CN218867047U - Substrate processing apparatus and semiconductor production line - Google Patents

Abstract

The utility model belongs to the technical field of the semiconductor, a base plate treatment facility and semiconductor production line are disclosed. The substrate is taken out of the feeding device through the transfer device, then the substrate passes through the thickness measuring device, the cutting device and the marking device, in the thickness measuring stage, if the thickness of the substrate exceeds a preset value, the transfer device can place the substrate into a poor grade, if the thickness of the substrate is qualified, the substrate is placed into a good grade after being processed by the cutting device and the marking device, so that the accurate control of the thickness and the size parameters of the substrate is realized simultaneously, the marking operation is performed on the substrate simultaneously, the rapid identification of each substrate by a subsequent station is facilitated, the subsequent station is convenient to perform corresponding plastic package powder compensation operation on the substrates with different thicknesses, and the consistency of products is ensured. The semiconductor production line can use qualified substrates and perform corresponding subsequent processing according to the information of the substrates by adopting the substrate processing equipment, so that the consistency of products is ensured.

Description

Substrate processing apparatus and semiconductor production line

Technical Field

The utility model relates to the field of semiconductor technology, especially, relate to a substrate treatment facility and semiconductor production line.

Background

In the advanced encapsulation of fan-out type, need use the base plate when shifting the chip, if the thickness of base plate is too thick, then can lead to final product size deviation to appear, if the thickness of base plate is too thin, can lead to the chip to connect unstablely on the base plate, and the thickness of base plate can influence the addition of later stage plastic packaging powder, and the plastic packaging powder is used for making level all base plate thickness, so must guarantee that the thickness of base plate is in a reasonable within range. Meanwhile, in order to facilitate material management and information tracking, it is also necessary to add information codes on the substrate, the size of the original substrate is not consistent with the processing requirement, and the substrate with a reasonable size can be used only by processing the substrate, so that an automatic device integrating thickness measurement, cutting, marking and sorting is needed. The flow of defective substrates into a downstream production line is avoided.

Therefore, it is desirable to design a substrate processing apparatus and a semiconductor manufacturing line to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a substrate treatment facility can carry out the systematization to the base plate and handle, selects out qualified base plate to can let next station discern the base plate.

To achieve the purpose, the utility model adopts the following technical proposal:

a substrate processing apparatus comprising:

a frame body;

the feeding device is arranged on the frame body and used for storing a plurality of substrates;

the thickness measuring device is arranged on the frame body and is used for measuring the thickness of the substrate;

the cutting device is arranged on the frame body and used for cutting the substrate into preset sizes;

the marking device is arranged on the frame body and used for marking the substrate;

the blanking device comprises a good grade and a poor grade, and the good grade and the poor grade are both arranged on the frame body; and

and the transfer device is arranged on the frame body, can grab the substrate in the feeding device, and can switch among the thickness measuring device, the cutting device and the marking device so as to selectively sort the substrate into the good grade and the poor grade.

Preferably, the thickness measuring device includes:

the first base is arranged on the frame body;

a first stage mounted on the first base, the transfer device being capable of placing the substrate on the stage, the stage being provided with a via hole;

the first thickness measuring mechanism is arranged above the via hole along the vertical direction; and

and the first thickness measuring mechanism and the second thickness measuring mechanism can measure the thickness of the substrate together, and the transfer device can selectively transfer the substrate to the next station or the difference grade according to the thickness of the substrate.

Preferably, the thickness measuring device further includes a first guide rail mounted on the first base and extending in the vertical direction, a relative position of the first thickness measuring mechanism and the first guide rail in the vertical direction is adjustable, and a relative position of the second thickness measuring mechanism and the first guide rail in the vertical direction is adjustable.

Preferably, the cutting device includes:

a second stage on which the substrate can be placed by the transfer device and which is attracted by the second stage, the second stage being slidably coupled to the frame body along a first direction; and

and a cutting mechanism mounted on the frame and disposed on one side of the second stage along the first direction, the cutting mechanism being configured to cut the substrate.

