CN103871931A - Cutting device and cutting method - Google Patents
Cutting device and cutting method Download PDFInfo
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- CN103871931A CN103871931A CN201310655965.XA CN201310655965A CN103871931A CN 103871931 A CN103871931 A CN 103871931A CN 201310655965 A CN201310655965 A CN 201310655965A CN 103871931 A CN103871931 A CN 103871931A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
The invention provides a cutting device and a cutting method. The device can cut cutting predetermined lines of a chip supported in the inside of a cyclic frame with a suitable size corresponding to the chip (a round plate) by a belt body through strip parts and the strip parts cannot intervene with the cyclic frame. A strip unit (50) has a first strip part (51) which is longer than the shortest line of the cutting predetermined lines of the chip (1) and shorter than the longest line and a second strip part (52) which is longer than the longest line. The strip unit moves relative to the chip along the direction vertical to the cutting predetermined lines in a state that the strip parts and the cutting predetermined lines are parallel. The cutting predetermined line of the outer region of the chip is broken through the first strip part (51), the cutting predetermined line of the central region of the chip is broken through the second strip part (52) and therefore the chip is cut. The interference of the strip part and the cyclic frame (7) is prevented through the different strip parts with lengths corresponding to the lengths of the cutting predetermined lines.
Description
Technical field
The present invention relates to for along predefined segmenting device and the dividing method of cutting apart preset lines and come the circular plate objects such as dividing semiconductor wafer.
Background technology
In semiconductor device manufacturing process, divide and have multiple rectangular areas by the cancellate preset lines of cutting apart on the surface of discoideus semiconductor wafer, form IC(integrated circuit on the surface of these rectangular areas) and LSI(large scale integrated circuit) etc. electronic circuit, the necessary processing such as then after having been carried out to grinding, the back side grinds, then along cutting apart preset lines, wafer is divided into rectangular area one by one, thereby obtains multiple semiconductor chips.
As the method for cutting apart the circular plate objects such as above-mentioned semiconductor wafer, such method has been proposed: along cut apart preset lines form make strength decreased cut apart starting point after, circular plate object is applied to external force and cuts apart.The method that applies external force is of all kinds, but, for example known method like this: large or hardness ratio is compared with high and being difficult to cut apart at the little wafer of chip size, thickness, press locally circular plate object along cutting apart starting point, thereby or circular plate object is aspirated to pull cut apart (patent documentation 1,2) along cutting apart preset lines.
Prior art document
Patent documentation 1: TOHKEMY 2012-146744 communique
Patent documentation 2: TOHKEMY 2006-108273 communique
But, because the circular plate objects such as semiconductor wafer are flimsy, therefore, in the time carrying out division processing, in order to ensure treatability, circular plate object is supported on to the inner side of ring-shaped frame through belt body, make it possible to process by ring-shaped frame.In the case of use along cut apart preset lines strip parts (bar parts) thus apply external force and cut apart circular plate object (being supported on as described above the inner side of ring-shaped frame through belt body) cutting apart preset lines, bar parts need to have the length longer than the diameter of circular plate object, but, when make such bar parts act on circular plate object exterior lateral area cut apart preset lines time, bar parts and ring-shaped frame are interfered, and cannot apply external force.Therefore, the opening size that need to make the inner side of ring-shaped frame is and the discontiguous larger size of bar parts that larger like this ring-shaped frame is excessive with respect to circular plate object, thereby causes using the not framework of appropriate size.
If use the oversize ring-shaped frame with respect to circular plate object, also need to mate the size of ring-shaped frame as the belt body of running stores and increase, because the use amount of belt body increases, therefore produce uneconomic problem.In addition, beyond cut apart for example cut apart starting point form operation and pick up chip after cutting apart pick up the operations such as operation in the processing unit (plant) that uses, require to use the ring-shaped frame of the size corresponding with circular plate object, therefore, need to carry out circular plate object to turn the operation of note to excessive ring-shaped frame just to segmentation process, bothersome and cause productivity to reduce in the extreme.In addition, for example, under the present situation, in the time of wafer that circular plate object is maximum gauge, also there is such problem: have to special make be applicable to this wafer, i.e. the larger ring-shaped frame of not interfering with bar parts.
Summary of the invention
The present invention is the invention completing in view of above-mentioned thing, its main technical task is to provide a kind of segmenting device and dividing method, the all preset lines of cutting apart that can cut apart by bar parts circular plate object in the situation that bar parts are not interfered with ring-shaped frame, above-mentioned circular plate object is supported on the inner side of the ring-shaped frame of the appropriate size corresponding with circular plate object through belt body.
