200916393 九、發明說明： 【發明所屬之技術領域】 土發明係提供-種可自動化執行晶片測試及分類作業， 〜先前更利性及測試產能之晶片自動測試分類機。、 料^晶片於完成切割料後，業者為確保⑼良率及避免後 成本浪費，因此在執行封裝製程之前，均會進行晶 0係於機架上架設-探針1 ιδ:該具ί 判別屮器12，該測試器12係用以 ⑻出良，片或不良4片，另於探針丨丨下方 、^構13 ’該載台機構！3係於—滑執i 3 i上 具13 驅動源驅動而可作升降位移之治 進而治具1 3 3可經由載台1 3 2的帶動，以水平移 11^=1了3=再以驅動源軸上升以接觸探針 及心隹紅11 I 口具133之頂面設有一真空吸嘴134 =可由轉源驅動郷之推移件i 3 5，娜移件 二 i 34吸附晶片時，稍微推移晶片位移以利對位測試;、 =====之治具⑴上，該治具 1 4可準確對位於探針i ] ^測晶片1 4 ’為使待測之晶片 位完畢後，該載台機構1 3即載J、、:2 J貝晶片1 4定 位移至探針一⑴ 200916393 作上升位移，而穿伸於機架之通孔中，以人 =11之探針111，俾以利用探針17寺==片14接觸 片1 4，以執行晶片i 4的測試作業，該待測之晶 之晶片1 4為良品或不良品後，即可 2於判別待測 ^式將完測之⑻分置於各酬之收料處'/俾^ ’該待機時間過長將嚴_測試ίΐ，’ ί 化及提升檢測產能之趨勢下，如何設計-種可全 者致Z研發分類之作業’以有效提升檢測產能，即為業 【發明内容】 -·於要目的係提供一種晶片自動測試分類機，其係包含 之供!^、收料Ε及空11，另於機台後端則設有具 S，°_i十之測試裝置，以及於測試裝置與轉運區間設有轉運 ^ >Λ 放裝置係可將供料匣上待測之晶片取放於轉運裝置200916393 IX. Description of the invention: [Technical field to which the invention pertains] The Department of Soil Invention provides a wafer automatic test sorting machine that can automatically perform wafer testing and sorting operations, and previously more advantageous and test throughput. After the completion of the cutting material, the manufacturer will ensure (9) the yield and avoid the waste of the cost. Therefore, before the packaging process is performed, the crystal system will be erected on the rack - probe 1 ιδ: The device 12 is used for (8) good, slice or bad 4 pieces, and under the probe 、, 13' the stage mechanism! The 3 series is driven by the 13 drive source and can be used as the driving force for lifting and lowering. The fixture 1 3 3 can be driven by the stage 1 3 2 to shift horizontally by 11^=1 3= The drive source shaft rises to contact the probe and the heart blush 11 I. The top surface of the mouthpiece 133 is provided with a vacuum nozzle 134 = the shifting member i 3 5 that can be driven by the transfer source, and the nano-moving member i 34 absorb the wafer, slightly The wafer displacement is shifted to facilitate the alignment test; and the fixture of the ===== (1), the fixture 14 can be accurately located on the probe i] ^ the wafer 1 4 ', so that the wafer to be tested is completed, The stage mechanism 13 is loaded with J, and the 2 J-shell wafer 14 is positioned to move to the probe one (1) 200916393 for upward displacement, and penetrates into the through hole of the frame to be the probe 111 of the person=11.俾Using the probe 17 Temple==slice 14 to contact the sheet 14 to perform the test operation of the wafer i 4, after the wafer 14 to be tested is a good or defective product, the discrimination is to be determined. The completion of the test (8) is placed in the receipt of each payment '/ 俾 ^ ' The standby time is too long will be strict _ test ΐ, ' ί ̄ and improve the detection capacity trend, how to design - can be all to Z R&D classification Industry's effective improvement of testing capacity, that is, the industry [invention content] -····································································· There is a test device with S, °_i ten, and a transfer device in the test device and the transfer section. The transfer device can take the wafer to be tested on the feed device to the transfer device.