Preferably, the cutting mechanism includes:

a second base mounted on the frame body and disposed at one end of the second stage along the first direction;

a first transverse moving module mounted on the second base, the first transverse moving module being capable of moving along a second direction, the second direction being perpendicular to the first direction; and

the first vertical moving module comprises a first driving piece and a cutting piece, the first driving piece is installed on the transverse moving module, the cutting piece is in transmission connection with the output end of the first driving piece, and the first driving piece can drive the cutting piece to move in the vertical direction.

As a preferred aspect, the cutting device further includes a scrap collecting device, the scrap catching groove is formed outside the second carrying platform, and the scrap collecting device includes:

a third base installed on the frame body;

a second traverse module mounted on a third base, the second traverse module being movable in the second direction, the second stage being provided at one end of the second traverse module in the second direction;

the second driving piece is in transmission connection with the output end of the second transverse moving module;

the third driving piece is in transmission connection with the output end of the second driving piece, and the second driving piece can drive the third driving piece to move along the vertical direction;

the second transverse moving module can drive the first clamping plate to extend into the waste material grabbing groove;

the second clamping plate is arranged at the output end of the third driving piece and is positioned above the first clamping plate, and the third driving piece can drive the second clamping plate to move along the vertical direction so as to enable the first clamping plate and the second clamping plate to be close to or far away from each other; and

and the waste material frame is arranged on the frame body and is arranged at the other end of the second transverse moving module along the second direction.

Preferably, the marking device includes:

a fourth base installed on the frame body;

a chucking mechanism mounted on the fourth base, the chucking mechanism being configured to chuck the substrate; and

and a marking mechanism which is arranged on the fourth base and is used for marking the substrate to form an information code.

Preferably, the marking device further includes a detection mechanism mounted on the fourth base, the transfer device is capable of transferring the substrate from the clamping mechanism to the detection mechanism, the detection mechanism is configured to detect the information code, and the transfer device is configured to selectively transfer the substrate to the good grade or the poor grade according to a detection result of the detection mechanism.

Preferably, the clamping mechanism includes:

a first clamping assembly, including a fourth driving member, a first mounting plate and a first clamping member, wherein the fourth driving member is mounted on the fourth base, the first mounting plate is mounted at the output end of the fourth driving member, the first clamping member is mounted on the first mounting plate, and the first mounting plate and the fourth base can slide relatively; and

and the fourth driving part can drive the first clamping part to approach or separate from the second clamping part.

Another object of the utility model is to provide a semiconductor production line can use qualified base plate and make corresponding subsequent processing according to the information of this base plate, guarantees the uniformity of product.

To achieve the purpose, the utility model adopts the following technical proposal:

the semiconductor production line comprises the substrate processing equipment, and the substrate processing equipment can measure, cut, mark and sort the substrate.

The beneficial effects of the utility model reside in that:

the utility model provides a substrate processing equipment, take out the base plate from feed arrangement through transmission device, back is through the thickness measuring device, cutting device, beat the operation of mark device, in the thickness measurement stage, if base plate thickness surpasss the default, transmission device can put into poor grade with the base plate, if qualified put into good grade with the base plate after cutting device and mark device are handled to the base plate again of base plate thickness, thereby realized simultaneously to the accurate of base plate thickness and dimensional parameter accuse, beat the mark operation to the base plate simultaneously, make things convenient for the quick discernment of follow-up station to every base plate, and then make things convenient for follow-up station to carry out corresponding plastic packaging powder to the base plate of different thickness and mend poor operation, the uniformity of product has been guaranteed.

The utility model provides a substrate treatment equipment, through adopting foretell substrate treatment equipment, can carry out accurate screening with the qualified base plate of thickness, use the qualified base plate of thickness and size and make corresponding subsequent processing according to the information of this base plate, and then adopt different benefit poor measures to the base plate not, add the plastic envelope powder of different volumes, guarantee the uniformity of product.

