JP6599783B2 - Board work system - Google Patents

Description

  The present invention relates to an on-board working system having two working heads and capable of transferring components from one of the two working heads to the other.

  In the substrate-to-board working system, there is a system having two working heads and capable of transferring parts from one of the two working heads to the other. In such a system, when each work head has a plurality of component holders, two or more held by at least two or more component holders of the plurality of component holders of one work head This part can be simultaneously delivered to at least two or more of the plurality of part holders of the other work head, so that the time required for the part delivery work can be shortened. However, if the distance between the component holder that delivers the component and the component holder that receives the component (hereinafter referred to as “distance between the holders”) differs for each of the plurality of component holders, Simultaneous delivery may not be performed properly. In such a case, as described in the following patent document, by adjusting the holding position by the component holder for each of the plurality of component holders, the distance between the holders for each of the plurality of component holders. It is possible to appropriately carry out simultaneous delivery of a plurality of parts.

Japanese Unexamined Patent Publication No. 2000-077786

  However, in order to adopt the technology described in the above-mentioned patent document and adjust the distance between the holders for each of the plurality of component holders, a mechanism for adjusting the distance between the holders for each component holder is required. There are various problems such as complicated mechanisms, large working heads, and increased costs. For this reason, it is considered that the practicality of the substrate working system is improved by solving such various problems. The present invention has been made in view of such circumstances, and an object of the present invention is to provide a highly practical anti-substrate working system.

  In order to solve the above-described problem, a substrate-based work system described in the present application includes a plurality of first holders and a plurality of first component holders that are detachably attached to the plurality of first holders. A second working head having a working head, a plurality of second holders, and a plurality of second component holders detachably attached to the plurality of second holders; A head and the second work head are disposed in a state where the plurality of first component holders and the plurality of second component holders face each other, and the plurality of first components of the first work head. Two or more components held by at least two or more first component holders among the holders are used as at least two or more second component holders of the plurality of second component holders of the second working head. In the board-to-board system that delivers to The control device has a component holding position by the first component holder when the plurality of first component holders are sequentially mounted on each of the plurality of first holders of the first work head, and the second An acquisition unit configured to acquire a component holding position by the second component holder when the plurality of second component holders are sequentially mounted on each of the plurality of second holders of the work head; In one component holder and the two or more second component holders that receive components from the two or more first component holders, the holding position of the component by the first component holder, and the first component holder The first holder and the first component based on the holding position acquired by the acquisition unit so that a difference in distance from the holding position of the component by the second component holder receiving the component from the second component holder is reduced. Combination with a holder and the second And having a determination unit for determining a combination of a holder and the second component holder.

  In the on-board working system described in the present application, the component holding position by the first component holder when the plurality of first component holders are sequentially mounted on each of the plurality of first holders of the first work head, The holding position of the component by the second component holder when the plurality of second component holders are sequentially mounted on each of the plurality of second holders of the two work heads is acquired. Then, based on the acquired holding position of the component by the first component holder and the holding position of the component by the second component holder, the difference in the distance between the holders of the plurality of component holders is reduced. A combination of the first holder and the first component holder and a combination of the second holder and the second component holder are determined. This makes it possible to reduce the difference in the distance between the holders of a plurality of component holders and appropriately execute the simultaneous delivery of a plurality of parts without using a mechanism for adjusting the distance between the holders. Thus, practicality is improved.

It is a perspective view which shows an electronic component mounting machine. It is a top view which shows an electronic component mounting machine. It is a figure which shows the bottom face of a mounting head. It is a perspective view which shows a die supply apparatus. It is a perspective view which shows a pickup head. It is a block diagram which shows an electronic component mounting machine. It is the schematic which shows the suction nozzle of a mounting head, and the suction nozzle of a pick-up head. It is the schematic which shows the suction nozzle of a mounting head, and the suction nozzle of a pick-up head. It is the schematic which shows the suction nozzle of a mounting head, and the suction nozzle of a pick-up head.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

<Configuration of electronic component mounting machine>
1 and 2 show an electronic component mounting machine 10 according to an embodiment of the present invention. FIG. 1 is a perspective view of the electronic component mounting machine 10, and FIG. 2 is a diagram showing the electronic component mounting machine 10 with the cover 12 and the like removed from a viewpoint from above. The electronic component mounting machine 10 is a working machine for mounting electronic components on a circuit board. The electronic component mounting machine 10 includes a transport device 20, a mounting head moving device (hereinafter may be abbreviated as “moving device”) 22, a mounting head 24, a flux supply device 26, a nozzle station 27, and a parts camera. 28 and a die supply device 30. In the following description, the width direction of the electronic component mounting machine 10 is referred to as an X-axis direction, and a horizontal direction perpendicular to the direction is referred to as a Y-axis direction.

  The transport device 20 includes two conveyor devices 40 and 42. The two conveyor devices 40 and 42 are arranged on the base 46 so as to be parallel to each other and extend in the X-axis direction. Each of the two conveyor devices 40 and 42 conveys the circuit board in the X-axis direction by driving an electromagnetic motor 47 (see FIG. 6). The circuit board is fixedly held by a board holding device (see FIG. 6) 48 at a predetermined position.

  The moving device 22 has a pair of Y-axis direction guide rails 50 extending in the Y-axis direction and an X-axis direction guide rail 52 extending in the X-axis direction. The X-axis direction guide rail 52 is overlaid on a pair of Y-axis direction guide rails 50. The X-axis direction guide rail 52 is moved to an arbitrary position in the Y-axis direction by driving an electromagnetic motor (see FIG. 6) 53. The X-axis direction guide rail 52 holds a slider 54 so as to be movable along its own axis. The slider 54 is moved to an arbitrary position in the X-axis direction by driving an electromagnetic motor (see FIG. 6) 55. The mounting head 24 is attached to the slider 54. With such a structure, the mounting head 24 moves to an arbitrary position on the base 46.

