CN101241869B - Chip testing classifier - Google Patents

Chip testing classifier Download PDF

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Publication number
CN101241869B
CN101241869B CN2007100028666A CN200710002866A CN101241869B CN 101241869 B CN101241869 B CN 101241869B CN 2007100028666 A CN2007100028666 A CN 2007100028666A CN 200710002866 A CN200710002866 A CN 200710002866A CN 101241869 B CN101241869 B CN 101241869B
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China
Prior art keywords
chip
testing
test
order
box
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Expired - Fee Related
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CN2007100028666A
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Chinese (zh)
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CN101241869A (en
Inventor
谢旼达
游庆祥
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HON TECHNOLOGIES Inc
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HON TECHNOLOGIES Inc
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Priority to CN2007100028666A priority Critical patent/CN101241869B/en
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Abstract

A chip detecting sorter comprises a feeding box arranged in the front terminal of the sorter table, holding box and an empty box. The feeding box can hold the chip to be tested to support the material. The holding box can hold the test-finished chip to take the material. The empty box can receive the empty tray at the feeding box position or supply the empty tray necessarty for the holding box. A plurality testing devices including testers, probe cards and locating tools are arranged at the rear terminal of the sorter table to test the chip. A transfer loading device is arranged among the feeding box, the holding box and the tester to transfer and load the test-finished chips and automatically transfer and load among the feeding box, holding box and the empty box and supply the empty tray. Thus, the invention can test the chips after cutting and sort immediately based on the test result so as to ensure the test quality and effectively promote the operation convenience and the usage benefit of the capacity.