Fl^可將轉運襄置上完測之晶片，依據測試結果分別取放於不 ^、收料匣，進而可自動化進行供料及執行測試作業，並依 之自動分類收置，達到有效提升作業便利性及測試產能 明另一目的係提供一種晶片自動測試分類機，其係於測 试裝置”轉運區間設有二轉運裝置，其中一轉運裝置於進行測試 作業，，另一轉運裴置則可於轉運區進行收料作業及供料作業， 而=父替接續的將待測晶片移載至測試裝置進行測試，進而降低 測式裝置的賴時間，達财效提升職產能之使用效益。 200916393 【實施方式】 為使貴審查委員對本發明作更進一步之瞭解，茲舉一較佳 實施例並配合圖式，說明如后：Fl^ can put the transfer 上 on the tested wafer, and according to the test results, it can be placed in the 不, 收 匣, and then can automatically carry out the feeding and test operations, and automatically sorted and collected according to the test, to achieve effective lifting work Sex and Test Capacity Another objective is to provide an automatic wafer sorting machine that is equipped with two transfer devices in the transfer device. One transfer device is used for testing operations, and the other transfer device is available. The transfer area performs the receiving operation and the feeding operation, and the parent replaces the wafer to be tested to the test device for testing, thereby reducing the time of the measuring device and achieving the benefit of using the financial efficiency to improve the production capacity. MODE FOR CARRYING OUT THE INVENTION For a better understanding of the present invention by the reviewing committee, a preferred embodiment will be described with reference to the following drawings:
請參閱第5圖，本發明係於機台之前端設有供料匣2 〇、第 一、二空匣2 3、2 4及不同等級之第一、二收料匣2 9、3 〇， 該供料匣2 0係可升降以供收納承置有待測晶片之料盤4 〇A， 置有待測晶片之料盤40A係可由供料匣2 〇推移至後側之第一 暫置區21及供料區2 2，而由供料區2 2進行供料作業；第一、 二空匣2 3、2 4係可升降以供收納空料盤4 〇B、4 〇c，第一、 二空E2 3、24並可分別提供空料盤4QB、4〇c經第 區2 5及第三暫置區2 6而至第-收料區2 7及第二收料區？只 ’以於第-收料區2 7及第二收料區2 8承置不同等級之完測曰 片，並於料盤滿載後移入可升降收納之第一、二收 ^阳 3 0 ;另機台後端設有測試裝置3 1，該測試裝置3 μ 器（圖面未示）及可升降之探針3 i丨，二可分別移^^= 32、33及測試裝置3 1間之第-、二轉運裝置& 其係分別設有可供承置晶片之槽座341、^r ^、 b， 座sms i下方設有真空吸嘴mm” 3 4 1、3 5 1側方設有可由驅動源驅動位移之推^ =座 3 5 3，該推移件3 4 3、3 5 3可於真空吸嘴3 4 9 0 c 吸附晶片時，稍微推移晶片位移以利對位，進而—352 置3 4、35可交替的將待測晶片移载至測試裝;'二轉，裝 試，並於完成測試後移載至轉運區3 2、3 3，一 以進行測 係設有可作三方向（X-Y-Z)位移之取放器3 6 ’ =放裳置3 6 2 2將待測晶片取放於第一、二韓運萝詈^ ^ 而可於供料區 二轉運裝置3 4、3 5上完敗晶/，依據將第一、 於不同等級之第一收料區2 7及第二收料區2 8 果分別取放 行自動化之供料及分類收料的作業。 <料盤上’以進 請參閱第6圖，本發明於進行晶片自動化測試作業時，其供 200916393 料匣2 0係將承置有待測晶片之料盤4 〇A推移至供料區2 2，而 由供料區22進行供料作業，而第一、二空g23、24則分別 將空料盤4 OB、4 QC推移至第-收料區2 7及第二收料區2 8 ’以於第一收料區2 7及第二收料區2 8承置不同等級之完測晶 片。 參閱第7圖，接著取放裝置3 6之取放器3 6 1會移動至 供f區2 2，並於吸取料盤4 0A上待測之晶片5 〇八後，將待測 之晶片5 0A放置於第一轉運裝置3 4之槽座3 4丄内。請參閱第 8圖，當第一轉運裝置3 4之槽座3 4丄滿載時，第一轉運裝置 3 4之真空吸嘴3 4 2將會輕微吸附晶片 5 0A，並以推移件 3 4 3稍微推移晶片5 〇 A位移對位。Referring to Figure 5, the present invention is provided with a feed 匣 2 〇, a first and a second space 2 3, 2 4 at the front end of the machine, and first and second receiving 匣 2 9 and 3 不同 of different grades. The supply 匣20 is movable up and down for accommodating the tray 4 〇A on which the wafer to be tested is placed, and the tray 40A on which the wafer to be tested is placed from the supply 匣2 至 to the first temporary position on the rear side Zone 21 and supply