JPH08103910A - Cutting of substrate and device thereof - Google Patents

Abstract

PURPOSE: To miniaturize the structure of a device as a whole and thereby, reduce manufacturing cost by fixing one of upper or lower cutting blade and moving a substrate vertically until the freely movable cutting blade comes into contact with the fixed blade, and cutting the substrate by moving the freely movable cutting blade vertically, at the time of cutting operation. CONSTITUTION: First a substrate 26 is set on a tray 6 in such a manner that the lateral edge of the substrate 26 is deposited on the tray 6. Next, the tray 6 placed on a movable table 5 which is driven by a belt 7 is transported toward a cutting machine. If the substrate 26 is introduced into the cutting machine, the tray 6 stops and is positioned. After this positioning, the tray 6 is caused to descend by an air cylinder 17, and the substrate 26 is caused to come into contact with a lower cutting blade 24 with the substrate 26 fixed. After that, a movable plate 22 is caused to descend using a hydraulic cylinder 21, resulting in the downward movement of an upper cutting blade 24A. Thus the substrate 26 is cut by the descent of the upper cutting blade 24 coming into contact with the lower cutting blade 24B under pressure. After cutting, the movable plate 22 and the tray 6 are moved upward to start the belt 7 again and transport the cut substrate 26 farther.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cutting method and device, and more particularly to a method and device for dividing a substrate having a plurality of circuit patterns into individual unit substrates.

[0002]

2. Description of the Related Art On a conventional printed circuit board, a plurality of unit boards on which circuit patterns are printed and elements are mounted are formed in a grid pattern. FIG. 8 shows this unit substrate 3
Reference numeral 0 indicates the plane of the aggregate printed circuit board in which a plurality of grids are formed. Between each unit board 30, one aggregate printed board is divided into individual unit boards 30 along a cutting line 31 indicated by a two-dot chain line. Conventionally, such division of the unit substrate has been performed by horizontally transporting the substrate placed on the tray for positioning, and sequentially pressing by the upper and lower cutting blades to perform cutting.

[0003]

However, when pressure is applied by the upper and lower cutting blades to perform cutting, the vertical position of the printed circuit board is kept constant and the cutting blades are moved vertically so that the pressing drive source is moved up and down. Had been placed. Therefore, a large and expensive pressurizing pressure drive source (for example, a hydraulic cylinder) needs to be provided in two sets up and down, and there is a drawback that the entire structure of the device becomes large and expensive. The present invention has been made to solve the above problems, and an object of the present invention is to provide a cutting method and a device that reduce the size of the entire device and reduce the cost.

[0004]

In order to achieve the above object, a method of cutting a substrate according to the present invention comprises a step of positioning a conveyed substrate at a cutting position, and a step of vertically arranging the substrate. In the method of cutting a substrate, which comprises a step of cutting the substrate by pressing a blade, at the time of cutting, one of the upper and lower cutting blades is fixed, and the printed board is moved in the vertical direction until it abuts on the fixed cutting blade. After moving
It is characterized by comprising the step of moving the cutting blade on the non-fixed side in the vertical direction to cut the substrate.

Further, the substrate cutting apparatus according to the present invention is
In a substrate cutting device comprising a means for positioning a substrate to be conveyed at a cutting position and a cutting machine that presses the cutting blades arranged facing each other vertically to the substrate to cut one of the upper and lower cutting blades. It is fixed, and after moving the substrate in the vertical direction to the position of the cutting blade on the fixed side, a means for cutting the substrate by moving the cutting blade on the non-fixed side in the vertical direction is formed. It is what

[0006]

According to the board cutting method or the cutting apparatus of the present invention, since the driving source for moving the board up and down does not need to be pressurized, a small driving source (for example, an air cylinder) can be used. A large and expensive pressurizing drive source for pressurizing can be replaced by one set of small size.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of a substrate cutting apparatus according to the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a side view showing an outline of the entire apparatus, FIG. 2 is a front view of FIG. 1, and FIG. 3 is a perspective view of a main part. The substrate cutting device 1 mainly includes a substrate transfer system 2 and a cutting machine 3 for cutting the substrate.

The transfer system 2 is set on the moving table 5 having a frame structure that strokes in the left-right direction of the support base 4 in FIG. 1, and is set on the moving table 5 to support the uncut substrate and cut the cut substrate. Upper and lower cutting blades, which will be supported and will be described later, are provided with a plate-shaped tray 6 having a window for pressing the substrate. A belt conveyor 10 including a belt 7, a plurality of pulleys 8 for driving the belt 7, and a motor 9 is provided on one side of the support 4. One side edge 11 of the moving table 5 is attached to the belt 7.
Is fixed. A slide member 14 having a groove 13 that fits in a guide rail 12 provided in the longitudinal direction of the support 4 is provided on the lower surface of the side edge 11 of the movable table 5 that is fixed to the belt 7. Further, a plurality of rollers 16 are provided on the lower surface of the side edge portion 15 of the moving table 5 opposite to the side where the moving table 5 is fixed, and the rollers 16 rotate in synchronization with the driving of the belt 7 to move the moving table 5 Is trying to make a stroke. In addition, the moving table 5 has a tray 6
A small drive source (air cylinder) 17 for moving up and down is set.

