JP4896757B2 - Surface mount machine - Google Patents

Description

  The present invention relates to a surface mounter including a movable head unit having a suction nozzle.

  Generally, as a surface mounter equipped with a movable head unit having a suction nozzle, the electronic component picked up by the suction nozzle is imaged by an image pickup means, and the suction shift of the electronic component with respect to the suction nozzle is recognized, and this suction shift is detected. It is known that an electronic component is mounted by obtaining a mounting position correction amount based on the amount and then moving the suction nozzle to the corrected position on the substrate.

  Conventionally, in such a surface mounting machine, if the suction displacement amount is large, the suction nozzle mounting position correction amount is also large, so if the density of electronic components on the substrate is high, the suction nozzle and the substrate are already mounted. There is a possibility that a defective substrate may be generated in which the electronic components interfere with each other and the mounted components are displaced or jumped off. FIG. 11 is an explanatory diagram when the density of the electronic components 92 on the substrate 93 is high and the suction nozzle 96a and the electronic component 92a already mounted on the substrate 93 interfere with each other, and FIG. ) Respectively show top views.

  In view of this, recently, there has been developed a configuration in which an electronic component is mounted on a substrate after the suction displacement of the electronic component sucked by the suction nozzle is corrected in advance.

For example, Patent Document 1 discloses a technique of an electronic component mounting apparatus configured to mount an electronic component on a substrate after the electronic component is pressed in advance on an alignment surface of an alignment tool to position the electronic component. Yes.
JP 2004-186385 A

  However, in the technique of the electronic component mounting apparatus disclosed in the above-mentioned Patent Document 1, the electronic component is positioned by pressing the electronic component against the alignment surface every time before the image pickup unit recognizes the suction displacement of the electronic component. Therefore, the productivity of the surface mounter has been lowered as a result of including the step of performing the alignment operation even for the electronic components that originally do not require the alignment operation.

  The present invention has been made in view of the above problems, and prevents the suction nozzle and the electronic component already mounted on the substrate from interfering with each other to prevent the tip of the suction nozzle or the electronic component already mounted on the substrate from being damaged. By preventing or reducing the generation of defective substrates and reducing unnecessary processes such as alignment operations even for electronic components that do not require alignment operations, maintaining a continuous and smooth mounting operation It is an object to provide a surface mounter capable of increasing the productivity of the surface mounter.

A surface mounting machine according to the present invention for solving the above-described problem includes a movable head unit having a suction nozzle capable of sucking an electronic component, and sucks the electronic component from the component supply unit by the suction nozzle of the head unit. At the same time, the electronic component picked up by the suction nozzle is picked up by an image pickup means, and the suction displacement of the electronic component with respect to the suction nozzle is recognized. A surface mounter that mounts electronic components by moving them to a corrected position on a substrate, and before the component suction operation in which the suction nozzle picks up the electronic components, the suction nozzle and the electronic components already mounted on the substrate If it is determined that the surface mounter will interfere with the electronic components already mounted on the substrate, Interference prevention process control means for changing the operation setting for the electronic component, and the interference prevention process control means includes the dimensions and coordinates of the suction nozzle and the dimensions and coordinates of the electronic parts already mounted on the substrate in the mounting process of the electronic components. In consideration of calculating a suction tolerance that is a suction error allowed when the suction nozzle picks up the electronic component in consideration of the suction nozzle and avoiding interference between the suction nozzle and the mounted electronic component. All reference values that are determined to be smaller in the above-mentioned adsorption allowable value are compared with a plurality of predetermined reference values that are different from each other in advance corresponding to a plurality of operation settings that are assumed to require setting changes. The operation setting corresponding to is changed.

  According to the surface mounting machine of the present invention, the interference prevention processing control means calculates a suction allowable value that is an allowable suction error when the suction nozzle sucks the electronic component, and this suction allowable value and a predetermined reference value If it is determined that there is a risk of interference between the suction nozzle and the electronic component already mounted on the board, the surface should be avoided to avoid interference between the suction nozzle and the mounted electronic component. Since the operation setting for controlling the mounting machine is changed, the suction nozzle and the electronic component mounted on the substrate do not interfere with each other, and the tip of the suction nozzle and the electronic component mounted on the substrate are not damaged. As a result, a continuous and smooth mounting operation can be maintained, and the productivity of the surface mounter is increased. Further, since the mounted electronic component is less likely to be damaged, the generation of a defective substrate can be prevented or reduced.

  In particular, before the component suction operation, the operation setting for controlling the surface mounter is changed so as to avoid the interference between the suction nozzle and the electronic component mounted on the board, so unnecessary steps are reduced. Will be able to.

  In this configuration, the head unit may include a plurality of suction nozzles. In this case, as the plurality of operation settings, a simultaneous suction reference for simultaneously sucking electronic components by the plurality of suction nozzles. Including the setting of the position and the setting of the suction operation of whether to perform simultaneous suction or continuous suction, the interference prevention processing control means, when the electronic components are simultaneously suctioned by the plurality of suction nozzles, A first reference value that is predetermined as a reference value corresponding to the setting of the suction reference position and a reference value that is predetermined as a reference value corresponding to the setting of the suction operation are smaller than the first reference value. A second reference value of each value is compared with the adsorbing allowance value, and the adsorbing allowance value of any of the suction nozzles is smaller than the first reference value and greater than or equal to the second reference value. If it is determined that there is a risk of interference between the suction nozzle and the electronic component already mounted on the board, the simultaneous suction reference position is changed to the suction head having the smallest suction allowable value and the suction coordinates are recalculated. On the other hand, if it is determined that the suction tolerance value of any suction nozzle is smaller than the second reference value and there is a risk of interference between the suction nozzle and the electronic component mounted on the board, simultaneous suction It is preferable that the setting of the suction operation is changed so that continuous suction is performed while stopping.

  According to this configuration, it is possible to reduce interference between the suction nozzle and the electronic component already mounted on the substrate while simultaneously sucking the plurality of electronic components to the plurality of suction nozzles. In addition, if the suction tolerance is a smaller value, the simultaneous suction is stopped and the continuous suction is performed, so that the interference between the suction nozzle and the electronic component already mounted on the board caused when the electronic parts are sucked simultaneously is prevented. It can be effectively reduced.

