九、發明說明： 【發明所屬之技術領域】 電性測試，且可在3進3佳^ 【先前技術】 本電ϊ,>]ΐϊΐΐ5ίί完成封裝後之測試作業，係先於一基 口 mu機上進彳了基本概峨，完絲本電 ί包'%統層_試機進行測試’·基本電性測試機的^Nine, invention description: [Technical field of invention] Electrical test, and can be in 3 into 3 good ^ [Prior technology] This electric ϊ, > ΐϊΐΐ 5 ίί After the completion of the package test operation, prior to a base mu The machine has entered the basic outline, and the wire is powered by the '% layer _ test machine for testing' · basic electrical test machine ^
TEST> POWER u ’而系統層級測試機則請參閱第 91210786 實際配合使用之實以= 士貫際環境中作各功能測試，以提升測試結 用之基本電性測試機及系統層__為各 别早機測甙，在測試作業之進行上則顯得不便。 妹情形’遂有業者將基本電性測試及公板測試 7「丰;ί;^2上;請參閱第2圖，其係為申請第93109078 號+導體構褒兀件之自動化測試震置」專利案，其工作 1 ◦上具有第-測試^ i及第二測試區丄2，—可對 ; 電性測試之第—測試單3，係具有-測試ί 1 3 電性測試之半導體元件進行公板測試之第二測 41，並設置於工作平台1 〇之第二測試ίΐ 5，Ί η’斗早元1 5係設置於工作平台1 〇之前端，而緊鄰工作 平台10，其並具有可堆疊容置半導體承載盤之供料匣丄 以提供待測之半導體元件；—触單元i 6絲設敎作平台丄 ^42596 0上，並具有一可於工作平台丄〇 臂1 6 i，靖供料單w 5彳铜之飾之機械手 —出料單元1 7係設置於I作平” n 件私至指定位置； 5間隔相鄰，其並具有複數個分’而與供料單元1 果裝載完測之半導體元件；一緩衝單 :，分別依據測試結 0上，係具有複數個緩衝承座 設於工作平台1 第-測試單元i 3之測試心以第移=分麟應 1 4 1 ; -壓持單元丄9係設置 六:? 3‘式公板 之測試公;“二= 附取出並壓持置人測;將半導體元件吸 κ;内取出:並運送至第-以===== 由壓持ί 1 q I1 ’緩衝承座1 8 1再移入壓持件1 9 1下方， 退出、π拉杜1 °。附取出待測之半導體元件，緩衝承座1 8 1再 =壓持件191即將待測之半導體元件 |1 1内，以進行基本電性測铽，6占 了 t八’只旱丄d 1吸附取出完測之件，==，後，壓持件1 9 1 Q T , _导體凡件緩衝承座1 8 1則再移入壓持件 1 8 1内，緩衝1將完測之半導體元件置人緩衝承座 1 ί81再退出測試槔1 3 1，接著機械手臂 類…i内;測气類置入於標記電性不良品之分 元件運送移載至測4忿” f°〇 ’則機械手臂1 6 1將半導體 承庙Wi 1^，板1 4 1對應之緩衝承座1 8 1上，缓衝 待測之半導r - ft件1 9 1下方’由麼持件1 9 1吸附取出 待測之丰! ’緩衝承座181再退出，壓持件191即將 t tff,7!: _置人測試公板141内，以進行公板測 緩衝U 後，顯件191吸附取出完測之半導體元件， 完測之本則再移Ayf持件191下方，由愿持件191將 “ 導體70件置入緩衝承座1 8 1内，缓衝承座1 8 1再退 1342596 出測試公板141，接著機械手臂161依據測試結果，將完測 之半導體元件置入分類置入於各分類匣171内；上述之設備雖 可於機台上同時進行基本電性測試及公板測試，以增進測試產能 及降低設備成本，惟其在機台之配置架構上仍具有如下之缺失： 1 . a其係於原有公板測試之測試區内增設進行基本電性測試之測TEST> POWER u 'and the system level test machine, please refer to the 91210786 actual use of the actual use of the test in the internal environment to improve the test of the basic electrical test machine and system layer __ for each Don't test the machine early, it is inconvenient in the test operation. Sister's situation 'The industry will conduct basic electrical testing and public board testing 7 "Feng; ί; ^2; please refer to Figure 2, which is the application of the 93109078 + automatic construction of the conductor structure shocked" In the patent case, the work 1 has a first test and a second test area 丄2, which can be used; the first test of the electrical test 3, which is a semiconductor component with a test ί 1 3 electrical test The second test of the public board test 41, and is set on the work platform 1 〇 second test ΐ 5, η η '斗早元 1 5 series is set at the front end of the working platform 1 ,, and adjacent to the work platform 10, which has The feeding device of the semiconductor carrier can be stacked to provide the semiconductor