  The mounting head 24 mounts electronic components on a circuit board. The mounting head 24 has four mounting units 60, as shown in FIG. FIG. 3 is a bottom view of the mounting head 24 shown from a viewpoint from the lower side of the mounting head 24. The mounting unit 60 has a rod shape, and a suction nozzle 62 is mounted at the tip of each mounting unit 60. The suction nozzle 62 can be attached to and detached from the mounting unit 60.

  Each suction nozzle 62 communicates with a positive / negative pressure supply device (see FIG. 6) 64 via negative pressure air and positive pressure air passages. Each suction nozzle 62 sucks and holds the electronic component with a negative pressure, and detaches the held electronic component with a positive pressure. Further, the mounting unit 60 is held by a unit holder 66 so as to be movable in the axial direction in a state where the axial direction is vertical, and the suction nozzle 62 mounted on the tip of the mounting unit 60 is held by the unit. It extends downward from the lower surface of the body 66. Note that the four mounting units 60 are arranged on the circumference of the circle in four equal positions from the viewpoint from the vertical direction.

  The mounting head 24 has a nozzle lifting device 68 (see FIG. 6). The nozzle lifting / lowering device 68 is connected to the mounting unit 60 via a gear (not shown), and moves the mounting unit 60 up and down. The gear is switched between a state in which it is individually engaged with any one of the four mounting units 60 and a state in which it is engaged with all of the four mounting units 60. For this reason, the nozzle lifting / lowering device 68 can lift and lower each of the four mounting units 60 individually by switching the gears, and can also lift and lower all the four mounting units 60 simultaneously. It is.

  As shown in FIG. 2, the flux supply device 26 is provided at one end of the base 46 in the Y-axis direction. Specifically, the upper surface of the base 46 is generally rectangular, and the device pallet 70 is fixed to the front edge of the base 46 in the Y-axis direction. A flux supply device 26 is attached to the device pallet 70. The flux supply device 26 has a main body base 72 and a flux tray 74. The main body base 72 has a generally rectangular plate shape, and a slide portion (not shown) is provided on the back surface of the main body base 72 so as to extend in the longitudinal direction. On the other hand, a plurality of grooves 75 are formed on the upper surface of the device pallet 70 so as to extend in the Y-axis direction. The main body base 72 is attached to the device pallet 70 by fitting the slide portion of the main body base 72 into the groove 75. A flux tray 74 is placed on the upper surface of the end of the main body base 72 on the side close to the inside of the electronic component mounting machine 10. The flux is stored in the flux tray 74.

  The nozzle station 27 is disposed between the device pallet 70 and the transfer device 20 and has a nozzle tray 76. A plurality of suction nozzles 62 are accommodated in the nozzle tray 76. In the nozzle station 27, the suction nozzle 62 attached to the mounting head 24 and the suction nozzle 62 accommodated in the nozzle tray 76 are exchanged as necessary. The nozzle tray 76 can be attached to and detached from the nozzle station 27, and collection of the suction nozzles 62 accommodated in the nozzle tray 76, supply of the suction nozzles 62 to the nozzle tray 76, and the like are performed outside the electronic component mounting machine 10. It is possible.

  The parts camera 28 is disposed next to the nozzle station 27. The parts camera 28 irradiates the electronic component held by the mounting head 24 with light from the side, receives the light, and images the electronic component. That is, the parts camera 28 images the electronic component held by the mounting head 24 from a side viewpoint.

  The die supply device 30 is provided at one end of the base 46 in the Y-axis direction. Specifically, a recessed storage section 86 is formed at the edge of the base 46 to which the device pallet 70 is fixed, and a part of the die supply device 30 is stored in the storage section 86. As shown in FIG. 4, the die supply device 30 supplies the die 92 from the die assembly 90. The die assembly 90 is formed by dicing a wafer in which a dicing sheet is attached. Note that the die assembly 90 is sometimes simply referred to as a “wafer”, and the die 92 is sometimes referred to as a “chip”.

  The die supply device 30 includes a main frame 100, a die assembly housing device 102, a die assembly holding device 104, a pickup head 105, and a pickup head moving device (hereinafter may be abbreviated as “moving device”) 106. A die push-up device (see FIG. 6) 107, a nozzle station 108, and a touch sensor 109.

  On the upper surface of the main frame 100, a die assembly holding device 104, a pickup head 105, a moving device 106, a die push-up device 107, a nozzle station 108, and a touch sensor 109 are disposed. The die supply device 30 is attached to the main frame 100 by storing the main frame 100 in the storage portion 86.

  The die assembly accommodation apparatus 102 includes a rack 110 and a lifting table 112. The rack 110 is disposed on a lifting table 112, and a plurality of die assemblies 90 are accommodated in the rack 110 in a stacked state. The plurality of die assemblies 90 move in the vertical direction by moving the lifting table 112 up and down by a table lifting mechanism (see FIG. 6) 115. Then, the die assembly 90 positioned at a predetermined height is pulled out onto the die assembly holding device 104. The upper portion of the rack 110 is covered with a rack cover 114. The rack cover 114 is formed of a material having permeability, so that an operator can see the inside of the rack 110.

  The die assembly holding device 104 includes a holding frame 118 and a fixing mechanism (see FIG. 6) 119. The holding frame 118 is disposed substantially at the center of the upper surface of the main frame 100, and the die assembly 90 pulled out from the die assembly accommodating device 102 is placed on the holding frame 118. The die assembly 90 placed on the holding frame 118 is fixed by the fixing mechanism 119.

  The pickup head 105 picks up the die 92 from the die assembly 90. As shown in FIG. 5, the pickup head 105 has four pickup units 120. The pickup unit 120 has a rod shape, and a suction nozzle 122 is attached to the tip of each pickup unit 120. The suction nozzle 122 can be attached to and detached from the pickup unit 120.

