TW201534943A - Sorting machine for testing semiconductor components and method for supporting test in the sorting machine - Google Patents

Abstract

The present invention relates to a sorting machine for testing semiconductor components and a method for supporting test in the sorting machine. In the sorting machine for testing semiconductor components according to the present invention, the utilization of a tray transfer is increased by expanding the functionality thereof and additional constituent elements are increased in order to allow the semiconductor components that have been subjected to new tests and classified as retest objects to be subjected to retest smoothly after passing the new test. Thus, the process of new tests and the preparation process of retest for the entirety of a lot of components can be combined organically in a condition of having the minimum mutual interference therebetween thereby improving the processing speed and capacity.

Description

Semiconductor component test sorting machine and test support method in the sorting machine

The present invention relates to a semiconductor component test sorting machine used when testing a produced semiconductor component, and more particularly to a retesting technique.

A semiconductor component test sorting machine (hereinafter, simply referred to as "sorting machine") for electrically connecting a semiconductor component manufactured by a predetermined manufacturing process from a customer tray to a tester after electrically connecting the semiconductor component from a customer tray And if the test is finished, the semiconductor components are classified according to the test results and introduced into the vacant customer tray.

Typically, the sorter performs the test process in units of one lot (Lot). At this time, as a new test for one batch is performed, a semiconductor element as a good product, a semiconductor element that needs to be retested, and a semiconductor element that is a defective product that does not need to be retested are classified from the quantity of one batch. In addition, semiconductor components that need to be retested will be classified by retesting the retesting process.

In the past, the retesting process was performed by manually supplying the retest amount when the new test was completed. In this case, the administrator's manual The work is inconvenient, and there is a problem of a decrease in processing speed and capacity due to a time delay or the like.

Thus, a technique for automatically retesting as in Korean Patent Publication No. 10-2002-0077596 (Invention name: retesting method of test sorter; hereinafter referred to as "prior art") is proposed.

In the prior art, the vacant customer tray after the semiconductor elements to be tested are all taken out is utilized as a good material amount or a re-test amount. Therefore, it can only be used as a device whose application range is limited to the case where the amount of material to be tested is small. Moreover, the tray transferer (Tray Transfer, which is named as "80" in the prior art) has a limited effect and a correspondingly small frequency of use, resulting in a decrease in the efficient use of the apparatus.

SUMMARY OF THE INVENTION An object of the present invention is to provide a technique for increasing the function expansion of a tray conveyor and the components required for the expansion thereof, and improving the utilization rate of the tray conveyor to allow the logistics for automatic retesting to proceed smoothly.

In order to achieve the above object, a semiconductor component test sorting machine according to the present invention includes: a test batch stacker for accommodating a customer tray loaded with a semiconductor component to be tested; a test support section, a slave The test batch stacker electrically connects the semiconductor component to the tester side after taking out the semiconductor component in the customer tray moved from the take-out position, and classifies the semiconductor component according to the test result to be introduced into the customer tray at the introduction position or a customer tray located at a retest location, wherein the lead is drawn The position is a position at which the semiconductor component to be tested is taken out from the customer tray, the introduction position is a position at which the semiconductor component to be tested is introduced to the customer tray, the retest position is to introduce the semiconductor component as a retest object to the customer a position of the tray; a first storage stacker for accommodating a customer tray in which the mounted semiconductor element is taken out by the test support unit and then passes through the storage position, wherein the storage position is a loaded semiconductor element a position where all of the vacant customer trays are transferred from the take-out position; a second storage stacker for accommodating the customer tray from the lead-in position; and a third storage stacker for accommodating the re-test position Customer tray; waiting for the stacker for accommodating a vacant customer tray to be supplied to the waiting position for waiting for the customer tray to be moved to the lead-in or re-test position; pallet transfer For use in the lead-out position, the lead-in position, the retest position, and the waiting position Delivering a customer tray, the tray transporter comprising: a picker for picking up the customer tray; a lifter for lifting the picker; and a level shifter for moving the picker to the take-out position, the lead-in position , retest the location, wait for the position above.

