CN207736544U - A kind of automatic test cutting all-in-one machine - Google Patents
A kind of automatic test cutting all-in-one machine Download PDFInfo
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- CN207736544U CN207736544U CN201721437727.1U CN201721437727U CN207736544U CN 207736544 U CN207736544 U CN 207736544U CN 201721437727 U CN201721437727 U CN 201721437727U CN 207736544 U CN207736544 U CN 207736544U
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- cutting
- silicon chip
- locating platform
- detection
- automatic test
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Abstract
The utility model provides a kind of automatic test cutting all-in-one machine, including feeding portion, detection cutting part and the blanking portion set gradually, the detection cutting part includes the testing agency being arranged according to this and cutting mechanism, the testing agency is for detecting silicon chip, for cutting the silicon chip after the detection, the feeding portion, the detection cutting part and the blanking portion are controlled by control system the cutting mechanism.The utility model has the beneficial effects that using automatic test cutting all-in-one machine, automatically it tested, cut, manual operation amount and operation intensity are reduced using equipment automatization, operator can take into account other equipment and carry out operation simultaneously, reduce personnel amount and personnel cost, the features such as security level is high.
Description
Technical field
The utility model belongs to conductor silicon chip technical field of mechanical automation, and one is cut more particularly, to a kind of automatic test
Body machine.
Background technology
With the development of semicon industry, the processing production capacity demand of circular semiconductor silicon chip increases increasingly, needs one kind certainly
Dynamicization degree is high, the high equipment of production efficiency, and realization carries out lower silicon slice automatically, and test is cut, lower turn, and substitution is artificial cumbersome
Manual working.Currently, round silicon chip adds man-hour requirement operating personnel by round silicon chip from a upper process in test, cutting action
It takes out in sheets used basket, and classifies according to fixed batch, model, by manually silicon chip is positioned in test equipment, carry out
Monolithic is tested, then will go to cutting action in the silicon chip tested, and carrying out pendulum by operator is manually adjusted, then carries out list
Piece is cut, and a process produces still further below.Entire detection correction, scribing correction, the process of loading and unloading and the complete hand of transfer process
Dynamic operation.This operation has the following disadvantages：
1. manual pendulum and taking piece, fragment rate is high；
2. manual pendulum takes piece, the hand of operator that can contact silicon chip and will produce pollution；
3. manual correction need to be equipped with special messenger and operate, the accumulation working efficiency of only elapsed-time standards can be promoted；
4. manual test, cutting intricate operation, efficiency is low, great work intensity, easily goes out error, causes damages.
Therefore, for manual test, cutting operation disadvantage, urgent need is a kind of to be replaced artificial pendulum using automation equipment, taking
Piece, correction, test, cutting action complete round silicon test, the automating of cutting work, integrated equipment.
Invention content
The purpose of this utility model is the problems in background technology to be solved, and provides a kind of automatic test cutting all-in-one machine.
In order to solve the above technical problems, the technical solution adopted in the utility model is：A kind of automatic test cutting all-in-one machine,
Including feeding portion, detection cutting part and the blanking portion set gradually, the detection cutting part includes the testing agency set gradually
And cutting mechanism, for detecting silicon chip, the cutting mechanism is described for cutting the silicon chip after the detection for the testing agency
Feeding portion, the detection cutting part and the blanking portion are controlled by control system.
Further, the testing agency includes probe card and rotation slide holder, and the probe card is set to the rotation
The top of slide holder, the rotation slide holder includes the feeding station circumferentially set gradually, positional stations, detection station and mark
Know station, the probe card is used to test the silicon slice under test in the detection station.
Further, the probe card includes the pcb board set gradually, third needle plate, the second needle plate and the first needle plate, institute
The bottom fixed setting probe of the first needle plate is stated, the probe is contacted with the silicon slice under test.
Further, the cutting mechanism includes laser cutting machine and locating platform, and fixture is arranged on the locating platform,
The fixture is for being clamped silicon chip, and the laser cutting machine is set to the top of the locating platform, for cutting the positioning
Silicon chip on platform.
Further, the locating platform includes X-axis locating platform, Y-axis locating platform and turntable, wherein：
The X-axis locating platform is for driving fixture to be moved in X-direction；
The Y-axis locating platform is for driving the fixture to be moved in Y direction；
The turntable drives the fixture to be moved in vertical direction, and the turntable drives the fixture rotation；
The X-axis locating platform, Y-axis locating platform and turntable are controlled by control system.