zone 22, and feeding operation by feeding zone 22; first and second space 2 3, 2 4 can be raised and lowered for accommodating empty trays 4 〇 B, 4 〇 c, One or two empty E2 3, 24 and can provide empty trays 4QB, 4〇c via the first zone 25 and the third temporary zone 26 to the first-receiving zone 27 and the second receiving zone? Only the first and second collections of the first and second collections of the movable storage trays can be placed in the first and second receiving areas 2 7 and the second receiving area 28 8; The back end of the machine is equipped with a test device 3 1, the test device 3 μ (not shown) and the liftable probe 3 i丨, 2 can be moved separately ^^= 32, 33 and the test device 3 1 The first and second transfer devices & respectively are provided with sockets 341, ^r ^, b for holding the wafer, and a vacuum nozzle mm" 3 4 1 , 3 5 1 lateral side is provided below the seat sms i There is a pusher 3 3 3 that can be driven by a driving source, and the pusher 3 4 3, 3 5 3 can slightly shift the wafer displacement to facilitate alignment when the vacuum nozzle 3 4 9 0 c adsorbs the wafer, thereby further —352 Place 3 4, 35 can alternately transfer the wafer to be tested to the test equipment; 'two turns, load test, and after the test is completed, transfer to the transfer area 3 2, 3 3, one for the test system Can be used as a three-direction (XYZ) displacement pick-and-placer 3 6 ' = put the skirt 3 6 2 2 to take the wafer to be tested in the first and second Han Yun Luo 詈 ^ ^ and in the feeding area two transfer device 3 4, 3 5 after the defeat of the crystal /, according to the first, in The first receiving area 2 7 and the second receiving area 28 of the same level respectively take the automatic feeding and sorting and receiving operations. <Before the tray, please refer to Fig. 6, the present invention is carried out In the wafer automated test operation, the 200916393 material is used to feed the tray 4 〇A of the wafer to be tested to the supply area 22, and the supply area 22 performs the feeding operation, and the first The second empty g23, 24 respectively shifts the empty tray 4 OB, 4 QC to the first receiving area 27 and the second receiving area 2 8 ' for the first receiving area 27 and the second receiving area 2 8 The test wafers of different grades are placed. Referring to Fig. 7, the pick-and-place device 3 6 1 of the pick-and-place device 3 6 will move to the wafer for the f-zone 2 2 and the wafer to be tested on the suction tray 40 A. After the second, the wafer 50 to be tested is placed in the socket 34 of the first transfer device 34. Referring to Fig. 8, when the socket of the first transfer device 34 is fully loaded, the first The vacuum nozzle 3 4 2 of a transfer device 34 will slightly adsorb the wafer 50A and slightly shift the wafer 5 〇A by the shifting member 343.
