitably set the size of long side direction of the press surface of the size of long side direction of press surface of the fixedly block 37 in the trip arm 36 and unit block 39 as the wafer 11 of processing object.In this example, for example fixedly the length of the long side direction of block 37 is made as about 100mm, and the length of the long side direction of unit block 39 is made as about 12.5mm (amounting to 8), as trip arm 36, the longest length L is made as about 200mm.Therefore, the length L of trip arm 36 becomes about 100mm, about 125mm, about 150mm, about 175mm, about 200mm according to the variation of pattern P 1-P5.Thus, can disconnect the wafer 11 of maximum 200mm (8 inches).
Figure 10 is the width cross section of the press surface of trip arm 36 (fixedly block 37 and unit block 39).As the size of the width of press surface, front end is made as taper about 0.1 μ m-3mm, the width contact wafer 11 with narrower applies thereby load-carrying is concentrated with becoming wire.
In addition, trip arm 36 (fixedly block 37 and unit block 39) is preferably used hard material, for example the tool using steel that is difficult to be out of shape when pushing.
Secondly, the 23a of work mounting s mechanism, 23b are described.Figure 11 is the figure of the formation of the expression work mounting s 23a of mechanism, 23b, and Figure 11 (a) is a stereogram, and Figure 11 (b) is a front view.The 23a of work mounting s mechanism, 23b carry respectively on pedestal 41a, 41b, by the cramp bar driving mechanism 41d that uses ball screw and motor pedestal 41a, 41b can be moved on track 41c.
In the 23a of work mounting s mechanism, 23b, except that cramp bar 46 (trip arm 36 that is equivalent to Fig. 7), all adopt and pressing mechanism 22 identical mechanism illustrated in fig. 7.Therefore, the 23a of work mounting s mechanism except that cramp bar 46, the symbol of 23b each several part are identical with Fig. 7, so omit explanation.
Figure 12 is the figure of the formation of expression cramp bar 46, and Figure 12 (a) is a stereogram, and Figure 12 (b) is a front view, and Figure 12 (c) is a vertical view, and Figure 12 (d) is a side view.
Constituent parts block 49 possesses and uses air pressure valve and utilize air operated elevating mechanism 50, and elevating mechanism 50 is to play a role as the bearing surface guiding mechanism 78 (Figure 17) that the position of more shrinking back to the fixing bearing surface position of block 47 is kept out of the way in the position that makes each bearing surface (fore-end of constituent parts block 49).Again, unit block 49 is identical and install symmetrically in the left and right sides quantity of fixing block 47, and the unit block 49 of position that is positioned at symmetry is each other in to keep out of the way action (amounting to 4 pairs).
That is, in Figure 12, bring into play the effect of the bearing surface guiding mechanism of cramp bar 46 with the press surface guiding mechanism identical mechanism of the trip arm 36 of Fig. 8.Again, about the distortion pattern according to unit block 49 of cramp bar 46, also the distortion pattern with trip arm 36 similarly is P1-P5 (Fig. 9).
The size of cramp bar 46 is identical with trip arm 36 basically, but is connected to the shape and the material difference of the fore-end of wafer 11.
Figure 13 is the width cross section of cramp bar 46 (fixedly block 47 and unit block 49).The front end face of cramp bar 46 is the plane.But be not limited to this, also curved surface.The material of the fore-end of cramp bar 46 is used elastic caoutchouc, flexibly to contact wafer 11 when pushing.
Secondly, referring again to Fig. 2-Fig. 6 work transporting mechanism 24 and go-cart 25 are described.Work transporting remove mechanism 24 above the framework 61 of the mount structure that stands vertically and below, be provided with and be used to support and the linear guide 62 of conveyance go-cart 25, and utilize linear motor (not icon) to make go-cart 25 horizontal (directions X) mobile.Be formed with the hole of installing ring member 10 in the central authorities of go-cart 25.