Further, the cutting mechanism further includes high power image-forming module and low power image-forming module, and the high power is imaged mould
Block is set to the bottom of the locating platform with the low power image-forming module, for acquiring silicon chip information.
Further, the detection cutting part further includes manipulator, described for the silicon chip tested to be placed into
On locating platform.
Further, the feeding portion includes the full magazine feeding device set gradually, lamination feeding device, the lamination
Feeding device includes vacuum cups, and the vacuum cups is delivered to the detection cutting part after drawing silicon chip piecewise.
Further, the feeding portion further includes sky magazine blanking device and lifting gear, and the lifting gear is set to
Described full between magazine feeding device and the lamination feeding device, the sky magazine blanking device is filled with the full magazine feeding
It sets and is arranged in parallel, the sky magazine blanking device is set to the bottom of the full magazine feeding device, and the lifting gear is in institute
It states and is slided between full magazine feeding device and the empty magazine blanking device, for driving magazine to lift.
Further, the blanking portion includes：
Transport mechanism, the silicon chip being used for transmission after cutting.
Waste material load station is set to the side of the transport mechanism, stores identified silicon chip；
Product load station is set to the other side of the transport mechanism, the silicon chip qualified for storing detection.
The utility model has the advantages and positive effects of, due to the adoption of the above technical scheme：
1. replacing artificial pendulum using automation equipment, taking piece, correction, test, cutting action, round silicon chip can be realized
Go up lower silicon slice automatically in detecting cutting action.
2. using automatic test cutting all-in-one machine, tested, cut automatically, manual work is reduced using equipment automatization
Amount and operation intensity, operator can take into account other equipment and carry out operation simultaneously, reduce personnel amount and personnel cost, safety level
The features such as not high.
3. the high loss of fragment rate caused by eliminating manual work error has the advantages that stability is high, production efficiency is high,
Also wafer contamination caused by can avoid manual working has very high practical value.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the structural schematic diagram in the utility model feeding portion；
Fig. 3 is the structural schematic diagram of the utility model probe card；
Fig. 4 is the structural schematic diagram of the utility model laser cutting machine；
Fig. 5 is the overlooking structure diagram of the utility model rotation slide holder.
In figure：
1, feeding portion 2, detection cutting part 3, blanking portion
11, full magazine feeding device 12, empty magazine blanking device 13, lifting gear
14, feed mechanism 21, pcb board 22, third needle plate are stacked
23, the second needle plate 24, the first needle plate 25, cushion block
26, probe 31, fixture 32, turntable
33, X-axis locating platform 34, Y-axis locating platform 35, high power image-forming module
36, low power image-forming module 41, feeding station 42, positional stations
43, detection station 44, mark station
Specific implementation mode
As shown in Figure 1, a kind of automatic test cutting all-in-one machine of this example, including set gradually feeding portion 1, detection cutting
Portion 2 and blanking portion 3, detection cutting part 2 include testing agency and cutting mechanism, and testing agency is for detecting silicon chip, cutting mechanism
For cutting the silicon chip after detecting, feeding portion 1, detection cutting part 2 are controlled by PLC control system with blanking portion 3.
As shown in Fig. 2, feeding portion 1 includes the full magazine feeding device 11 set gradually and stacking feed mechanism 14, wherein
Full magazine feeding device 11, is controlled when supplied materials is the piece basket form for sticking with silicon chip by PLC for the silicon chip in extracting sheet basket
System control setting feeding manner processed is piece basket feeding, and the full magazine feeding device of equipment identification can be by the silicon in piece basket after having piece basket
Piece is extracted out.Feed mechanism 14 is stacked, feed mechanism is stacked and also PLC control system is used to control, including vacuum cups, for that will fold
To detection cutting part, means of transportation uses Belt Conveying for transport after the silicon chip of sheet form is drawn piecewise by vacuum cups, and
Sensor is set in the initiating terminal of belt, sensor is connect with control system, and whether there is or not silicon chips to need to convey for perceiving.
