TWI403451B - Automatic testing classifier for use in chips - Google Patents

Abstract

An automatic testing classifier for use in chips comprises a feeding magazine, collecting magazines, and empty magazines all mounted on the front end of a base, wherein the feeding magazine is provided to receive untested chips, the respective collecting magazines are provided to receive different-level tested chips, and the respective empty magazines serve to receive empty trays of the feeding magazine or supply empty trays to the collecting magazines. Besides, a testing device is disposed on the rear end of the base and includes a tester, a vertically moveable probe, two transporting devices for moving between transferring areas and the testing device so as to exchangably convey the untested chips to the testing device for testing. Thereafter, the tested chips are conveyed to the transferring areas, in the meantime, a picking device picks and places the tested chips on the feeding magazine onto two transporting devices, and then the tested chips on the transporting devices are in turn classified and then placed to the collecting magazines, thereby enhancing testing efficiency.

Description

Wafer automatic test sorter

The invention provides an automatic wafer sorting and sorting machine which can automatically perform wafer testing and sorting operations, thereby effectively improving work convenience and testing productivity.

After the wafer is finished, the manufacturer will ensure the wafer yield and avoid the waste of the post-packaging process. Therefore, before the packaging process is performed, the wafer test operation will be performed to test whether the wafer is electrically damaged; In the first embodiment, the wafer testing device 10 is provided with a probe 11 on the frame. The probe 11 has a plurality of probes 111, and the plurality of probes 111 are located at the through holes of the frame, and the probe 11 And connecting the tester 12 at the rear, the tester 12 is for discriminating a good wafer or a defective wafer, and the stage below the probe 11 is provided with a stage mechanism 13 which is attached to the first stage. A mounting table 132 is mounted on the sliding rail 131. The loading table 132 can be driven by a driving source to be moved in and out. The mounting table 132 is provided with a jig 133 which can be driven by a driving source and can be used for lifting and lowering. The jig 133 can be moved horizontally into a position corresponding to the lower position of the probe 11 via the stage 132, and then driven by the driving source to contact the probe 111 of the probe 11, and the top surface of the jig 133 is provided with a vacuum suction. The nozzle 134 and one can be driven to be displaced by the driving source The pushing member 135 can slightly change the displacement of the wafer when the vacuum suction nozzle 134 adsorbs the wafer to facilitate the alignment test; refer to FIG. 2, when the wafer test is performed, it is to be tested by manual operation. The wafer 14 is placed on the jig 133 of the testing device 10, and the jig 133 is attached to the wafer 14 to be tested by the vacuum nozzle 134, so that the wafer 14 to be tested can be accurately positioned on the probe 111 of the probe 11. The movable member 135 can be controlled to shift the displacement of the wafer 14 to be tested, and the wafer 14 to be tested is positioned for testing; please refer to FIGS. 3 and 4, when the wafer 14 to be tested on the fixture 133 is positioned, the carrier The mesa 13 and the wafer 14 to be tested are displaced to the underside of the probe 111 of the probe 11. The jig 133 is driven by the driving source to be up-shifted and penetrates through the through hole of the frame to The wafer 14 to be tested is brought into contact with the probe 111 of the probe 11 to contact the wafer 14 to be tested by the probe 111 to perform the test operation of the wafer 14. The controller 12 determines the wafer 14 to be tested as a good product. After the defective product, the finished wafer can be divided into manual operations according to the test results. The respective levels of the receipt, serve to facilitate the next job.

Since the wafer testing device is carried out by manual operation after the feeding and the completion of the testing, the device has not been able to achieve an automated operation in the classification operation of the front and rear sections, and must be effectively improved and provided. After the material and the classified operation after the test, the tester is in the standby state, and it is necessary to wait for the completion of the feeding operation before the test operation can be continued. The long standby time will seriously affect the test capacity, so it is necessary to fully automate and improve the detection capacity. Under the trend, how to design a comprehensive automatic inspection and classification operation to effectively improve the detection capacity, that is, the industry is committed to the development of the target.

The main object of the present invention is to provide a wafer automatic test sorting machine, which comprises a feed hopper, a receiving hopper and an empty raft at the front end of the machine, and a tester and a probe at the rear end of the machine. The device, and the transfer device is disposed in the test device and the transfer section, and the pick-and-place device can take the wafer to be tested on the feed device to the transfer device, and can complete the test wafer on the transfer device according to the test result. They can be placed in different grades of receiving materials, which can automatically carry out the feeding and test operations, and automatically sort and collect according to the test results, so as to effectively improve the convenience of the operation and the use efficiency of the test capacity.