The segmenting device that a first aspect of the present invention is recorded is along the circular plate object of cutting apart preset lines and cut apart circular plate-shaped object units, above-mentioned circular plate-shaped object units comprises above-mentioned circular plate object, belt body and ring-shaped frame, above-mentioned circular plate object has many above-mentioned preset lines of cutting apart that length is different, and is formed with and cuts apart starting point along the above-mentioned preset lines of cutting apart, above-mentioned belt body is pasted on a face of above-mentioned circular plate object, the periphery of above-mentioned belt body is pasted on above-mentioned ring-shaped frame, above-mentioned ring-shaped frame has the big or small peristome of the above-mentioned circular plate object of storage, above-mentioned segmenting device is characterised in that, above-mentioned segmenting device has: ring-shaped frame retaining member, it has the supporting surface of the above-mentioned ring-shaped frame for supporting above-mentioned circular plate-shaped object units, above-mentioned ring-shaped frame retaining member keeps above-mentioned ring-shaped frame with following state: make the circular plate object of above-mentioned circular plate-shaped object units in upside, make the above-mentioned belt body in the region corresponding with above-mentioned circular plate object in downside, the above-mentioned belt body in above-mentioned circular plate object and the region corresponding with above-mentioned circular plate object is exposed, bar unit, it is disposed in the below that sticks on the above-mentioned belt body on the above-mentioned ring-shaped frame being kept by above-mentioned ring-shaped frame retaining member, above-mentioned unit extends abreast across the above-mentioned bearing of trend of cutting apart preset lines of above-mentioned belt body and above-mentioned circular plate object, above-mentioned unit is used for cutting apart the above-mentioned preset lines of cutting apart, and above-mentioned unit has the length shorter than the diameter of the above-mentioned peristome of above-mentioned ring-shaped frame, and mobile member, it makes above-mentioned unit and is cutting apart in the vertical direction of preset lines and relatively moving with this with respect to the above-mentioned preset lines of cutting apart that will cut apart, above-mentioned unit at least has: Article 1 parts, the above-mentioned circular plate object of its Length Ratio to cut apart above-mentionedly cut apart the shortest above-mentioned predetermined line length of cutting apart in preset lines, and than above-mentioned circular plate object to cut apart above-mentioned to cut apart the above-mentioned preset lines of cutting apart the longest in preset lines short, and Article 2 parts, its Length Ratio will be cut apart above-mentionedly cuts apart the longest above-mentioned predetermined line length of cutting apart in preset lines, above-mentioned Article 1 parts are responsible for cutting apart the above-mentioned preset lines of cutting apart of the exterior lateral area that is positioned at above-mentioned circular plate object, above-mentioned Article 2 parts are responsible for cutting apart the above-mentioned preset lines of cutting apart of the middle section that is positioned at above-mentioned circular plate object, and above-mentioned Article 1 parts and above-mentioned Article 2 parts are positioned respectively above-mentioned exterior lateral area and the above-mentioned middle section of above-mentioned circular plate object by above-mentioned mobile member.
In addition, the dividing method that a second aspect of the present invention is recorded, utilize segmenting device that first aspect records along the circular plate object of cutting apart preset lines and cut apart circular plate-shaped object units, above-mentioned circular plate-shaped object units comprises above-mentioned circular plate object, belt body and ring-shaped frame, above-mentioned circular plate object has many above-mentioned preset lines of cutting apart that length is different, and is formed with and cuts apart starting point along the above-mentioned preset lines of cutting apart; Above-mentioned belt body is pasted on a face of above-mentioned circular plate object; The periphery of above-mentioned belt body is pasted on above-mentioned ring-shaped frame, above-mentioned ring-shaped frame has the big or small peristome of the above-mentioned circular plate object of storage, above-mentioned dividing method is characterised in that, above-mentioned dividing method has: keep step, keep the above-mentioned ring-shaped frame of above-mentioned circular plate-shaped object units by above-mentioned ring-shaped frame retaining member; Position alignment step, the circular plate object to the above-mentioned circular plate-shaped object units fixing by above-mentioned ring-shaped frame retaining member to cut apart above-mentionedly cut apart preset lines and above-mentioned parts carry out position alignment; The first segmentation step, implementing after above-mentioned position alignment step and above-mentioned maintenance step, comprising that will cut apart above-mentioned is in cutting apart preset lines in the shortest above-mentioned above-mentioned exterior lateral area of cutting apart preset lines, making above-mentioned Article 1 parts by above-mentioned mobile member is cutting apart in the vertical direction of preset lines and is relatively moving with this with respect to the above-mentioned preset lines of cutting apart that will cut apart, thus, in above-mentioned exterior lateral area, cut apart circular plate object along the above-mentioned preset lines of cutting apart; And second segmentation step, comprising that will cut apart above-mentioned is in cutting apart preset lines in the longest above-mentioned above-mentioned middle section of cutting apart preset lines, making above-mentioned Article 2 parts by above-mentioned mobile member is cutting apart in the vertical direction of preset lines and is relatively moving with this with respect to the above-mentioned preset lines of cutting apart that will cut apart, thus, in above-mentioned middle section, cut apart circular plate object along the above-mentioned preset lines of cutting apart.
In the present invention, with respectively from circular plate object, cut apart the shorter exterior lateral area of preset lines and cut apart the preset lines of cutting apart that bar parts that length that the long middle section of preset lines is corresponding is different are cut apart circular plate object.Therefore, the length of each parts can be configured to enough cutting apart that preset lines is cut apart and being required MIN length.Its result is in using the ring-shaped frame of the appropriate size corresponding with circular plate object, reliably circular plate object to be cut apart in the situation that bar parts are not interfered with ring-shaped frame by bar parts.
Invention effect
Can obtain following effect according to the present invention: can provide a kind of segmenting device and dividing method, can in the situation that bar parts are not interfered with ring-shaped frame, cut apart by bar parts all preset lines of cutting apart of circular plate object, wherein said circular plate object is supported on the ring-shaped frame inner side of the appropriate size corresponding with circular plate object through belt body.
Brief description of the drawings
In Fig. 1, (a) being the stereogram of implementing the semiconductor wafer of division processing by the segmenting device of one embodiment of the present invention, is (b) cutaway view of implementing the semiconductor wafer of division processing by the segmenting device of one embodiment of the present invention.
Fig. 2 is the stereogram of the segmenting device of an execution mode.
Fig. 3 is the stereogram that pedestal to above-mentioned segmenting device and travelling table have carried out the state decomposing.
Fig. 4 is the sectional view of the ring-shaped frame retaining member that has of above-mentioned segmenting device.