請參閱第9圖，接著第一轉運裝置3 4將待測之晶片5 0A f入至測试裝置31之探針311下方，探針31ι並下降接觸 晶片5 0A以進行測試作業，此時，取放裝置3 6之取放器3 6工 會再移動至供料區2 2，繼續將待測之晶片5 0A放置於第二轉運 裝置3 5之槽座3 51内。請參閱第1〇圖，當第二轉運裝置 3 5之槽座3 51滿載時，第二轉運裝置3 5之真空吸嘴3 5 2 將會輕微吸附晶片5 0A，並以推移件3 5 3稍微推移晶片5 0A 位移對位。 上/請參閱第1 1圖’當第一轉運裝置34上之晶片50A完成測 試後，第一轉運裝置3 4將移出至轉運區3 2，而第二轉運裝置 3 5則將另一批待測之晶片5 〇A移入至測試裝置31之探針 311下方，以進行測試作業。請參閱第丄2圖，當第一轉運裝 置3 4將完測之晶片5 0A移出至轉運區3 2後，取放裝置3 6之 取放器3 6 1將會依據測試結果由控制器（圖面未示）控制驅動， 將第一轉運裝置3 4上不同等級之晶片分別放置於第一收料區 2 7及第二收料區2 8上之空料盤4 OB、4 0C，以自動化的進 行第一轉運裝置3 4上晶片完測後之分類作業。 請參閱第1 3圖’當第一轉運裝置3 4上之晶片5 0A完成分 200916393 測之晶片50A放ίΑ6取放361續從供料區22將待 測之曰曰片5 0Α放置於第一轉運裝置3 第14圖，當第二轉_置35上之曰内。月參閲 艫運奘罟q 山 d ϋ之曰日片5 〇A完成測試後，第二 轉運裝置35將移出至轉運區33 接續進行職作業。料R ^ 11下方’以 刺之曰Μ 5 ΠΑ #山閱第15圖，當第二轉運裝置3 5將完 測之日日片5 0Α移出至轉運區3 3後， 3 61將會依據測試結果由护制考Γ 置3 6之取放器 一轉運裝㈡R μπηί由控f (圖面未不）控制驅動，將第 二轉建裝置3 5上不同等級之晶片分別 第二收料區2 8上之空料盤4⑽、/〇, 收科&2 7及 取完後’該空料』Γο : =測之晶片被 ^ 2 2 iJ4 °D 2 2 ^ 質及有效提升作業便利性= 及進步性之設計，鈇来男右 皿實為冰具實用性 明專利申請要件，ϊ^ί^ί產品及刊物公開，從而允符發 【圖式簡單說明】 第2圖 第3圖 第4圖 第5圖 第6圖 第7圖 第1圖：習式晶片測試裝置之示意圖。 習式晶片測試裝置之動作示意圖（ 2晶>}測試裝置之動作示意圖（二> 片測試裝置之動作示意圖（三)。 本發明之架構示意圖。 行；測試及分類作業之 本發明執行晶片測試及分類作業之動作示ίΓ(」。 200916393 第8圖：本發明執行晶片測試及分類作業之動作示意圖（三）。 f9圖：本發明執行晶片測試及分類作業之動作示意圖（四）。 f10圖：本發明執行晶片測試及分類作業之動作示意圖（五）。 第1 1圖：本發明執行晶片測試及分類作業之動作示意圖（六）。 ^12圖：本發明執行晶片測試及分類作業之動作示意圖（七）。 第13圖：本發明執行晶片測試及分類作業之動作示意圖（八）。 第14圖：本發明執行晶片測試及分類作業之動作示意圖（九）。 第15圖：本發明執行晶片測試及分類作業之動作示意圖（十 ，1 6 ^ :本發明執行晶片測試及分類作業之動作示意圖（十一）。 【主要元件符號說明】 習式部分： 1〇:測試裝置 11:探針 111:探針 1 2 :試器Referring to FIG. 9, the first transfer device 34 then inserts the wafer 50A to be tested under the probe 311 of the test device 31, and the probe 311 is lowered to contact the wafer 50A for testing operation. The pick-and-place device 36 of the pick-and-place device 36 moves to the supply area 22, and continues to place the wafer 50A to be tested in the socket 3 51 of the second transfer unit 35. Referring to FIG. 1 , when the socket 3 51 of the second transfer device 35 is fully loaded, the vacuum nozzle 3 5 2 of the second transfer device 35 will slightly adsorb the wafer 50A and push the piece 3 5 3 Slightly shift the wafer 50A displacement alignment. Above / please refer to FIG. 1 'When the wafer 50A on the first transfer device 34 is tested, the first transfer device 34 will be removed to the transfer zone 32, and the second transfer device 35 will be another batch The wafer 5 〇A is moved under the probe 311 of the test device 31 for the test operation. Referring to FIG. 2, after the first transfer device 34 removes the finished wafer 50A to the transfer area 3 2, the pick-and-place device 3 6 1 of the pick-and-place device 36 will be controlled by the controller according to the test result ( The control drive is performed, and the wafers of different grades on the first transfer device 34 are placed on the empty trays 4 OB, 40C on the first receiving area 27 and the second receiving area 28, respectively. The sorting operation after the wafer is completed on the first transfer device 34 is automatically performed. Please refer to Figure 1 3 'When the wafer on the first transfer device 3 4 is completed, the wafer 50A is divided into 200916393. The wafer 50A is placed on the wafer 50A. The pick-and-place 361 continues to place the wafer 50 to be tested from the supply area 22 in the first place. Transfer device 3 Figure 14, when the second turn is placed on the top of the 35. Monthly reference 舻 奘罟 山 q 山 d ϋ 曰 5 5 5 After completing the test, the second transfer device 35 will be removed to the transfer area 33 for subsequent work. Below the material R ^ 11 'to the