Drawings

Fig. 1 is a first schematic structural diagram of a substrate processing apparatus according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a thickness measuring device according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a substrate processing apparatus according to an embodiment of the present invention;

FIG. 4 is an enlarged view at A in FIG. 3;

fig. 5 is a schematic structural diagram of the marking device provided by the embodiment of the present invention.

In the figure:

10. a frame body; 20. a feeding device;

30. a thickness measuring device; 31. a first base; 311. a base; 312. an L-shaped plate; 32. a first stage; 321. a via hole; 33. a first thickness measuring mechanism; 331. a mounting seat; 332. a screw; 333. a measuring member; 34. a second thickness measuring mechanism; 35. a first guide rail;

40. a cutting device; 41. a second stage; 411. a waste material grabbing tank; 42. a second guide rail; 43. a cutting mechanism; 431. a second base; 432. a first transverse moving module; 433. a first vertical moving module; 434. cutting the piece; 44. a waste collection device; 441. a third base; 442. a second transverse moving module; 443. a second driving member; 444. a third driving member; 445. a first splint; 446. a second splint; 447. a waste frame; 448. a connecting member;

50. a marking device; 51. a fourth base; 52. a clamping mechanism; 521. a first clamping assembly; 5211. a first mounting plate; 5212. a first clamping member; 522. a second clamping assembly; 5221. a second mounting plate; 5222. a second clamping member; 53. a marking mechanism; 531. mounting a marking mechanism; 5311. a third mounting plate; 5312. an upper marker; 532. a lower marking mechanism; 54. a detection mechanism; 541. a first detecting member; 542. a second detecting member; 55. a second guide rail;

60. a blanking device; 61. good grade; 62. poor grade; 200. a substrate.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It should be further noted that, for the convenience of description, only some of the structures associated with the present invention are shown in the drawings, not all of them.

In the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected", "connected" and "fixed" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used in the orientation or positional relationship shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

The utility model provides a substrate treatment equipment can carry out the systematization to base plate 200 and handle, selects out qualified base plate 200 to can let next station discern base plate 200. As shown in fig. 1, the substrate processing apparatus includes a frame 10, a feeding device 20, a thickness measuring device 30, a cutting device 40, a marking device 50, a blanking device 60, and a transferring device, wherein the feeding device 20, the thickness measuring device 30, the cutting device 40, the marking device 50, the blanking device 60, and the transferring device are all disposed on the frame 10, the feeding device 20 is configured to store a plurality of substrates 200, the thickness measuring device 30 is configured to measure the thickness of the substrates 200, the cutting device 40 is configured to cut the substrates 200 to a predetermined size, the marking device 50 is configured to mark the substrates 200, the blanking device 60 is configured to extend a good product position 61 and a poor product position 62, and the transferring device is configured to grasp the substrates 200 in the feeding device 20, and switch among the thickness measuring device 30, the cutting device 40, and the marking device 50 to selectively sort the substrates 200 into the good product position 61 and the poor product position 62. The substrate 200 is taken out from the feeding device 20 through the transfer device, then the substrate 200 is operated through the thickness measuring device 30, the cutting device 40 and the marking device 50, in the thickness measuring stage, if the thickness of the substrate 200 exceeds a preset value, the transfer device can place the substrate 200 into the poor grade 62, if the thickness of the substrate 200 is qualified, the substrate 200 is placed into the good grade 61 after the substrate 200 is processed through the cutting device 40 and the marking device 50, so that the accurate control of the thickness and the size parameters of the substrate 200 is realized, meanwhile, the marking operation is carried out on the substrate 200, the rapid identification of each substrate 200 by the subsequent stations is facilitated, the subsequent stations can conveniently carry out corresponding plastic packaging powder compensation operation on the substrates 200 with different thicknesses, and the consistency of products is ensured.