Further include sky magazine blanking device 12, empty magazine blanking device 12 and full magazine feeding device 11 are arranged in parallel, empty
Magazine blanking device 12 is set to full 11 bottom of magazine feeding device, further includes lifting gear 13, and lifting gear is expected for lifting
Box, lifting gear are set between full magazine feeding device 11 and the lamination feeding device 14, and the setting of magazine lifting platform 13 exists
Between full magazine feeding device 11 and stacking feed mechanism 14, magazine lifting platform 13 is under full magazine feeding device 11 and empty magazine
It is slided up and down between material device 12, to drive magazine to lift.
Detection cutting part 2 includes the testing agency set gradually and cutting mechanism, wherein testing agency includes probe card 2
With rotation slide holder, the probe card be set to it is described rotation slide holder top, the rotation slide holder including circumferentially according to
Feeding station, positional stations, detection station and the mark station of secondary setting, the probe card is for testing the detection station
The silicon slice under test.
Probe card is used to test silicon slice under test in detection station 43, as shown in figure 3, probe card includes from top to bottom successively
Pcb board 21, third needle plate 22, the second needle plate 23 and the first needle plate 24 of setting, wherein pcb board is integrated circuit board, is welded thereon
Multiple electronic components are connect to realize that electrical function, third needle plate 22 and the second needle plate 23 are used for coarse positioning, the first needle plate 24 is used
Probe is fixedly installed in the bottom of fine positioning, the first needle plate 24, probe 26 is contacted with silicon slice under test, and probe 26 is 200-2000
It is a, quickly silicon chip can be detected, greatly shorten detection time, increase production efficiency, probe 26 is imperial crown head probe, is prevented
Probe is blocked by foul, and cushion block 25 is arranged between third needle plate 22 and the second needle plate, is adjusted by cushion block 25, probe 26 is made to reach
Basic fixed position, and cushion block 25 can reduce heat transfer, and the first needle plate 24 after the adjustment is accurately positioned, and makes its lower installation
Multiple probes 26 reach exact position, and the piece basket supplied materials for filling round silicon chip need to be only placed on by operating personnel during operation
Feeding station simultaneously positions, and after confirming equipment state, presses start button, the state that equipment detects upper tablet basket automatically is laggard
Row operates in next step, greatly reduces the operation difficulty and tired degree of operating personnel, effectively improves production efficiency.
As shown in figure 5, rotation slide holder 4 includes the feeding station 41 circumferentially set gradually, positional stations 42, detection work
Position 43 and mark station 44, mark station 44 are set as INK marks, rotation slide holder 4 realize the transmission of round silicon chip, test, under
Round silicon chip, the fixed position of rotation slide holder 4 is positioned over via manipulator 1 by the automation turned, and rotation slide holder 4 uses vacuum
Silicon chip is fixed, after three axial adjustment, is tested by 2 Multi probe of probe card, the tattooing needle of station is then identified into rower by INK
Know, then turn, it further includes manipulator to detect in cutting part 2, and the silicon chip tested is placed into locating platform with manipulator
First-class to be cut, manipulator is connect with motor, is operated using manipulator by motor control, can be realized that round silicon chip is detecting
Automatic loading/unloading in process, solve in the prior art manually pendulum, take piece, reduce manual operation amount and operation intensity,
Also wafer contamination caused by can avoid manual working saves personnel, security level height.
Cutting mechanism includes laser cutting machine and locating platform, and laser cutting machine uses femto-second laser or picosecond laser
Device, wherein second laser or picosecond laser to cutting speed≤450mm/s of silicon chip, to 25 μm of the cutting width of silicon chip~
45 μm, depth of cut is the 25%~50% of silicon wafer thickness.The laser head power of femto-second laser or picosecond laser：15W~
25W, laser head tranmitting frequency 60KHz~80KHz ensure cutting accuracy and cutting efficiency, and it is flat that laser cutting machine is set to positioning
The top of platform, for cutting the silicon chip on locating platform from the top of silicon chip to be cut.