Another object of the present invention is to provide a wafer automatic test sorting machine, which is provided with a second transfer device in the test device and the transfer section, wherein one transfer device can perform the test operation and the other transfer device can receive the material in the transfer area. The operation and the feeding operation can alternately transfer the wafer to be tested to the testing device for testing, thereby reducing the standby time of the testing device, thereby effectively improving the use efficiency of the testing capacity.

In order to make the present invention more fully understood by the reviewing committee, a preferred embodiment will be described with reference to the following drawings. Referring to FIG. 5, the present invention is provided with a feeding port 20 at the front end of the machine. The first and second spaces 23, 24 and the first and second receiving materials 29 and 30 of different grades, the feeding cassette 20 series can be raised and lowered for accommodating the tray 40A for holding the wafer to be tested, and the housing is to be placed The tray 40A for measuring wafers can be moved from the supply cassette 20 to the first temporary storage area 21 and the supply area 22 on the rear side, and the feeding operation is performed by the supply area 22; the first and second air units 23, 24 are The utility model can be raised and lowered for accommodating the empty trays 40B and 40C, and the first and second air trays 23 and 24 can respectively provide the empty trays 40B and 40C to the first temporary area 25 and the third temporary area 26 to the first collection. The material area 27 and the second receiving area 28 are used to receive different levels of the finished wafers in the first receiving area 27 and the second receiving area 28, and are moved into the first and second of the movable storage after the tray is fully loaded. The receiving device 29, 30; the back end of the other machine is provided with a testing device 31, the testing device 31 is provided with a tester (not shown) and a lifting probe 311, which can be moved respectively in the transfer area 32, 33 The first and second transfer devices 34 and 35 between the test devices 31 are respectively provided with sockets 341 and 351 for receiving the wafer, and vacuum suction nozzles 342 and 352 are disposed under each of the housings 341 and 351. And the side of the housings 341 and 351 are provided with the pushing members 343 and 353 which can be displaced by the driving source. The pushing members 343 and 353 can slightly shift the displacement of the wafer when the vacuum suction nozzles 342 and 352 adsorb the wafer to facilitate the alignment. The first and second transfer devices 34, 35 can alternately transfer the wafer to be tested to the test device 31 for testing, and after the test is completed, transfer to the transfer areas 32, 33, and a pick-and-place device 36 is provided. a three-direction (X-Y-Z) displacement picker 361, and the wafer to be tested can be taken in the first and second transfer devices 34, 35 in the feeding area 22, and the first and second transfer devices 34, The wafers that have been tested on the 35th are respectively placed on the trays of the first receiving area 27 and the second receiving area 28 of different grades according to the test results, so as to carry out the operations of automatic feeding and sorting and receiving.

Referring to FIG. 6, in the present invention, when the wafer automated test operation is performed, the supply cassette 20 is configured to carry the tray 40A carrying the wafer to be tested to the supply area 22, and the supply area 22 performs the feeding operation. And the first and second open spaces 23 and 24 respectively move the empty trays 40B and 40C to the first receiving area 27 and the second receiving area 28 for the first receiving area 27 and the second receiving area. 28 Undertake different levels of finished wafers.

Referring to FIG. 7, the pick-and-place 361 of the pick-and-place device 36 is moved to the feeding area 22, and after the wafer 50A to be tested is taken up on the tray 40A, the wafer 50A to be tested is placed on the first transfer device. 34 slot seat 341. Referring to Fig. 8, when the socket 341 of the first transfer device 34 is fully loaded, the vacuum nozzle 342 of the first transfer device 34 will slightly adsorb the wafer 50A and slightly shift the wafer 50A by the shifting member 343.

Referring to FIG. 9, the first transfer device 34 moves the wafer 50A to be tested under the probe 311 of the test device 31, and the probe 311 is lowered to contact the wafer 50A for testing operation. At this time, the pick-and-place device 36 The picker 361 is moved to the supply area 22 again, and the wafer 50A to be tested is continuously placed in the housing 351 of the second transfer unit 35. Referring to FIG. 10, when the socket 351 of the second transfer device 35 is fully loaded, the vacuum nozzle 352 of the second transfer device 35 will slightly adsorb the wafer 50A, and the wafer 50A is slightly displaced by the shifting member 353.

