CN105140182B - Wafer splitting machine - Google Patents
Wafer splitting machine Download PDFInfo
- Publication number
- CN105140182B CN105140182B CN201510204747.3A CN201510204747A CN105140182B CN 105140182 B CN105140182 B CN 105140182B CN 201510204747 A CN201510204747 A CN 201510204747A CN 105140182 B CN105140182 B CN 105140182B
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- Prior art keywords
- rotary table
- axis
- rack
- wafer
- ccd
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Wafer splitting machine, for ensureing the processing quality of wafer, improving precision when wafer is processed.It states rack and is equipped with rotary table, be equipped with magazine on the left of the rotary table in rack, magazine moves up and down under the driving of stepper motor along automatic loading/unloading axis；It is equipped with de-distortion equipment between automatic loading/unloading axis and rotary table, is equipped with the first CCD in the top of de-distortion equipment, the scanner of the Quick Response Code on scanning machining material is equipped between the first CCD and de-distortion equipment；It is equipped with feeding axis in the front side of rack, feeding axle clamp pawl is equipped on feeding axis；It is equipped with several positioning devices on rotary table, is equipped with alignment sensor in the top of rotary table, alignment sensor realizes the positioning to rapidoprint with positioning device mating reaction；It is equipped with the pressing plate that can be lifted in the vertical direction and splitting knife in the top of rotary table.The splitting machine high precision machining and high in machining efficiency ensure that quality when wafer processing.
Description
Technical field
The present invention relates to splitting machine technical field, specifically a kind of splitting machines for wafer processing.
Background technology
Wafer refers to the silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer；
Various circuit component structures can be manufactured on silicon, and become the IC products for having specific electrical functionality.With integrated
The fast development of circuit, more stringent requirements are proposed for the requirement to wafer quality, and the quality of wafer processing quality is for wafer
Normal work plays a crucial role.Therefore, it is necessary to a kind of splitting machines of wafer to realize the processing and manufacturing to wafer, to carry
Mechanization Level when high wafer processing,
Invention content
The purpose of the present invention is to provide a kind of efficient wafer splitting machines, for ensureing the processing quality of wafer, improving
Precision when wafer is processed.
The technical scheme adopted by the invention to solve the technical problem is that：Wafer splitting machine, characterized in that it includes feeding
Axis, de-distortion equipment, automatic loading/unloading axis, magazine, CCD, scanner, alignment sensor, rotary table, pressing plate, splitting platform
Axis, positioning device and rack are equipped with rotary table in the rack, are equipped in the rack on the left of the rotary table
Magazine for holding rapidoprint is equipped with automatic loading/unloading axis in the rack below the magazine, and the magazine is in stepping
It is moved up and down along automatic loading/unloading axis under the driving of motor；De-distortion is equipped between the automatic loading/unloading axis and rotary table
Equipment is equipped with the first CCD in the top of the de-distortion equipment, is equipped with and sweeps between the first CCD and de-distortion equipment
Instrument is retouched, the scanner can be with the Quick Response Code on scanning machining material；It is equipped with feeding axis in the front side of the rack, is taken described
Material axis is equipped with the feeding axle clamp pawl moved left and right；It is equipped on the rotary table several positioned at same circumferentially by folder
The positioning device for holding fixed material to be processed is equipped with alignment sensor, the orientation sensing in the top of the rotary table
Device realizes the positioning to rapidoprint with positioning device mating reaction；Being equipped in the top of the rotary table can be in vertical side
The pressing plate and splitting knife lifted upwards；It is equipped with splitting platform in the front side of the rack, being equipped in the bottom of the rack can be on a left side
The 2nd CCD that right moves up, the 2nd CCD are used to acquire the target information on rapidoprint to feed back to control system.
Further, the pressing plate and splitting knife are lifted by hydraulic oil cylinder driving.
Further, the positioning device is moved by hydraulic oil cylinder driving and the moving direction of positioning device is along rotary table
It is radial.
Further, the positioning device is three.
Further, the splitting knife is driven by stepper motor.
The beneficial effects of the invention are as follows：Wafer splitting machine, rapidoprint is placed in magazine, and the lifting of magazine is by stepping horse
Up to control.Rapidoprint is captured by feeding axle clamp pawl to be then placed on rotary table, and is taken pictures by CCD and judged processing material
Full wafer or relic when material, by the machine-readable target information taken on rapidoprint of CCD, control system is adjusted according to feedack
The angle of rotary table adjusts workpiece to machinable position.The splitting machine, which can be realized, grabs the intelligence of rapidoprint
Take, judge, information scanning, positioning and processing, high precision machining and high in machining efficiency ensure that quality when wafer processing.