  The plurality of operation settings further include the setting of the coordinate position of the suction nozzle, and the interference prevention processing control means is further predetermined as a reference value corresponding to the setting of the coordinate position of the suction nozzle. A third reference value that is smaller than the second reference value is compared with the suction allowable value, and the suction allowable value of any suction nozzle is smaller than the second reference value and If it is determined that there is a risk of interference between the suction nozzle and the electronic component already mounted on the board, the suction operation setting is changed to stop simultaneous suction and perform continuous suction. And when the suction allowable value of any of the suction nozzles is smaller than the third reference value and it is determined that the suction nozzle and an electronic component already mounted on the substrate may interfere with each other. And electronic components If there is a direction avoidable interference is that the direction of avoiding interference is to change the suction coordinates of the suction nozzle is preferred.

  According to this configuration, if there is a direction that can avoid interference between the suction nozzle and the electronic component mounted on the board, the suction coordinates of the suction nozzle are changed. Interference can be reduced more effectively.

  Further, the plurality of operation settings further include a setting of a suction nozzle type, and the interference prevention processing control means further includes a reference set in advance as a reference value corresponding to the setting of the suction nozzle type. A fourth reference value that is smaller than the third reference value is compared with the suction allowance value, and the suction allowance value of any suction nozzle is smaller than the third reference value and the fourth reference value. Direction that can avoid interference if there is a direction that is greater than the reference value and that may cause interference between the suction nozzle and the electronic component already mounted on the board and that can avoid interference between the suction nozzle and the electronic component. The suction coordinate of the suction nozzle is changed, and the suction tolerance value of any suction nozzle is smaller than the fourth reference value, and it is determined that there is a possibility of interference between the suction nozzle and the electronic component already mounted on the board. Place The, it is preferred that is to replace the suction nozzle to a narrow adjacent dedicated nozzles small.

  According to this configuration, since the suction nozzle is replaced with a small narrow adjacent dedicated nozzle, it is possible to avoid the interference between the suction nozzle and the electronic component already mounted on the substrate, and to continue mounting the electronic component on the substrate. become.

  In the surface mounter, when the head unit includes a plurality of suction nozzles, the simultaneous suction reference position when the electronic components are simultaneously picked up by the plurality of suction nozzles as the plurality of operation settings. The setting of the suction operation, whether to perform simultaneous suction or continuous suction, the setting of the coordinate position of the suction nozzle, and the setting of the type of the suction nozzle. The suction allowable value is compared with a reference value corresponding to two or more operation settings of the plurality of operation settings, and based on the comparison, the content of a specific operation setting of the two or more operation settings is determined. It may be changed.

  In the surface mount machine as described above, after the electronic component sucked by the suction nozzle is image-recognized by the imaging unit, the mounting of the image-recognized electronic component on the substrate is performed. If it is determined that the electronic component already interferes with the electronic component, the component adsorption posture correction control means corrects the component adsorption posture so as to avoid interference between the adsorption nozzle and the electronic component already mounted on the board. The posture correction control means changes at least one of the suction position and the suction direction around the central axis of the suction nozzle by a correction device that corrects the relative position between the suction nozzle and the sucked electronic component alone or in cooperation with the suction nozzle. It is preferable that the

  According to this configuration, in order to avoid interference between the suction nozzle and the electronic component already mounted on the board, the relative position between the suction nozzle and the sucked electronic component is corrected independently or in cooperation with the suction nozzle. The at least one of the suction position and the suction direction around the suction nozzle center axis is changed by the correction device that is used, so that the suction nozzle and the electronic component already mounted on the board interfere with each other, and the tip of the suction nozzle or the The electronic parts will not be damaged. As a result, a continuous and smooth mounting operation can be maintained, and the productivity of the surface mounter is increased. Further, since the mounted electronic component is less likely to be damaged, the generation of a defective substrate can be prevented or reduced.

  In particular, after the image recognition of the electronic component, the correction device is moved to change at least one of the suction position or the suction direction around the suction nozzle central axis, so that the alignment operation is performed even for the electronic component that does not require the alignment operation. Unnecessary processes such as can be reduced.

  Here, the correction device is configured to bring the tip of the correction nail driven by the correction nail driving mechanism into contact with the electronic component adsorbed by the adsorption nozzle, or at least to move or rotate the adsorption nozzle while making contact. The component suction posture correction control means corrects the relative position between the suction nozzle and the sucked electronic component by causing the electronic component to be corrected by the image recognition of the suction state of the electronic component. When it is determined that correction is possible, it is preferable that the head unit moves to the correction device and moves the correction device to a suction position and a suction posture that do not interfere with each other.

  In this way, when it is determined that the electronic component can be corrected by the correction device based on the image recognition of the suction state of the electronic component, the head unit moves to the correction device, moves the correction device, and is driven by the correction nail drive mechanism. The suction position where the correction device moves and does not interfere by bringing the tip of the correction nail into contact with the electronic component sucked by the suction nozzle, or by moving or rotating the suction nozzle while making contact. Further, since the suction posture is adopted, it is possible to reduce interference between the suction nozzle caused by the suction deviation and the electronic component mounted on the substrate.

  In addition, the component suction posture correction control means can temporarily place the electronic component in consideration of the amount of suction deviation when it is determined that the electronic component can be re-sucked at the station by the image recognition of the suction state of the electronic component. Placed in a separate station and moving or further rotating the suction nozzle to the center position of the component, or moving or further rotating the suction nozzle to a predetermined position away from the center position of the component, there is no interference The suction position and the suction posture are preferred.

  In this way, the electronic component is placed in a temporary place where the suction nozzle is moved or further rotated to the center position of the component, or the suction nozzle is separated from the center position of the component. Since the suction position and the suction posture that do not interfere with each other are moved or rotated further, the interference between the suction nozzle caused by the suction deviation and the electronic component mounted on the substrate can be reduced.

  In addition, when the electronic component is determined to be re-suckable by the component supply unit based on the image recognition of the suction state of the electronic component, the component suction posture correction control unit takes the electronic component into account by taking the suction displacement amount into account. It is preferable that the component is returned to the supply unit, and the component is re-sucked to a suction position and a suction posture that do not interfere with the suction nozzle in the component supply unit.

  By doing this, the electronic component is returned to the component supply unit, and the component supply unit re-adsorbs the component to the adsorption position and the adsorption posture that do not interfere with the adsorption nozzle. Interference with electronic components can be reduced.

