JP2023003487A - Apparatus for dividing electronic component substrate - Google Patents

Abstract

To provide an apparatus for dividing an electronic component substrate that is capable of efficiently dividing an electronic component substrate having ultra-small electronic components of 2 mm or less each side mounted thereon into individual electronic components.SOLUTION: There is provided a conveyor belt 14 for conveying an electronic component substrate 1 on which ultra-small electronic components 3 of 2 mm or less each side are mounted in a grid pattern. A reaction force support surface 16a is arranged immediately below the conveyor belt, and a small-diameter columnar support roll 18 is arranged in the vicinity of the downstream side thereof. The support roll 18 is laterally and rotatably held in a groove portion 17a at the top portion of a tapered block 17C protruding upward from a support block 17. A small-diameter and cylindrical pressing roll 36 for pressing the vicinity of a dividing groove 4 of the electronic component substrate is arranged directly above the conveyor belt in a state where a leading portion fp of the electronic component substrate 1 is pushed up by the support roll 18. The pressing roll 36 is laterally and rotatably held in a groove portion 34a provided at the top portion of a tapered block 34D protruding downward from a slide block 34 that can slide up and down.SELECTED DRAWING: Figure 1

Description

TECHNICAL FIELD The present invention relates to a dividing device for dividing an electronic component board on which a plurality of electronic components are mounted along a dividing groove for each electronic component.

Electronic component substrates, such as ceramic substrates, are often manufactured by collectively mounting a plurality of electronic components on the substrate in consideration of productivity. The electronic component board has a plurality of electronic components mounted on the board body, and the board body is previously provided with dividing lines along the electronic components by drilling or V-cutting along the vertical and horizontal directions. After completion of the electronic component substrate, individual electronic components are separated along the dividing line.

As a method of dividing an electronic component board into a plurality of individual pieces, a method of applying a bending force by hand to propagate a crack from the dividing line as a base point, applying an edge facing the dividing line to the lower surface of the board, A method of applying a downward bending force to the substrate to divide it (Patent Document 1). A method (Patent Document 2) is known in which the substrate is rotated in the opposite direction to the pressing direction to separate the substrate.

However, in recent years, the miniaturization of electronic components has progressed due to advances in advanced integration technology for electronic components. , it is very difficult to apply or press the edge or blade to the dividing line on the substrate, and it is very difficult to divide it accurately. For this reason, the present applicant has previously proposed an electronic component substrate dividing device (patented Reference 3) was proposed.

JP-A-57-4714 Japanese Patent No. 2801453 JP 2010-199163 A

According to the apparatus of Patent Document 3 previously proposed by the present applicant, it is possible to efficiently and sequentially divide an electronic component mounted on an electronic component substrate with a unit of several millimeters per side (eg, 4 mm per side) from the beginning. . However, after that, the miniaturization of electronic components such as for smartphones has progressed further, and the applicant has not been able to divide electronic component substrates on which ultra-small electronic components of 2 mm or less per side (further, 1 mm or less per side) are mounted. There was a problem that it was difficult to deal with the equipment proposed earlier by

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides an electronic component board dividing apparatus capable of efficiently dividing an electronic component board on which ultra-small electronic components of 2 mm or less on a side are mounted into individual electronic components. intended to provide

In order to solve the above problems, an electronic component substrate dividing apparatus according to the present invention includes:
A dividing device that divides an electronic component substrate along the dividing grooves, on which a plurality of ultra-small electronic components with a side of 2 mm or less are mounted in a grid pattern and dividing grooves are formed in the vertical and horizontal directions,
A conveyor belt for conveying the electronic component substrate,
Directly under the conveyor belt, a reaction force supporting surface that receives a reaction force when dividing the electronic component substrate is arranged, and in the vicinity of the downstream side of the reaction force supporting surface, the leading portion of the electronic component substrate is pushed up from under the conveyor belt. Place a small-diameter and cylindrical support roll supported by
holding the support roll laterally and rotatably in a groove provided at the top of a tapered block projecting upward from a support block disposed immediately below the conveyor belt;
Directly above the conveying belt, a small-diameter and cylindrical pressure roll is provided for pressing from above the vicinity of the position of the division processing groove in the leading portion of the electronic component substrate in a state where the leading portion of the electronic component substrate is pushed up by the support roll. place and
A first feature is that the pressing roll is laterally and rotatably held in a groove provided at the top of a tapered block projecting downward from a slide block arranged slidably up and down directly above the conveying belt. .