component to be tested; the contact unit i 6 is arranged on the platform 42^42596 0, and has a working platform arm 1 6 i, Jing supply material w 5 彳 copper decoration robot - discharge unit 1 7 series set at I flat" n pieces private to the specified position; 5 spaced adjacent, which has a plurality of points ' and the feeding unit 1 If the measured semiconductor components are loaded; a buffer list: according to the test node 0, there are a plurality of buffers The test heart of the first test unit i 3 of the working platform 1 is moved by the first shift = 1 lin; 1 - the holding unit 丄 9 is set to six: ? 3' type public test; "two = attached Press and hold the test; take the semiconductor component to κ; take it out: and transport it to the first -====== by pressing ί 1 q I1 'buffer bearing 1 8 1 and then moving into the holding part 1 9 1 , exit, π pullu 1 °. Attaching the semiconductor component to be tested, buffering the socket 1 8 1 and then pressing the component 191 to the semiconductor component to be tested |1 1 for basic electrical measurement, 6 accounted for t8' only drought d1 After the suction and removal of the measured piece, ==, after the holding piece 1 9 1 QT, the _ conductor of the member buffer socket 1 8 1 is then moved into the holding member 1 8 1 , the buffer 1 will be completed semiconductor component Set the person to cushion the seat 1 ί81 and then exit the test 槔 1 3 1, then the robot arm class...i; the gas metering device is placed in the marked component of the defective product and transported to the test 4忿” f°〇' The robot arm 1 6 1 will be the semiconductor bearing temple Wi 1 ^, the board 1 4 1 corresponding to the buffer socket 1 8 1 , buffering the semi-conducting r - ft piece to be tested below the 1 '1' by the holding piece 1 9 1 Adsorption takes out the abundance to be tested! 'The buffer seat 181 is re-exited, and the holding member 191 is about to t tff, 7!: _ is placed in the test board 141 for the public board to measure the buffer U, and the display 191 is sucked and removed. After measuring the semiconductor component, the test is then moved to the bottom of the Ayf holder 191. The holder 70 will place the 70 pieces of the conductor into the buffer socket 1 8 1 , and the buffer socket 1 8 1 retreat 1342596. Board 141, According to the test result, the robot arm 161 puts the completed semiconductor components into the classification 171. The above equipment can perform basic electrical testing and public board testing on the machine to improve the testing capacity. And reduce the cost of equipment, but it still has the following shortcomings in the configuration of the machine: 1. It is added to the test of the basic electrical test in the test area of the original public board test.