  Each suction nozzle 122 communicates with a positive / negative pressure supply device (see FIG. 6) 123 through negative pressure air and positive pressure air passages. Each suction nozzle 122 sucks and holds the electronic component with a negative pressure, and detaches the held electronic component with a positive pressure. The pickup unit 120 is held by the unit holder 124 so as to be movable in the axial direction in a state where the axial direction is vertical, and the suction nozzle 122 attached to the front end of the pickup unit 120 is a pickup head. It extends downward from the lower surface of 105. The four pickup units 120 are arranged on the circumference of the circle in four equal positions from the viewpoint from the vertical direction, and have the same arrangement pitch as the four mounting units 60 of the mounting head 24. .

  The pickup head 105 has a nozzle lifting / lowering device 125. The nozzle lifting / lowering device 125 lifts and lowers each mounting unit 60 individually by lifting and lowering the engagement block 126. Specifically, the engagement block 126 is controlled up and down and rotated by the operation of the electromagnetic motor 127 (see FIG. 6). Further, the engagement block 126 individually engages with any one of the four mounting units 60 by rotation. For this reason, when the engagement block 126 is lifted and lowered in a state where it is engaged with any one of the four mounting units 60, the mounting units 60 are individually lifted and lowered one by one.

  The pickup head 105 further includes a reversing device 128 that reverses the unit holding body 124 in the up-down direction. By the operation of the reversing device 128, the pickup unit 120 held by the unit holding body 124 is turned upside down. It is possible. Specifically, the unit holder 124 is rotatably supported by the main body 130 of the pickup head 105 by a support shaft 129 that extends in a generally horizontal direction. The reversing device 128 includes a pinion 131 fixed to the unit holder 124 coaxially with the support shaft 129, and a rack 132 that meshes with the pinion 131. Then, the rack 132 moves up and down by the operation of the electromagnetic motor (see FIG. 6) 133, so that the pinion 131 rotates, and the unit holder 124 moves the support shaft 129 as shown by the arrow in the drawing. Invert to the center. As a result, the pickup unit 120 held by the unit holding body 124 is reversed, and the suction nozzle 122 can be positioned at the upper end of the pickup unit 120 with the tip portion facing upward. That is, by the operation of the reversing device 128, the suction nozzle 122 attached to the pickup unit 120 is switched between a state facing downward and a state facing upward.

  As shown in FIG. 4, the moving device 106 includes a pair of Y-axis direction guide rails 134 that extend in the Y-axis direction, and an X-axis direction guide rail 135 that extends in the X-axis direction. The X-axis direction guide rail 135 is overlaid on a pair of Y-axis direction guide rails 134. The X-axis direction guide rail 135 is moved to an arbitrary position in the Y-axis direction by driving an electromagnetic motor (see FIG. 6) 136. The X-axis direction guide rail 135 holds a slider 138 so as to be movable along its own axis. The slider 138 is moved to an arbitrary position in the X-axis direction by driving an electromagnetic motor (see FIG. 6) 140. A pickup head 105 is attached to the slider 138. With such a structure, the pickup head 105 moves to an arbitrary position on the main frame 100.

  A clamp 146 is attached to the back surface of the X-axis direction guide rail 135 of the moving device 106. The clamp 146 holds the die assembly 90 housed in the rack 110 of the die assembly housing apparatus 102. That is, by moving the X-axis direction guide rail 135 in the Y-axis direction, the die assembly 90 held by the clamp 146 moves in the Y-axis direction. As a result, the die assembly 90 accommodated in the rack 110 is pulled out onto the holding frame 118.

  The die lifting device 107 is disposed below the holding frame 118 of the die assembly holding device 104, and includes a lifting tool (not shown), a lifting tool lifting device (see FIG. 6) 150, and a lifting tool movement. And a device (see FIG. 6) 152. The thrusting tool pushes up the die 92 of the die assembly 90 held by the holding frame 118 from the back surface. The lifting tool lifting device 150 lifts and lowers the lifting tool in the vertical direction. The protrusion tool moving device 152 moves the protrusion tool to an arbitrary position below the die assembly 90. As a result, the die thrusting device 107 supports the pickup of the die 92 by the pickup head 105. Specifically, the protrusion is moved below the die 92 picked up by the pickup head 105, and the protrusion is raised at that position. Thereby, the die 92 is lifted, and the lifted die 92 is sucked by the suction nozzle 122 of the pickup head 105.

  The nozzle station 108 is disposed between the die assembly housing device 102 and the die assembly holding device 104 and has a nozzle tray 156. A plurality of suction nozzles 122 are accommodated in the nozzle tray 156. In the nozzle station 108, the suction nozzle 122 attached to the pickup head 105 and the suction nozzle 122 accommodated in the nozzle tray 156 are exchanged as necessary. The nozzle tray 156 can be attached to and detached from the nozzle station 108, and the collection of the suction nozzle 122 accommodated in the nozzle tray 156, the replenishment of the suction nozzle 122 to the nozzle tray 156, and the like are performed outside the electronic component mounting machine 10. It is possible.

  The touch sensor 109 is a sensor for detecting the position of the tip of the suction nozzle 122 attached to the pickup unit 120 of the pickup head 105, and is disposed next to the nozzle station 108. Specifically, the suction nozzle 122 to be detected is moved above the touch sensor 109, and the suction nozzle 122 is lowered by the operation of the nozzle lifting / lowering device 125. At this time, the suction nozzle 122 is lowered until contact is detected by the touch sensor 109, and the lowering amount of the suction nozzle 122 is calculated. Based on the descending amount, the tip position of the suction nozzle 122 in the vertical direction, that is, the holding position of the component by the suction nozzle 122 is calculated. In this specification, the vertical direction refers to a direction perpendicular to the X-axis direction and the Y-axis direction, a vertical direction, a height direction, a direction perpendicular to the circuit substrate held by the substrate holding device 48, and a holding unit 60 This means the axial direction of the suction nozzle 62, the axial direction of the suction nozzle 122 held by the pickup unit 120, the lifting direction of the suction nozzle 62 by the nozzle lifting device 68, and the lifting direction of the suction nozzle 122 by the nozzle lifting device 125.