Optionally, the transferring device is a multi-axis robot, a vacuum mechanism is disposed at a tail end of the multi-axis robot to adsorb the substrate 200 for transferring, and the multi-axis robot is configured as a structure that is common in the art and is not described herein. The positions of the feeding device 20, the thickness measuring device 30, the cutting device 40, the marking device 50, and the blanking device 60 may be selected within the reach range of the multi-axis robot, and may be arranged in a reasonable layout.

In this embodiment, the transferring device adsorbs the substrate 200 and passes through the thickness measuring device 30, the thickness of the substrate 200 that will be unqualified outside the preset range is placed in the poor grade 62, and then the substrate 200 is cut and code-sprayed, so that the substrate 200 with unqualified thickness can be discriminated at first, and the invalid processing operation caused by cutting or code-spraying first and then thickness measuring is avoided. In other embodiments, the sequence of thickness measurement, cutting and code spraying can be changed at will, and is not limited herein.

Preferably, the incoming material device 20 includes an incoming material frame and an inductor, the incoming material frame is installed on the frame body 10, the inductor is installed at the bottom of the incoming material frame and is used for sensing whether there is material in the incoming material frame, the transfer device snatchs according to the signal of the inductor, and the phenomenon that the transfer device is empty is avoided.

The structure of the thickness measuring device 30 will be described with reference to fig. 2. As shown in fig. 2, the cutting device 40 includes a first base 31, a first stage 32, a first thickness measuring mechanism 33, and a second thickness measuring mechanism 34, the first base 31 is mounted on the frame 10, the first stage 32 is mounted on the first base 31, the transfer device can place the substrate 200 on the stage, a through hole 321 is formed in the stage, the first thickness measuring mechanism 33 is disposed above the through hole 321 along a vertical direction (Z direction in the figure), the second thickness measuring mechanism 34 is disposed below the through hole 321 along the vertical direction, the first thickness measuring mechanism 33 and the second thickness measuring mechanism 34 can measure the thickness of the substrate 200 together, and the transfer device can selectively transfer the substrate 200 to a next station or a different station 62 according to the thickness of the substrate 200. Through the arrangement, the thickness of the substrate 200 can be measured, and the substrate 200 with the thickness exceeding the tolerance can be screened out. In this embodiment, the first thickness measuring mechanism 33 and the second thickness measuring mechanism 34 are both connected to the first base 31, and in other embodiments, the first thickness measuring mechanism 33 and the second thickness measuring mechanism 34 may be mounted on the frame body 10, only the probe for measuring the thickness is ensured to be aligned with the through hole 321, which is not limited herein. Alternatively, the first base 31 includes a base 311 and an L-shaped plate 312 connected to each other and disposed on the frame body 10, the L-shaped plate 312 is mounted on the base 311, and the L-shaped plate 312 is disposed to provide a larger mounting space for mounting the first thickness measuring mechanism 33 and the second thickness measuring mechanism 34.

Preferably, as shown in fig. 2, a first guide rail 35 is disposed between the first thickness measuring mechanism 33 and the L-shaped plate 312 and between the second thickness measuring mechanism 34 and the L-shaped plate 312, the first guide rail 35 extends along the Z direction, the relative position of the first thickness measuring mechanism 33 and the first guide rail 35 in the Z direction is adjustable, and the relative position of the second thickness measuring mechanism 34 and the first guide rail 35 in the Z direction is adjustable. Through the arrangement, when the thickness models of the substrates 200 are different, the first thickness measuring mechanism 33 and the second thickness measuring mechanism 34 can be adjusted in height correspondingly, and the adaptability of the thickness measuring device 30 to different substrates 200 is improved.