thorn 曰Μ 5 ΠΑ #山阅第15图, when the second transfer device 3 5 will be removed from the day of the test, the film will be removed to the transfer area 3 3, 3 61 will be tested according to the test The result is controlled by the protective device. The pick-and-place device (2) R μπηί is controlled by the control f (not shown), and the second transfer device 3 has different levels of wafers in the second receiving area 2 8 empty tray 4 (10), / 〇, receipt & 2 7 and after the completion of the 'empty material Γ ο : = measured wafer was ^ 2 2 iJ4 °D 2 2 ^ quality and effective lifting work convenience = And the progressive design, the man's right dish is actually practical and patent application requirements for ice, ϊ^ί^ί products and publications are published, so that the symbol is simple [Figure simple description] Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 1: Schematic diagram of a conventional wafer test apparatus. Schematic diagram of the operation of the conventional wafer test apparatus (2 crystals)} The operation diagram of the test apparatus (2) The schematic diagram of the operation of the sheet test apparatus (3). Schematic diagram of the structure of the present invention. The test execution and classification operation of the present invention executes the wafer Test and classification operation actions Γ Γ (". 200916393 Figure 8: Schematic diagram of the operation of the wafer test and classification operation of the present invention (3) f9 Figure: The operation diagram of the wafer test and classification operation of the present invention (4). Figure: Schematic diagram of the operation of the wafer test and classification operation of the present invention (5). Fig. 1 : Schematic diagram of the operation of the wafer test and classification operation of the present invention (6). Figure 12: The present invention performs wafer test and classification operations. Schematic diagram of action (7) Fig. 13: Schematic diagram of the operation of the wafer test and classification operation of the present invention (8). Figure 14: Schematic diagram of the operation of the wafer test and classification operation of the present invention (9). Figure 15: The present invention Schematic diagram of the operation of performing wafer testing and sorting operations (10, 16 6 : The operation of the present invention for performing wafer testing and sorting operations) Intent (XI) The main element of formula Xi portion REFERENCE NUMERALS: 1〇: test apparatus 11: Probe 111: 12 Probe: debugger
4 載台機構 1 :滑轨 4:真空吸嘴 :晶片 13 2 :載台 13 5 :推移件 本發明部分：4 Stage mechanism 1 : Slide rail 4: Vacuum nozzle: Wafer 13 2 : Stage 13 5 : Pusher part of the invention:
第一空匣 第三暫置區 第一收料匣 測試裝置 轉運區 44 供料匣 第一轉運裝置 :槽座 第二轉運装置 :槽座 21:第一暫置區 2 4 :第二空11 2 7 :第一收料區 3 〇 ·•第二收料匣 311:探針3 3 :轉運區 3 4 2 :真空吸嘴 3 5 2 :真空吸嘴 2 2 :供料區 2 5 :第二暫置區 2 8 :第二收料區 3 4 3 :推移件 3 5 3 :推移件 10 200916393 3 6 :取放裝置 3 61 :取放器 4 0A:料盤 4 0B:料盤 4 0C:料盤 4 0D :料盤 5 0 A.晶片 11First open third temporary zone first receiving 匣 test device transfer area 44 feeding 匣 first transfer device: trough second transfer device: trough 21: first temporary zone 2 4: second empty 11 2 7 : First receiving area 3 •·• Second receiving 匣 311: Probe 3 3 : Transfer area 3 4 2 : Vacuum nozzle 3 5 2 : Vacuum nozzle 2 2 : Feeding area 2 5 : 2 temporary area 2 8 : second receiving area 3 4 3 : pusher 3 5 3 : pusher 10 200916393 3 6 : pick and place device 3 61 : pick and place unit 4 0A: tray 4 0B: tray 4 0C : tray 4 0D : tray 5 0 A. wafer 11