  Moreover, the electronic component mounting machine 10 is provided with the control apparatus 160, as shown in FIG. The control device 160 includes a controller 162 and a plurality of drive circuits 164. The plurality of drive circuits 164 include the electromagnetic motors 47, 53, 55, 127, 133, 136, 140, the substrate holding device 48, the positive / negative pressure supply devices 64, 123, the nozzle lifting / lowering device 68, the table lifting / lowering mechanism 115, and the fixing mechanism 119. , The lifting tool lifting device 150 and the lifting tool moving device 152 are connected. The controller 162 includes a CPU, a ROM, a RAM, and the like, is mainly a computer, and is connected to a plurality of drive circuits 164. Accordingly, the operations of the transport device 20 and the moving device 22 are controlled by the controller 162. The controller 162 is also connected to the image processing device 168. The image processing device 168 is a device for processing image data captured by the parts camera 28. Thereby, the controller 162 acquires various types of information from the imaging data. Further, the controller 162 is connected to the touch sensor 109 and detects the contact of the suction nozzle 122 from the touch sensor 109.

<Mounting work with electronic component mounting machine>
With the above-described configuration, the electronic component mounting machine 10 performs a mounting operation for mounting the die 92 on the circuit board. Specifically, the circuit board is transported to the work position according to a command from the controller 162 of the control device 160, and the circuit board is fixedly held at the position. Further, the die supply device 30 supplies the die 92 using the pickup head 105.

  Specifically, the elevator table 112 is moved up and down by an instruction from the controller 162, and any die assembly 90 among the plurality of die assemblies 90 accommodated in the rack 110 is moved to a position facing the clamp 146. Is done. Then, the die assembly 90 is gripped by the clamp 146, and the X-axis direction guide rail 135 is moved in the X-axis direction. As a result, the die assembly 90 held by the clamp 146 is pulled out onto the holding frame 118. The die assembly 90 pulled out from the rack 110 is fixed by the fixing mechanism 119. Next, the pickup head 105 moves above the die 92 to be picked up, and the die 92 is sucked and held by the suction nozzle 122. At this time, the protruding tool is moved below the die 92 sucked and held by the suction nozzle 122 of the pickup head 105, and the protruding tool is raised at that position. Thereby, the die 92 is lifted, and the lifted die 92 is sucked and held by the suction nozzle 122 of the pickup head 105.

  Subsequently, the pickup head 105 is inverted in the vertical direction. As a result, the die 92 sucked and held by the suction nozzle 122 is supplied at the top of the pickup head 105. When the die 92 is supplied above the pickup head 105, the mounting head 24 moves above the pickup head 105, and the suction nozzle 62 holds the die 92 by suction. That is, the die 92 is delivered from the suction nozzle 122 of the pickup head 105 to the suction nozzle 62 of the mounting head 24. Next, the mounting head 24 moves above the flux tray 74 of the flux supply device 26, the suction nozzle 62 holding the die 92 is lowered, and the flux is applied to the bumps (not shown) of the die 92. Then, the mounting head 24 moves onto the circuit board, and the die 92 is mounted on the circuit board.

<Die delivery from pickup head to mounting head>
In the electronic component mounting machine 10, as described above, the die 92 held by the suction nozzle 122 of the pickup head 105 is delivered to the suction nozzle 62 of the mounting head 24. At this time, the four dies 92 held by the four suction nozzles 122 of the pickup head 105 are connected to the four of the mounting head 24 in order to shorten the time required for the transfer operation of the die 92 from the pickup head 105 to the mounting head 24. The two suction nozzles 62 are simultaneously delivered. Specifically, the four suction nozzles 122 of the pickup head 105 are individually lowered to hold the die 92 by suction. When the four dies 92 are sucked and held by the four suction nozzles 122 of the pickup head 105, the pickup head 105 is inverted in the vertical direction. As a result, four dies 92 are supplied above the pickup head 105.

  On the other hand, the four suction nozzles 62 of the mounting head 24 have the same arrangement pitch as the four suction nozzles 122 of the pickup head 105. For this reason, the four suction nozzles 62 of the mounting head 24 and the four suction nozzles 122 of the pickup head 105 can be matched in the vertical direction. That is, it is possible to make the X coordinate and Y coordinate of each of the four suction nozzles 62 of the mounting head 24 coincide with the X coordinate and Y coordinate of each of the four suction nozzles 122 of the pickup head 105. In the mounting head 24, the four suction nozzles 62 can be lowered simultaneously. Therefore, after the mounting head 24 is moved so that the four suction nozzles 62 of the mounting head 24 and the four suction nozzles 122 of the pickup head 105 are aligned in the vertical direction, the four suction nozzles 62 are simultaneously moved. By lowering, the four suction nozzles 62 of the mounting head 24 suck and hold the four dies 92 simultaneously. That is, the four dies 92 held by the four suction nozzles 122 of the pickup head 105 are simultaneously delivered to the four suction nozzles 62 of the mounting head 24.

  However, even if the suction nozzles 62 and 122 of the same type are used, there are variations in dimensions. Also, the mounting unit 60 to which the suction nozzle 62 is mounted and the pickup unit 120 to which the suction nozzle 122 is mounted also have variations in dimensions. Therefore, the distance between the suction nozzle 62 of the mounting head 24 and the suction nozzle 122 of the pickup head 105 (hereinafter sometimes referred to as “distance between nozzles”) differs for each of the suction nozzles 62 and 122. When the die 92 is delivered, the die 92 may be damaged.

  Specifically, for example, as shown in FIG. 7, the suction nozzle 62a mounted on the mounting unit 60a of the mounting head 24 and the suction nozzle 122a mounted on the pickup unit 120a of the pickup head 105 face each other and are mounted. The suction nozzle 62b mounted on the unit 60b and the suction nozzle 122b mounted on the pickup unit 120b face each other, and the suction nozzle 62c mounted on the mounting unit 60c and the suction nozzle 122c mounted on the pickup unit 120c The case where the suction nozzle 62d mounted on the mounting unit 60d and the suction nozzle 122d mounted on the pickup unit 120d are opposed to each other will be described. The suction nozzles 62 and 122, the mounting unit 60, and the pickup unit 120 are arranged at an equal pitch on one circumference as described above. However, for easy explanation, in the drawings from FIG. The suction nozzles 62, 122 and the like are arranged on a straight line at an equal pitch. Further, the variation in dimensions of the suction nozzles 62, 122, etc. is shown to be extremely large.