According to the present invention, when the electronic component board is conveyed downstream on the conveying belt, and the front end portion of the electronic component board is pushed up by the support rolls on the downstream side, the position of the dividing groove at the front end portion of the electronic component board is moved upward. Since the pressing rolls press from above, an upward bending force is applied to the leading portion of the electronic component substrate starting from the splitting groove, and the leading portion of the electronic component substrate is split. A support roll having a small diameter and a cylindrical shape is inserted into a groove at the top of a tapered block projecting upward from a support block arranged below the conveying belt, and a pressure roll having a similar small diameter and having a cylindrical shape is a slide arranged above the conveying belt. Each of the taper blocks projecting downward from the black is laterally and rotatably held in a groove at the top of the block, so that the deflection of the support roll and the pressure roll during splitting is suppressed in the respective grooves. , the pressing force applied to the vicinity of the processing groove of the electronic component substrate at the time of division is made uniform in the lateral direction, so that the division can be reliably performed. In addition, since it is possible to simultaneously reduce the diameters of the support roll and the pressure roll and narrow the gaps between the rolls in the vertical direction and the front-rear direction, it is possible to efficiently divide electronic component substrates even for ultra-small electronic components. .

An electronic component substrate dividing apparatus according to the present invention includes:
A second feature is that shaft holes for supporting the ends of the pressing roll are provided at both ends of a groove provided in the top of the taper block protruding downward from the slide block.

As described above, according to the present invention, it is possible to sequentially and efficiently separate mounted electronic components having a size of 2 mm on a side from an electronic component substrate or an electronic component row conveyed on a conveyor belt. effect.

1 shows an embodiment of the present invention, and is a perspective view of an electronic component board dividing device; Front view of the dividing device shown in FIG. Fig. 1 shows the rear view of the dividing device; A perspective view showing a support block and a slide block, longitudinal sectional view showing the support block and the slide block; AA cross-sectional view of FIG. 5, (A) and (B) are explanatory diagrams showing how electronic components are separated from an electronic component substrate; Explanatory diagram showing how electronic components are separated from an electronic component substrate, a plan view of a ceramic substrate, (A) and (B) are plan views showing how electronic components are separated from an electronic component substrate; (A) and (B) are a plan view and a cross-sectional view of an electronic component substrate on which a micro electronic component is mounted.

Embodiments of the present invention will now be described with reference to the drawings. 1 to 10 show a first embodiment of the present invention. In these figures, reference S denotes an electronic component substrate dividing device, and reference 1 denotes an electronic component substrate.

First, the electronic component board 1 will be explained. As shown in FIG. are mounted in a grid pattern. Around each electronic component 3, there are divided grooves 4 extending in a grid pattern in the vertical and horizontal directions (division width dimension W = 0.8 to 1.2 mm in the vertical direction and 0.8 to 1.2 mm in the horizontal direction). ) is provided. The dividing grooves 4 are provided on the upper and lower surfaces of the substrate body 2, as shown in FIG. 11(B). Incidentally, the thickness t of the electronic component substrate 1 is 0.2 to 0.5 mm.

The dividing device S is composed of a lower unit 10 and an upper unit 30, as shown in FIGS.

The lower unit 10 has legs 12 supported on the floor surface G on the lower surface of the base frame 11 , and a conveyor belt 14 driven by a motor 13 on the upper part of the base frame 11 . The transport belt 14 serves to transport the electronic component substrates 1 one by one from the upstream side (right side in FIG. 2) to the downstream side (left side in FIG. 2). In the drawing, reference numeral 15 denotes a pulley that supports the conveying belt 14 in a stretched state.

Above the lower unit 10, a reaction support plate 16 positioned directly below the conveyor belt 14 is supported by a bracket (not shown). A reaction force support surface 16 a (see FIG. 7 ) is formed on the upper surface of the reaction force support plate 16 to support the reaction force generated when the electronic component substrate 1 is divided on the conveyor belt 14 .