As shown in figure 4, fixture 31 is arranged on locating platform, fixture 31 includes X-axis positioning for silicon chip, locating platform to be clamped
Platform 33, Y-axis locating platform 34 and turntable 32, wherein：X-axis locating platform 33 is for driving fixture to be moved in X-direction；Y-axis
Locating platform 34 is for driving the fixture to be moved in Y direction；Using X-axis locating platform 33 and Y-axis locating platform 34 to folder
Silicon chip on tool 31 carries out level correction, carries out depth correction to the silicon chip on fixture 31 using turntable 32, turntable 32 drives folder
Tool 31 is moved in vertical direction, and during cutting, and the pendulum that the rotation of fixture 31 passes through fixture 31 is driven by turntable 32
It moves to cut silicon chip to be cut；X-axis locating platform 33, Y-axis locating platform 34 and turntable 32 pass through PLC control system control
System, cutting mechanism further include high power image-forming module 35 and low power image-forming module 36, high power image-forming module 35 and low power image-forming module
36 are set to the bottom of locating platform, the groove information for acquiring silicon chip bottom, ensure the cutting line and silicon of silicon chip upper surface
Piece undercut position corresponds to.
Blanking portion 3 includes transport mechanism, and transport mechanism uses belt transport, the silicon chip being used for transmission after cutting, waste material dress
Station is carried, the side of the transport mechanism is set to, stores identified silicon chip；Product load station is set to the transmission
The other side of mechanism, the silicon chip qualified for storing detection, blanking portion are connect with PLC control system, pass through setting in blanking portion
Identification device identifies ink dot silicon chip, the qualified storage with ink dot silicon chip, wherein identification device can be CCD industrial cameras or its
The equipment that he can identify product surface ink dot.
The course of work of this example：Feeding portion passes through PLC controller control from piece basket feeding or lamination feeding, material-uploading style
Silicon chip, is sent to detection cutting part by system piecewise, and round silicon chip is positioned over to the feeding station of rotation slide holder via manipulator,
Rotation slide holder is fixed silicon chip using vacuum, and rotation slide holder rotates a station, silicon chip is sent to positional stations, through three
Axis calibration, then rotate a station to detection station, electrical testing is carried out by probe card Multi probe to silicon chip, after being completed under
INK mark stations are gone to, defective products are identified using tattooing needle, then transfer and be sent to cutting mechanism, in cutting mechanism
Groove information through high power image-forming module and low power image-forming module acquisition silicon chip bottom, sends PLC control system, PLC controls to
The information that system is acquired according to image-forming module, by the fixture of fixed silicon chip through X-axis locating platform, Y-axis locating platform and turntable
Effect, with laser cutting machine to being just cut by laser afterwards, the silicon chip after cutting is sent to blanking portion by feed belt.
The utility model has the beneficial effects that：1. replacing artificial pendulum using automation equipment, taking piece, correction, test, cut
Action is cut, can realize that round silicon chip goes up lower silicon slice automatically in detecting cutting action.
2. using automatic test cutting all-in-one machine, tested, cut automatically, manual work is reduced using equipment automatization
Amount and operation intensity, operator can take into account other equipment and carry out operation simultaneously, reduce personnel amount and personnel cost, safety level
The features such as not high.
3. the high loss of fragment rate caused by eliminating manual work error has the advantages that stability is high, production efficiency is high,
Also wafer contamination caused by can avoid manual working has very high practical value.
4. test section coordinates probe card using rotation slide holder, it is provided with 200-2000 probe on probe card, greatly
Fast detection speed, improves production efficiency, has test speed fast, identifies bad products, the high advantage of stability automatically.
One embodiment of the utility model is described in detail above, but the content is only the utility model
Preferred embodiment should not be considered as limiting the scope of the present invention.It is all to be made according to application scope of the utility model
All the changes and improvements etc., should all still belong within the patent covering scope of the utility model.
Claims (10)
1. a kind of automatic test cutting all-in-one machine, it is characterised in that：Including feeding portion, detection cutting part and the blanking set gradually
Portion, the detection cutting part include the testing agency set gradually and cutting mechanism, and the testing agency is for detecting silicon chip, institute
Cutting mechanism is stated for cutting the silicon chip after the detection, the feeding portion, the detection cutting part and the blanking portion are logical
Cross control system control.
2. automatic test cutting all-in-one machine according to claim 1, it is characterised in that：The testing agency includes probe card
With rotation slide holder, the probe card be set to it is described rotation slide holder top, the rotation slide holder including circumferentially according to
Feeding station, positional stations, detection station and the mark station of secondary setting, the probe card is for testing the detection station
Silicon slice under test.
3. automatic test cutting all-in-one machine according to claim 2, it is characterised in that：The probe card includes setting gradually
Pcb board, third needle plate, the second needle plate and the first needle plate, the bottom of first needle plate is fixedly installed probe, the probe with
The silicon slice under test contact.