  As can be seen from the figure, the distance between the nozzles is different for each of the suction nozzles 62 and 122. At this time, the distance between the suction nozzles 62d and 122d is the shortest, and the distance between the suction nozzles 62c and 122c is the longest. For this reason, when four dies 92 are simultaneously delivered from the pickup head 105 to the mounting head 24, the distance obtained by subtracting the thickness of the die 92 from the distance between the nozzles of the suction nozzles 62c and 122c, 4 of the mounting head 24. Two suction nozzles 62 are lowered simultaneously. As a result, the four suction nozzles 62 of the mounting head 24 can simultaneously hold and hold the four dies 92 from the four suction nozzles 122 of the pickup head 105. However, the suction nozzles 122 other than the suction nozzle 122c, in particular, the die 92 delivered from the suction nozzle 122d may be crushed by the suction nozzle 62d and damaged by receiving an excessive load.

  Further, in the electronic component mounting machine 10, as described above, the die 92 held by the suction nozzle 62 of the mounting head 24 is immersed in the flux stored in the flux tray 74, and the flux is applied to the bumps of the die 92. The At this time, in order to shorten the application time of the flux, the four suction nozzles 62 of the mounting head 24 are simultaneously lowered, and the flux is simultaneously applied to the bumps of the four dies 92 held by the four suction nozzles 62. . However, as can be seen from the figure, the tip positions of the four suction nozzles 62 of the mounting head 24, that is, the holding position of the die 92 are different in the vertical direction. For this reason, the vertical positions of the four dies 92 held by the four suction nozzles 62 are also different, and when the four dies 92 are immersed in the flux at the same time, the fluxes to the bumps are different for each die 92. Application amount is different. Thus, if the amount of flux applied to the bumps differs for each die 92, the die 92 may not be properly fixed to the circuit board.

  In such a case, if the vertical positions of the four suction nozzles 62 and 122 can be individually adjusted, the four dies 92 can be simultaneously attached to the mounting head 24 without applying an excessive load to the dies 92. It is possible to make it uniform, and to make the amount of flux applied to the bumps of each die 92 uniform. However, it is difficult to individually adjust the vertical positions of the four suction nozzles 62 and 122 due to problems such as a complicated mechanism, a large head, and an increase in cost. For this reason, in the electronic component mounting machine 10, the current components are used to simultaneously deliver the four dies 92 and uniformly apply the flux to the bumps without applying an excessive load to the dies 92. Realized.

  Specifically, before the mounting operation is performed, all the suction nozzles 62 used in the electronic component mounting machine 10 are sequentially mounted on each mounting unit 60 and each time the suction nozzle 62 is mounted on the mounting unit 60. The tip position of the suction nozzle 62 attached to the attachment unit 60 is calculated. Specifically, for example, when four suction nozzles 62a, 62b, 62c, and 62d are used in the electronic component mounting machine 10, the suction nozzle 62a is mounted on the mounting unit 60a, and other suction nozzles are used. 62b, 62c and 62d are accommodated in the nozzle tray 76 of the nozzle station 27. The suction nozzle 62a attached to the attachment unit 60a is imaged by the parts camera 28. As described above, the parts camera 28 is an apparatus that captures images by side light. Based on the imaging data from the parts camera 28, the tip position in the vertical direction of the suction nozzle 62 a mounted on the mounting unit 60 a is determined by the controller 162. Calculated.

  Next, when the tip position of the suction nozzle 62a is calculated, the mounting head 24 is moved above the nozzle tray 76, the suction nozzle 62a mounted on the mounting unit 60a, and the suction nozzle 62b housed in the nozzle tray 76. And are exchanged. That is, the suction nozzle 62b is mounted on the mounting unit 60a. The suction nozzle 62b mounted on the mounting unit 60a is imaged by the parts camera 28, and the tip position of the suction nozzle 62b is calculated by the controller 162. In this manner, the suction nozzles 62 are sequentially attached to the attachment unit 60a, and each time the suction nozzle 62 is attached, the tip position of the attached suction nozzle 62 is calculated. Thereby, the front-end | tip position for every four suction nozzles 62 with which the mounting unit 60a is mounted | worn is acquired.

  Next, the suction nozzle 62a is mounted on the mounting unit 60b, and the tip position of the suction nozzle 62a is also calculated by the controller 162 as described above. The suction nozzles 62b, 62c, and 62d are sequentially attached to the attachment unit 60b, and each time the suction nozzle 62 is attached, the tip position of the attached suction nozzle 62 is calculated. Thereby, the front-end | tip position for every four suction nozzles 62 with which the mounting unit 60b is mounted | worn is acquired. Further, in the mounting unit 60c and the mounting unit 60d, the tip positions of the four suction nozzles 62 mounted on the mounting unit 60c and the mounting unit 60d are acquired by the same method.

  Further, in the electronic component mounting machine 10, when four suction nozzles 122a, 122b, 122c, 122d are used, the suction nozzle 122a is mounted on the pickup unit 120a, and the other suction nozzles 122b, 122c, 122d. Are accommodated in the nozzle tray 156 of the nozzle station 108. Then, the suction nozzle 122a attached to the pickup unit 120a is lowered toward the touch sensor 109, and the tip position of the suction nozzle 122a is calculated by the controller 162 by the method described above. In the pickup unit 120a as well as the mounting unit 60 of the mounting head 24, the suction nozzles 122b, 122c, and 122d are sequentially mounted on the pickup unit 120a, and each time the suction nozzle 122 is mounted, the pickup unit 120a is mounted. The tip position of the suction nozzle 122 is calculated. Thereby, the front-end | tip position for every four suction nozzles 122 with which the pick-up unit 120a is mounted | worn is acquired. Also, in the pickup units 120b, 120c, and 120d, the tip positions of the four suction nozzles 122 attached to the pickup units 120b, 120c, and 120d are acquired by the same method.