  As described above, the suction nozzle and the electronic components already mounted on the board interfere with each other, preventing the tip of the suction nozzle and the electronic components already mounted on the board from being damaged, thereby preventing the occurrence of defective substrates. In addition to reducing the number of unnecessary processes such as performing alignment operations not only for electronic components that do not require alignment operations, but also maintaining continuous smooth mounting work, Productivity can be increased.

  Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing a schematic configuration of a surface mounter 1 according to an embodiment of the present invention, and FIG. 2 is a side view showing a schematic configuration of the surface mounter 1. 3 is a block diagram showing the configuration of the control device 20 of the surface mounter 1, and FIG. 4 is a block diagram showing the configuration of the axis control unit 22 of the control device 20. As shown in FIG. FIG. 5 is an explanatory view showing an example of the posture of the electronic component 2 sucked by the suction nozzle 6a, wherein (a) shows a side view and (b) shows a top view. FIG. 6 is an explanatory view showing a schematic configuration of the correction device 16, wherein (a) shows a side view and (b) shows a top view.

  As shown in FIGS. 1 and 2, the surface mounter 1 according to the embodiment of the present invention includes a small electronic component 2 (FIGS. 5 and 6) and a large-sized electronic device having a larger dimension than this. A device for mounting components on a substrate 3, a substrate transport unit 4 disposed on a base 1 a for transporting the substrate 3, and a component supply unit for supplying a plurality of electronic components 2 and a plurality of large electronic components 5 and a head capable of moving between the component supply unit 5 and the substrate 3 by carrying a suction nozzle 6a (FIG. 2) capable of sucking the electronic component 2 and the large electronic component from the component supply unit 5. Unit 7 is provided.

  The surface mounter 1 further includes a component recognition device 8 as a means for recognizing the suction displacement of the electronic component 2 with respect to the suction nozzle 6a, and also recognizes the suction displacement of the large electronic component with respect to the suction nozzle 6a. As a means, a fixed camera 1b is provided on the base 1a.

  The surface mounter 1 also includes a correction device 16 that corrects the relative position between the suction nozzle 6a and the sucked electronic component 2, a station 17 on which the electronic component 2 can be temporarily placed, and a nozzle changer 18. Yes.

  The substrate transport means 4 has a pair of conveyors 4a and 4a for transporting the substrate 3 on the base 1a, and the substrate 3 carried by the conveyors 4a and 4a has a predetermined mounting work position (see FIG. And the electronic component 2 is mounted on the substrate 3 here.

  The component supply unit 5 includes a large number of tape feeders 5 a for supplying a plurality of electronic components 2 and a tray feeder 5 b for supplying a plurality of large electronic components on the side of the substrate transport means 4.

  Each of the tape feeders 5a has a reel on which small pieces of chip electronic components 2 such as ICs, transistors, capacitors and the like are stored and held at predetermined intervals, and the electronic components 2 are wound from the reels. It is configured to be intermittently drawn out and picked up by the suction nozzle 6a of the head unit 7.

  The tray feeder 5b accommodates therein a rectangular tray 5c on which a large electronic component such as QFP is placed. The tray 5c is pulled out to place the large electronic component on the tray 5c into the suction nozzle 6a of the head unit 7. It is comprised so that it may be picked up by. Although not shown in detail in the tray 5c, a plurality of component storage portions are provided in a matrix shape on the upper surface, and large electronic components are stored in these component storage portions, respectively.

  The suction state of the large electronic component sucked by the suction nozzle 6a is image-recognized from below by the fixed camera 1b arranged on the base 1a.

  The head unit 7 sucks and holds the electronic component 2 from the tape feeder 5a and the large electronic component from the tray feeder 5b by the suction nozzle 6a and conveys them to the substrate 3. In the present embodiment, Six mounting heads 6 each having a suction nozzle 6a in the head unit 7 are provided in a row at equal intervals in the X-axis direction (transport direction of the substrate transport means 4).

  The suction nozzle 6a is connected to a negative pressure generator (not shown) to generate a negative pressure state at the nozzle tip, and the negative pressure suction force can detachably hold the electronic component 2 by suction. It is configured.

  The suction nozzle 6a can be moved up and down (moved in the Z-axis direction) with respect to the head unit 7 by a nozzle lifting / lowering driving means (head Z-axis lifting / lowering motor 6b, FIG. 4). The R-axis raising / lowering motor 6c (FIG. 4) is configured to be able to rotate around the nozzle center axis (rotation around the R axis).

  Here, the head Z-axis raising / lowering motor 6b raises / lowers the suction nozzle 6a between a lowered position at the time of suction or mounting and an elevated position at the time of conveyance or imaging. 6c is for adjusting the posture of the electronic component 2 by rotating the suction nozzle 6a as necessary. The head Z-axis elevating motor 6b and the head R-axis elevating motor 6c are each composed of a servo motor and a predetermined power transmission mechanism.

  Then, the head unit 7 conveys the plurality of electronic components 2 and large electronic components sucked by these suction nozzles 6a between the component supply unit 5 and the substrate 3, and the electronic components 2 and large electronic components are transferred. One by one is mounted on the substrate 3. Therefore, the head unit 7 can move in the X-axis direction and the Y-axis direction (direction orthogonal to the X-axis direction) over a predetermined range of the base 1a.

  That is, the head unit 7 is supported so as to be movable along the X axis with respect to the mounting head support member 7a extending in the X axis direction. Further, both ends of the mounting head support member 7 a are supported by a fixed rail 9 in the Y-axis direction, and are movable along the fixed rail 9 in the Y-axis direction. The head unit 7 is driven by the X-axis servomotor 11 in the X-axis direction via the ball screw 12, and the mounting head support member 7 a is driven by the Y-axis servomotor 13 via the ball screw 14 in the Y-axis direction. Driven to.

  The component recognition device 8 sequentially captures the suction state of the electronic component 2 in the suction nozzle 6a when the head unit 7 transports the electronic component 2 sucked by the suction nozzle 6a from the component supply unit 5 to the target position. This is an apparatus provided in the head unit 7 for image recognition, and the scanning unit 8a and the location of details are not shown, but the illumination means 8e (FIG. 3) and the electronic component 2 provided integrally with the scanning unit 8a. And an imaging means 8f (FIG. 3) for taking an image of the lower surface.

  The scan unit 8a is a member provided so as to be able to move substantially in parallel with the row of suction nozzles 6a via a ball screw 8g by a servo motor (not shown) provided in the head unit 7.

  The illumination unit 8e is a device that illuminates illumination light in the direction of the electronic component 2 sucked by the suction nozzle 6a and illuminates the lower surface of the electronic component 2, and a plurality of light emitting diodes are employed as the lighting unit 8e.