Referring to FIG. 11, when the wafer 50A on the first transfer device 34 is tested, the first transfer device 34 will be removed to the transfer zone 32, and the second transfer device 35 will move another batch of wafers 50A to be tested. Below the probe 311 of the test device 31, a test operation is performed. Referring to FIG. 12, after the first transfer device 34 removes the finished wafer 50A to the transfer area 32, the pick and place unit 361 of the pick-and-place device 36 will be driven by the controller (not shown) according to the test result. The wafers of different grades on the first transfer device 34 are placed on the empty trays 40B, 40C on the first receiving area 27 and the second receiving area 28, respectively, to automatically perform wafer completion on the first transfer device 34. Subsequent classification work.

Referring to FIG. 13, after the wafer 50A on the first transfer device 34 completes the sorting operation, the picker 361 of the pick-and-place device 36 continues to place the wafer 50A to be tested from the supply region 22 on the first transfer device 34. Inside the slot 341. Referring to Figure 14, after the wafer 50A on the second transfer device 35 is tested, the second transfer device 35 will be removed to the transfer zone 33, and the first transfer device 34 will move another batch of wafers 50A to be tested. Below the probe 311 of the test device 31, the test operation is continued. Referring to FIG. 15, after the second transfer device 35 removes the finished wafer 50A to the transfer area 33, the pick and place unit 361 of the pick-and-place device 36 will be driven by the controller (not shown) according to the test result. The wafers of different grades on the second transfer device 35 are placed on the empty trays 40B, 40C on the first receiving area 27 and the second receiving area 28, respectively, to automatically perform wafer processing on the second transfer unit 35. Subsequent classification work.

Referring to Fig. 16, when the wafer to be tested on the tray 40A of the supply area 22 is taken out, the empty tray 40A will be placed in the first space 23 for storage, and the supply cassette 20 will be placed. The tray 40D of the wafer to be tested is moved to the supply area 22, and the supply operation is continued in the supply area 22.

Accordingly, the present invention utilizes the timing matching of each device, and can automatically perform test operations on each wafer, and sort and collect according to the test results, thereby ensuring test quality and effectively improving work convenience and productivity, which is one. The design of practical and progressive design, but did not see the same product and publications open, thus allowing the invention patent application requirements, 提出 apply in accordance with the law.

Part of the formula:

10. . . Test device

11. . . Probe

111. . . Probe

12. . . Tester

13. . . Stage mechanism

131. . . Slide rail

132. . . Loading platform

133. . . Fixture

134. . . Vacuum nozzle

135. . . Pusher

14. . . Wafer

Part of the invention:

20. . . Feeding 匣

twenty one. . . First temporary area

twenty two. . . Feeding area

twenty three. . . First space

twenty four. . . Second space

25. . . Second temporary zone

26. . . Third temporary zone

27. . . First receiving area

28. . . Second receiving area

29. . . First receipt

30. . . Second receipt

31. . . Test device

311. . . Probe

32. . . Transfer zone

33. . . Transfer zone

34. . . First transfer device

341. . . Slot

342. . . Vacuum nozzle

343. . . Pusher

35. . . Second transfer device

351. . . Slot

352. . . Vacuum nozzle

353. . . Pusher

36. . . Pick and place device

361. . . Pick and place

40A. . . Trays

40B. . . Trays

40C. . . Trays

40D. . . Trays

50A. . . Wafer

Figure 1: Schematic diagram of a conventional wafer test apparatus.

Figure 2: Schematic diagram of the operation of the conventional wafer test device (1).

Figure 3: Schematic diagram of the operation of the conventional wafer test device (2).

Figure 4: Schematic diagram of the operation of the conventional wafer test device (3).

Figure 5: Schematic diagram of the architecture of the present invention.

Figure 6: Schematic diagram of the operation of the present invention for performing wafer testing and sorting operations (1).

Figure 7: Schematic diagram of the operation of the wafer test and classification operation of the present invention (2).

Figure 8: Schematic diagram of the operation of the wafer test and classification operation of the present invention (3).

Figure 9: Schematic diagram of the operation of the wafer test and classification operation of the present invention (4).

Figure 10: Schematic diagram of the operation of the wafer test and classification operation of the present invention (5).

Figure 11: Schematic diagram of the operation of the present invention for performing wafer testing and sorting operations (6).