The pickup has a detachment preventing cover for preventing detachment of a semiconductor element loaded on a customer tray.

The sorting machine further includes: a retesting batch palletizer for accommodating a customer tray loaded with a semiconductor component as a retest article, wherein a customer tray loaded with a semiconductor component as a retest article is by means of the tray The transferer is transferred to the rear position of the retest batch stacker and then stored in the retest batch stacker.

The sorter further includes: retesting the failed stacker for accommodating a customer tray loaded with semiconductor components that failed during the retest.

In order to achieve the object as described above, a test support method in a semiconductor component test sorter according to a first aspect of the present invention includes: a moving step of moving a customer tray loaded with a semiconductor component to be tested to an extraction position, Wherein the lead-out position is a position at which the semiconductor component to be tested is taken out from the customer tray; and the test support step provides support after taking out the semiconductor component from the customer tray located at the take-out position to obtain new semiconductor component in the test machine The test, and then classify the semiconductor components of the new test, thereby introducing the semiconductor component through the new test to the customer tray at the introduction position, and introducing the semiconductor component as the retest object to the retest position. a customer tray, wherein the introduction position is a position at which a semiconductor element to be tested is introduced to a customer tray, the re-test position is a position at which a semiconductor component as a retest object is introduced to a customer tray; a transfer step by means of a tray Transmitter will be located The customer tray of the retest position is transferred to the take-out position; the test support step is re-tested, and if the new test is completed, support is provided to implement the semiconductor loaded on the customer tray located at the take-out position by the transfer step Retesting of components.

The transferring step includes: a first step of moving the customer tray located at the retest position to the retest stacker; and a second step, if the new test is completed, moving the customer tray located at the retest stacker Go to the retest position; the third step is to transfer the customer tray located at the retest position by the second step to the take-out position.

The transferring step may further include: a fourth step of moving the customer tray located at the take-out position by the third step to the test batch stacker; and the fifth step, being accommodated by the fourth step The customer tray for testing the batch stacker is moved to the take-out position.

In order to achieve the object as described above, a test support method in a semiconductor component test sorting machine according to a second aspect of the present invention includes: a moving step of moving a customer tray loaded with a semiconductor component to be tested to an extraction position, Wherein the lead-out position is a position at which the semiconductor component to be tested is taken out from the customer tray; and the test support step provides support after taking out the semiconductor component from the customer tray located at the take-out position to obtain new semiconductor component in the test machine The test, and then classify the semiconductor components of the new test, thereby introducing the semiconductor component through the new test to the customer tray at the introduction position, and introducing the semiconductor component as the retest object to the retest position. a customer tray, wherein the introduction position is a position at which a semiconductor element to be tested is introduced to a customer tray, the re-test position is a position at which a semiconductor component as a retest object is introduced to a customer tray; a transfer step by means of a tray Transmitter will be located The customer tray of the retest position is transferred to a carry-out position different from the take-out position, wherein the carry-out position is a position at which the semiconductor component as the retest object is carried out from the customer tray; the test support step, if a new test After the completion, support is provided to implement re-testing of the semiconductor component loaded on the customer tray located in the carry-out position by the transfer step, the transfer step comprising the following steps: a first step: the retest is to be located The customer tray of the position is moved to the moving out position; the second step is to The customer tray located at the carry-out position is moved to the retest batch stacker; and the third step is to move the customer tray stored in the retest batch stacker to the carry-out position by the second step.

According to the present invention, the new test process and the retest preparation process for all of the 1 batch quantities can be organically combined in a state where interference with each other is minimized, thereby increasing the processing speed and capacity.