  The imaging unit 8f is configured by a camera, such as a CCD line sensor camera, configured to individually capture the lower surface of the electronic component 2 that is sucked by the suction nozzle 6a and illuminated by the lighting unit 8e. 8f, when the electronic component 2 is sucked by the suction nozzle 6a in each component supply unit 5, the electronic component 2 is imaged from below the suction nozzle 6a while being transferred from each component supply unit 5 to the substrate 3. The captured image is subjected to image processing by an image processing unit 25 provided in the control device 20 (FIG. 3).

  In addition, although the adsorption | suction shift | offset | difference of the large sized electronic component adsorbed by the adsorption nozzle 6a is imaged with the fixed camera 1b arrange | positioned on the base 1a, this fixed camera 1b is comprised by the CCD camera, for example, and is large sized. When the electronic component is adsorbed by the adsorption nozzle 6a, the large electronic component is image-recognized from below the adsorption nozzle 6a while being transferred from the tray feeder 5b to the substrate 3.

  As shown in FIG. 6, the correction device 16 makes the tip 16 c of the correction nail 16 b driven by the correction nail driving mechanism 16 a contact or make contact with the electronic component 2 sucked by the suction nozzle 6 a. The device corrects the relative position between the suction nozzle 6a and the sucked electronic component 2 by moving or rotating the suction nozzle 6a.

  In the suction nozzle, there is a rare occurrence of suction displacement of the electronic component as shown in FIG. 5, and in this embodiment, the electronic device that has caused the suction displacement as shown in FIG. The posture is corrected by changing at least one of the suction directions around the central axis of the nozzle 6a.

  As shown in FIG. 1, the station 17 is a space provided on the base 1 a so that a large electronic component can be temporarily placed thereon, and a suction nozzle for the large electronic component temporarily placed on the station 17. By moving or further rotating 6a to the center position of the component, or by moving or further rotating the suction nozzle 6a to a predetermined position away from the center position of the component, the suction position and suction posture are set so as not to interfere with each other. It is configured.

  The nozzle changer 18 is an apparatus for exchanging the suction nozzle 6a with a small narrow adjacent dedicated nozzle when it is determined that the suction nozzle 6a and the electronic component 2a mounted on the substrate 3 may interfere with each other. As shown in FIG. 1, the head unit 7 is provided on the base 1a so as to be accessible upward.

  Next, the control device 20 of the surface mounter 1 will be described with reference to FIG.

  As shown in FIG. 3, the control device 20 includes a main control unit 21, an axis control unit 22, an illumination control unit 23, a camera control unit 24, and an image processing unit 25 as functional configurations.

  The main control unit 21 includes a well-known CPU that executes logical operations, a ROM that stores various programs for controlling the CPU in advance, a RAM that temporarily stores various data during operation of the apparatus, and the like. In accordance with a program stored in advance, the operation of the mounting machine is controlled in an integrated manner by controlling each device such as the board transport means 4, the component supply unit 5, the mounting head 6, the head unit 7, and the component recognition device 8. is there. In addition to the overall control of the operation of the mounting machine, the main control unit 21 serves as an interference prevention processing control means for avoiding interference between the suction nozzle and the electronic components already mounted on the board. Each component is controlled as component suction posture correction control means for correcting the component suction posture so as to avoid interference with mounted electronic components.

  The axis control unit 22 controls driving of various servo motors 31 such as the X-axis servo motor 11, the Y-axis servo motor 13, and the servo motor of the scan unit 8a while exchanging control signals with the main control unit 21. Each servo motor 31 is provided with an encoder 32, whereby the movement position of each part is detected and fed back to the axis control unit 22 as a control signal.

  The illumination control unit 23 controls the illumination unit 8e of the imaging unit 8f in accordance with the imaging of the electronic component 2 by the imaging unit 8f while exchanging control signals with the main control unit 21.

  The camera control unit 24 controls the imaging unit 8 f of the component recognition device 8 while exchanging control signals with the main control unit 21.

  The image processing unit 25 performs predetermined processing on the image signal output from the imaging unit 8f to generate image data suitable for component recognition, and outputs the image data to the main control unit 21. Then, the main control unit 21 recognizes an image of the adsorption deviation (adsorption error) of the electronic component 2 with respect to the adsorption nozzle 6a based on the image data output from the image processing unit 25, and corrects the mounting position based on the amount of adsorption deviation. Perform operations such as calculating quantities.

  Next, with reference to FIGS. 7-10, control and an effect | action of the surface mounter 1 which concern on embodiment of this invention are demonstrated.

  In the surface mounter 1 according to the embodiment of the present invention, the control device 20 comprehensively controls the operation of each part of the mounter.

  First, as shown in FIG. 1, the pair of conveyors 4a, 4a of the board transport means 4 carries the board 3 onto a predetermined mounting work position (position of the board 3 shown in the figure) on the base 1a. Here, the substrate 3 is temporarily stopped.

  Further, the head unit 7 moves from the component supply unit 5 to the substrate 3 with the suction nozzle 6 a sucking and holding the electronic component 2 supplied from the component supply unit 5, and mounts the electronic component 2 on the substrate 3. .

  Here, a control method of the surface mounter 1 when the electronic component 2 is mounted on the substrate 3 will be described. FIG. 7 is a flowchart showing a control method of the surface mounter 1 according to the embodiment of the present invention when the electronic component 2 is mounted on the substrate 3, and FIG. 8 is a flowchart showing the configuration of the interference prevention processing step S4. FIG. FIG. 9 is a flowchart showing the configuration of the component suction posture correction step S12.

  As shown in FIGS. 7 to 9, in this embodiment, the main control unit 21 of the control device 20, in addition to the overall control of the operation of the mounting machine, particularly the electronic components already mounted on the suction nozzle and the substrate. As an interference prevention processing control means for avoiding interference with the component, the component that executes the control of the interference prevention processing step S4 and corrects the component suction posture so as to avoid interference between the suction nozzle and the electronic component mounted on the substrate As the suction posture correction control means, the control of the component suction posture correction step S12 is executed.