Description of the drawings
Fig. 1 is the graphics of the present invention；
Fig. 2 is the front view of Fig. 1；
Fig. 3 is the left view of Fig. 1；
Fig. 4 is the vertical view of Fig. 1；
In figure：1 feeding axis, 2 de-distortion equipments, 3 automatic loading/unloading axis, 4 magazines, 5 rapidoprints, 6 CCD, 7 scanners,
8 Z axis, 9 splitting knives, 10 alignment sensors, 11 Y-axis, 12 rotary tables, 13 X-axis, 14 pressing plates, 15 splitting platform axis, 16 is fixed
Position device, 17 racks.
Specific implementation mode
As shown in Figures 1 to 4, the present invention includes feeding axis 1, de-distortion equipment 2, automatic loading/unloading axis 3, magazine 4, first
CCD6, scanner 7, Z axis 8, splitting knife 9, alignment sensor 10, Y-axis 11, rotary table 12, X-axis 13, pressing plate 14, splitting platform
Axis 15, positioning device 16 and rack 17, present invention is described below in conjunction with the accompanying drawings.
As shown in Figure 1, rack 17 is the matrix of the present invention, rack is used to support the main body of splitting machine, is installed in rack
There are other components.Be rotatablely equipped with rotary table 12 in rack, rotary table by Y-axis 11 motor-driven rotation.Rotation
Working face on revolving worktable is located in horizontal plane, alignment sensor 10 is equipped in the top of rotary table, for detecting
Whether rapidoprint is located in the machining area of rotary table, so that rapidoprint is in place.The edge position of workbench
Several positioning devices 16 on same circumference are installed, several positioning devices are for realizing the positioning to wafer, positioning dress
The fit inside effect set surrounds positioning of the arc-shaped realization to wafer, at this time in the center of circle and rotary table of wafer
The heart overlaps.Positioning device is driven by the cylinder radial direction of mobile and positioning device the moving direction along rotary table；Positioning device
Three are may be configured as, determines that a round principle realizes the positioning to rapidoprint according to 3 points.In the left side of rotary table
Equipped with magazine 4, magazine is equipped with automatic loading/unloading axis 3 for holding rapidoprint 5, in the lower section of magazine, and magazine is in stepper motor
Driving under moved up and down along automatic loading/unloading axis.
It is equipped with feeding axis 1 in the front side of rotary table, motor driving feeding axle clamp pawl is moved left and right along feeding axis, feeding
Axle clamp pawl realizes the material extracting operation to rapidoprint when being moved to feeding position.De-distortion is equipped between rotary table and magazine
Rapidoprint is placed on de-distortion equipment by equipment 2, feeding axle clamp pawl, carries out rectification work.De-distortion equipment just on
Side is equipped with the first CCD6, and the first CCD is used to shoot the shape of rapidoprint and judges that rapidoprint is full wafer or relic, together
When, the first CCD will determine that result feeds back to control system, and control system takes different processing sides according to different judging results
Formula.Scanner 7 is additionally provided between rotary table and magazine, scanner is for the Quick Response Code on scanning machining material, record
The information and statistics of rapidoprint.Hereafter, wafer is placed on rotary table by feeding axle clamp pawl, positioning device and orientation sensing
The positioning to rapidoprint is realized in device mating reaction, and rapidoprint is placed on Working position.It is set on front side of rotary table
There is splitting platform axis 15, after rapidoprint is placed on rotary table, the splitting platform on splitting platform axis Unscrew splitting platform axis.
It is equipped with X-axis 13 in rack, the 2nd CCD is equipped in X-axis, the 2nd CCD in X-axis runs to designated position acquisition rapidoprint
Target information, and feed back to control system.Control system adjusts the angle of rotary table by operation, by rapidoprint tune
Whole to machinable position.It is equipped with Z axis in the top of rotary table, the pressing plate 14 being driven by the cylinder, oil cylinder are equipped on Z axis
Driving pressing plate is moved down and is pressed on rapidoprint, warpage occurs to avoid rapidoprint, and then facilitate processing.On Z axis
It is additionally provided with splitting knife 9, splitting knife is driven by drive motor and rotated, and is cleaved knife at this time and is operated to Working position, after starting motor, splits
Knife is split to be processed rapidoprint.After processing is completed, it cleaves knife and pressing plate rises under the drive of cylinder, feeding axis moves
It moves to rotary table position, positioning device unclamps rapidoprint, and the processing material after processing is captured by feeding clamping jaw
Rapidoprint original road, is then returned in magazine by material.