Fig. 5 is the vertical view that schematically shows the relative position of bar parts that above-mentioned segmenting device has and wafer.
Fig. 6 is the figure that represents the side partial cross-sectional of above-mentioned parts and the aspiration path on suction road.
Fig. 7 is the sectional view of the process of the dividing method that represents that above-mentioned segmenting device cuts apart wafer.
Fig. 8 is the vertical view that schematically shows the process of above-mentioned dividing method.
Fig. 9 is the vertical view that schematically shows the dividing method that other execution modes of bar unit cut apart wafer.
Figure 10 is the stereogram with the segmenting device of other other execution modes of bar unit.
Figure 11 is the stereogram that pedestal to the segmenting device shown in Figure 10 and travelling table have carried out the state decomposing.
Figure 12 is the vertical view that schematically shows the relative position of bar parts that the segmenting device shown in Figure 10 has and wafer.
Figure 13 is the vertical view that schematically shows the process of the dividing method that the segmenting device shown in Figure 10 cuts apart wafer.
Figure 14 is the end view that represents an example of other execution modes of bar parts.
Label declaration
1 ... the circular plate object of wafer 1()
2 ... cut apart preset lines
5 ... modified layer (cutting apart starting point)
6 ... belt body
7 ... ring-shaped frame
7a ... the peristome of ring-shaped frame
8 ... wafer cell (circular plate-shaped object units)
10 ... segmenting device
20 ... mobile member
30 ... ring-shaped frame retaining member
35a ... supporting surface
50 ... bar unit
51 ... Article 1, parts
52 ... Article 2 parts
53 ... Article 3 parts
A1 ... first area (exterior lateral area)
A2 ... second area (middle section)
A3 ... the 3rd region (exterior lateral area)
Embodiment
Below, with reference to accompanying drawing, one embodiment of the present invention is described.
The label 1 of Fig. 1 represents to implement in one embodiment the wafers (circular plate object) such as the semiconductor wafer of division processing, and Fig. 2 represents wafer 1 to implement the segmenting device 10 of an execution mode of division processing.
[1] wafer
It is for example the discoideus of hundreds of μ m left and right that wafer 1 shown in Fig. 1 is formed as thickness, is formed with the otch 1c that is called directed face that represents crystal orientation in a part for outer peripheral edges.As shown in Fig. 1 (a), in wafer 1, cut apart preset lines 2 by cancellate many and be set with multiple rectangular areas 3, positive 1a side in these rectangular areas 3 is formed with device 4 as shown in Fig. 1 (b), and above-mentioned device 4 has the electronic circuit being made up of IC or LSI.Because wafer 1 is discoideus, so it is inhomogeneous to cut apart the length of preset lines 2, thereby be set with many length different cut apart preset lines.
As shown in Figure 1, about wafer 1, at its back side, 1b is pasted with belt body 6, is pasted with ring-shaped frame 7 in the periphery of this belt body 6, thereby becomes wafer cell (circular plate-shaped object units) 8 and moved into segmenting device 10.Ring-shaped frame 7 is had the metallic plate of rigidity etc. and forms by stainless steel etc., ring-shaped frame 7 has the peristome 7a of the big or small toroidal of storage wafer 1, and wafer 1 sticks on belt body 6 to be with peristome 7a the mode that concentric shape arranges.
As shown in Fig. 1 (b), be pre-formed modified layer 5 in the inside of wafer 1 along cutting apart preset lines 2.Modified layer 5 is irradiated the pulsed laser beam that has a radioparent predetermined wavelength with respect to wafer 1 and is formed by focal point being registered to the inside of wafer 1.Compared with other parts of wafer 1, the strength decreased of modified layer 5, cuts apart starting point thereby modified layer 5 becomes.
In addition, making in the present embodiment along the starting point of cutting apart of cutting apart preset lines 2 of wafer 1 is modified layer 5, but cuts apart starting point and be not limited to modified layer 5, can be also to be cut or irradiating laser light beam and the groove that forms etc. by cutting tool.
Next, to the segmenting device 10 shown in Fig. 2 and used the dividing method of the wafer 1 of this segmenting device 10 to describe.
[2] segmenting device
[2-1] structure
As shown in Figure 2, segmenting device 10 has: the pedestal 11 of rectangular shape; And the travelling table 15 of rectangular shape, it can be loaded on this pedestal 11 movably in Y-direction.On pedestal 11, be equipped with discretely the pair of guide rails parallel to each other 12 of extending along Y-direction at directions X, be formed with at the upper surface of the guide rail 12 of X1 side the guiding groove 12a that cross section is V word shape.In addition, below X(X1, the X2 of explanation), Y(Y1, Y2) and Z direction the reference axis X(X1, the X2 that record with Fig. 2), Y(Y1, Y2) and Z direction consistent.
As shown in Figure 3, about travelling table 15, portion is formed with circular port 15b in the central, is formed with the raised line 15a that can engage with above-mentioned guiding groove 12a slidably at the position of the regulation of its lower surface.Travelling table 15, by raised line 15a is slided along guiding groove 12a, and can move along Y-direction on pedestal 11, and the mobile member 20 that moves through of travelling table 15 completes.
As shown in Figure 3, mobile member 20 is closely disposed on pedestal 11 with the guide rail 12 of X2 side, and this mobile member 20 is made up of following part: external thread rod 21, and its end along Y-direction extension and Y2 side can be supported in to positive and negative rotation bearing 16; Impulse motor 22, it is connected with the end of the Y1 side of this external thread rod 21 and rotarilys actuate external thread rod 21; And internal thread piece 23, it is fixed on the lower surface of travelling table 15 and screws togather with external thread rod 21.According to this mobile member 20, make external thread rod 21 positive and negative rotations by impulse motor 22, thus, travelling table 15 is mobile to the Y-direction corresponding with the direction of rotation of external thread rod 21 (Y1 direction or Y2 direction) through internal thread piece 23.