  In the surface mounter 1 according to the embodiment of the present invention, as shown in FIG. 7, when the mounting operation is started, first, in step S1, the electronic component 2 is mounted on the mounting position on the substrate 3. The memory of the mounted flag, which is a flag indicating whether or not it is completed, is initialized, and the process proceeds to the routine after step S2. In step S2, the memory of the mounted flag is inspected to determine whether or not all mounting processing of the electronic component 2 has been completed. If YES, it is determined that all mounting processing of the electronic component 2 has been completed. The board 3 is released from the fixed state, the board 3 is unloaded from the surface mounter 1, and the mounting operation is completed in step S16.

  If NO in step S2, the mounted flag memory is inspected in step S3 to create a mounting group memory indicating a group of mounted electronic components 2, and this mounted mounting. In step S4, interference prevention processing is performed on the group. This interference prevention processing step S4 is performed when it is determined that the suction nozzle 6a and the electronic component 2a already mounted on the board 3 interfere with each other before the component suction operation in which the suction nozzle 6a sucks the electronic component 2. This is a step of avoiding interference between the nozzle 6a and the electronic component 2a already mounted on the substrate 3.

  In this interference prevention processing step S4, in consideration of the dimensions and coordinates of the suction nozzle 6a and the dimensions and coordinates of the electronic component 2a already mounted on the substrate 3 in the mounting process of the electronic component 2, the suction nozzle 6a The allowable suction values X, Y, and R, which are permissible suction errors at the time of suction, are calculated, and the allowable suction values X, Y, and R are smaller than a predetermined set value and mounted on the suction nozzle 6a and the substrate 3. When it is determined that there is a possibility of interference with the electronic component 2a, setting related to the control of the surface mounter 1 so as to avoid interference between the suction nozzle 6a and the electronic component 2a already mounted on the substrate 3 (Refer to the description of FIG. 8 described later for details).

  When the interference prevention processing step S4 in step S4 is completed, a component suction operation is performed in step S5, and a component recognition operation is performed in step S6.

  Then, in step S7, it is determined whether or not the recognition is OK, that is, whether or not the result of the image recognition is good. If NO, the component discarding operation is performed in step S8, and the process returns to step S2. In the case of YES, in step S9, the actual suction deviation amount is calculated, and the process proceeds to step S10, and the mounting possibility determination is performed in consideration of the calculated suction deviation amount.

  That is, in step S11, it is determined whether or not the electronic component 2 can be mounted. If NO, the process proceeds to step S12 to correct the component suction posture, and returns to step S6 to repeat the control from the component recognition operation. It is. In the case of YES, the mounting operation of the electronic component 2 is performed in step S13, the fact that the mounting is completed in step S14 is stored in the memory of the mounted flag, and the process returns to step S2 to return to the next electronic component 2 Control is repeated for.

  Here, the interference prevention processing step S4 is performed as follows.

  That is, as shown in FIG. 8, when the interference prevention process is started, when the head unit 7 simultaneously sucks the plurality of electronic components 2 by the plurality of suction nozzles 6a in step S41, the suction allowable value of the suction nozzle 6a. X, Y, and R, that is, the suction allowable values X, Y, and R, which are errors of the X coordinate, the Y coordinate, and the rotation angle R that are allowed when the suction nozzle 6a sucks the electronic component 2, respectively correspond to each other. It is determined whether or not it is equal to or greater than a predetermined first set value α (ΔXα, ΔYα, ΔRα; corresponding to the first reference value of the present invention). If YES, the process directly proceeds to step S43. In the case of NO, that is, any one of the suction allowable values X, Y, and R of the suction nozzle 6a is smaller than the corresponding first set value α (ΔXα, ΔYα, ΔRα), and the suction nozzle 6a and the substrate 3 If it is determined that there is a possibility of interference with the already mounted electronic component 2a, the process proceeds to step S42, the simultaneous suction reference position is changed to the head reference with the smallest allowable value, and the suction coordinates are recalculated. Then, the process proceeds to step S43.

  In step S43, it is determined whether the adsorption allowable values X, Y, and R are equal to or greater than the corresponding predetermined second set values β (ΔXβ, ΔYβ, ΔRβ). Proceed to S45. Further, in the case of NO, that is, any one of the allowable suction values X, Y, and R is smaller than the corresponding predetermined second set value β (ΔXβ, ΔYβ, ΔRβ), and is already mounted on the suction nozzle 6a and the substrate 3. If it is determined that there is a possibility of interference with the electronic component 2a, the process proceeds to step S44, where the suction speed is set to the suction allowable values X, Y, R and a predetermined second set value β (ΔXβ, ΔYβ, ΔRβ). The process proceeds to step S45 after being delayed according to the difference.

  Also, in step S45, whether or not the adsorption allowable values X, Y, and R are each equal to or greater than a corresponding predetermined third set value γ (ΔXγ, ΔYγ, ΔRγ; corresponding to the second reference value of the present invention). If YES and YES, the process proceeds to step S47 as it is. Further, in the case of NO, that is, any one of the allowable suction values X, Y, and R is smaller than the corresponding predetermined third set value γ (ΔXγ, ΔYγ, ΔRγ), and is already mounted on the suction nozzle 6 a and the substrate 3. If it is determined that there is a possibility of interference with the electronic component 2a, the process proceeds to step S46, and the operation setting is changed so as to stop simultaneous suction and perform continuous suction. Then, the process proceeds to step S47.

  In step S47, whether or not the adsorption allowable values X, Y, and R are all equal to or greater than the corresponding predetermined fourth set value κ (ΔXκ, ΔYκ, ΔRκ; corresponding to the third reference value of the present invention). If YES and YES, the process proceeds to step S49. Further, in the case of NO, that is, any one of the allowable suction values X, Y, and R is smaller than the corresponding predetermined fourth set value κ (ΔXκ, ΔYκ, ΔRκ), and is already mounted on the suction nozzle 6 a and the substrate 3. If it is determined that there is a possibility of interference with the electronic component 2a, the process proceeds to step S48, and if there is a direction in which the interference can be avoided, the suction coordinates are changed so as to shift in a direction in which the interference can be avoided, and then the process proceeds to step S49. move on. FIG. 10 is an explanatory view showing an example of mounting the electronic component 2 on the substrate 3 of the suction nozzle 6a in step S48, where (a) shows a side view and (b) shows a top view.