Claims (5)
1. wafer splitting machine, characterized in that it includes feeding axis, de-distortion equipment, automatic loading/unloading axis, magazine, CCD, scanning
Instrument, alignment sensor, rotary table, pressing plate, splitting platform axis, positioning device and rack, are equipped with rotation work in the rack
Make platform, the magazine for holding rapidoprint is equipped in the rack on the left of the rotary table, below the magazine
Rack is equipped with automatic loading/unloading axis, and the magazine moves up and down under the driving of stepper motor along automatic loading/unloading axis；Institute
It states and is equipped with de-distortion equipment between automatic loading/unloading axis and rotary table, first is equipped in the top of the de-distortion equipment
CCD is equipped with scanner between the first CCD and de-distortion equipment, and the scanner can be with two on scanning machining material
Tie up code；It is equipped with feeding axis in the front side of the rack, the feeding axle clamp pawl moved left and right is equipped on the feeding axis；Described
Rotary table be equipped with it is several be located at it is same circumferentially by the positioning device for gripping material to be processed, in the rotation
The top of workbench is equipped with alignment sensor, and the alignment sensor determines rapidoprint with positioning device mating reaction realization
Position；It is equipped with the pressing plate that can be lifted in the vertical direction and splitting knife in the top of the rotary table；Before the rack
Side is equipped with splitting platform, the 2nd CCD that can be moved in the lateral direction is equipped in the bottom of the rack, the 2nd CCD is for adopting
Collect the target information on rapidoprint to feed back to control system.
2. wafer splitting machine according to claim 1, characterized in that the pressing plate and splitting knife are driven by the cylinder lifting.
3. wafer splitting machine according to claim 1, characterized in that the positioning device is driven by the cylinder mobile and positions
Radial direction of the moving direction of device along rotary table.
4. wafer splitting machine according to claim 3, characterized in that the positioning device is three.
5. wafer splitting machine according to claim 1, characterized in that the splitting knife is driven by stepper motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510204747.3A CN105140182B (en) | 2015-04-28 | 2015-04-28 | Wafer splitting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510204747.3A CN105140182B (en) | 2015-04-28 | 2015-04-28 | Wafer splitting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105140182A CN105140182A (en) | 2015-12-09 |
| CN105140182B true CN105140182B (en) | 2018-10-30 |
Family
ID=54725480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510204747.3A Active CN105140182B (en) | 2015-04-28 | 2015-04-28 | Wafer splitting machine |
Country Status (1)
| Country | Link |
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| CN (1) | CN105140182B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105590884B (en) * | 2015-12-30 | 2018-06-01 | 天津天物金佰微电子有限公司 | Semi-automatic chip breaking machine and splinter method |
| CN110676199B (en) * | 2019-10-16 | 2022-04-22 | 深圳市迈诺为智能科技有限公司 | High-speed mounting imprinter |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102646611A (en) * | 2011-02-17 | 2012-08-22 | 竑腾科技股份有限公司 | Method for detecting height of wafer splitting breakpoint |
| CN203631525U (en) * | 2013-12-13 | 2014-06-04 | 正恩科技有限公司 | Splitter cutter axis automatic compensation device |
| CN203746818U (en) * | 2013-12-30 | 2014-07-30 | 郑礼忠 | Wafer splitting machine |
| CN204809205U (en) * | 2015-04-28 | 2015-11-25 | 苏州镭明激光科技有限公司 | Wafer splitting machine |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100175834A1 (en) * | 2009-01-13 | 2010-07-15 | Shin-Kan Liu | Wafer splitting laminate mechanism |
| KR101284717B1 (en) * | 2011-05-25 | 2013-07-17 | 코리아테크노(주) | Laser scanning apparatus for fabricating organic light emitting display device |
| JP6047392B2 (en) * | 2012-12-13 | 2016-12-21 | 株式会社ディスコ | Dividing device and dividing method |
-
2015
- 2015-04-28 CN CN201510204747.3A patent/CN105140182B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102646611A (en) * | 2011-02-17 | 2012-08-22 | 竑腾科技股份有限公司 | Method for detecting height of wafer splitting breakpoint |
| CN203631525U (en) * | 2013-12-13 | 2014-06-04 | 正恩科技有限公司 | Splitter cutter axis automatic compensation device |
| CN203746818U (en) * | 2013-12-30 | 2014-07-30 | 郑礼忠 | Wafer splitting machine |
| CN204809205U (en) * | 2015-04-28 | 2015-11-25 | 苏州镭明激光科技有限公司 | Wafer splitting machine |
Non-Patent Citations (1)
| Title |
|---|
| 紫外激光切割磷化铟晶圆的工艺研究;周波 等;《应用激光》;20121231;第32卷(第6期);全文 * |
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| Publication number | Publication date |
|---|---|
| CN105140182A (en) | 2015-12-09 |
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