  Thus, when the tip position for each suction nozzle 62 attached to each mounting unit 60 and the tip position for each suction nozzle 122 attached to each pickup unit 120 are calculated, it is attached to the four mounting units 60. The combination of the mounting unit 60 and the suction nozzle 62 is specified so that the tip positions of the four suction nozzles 62 are uniform in the vertical direction. Specifically, for example, for each of the four mounting units 60, the difference between the tip positions of the suction nozzles 62 is extracted within a preset threshold value X, and the suction nozzles 62 extracted for each of the four mounting units 60 are It is judged whether there is a duplication. When the suction nozzles 62 extracted for each of the four mounting units 60 do not overlap, the suction nozzle 62 extracted for each of the four mounting units 60 is a combination of the mounting unit 60 and the suction nozzle 62. Identified. Then, the suction nozzle 62 is mounted on the mounting unit 60 according to the specified combination. The attachment of the suction nozzle 62 to the attachment unit 60 is automatically performed at the nozzle station 27.

  At this time, for example, the suction nozzle 62b is specified for the mounting unit 60a, the suction nozzle 62a is specified for the mounting unit 60b, the suction nozzle 62d is specified for the mounting unit 60c, and the mounting unit 60d. On the other hand, when the suction nozzle 62c is specified, when the suction nozzle 62 is mounted on the mounting unit 60 in accordance with the specified combination, it is mounted on the four mounting units 60 as shown in FIG. The tip positions of the four suction nozzles 62 are uniform in the vertical direction. The tip positions of the four suction nozzles 62 are uniform in FIG. 8, but when the combination of the mounting unit 60 and the suction nozzle 62 is specified by the above method, the tip ends of the four suction nozzles 62. The difference in the vertical direction of the position is within the threshold value X.

  Further, the combination of the pickup unit 120 and the suction nozzle 122 is specified so that the tip positions of the four suction nozzles 122 mounted on the four pickup units 120 are uniform in the vertical direction. Specifically, for example, for each of the four pickup units 120, the difference between the tip positions of the suction nozzles 122 within a preset threshold Y (which may be the same as or different from X) is extracted, It is determined whether or not the suction nozzles 122 extracted for each of the four pickup units 120 overlap. When the suction nozzles 122 extracted for each of the four pickup units 120 do not overlap, the suction nozzles 122 extracted for each of the four pickup units 120 are combined as the pickup unit 120 and the suction nozzle 122. Identified. Then, the suction nozzle 122 is attached to the pickup unit 120 according to the specified combination. The attachment of the suction nozzle 122 to the pickup unit 120 is automatically performed at the nozzle station 108.

  At this time, for example, the suction nozzle 122d is specified for the pickup unit 120a, the suction nozzle 122a is specified for the pickup unit 120b, the suction nozzle 122c is specified for the pickup unit 120c, and the pickup unit 120d. On the other hand, when the suction nozzle 122b is specified, when the suction nozzle 122 is attached to the pickup unit 120 according to the specified combination, it is attached to the four pickup units 120 as shown in FIG. The tip positions of the four suction nozzles 122 are uniform in the vertical direction. The tip positions of the four suction nozzles 122 are uniform in FIG. 8, but when the combination of the pickup unit 120 and the suction nozzle 122 is specified by the above method, the tip ends of the four suction nozzles 122. The difference in the vertical direction of the position is within the threshold Y.

  In this way, the difference in the vertical direction of the tip positions of the four suction nozzles 62 of the mounting head 24 is set within the threshold value X, and the difference in the vertical direction of the tip position of the four suction nozzles 122 of the pickup head 105 is set within the threshold value Y. Thus, in the four suction nozzles 62 that receive the four dies 92 from the four suction nozzles 122, the difference in the inter-nozzle distance can be reduced. Note that the maximum difference in the distance between the nozzles in the four suction nozzles 62 is X + Y. Therefore, the threshold value X and the threshold value Y are set so that the maximum value (X + Y) does not become a load on the die 92.

  Thus, the combination of the mounting unit 60 and the suction nozzle 62 and the combination of the pickup unit 120 and the suction nozzle 122 are specified, and the suction nozzle 62 is mounted on the mounting unit 60 according to the specified combination, and the pickup unit By attaching the suction nozzle 122 to 120, simultaneous application of the four dies 92 and uniform application of flux to the bumps are realized without applying an excessive load to the die 92. In addition, the components required when the above method is adopted are a part camera 28, a touch sensor 109, and a controller 162. If the part camera 28 and the controller 162 are general electronic component mounting machines, they are usually used. Arranged. For this reason, by disposing the touch sensor 109, simultaneous delivery of the plurality of dies 92 and uniform application of the flux to the bumps can be achieved at low cost.

  The controller 162 of the control device 160 includes an acquisition unit 170 and a determination unit 172 as illustrated in FIG. The acquisition unit 170 is a functional unit for acquiring the tip positions of the plurality of suction nozzles 62 attached to each attachment unit 60 and the tip positions of the plurality of suction nozzles 122 attached to the pickup unit 120. The determination unit 172 is a functional unit for determining a combination of the mounting unit 60 and the suction nozzle 62 and a combination of the pickup unit 120 and the suction nozzle 122.

  Further, in the suction nozzles 62 and 122 used in the electronic component mounting machine 10, the difference between the nozzle distances of the four suction nozzles 62 may exceed (X + Y). Specifically, when the difference between the tip positions of the suction nozzles 62 within the threshold value X is not extracted for every four mounting units 60, the difference between the tip positions of the suction nozzles 62 is the threshold value X for every four mounting units 60. If the extracted suction nozzles 62 are overlapped even if those within are extracted, if the difference between the tip positions of the suction nozzles 122 is not within the threshold Y for each of the four pickup units 120, Even if the difference between the tip positions of the suction nozzles 122 within the threshold Y is extracted for each of the four pickup units 120, if the extracted suction nozzles 122 overlap, the nozzles in the four suction nozzles 62 The difference in distance exceeds (X + Y). That is, the difference in the distance between the nozzles of the four suction nozzles 62 increases, and the die 92 may be damaged.