As shown in FIG. 2, the cutting machine 3 includes a cutting machine body 18 and the support base 4 for supporting the cutting machine body 18.
And a hydraulic pressure supply device (not shown) for supplying hydraulic pressure to the cutting machine. The cutting machine body 18 is provided with two shafts 19 so as to straddle the conveying system 2, and the shafts 19 are bolted between the upper fixed plate 20 and the support base 4, respectively. A large drive source (hydraulic cylinder) 21 is projectingly provided on the upper fixed plate 20, and the tip of the hydraulic cylinder 21 is fixed to the upper movable plate 22. The lower surface of the upper movable plate 22 and the support base 4
A pair of cutting blades 24A facing each other for cutting the substrate are provided on each of the upper surfaces of the fixed plates 23 fixed to the
A die set 25 for fixing the (upper blade) and 24B (lower blade) is fixed. Cutting blade 2 fixed to the die set 25
For 4A and 24B, a cutting blade suitable for cutting the substrate may be selected, but the tip as shown in FIG. 3 is preferably an acute angle.

Although not shown, the cutting device 1 according to the present embodiment is a control device in which software is incorporated into a sequencer having a simple NC function and functions such as automatic operation and individual operation to simplify program operation. I have it.

Next, the operation of the cutting device 1 shown in this embodiment will be described. First, the substrate 26 has the side edge of the tray 6
When the program is started after the tray is set on the tray 6 so as to be placed on the tray 6, as the moving table 5 driven by the belt 7 moves from the right direction to the left direction in FIG.
The tray 6 on the moving table 5 and the substrate 26 placed on the tray 6 are conveyed toward the cutting machine 3.

The belt 7 is controlled by a servo motor, and when the substrate 26 enters the cutting machine 3, the belt 7 is positioned according to a program and the conveyance of the substrate 26 is stopped. When the substrate 26 is positioned, the tray 6 is lowered from the state shown in FIG. 4 by a small drive source (air cylinder) 17 as shown in FIG. 5, and the substrate 26 is placed on the lower cutting blade 24B.
Abutted against.

Next, as shown in FIG. 6, the movable plate 22 is lowered by a large drive source (hydraulic cylinder) 21, and the upper cutting blade 24A is lowered accordingly, and is brought into pressure contact with (pressurized with) the substrate 26. ), Substrate 2 as shown in FIG.
Cut 6 After cutting, movable plate 22 and tray 6
Moves upward to return to the initial state before cutting shown in FIG. 4, and after the return, driving of the belt conveyor 10 is restarted to further convey the cut substrate. After all necessary cutting is completed, the belt conveyor 10 is rotated in the reverse direction to return the moving table 5 to the initial state, and the substrate is replaced to prepare for the next cutting. According to the above-described embodiment, since it is not necessary to provide a large pressure drive source on the lower part of the support base, the lower part of the support base can be made compact and can be placed on a table.

Although the lower cutting blade 24B is fixed and the substrate 26 and the upper cutting blade 24A are lowered in the above embodiment, the present invention is not limited to this example, and the upper cutting blade 24A is fixed. , Substrate 26 and lower cutting blade 2
4B may be raised. Further, although the hydraulic cylinder is shown as the large drive source 21 for lowering the cutting blade, it goes without saying that various drive sources such as an air cylinder can be applied instead of the hydraulic cylinder.

[0015]

Since the present invention is configured as described above, a small drive source is required to move the substrate in the vertical direction, and a large pressure drive source set can be replaced by a small drive source. It is possible to provide a substrate cutting method and a device that reduce the size and cost of the entire device.

[Brief description of drawings]

FIG. 1 is a side view showing an outline of an entire apparatus according to an embodiment of the present invention.

FIG. 2 is a front view of FIG.

FIG. 3 is a perspective view showing an outline of the entire apparatus according to an embodiment of the present invention.

FIG. 4 is a side view of the essential part showing the initial state before lowering the substrate for explaining the operation of the embodiment of the present invention.

FIG. 5 is a side view of an essential part showing a state in which the substrate is lowered for explaining the operation of the embodiment of the present invention.

FIG. 6 is a side view of an essential part for explaining the operation of the embodiment of the present invention, immediately before cutting the substrate on which the upper cutting blade is lowered.

FIG. 7 is a side view of a main part for cutting the substrate, which illustrates the operation of the embodiment of the present invention.

FIG. 8 is a plan view of a collective printed circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Board cutting device 2 Conveying system 3 Cutting machine 4 Support stand 5 Moving table 6 Tray 17 Small drive source (air cylinder) 18 Cutting machine body 21 Large drive source (hydraulic cylinder) 24 Cutting blade

Claims (2)

[Claims] 1. A method of cutting a substrate, comprising: a step of positioning a conveyed substrate at a cutting position; and a step of cutting the substrate by pressing a cutting blade vertically opposed to the substrate. , One of the upper and lower cutting blades is fixed, and the printed board is moved up and down until it abuts the fixed cutting blade, and then the cutting blade on the non-fixed side is moved vertically to move the board. A method of cutting a substrate, comprising a step of cutting. 2. A substrate cutting apparatus comprising: a means for positioning a conveyed substrate at a cutting position; and a cutting machine for cutting a substrate by pressing cutting blades arranged facing each other vertically to the substrate. One of the cutting blades is fixed, the substrate is moved up and down to the position of the fixed cutting blade, and then the cutting blade on the non-fixed side is moved vertically to cut the substrate. A cutting device for the formed substrate.