TWI416652B - With a single through the shuttle shuttle of the semiconductor components test machine - Google Patents

Abstract

Disclosed is an inspection machine for semiconductor component with single penetrating transport shuttle, which uses a supply arm to move semiconductor components for inspection in a supply case to a supply carrier of the penetrating transport shuttle. The export carrier accepts the inspected components brought by a test arm module at an exchange position. The shuttle moves to locate the supply carrier at the exchange position for the test arm module to haul the components to the test base to conduct an inspection. Meanwhile, the export carrier moves correspondingly to an export position to take out the inspected components with an export arm. The penetrating transport shuttle returns to the original place, so that the supply carrier is back to the supply position to load the next lot of components for inspection while the export carrier goes to the exchange position to accept the inspected components simultaneously. The back and forth movement of the shuttle not only simplifies the machine transport structure for reduced manufacturing cost, but also improves transport efficiency for increased competitiveness.

Description

Semiconductor component testing machine with a single through-feed shuttle

The present invention relates to a semiconductor component testing machine, and more particularly to a semiconductor component testing machine having a single through conveying shuttle.

At present, the methods for testing semiconductor components can be mainly divided into virtual testing and real-world testing, wherein the virtual testing is to write a specific test software according to different characteristics of each IC according to a predetermined circuit design, thereby confirming, for example, whether the feet are not between. Expected short circuit or open circuit, and whether it meets the predetermined logical relationship; the reality test is to blank the IC to be tested by the public board that has already completed the function, and fill each blank to be tested into the blank position. At this time, it is tested whether the public board can operate normally, thereby confirming that the function of the IC to be tested is normal, and the test result is used as a basis for classification. When testing different ICs, you only need to replace the different public boards and tested software.

In order to improve efficiency, the current test machine has been automated and tested for the process of measuring and measuring the semiconductor components to be tested. As shown in Figure 1, multiple sets of feeds 匣4 are stacked in the feed zone, and each feed 匣4 There are a plurality of semiconductor components to be tested. When starting the test, the lowermost feed 匣4 is first removed from the lower side of the drawing by about one row, and the input semiconductor arm 5 transfers the semiconductor component 5 to be tested in the first row of the feed hopper 4 to the lateral direction. On the moving feeder shuttle 33, the incoming shuttle 33 is then moved right to the position where the test arm assembly 22 ₁ can be taken, and the semiconductor component 5 to be tested is transferred by the test arm assembly 22 ₁ to the test stand 21 for testing.

After the test is completed, the test arm assembly 22 ₁ feeds the tested semiconductor component 6 to the discharge shuttle 34 above the drawing, and the discharge shuttle 34 is then moved right to the position where the discharge arm 32 can be taken, and discharged. The arm 32 is used as the classification basis of the tested semiconductor component 6 according to the test data, and is respectively transferred to the corresponding classification material in the plurality of classification materials at the lower right of the figure. When the previous semiconductor component is being tested, the input arm 31 has placed the next semiconductor component to be tested 5 on the input shuttle 33 and moved to the other test arm assembly 22 ₂ on the right to pick up the position. Therefore, when the left test arm assembly 22 ₁ moves the finished semiconductor component out of the test socket 21, the right test arm assembly 22 ₂ can feed the next semiconductor component under test 5 into the test socket 21 as soon as possible, and continue the next round of testing.