試埠131，以原先架構而言，相對的勢必縮減公板測試之 測試區，以供增設基本電性測試之測試埠i 3丄，然而因基 本電性測試之時間極短，而公板測試之時間較長，於縮減公 板測试之測試區後，其公板測試的測試埠數量將更無法匹配 於基本電性測試的產能，將導致完成基本電性測試的半導體 元件無法依時序接續進行公板測試’而必須停留於測試埠1 31内等待，進而產生過長之待機時間，而降低檢測產能。 2 ‘由於基本電性測試之測試埠丄3丄係設置於工作平台丄〇之In the original structure, in the original structure, the test area of the public board test is inevitably reduced for the test of the basic electrical test. However, due to the extremely short time of the basic electrical test, the public board test After a long period of time, after reducing the test area of the public board test, the number of test pieces of the public board test will be less able to match the capacity of the basic electrical test, which will result in the semiconductor components that have completed the basic electrical test cannot be connected in time series. For the public board test 'and must wait in the test 埠 1 31 to wait, resulting in excessive standby time, and reduce the detection capacity. 2 ‘Because of the basic electrical test test埠丄3丄 is set on the work platform丄〇
第一測試區11 ’而與公板測試的測試埠平行排列，如此的 架構，機械手臂161必須將待測之半導體元件自供料匣工 51内取出，再運送至遠端之第一測試單元測試埠丄3工内 進行基本電性測試，若測試結果為不良品，則機械手臂工6 1必須將不良品由測試淳131内移送取出至遠端之石芦0 之分舰⑴内，進而導致機械手臂16ιί==〇 長，而徒增運送時間，尤其單一組機械手臂16丄還 其他半導體元件的運送工作，機械手臂i 6 i運送路及 間過長’將嚴重影響工作時序上匹配之問題。 有鑑於此，本發明人遂以其多年從事相關行業的研發盥M =，針對目前所面臨之問題深人研究，經過長期努力之^ ^作’終究研創出-種補可先行料導體元件進行基 ^ ^ ’且可在不影響系統層級測試產能下，以最佳化移載 上 置’達到確保測試產能之測試分類機 … 此即為本發明之設計宗旨。 【發明内容】 以大幅改善習式之缺弊， m 7 =之半導體元件機種系統層級測 開、短路測試裝置，不前端設置 ΐί-"?ί -2^：' 產能之目的。 々行糸統層級測试，達到確保測試 試之半導體元件自3、、短，測，系統層級測 料E、空度、數個收料 ’ ’八係於機台之前端分別設有供 成將= ==後:㈤ 了先進行基;電^試且===為= 口口，以較紐之運达路徑及時間移送至鄰側 路徑的配置’達到確侧試產能ί目的。 實施；ί委=:明作更進-步一 睛參閱第3圖’本發明係於機台2 〇 導體元件料盤之供 設於機台 空料盤之空Ε2 2、 及數個π於機台别端開、短路測試裝置2 3右側位置之系統層級 1342596 測試之分類收料匣2 5，機台2 〇之後端位 個系統層級測試裝置2 6，另裝設於機台2 包括有移動於機台前端區域之前機械手f2 7係 ，端區域之轉運台2 8及移動於機台後端區域之後機械手<臂2 ^，而可接續運送半導體元件進行開、娜基本電性測試及 層級測试。本發明由於係於機台2 〇前端與供 y'。 ^暮樣置2 6之數量下（本實施例為六組），不僅可 :茄======= ㈣===== ^動别後移動及動力源2 3 5驅動升降之下|頭2 3 3 '，其於向 夺;?機械手臂2 7可將待測半導體元件放置於測^ A 3 3再向後移入並下降下壓半導體元件以進ί ί，生測試’完測後下壓頭2 3 3再上升並向前移 ，機械手臂2 7將該不良品移載至相鄰之不良 進行抑# 4丨，右為良品卿載至_之轉運台2 8上，以接續 不本發明由於係於機台2 0前端與供· 2 1 Π 及轉運台2 8相鄰處設置開、短路測聰2 短之ί 路基本電_試結果為不良品敍品時，以較 運l路！及時間移送至鄰側不良品之收料g 2 4或轉運 請1=圭ΐ移載ΐ徑的配置，確保工作時序的有效匹°配。 结果口夕尘道7圖’當轉運台2 8將開、短路基本電性測試 果為良品之料體元件賴域台2 G之後端時，後機械手臂 [S1 9 1342596 參閱第7、8圖Ϊ件，並分置於系統層級測試裝置26内。請 二蔣？ 糸統層級測試裝置2 6係於測試區内裝設實 Γ之測η越⑽域手臂2 9料導體元件誠至實體板2 6 :下壓頭2 6 2將會下降壓抵半導體元件，使i 完測後fit座確實接觸’以進行系統層級的測試，於 之測試座内取出後機械手臂2 9再於實體板2 6 1 ’當後機械手臂2 9於實體板之測試座内取出 載严件赚轉運台2 8上，由於= 體元件，因此後機械手臂29會 的交換取置，而將完成系統層級測試之半導 2，上展並吸取欲接續進行系統層級測試之半導體元件：以移i 至糸統層級測試裳置2 6。請參閱第！ ◦圖，轉運= 系統層級測試之半導體元件移出至機台2 Q之前端後播二 臂2 7將會依據系統層級測試之結果， | 繊、峨本酬 性測r且=====最=_ 性之設計’絲見有相同之產品及刊物公開 及進步 申請要件，爰依法提出申請。 允付么明專利 【圖式簡單說明】 第1圖:=;Γ786號ric檢測—^ 第2圖：係為申請第93109078號「半導體播肚_ ^ 裝置」專利案之架構示意圖。 、凡之自動化測試 第3圖：本發明之架構示意圖。 10 1342596The first test area 11' is arranged in parallel with the test 埠 of the public board test. In such a structure, the mechanical arm 161 must take out the semiconductor component to be tested from the supply completion 51 and then transport it to the remote first test unit for testing.