  In step S49, it is determined whether or not the adsorption allowable values X, Y, and R are equal to or greater than the corresponding predetermined fifth set values μ (ΔXμ, ΔYμ, ΔRμ; corresponding to the fourth reference value of the present invention). If the determination is YES, the process proceeds to step S43 and the interference prevention processing step S4 is terminated. In the case of NO, that is, any one of the suction allowable values X, Y, and R is smaller than the corresponding predetermined fifth set value μ (ΔXμ, ΔYμ, ΔRμ), and the suction nozzle 6a and the substrate 3 are already mounted. If it is determined that there is a possibility of interference with the electronic component 2a, the process proceeds to step S50, the suction nozzle 6a is replaced with a small narrow adjacent dedicated nozzle, and then the process proceeds to step S51 to complete the interference prevention process step S4. To do.

  It should be noted that the magnitude relationship between the predetermined set values is α> β> γ> κ> μ, that is, ΔXα> ΔXβ> ΔXγ> ΔXκ> ΔXμ, ΔYα> ΔYβ> ΔYγ> ΔYκ> ΔYμ, ΔRα> ΔRβ> ΔRγ > ΔRκ> ΔRμ is set.

  Next, as shown in FIG. 9, the component suction posture correction step S12 is performed as follows.

  That is, when the component suction posture correction process is started, it is determined in step S111 whether or not the electronic component 2 can be corrected by the correction device 16 by image recognition of the suction state of the electronic component 2, and if NO, the step is performed as it is. The process proceeds to S115. If YES, that is, if it is determined that the electronic component 2 can be corrected by the correction device 16 by image recognition of the suction state of the electronic component 2, the head unit 7 moves to the correction device 16 and moves to step S112. In S113, the suction device 6 is moved, and the suction nozzle 6a is moved by bringing the tip of the correction finger 16b driven by the correction finger driving mechanism 16a into contact with the electronic component 2 sucked by the suction nozzle 6a. By moving at least one of the movement and rotation, the suction position is adjusted to the center of the nozzle 6a, and then the process proceeds to step S114, and the component suction posture correction step S12 is ended.

  In step S115, whether or not the electronic component 2 can be re-sucked at the station 17 is determined by image recognition of the suction state of the electronic component 2. If NO, the process directly proceeds to step S118. In the case of YES, that is, when it is determined that the electronic component 2 can be re-sucked at the station 17 by image recognition of the suction state of the electronic component 2, in step S116, the electronic component 2 is taken into account by taking the suction deviation amount into consideration. In step S117, the suction nozzle 6a is moved or further rotated to the center position of the component, or the suction nozzle 6a is moved or further rotated to a predetermined position away from the center position of the component. By moving the suction position and the suction posture so as not to interfere, the process proceeds to step S114, and the component suction posture correction step S12 is completed.

  In step S118, it is determined whether or not the electronic component 2 can be re-sucked by the component supply unit 5 such as a reel or a tray by image recognition of the suction state of the electronic component 2. If NO, the process directly proceeds to step S121. Then, after discarding the electronic component 2, the next electronic component 2 is sucked in step S122, the process proceeds to step S114, and the component suction posture correcting step S12 is ended.

  In the case of YES, that is, when it is determined that the electronic component 2 can be re-sucked by the component supply unit 5 by image recognition of the suction state of the electronic component 2, in step S119, the electronic component is added in consideration of the suction displacement amount. 2 is returned to the component supply unit 5, and in step S120, the component supply unit 5 re-sucks the component to the suction position and suction posture that do not interfere with the suction nozzle 6a, and then proceeds to step S114, where the component suction posture correction step S12 is performed. finish.

  In the present embodiment, the small electronic component 2 is sucked by a part of the suction nozzles 6a, and the large electronic component is sucked by another suction nozzle 6a, and these components 2, 2a are mixed and fed. As for the electronic component 2, the component recognition is performed by the scan unit 8a as described above after the component is attracted, and before and after this, the large electronic component is imaged by the fixed camera 1b. Then, control is performed so that these components 2 and 2a are sequentially mounted on the board 3.

  As described above, according to the control method of the surface mounter 1 according to the embodiment of the present invention, the suction error allowed when the suction nozzle 6a sucks the electronic component 2 in the interference prevention processing step S4. The suction allowable values X, Y, and R are calculated, and the suction allowable values X, Y, and R are smaller than a predetermined set value, and there is a possibility that the suction nozzle 6a and the electronic component 2a mounted on the substrate 3 interfere with each other. If it is determined, the setting for controlling the surface mounter 1 is changed so as to avoid interference between the suction nozzle 6a and the mounted electronic component 2a, so that the suction nozzle 6a and the board 3 are already mounted. The electronic component 2a is not interfered with and damages the tip of the suction nozzle 6a or the electronic component 2a already mounted on the substrate 3. As a result, since a continuous and smooth mounting operation can be maintained, the productivity of the surface mounting machine 1 is increased. Further, since the mounted electronic component 2a is less likely to be damaged, the generation of a defective substrate can be prevented or reduced.

  In particular, since the setting for controlling the surface mounter 1 is changed so as to avoid interference between the suction nozzle 6a and the electronic component 2a mounted on the board 3 before the component suction operation, it is unnecessary. It is possible to reduce the number of processes.

  Further, it is determined that the suction allowable values X, Y, and R of the suction nozzle 6a are smaller than the predetermined first set value α, and the suction nozzle 6a and the electronic component 2a mounted on the substrate 3 may interfere with each other. In this case, the simultaneous suction reference position is changed to the head reference with the smallest allowable value, and the step of recalculating the suction coordinates is included, so that the plurality of electronic components 2 are simultaneously picked up by the plurality of suction nozzles 6a. The interference between the suction nozzle 6a and the electronic component 2a already mounted on the substrate 3 can be reduced.

  If it is determined that the suction allowable values X, Y, R are smaller than the predetermined second set value β and the suction nozzle 6a and the electronic component 2a mounted on the substrate 3 may interfere with each other, Since the suction speed is decreased according to the difference between the suction allowable value and the predetermined second set value, the interference between the suction nozzle 6a caused by the inertia of the suction nozzle 6a and the electronic component 2a already mounted on the substrate 3 is prevented. Can be reduced.

  If it is determined that the suction allowable values X, Y, R are smaller than the predetermined third set value γ and the suction nozzle 6a and the electronic component 2a mounted on the substrate 3 may interfere with each other, Since the operation setting is changed so that the simultaneous suction is stopped and the continuous suction is performed, the interference between the suction nozzle 6a and the electronic component 2a mounted on the board 3 when the electronic component 2 is simultaneously sucked can be reduced.