Description

Chip testing classifier
Technical field
The present invention relates to a kind of can always the change and automatically perform chip testing and sorting operations, and effectively promote the chip testing classifier of operation convenience and tested productivity.
Background technology
General semi-conductive processing procedure, be prior to cooking up the various chip of quantity on the wafer, after wafer manufacturing is finished, the dealer is the cost waste of guaranteeing the wafer yield and avoiding the back segment encapsulation procedure, before the operation of execution chip cutting, all can carry out the wafer pin and survey operation, electrically whether impaired with each chip on the test wafer, it is that the full wafer wafer is positioned on the tool of a probe test machine that described wafer pin is surveyed operation, described probe test machine is the probe that is provided with a connection tester in the top of tool, probe has a plurality of probes, utilize the probe of probe to survey the chip of dividing on the wafer, and test data is sent to tester, the chip of being judged test by tester is non-defective unit or defective products, if defective products, promptly annotate mark in chip or database subscript, to filter out bad chip in advance, after the wafer sort operation is finished, the wafer that will finish survey again places in wafer cassette, and transfer load to next wafer cutting work station, wafer being cut into a plurality of chips, and after finishing cutting, result according to first Pretesting places each chip selection on each charging tray, carries out packaging operation for temporary or preparation; Only, each one chip after described aforesaid work flow there is no and finishes at cutting carries out each other test again, if it is careless slightly and when injuring chip in the process of cutting operation, described work flow can't be certain again defective products is chosen, and then cause flaw on the test jobs, and reduce test mass.
So under the trend of stressing the lifting of comprehensive automation and test mass, how to design a kind of can be after executing the chip cutting operation, carry out each other test at each one chip again, and according to test result one classification of chip do is placed immediately, and consistentization automatically performs chip testing and classification, to promote operation convenience and production capacity, be the target that the dealer endeavours to research and develop.
Summary of the invention
Purpose one of the present invention, provide a kind of chip testing classifier, include the testing apparatus of feed casket, rewinding casket, empty boxes, a plurality of tool tester, probe and localization tool, and the shifting apparatus of tool fetching device, to utilize the sequential collocation start of each device, and can carry out test jobs to the chip after the cutting, and then can be certain will cut after defective products choose, reach the benefit that significantly promotes test mass.
Purpose two of the present invention, described chip testing classifier are after the automatic test chip finishes, and according to test result chip being classified rapidly immediately places, and reaches consistentization test and classification automatically, and promotes the utilization benefit of operation convenience and prouctiveness.
In order to achieve the above object, the invention provides a kind of chip testing classifier, comprising:
Feed casket: be that bearing has chip to be measured;
Rewinding casket: be to receive the intact chip of surveying of bearing;
Testing apparatus: be to be provided with tester and probe, and be provided with microscope carrier mechanism in corresponding probe position, described microscope carrier mechanism is placed on the slide rail with microscope carrier, and drive the displacement make the Y direction by drive source, on microscope carrier and be equiped with pedestal, then be equiped with the tool in order to the bearing chip on the described pedestal, the tool of described testing apparatus is to be driven by drive source to do the lifting of Z direction, and the chip on the described tool is contacted with probe;
Shifting apparatus: be to be provided with in order to the transfer fetching device of surveying chip that reached to be measured;
Central processing unit: start is respectively installed in control and integration.
Description of drawings
Figure is the allocation plan of each device of the present invention;
Figure is the schematic diagram of testing apparatus of the present invention;
Figure is the use schematic diagram one that the present invention carries out chip testing and sorting operations;
Figure is the use schematic diagram two that the present invention carries out chip testing and sorting operations;
Figure is the use schematic diagram three that the present invention carries out chip testing and sorting operations;
Figure is the use schematic diagram four that the present invention carries out chip testing and sorting operations;
Figure is the use schematic diagram five that the present invention carries out chip testing and sorting operations;
Figure is the use schematic diagram six that the present invention carries out chip testing and sorting operations;
Figure is the use schematic diagram seven that the present invention carries out chip testing and sorting operations;
Figure is the use schematic diagram eight that the present invention carries out chip testing and sorting operations;
Figure is the use schematic diagram nine that the present invention carries out chip testing and sorting operations;
Figure is the use schematic diagram ten that the present invention carries out chip testing and sorting operations.
Description of reference numerals
(the present invention)
Feed casket 10; Rewinding casket 20a, 20b, 20c, 20d; Empty boxes 30; Testing apparatus 40,40a, 40b, 40c, 40d; Probe 41,41a; Probe 411,411a; Tester 42,42a; Microscope carrier mechanism 43,43a; Microscope carrier 431,431a; Localization tool 432,432a; Vacuum slot 433,433a; Pusher shoe 434,434a; Slide rail 435; Pedestal 436; Transfer mechanism 50; First group of fetching device 51; Second group of fetching device 52; The 3rd fetching device 53; Chip 61,62,63,64,65,66,67,68.
Embodiment
Further understand for the present invention is done, now lift a preferred embodiment and cooperate graphicly, describe in detail as the back:
See also Fig. 1, shown in Figure 2, described chip testing classifier is that the front end in board is provided with feed casket 10, rewinding casket 20a, 20b, 20c, 20d and empty boxes 30, wherein, described feed casket 10 is charging trays of ccontaining at least one splendid attire chip to be measured, and can drive charging tray lifting displacement for getting material, and the rewinding casket can segment the rewinding casket 20a of different brackets, 20b, 20c, 20d, each rewinding casket 20a, 20b, 20c, 20d is the different brackets chip of surveying in order to have stored, empty boxes 30 is to receive the empty charging tray that is used by feed casket 10, and empty charging tray lifting displacement storehouse placed, also can be according to need with the empty charging tray lifting displacement that places, for being complemented at each rewinding casket 20a, 20b, 20c, 20d is in order to rewinding, be provided with a plurality of testing apparatuss 40 in addition in the rear end of board, each testing apparatus 40 is to set up a probe 41 with the frame of tool through hole, described probe 41 has a plurality of probes 411, and make a plurality of probes to being positioned at the through hole of frame, and probe 41 and connection are positioned at the tester 42 at rear, described tester 42 is in order to determine non-defective unit chip or defective products chip, again test result is transferred to the central processing unit (scheming not shown) of testing sorter, cooperate start by each device of central processing unit control, board in probe 41 belows is provided with microscope carrier mechanism 43 in addition, described microscope carrier mechanism 43 is to mount microscope carrier 431 on a slide rail 435, described microscope carrier 431 and can drive the displacement make the Y direction by drive source, on described microscope carrier 431, be equiped with the pedestal 436 that to do the fine setting of X-Y direction and θ angle, and be provided with one in described pedestal 436 and can drive and can make the tool 432 of Z direction lifting by drive source, and then after utilizing pedestal 436 fine setting contrapositions, tool 432 can be via the drive of microscope carrier 431, move into corresponding to probe 41 lower position with Y direction level, drive the probe 411 that rises with contact probe card 41 with drive source again, the end face of other tool 432 is provided with a vacuum slot 433 and can be by the pusher shoe 434 of drive source drive displacement, described pusher shoe 434 can be when vacuum slot 433 absorption chips, pass the chip displacement a little in order to bit test, one transfer mechanism 50 is that transfer is in feed casket 10, rewinding casket 20a, 20b, 20c, 20d, 40 of empty boxes 30 and testing apparatuss, it has first group of fetching device 51 can doing the displacement of X-Y-Z direction, second group of fetching device 52 and the 3rd fetching device 53, wherein, described first group of fetching device 51 is in order to taking and putting measured chip, and second group of fetching device 52 is chips of surveying in order to have picked and placeed, the 3rd fetching device 53 then transfers load to empty boxes 30 places in order to the empty charging tray with feed casket 10 and places, or the empty charging tray transfer at empty boxes 30 places is supplemented to each rewinding casket 20a, 20b, 20c, 20d is in order to rewinding.
See also shown in Figure 3, but a plurality of chip splendid attires that cut out by wafer are in charging tray, and be placed in the feed casket 10 for getting material, and transfer mechanism 50 can drive the top that first group of fetching device 51 is moved to feed casket 10, and the chip to be measured in the taking-up charging tray 61,62,63,64, so that transfer load to next device place.
See also Fig. 4, shown in Figure 5, first group of fetching device 51 of described shifting apparatus 50 is in taking out several chips to be measured 61,62,63, after 64, it is the chip 61 that each is to be measured, 62,63,64 transfer load to each testing apparatus 40a, 40b, 40c, the place of reloading of 40d, with testing apparatus 40a is example, first group of fetching device 51 of described shifting apparatus 50 is the places of reloading that chip to be measured 61 transferred load to testing apparatus 40a, carry tool 432a and be positioned at the place of reloading and testing apparatus 40a also drives microscope carrier 431a, first group of fetching device 51 for shifting apparatus 50 is placed in chip 61 to be measured on the tool 432a, and on tool 432a, adsorb chip 61 to be measured with vacuum slot 433a, for making the chip to be measured 61 can be accurately to being positioned at the probe 411a of probe 41a, be that may command pusher shoe 434a passes chip 61 displacements to be measured, make chip to be measured 61 location in order to test.
See also Fig. 6, shown in Figure 7, after 61 location of the chip to be measured on the tool 432a finish, the described microscope carrier 43a of mechanism promptly carries the below that tool 432a and chip 61 to be measured are moved to the probe 411a of probe 41a, tool 432a promptly drives the rising displacement of making the Z direction by drive source, and be extended through in the through hole of frame, to make the probe 411a of chip to be measured 61 contact probe card 41a, to utilize probe 411a contact conducting chip 61 to be measured, to carry out chip 61 test jobs, after controller 42a differentiation chip 61 to be measured is non-defective unit or defective products, described controller 42a transfers to test result the central processing unit (scheming not shown) of testing sorter again, makes each device of central processing unit control cooperate start.
See also shown in Figure 8, when testing apparatus 40a, 40b, 40c, 40d when carrying out the test jobs of chip 61,62,63,64 to be measured, described shifting apparatus 50 can drive first group of fetching device 51 and be moved to feed casket 10 places, and takes out next group chip 65,66,67,68 to be measured with to be tested.
See also Fig. 9, Figure 10, shown in Figure 11, after test jobs finishes, described tool 432a promptly drives the decline displacement of making the Z direction by drive source, made the chip of surveying 61 break away from probe 41a, the 43a of microscope carrier mechanism also drives tool 432a and has reached the chip of surveying 61 and oppositely be moved to the place of reloading, and make vacuum slot 433a discharge the chip 61 of survey for taking-up, described shifting apparatus 50 promptly drives first group of fetching device 51 and second group of fetching device 52 is moved to testing apparatus 40a, and make second group of fetching device 52 tool 432a gone up chip 61 taking-ups of surveying, taken out the chip 61 of survey when second group of fetching device 52 after, promptly control first group of fetching device 51 chip 65 that next is to be measured and be positioned on the tool 432a of testing apparatus 40a, and can carry out test jobs in regular turn.
See also shown in Figure 12, described shifting apparatus 50 is in regular turn in each testing apparatus 40a, 40b, 40c, 40d has taken out at the place chip of surveying 61,62,63,64, and with chip to be measured 65,66,67,68 are placed in each testing apparatus 40a in regular turn, 40b, 40c, 40d is for after carrying out test jobs, the central processing unit of described testing sorter is immediately according to each testing apparatus 40a, 40b, 40c, the test result of 40d, and second group of fetching device 52 of control shifting apparatus 50 will finish the chip 61 of survey respectively, 62,63,64 are positioned over each rewinding casket 20a, 20b, 20c, place in the charging tray of 20d, for example chip 61 promptly is positioned over non-defective unit rewinding casket 20a for non-defective unit, as then being positioned over defective products rewinding casket for defective products, place and can do a real-time classification, reach the utilization benefit that consistentization tested automatically and classification places.
In view of the above, the present invention can utilize the sequential collocation start of each mechanism, after chip testing finishes, and place according to the rapid classification of test result immediately, and consistentization test and classification automatically with effective lifting operation convenience and production capacity, is the design of a dark tool practicality and progressive in fact.