100, 200, 300‧‧‧ test sorter

111, 211, 311‧‧‧Test batch stacker

112, 212, 312‧‧‧ first storage stacker

113,213, 313‧‧‧Second storage stacker

114, 214‧‧‧ Third storage stacker

115, 215, 315 ‧ ‧ waiting for the stacker

216‧‧‧Retest failed stacker

317‧‧‧Retest batch stacker

120, 220, 320‧‧‧ loading boards

130, 230, 330‧‧‧ first mover

140, 240, 340‧‧‧ test reciprocating parts

150, 250, 350‧‧‧ connectors

160, 260, 360‧‧‧ second mover

170, 270, 370‧‧‧Tray transfer device

171‧‧‧ Picker

171a‧‧‧ gripper

171b‧‧‧Protection cover

172‧‧‧ Lifter

173‧‧‧Level mover

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic plan view of a semiconductor element test sorting machine in accordance with a first embodiment of the present invention.

2 is a schematic perspective view of a tray shifter applied to the sorter of FIG. 1.

Fig. 3 is a reference diagram for explaining a retesting process performed in the sorting machine of Fig. 1.

Figure 4 is a schematic plan view of a semiconductor element test sorting machine in accordance with a second embodiment of the present invention.

Figure 5 is a schematic plan view of a sorting machine for testing a semiconductor element according to a third embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention as described above will be described with reference to the accompanying drawings, and the repeated description will be omitted or reduced as much as possible for the sake of simplicity of the description.

<First Embodiment>

1 is a view of a sorting machine 100 according to a first embodiment of the present invention. Schematic plan view.

As shown in FIG. 1, a sorting machine 100 according to the present invention includes a test lot stacker 111, a pair of loading plates 120, a first mover 130, and a pair of test shuttles 140. The connector 150, the second mover 160, the first storage stacker 112, the second storage stacker 113, the third storage stacker 114, the waiting stacker 115, the tray conveyor 170, and the like.

The test batch stacker 111, the first storage stacker 112, the second storage stacker 113, the third storage stacker 114, and the waiting stacker 115 are used to store the customer tray CT, regarding its structure and the customer tray. The mobile technology of the CT on each of the stackers 111-115 has been disclosed by the applicants of the present application Nos. 10-2013-0052809 and 10-2013-0055510, etc., and detailed description thereof is omitted. .

A customer tray CT is housed and loaded in the test batch stacker 111, and the customer tray CT is loaded with a semiconductor element that requires a new test. Generally, the semiconductor components tested by the sorter 100 are tested under the same environmental conditions in a quantity of one lot. Therefore, one batch of semiconductor elements is distributed to a plurality of customer trays, and a plurality of customer trays are loaded together with the test batch stacker 111. Further, the customer tray CT loaded on the test batch stacker 111 is moved to the take-out position WP in units of one (refer to arrow a). Among them, the lead-out position WP is a position at which the semiconductor element to be tested is taken out from the customer tray CT.

The loading board 120 can be loaded with semiconductor components. Such a loading plate 120 has a heater so that the loaded semiconductor component can be heated to the temperature required for testing. Of course, the operation of the heater is aborted during the normal temperature test.

The first mover 130 loads the semiconductor element from the customer tray CT located at the take-out position WP, and then loads it onto the loading plate 120, or moves the semiconductor element located on the loading plate 120 to the test reciprocating member 140 currently located on the left side. To this end, the first mover 130 is configured to be movable in the left-right direction and the front-rear direction (refer to arrows b, c).

The test reciprocating member 140 may be loaded with a semiconductor element and configured to be movable in the left-right direction via the test position TP (refer to arrows d ₁ , d ₂ ).

The connector 150 electrically connects the semiconductor component loaded by the test shuttle 140 at the test position TP to the test socket TS below it. Here, the electrical connection between the semiconductor element and the test socket TS can be achieved by pressurizing the semiconductor element mounted on the test shuttle 140 downward by the connector 150. Of course, the semiconductor component is ultimately electrically connected to the test machine through the test socket TS.