4. according to any automatic test cutting all-in-one machines of claim 1-3, it is characterised in that：The cutting mechanism includes
Fixture is arranged on the locating platform for laser cutting machine and locating platform, and the fixture is for being clamped silicon chip, the laser cutting
Machine is set to the top of the locating platform, for cutting the silicon chip on the locating platform.
5. automatic test cutting all-in-one machine according to claim 4, which is characterized in that the locating platform includes that X-axis is fixed
Bit platform, Y-axis locating platform and turntable, wherein：
The X-axis locating platform is for driving fixture to be moved in X-direction；
The Y-axis locating platform is for driving the fixture to be moved in Y direction；
The turntable drives the fixture to be moved in vertical direction, and the turntable drives the fixture rotation；
The X-axis locating platform, Y-axis locating platform and turntable are controlled by control system.
6. automatic test cutting all-in-one machine according to claim 5, it is characterised in that：The cutting mechanism further includes high power
Image-forming module and low power image-forming module, the high power image-forming module are set to the locating platform with the low power image-forming module
Bottom, for acquiring silicon chip information.
7. automatic test cutting all-in-one machine according to claim 4, it is characterised in that：The detection cutting part further includes machine
Tool hand, for the silicon chip tested to be placed into the locating platform.
8. automatic test cutting all-in-one machine according to claim 1, it is characterised in that：The feeding portion includes setting gradually
Full magazine feeding device, lamination feeding device, the lamination feeding device includes vacuum cups, and the vacuum cups is by silicon chip
It is delivered to the detection cutting part after drawing piecewise.
9. automatic test cutting all-in-one machine according to claim 8, which is characterized in that the feeding portion further includes sky magazine
Blanking device and lifting gear, the lifting gear be set to the full magazine feeding device and the lamination feeding device it
Between, the sky magazine blanking device is arranged in parallel with the full magazine feeding device, and the sky magazine blanking device is set to institute
State the bottom of full magazine feeding device, the lifting gear the full magazine feeding device and the empty magazine blanking device it
Between slide, for driving magazine to lift.
10. automatic test cutting all-in-one machine according to claim 1, which is characterized in that the blanking portion includes：
Transport mechanism, the silicon chip being used for transmission after cutting；
Waste material load station is set to the side of the transport mechanism, stores identified silicon chip；
Product load station is set to the other side of the transport mechanism, the silicon chip qualified for storing detection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721437727.1U CN207736544U (en) | 2017-11-01 | 2017-11-01 | A kind of automatic test cutting all-in-one machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721437727.1U CN207736544U (en) | 2017-11-01 | 2017-11-01 | A kind of automatic test cutting all-in-one machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207736544U true CN207736544U (en) | 2018-08-17 |
Family
ID=63114219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721437727.1U Active CN207736544U (en) | 2017-11-01 | 2017-11-01 | A kind of automatic test cutting all-in-one machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207736544U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109747054A (en) * | 2017-11-01 | 2019-05-14 | 天津环鑫科技发展有限公司 | A kind of automatic test cutting all-in-one machine |
| CN110739216A (en) * | 2019-10-28 | 2020-01-31 | 东莞记忆存储科技有限公司 | Processing method for single-shaft step-by-step cutting wafers |
-
2017
- 2017-11-01 CN CN201721437727.1U patent/CN207736544U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109747054A (en) * | 2017-11-01 | 2019-05-14 | 天津环鑫科技发展有限公司 | A kind of automatic test cutting all-in-one machine |
| CN110739216A (en) * | 2019-10-28 | 2020-01-31 | 东莞记忆存储科技有限公司 | Processing method for single-shaft step-by-step cutting wafers |
| CN110739216B (en) * | 2019-10-28 | 2022-03-29 | 东莞记忆存储科技有限公司 | Processing method for single-shaft step-by-step wafer cutting |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220511 Address after: 214200 No. 2, Wenzhuang Road, Qiting street, Yixing City, Wuxi City, Jiangsu Province Patentee after: Jiangsu Huanxin Semiconductor Co.,Ltd. Address before: 300380 2nd floor, block a, No.12 Haitai East Road, Huayuan Industrial Zone, Xiqing District, Tianjin Patentee before: TIANJIN HUANXIN TECHNOLOGY & DEVELOPMENT Co.,Ltd. |
|
| TR01 | Transfer of patent right |