As shown in Figure 2, on travelling table 15, be equipped with: ring-shaped frame retaining member 30, it is for keeping ring-shaped frame 7 and wafer cell 8 being remained to level; And bar unit 50, it cuts apart wafer 1 along cutting apart preset lines 2.
As shown in Fig. 2 and Fig. 4, ring-shaped frame retaining member 30 has: cylinder seat 31, the upper ora terminalis that it has the internal diameter more bigger than the external diameter of wafer 1 and has horizontal ring-type; And the framework holding member 35 of ring-type that can lifting, it is disposed in the surrounding of this cylinder seat 31 and around cylinder seat.Bottom at cylinder seat 31 is formed with flange part 32 as shown in Figure 2.Flange part 32 can coordinate rotatably with the circular port 15b of travelling table 15, and cylinder seat 31 is driven in rotation by the rotating member 40 that comprises the driving-belt 43 that is wound in flange part 32.
Rotating member 40 is made up of following part: impulse motor 41, and it is installed on the lower face side of travelling table 15; Belt wheel 42, it is disposed in the upper surface side of travelling table 15 and is assemblied on the rotating shaft of impulse motor 41; And driving-belt 43, it is wound in belt wheel 42 and flange part 32.According to this rotating member 40, by impulse motor 41, the rotation of the belt wheel 42 of positive and negative rotation is passed to flange part 32 through driving-belt 43, and cylinder seat 31 is rotated.
It is concentric shape that the framework holding member 35 of ring-type is arranged to cylinder seat 31, and the upper surface that is formed as certain width of the framework holding member 35 of this ring-type is level, and this upper surface becomes the supporting surface 35a of the ring-shaped frame 7 of supporting wafers unit 8.Be equipped with multiple clamp systems 36 at the outer circumferential side of framework holding member 35, above-mentioned clamp system 36 is clipped between clamp system 36 and supporting surface 35a and keeps ring-shaped frame 7 being loaded into ring-shaped frame 7 on supporting surface 35a.The round-shaped peristome 35b of framework holding member 35 is set as larger than the external diameter of cylinder seat 31, and more smaller than the internal diameter of ring-shaped frame 7, and cylinder seat 31 can relatively pass through peristome 35b.
As shown in Figure 4, in above-mentioned ring-shaped frame retaining member 30, wafer cell 8 is using wafer 1 as upside, and using belt body 6 as downside, wafer 1 is concentric shape and is loaded on cylinder seat 31, and supporting surface 35a and clamped mechanism 36 that ring-shaped frame 7 is loaded on framework holding member 35 keep.Under this hold mode, wafer 1 exposes to upside, and the belt body 6 in the region corresponding with wafer 1 exposes downwards in cylinder seat 31.
In the inside of the cylinder seat 31 of ring-shaped frame retaining member 30, below the belt body 6 of the wafer cell 8 being kept by ring-shaped frame retaining member 30, be equipped with bar unit 50.
As shown in Figure 3 and 4, bar unit 50 has: the rectangular-shaped unit seat 59 that is fixed on pedestal 11; And erect Article 1 parts 51, Article 2 parts 52, the Article 3 parts 53 of the rectangular plate shape being arranged on unit seat 59.The face direction of each parts 51,52,53 is along X-Z face, and upper ora terminalis extends along directions X.The diameter of the peristome 7a of the Length Ratio ring-shaped frame 7 of the directions X of these parts 51,52,53 is short, and height setting is the upper ora terminalis degree consistent with the upper ora terminalis of cylinder seat 31.
Article 2 parts 52 erect the central portion that is arranged at unit seat 59, and the compartment of terrain that separates respectively regulation in the Y-direction both sides of these Article 2 parts 52 erects and is provided with Article 1 parts 51 and Article 3 parts 53.Fig. 5 represents to make cylinder seat 31 to rotate, and the preset lines 2 of cutting apart of extending along a direction that remains on the wafer 1 on ring-shaped frame retaining member 30 is decided to be to the state parallel with directions X.As shown in the drawing, about directions X length, Article 1 parts 51 and Article 3 parts 53 are identical, and Article 2 parts 52 are longer than Article 1 parts 51 and Article 3 parts 53.Article 1 parts 51 and the Article 3 parts 53 of equal length have such length: than wafer 1 cut apart the shortest i.e. end side in preset lines 2 to cut apart preset lines 2 long, and than the longest be near diameter or diameter to cut apart preset lines 2 short.The Article 3 parts 53 of present embodiment are the parts that are equivalent to be called in the present invention Article 1 parts.In addition, Article 2 parts 52 have than cutting apart the length of cutting apart preset lines 2 length the longest in preset lines 2.
By travelling table 15 is moved along Y-direction, each parts 51,52,53 inside at cylinder seat 31 of bar unit 50 relatively move along Y-direction with respect to cylinder seat 31.Travelling table 15 can move in by the scope before butt with the inner peripheral surface of cylinder seat 31 respectively at the directions X two ends of the Article 1 parts 51 of Article 2 parts 52 both sides and Article 3 parts 53 edge, and unit seat 59 does not hinder this action.