However, when the semiconductor component is transferred, the movement of the left test arm assembly 22 ₁ and the right test arm assembly 22 ₂ needs to be highly matched with each other, so that the manufacturing cost of the machine itself is thus high; and the handover process is more required with the input arm. And the movement speed of the discharge arm is limited to each other: in the three steps of feeding-testing-discharging, the slowest step will limit the overall output efficiency, and in the round-trip handover process, a little idle will be wasted for the faster one. waiting time. In particular, as shown in Figure 1, the feed arm only needs to be moved in the loading zone on the left side and the incoming feed shuttle shop, while the discharge arm needs to be in the sorting material at the bottom right of the shuttle and the bottom of the drawing. The movement between the discharge arms is much longer than the movement path of the feed arm, forcing the synchronous action of the overall cycle fit to be imperfect; once the time for the semiconductor component to be tested on the test socket is shortened, the above synchronization is not perfect. The higher the proportion of time wasted in the overall cycle, and the slower the output efficiency, the more obvious the benefits. In particular, when a large number of semiconductor components are tested, the output efficiency will be clearly limited. In addition, the test arm assembly performs semiconductor component testing in a two-dimensional movement manner, the structure is complicated, and the maintenance is troublesome, so that the cost and maintenance cost are relatively high, and in the automated test process, it is undoubtedly a standard that can be further improved.

Therefore, it is possible to provide a test machine in which each transfer robot arm moves in one-dimensional manner to transfer semiconductor components, and can speed up the transfer speed, and simplifies the structure and reduces the cost, so that the transfer speed can be improved to match the test speed. Not only can it reduce the idle time during testing, but the simplified test machine is relatively cheap in terms of cost and maintenance, and the probability of damage is low, making the automated test process less likely to be interrupted, reducing costs. It is also possible to test semiconductor components more efficiently.

SUMMARY OF THE INVENTION One object of the present invention is to provide a semiconductor component testing machine having a single through-feed shuttle that is shuttled back and forth along a path through a feed position, an exchange position, and a discharge position, so that the machine structure is simplified.

Another object of the present invention is to provide a through-transport shuttle having a plurality of carriers, wherein a part of the feed conveyor is required, and the other part is required to discharge, so that the in-and-out movement can be highly synchronized. The semiconductor component testing machine of the car.

Still another object of the present invention is to provide a semiconductor component testing machine having a single through-feed shuttle that allows linear switching between the feeding and discharging positions through the conveying shuttle in order to improve the efficiency of the transfer operation and the test operation.

A semiconductor component testing machine having a single through-feed shuttle is disclosed in the present invention for testing a plurality of semiconductor components to be tested placed in a magazine, the testing machine comprising: one for each of the at least one a receiving zone containing the aforementioned material, and a base for discharging a plurality of test areas of the semiconductor component magazine; a set of test devices disposed on the base, the testing device comprising: at least one having a test stand of at least one test position; and at least one set of test arm assemblies corresponding to the test stand for moving the semiconductor component to be tested or tested between a swap position corresponding to the test stand and the test position; and the test The machine further comprises: a set of conveying devices, comprising: a feeding arm disposed on the machine for moving the semiconductor component to be tested between a picking position corresponding to the feeding zone and a feeding position; a setting Moving the tested semiconductor component between the discharge position and a release position corresponding to the discharge zone on the machine table Discharge arm; a supporting base is formed with a plurality, and that through a feeding position, switching position and the feed position of the reciprocating pathway through the transport shuttle cars.

Since the semiconductor component testing machine with a single through-feed shuttle is disclosed in the present invention, the semiconductor component to be tested is transferred from the loading arm to a loading device containing the semiconductor component to be tested to the through-feed shuttle. The feeding carrier is driven through the conveying shuttle so that the feeding carrier corresponds to the test arm assembly, and at the same time, the discharging carrier corresponds to the discharging arm, and the feeding carrier is used by the testing arm assembly. The mechanical arm of the discharging device is transferred to the test seat for testing, and is driven through the conveying shuttle, so that the feeding carrier seat is again corresponding to the feeding arm, and the next batch of semiconductor components to be tested is again carried by the feeding carrier. At the same time as the loading arm is transferred, the test socket is also tested, and is driven again through the transport shuttle. The discharge carrier also corresponds to the test arm assembly, and the tested semiconductor component is again controlled by the robot arm. Extracted from the test stand and transferred and placed in the discharge carrier, when the transport shuttle is driven again to make the loading carrier correspond to the test arm assembly, and the discharge bearing of the tested semiconductor component is carried The seat also corresponds to the discharge arm. Therefore, when the test arm assembly is similarly transferred to the next batch of semiconductor components to be tested, the discharge arm similarly transfers the tested semiconductor components, and the transfer operation is performed through sequential switching. It can be synchronized with the test operation to achieve all of the above purposes.