  For this reason, in such a case, a screen indicating that the combination of the mounting unit 60 and the suction nozzle 62 and the combination of the pickup unit 120 and the suction nozzle 122 cannot be specified is displayed on the electronic component mounting machine 10. Are displayed on a display panel 180 (see FIG. 1). In addition, an operation button for selecting individual delivery of the die 92 is displayed on the screen instead of simultaneous delivery of the die 92. Then, when the operator operates the operation button, in the electronic component mounting machine 10, the four suction nozzles 62 of the mounting head 24 individually suck the die 92 from the four suction nozzles 122 of the pickup head 105. Hold. In other words, any one of the four suction nozzles 62 of the mounting head 24 is lowered according to the inter-nozzle distance of the suction nozzle 62, and of the four suction nozzles 122 of the pickup head 105. The die 92 is received from one suction nozzle 122. Then, one suction nozzle different from the arbitrary one suction nozzle 62 is individually lowered in order, whereby four dies 92 are held by the four suction nozzles 62.

  When the operator does not operate the operation button displayed on the display panel 180, the worker takes out at least one of the nozzle tray 76 and the nozzle tray 156 from the electronic component mounting machine 10, and the nozzle tray 76. 156, the suction nozzles 62 and 122 are replenished or replaced. Then, when the operator returns the nozzle trays 76 and 156 to the electronic component mounting machine 10, the mounting unit 60, the suction nozzle 62, and the suction nozzles 62 and 122 accommodated in the nozzle trays 76 and 156 again. And the combination of the pickup unit 120 and the suction nozzle 122 are specified.

  Incidentally, in the above-described embodiment, the electronic component mounting machine 10 is an example of an on-board working system. The mounting head 24 is an example of a second working head. The mounting unit 60 is an example of a second holder. The suction nozzle 62 is an example of a second component holder. The pickup head 105 is an example of a first work head. The pickup unit 120 is an example of a first holder. The suction nozzle 122 is an example of a first component holder. The control device 160 is an example of a control device. The acquisition unit 170 is an example of an acquisition unit. The determination unit 172 is an example of a determination unit.

  In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, the tip positions of the four suction nozzles 62 of the mounting head 24 are uniform in the vertical direction, and the tip positions of the four suction nozzles 122 of the pickup head 105 are the vertical direction. The combination of the mounting unit 60 and the suction nozzle 62 and the combination of the pickup unit 120 and the suction nozzle 122 are specified so that the tip positions of the suction nozzles 62 and 122 are uniform in the vertical direction. The combination of the mounting unit 60 and the suction nozzle 62 and the combination of the pickup unit 120 and the suction nozzle 122 are specified so that the difference in the distance between the four suction nozzles 62 and 122 is reduced. May be.

  Specifically, when the controller 162 calculates the tip positions of the plurality of suction nozzles 62 mounted on each mounting unit 60 and the tip positions of the plurality of suction nozzles 122 mounted on the pickup unit 120, the suction nozzles 62 are calculated. , 122, the distance between each of the plurality of suction nozzles 62 and each of the plurality of suction nozzles 122 is calculated for each of the mounting unit 60 and the pickup unit 120 corresponding to the mounting unit 60. The That is, for example, based on the tip positions of the plurality of suction nozzles 62a, 62b, 62c, 62d mounted on the mounting unit 60a and the tip positions of the plurality of suction nozzles 122a, 122b, 122c, 122d mounted on the pickup unit 120a. Thus, in the mounting unit 60a and the pickup unit 120a, the inter-nozzle distances between the suction nozzles 62a, 62b, 62c, and 62d and the suction nozzles 122a, 122b, 122c, and 122d are calculated. Also, in the mounting unit 60b and the pickup unit 120b, the mounting unit 60c and the pickup unit 120c, the mounting unit 60d, and the pickup unit 120d, the suction nozzles 62a, 62b, 62c, and 62d, and the suction nozzles 122a, 122b, 122c, and 122d, respectively. The inter-nozzle distance from each of these is calculated. Then, for each of the mounting unit 60 and the pickup unit 120, the one having a difference in nozzle distance within a preset threshold Z is extracted, and the mounting unit 60 and the suction nozzle used for the calculation of the extracted nozzle distance. 62 and the combination of the pickup unit 120 and the suction nozzle 122 are specified. If there is no overlap of the suction nozzles 62 and 122 in the specified combination, the suction nozzle 62 is mounted on the mounting unit 60 and the suction nozzle 122 is mounted on the pickup unit 120 according to the specified combination. As a result, as shown in FIG. 9, the tip positions of the suction nozzles 62 and 122 are not uniform in the vertical direction, but the difference in the distance between the four suction nozzles 62 and 122 is within the threshold value Z, and It is possible to guarantee simultaneous delivery of the die 92.

  In the above embodiment, the tip positions of the suction nozzles 62 and 122 attached to the mounting unit 60 and the pickup unit 120 are directly acquired. However, the tip positions of the mounting unit 60 and the pickup unit 120 are acquired. The tip positions of the suction nozzles 62 and 122 attached to the mounting unit 60 and the pickup unit 120 may be acquired by adding the axial length of the suction nozzles 62 and 122 to the tip position. Specifically, for example, similarly to the above-described method, four suction nozzles 62a, 62b, 62c, and 62d are sequentially attached to the attachment unit 60a, and each time the suction nozzle 62 is attached, the tip of the suction nozzle 62 is attached. The position is calculated. Further, the mounting unit 60 in a state where the suction nozzle 62 is not mounted is imaged, and the tip position of the mounting unit 60 is also calculated. Thereby, the axial length of the suction nozzle 62 is calculated by subtracting the tip position of the mounting unit 60 from the tip position of the suction nozzle 62 mounted on the mounting unit 60. Next, the mounting units 60b, 60c, and 60d in a state where the suction nozzle 62 is not mounted are imaged, and the tip position of the mounting unit 60 is also calculated. Then, by adding the calculated axial length of the suction nozzle 62 to the tip position of each mounting unit 60b, 60c, 60d, the suction nozzle 62 mounted on each mounting unit 60b, 60c, 60d. The tip position is acquired. In this way, by acquiring the tip positions of the suction nozzles 62 and 122 attached to the mounting unit 60 or the pickup unit 120, the number of times of imaging by the parts camera 28 and the number of times of detection of the suction nozzle 122 by the touch sensor 109 are reduced. It becomes possible.