埠丄3 The basic electrical test is carried out in the work. If the test result is a defective product, the mechanical arm worker 6 1 must transfer the defective product from the test 淳131 to the remote detachment (1) of the Shilu 0, which leads to The robotic arm 16ιί==〇 long, and the increase of the transport time, especially the single group of robotic arms 16丄 and the transport of other semiconductor components, the mechanical arm i 6 i transport path and the length of the 'will seriously affect the timing of the matching problem . In view of this, the inventor has been engaged in the research and development of related industries for many years 盥M =, for the deep-seated research on the problems currently faced, after a long-term effort to make a final investigation of the conductor elements Based on ^ ^ ' and can not be affected by the system level test capacity, to optimize the transfer on the top to achieve the test classification machine to ensure test capacity ... This is the design purpose of the invention. SUMMARY OF THE INVENTION In order to greatly improve the shortcomings of the formula, m 7 = semiconductor component system system level measurement, short-circuit test device, no front-end setting ΐί-"?ί -2^: 'The purpose of capacity. 々 糸 层 层 , , , 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体After ===: (5) First, the base is tested; the power is tested and === is = port, and the configuration of the path to the adjacent side is transferred to the adjacent side path. Implementation; 委 = =: Ming made more progress - step by step refer to Figure 3 'The invention is attached to the machine 2 〇 conductor component tray for the empty space of the machine tray 2 2, and several π The machine is not open, short circuit test device 2 3 system position on the right side of the system 1342596 test classification receipt 匣 2 5, machine 2 〇 rear end system level test device 2 6, installed in the machine 2 includes Before moving to the front end area of the machine, the robot f2 7 system, the transfer table 28 of the end area and the robot arm 2 arm after moving to the rear end area of the machine, can continue to transport the semiconductor components for basic and electrical performance. Testing and level testing. The invention is attached to the front end of the machine 2 and is supplied with y'. ^ 暮 置 置 2 2 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( |Head 2 3 3 ', its in the direction; the robot arm 2 7 can place the semiconductor component to be tested on the test A 3 3 and then move back and lower the semiconductor component to the ί, the test "after the test The lower pressing head 2 3 3 rises again and moves forward, and the robot arm 27 transfers the defective product to the adjacent badly performing the suppression, and the right is the good product to the transfer table 28 of the _ to continue The present invention is not based on the front end of the machine 20 and the supply and the 2 1 Π and the transfer station 2 8 adjacent to the open, short-circuited test 2 short ί Road basic electricity _ test results for defective products, Yun l road! And time transfer to the adjacent side of the defective goods g 2 4 or transfer Please 1 = the configuration of the transfer path to ensure the effective timing of the work sequence. Results: Figure 7: When the transfer station 28 is to open and short-circuit the basic electrical test results, the rear mechanical arm [S1 9 1342596 see Figures 7 and 8 The components are placed and placed in the system level test device 26. Please two Chiang?