In addition, the Article 1 parts 51 of right side in Fig. 5 presentation graphs (Y1 side) are with the inner peripheral surface of cylinder seat 31 by the state before butt, and bar parts 50 are positioned to the state of the mobile terminal of Y1 side.As shown in the drawing, under this state, Article 1 parts 51 leave along Y1 side laterally from the wafer 1 remaining on ring-shaped frame retaining member 30, and the length of directions X is the length that can be contained in ring-shaped frame 7.In addition, in the time that bar unit 50 is positioned at the mobile terminal to Y2 side, each parts 51,52,53 are positioned at symmetrical left side (shown in double dot dash line) in Fig. 5.
Thereby make like this travelling table 15 move along Y-direction to make bar unit 50 along the Y-direction vertical with cutting apart preset lines 2 with respect to cutting apart in the process that preset lines 2 relatively moves, it is that the region that Article 1 parts 51 can cover is set as first area (exterior lateral area) A1 that Article 1 parts 51 are cut apart preset lines 2 long regions than many of the Y1 side in wafer 1.In addition, the many articles of regions of cutting apart preset lines 2 that Article 3 parts 53 can cover Y2 side are set as the 3rd region (exterior lateral area) A3.And, between first area A1 and the 3rd region A3, Article 1 parts 51 and Article 3 parts 53 region that can not cover, that can only cover by Article 2 parts 52 be set as second area (middle section) A2.
Each parts 51,52,53 have the suction road 54 of slit-shaped as shown in Figure 6 at the pars intermedia of Width (Y-direction).Suction road 54 is in the sealing of directions X both ends, and the length of the directions X of above-mentioned bar parts is essentially the length of the directions X on this suction road 54.
As shown in Figure 6, to be formed as the board 55a of the Y2 side of aspirating road 54 higher than the board 55b of Y1 side in the upper end of each parts 51,52,53.In addition, the upper surface of high board 55a is formed as smooth, and the cross section of the upper surface from this upper surface to low board 55b is formed as rolling tiltedly and being to Y1 the flexure plane 56 of concavity bending.In each parts 51,52,53, the upper surface of high board 55a with remain on the wafer cell 8 on ring-shaped frame retaining member 30 belt body 6 lower surface butt or approach.
In bar unit 50, be formed with independently of one another above-mentioned suction road 54 at each parts 51,52,53, these suction roads 54 are communicated with the aspiration 62 that electromagnetic switching valve 61 is housed halfway respectively as shown in Fig. 4 and Fig. 6, and these aspiration 62 are put together with suction source 63 and are communicated with.Electromagnetic switching valve 61 is the valves on open and close suction road 54, in the time electromagnetic switching valve 61 being made as to " unlatching " under the state turning round at suction source 63, air in suction road 54 is sucked, make the upper end open of suction function on suction road 54, in the time that electromagnetic switching valve 61 is switched to " closing ", be returned as normal pressure.Because each suction road 54 is respectively arranged with electromagnetic switching valve 61 in each aspiration 62, so carry out independently of one another the switching of negative pressure and normal pressure for each parts 51,52,53.
In the time cutting apart wafer 1 by above-mentioned each parts 51,52,53, road 54 produces negative pressure and under state that the lower surface of belt body 6 is aspirated together with wafer 1 making to aspirate, thereby makes travelling table 15 to Y1 side shifting, bar unit 50 be relatively moved to Y2 side.And, in the way of moving at it, as shown in Figure 6, when 54Ce edge, suction road (being called crack edge) 57 of the upper surface in the high board 55a of bar parts 51,52,53 across belt body 6 and wafer 1 extend along directions X cut apart preset lines 2 when consistent, the right side of cutting apart preset lines 2 (low board 55b side) of wafer 1 is aspirated downwards.Produce bending stress by crack edge 57 along cutting apart preset lines 2 thus, thereby correspondingly, wafer 1 is ruptured along cutting apart preset lines 2 strength decreased with being formed with modified layer 5.
In bar unit 50, first to Article 3 parts 51,52,53 be responsible for respectively wafer 1 be positioned at the first to the 3rd region A1, A2, A3 cut apart cutting apart of preset lines 2, along with travelling table 15 is to the movement of Y-direction, first is positioned respectively the first to the 3rd region A1, A2, A3 to Article 3 parts 51,52,53.
In addition, this device 10 has detection means 60, and this detection means 60 is cut apart preset lines 2 for detection of what remain on as shown in Figure 2 wafer 1 on ring-shaped frame retaining member 30.Detection means 60 is installed in the end of the pillar 61 of L word shape, and is located in the top of cylinder seat 31, and the pillar 61 of above-mentioned L word shape erects the end of the Y2 side that is arranged at pedestal 11.Detection means 60 has the imaging apparatuss such as CCD, by the positive 1a of wafer 1 having been taken to cut apart the detection of preset lines 2.
[2-2] dividing method
Be more than the structure of the segmenting device 10 of an execution mode, next the dividing method of the wafer 1 that has used this device 10 described.
First, as shown in Figure 4, by air cylinder device 37, framework holding member 35 is positioned to the height and position that makes supporting surface 35a identical with the upper end of cylinder seat 31, wafer cell 8 is to concentric shape and remains to (maintenance step) on ring-shaped frame retaining member 30.Wafer cell 8 is taking wafer 1 as upside, and taking belt body 6 as downside, ring-shaped frame 7 is loaded on framework holding member 35 and by clamp system 36 and is clamped, wafer 1 is loaded on cylinder seat 31 through belt body 6, thereby wafer cell 8 is kept by ring-shaped frame retaining member 30.