Claims (7)

1. a chip testing classifier is characterized in that, comprising:
Feed casket: be that bearing has chip to be measured;
Rewinding casket: be to receive the intact chip of surveying of bearing;
Testing apparatus: be to be provided with tester and probe, and be provided with microscope carrier mechanism in corresponding probe position, described microscope carrier mechanism is placed on the slide rail with microscope carrier, and drive the displacement make the Y direction by drive source, on microscope carrier and be equiped with pedestal, then be equiped with the tool in order to the bearing chip on the described pedestal, the tool of described testing apparatus is to be driven by drive source to do the lifting of Z direction, and the chip on the described tool is contacted with probe;
Shifting apparatus: be to be provided with in order to the transfer fetching device of surveying chip that reached to be measured;
Central processing unit: start is respectively installed in control and integration.
2. according to the described chip testing classifier of claim 1, it is characterized in that: described rewinding casket is the rewinding casket that segmentation has the different brackets that has stored the different brackets chip of surveying.
3. according to the described chip testing classifier of claim 1, it is characterized in that: the pedestal of described microscope carrier mechanism is the fine setting contraposition that can do X-Y direction and θ angle.
4. according to the described chip testing classifier of claim 1, it is characterized in that: be vacuum slot and the pusher shoe that is provided with in order to absorption and positioning chip on the tool of described testing apparatus.
5. according to the described chip testing classifier of claim 1, it is characterized in that: described shifting apparatus is to be provided with in order to first group of fetching device of taking and putting measured chip and in order to have picked and placeed second group of fetching device surveying chip.
6. according to the described chip testing classifier of claim 1, it is characterized in that: described shifting apparatus is provided with the 3rd fetching device in order to the charging tray of transfer sky.
7. according to the described chip testing classifier of claim 1, it is characterized in that: more include in order to place the empty boxes of empty charging tray.
CN2007100028666A 2007-02-08 2007-02-08 Chip testing classifier Expired - Fee Related CN101241869B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012216641B4 (en) 2011-09-26 2022-08-11 Mitsubishi Electric Corp. Semiconductor chip testing method and semiconductor chip testing device

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