The ring element 10 that is installed on go-cart 25 by work transporting mechanism 24 by conveyance to pressing mechanism 22 and the 23a of work mounting s mechanism, the 23b, and make and carve the open position that the positive behind of trip arm 36 is come in the line of being located at wafer 11.Then, when disconnecting many line in succession, carry out the position adjustment, so that open position is come in each line successively.
The position adjustment is to be undertaken by localization method that has adopted video camera or mechanical type localization method isoperimetric perception method.For example also can utilize the video camera (not icon) that is installed in the device 20 that the alignment mark of being located at wafer 11 quarter is taken in advance, position by image processing then.When wafer 11 is attached at ring element 10 accurately, and when ring element 10 is installed on go-cart 25 accurately, also can position according to the position coordinates of go-cart 25 with respect to the origin position that sets at disconnecting apparatus 20 in advance again.
Next illustrates air plates 26.By ring element 10, go-cart 25, work transporting mechanism 24 and supported, and can utilize these supporting to carry out disconnection process as the wafer 11 of processing object with the state that stands vertically.Yet on ring element 10, wafer 11 is to be attached at the adhesion sheet 12 that is vulnerable to vibrate, if 12 vibrations of adhesion sheet, wafer 11 itself also can be affected.Therefore in order to carry out more high-precision disconnection process, preferably adopt the vibrationproof countermeasure in the line of being located at wafer 11 along quarter.
Therefore, in this example, be further around pressing mechanism 22, to advance to be equipped with square air plates 26.Air plates 26 with the position of ring element 10 subtends on be formed with a plurality of nozzle bores, from a part of nozzle bore, spray dry air, and utilize a part of nozzle bore to attract, thus, when go-cart 25 is arranged at open position, be with non-contacting state make adhesion sheet 12 and on the wafer 11 that attached stable under the state that stands vertically.
Position relation during secondly, to the disconnection of pressing mechanism 22 and the 23a of work mounting s mechanism, 23b describes.Figure 14 has omitted work transporting mechanism 24, go-cart 25, air plates 26 to represent the figure that the position of pressing mechanism 22 and the 23a of work mounting s mechanism, 23b concerns for ease of explanation.Shown in Figure 14 (a), pressing mechanism 22 and a pair of work mounting s 23a of mechanism, 23b are across ring element 10 and subtend.
As other butt method of cramp bar 46, also can shown in Figure 15 (a), make the 23a of work mounting s mechanism keep out of the way (perhaps promptly not carrying the 23a of work mounting s mechanism at first), and only use the 23b of work mounting s mechanism again.
In such cases, shown in Figure 15 (b), make cramp bar 46 butt directly over the line S of wafer 11.In addition, make trip arm 36 come the positive behind of line S.Thus, if trip arm 36 is pushed wafer 11, promptly can be because of the caused distortion of the elastic force of cramp bar 46 makes wafer 11 bendings, to apply bending moment.
(disconnection pattern)
Figure 16 is the schematic diagram of relation of pattern of the press surface of open position on the representative ring member 10 and trip arm 36.
For the short periphery of line, utilize the short pattern P 1 of press surface to disconnect, and make pattern be deformed into P2, P3, P4 in regular turn, the longest central authorities utilize the longest pattern P of press surface 5 to disconnect in line, thus, can not make trip arm 36 collide cut ring 13 and promptly disconnect wafer 11.
(control system)
Secondly, the control system to disconnecting apparatus 20 describes.Figure 17 is the calcspar of the control system of expression disconnecting apparatus 20.Control part 70 is made of the computer that comprises CPU71, memory 72, input part 73, display part 74.These are to be configured to unit's of control (not icon) on the device or near the device.Carry out go-cart conveyance and location work transporting mechanism 24, make the stable air plates 26 of wafer 11, make pressing mechanism 22, the press surface guiding mechanism 77 of adjusting the press surface length of trip arm 36 that trip arm 36 pushes, make the 23a of work mounting s mechanism, the 23b of cramp bar 46 butts and each one such as bearing surface guiding mechanism 78 that adjusts cramp bar length, be to control, and utilize display part 74 to come the supervisory control action state according to the stored program of memory 72 or parameter and from parameter, the instruction of input part 73 inputs.