A support block 17 is arranged directly below the conveying belt 14 and near the downstream side of the reaction force support plate 16 . The support block 17 holds a small-diameter (1.0 mm to 3.0 mm diameter) cylindrical (shaft-shaped) support roll 18 rotatably over its entire length, and is supported by the base frame 11 via a bracket 19 . there is

As shown in FIG. 4, the support block 17 includes both side portions 17A extending in the front-rear direction and a center portion 17B extending in the left-right direction. The upper portion of the taper block portion 17C is a tapered portion 17c having a triangular cross section, and the top portion of the tapered portion 17c is provided with a groove portion 17a extending in the left and right (horizontal direction) with both ends left. As shown in FIGS. 5 and 6, a columnar (shaft-like) support roll 18 is rotatably accommodated and held in the groove 17a such that its upper surface protrudes slightly from the upper end of the groove 17a.

The support roll 18 lifts and supports the leading portion of the electronic component board 1 from below when the electronic component board 1 conveyed downstream on the conveying belt 14 is divided. 18 is set to a position slightly above the reaction force support surface 16a (in the illustrated example, the height H from the reaction force support surface 16a to the upper end of the support roll 18 = 0.1 mm to 0.3 mm). ing. 10(A), electronic component rows U1 to Un shown in FIG. 9(A), and electronic component rows U1 to Un shown in FIG. 9(B). An electronic component 3 is included. The length dimension of the support roll 18 is set to be larger than the lateral width dimension of the electronic component substrate 1 .

The support roll 18 cooperates with the pressure roll 36 positioned directly above the conveying belt 14 to exhibit the function of dividing the leading portion of the electronic component substrate 1 . Since it is rotatably held over the entire length in the groove 17a at the top, bending is suppressed during division, and as a result of uniformly supporting the pressing force of the pressure roll 36, the electronic component substrate 1 is reliably divided. On the downstream side of the conveying belt 14, an accommodating portion 20 is arranged to accommodate the leading portion separated from the electronic component substrate 1. As shown in FIG.

The driving force from the motor 13 is transmitted to the conveyor belt 14, and is also transmitted from the synchronous gear 22 to the feed belt 36 of the upper unit 30 via the transmission belt 21. 14 are driven synchronously, and the electronic component substrate 1 on the conveying belt 14 is conveyed to the dividing position while being held down by the upper conveying belt 37 .

An upper frame 31 of the upper unit 30 supports a motor 32 for vertical movement and an air cylinder 33 . A slide block 34 is supported at the lower end of the air cylinder 33 , and the slide block 34 is supported by guide portions 35 arranged on both sides of the air cylinder 33 so as to be vertically slidable. The motor 32 positions the height of the slide block 34 and the pressure roll 36 , and the air cylinder 33 supports the reaction force acting on the pressure roll 36 when the electronic component substrate 1 is divided by the pressure roll 36 .

As shown in FIG. 4, the slide block 34 includes vertically extending side portions 34A, laterally extending upper connecting portion 34B and lower connecting portion 34C, and a tapered block 34D on the lower surface of the lower connecting portion 34C. The taper block 34D is composed of a central taper block portion 34D1 and left and right side taper block portions 34D2. The lower portion of each taper block portion 34D1 to 34D2 is a tapered portion 34d having a triangular cross-section with the apex facing downward. A groove portion 34a is provided in the top portion from the tapered portion of the tapered block portion 34D1 to the tapered portion of the left and right side tapered block portions 34D2, leaving both ends.

In the groove 34a, as shown in FIG. 6, a small-diameter (diameter 1.0 mm to 3.0 mm) and cylindrical (shaft-shaped) pressing roll 36 rotates in such a manner that the lower surface slightly protrudes from the lower end of the groove 34a. retained as possible. As shown in FIG. 5, shaft holes 34b for axially supporting a cylindrical (shaft-shaped) pressing roll 36 are provided in the inner end surfaces of the groove portions 34a of the left and right side tapered block portions 34D2. is accommodated in the downward groove 34a, both ends thereof are pivotally supported by the left and right shaft holes 34b, and the accommodated state is maintained.