The foregoing and other objects, features, and advantages of the invention are set forth in the <RTIgt;

Please refer to FIG. 2 and FIG. 3 together, which is a first preferred embodiment of a semiconductor component testing machine having a single through-feeding shuttle, which mainly includes a base 1', a testing device 2' and a conveying device 3'. The susceptor 1' is formed with a feeding area 11' for discharging the hopper and a discharging area 12'. The plurality of semiconductor elements to be tested are pre-loaded in the material hopper at the feeding area 11'. And the discharge area 12' is separately for placing a plurality of materials, each material corresponding to a semiconductor component having a certain electrical property and being tested and classified, for convenience of explanation, the definition is located here. The material of the zone 11' is the feed 匣 4', and in this example, the feed 匣 4' is placed in the feed zone 11' in a stacked manner, and the plurality of feeds located in the discharge zone 12' are Category 匣7'.

The test device 2' disposed on the base 1' includes a test stand 21' and a corresponding test arm assembly 22' in this example. The test arm assembly 22' is illustrated as having a nozzle 220' attached thereto and a temperature. The mechanical arm 221' of the adjusting member 222' extracts/releases the semiconductor component 5 to be tested by applying a vacuum suction/release negative pressure by the suction nozzle 220', and the temperature adjusting member 222' can perform temperature adjustment according to requirements, especially in progress. During the testing of the semiconductor component, the semiconductor component 5 to be tested is kept at a predetermined temperature to test whether the semiconductor cell can operate normally under the simulated high temperature environment or low temperature environment. The robot arm 221' moves the semiconductor component 5 to be tested drawn by the nozzle 220' into the test holder 21' or moves it in the reverse direction. Although in this example, the semiconductor element is taken by the negative pressure/release negative pressure method using a nozzle, those skilled in the art can also perform the transfer using, for example, clamping or the like, without hindering the implementation of the present invention.

The conveyor 3' includes a feed arm 31', a discharge arm 32', and a through shuttle 33' disposed on the machine table. Here, the feed arm 31' and the discharge arm 32' are respectively illustrated as suction nozzles 310', 320' having a group of attracting/releasing semiconductor elements. Similarly, the position at which the feeding arm 31' draws the semiconductor component 5 to be tested from the loading port 4' is referred to as a drawing position, and the position at which the semiconductor element 5 to be tested is released to the through-feeding shuttle 33' is defined as a feeding. Position; and the position of the mechanical arm 221' from the through shuttle 33', or the release of the semiconductor component is the exchange position; the position of the discharge arm 32' from the through-feed shuttle 33' to take out the semiconductor component is defined as At the discharge position, the position released to the sorting material 匣 7' is the release position. Therefore, the movement path of the shuttle shuttle 33' on the machine platform runs through the above-mentioned feeding position, exchange position, and discharge position, and moves back and forth; and is transported and carried by a single through-feed shuttle to simplify the overall structure, Effectively reduce manufacturing costs.

And in this example, the through shuttle 33' includes two carriers spaced apart from each other by a predetermined distance, respectively, a loading carrier 331' and a discharge carrier 332' for respectively placing the semiconductor component to be tested and completing the measurement. The semiconductor component; the spacing between the loading carrier 331' and the discharge carrier 332' is such that when the loading carrier 331' is in the feeding position, the discharging carrier 332' is in the exchange position; When the seat 331' arrives at the exchange position, the discharge carrier 332' arrives at the discharge position.