  Further, when it is determined that the suction allowable values X, Y, R are smaller than the predetermined fourth set value κ and the suction nozzle 6a and the electronic component 2a mounted on the substrate 3 may interfere with each other, If there is a direction in which interference can be avoided, the suction coordinates are changed so as to be shifted in a direction in which interference can be avoided, so that interference between the suction nozzle 6a and the electronic component 2a already mounted on the substrate 3 can be reduced.

  Further, when it is determined that the suction allowable values X, Y, R are smaller than the predetermined fifth set value μ and there is a possibility that the suction nozzle 6a and the electronic component 2a mounted on the substrate 3 may interfere with each other. Since the suction nozzle 6a is replaced with a small narrow adjacent dedicated nozzle, the electronic component 2 can be subsequently mounted on the substrate 3.

  Further, according to the control method of the surface mounter 1 according to the embodiment of the present invention, the single or the suction nozzle 6a and the suction nozzle 6a are arranged so as to avoid interference between the suction nozzle 6a and the electronic component 2a already mounted on the substrate 3. The correction device 16 that cooperates to correct the relative position between the suction nozzle 6a and the sucked electronic component 2 changes at least one of the suction position or the suction direction around the central axis of the suction nozzle 6a. And the electronic component 2a already mounted on the substrate 3 do not interfere with each other, and the tip of the suction nozzle 6a and the electronic component 2a mounted on the substrate 3 are not damaged. As a result, since a continuous and smooth mounting operation can be maintained, the productivity of the surface mounting machine 1 is increased. Further, since the mounted electronic component 2a is less likely to be damaged, the generation of a defective substrate can be prevented or reduced.

  In particular, after the image recognition of the electronic component 2, the correction device 16 is moved to change at least one of the suction position or the suction direction around the central axis of the suction nozzle 6a. As a result, unnecessary steps such as performing an alignment operation can be reduced.

  Further, at least one of moving or rotating the suction nozzle 6a by bringing the tip of the correction nail 16b driven by the correction nail driving mechanism 16a into contact with the electronic component 2 sucked by the suction nozzle 6a By moving the correction device 16, the suction position and the suction posture are set so as not to interfere with each other, so that the interference between the suction nozzle 6a and the electronic component 2a mounted on the substrate 3 caused by the suction deviation can be reduced.

  Further, the electronic component 2 is placed in a station 17 where temporary placement is possible, and at this station 17 the suction nozzle 6a is moved or further rotated to the center position of the component, or the suction nozzle 6a is separated from the center position of the component. By moving or further rotating the position, the suction position and the suction posture are set so as not to interfere with each other, so that the interference between the suction nozzle 6a and the electronic component 2a mounted on the substrate 3 caused by the suction shift can be reduced.

  Then, the electronic component 2 is returned to the component supply unit 5, and the component supply unit 5 re-sucks the component to the suction position and suction posture that do not interfere with the suction nozzle 6 a, so that the electronic component 2 is mounted on the suction nozzle 6 a and the substrate 3. Interference with the already-used electronic component 2a can be reduced.

  The above-described embodiment is merely a preferred specific example of the present invention, and the present invention is not limited to the above-described embodiment.

  For example, the configurations of the board conveying means 4, the component supply unit 5, the mounting head 6, the X-axis Y-axis drive mechanism of the head unit 7, the component recognition device 8 and the like do not limit the present invention, and various design changes Is possible.

  The correction device 16 is not necessarily limited to the shape shown in the figure. The apparatus is limited to a device that corrects the relative position between the suction nozzle 6a and the sucked electronic component 2 by bringing the tip of the correction nail 16b driven by the correction finger driving mechanism 16a into contact with the electronic component 2 sucked by the suction nozzle 6a. Not. After the electronic component 2 is image-recognized, if the relative position between the suction nozzle 6a and the electronic component 2a mounted on the substrate 3 can be corrected, for example, the suction nozzle 6a contacts the wall surface with the electronic component 2 It is also possible to employ an apparatus configured to change the position of the electronic component 2.

  In addition, in the interference prevention processing step S4, in the present embodiment, the magnitude relationship between the predetermined set values is α> β> γ> κ> μ, and as a result, step S41, step S43, step S45, Although control is performed in the order of step S47 and step S49, the magnitude relationship between the set values does not necessarily need to be α> β> γ> κ> μ. Therefore, the order of step S41, step S43, step S45, step S47, and step S49 can also be changed according to the corresponding predetermined set values α, β, γ, κ, and μ.

  In addition, it goes without saying that various design changes are possible within the scope of the claims of the present invention.

1 is a plan view showing a schematic configuration of a surface mounter according to an embodiment of the present invention. It is a side view which shows the structure of the outline of a surface mounter. It is a block diagram which shows the structure of the outline of the control apparatus of a surface mounter. It is a block diagram which shows the schematic structure of the axis | shaft control part of a control apparatus. It is explanatory drawing which shows the example of the attitude | position of the electronic component attracted | sucked by the suction nozzle, (a) is a side view, (b) has each shown the top view. It is explanatory drawing which shows the general | schematic structure of the correction apparatus, (a) is a side view, (b) has each shown the top view. It is a flowchart which shows the control method of the surface mounter which concerns on embodiment of this invention when mounting an electronic component on a board | substrate. It is a flowchart which shows the structure of interference prevention process process S4. It is a flowchart which shows the structure of components adsorption posture correction process S12. It is explanatory drawing which shows the example of the mounting by the interference prevention process process S4 of the electronic component with respect to the board | substrate of the suction nozzle by step S48, (a) is a side view, (b) has each shown the top view. It is explanatory drawing when the density of the electronic component on a board | substrate is high, and an adsorption nozzle and the electronic component already mounted in the board | substrate interfere, (a) shows a side view, (b) shows a top view, respectively. Yes.