Next, ring-shaped frame retaining member 30 is rotated together with cylinder seat 31, to be aligned to the bearing of trend of bar parts 51～53 be directions X parallel (position alignment step) to the preset lines 2 of cutting apart that the direction along cutting apart of wafer 1 is extended.About position alignment step, by by detection means 60, the front of wafer 1 being made a video recording to adjust the anglec of rotation of cylinder seat 31, thereby it is parallel with directions X to make to cut apart preset lines 2.Next, as shown in Fig. 7 (a), by air cylinder device 37, framework holding member 35 is declined, expand thus belt body 6 and wafer 1 is easily cut apart.In addition, the expansion of belt body 6 is carried out as required, for example, if just can cut apart under the very thin state not needing expansion of wafer 1, also can not make especially belt body 6 expand.
Next, by travelling table 15 is moved to Y1 direction continuously with the speed of regulation, as shown in Fig. 8 (a)～(c), when bar unit 50 is relatively moved to Y2 direction, successively all preset lines 2 of cutting apart of extending along directions X are cut apart from Y1 side direction Y2 side in the figure.
; first; as shown in Fig. 8 (a); bar unit 50 is navigated to Y1 side; open the electromagnetic switching valve 61 of Article 1 parts 51 sides and make to aspirate road 54 for negative pressure, thereby make bar unit 50 relatively move the upper end of Article 1 parts 51 is moved to Y2 direction along the lower surface of belt body 6 to Y2 direction.Thus, cut apart preset lines 2 start to rupture successively many of first area A1 by Article 1 parts 51 from Y1 side end the shortest and cut apart preset lines 2, wafer 1 is cut apart down (the first segmentation step).In the first segmentation step, because Article 3 parts 53 do not have to cover the total length of cutting apart preset lines 2, so the electromagnetic switching valve 61 of Article 3 parts 53 is negative pressure for closed condition does not make to aspirate road 54.
Cut apart preset lines 2 and be formed with that to cut apart starting point be modified layer 5, in the time cutting apart preset lines 2 and be subject to suction function from the Article 1 parts 51 that pass through, cut apart preset lines 2 from the crack edge 57 of Article 1 parts 51 be subject to bending stress and successively fracture go down.In addition, Article 2 parts 52 make to aspirate road 54 for negative pressure with Article 1 parts 51 simultaneously, cut apart preset lines 2 and wafer 1 is cut apart by rupture the successively part of the Y2 side in second area A2 of Article 2 parts 52.
First area A1 all cut apart preset lines 2 by fracture after, close the electromagnetic switching valve 61 of Article 1 parts 51 sides, as shown in Fig. 7 (b) and Fig. 8 (b), continue bar unit 50 in the relatively moving of Y2 direction, only by Article 2 parts 52, the preset lines 2 of cutting apart of remaining second area A2 is cut apart down to (the second segmentation step).In the second segmentation step, comprise that the longest many of cutting apart preset lines 2 that are formed at second area A2 cut apart preset lines 2 and ruptured.
In the final stage of the second segmentation step, because Article 3 parts 53 start to enter the 3rd region A3, make to aspirate road 54 so open the electromagnetic switching valve 61 of Article 3 parts 53 sides here for negative pressure, as shown in Figure 8 (c), what start to rupture the 3rd region A3 by Article 3 parts 53 cuts apart preset lines 2, and continues the fracture of cutting apart preset lines 2 (three segmentation step) of Article 2 parts 52 to second area A2.And, Y2 side end the shortest cut apart preset lines 2 by Article 3 parts 53 by fracture after, all preset lines 2 of cutting apart of extending along directions X are ruptured.
Next, as shown in Fig. 8 (d), cylinder seat 31 is rotated and make wafer cell 8 half-twists, in the positive 1a of wafer 1 being made a video recording by detection means 60, by fracture not cut apart preset lines 2(along with rupture cut apart the extension of the vertical direction of preset lines 2) be aligned to parallel with directions X (position alignment step).Then, making after bar unit 50 turns back to initial Y1 side, to carry out the above-mentioned first to the 3rd segmentation step with same will getting.Or, as shown in Fig. 8 (e), the state that also can arrive Y2 side from bar unit 50, cut apart with the order of the 3rd region A3, second area A2, first area A1.
By above processing, wafer 1 is cut apart along all preset lines 2 of cutting apart that are clathrate setting.
The action effect of [2-3] execution mode
In an above-mentioned execution mode, thus with respectively from wafer 1, cut apart the shorter first area A1 of preset lines 2 and the 3rd region A3 and cut apart different first the rupturing and cut apart preset lines 2 wafer 1 is cut apart to Article 3 parts 51,52,53 of length that the long second area A2 of preset lines 2 is corresponding.Therefore, can be by the length setting of each parts 51,52,53 for enough to cutting apart that preset lines 2 is cut apart and being required MIN length.Its result is in using the ring-shaped frame 7 of the appropriate size corresponding with wafer 1, in the situation that bar parts 51,52,53 are not interfered with ring-shaped frame 7, reliably wafer 1 to be cut apart along cutting apart preset lines 2 by bar parts 51,52,53.
In addition, in the above-described embodiment, moment wafer 1 expanded belt body 6 as shown in Fig. 7 (a) is not cut apart and is illustrated along cutting apart preset lines 2, but also can increase the external force that is applied to wafer 1 by the amount of expansion of adjusting belt body 6, along being formed with, to cut apart starting point be that the preset lines 2 of cutting apart of modified layer 5 is prepared and cut apart wafer 1, cut apart by preparation and cut apart the not partitioning portion of not cutting apart as mentioned above by bar parts 51～53.