Figure 12: Schematic diagram of the operation of the wafer test and classification operation of the present invention (7).

Figure 13: Schematic diagram of the operation of the present invention for performing wafer testing and sorting operations (8).

Figure 14: Schematic diagram of the operation of the present invention for performing wafer testing and sorting operations (9).

Figure 15: Schematic diagram of the operation of the present invention for performing wafer testing and sorting operations (10).

Figure 16: Schematic diagram of the operation of the present invention for performing wafer testing and sorting operations (11).

20. . . Feeding 匣

twenty one. . . First temporary area

twenty two. . . Feeding area

twenty three. . . First space

twenty four. . . Second space

25. . . Second temporary zone

26. . . Third temporary zone

27. . . First receiving area

28. . . Second receiving area

29. . . First receipt

30. . . Second receipt

31. . . Test device

311. . . Probe

32. . . Transfer zone

33. . . Transfer zone

34. . . First transfer device

341. . . Slot

342. . . Vacuum nozzle

343. . . Pusher

35. . . Second transfer device

351. . . Slot

352. . . Vacuum nozzle

353. . . Pusher

36. . . Pick and place device

361. . . Pick and place

40A. . . Trays

40B. . . Trays

40C. . . Trays

Claims (12)

The invention relates to a wafer automatic test sorting machine, which comprises: a feeding device: a tray disposed at a front end of the machine for accommodating a wafer to be tested; and a receiving hopper: disposed at a front end of the machine, at least There is a first receiving hopper and a second receiving hopper to store the trays with the completed wafers according to different grades; the test device is arranged at the rear end of the machine, and is provided with a probe and a tester to treat The test wafer is tested; the transfer device is disposed in the transfer area of the machine and can be moved between the transfer area and the test device, and has a socket for holding the wafer to be tested to transfer the wafer to be tested. Test the test by contacting the probe in the test device, transferring the finished wafer to the transfer area after the test is completed, for sorting and receiving operations; pick and place device: having a pick and place device to feed the feed The wafer to be tested on the tray is placed on the socket of the transfer device, and the finished wafer on the tray is sorted and placed on the tray of the receiving tray; the central processor is used to control and integrate the devices. Actuate to perform automated work. The automatic wafer sorting machine according to claim 1, wherein the feeding device is movable up and down to accommodate a tray on which the wafer to be tested is placed. According to the automatic test sorting machine of the first aspect of the patent application, the first temporary setting area and the feeding area are provided, and the tray on which the wafer to be tested is placed on the feeding cassette can be moved to the first The temporary area and the feeding area are used for feeding operations in the feeding area. The automatic wafer sorting machine according to the first aspect of the invention, wherein the first receiving hopper and the second receiving hopper are respectively provided with a first receiving area and a second receiving area for performing The receiving operation of the wafers of different grades is completed, and after the tray is fully loaded, the tray can be moved to the first receiving magazine or the second receiving magazine for storage. The automatic wafer sorting machine according to the first aspect of the invention, wherein the first receiving magazine and the second receiving magazine are movable up and down to accommodate a tray on which the wafer is completed. According to the automatic test sorting machine of the first aspect of the patent application, the first and second open spaces are provided for accommodating the empty tray and providing the empty tray to the receiving magazine. The automatic wafer sorting machine according to claim 6 , wherein the first and second air systems are movable up and down to accommodate and provide an empty tray. The automatic wafer sorting machine according to the sixth aspect of the patent application, wherein the first and second airside rear sides are respectively provided with a second temporary zone and a third temporary zone, and the first and second air zones are respectively The empty tray on the raft can be moved to the receiving hopper via the second temporary zone or the third temporary zone. The automatic wafer sorting machine according to claim 1, wherein the probe of the testing device is movable up and down to contact the wafer to be tested and perform a test operation. The automatic wafer sorting machine according to claim 1, wherein the transport device comprises first and second transfer devices, and the first and second transfer devices are respectively movable between the two transfer regions and the test device. , to alternately transfer the wafer to be tested and completed. The automatic wafer sorting machine according to claim 1, wherein the first and second transfer devices are provided with a vacuum nozzle and a displacement member that can be driven by a driving source to accurately position the wafer on the transfer device. . The wafer automatic test sorting machine according to claim 1, wherein the pick-and-place device of the pick-and-place device is capable of three-way displacement to pick up and place the wafer.