DESCRIPTION OF SYMBOLS 1 Surface mounter 2 Electronic component 2a Mounted electronic component 3 Board | substrate 5 Component supply part 6a Adsorption nozzle 7 Head unit 8f Imaging means 16 Correction apparatus 16a Correction nail drive mechanism 16b Correction nail 17 Station 21 Main control part (interference prevention process control) Means, component adsorption posture correction control means)
X, Y, R Suction allowable value α First set value β Second set value γ Third set value κ Fourth set value μ Fifth set value

Claims (9)

Equipped with a movable head unit that has a suction nozzle that can pick up electronic components. The head unit picks up electronic components from the component supply unit and picks up the electronic components picked up by the pick-up nozzles with an imaging device. Then, the electronic component is mounted by moving the suction nozzle to the corrected position on the substrate after recognizing the image of the electronic component's suction displacement with respect to the suction nozzle and obtaining the mounting position correction amount based on the suction displacement amount. A surface mount machine,
If it is determined that the suction nozzle and the electronic component already mounted on the board interfere with each other before the component suction operation for sucking the electronic component, the interference between the suction nozzle and the electronic component already mounted on the board Comprising interference prevention processing control means for changing the operation setting for component adsorption related to the control of the surface mounter so as to avoid,
The interference prevention processing control means is allowed when the suction nozzle sucks the electronic component in consideration of the size and coordinates of the suction nozzle and the size and coordinates of the electronic component already mounted on the substrate in the mounting process of the electronic component. Calculates the suction tolerance value, which is a suction error, and handles each of the suction tolerance value and multiple operation settings that require setting changes to avoid interference between the suction nozzle and the mounted electronic component. And comparing a plurality of predetermined reference values having different values with each other, and changing the contents of the operation settings corresponding to all the reference values determined to be smaller in the adsorption allowable value. Surface mount machine. The head unit includes a plurality of suction nozzles,
The plurality of operation settings include setting of a simultaneous suction reference position when electronic parts are simultaneously picked up by the plurality of suction nozzles and setting of a suction operation for performing simultaneous suction or continuous suction. ,
When the electronic component is simultaneously picked up by the plurality of suction nozzles, the interference prevention processing control means is configured to set a first reference value predetermined as a reference value corresponding to the setting of the suction reference position and the setting of the suction operation. A second reference value that is a reference value that is predetermined as a reference value that is smaller than the first reference value is compared with the suction allowance value, and the suction allowance value of any suction nozzle is If it is determined that there is a risk of interference between the suction nozzle and the electronic component mounted on the substrate, which is smaller than the first reference value and greater than or equal to the second reference value, the simultaneous suction reference position is set to the suction position. While changing to the suction head with the smallest allowable value and recalculating the suction coordinates, the suction allowable value of any suction nozzle is smaller than the second reference value and mounted on the suction nozzle and the substrate. 2. The surface mounting according to claim 1, wherein when it is determined that there is a possibility of interference with a single electronic component, the setting of the suction operation is changed so that simultaneous suction is stopped and continuous suction is performed. Machine. The plurality of operation settings further include setting of the coordinate position of the suction nozzle,
The interference prevention process control means further provides a third reference value that is a reference value that is predetermined as a reference value corresponding to the setting of the coordinate position of the suction nozzle and that is smaller than the second reference value. Compared with the allowable value, the suction allowable value of any of the suction nozzles is smaller than the second reference value and greater than or equal to the third reference value, and the suction nozzle and the electronic component mounted on the substrate interfere with each other. If it is determined that there is a risk, the suction operation setting is changed so that simultaneous suction is stopped and continuous suction is performed, and the suction allowable value of any suction nozzle is smaller than the third reference value and the suction is performed. If it is determined that there is a risk of interference between the nozzle and the electronic component mounted on the board, and there is a direction that can avoid interference between the suction nozzle and the electronic component, the direction in which interference can be avoided Suction nozzle suction coordinates Surface mounting machine according to claim 2, characterized in that to change. The plurality of operation settings further include setting of the type of suction nozzle,
The interference prevention processing control unit further sets a fourth reference value that is a reference value that is predetermined as a reference value corresponding to the setting of the type of the suction nozzle and that is smaller than the third reference value, to the suction allowance. The suction allowable value of any of the suction nozzles is smaller than the third reference value and greater than or equal to the fourth reference value, and the suction nozzle and an electronic component already mounted on the substrate interfere with each other. If there is a direction that can avoid interference between the suction nozzle and the electronic component, the suction coordinates of the suction nozzle are changed in a direction that can avoid interference, and the suction tolerance value of any suction nozzle is When it is determined that there is a possibility that the suction nozzle and the electronic component already mounted on the substrate may interfere with each other, the suction nozzle is replaced with a small narrow dedicated nozzle. Claim 3 Surface mounting machine of the mounting. The head unit includes a plurality of suction nozzles,
As the plurality of operation settings, setting of a simultaneous suction reference position when electronic components are simultaneously picked up by the plurality of suction nozzles, setting of a suction operation for performing simultaneous suction or continuous suction, and coordinates of the suction nozzle Including setting of position and setting of type of suction nozzle,
The interference prevention process control means compares the suction allowable value with a reference value corresponding to two or more operation settings among the plurality of operation settings, and based on the comparison, out of the two or more operation settings. The surface mounter according to claim 1, wherein the content of the specific operation setting is changed. When it is determined that the suction nozzle and the mounted electronic component interfere when mounting the image-recognized electronic component on the substrate after the electronic component sucked by the suction nozzle is image-recognized by the imaging unit. It further comprises component suction posture correction control means for correcting the component suction posture so as to avoid interference between the suction nozzle and the electronic component already mounted on the board,
The component suction posture correction control means alone or in cooperation with the suction nozzle is used to correct at least the suction position or the suction direction around the suction nozzle central axis by a correction device that corrects the relative position between the suction nozzle and the sucked electronic component. The surface mounter according to claim 1, wherein one of them is changed. The correction device causes the tip of the correction nail driven by the correction nail driving mechanism to abut the electronic component adsorbed by the adsorption nozzle, or causes the adsorption nozzle to move or rotate while abutting. In order to correct the relative position between the suction nozzle and the sucked electronic component,
When it is determined that the electronic component can be corrected by the correction device based on the image recognition of the electronic component suction state, the component suction posture correction control means moves the correction unit and moves the correction device to interfere. The surface mounting machine according to claim 6, wherein the suction position and the suction posture are not set.   If the electronic component is determined to be re-suckable at the station by the image recognition of the suction state of the electronic component, the component suction posture correction control unit can temporarily place the electronic component in consideration of the suction displacement amount. In this station, the suction nozzle is moved to the center position of the component or further rotated, or the suction nozzle is moved or further rotated to a predetermined position away from the center position of the component, so that the suction position does not interfere. The surface mounter according to claim 6, wherein the surface mounter is in a suction posture. If it is determined that the electronic component can be re-sucked by the component supply unit based on the image recognition of the electronic component suction state, the component suction posture correction control unit takes the electronic component into consideration as a component supply unit. 9. The surface mounter according to claim 6, wherein the component is re-sucked to a suction position and a suction posture that do not interfere with the suction nozzle in the component supply unit.

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