Further, the first thickness measuring mechanism 33 includes an installation base 331, a screw 332 and a measuring piece 333, the installation base 331 and the first guide rail 35 can slide relatively, the measuring piece 333 is installed on the installation base 331 and is opposite to the through hole 321, and the screw 332 is in threaded connection with the installation base 331 and can abut against the first guide rail 35. With the above arrangement, the screw 332 is tightened, the mounting base 331 is fixed at a certain position, the screw 332 is loosened, and an operator can move the mounting base 331 along the first guide rail 35 to adjust the height of the measuring part 333. In this embodiment, the base plate 200 is perforated to allow the first guide rail 35 to pass through. In other embodiments, the base plate 200 may not be provided with a through hole, and the first guide rail 35 may be separately disposed and respectively disposed on the upper and lower sides of the base plate 200, which is not limited herein.

The second thickness measuring mechanism 34 is the same as the first thickness measuring mechanism 33, and a description thereof will not be repeated. In the thickness measuring process, the transfer device always sucks the substrate 200 to perform the thickness measuring operation.

The structure of the cutting device 40 will be described with reference to fig. 3 and 4. As shown in fig. 3, the cutting device 40 includes a second stage 41 and a cutting mechanism 43, the substrate 200 can be placed on the second stage 41 by the transfer device and absorbed by the second stage 41, the second stage 41 is connected with the frame body 10 in a sliding manner along the first direction (X direction in the figure), the cutting mechanism 43 is installed on the frame body 10 and is arranged on one side of the second stage 41 along the preset direction, the cutting mechanism 43 is used for cutting the substrate 200, and by the above arrangement, when the second stage 41 slides to one end of the transfer device, the transfer device places the substrate 200 on the second stage 41, and then the second stage 41 slides to one end of the cutting mechanism 43 to complete the cutting of the substrate 200. Specifically, the cutting device 40 further includes a second guide rail 55 and a fifth driving element (not shown in the figure), the second guide rail 55 extends along the first direction, and the second stage 41 is in transmission connection with an output end of the fifth driving element.

Optionally, the cutting mechanism 43 includes a second base 431, a first transverse moving module 432 and a first vertical moving module 433, the second base 431 is mounted on the prosthesis and disposed at one end of the second guide rail 55, the first transverse moving module 432 is mounted on the second base 431, the first transverse moving module 432 is capable of moving along a second direction (Y direction in the figure, and X direction and Y direction are perpendicular), the first vertical moving module 433 includes a first driving member and a cutting member 434, the first driving member is mounted on the transverse moving module, the cutting member 434 is in transmission connection with an output end of the first driving member, and the first driving member is capable of driving the cutting member 434 to move along the Z direction. Through the above arrangement, the cutting piece 434 can move in the Y direction and the Z direction, and is matched with the X direction of the second carrying table 41 in a moving manner, after the second carrying table 41 moves to the second base 431, the cutting piece 434 is driven by the first transverse moving module 432 and the first vertical moving module 433 to move and cut along the Y direction after approaching the substrate 200 downwards, and then the second carrying table 41 moves along the X direction, so that the cutting piece 434 cuts the substrate 200 in the X direction, and further cuts the substrate 200 into a square shape. Optionally, the cutting element 434 is a laser cutter. Optionally, the first transverse moving module 432 is in the form of a linear module driven by a lead screw nut, and the structure thereof is a common configuration in the art and will not be described herein. Optionally, the first driving member is an air cylinder, and the air cylinder has the advantage of rapid response, so that the cutting speed can be increased.