In order to provide convenient operation for the staff, the detection machine feeding area 11' and the discharging area 12' of the present case are located on the side of the machine platform at the lower side of FIG. 2, and the test seat 21' is disposed on the opposite upper side. The through-feed shuttle 33' traverses the central portion of the machine table, so that the test seat 21' is located on opposite sides of the transport shuttle 33' with respect to the feeding area 11' and the discharge area 12', respectively. Therefore, the staff can complete the loading and unloading at the same side position.

When performing the transfer test operation, referring to FIG. 4 to FIG. 6 together, first, as shown in FIG. 4, the feed arm 31' is taken to the pick-up position, and the suction nozzle 310' is taken from the feed port 4' to be tested. The semiconductor component 5 is transferred to the feeding position for release, so that the semiconductor component 5 to be tested is placed on the feeding carrier 331' of the conveying shuttle 33'; meanwhile, the discharging carrier 332' is in the exchange position receiving mechanism. The semiconductor component is completed by the arm 221'.

Then, as shown in FIG. 5, when the through shuttle 33' is driven to the right, the loading carrier 331' is correspondingly moved to the exchange position, and the robot arm 221' corresponding to the exchange position will be the loading carrier 331'. The semiconductor component 5 to be tested carried on is sucked by the suction nozzle 220'; oppositely, the discharge arm 32' simultaneously sucks the finished semiconductor component on the material carrier 332'.

As shown in FIG. 6, after the semiconductor component 5 to be tested is transferred to the test position, the robot arm 221' will be lowered, so that the semiconductor component 5 to be tested captured by the nozzle 220' is pressed on the test socket 21'. The test is performed while simulating a specific environment, and the temperature adjustment member 222' adjusts the application of the predetermined temperature to the semiconductor element 5 to be tested, and transmits the test result to the process sorting means 23'. In this process, the discharge arm 32' has released the captured semiconductor component to the corresponding sorting magazine 7' in accordance with the instruction of the processing sorting means 23'. While the test is being carried out, the through shuttle 33' will also be driven to the left to return to the original position, so that the loading carrier 331' corresponds to the feeding position, and the discharging carrier 332' corresponds to the exchange position. Prepare to take over the next round of semiconductor components for the next cycle of operation.

Because the through shuttle 33' can shoulder the dual responsibility of feeding and discharging, and the feeding arm feeding time is just the test arm assembly discharging time, and the test arm assembly feeding is ready for the discharging arm. Material, this design allows the conveyor shuttle to integrate the feeding and discharging in a synchronized manner, so that the incoming and outgoing movements can be highly synchronized, and the efficiency of the transfer operation and test operation is improved, and the competitiveness of the machine is improved. The market acceptance is thereby increased to achieve all of the above objects of the present invention.

Of course, as is well understood by those skilled in the art, if the test process takes a long time, the transfer time is relatively short, and it is necessary to wait for the shuttle to pass through. In order to solve such problems and improve the overall output efficiency, please refer to the second preferred embodiment of the present invention shown in FIGS. 7 to 11, in which two sets of four test seats 21" and two sets of left and right test arm assemblies are used. 22 ₁ ”, 22 ₂ ” performs a test operation of the semiconductor component, wherein the test arm assemblies 22 ₁ ′′, 22 ₂ ′′ each have a mechanical arm 221 ₁ ”, 221 ₂ ”; of course, the transport shuttle 33 of this example feeding also includes two supporting base 331 'and two discharge supporting base 332 ", while the carrier for the two semiconductor elements; and the feeding arm 31', the feed arm 32" and the robot arm ₂₂₁₁ ', ₂₂₁₂ Each has two nozzles for simultaneously capturing and releasing two semiconductor components. Since there are two sets of test arm assemblies arranged in parallel to each other in the present example, there must be a slightly offset left and right corresponding position regardless of the feeding position, the exchange position, and the discharge position.