[3] other execution modes of bar unit
[3-1] has the mode of two bar parts
The bar unit 50 of an above-mentioned execution mode is such structure: comprise the longest preset lines 2 of cutting apart at the second area A2(that is responsible for cutting apart wafer 1) the both sides of Article 2 parts 52, be equipped be responsible for cutting apart wafer 1 both sides first, the 3rd region A1, A3(comprise the shortest preset lines 2 of cutting apart) first, Article 3 parts 51,53, by move all preset lines 2 of cutting apart that once just can rupture and extend along a direction along Y-direction.But the invention is characterized at least there are Article 1 parts 51 and Article 2 parts 52.Therefore, the bar unit 50 of execution mode is as shown in Figure 9 such, and bar parts can be also only to have both structures of above-mentioned Article 1 parts 51 and Article 2 parts 52.
According to the bar unit 50 of this execution mode, as shown in Fig. 9 (a)～(b), similarly rupture successively the cutting apart preset lines 2 of first area A1 and second area A2 and after wafer 1 is cut apart by Article 1 parts 51 and Article 2 parts 52 respectively with above-mentioned execution mode, as shown in Fig. 9 (c), cylinder seat 31 is rotated and make wafer cell 8 Rotate 180s °, the 3rd region A3 reversion of cutting apart preset lines 2 that makes to have not fracture is configured to Y1 side.Then,, in making bar unit 50 turn back to Y1 side, rupture and cut apart preset lines 2 with the order of second area A2, the 3rd region A3.All preset lines 2 of cutting apart of extending along directions X are ruptured thus.
[3-2] has the mode of multiple parts
Figure 10 and Figure 11 represent the segmenting device 10 of the bar unit 50 with such mode.As shown in figure 12, bar unit 50 now has: multiple Article 2 parts 52, and it is positioned at the central portion of Y-direction, and has than the longest and cut apart the length that preset lines 2 is long, and is responsible for cutting apart many of central portion that are positioned at wafer 1 and cuts apart preset lines 2; And multiple Article 1 parts 51, it is disposed in the Y-direction both sides of these Article 2 parts 52, have longlyer and than the longest short length of preset lines 2 of cutting apart than the shortest preset lines 2 of cutting apart, and be responsible for cutting apart many of exterior lateral area that are positioned at wafer 1 and cut apart preset lines 2.Each parts 51,52 also can be configured to separate and be adjacent to arrange closely-spacedly, or all parts are merged and become a block, and multiple suctions road 54 is formed to block and forms bar parts 51,52.
According to this unit 50, as shown in Figure 13 (a)～(f), when bar unit 50 is relatively moved from Y1 side direction Y2 side with respect to wafer 1, make to cover cut apart preset lines 2, suction road 54 that Length Ratio is cut apart the bar parts 51,52 that preset lines 2 is long is negative pressure, thus, thus can rupture continuously and cut apart preset lines 2 wafer 1 is separated.By thering are so multiple parts, can shorten travelling table 15 displacement carry out all cutting apart of preset lines 2 of cutting apart, can complete at short notice division processing.In addition, by making the sectionalization of bar parts, make bar parts be difficult for interfering with ring-shaped frame 7, therefore can obtain following advantage: also can cut apart even if the size of ring-shaped frame 7 is little, and can suppress the use amount of belt body 6.
[4] other execution modes of bar parts
The bar parts 51～53rd of above-mentioned execution mode, make to aspirate road 54 for negative pressure, wafer 1 is aspirated and along the structure of cutting apart preset lines 2 and cutting apart, thereby but as of the present invention parts as long as applying the parts that external force is cut apart wafer 1 along cutting apart preset lines 2, can be any mode.For example, can adopt by the end of pressing cutter 70 shown in Figure 14 the mode of cutting apart preset lines 2 jack-up and rupturing, wafer 1 is separated.Have multiple press cutter 70 in case the exterior lateral area of the wafer that can rupture and middle section cut apart preset lines, each is pressed cutter 70 and is configured to up and down independently.
In addition, in the above-described embodiment, be circular plate object using the wafers such as semiconductor wafer 1 as machined object of the present invention, but circular plate object of the present invention is not limited to this wafer, for example, comprise the various circular plate objects such as glass and sapphire substrate, pottery.
Claims (2)
1. a segmenting device, it is along the circular plate object of cutting apart preset lines and cut apart circular plate-shaped object units, above-mentioned circular plate-shaped object units comprises above-mentioned circular plate object, belt body and ring-shaped frame, above-mentioned circular plate object has many above-mentioned preset lines of cutting apart that length is different, and is formed with and cuts apart starting point along the above-mentioned preset lines of cutting apart; Above-mentioned belt body is pasted on a face of above-mentioned circular plate object; The periphery of above-mentioned belt body is pasted on above-mentioned ring-shaped frame, and above-mentioned ring-shaped frame has the big or small peristome of the above-mentioned circular plate object of storage,
Above-mentioned segmenting device is characterised in that,
Above-mentioned segmenting device has:
Ring-shaped frame retaining member, it has the supporting surface of the above-mentioned ring-shaped frame for supporting above-mentioned circular plate-shaped object units, above-mentioned ring-shaped frame retaining member keeps above-mentioned ring-shaped frame with following state: make the circular plate object of above-mentioned circular plate-shaped object units in upside, make the above-mentioned belt body in the region corresponding with above-mentioned circular plate object in downside, the above-mentioned belt body in above-mentioned circular plate object and the region corresponding with above-mentioned circular plate object is exposed;
Bar unit, it is disposed in the below that sticks on the above-mentioned belt body on the above-mentioned ring-shaped frame being kept by above-mentioned ring-shaped frame retaining member, above-mentioned unit extends abreast across the above-mentioned bearing of trend of cutting apart preset lines of above-mentioned belt body and above-mentioned circular plate object, above-mentioned unit is used for cutting apart the above-mentioned preset lines of cutting apart, and above-mentioned unit has the length shorter than the diameter of the above-mentioned peristome of above-mentioned ring-shaped frame; And
Mobile member, it makes above-mentioned unit is cutting apart in the vertical direction of preset lines and is relatively moving with this with respect to the above-mentioned preset lines of cutting apart that will cut apart,
Above-mentioned unit at least has:
Article 1, parts, the above-mentioned circular plate object of its Length Ratio to cut apart above-mentionedly cut apart the shortest above-mentioned predetermined line length of cutting apart in preset lines, and than above-mentioned circular plate object to cut apart above-mentioned to cut apart the above-mentioned preset lines of cutting apart the longest in preset lines short; And
Article 2 parts, its Length Ratio will be cut apart above-mentionedly cuts apart the longest above-mentioned predetermined line length of cutting apart in preset lines,
Above-mentioned Article 1 parts are responsible for cutting apart the above-mentioned preset lines of cutting apart of the exterior lateral area that is positioned at above-mentioned circular plate object, above-mentioned Article 2 parts are responsible for cutting apart the above-mentioned preset lines of cutting apart of the middle section that is positioned at above-mentioned circular plate object, and above-mentioned Article 1 parts and above-mentioned Article 2 parts are positioned respectively above-mentioned exterior lateral area and the above-mentioned middle section of above-mentioned circular plate object by above-mentioned mobile member.