(disconnection order)
In the disconnecting apparatus 20, when formed many line disconnect on wafer 11, can at random set disconnection order and should disconnection be stored in proper order in the memory 72 by input part 73 and (be called any designated mode), utilize stored disconnection to disconnect each line in proper order thus.
And, except that " designated mode arbitrarily ", in order to be easy to disconnect the setting input operation of order, also prepared " feeding pattern in regular turn ", " outside mode of priority " and " wait and cut apart pattern ", can select by the input of carrying out model selection.
Wherein, if select " feeding pattern in regular turn ", as that one as shown in Figure 18 disconnection order, disconnect in succession successively from a side of wafer 11.At this moment, according to the variation of the length of ruling, trip arm 36 changes according to the order of P1, P2, P3, P4, P5, P4, P3, P2, P1.By disconnecting with feeding pattern in regular turn, can make the needed time minimum of work transporting, therefore can shorten the processing time.
On the other hand, if select " outside mode of priority ", then as the disconnection order as shown in Figure 19, be positioned at wafer 11 outermost about the disconnection of line, then carry out the next one be positioned at the outside about the disconnection of line, be positioned at successively afterwards inboard about the disconnection of line.Then, be positioned at the disconnection of the longest line of central authorities at last.In such cases, according to the variation of the length of ruling, trip arm 36 changes according to the order of P1, P2, P3, P4, P5.
By disconnecting with outside mode of priority, the needed time feeding pattern more in regular turn of work transporting is slightly long, even if but wafer 11 also is to disconnect near symmetrical state under the state that a part is disconnected, therefore the center of gravity of wafer 11 moves and diminishes, and can realize more high-precision disconnection.
Again, if select " wait and cut apart pattern ", promptly as the disconnection order as shown in Figure 20, formation is divided into the wafer shape of two parts with the central authorities of wafer 11 line (then being the line of close central authorities when being scribed ss even number), then with the central separately line of each several part wafer that is divided into two parts this is divided into two parts again, and the part wafer is broken as four parts, similarly carry out afterwards with the part wafer be divided into eight parts, 16 parts ... the disconnection cut apart of grade.In such cases, owing to the dash line that is positioned at central authorities will be disconnected at first, so the length of trip arm becomes P5, but the length of trip arm then changes according to the length of the line that will disconnect subsequently afterwards.
Utilize to wait and to cut apart pattern and disconnect, because this promptly cuts apart with central authorities' line of the part wafer of this time point, so the width equalization of the left and right sides, and can disconnect more evenly, thereby can realize locational accurately disconnection.
More than the situation that disconnects many line of arranging in a direction (Y direction) is illustrated, but when the disconnection of carrying out cancellate line, when promptly carrying out the disconnection of many line of arranging at both direction (XY direction), be with ring element revolve turn 90 degrees lay equal stress on complex phase with action.In such cases, make ring element 10 revolve the rotating mechanism that turn 90 degrees as long as in go-cart 25, be provided with, can carry out the disconnection of both direction expeditiously.
Again, in the above-mentioned example, make 4 pairs of unit blocks 39 all be identical shape, but also can at each to and change the length of the long side direction of unit block.In addition, when the workpiece shape is asymmetric, also can make the length difference of the long side direction of paired unit block.
Again, in the above-mentioned example, across wafer 11 rear side of trip arm 36 and 1 or a pair of cramp bar 46 butts are supported, therefore can disconnect accurately, but there is the free degree in the shape of support side, so long as can support the supporting member of wafer 11, but so also in addition shape.For example, also can replace cramp bar 46, utilize the comprehensive plane supporting member that is connected to wafer 11 to support.
Again, in the above-mentioned example, though be that wafer to circle disconnects, the workpiece shape is not limited to circle.Be provided with the workpiece of many different line of length so long as can be attached in the ring of cut ring and carve, even if, also can effectively utilize the present invention so for example with other shape headed by the ellipse.