As shown in FIG. 7, when the through-feed shuttle 33" is located at the left side of the drawing, the loading carrier 331" corresponds to the left-hand feeding position, at which time the feeding arm 31" will have two semiconductor elements 5 to be tested at a time. Placed in the feed carrier 331", and the discharge carrier 332" is located at a left-hand exchange position corresponding to the left test arm assembly 22 ₁ ", receiving its finished semiconductor component. Then 8, 33 through the transport shuttle car "is driven to the right, so that the supporting base material 331" corresponds to the left arm assembly ₂₂₁ test "left switching position, by a robot arm ₂₂₁₁ 'is located in the draw Two semiconductor elements to be tested 5 in the material carrier 331"; at the same time, the discharge arm 32" is also in the discharge carrier 332" located at the left discharge position, and the two tested semiconductor components 6 are taken out for classification. , complete the first half of a cycle.

Next, as shown in FIG. 9, the loading carrier 331" is further driven to the left to perform the lower half of the cycle; in response to the completion period of the right test arm assembly 22 ₂ ", the discharge carrier 332" is now It is returned to the right exchange position, so that the feeding carrier 331" synchronously returns to the right feeding position, and again receives the next batch (two) of semiconductor elements to be tested 5 released by the feeding arm 31", while testing the arm assembly 22 ₂ "then the two semiconductor elements have been measured by the robot arm 221 6 _2" to release the two supporting base material 332 "; in this case, the robot arm ₂₂₁₁ 'of the semiconductor device to be tested in the previous step will be drawn 5 They are respectively pressed on the two test stands 21" to which they belong, and the test results are transmitted to the process sorting device 23".

Therefore, as shown in FIG. 10, during the continuous test of the robot arm 221 ₁ ′′ and the test seat 21 ′′, the feeding carrier 331 ′ will be moved right again to the right exchange position for the suction of the robot arm 22 ₂ ′′. And the discharge carrier 332" is also moved right to the right discharge position, and the discharge arm 32" takes the semiconductor component and takes it into the appropriate classification according to the processing classification device 23" indication.

Finally, as shown in FIG. 11, the shuttle shuttle is returned to the left side so that the loading carrier 331" corresponds to the left-side feeding position, and the next batch of semiconductor components to be tested 5 fed by the loading arm 31" is again received. The robot arm 221 ₁ ′′ transfers the tested semiconductor component 6 to the discharge carrier 332 ′′ of the left-side exchange position, and the robot 221 ₂ ′′ continuously moves the captured semiconductor component 5 to be tested to The associated test position is pressed onto the test stand 21" and the test result is passed to the process sorting device 23" to complete the entire cycle.

In the same way, since only a single group is used to transport the shuttle, the structure of the machine itself is simplified and the cost is reduced, and the responsibility and movement path of the shuttle and the input arm and the discharge arm are relatively simple, and each other is With a high degree of coordination, the overall output efficiency of the machine is greatly improved, especially in terms of the length of the test, which can effectively respond to the application flexibility of the machine and achieve all of the above objectives.

Of course, in addition to the previous embodiment, the transfer test operation is performed by two sets of test arm assemblies arranged in parallel, and the two sets of test arm assemblies 22 ₁ ' of the third preferred embodiment of the present invention shown in FIGS. 12 to 17 can also be used. '', 22 ₂ ''' mechanical arms 221 ₁ ''', 221 ₂ ''', up and down alternate rotation test, as for the feeding area, discharge area, feeding arm, discharge arm and other structures, are all In the same embodiment, in this example, each of the robot arms 221 ₁ ''', 221 ₂ ′′′ has four nozzles, and there are four feeding carriers 331 ′ respectively through the shuttle shuttle 33 ′′′. ''and four discharge carriers 332'''. Referring to FIG. 13 and FIG. 14 together, the shuttle shuttle 33''' is first moved to the feeding position, and the loading arm 31''' captures and transfers the four semiconductor components to be tested 5 to the loading carrier. In the seat 331 ′′′, the robot arm 22 ₂ ′′′ is moved down at the exchange position, and the four tested semiconductor components are released to the discharge carrier 332 ′′′ and then moved up; at this time, the robot arm 221 ₁ ''' is being moved down from the preparation position, and the four semiconductor components to be tested which are taken down are pressed down to the test position, and tested on the test stand.