Preferably, as shown in fig. 3 and 4, the cutting device 40 further includes a scrap collecting device 44, and the scrap collecting device 44 can take and collect the scraps cut from the substrate 200. The scrap collecting device 44 includes a third base 441, a second traverse module 442, a second driving element 443, a third driving element 444, a first clamping plate 445, a second clamping plate 446 and a scrap frame 447, the third base 441 is mounted on the frame 10, the second traverse module 442 is mounted on the third base 441 and can move along the Y direction, the second carrier 41 is disposed at one end of the second traverse module 442 along the Y direction, the second driving element 443 is in transmission connection with an output end of the second traverse module 442, the third driving element 444 is in transmission connection with an output end of the second driving element 443, the second driving element 443 can drive the third driving element 444 to move along the Z direction, the first clamping plate 445 is mounted on the third driving element 444, the second traverse module 442 can drive the first clamping plate to extend into the scrap collecting slot 411, the second clamping plate 446 is mounted at an output end of the third driving element 444 and is located above the first clamping plate 445, the third clamping plate 444 can drive the second clamping plate 446 to move along the Z direction so that the second clamping plate 446 is far from the second traverse module 442 or the other end of the frame 445. Through the structure, the waste collecting device 44 can lift the waste of the substrate 200 from the waste grabbing groove 411 to clamp the waste and then convey the waste to the waste frame 447, so that the waste can be timely cleaned and collected, and the waste is prevented from influencing the cutting of the next substrate 200.

The structure of the marking device 50 will be described with reference to fig. 5. As shown in fig. 5, the marking device 50 includes a fourth base 51, a clamping mechanism 52 and a marking mechanism 53, the fourth base 51 is mounted on the frame body 10, the clamping mechanism 52 is mounted on the fourth base 51, the clamping mechanism 52 is used for clamping the substrate 200, and the marking mechanism 53 is mounted on the fourth base 51 and is used for marking the substrate 200 to form an information code. Through the arrangement, the marking device 50 marks the substrate 200 to generate the information code, so that the subsequent stations of a semiconductor production line can conveniently perform different processing on each substrate 200, and the consistency of products is ensured.

Alternatively, the clamping mechanism 52 includes a first clamping assembly 521 and a second clamping assembly 522, the first clamping assembly 521 includes a fourth driving member (not shown in the drawings, and is installed at the back of the fourth base 51), a first mounting plate 5211 and a first clamping member 5212, the fourth driving member is installed on the fourth base 51, the first mounting plate 5211 is installed at the output end of the fourth driving member, the first clamping member 5212 is installed on the first mounting plate 5211, the first mounting plate 5211 and the fourth base 51 can slide relatively, the second clamping assembly 522 is arranged below the first clamping assembly 521, and the fourth driving member can drive the first clamping member 5212 and the second clamping assembly 522 to approach or separate from each other. With the above arrangement, the first clamping member 5212 is raised, the transferring device places the substrate 200 between the first clamping member 5212 and the second clamping assembly 522, the first clamping member 5212 is lowered to clamp the substrate 200, and then the marking mechanism 53 marks the substrate 200. Optionally, the second clamping assembly 522 comprises a second mounting plate 5221 and a second clamping member 5222, and the second mounting plate 5221 and the fourth base 51 are slidable relative to each other, so that the height of the second clamping member 5222 can be adjusted, thereby facilitating the debugging work in the field.

Suitably, the first clamping member 5212 and the second clamping member 5222 are both provided with marking holes, so that the area of the substrate 200 to be marked is exposed and marked.

Optionally, the marking mechanism 53 includes an upper marking mechanism 53153 and a lower marking mechanism 53253, the upper marking mechanism 53153 includes a third mounting plate 5311 and an upper marking device 5312, the upper marking device 5312 is mounted on the third mounting plate 5311 and disposed above the marking hole, the third mounting plate 5311 and the fourth base 51 are relatively slidable, the lower marking mechanism 53253 is disposed on the fourth mounting seat 331 and disposed below the marking hole, and by the above arrangement, the marking operation on the substrate 200 is realized, and meanwhile, the upper marking device 5312 can adjust the position in the Z direction, so as to facilitate on-site debugging.