The pressing roll 36 presses the position of the dividing groove 4 of the electronic component substrate 1 conveyed downstream on the conveying belt 14 from above. It is set to be larger than the dimensions. The horizontal distance (center axis distance) between the pressing roll 36 and the support roll 18 is set according to the division width dimensions (W _X , W _Y ) of the electronic component board 1 and the thickness t of the electronic component board 1 . , the horizontal distance can be adjusted by adjusting the position of the support block 17 with a servomotor (not shown). The pressure roll 36 and the support roll 18 are prepared with diameters (roll diameters) of 1.2 mm, 1.6 mm, and 2.0 mm, for example, within the above numerical range. A combination is determined based on the thickness t and the size of the electronic component 3 .

The pressing roll 36 cooperates with the support roll 18 positioned directly below the conveying belt 14 to exhibit the function of dividing the leading portion of the electronic component substrate 1 . Since the block 34D is rotatably held over its entire length in the groove 34a formed at the tip (top) of the tapered portion 34d of the block 34D, the pressing roll 36 is restrained from bending during division, and the pressing force of the pressing roll 36 is electronically controlled. As a result of uniformly acting on the dividing grooves 4 of the component substrate 1, the electronic component substrate 1 can be reliably divided.

Next, a method for dividing the electronic component substrate 1 into individual ultra-miniature electronic components 3 using the dividing apparatus S having the above configuration will be described.

First, the combination of the pressure roll 36 and the support roll 18 is determined according to the thickness t of the electronic component board 1 and the size of the electronic board 3 to be mounted. Adjust the directional position. Next, when the electronic component board 1 is placed on the transport belt 14 and the motor 13 is driven to transport the electronic component board 1 on the transport belt 14 to the downstream side, as shown in FIGS. , the leading portion fp of the electronic component substrate 1 conveyed on the conveying belt 14, that is, the peripheral portion 1A of the electronic component substrate 1 passes under the pressure roll 36 and tries to climb over the support roll 18 beyond it. do.

At this time, the upper end of the support roll 18 is located above the reaction force support surface 16a by a predetermined height H, and the pressure roll 36 presses the position of the divided groove 4 in the peripheral portion 1A from above, and the divided groove An upward bending force originating from 4 strongly acts on the leading portion fp (peripheral portion 1A), and the leading portion fp is easily separated from the electronic component board 1 as shown in FIG.

Next, when the electronic component row U1 in the first row located at the head passes under the pressure roll 36 and tries to climb over the support roll 18 beyond it, the support roll 18 and the pressure roll 36 , the upward bending force originating from the dividing groove 4 strongly acts on the leading electronic component row U1, and the electronic component row U1 is easily separated from the electronic component board 1. As shown in FIG.

Similarly, when the next second electronic component row U2 passes directly above the support roll 18, an upward bending force starting from the next divided groove 4 strongly acts on the same electronic component row U2. Thus, the electronic component row U2 can be easily separated from the main body of the electronic component substrate 1. As shown in FIG. In this way, as shown in FIG. 9A, all the electronic component rows U1 to Un of the electronic component board 1 are sequentially divided, conveyed downstream, and accommodated in the accommodating section 20. FIG.

Next, the individual electronic component rows U1 to Un accommodated in the accommodation section 20 are transferred to the upstream side of the conveyor belt 14, and as shown in FIG. One or a plurality of them are put on the conveyor belt 14 at different times. Then, when the motor 13 is driven again to convey the individual electronic component rows U1 to Un on the conveyor belt 14 downstream, the individual electronic components 3 . . . are sequentially divided from the leading electronic component 3 . That is, when the leading electronic component 3 passes through the lower surface of the pressing roll 36 and is about to climb over the support roll 18, the upward bending force originating from the immediately following split processing groove 4 is applied to the leading electronic component. It strongly acts on the component 3, and the same electronic component 3 is separated from each main body of the electronic component row U1.

In this manner, the dividing device S is used to easily divide the electronic component substrate 1 into individual electronic component rows U1 to Un, and further the individual electronic component rows U1 to Un into individual electronic components 3 . . . be able to.

According to the dividing apparatus S of the present embodiment, an electronic component board on which ultra-small electronic components having a side of 2 mm or less, or a side of 1 mm or less, are mounted can be divided into individual ultra-small electronic components. The dividing device S of the present embodiment has the function of dividing the leading portion fp of the electronic component substrate 1 by the support roll 18 directly below the conveying belt 14 in cooperation with the pressing roll 36 positioned directly above the conveying belt 14 . Demonstrate.