Next, as shown in FIG. 15, through the transport shuttle car 33 '''to the right, so that the supporting base material 331''' moves to a position corresponding to the exchange, together Referring to FIG 16, the robot arm ₂₂₁₂ '''drops again, After the semiconductor component 5 to be tested located in the loading carrier 331 ′′′ is picked up, the robot arm 221 ₁ ′′′ is kept in the test position. At this time, the discharge carrier moves to the discharge position, and the discharge arm extracts four completed semiconductor components, and according to the indication of the processing classification device 23''', the classification is released to each corresponding classification material 7'''.

Then also refer to FIG. 17, the robot arm ₂₂₁₁ '''carrying a semiconductor element completely tested by the test-shift position, ready to move to the left in the drawings, to the exchange position; robot arm _2212' '' is Move to the right of the drawing to the ready position. Then, the through shuttle 33''' will be moved back to the starting state, and the feeding carrier 331''' is returned to the feeding position to be connected to the semiconductor component 5 to be tested released by the arm, and the robot arm 221 ₁ '''to the next switching position to release the finished semiconductor element measuring the supporting base material 332''', the robot arm ₂₂₁₂ '''carrying case down semiconductor element, and to the test base packing tested, Thus, the flow as shown in FIG. 12 is returned to the next cycle, and the repetition is repeated until all tests are completed.

Through the above structural design, not only a single through-feeding shuttle is fully shouldered with the feeding and discharging mission, the test machine structure is simplified, the manufacturing cost is effectively reduced, and the components of each job are highly coordinated and can be efficiently synchronized. Carrying out semiconductor component transfer, testing, and classification, improving detection efficiency and output, achieving the goal of reducing costs and improving efficiency. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications according to the scope of the present invention and the description of the invention are still It is within the scope of the patent of the present invention.

1'. . . Pedestal

11’. . . Feeding area

12’. . . Discharge area

2'. . . Test device

21, 21', 21"... test seat

22 ₁ , 22 ₂ , 22 ', 22 ₁ ”, 22 ₂ ”, 22 ₁ ''', 22 ₂ '''. . . Test arm assembly

220’. . . Nozzle

222’. . . Temperature regulator

221 ', 221 ₁ ”, 221 ₂ ”, 221 ₁ ''', 221 ₂ '''. . . Robotic arm

23', 23", 23'''... processing classification device

3’. . . Conveyor

31, 31', 31", 31'''...feed arms

32, 32', 32", 32'''... discharge arms

33. . . Feed shuttle

34. . . Discharge shuttle

33’, 33”, 33’’’...through the shuttle bus

331', 331", 331'''... feeding carrier

332', 332", 332'''... discharge carrier

310', 320’. . . Nozzle

4, 4’. . . Feeding

5. . . Semiconductor component to be tested

6. . . Measured semiconductor component

7’, 7’’’. . . Classification

1 is a plan view of a conventional semiconductor component detecting machine;

2 is a top plan view of a semiconductor component testing machine having a single through-feed shuttle according to a first preferred embodiment of the present invention;

Figure 3 is a front elevational view of the semiconductor component testing machine of Figure 2 having a single through shuttle shuttle;

Figure 4 is a top plan view of the machine of Figure 2 with the feed arm picking up the semiconductor component to be tested and placed on the feed carrier;

Figure 5 is a top plan view of the machine arm assembly of the test arm assembly of Figure 2 taken from the loading carrier carried in the exchange position;

Figure 6 is a plan view of the machine of Figure 2 through which the transport shuttle is driven to the left to return to the original position, ready to take the next round of semiconductor components for the next cycle;

7 is a top plan view of a machine for performing a test operation of a semiconductor component with two test arm assemblies according to a second preferred embodiment of the present invention;

Figure 8 is a plan view of the machine of Figure 7 moving to the right after being driven by the shuttle shuttle;