Preferably, the marking device 50 further includes a second guide rail 55, the second guide rail 55 extends along the Z direction, the second guide rail 55 is installed on the fourth base 51, and a sliding block and a sliding fit connection with the second guide rail 55 are respectively provided between the third mounting plate 5311 and the second guide rail 55, between the first mounting plate 5211 and the second guide rail 55, and between the second mounting plate 5221 and the second guide rail 55, so that the resistance is reduced and the direction is accurate when the first clamping member 5212, the upper standard-reaching device and the lower standard-reaching device slide relative to the fourth base 51, and no shaking occurs. It should be noted that, the fixing and adjusting structures of the second mounting plate 5221 and the second rail 55 are the same as the structures of the screw 332 and the mounting base 331 mentioned above, and the fixing and adjusting structures of the third mounting plate 5311 and the second rail 55 are the same as the structures of the screw 332 and the mounting base 331 mentioned above, and therefore, the description thereof is not repeated herein.

Preferably, the marking device 50 further includes a detecting mechanism 54, the detecting mechanism 54 is mounted on the fourth base 51, the transferring device can transfer the substrate 200 from the clamping mechanism 52 to the detecting mechanism 54, the detecting mechanism 54 is used for detecting the information code, and the transferring device can selectively transfer the substrate 200 to the good product position 61 and the poor product position 62 according to the detecting mechanism 54 of the detecting mechanism 54. Through the arrangement, the two-dimensional code on the marked substrate 200 is detected, if the detection mechanism 54 can sweep out information of the information code, the transfer device places the substrate 200 on the good grade 61, and if the detection mechanism 54 fails to sweep the information code, the transfer device places the substrate 200 on the poor grade 62, so that the situation that the information code cannot be detected at the next station of the semiconductor production line, information transfer is interrupted, and the substrate 200 cannot be correspondingly processed is prevented.

The embodiment also provides a semiconductor production line, through adopting foretell base plate treatment facility, can carry out accurate screening with qualified base plate 200 of thickness, use qualified base plate 200 of thickness and size and make corresponding subsequent processing according to this base plate 200's information, and then adopt different compensation measures to base plate 200 not used, add the plastic envelope powder of different volume, guarantee the uniformity of product.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, rearrangements and substitutions will now occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (10)

1. A substrate processing apparatus, comprising:

a frame body (10);

the feeding device (20) is arranged on the frame body (10), and the feeding device (20) is used for storing a plurality of substrates (200);

the thickness measuring device (30) is arranged on the frame body (10), and the thickness measuring device (30) is used for measuring the thickness of the substrate (200);

a cutting device (40) disposed on the frame body (10), the cutting device (40) being configured to cut the substrate (200) to a predetermined size;

the marking device (50) is arranged on the frame body (10), and the marking device (50) is used for marking the substrate (200);

the blanking device (60) comprises a good grade (61) and a poor grade (62), and the good grade (61) and the poor grade (62) are both arranged on the frame body (10); and

the transfer device is arranged on the frame body (10) and can grab the substrate (200) in the feeding device (20), and the substrate (200) can be selectively sorted to the good grade (61) and the poor grade (62) by switching the thickness measuring device (30), the cutting device (40) and the marking device (50).

2. The substrate processing apparatus according to claim 1, wherein the thickness measuring device (30) comprises:

a first base (31) mounted on the frame body (10);

a first stage (32) mounted on the first base (31), the transfer device being capable of placing the substrate (200) on the first stage (32), the stage being provided with a via (321);

the first thickness measuring mechanism (33) is arranged above the through hole (321) along the vertical direction; and

the second thickness measuring mechanism (34) is arranged below the through hole (321) in the vertical direction, the first thickness measuring mechanism (33) and the second thickness measuring mechanism (34) can measure the thickness of the substrate (200) together, and the transfer device can selectively transfer the substrate (200) to the next station or the difference grade (62) according to the thickness of the substrate (200).

3. The substrate processing apparatus according to claim 2, wherein the thickness measuring device (30) further comprises a first guide rail (35), the first guide rail (35) is mounted on the first base (31) and extends in the vertical direction, a relative position of the first thickness measuring mechanism (33) and the first guide rail (35) in the vertical direction is adjustable, and a relative position of the second thickness measuring mechanism (34) and the first guide rail (35) in the vertical direction is adjustable.