Again, in the above-mentioned example, though be ring element 10 to be vertically support, the also general known type disconnecting apparatus processed of support ring member 10 flatly.
[utilizability on the industry]
Disconnecting apparatus of the present invention can be used for being attached to the disconnection of wafer on the ring element etc.
Claims (11)
1. disconnecting apparatus, its use by cut ring with in the ring of cut ring, open the ring element that adhesion zone the constituted conduct of establishing supporting member in order to the maintenance workpiece, and be attached in said workpiece under the state on the adhesion zone of aforementioned ring element, along many line disjunction workpiece that are formed on the workpiece, it is characterized in that, be provided with:
Pressing mechanism, it possesses trip arm, and this trip arm has the press surface of linearity, and pushes said workpiece along the positive behind of the line of disjunction object from the adhesion zone side; And
Work mounting s mechanism, it possesses and is connected to the said workpiece side and resists the supporting member of the pressing force of aforementioned trip arm with holding workpieces;
Aforementioned trip arm is divided into fixedly block portion and variable block portion along the long side direction of press surface, and is provided with the press surface that makes variable block portion and is changed to the press surface guiding mechanism of keeping out of the way state that the fixing press surface of block portion is more shunk back;
Aforementioned trip arm is pushed workpiece under the state of the press surface of having adjusted trip arm according to the marking lengths of disjunction object.
2. disconnecting apparatus as claimed in claim 1, wherein, the variable block portion of aforementioned trip arm is divided into the unit block of equal number respectively in the fixing long side direction both sides of block portion, and the unit block is mounted in the both sides of fixing block portion and becomes left-right symmetry, and aforementioned press surface guiding mechanism is the adjustment that the press surface of trip arm is changed according to the every pair of unit block that is positioned at symmetrical position.
3. disconnecting apparatus as claimed in claim 1 or 2 wherein, makes the maximum length L of the press surface of aforementioned trip arm compare the ring internal diameter a of cut ring in the scope of following formula
4. disconnecting apparatus as claimed in claim 1 or 2, wherein, aforementioned supporting member, be by constituting along line and across a pair of cramp bar that the position of the left and right sides of line is connected to workpiece respectively, aforementioned a pair of cramp bar is divided into fixedly block portion and variable block portion respectively, and is provided with the bearing surface that makes variable block portion and is changed to the bearing surface guiding mechanism of keeping out of the way state that the fixing bearing surface of block portion is more shunk back.
5. disconnecting apparatus as claimed in claim 4, wherein, the variable block portion of aforementioned a pair of cramp bar is divided into the unit block of equal number respectively in the fixing both sides of the long side direction of block portion, and the unit block is mounted in the both sides of fixing block portion in pairs and left-right symmetry, and aforementioned press surface guiding mechanism is the adjustment that the press surface of cramp bar is changed according to the every pair of unit block that is positioned at symmetrical position.
6. disconnecting apparatus as claimed in claim 1 or 2, wherein, aforementioned supporting member is made of the cramp bar along the line butt, aforementioned cramp bar is divided into fixedly block portion and variable block portion, and is provided with the bearing surface that makes variable block portion and is changed to the bearing surface guiding mechanism of keeping out of the way state that the fixing bearing surface of block portion is more shunk back.
7. disconnecting apparatus as claimed in claim 6, wherein, the variable block portion of aforementioned cramp bar is divided into the unit block of equal number respectively in the fixing both sides of the long side direction of block portion, and the unit block is mounted in the both sides of fixing block portion in pairs and left-right symmetry, and aforementioned press surface guiding mechanism is the adjustment that the press surface of cramp bar is changed according to the every pair of unit block that is positioned at symmetrical position.
8. disconnecting apparatus as claimed in claim 1 or 2, it possesses in order to set the input part to the disconnection order that is formed at many line on the workpiece;
The said workpiece transport mechanism is according to the disconnection that sets order, and the line that the position of ring element is adjusted to the disjunction object can be come the position with the press surface subtend of trip arm in regular turn.