  Further, by using the present invention, it is determined whether or not simultaneous delivery of a plurality of dies 92 can be executed by the suction nozzles 62 and 122 already mounted on each mounting unit 60 and each pickup unit 120. May be. Specifically, for example, the tip positions of the suction nozzles 62 and 122 that are already mounted on each mounting unit 60 and each pickup unit 120 are acquired using the part camera 28 or the touch sensor 109. Based on the tip positions of the suction nozzles 62 and 122, the distance between the four suction nozzles 62 and 122 is calculated, and the difference between the nozzle distances of the four suction nozzles 62 and 122 is within the threshold value Z. It is determined whether or not there is.

  At this time, for example, as shown in FIG. 8, when the suction nozzles 62 and 122 are attached to each mounting unit 60 and each pickup unit 120, the difference between the nozzle distances of the four suction nozzles 62 and 122 is It is determined that it is within the threshold value Z, and it is determined that simultaneous delivery of a plurality of dies 92 can be executed. For this reason, in such a case, the four suction nozzles 62 are simultaneously lowered so that the four suction nozzles 62 hold the four dies 92.

  On the other hand, as shown in FIG. 7, when the suction nozzles 62 and 122 are attached to each mounting unit 60 and each pickup unit 120, the difference between the nozzle distances of the four suction nozzles 62 and 122 is the threshold Z. It is determined that the number of the dies 92 has been exceeded, and it is determined that simultaneous delivery of the plurality of dies 92 cannot be executed. For this reason, in such a case, a screen indicating that simultaneous delivery of a plurality of dies 92 cannot be executed is displayed on the display panel 180. In addition, an operation button for selecting individual delivery of the die 92 is displayed on the screen instead of simultaneous delivery of the die 92. Then, when the operator operates the operation button, the four suction nozzles 62 are individually and sequentially lowered, whereby the four suction nozzles 62 hold the four dies 92. The four suction nozzles 62 may individually hold the dies 92 without displaying a screen or the like on the display panel 180.

  In the above embodiment, all the suction nozzles 62 of the mounting head 24 receive a plurality of dies 92 from all of the suction nozzles 122 of the pickup head 105 at the same time. Two or more of the suction nozzles 62 may simultaneously receive a plurality of dies 92 from two or more suction nozzles 122 of all the suction nozzles 122 of the pickup head 105. Specifically, for example, the two suction nozzles 62 of the mounting head 24 may simultaneously receive two dies 92 from the two suction nozzles 122 of the pickup head 105. Further, for example, when the mounting head 24 has two suction nozzles 62 and the pickup head 105 has four suction nozzles 122, the two suction nozzles 62 of the mounting head 24 are four of the pickup head 105. Two dies 92 may be received simultaneously from two of the two suction nozzles 122. For example, when the mounting head 24 has four suction nozzles 62 and the pickup head 105 has two suction nozzles 122, two of the four suction nozzles 62 of the mounting head 24. 62 may simultaneously receive two dies 92 from the two suction nozzles 122 of the pickup head 105.

  In the above embodiment, the calculation of the tip positions of the suction nozzles 62 and 122, the combination of the mounting unit 60 and the suction nozzle 62, and the like are executed by the control device 160 provided in the electronic component mounting machine 10. Various calculations can be performed by an information processing device or the like provided outside the mounting machine 10.

  In the above-described embodiment, the suction nozzles 62 and 122 are applied to the present invention. However, the present invention can be applied to a component gripper that grips a component with a plurality of claws such as a chuck. When a component gripping tool is applied, the part where the component is gripped by the component gripping tool is calculated by the controller 162 or the like.

  DESCRIPTION OF SYMBOLS 10: Electronic component mounting machine (to board | substrate work system) 24: Mounting head (2nd working head) 60: Mounting unit (2nd holder) 62: Suction nozzle (2nd component holder) 105: Pickup head (1st operation | work) Head) 120: Pickup unit (first holder) 122: Suction nozzle (first component holder) 160: Control device 170: Acquisition unit 172: Determination unit

Claims (2)

A first working head having a plurality of first holders and a plurality of first component holders detachably attached to the plurality of first holders;
A second working head having a plurality of second holders and a plurality of second component holders detachably attached to the plurality of second holders;
A control device, and
The first working head and the second working head are
The plurality of first component holders and the plurality of second component holders are arranged facing each other,
Two or more components held by at least two or more first component holders of the plurality of first component holders of the first work head are used as the plurality of second component holders of the second work head. In the board-to-board working system for simultaneously transferring to at least two of the second component holders,
The control device is
The holding position of the component by the first component holder when the plurality of first component holders are sequentially mounted on each of the plurality of first holders of the first work head, and the plurality of the second work heads An acquisition unit that acquires a holding position of a component by the second component holder when the plurality of second component holders are sequentially attached to each of the second holders;
In the two or more first component holders and the two or more second component holders that receive parts from the two or more first component holders, a holding position of the component by the first component holder, Based on the holding position acquired by the acquisition unit, the first holder so that a difference in distance from the holding position of the component by the second component holder that receives the component from the first component holder is reduced. And a determination unit that determines a combination of the first component holder and the combination of the second holder and the second component holder. The determination unit is
The acquisition unit so that the holding position of the parts by the two or more second part holders receiving parts from the two or more first part holders is uniform in the direction in which the axis of the second part holder extends. The on-board work system according to claim 1, wherein a combination of the first holder and the first component holder is determined based on the holding position acquired by the step.

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