4. The substrate processing apparatus according to claim 1, wherein the cutting device (40) comprises:

a second stage (41), on which the substrate (200) can be placed by the transfer device and which is attracted by the second stage (41), the second stage (41) being slidably connected to the frame (10) along a first direction; and

the cutting mechanism (43) is installed on the frame body (10) and arranged on one side of the second carrying platform (41) along the first direction, and the cutting mechanism (43) is used for cutting the substrate (200).

5. The substrate processing apparatus according to claim 4, wherein the cutting mechanism (43) comprises:

a second base (431) which is installed on the frame body (10) and is arranged at one end of the second carrying platform (41) along the first direction;

a first traverse module (432) mounted on the second base (431), the first traverse module (432) being movable in a second direction, the second direction being perpendicular to the first direction; and

the first vertical moving module (433) comprises a first driving piece and a cutting piece (434), the first driving piece is installed on the transverse moving module, the cutting piece (434) is in transmission connection with the output end of the first driving piece, and the first driving piece can drive the cutting piece (434) to move in the vertical direction.

6. The substrate processing apparatus according to claim 5, wherein the cutting device (40) further comprises a scrap collecting device (44), the outer side of the second stage (41) is provided with a scrap catching groove (411), and the scrap collecting device (44) comprises:

a third base (441) mounted on the frame body (10);

a second traverse module (442) mounted on a third base (441), the second traverse module (442) being movable in the second direction, the second stage (41) being disposed at one end of the second traverse module (442) in the second direction;

the second driving piece (443) is in transmission connection with the output end of the second transverse moving module (442);

the third driving piece (444) is in transmission connection with the output end of the second driving piece (443), and the second driving piece (443) can drive the third driving piece (444) to move in the vertical direction;

a first clamping plate (445) mounted on the third driving member (444), the second transverse moving module (442) can drive the first clamping plate (445) to extend into the waste catching groove (411);

a second clamping plate (446) mounted at the output end of the third driving member (444) and located above the first clamping plate (445), the third driving member (444) being capable of driving the second clamping plate (446) to move in the vertical direction to bring the first clamping plate (445) and the second clamping plate (446) closer to or away from each other; and

a waste frame (447) mounted on the frame body (10) and disposed at the other end of the second traverse module (442) in the second direction.

7. The substrate processing apparatus according to any of claims 1 to 6, wherein the marking device (50) comprises:

a fourth base (51) mounted on the frame body (10);

a chucking mechanism (52) mounted on the fourth base (51), the chucking mechanism (52) being for chucking the substrate (200); and

and the marking mechanism (53) is arranged on the fourth base (51) and is used for marking the substrate (200) to form an information code.

8. The substrate processing apparatus according to claim 7, wherein the marking device (50) further comprises a detection mechanism (54), the detection mechanism (54) is mounted on the fourth pedestal (51), the transfer device is capable of transferring the substrate (200) from the chucking mechanism (52) to the detection mechanism (54), the detection mechanism (54) is configured to detect the information code, and the transfer device is configured to selectively transfer the substrate (200) to the good grade (61) or the poor grade (62) according to a detection result of the detection mechanism (54).

9. The substrate processing apparatus according to claim 7, wherein the chucking mechanism (52) comprises:

a first clamping assembly (521) comprising a fourth driving member, a first mounting plate (5211) and a first clamping member (5212), wherein the fourth driving member is mounted on the fourth base (51), the first mounting plate (5211) is mounted at the output end of the fourth driving member, the first clamping member (5212) is mounted on the first mounting plate (5211), and the first mounting plate (5211) and the fourth base (51) can slide relatively; and

a second clamping assembly (522) disposed below the first clamping assembly (521), the fourth driving member being capable of driving the first clamping member (5212) to approach or separate from the second clamping assembly (522).

10. Semiconductor production line, characterized in that it comprises a substrate processing apparatus according to any of claims 1-9, which is capable of measuring, cutting, marking and sorting substrates (200).

Images