2. a dividing method, it utilizes segmenting device described in claim 1 along the circular plate object of cutting apart preset lines and cut apart circular plate-shaped object units, above-mentioned circular plate-shaped object units comprises above-mentioned circular plate object, belt body and ring-shaped frame, above-mentioned circular plate object has many above-mentioned preset lines of cutting apart that length is different, and is formed with and cuts apart starting point along the above-mentioned preset lines of cutting apart; Above-mentioned belt body is pasted on a face of above-mentioned circular plate object; The periphery of above-mentioned belt body is pasted on above-mentioned ring-shaped frame, and above-mentioned ring-shaped frame has the big or small peristome of the above-mentioned circular plate object of storage,
Above-mentioned dividing method is characterised in that,
Above-mentioned dividing method has:
Keep step, keep the above-mentioned ring-shaped frame of above-mentioned circular plate-shaped object units by above-mentioned ring-shaped frame retaining member;
Position alignment step, the circular plate object to the above-mentioned circular plate-shaped object units fixing by above-mentioned ring-shaped frame retaining member to cut apart above-mentionedly cut apart preset lines and above-mentioned parts carry out position alignment;
The first segmentation step, implementing after above-mentioned position alignment step and above-mentioned maintenance step, comprising that will cut apart above-mentioned is in cutting apart preset lines in the shortest above-mentioned above-mentioned exterior lateral area of cutting apart preset lines, making above-mentioned Article 1 parts by above-mentioned mobile member is cutting apart in the vertical direction of preset lines and is relatively moving with this with respect to the above-mentioned preset lines of cutting apart that will cut apart, thus, in above-mentioned exterior lateral area, cut apart circular plate object along the above-mentioned preset lines of cutting apart; And
The second segmentation step, comprising that will cut apart above-mentioned is in cutting apart preset lines in the longest above-mentioned above-mentioned middle section of cutting apart preset lines, making above-mentioned Article 2 parts by above-mentioned mobile member is cutting apart in the vertical direction of preset lines and is relatively moving with this with respect to the above-mentioned preset lines of cutting apart that will cut apart, thus, in above-mentioned middle section, cut apart circular plate object along the above-mentioned preset lines of cutting apart.
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| JP2012-272203 | 2012-12-13 | ||
| JP2012272203A JP6047392B2 (en) | 2012-12-13 | 2012-12-13 | Dividing device and dividing method |
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| CN105140182B (en) * | 2015-04-28 | 2018-10-30 | 苏州镭明激光科技有限公司 | Wafer splitting machine |
| JP2017112265A (en) * | 2015-12-17 | 2017-06-22 | 株式会社ディスコ | Wafer processing method |
| JP7015668B2 (en) * | 2017-10-11 | 2022-02-03 | 株式会社ディスコ | Plate-shaped partitioning device |
| JP7032954B2 (en) | 2018-02-27 | 2022-03-09 | 京セラ株式会社 | heater |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20060016443A1 (en) * | 2004-07-23 | 2006-01-26 | Disco Corporation | Wafer dividing method and apparatus |
| US20060087008A1 (en) * | 2004-10-26 | 2006-04-27 | Disco Corporation | Wafer dividing apparatus |
| CN102049815A (en) * | 2009-10-30 | 2011-05-11 | 三星钻石工业股份有限公司 | Cut-off device |
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| JP4721997B2 (en) * | 2006-09-14 | 2011-07-13 | 株式会社ディスコ | Wafer dividing apparatus and wafer dividing method |
| JP5310278B2 (en) * | 2009-06-05 | 2013-10-09 | 三星ダイヤモンド工業株式会社 | Break bar |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060016443A1 (en) * | 2004-07-23 | 2006-01-26 | Disco Corporation | Wafer dividing method and apparatus |
| US20060087008A1 (en) * | 2004-10-26 | 2006-04-27 | Disco Corporation | Wafer dividing apparatus |
| CN102049815A (en) * | 2009-10-30 | 2011-05-11 | 三星钻石工业股份有限公司 | Cut-off device |
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| CN103871931B (en) | 2018-02-13 |
| JP6047392B2 (en) | 2016-12-21 |
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