糸 层 测试 测试 2 2 2 层 层 层 层 层 层 层 层 层 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 After i completes the test, the fit seat does contact 'for system level test. After the test seat is removed, the robot arm 2 is then removed from the solid plate 2 6 1 ' and the rear mechanical arm 2 9 is taken out in the test stand of the solid board. On the transfer station 28, due to the body component, the rear robot arm 29 will be exchanged, and the semi-conductor 2 of the system level test will be completed, and the semiconductor component to be subjected to the system level test will be taken up. : Test the skirt 2 to the level of the move to the 糸 level. See the first! ◦图,Transportation = System level test of the semiconductor components removed to the machine 2 Q front end broadcast two arms 2 7 will be based on the results of the system level test, | 繊, 峨 酬 酬 且 and ===== =_ Sexual design's have the same product and publication disclosure and progress application requirements, and apply in accordance with the law. Allow payment of patents [Simplified description of the drawings] Figure 1: =; Γ 786 ric detection - ^ Figure 2: is the schematic diagram of the application of the "Semiconductor Broadcasting _ ^ Device" patent application No. 93109078. Automated Testing Where: Figure 3: Schematic diagram of the architecture of the present invention. 10 1342596
第4圖：本發明之動作示意圖（一）。 第5圖：本發明開、短路測試裝置之示意圖。 第6圖：本發明之動作示意圖（二）。 第7圖：本發明之動作示意圖（三）。 第8圖：本發明系統層級測試裝置之示意圖。 第9圖··本發明之動作示意圖（四）。 第1 0圖：本發明之動作示意圖（五）。 【主要元件符號說明】Figure 4: Schematic diagram of the action of the present invention (1). Figure 5: Schematic diagram of the open and short test device of the present invention. Figure 6: Schematic diagram of the action of the present invention (2). Figure 7: Schematic diagram of the action of the present invention (3). Figure 8 is a schematic illustration of the system level test apparatus of the present invention. Fig. 9 is a schematic view showing the operation of the present invention (4). Figure 10: Schematic diagram of the operation of the present invention (5). [Main component symbol description]
習用部分： 10 工作平台 11:第一測試區 13 第一測試單元 131 測試埠 14 第二測試單元 141 測試公板 15 供料單元 151 供料匣 16 輸送單元 161 機械手臂 17 出料單元 171 分類匣 18 緩衝單元 181 緩衝承座 19 壓持單元 191 壓持件 12:第二測試區 本發明部分： 2 0 :機台 21 :供料匣Conventional part: 10 Working platform 11: First test area 13 First test unit 131 Test 埠 14 Second test unit 141 Test board 15 Feed unit 151 Feed 匣 16 Transport unit 161 Robot arm 17 Discharge unit 171 Classification 匣18 Buffer unit 181 Buffer bearing 19 Pressing unit 191 Holding member 12: Second test area Part of the invention: 2 0: Machine 21: Feeding 匣
2 2 :空匣 2 3 3 :下壓頭 2 3 :開、短路測試裝置 2 31 :機架 2 3 2 :測試座 2 3 4 :動力源 2 3 5 :動力源 2 4 :不良品收料匣 2 5 :分類收料S 2 6 :系統層級測試裝置 2 61 :實體板 2 6 2 :下壓頭 27:前機械手臂 28:轉運台 2 9 :後機械手臂 [s] 112 2 : Open 2 3 3 : Lower indenter 2 3 : Open and short test device 2 31 : Rack 2 3 2 : Test stand 2 3 4 : Power source 2 3 5 : Power source 2 4 : defective product receipt匣 2 5 : Classification receipt S 2 6 : System level test device 2 61 : Solid board 2 6 2 : Lower head 27: Front robot arm 28: Transfer table 2 9 : Rear robot arm [s] 11