Figure 9 is a plan view of the machine of Figure 7 in which the feed carrier is driven to the left to perform the lower half of the cycle;

Figure 10 is a top plan view of the machine platform of Figure 7 in which the feed carrier will be moved right to the right exchange position, and the discharge carrier is also moved right to the right discharge position;

Figure 11 is a view of Figure 7 in which the loading carrier re-accepts the next batch of semiconductor components to be tested that are fed by the feed arm, and the test arm assembly transfers the tested semiconductor components to the left-hand exchange position. a top view of the platform of the carrier;

Figure 12 is a plan view showing a machine table in which two sets of test arm assemblies are alternately rotated up and down according to a third preferred embodiment of the present invention;

Figure 13 is a front elevational view of Figure 12 with two sets of test arm assemblies up and down alternately rotating test stands;

Figure 14 is a side elevational view of Figure 12 with two sets of test arm assemblies up and down alternately rotating test stands;

Figure 15 is a plan view of the machine of Figure 12 moving to the corresponding exchange position by moving the shuttle shuttle to the right;

Figure 16 is a side elevational view of the machine of the semiconductor component of the two sets of test arm assemblies of Figure 12 simultaneously picking up and down pressing the test semiconductor component; and

Figure 17 is a side elevational view of the machine of Figure 12 with the two sets of test arm assemblies alternately interchanged.

22 ₁ ''', 22 ₂ '''. . . Test arm assembly

221 ₁ ''', 221 ₂ '''. . . Robotic arm

33’’’. . . Through the shuttle

31’’’. . . Feed arm

331’’’. . . Feed carrier

332’’’. . . Discharge bearing

5. . . Semiconductor component to be tested

Claims (6)

A semiconductor component testing machine having a single through-feed shuttle is used for testing a plurality of semiconductor components to be tested placed in a magazine, the testing machine comprising: one for each of the at least one housing for receiving the aforementioned magazine a feeding zone, and a base for discharging a plurality of tested semiconductor component sorting materials; a set of test devices disposed on the base, the testing device comprising: at least one having at least one test position a test stand; and at least one set of test arm assemblies corresponding to the test stand for transporting the semiconductor component to be tested or tested between an exchange position corresponding to the test stand and the test position; and a set of transport means, including a loading arm disposed on the machine for moving the semiconductor component to be tested between a picking position corresponding to the feeding zone and a feeding position; one disposed on the machine for one discharge a discharge arm that moves the tested semiconductor component between a position and a release position corresponding to the discharge zone; and a plurality of carriers are formed And a shuttle car that moves back and forth in a path through the feeding position, the exchange position, and the discharge position; wherein the carriers are separated from each other by a predetermined distance, and respectively at the feeding position to the exchange position Move between and between the exchange position and the discharge position. The semiconductor component testing machine of claim 1, wherein the feeding zone and the discharging zone are located on one side of the through conveying shuttle, and the test seat is located on the opposite side of the through conveying shuttle side. The semiconductor component testing machine of claim 1, wherein the test arm assembly has Two mechanical arms that alternately rotate between the exchange position, the test position, and a preparation position, each of the robot arms having a set of suction nozzles for attracting/releasing the semiconductor elements. The semiconductor component testing machine of claim 1, wherein the set of test arm assemblies has at least one temperature regulating member for applying a predetermined temperature to the semiconductor component to be tested. The semiconductor component testing machine of claim 1 further comprises a group for receiving the test result of the test stand, and driving the output arm to release the tested semiconductor component from the discharge position to the corresponding test completion. A processing and sorting device for a semiconductor component magazine. The semiconductor component testing machine of claim 1, wherein the test socket has a plurality of test positions, and the feed arm, the test arm assembly, and the discharge arm respectively have a plurality of capture/release corresponding to the test position. And a set of feed carriers and a set of discharge carriers formed on the shuttle shuttle to form a plurality of corresponding pick/release members.