That is, in the dividing apparatus S of this embodiment, when dividing the electronic component substrate 1, the long support roll 18 directly below the conveying belt 14 can rotate over the entire length in the groove 17a at the top of the tapered portion 17c of the support block 17. Therefore, the support roll 18 is restrained from being bent at the time of splitting, and the pressing force of the pressing roll 36 is uniformly supported over the entire length. Since it is rotatably held over its entire length in the groove portion 34a formed at the tip of the taper portion 34c of the taper block 34D integral with the block 34, the bending of the pressing roll 36 during division is suppressed, and the pressing force of the pressing roll 36 is suppressed. uniformly acts on the dividing grooves 4 of the electronic component substrate 1, and the cooperative action of the two rolls 18 and 36 ensures the division of the electronic component substrate 1. As shown in FIG.

According to the dividing device S of this embodiment, it is possible to reduce the diameters of the support roll 18 and the pressure roll 36, and to narrow the gaps between the rolls in the vertical direction and the front-back direction. It is possible to efficiently divide an electronic component substrate for a component, and furthermore, for an ultra-small electronic component having a side of 1 mm or less.

The dividing device S of this embodiment transports the electronic component arrays U1 to Un after division to the upstream side, conveys them downstream again on the conveyor belt 14, and divides them into individual electronic components 3. , a second conveying belt is arranged downstream of the conveying belt 14, the divided electronic component rows U1 to Un are turned 90 degrees by the robot arm, transferred to the second conveying belt, and on the second conveying belt, the dividing device The electronic component 3 may be divided into individual electronic components 3 by a dividing mechanism S (the reaction force support surface 16a, the support roll 18, the pressure roll 36, etc.).

Thus, according to the electronic component substrate dividing apparatus of the present invention, it is possible to efficiently divide an electronic component substrate into ultra-small size electronic components having a side of 2 mm or less.

INDUSTRIAL APPLICABILITY The present invention can be used as an apparatus for dividing an electronic component board on which a plurality of electronic components are mounted into individual electronic components.

REFERENCE SIGNS LIST 1 electronic component board 1A peripheral portion of board 2 board main body 3 electronic component 4 divided groove 10 lower unit 11 base frame 12 legs 13, 32 motor 14 conveyor belt 15 pulley 16 reaction support plate 16a reaction support surface 17 support block 17A, 34A side portion 17B center portion 17C, 34D taper block portion 17c, 34d taper portion 17a, 34a groove portion 18 support roll 20 housing portion 21 transmission belt 22 synchronous gear 30 upper unit 31 upper frame 33 air cylinder 34 slide block 34B upper connection Part 34C Lower connection part 34D1 Central taper block part 34D2 Side taper block part 34b Shaft hole 35 Guide part 36 Press roll 37 Feed belt fp Leading part t Thickness of substrate H Height from reaction force support surface to upper end of support roll U1 to Un Electronic parts row W Board division width dimension

Claims (2)

A dividing device for dividing an electronic component board along the dividing grooves, on which a plurality of ultra-small electronic components with a side of 2 mm or less are mounted in a grid pattern and dividing grooves are formed in the vertical and horizontal directions,
A conveyor belt for conveying the electronic component substrate,
Directly under the transport belt, a reaction force supporting surface that receives a reaction force when the electronic component substrate is divided is arranged, and near the downstream side of the reaction force supporting surface, the leading portion of the electronic component substrate is pushed up from under the transport belt. A small-diameter and cylindrical support roll is arranged to support the shape,
The support roll is laterally and rotatably held in a groove provided at the top of a tapered block projecting upward from a support block arranged immediately below the conveyor belt,
Directly above the conveying belt, there is a small-diameter cylindrical pressure roll that presses the vicinity of the dividing groove of the leading portion of the electronic component substrate from above in a state where the leading portion of the electronic component substrate is pushed up by the support roll. placed and
The pressing roll is laterally and rotatably held in a groove provided at the top of a tapered block projecting downward from a vertically slidable slide block arranged directly above the conveying belt. , electronic component board dividing equipment. 2. The electronic device according to claim 1, wherein shaft holes for supporting the ends of said pressure roll are provided at both ends of a groove provided in the top of a taper block protruding downward from said slide block. Dividing device for component substrates.

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