9. disconnecting apparatus as claimed in claim 8, wherein, input part is provided with feeding pattern in regular turn as one of the disconnection order that can set, and this feeding pattern in regular turn is to disconnect according to the putting in order of many line that is formed on the workpiece.
10. disconnecting apparatus as claimed in claim 8, wherein, input part is provided with outside mode of priority as one of the disconnection order that can set, this outside mode of priority is to being formed at many line on the workpiece, from disconnecting near line about periphery, carry out one by one successively inboard about the disconnection of line, carry out the disconnection of the line of central authorities at last.
11. disconnecting apparatus as claimed in claim 8, wherein, input part is provided with etc. cuts apart pattern as one of the disconnection order that can set, the described pattern of cutting apart is that many line that are formed on the workpiece are carried out workpiece is divided into the disconnection of two parts, then be divided into tetrameric disconnection, then be divided into the disconnection of eight parts, again each workpiece through cutting apart waited respectively afterwards and cut apart.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009251183A JP5281544B2 (en) | 2009-10-30 | 2009-10-30 | Break device |
| JP2009-251183 | 2009-10-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102049815A true CN102049815A (en) | 2011-05-11 |
| CN102049815B CN102049815B (en) | 2013-09-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010231493 Expired - Fee Related CN102049815B (en) | 2009-10-30 | 2010-07-15 | Cut-off device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5281544B2 (en) |
| CN (1) | CN102049815B (en) |
| TW (1) | TWI414406B (en) |
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| CN103786267A (en) * | 2012-10-26 | 2014-05-14 | 三星钻石工业股份有限公司 | Method and device for fracturing fragile-material substrate |
| CN103871931A (en) * | 2012-12-13 | 2014-06-18 | 株式会社迪思科 | Cutting device and cutting method |
| CN109422456A (en) * | 2017-08-29 | 2019-03-05 | 三星钻石工业股份有限公司 | The apsacline of brittle material substrate disconnects device and disconnects method |
| CN110120446A (en) * | 2013-10-29 | 2019-08-13 | 亮锐控股有限公司 | Separate the chip of luminescent device |
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| JP5695520B2 (en) * | 2011-07-29 | 2015-04-08 | 三星ダイヤモンド工業株式会社 | Wafer ring alignment method |
| JP2013089622A (en) * | 2011-10-13 | 2013-05-13 | Mitsuboshi Diamond Industrial Co Ltd | Breaking method of semiconductor substrate |
| US9773941B2 (en) * | 2013-10-29 | 2017-09-26 | Koninklijke Philips N.V. | Separating a wafer of light emitting devices |
| JP6005708B2 (en) * | 2014-10-23 | 2016-10-12 | 三星ダイヤモンド工業株式会社 | Method and apparatus for dividing wafer laminate for image sensor |
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| JP2008296086A (en) * | 2007-05-29 | 2008-12-11 | Mitsuboshi Diamond Industrial Co Ltd | Apparatus and method for crushing |
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| CN103786267A (en) * | 2012-10-26 | 2014-05-14 | 三星钻石工业股份有限公司 | Method and device for fracturing fragile-material substrate |
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| CN103871931B (en) * | 2012-12-13 | 2018-02-13 | 株式会社迪思科 | Segmenting device and dividing method |
| CN110120446A (en) * | 2013-10-29 | 2019-08-13 | 亮锐控股有限公司 | Separate the chip of luminescent device |
| US11189750B2 (en) | 2013-10-29 | 2021-11-30 | Lumileds Llc | Separating a wafer of light emitting devices |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP5281544B2 (en) | 2013-09-04 |
| TWI414406B (en) | 2013-11-11 |
| TW201114571A (en) | 2011-05-01 |
| CN102049815B (en) | 2013-09-04 |
| JP2011096941A (en) | 2011-05-12 |
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