The second mover 160 classifies the tested semiconductor components on the test reciprocating member 140 currently located on the right side according to the test result, and introduces them to the customer tray CT located at the lead-in position IP, the re-test position RP, and the fixed position FP. . Wherein, the introduction position IP is a position at which the tested semiconductor component is introduced to the customer tray CT, and the retest position RP is a position at which the semiconductor component as a retest object is introduced to the customer tray CT, and the fixed position FP is the tested semiconductor component. Or the semiconductor component that is not in the retested object is introduced to the position of the customer tray CT. To this end, the second mover 160 is configured to be movable in the left-right direction and the front-rear direction (refer to arrows e, f).

The first storage stacker 112 is for accommodating a customer tray CT that is first moved at the take-out position WP at the loaded semiconductor component The device 130 is all taken out of the customer tray CT which comes after passing through the storage position AP (refer to arrow g). The storage position AP is a position at which the vacant customer tray CT that is loaded by the loaded semiconductor elements is moved by the first storage stacker 112.

The second housing 113 may be housed stacker (reference arrow h _1, h ₂₎ from a retracted position IP client tray CT.

The third storage stacker 114 can receive the customer tray CT (refer to arrow i) from the retest position RP.

It should be noted that the second storage stacker 113 and the third storage stacker 114 can change positions from each other, and accordingly, the introduction position IP and the retest position RP can be changed from each other.

The stacker 115 is awaiting for accommodating a vacant customer tray CT to be supplied to the waiting position SP for waiting for the customer tray CT to be moved to the lead-in, position IP or re-test position RP. That is, the vacant customer tray CT accommodated in the waiting stacker 115 is moved to the waiting position SP in one unit (refer to arrow j).

The tray conveyor 170 is for moving the customer tray CT between the take-out position WP, the storage position AP, the lead-in position IP, the re-test position RP, and the waiting position SP. To this end, the take-out position WP, the storage position AP, the lead-in position IP, the re-test position RP, and the waiting position SP are preferably arranged side by side in one direction on the horizontal plane.

As shown in the schematic view of FIG. 2, such a tray conveyor 170 includes a pickup 171, a lifter 172, and a level mover 173.

The pickup 171 can pick up the customer tray through the plurality of grippers 171a CT or unpickup, and can be lifted and lowered by means of the lifter 172, and moved in the left-right direction by means of the level mover 173 (refer to arrow z), thereby moving to the take-out position WP, introducing the position IP, retesting Position RP, waiting position above SP. Also, the pickup 171 has a detachment preventing cover 171b for moving the customer tray CT at the retest position RP to the take-out position WP.

The detachment cover covers the upper surface of the customer tray CT, thereby preventing detachment of the semiconductor element caused by the movement impact of the customer tray CT.

The loading plate 120, the first mover 130, the test shuttle 140, the connector 150, and the second mover 160 described above are provided to support the semiconductor element in the customer tray CT located at the take-out position WP after being tested by the test machine. According to the test result, the semiconductor component is classified and introduced into the customer tray CT. From this point of view, the loading plate 120, the first mover 130, the test shuttle 140, the connector 150, and the second mover 160 may be Outlined as Test Support.

Next, a test method of the sorter having the configuration as described above will be described.

First, the customer tray CT located in the test batch stacker 111 is moved to the take-out position WP.

The first mover 130 takes out the semiconductor component to be subjected to the new test from the customer tray CT located at the take-out position WP and loads it to the loading plate 120. In addition, when there is the test reciprocating member 140 on the left side, the first mover 130 moves the semiconductor element mounted on the loading plate 120 to the test reciprocating member 140 to be loaded.

The test reciprocating member 140 loaded with the semiconductor element to be subjected to the new test is moved to the right side at the test position TP, and the semiconductor element mounted on the test reciprocating member 140 is pressed downward by the connector 150 to electrically connect the semiconductor element to the test. Socket TS. According to this, the semiconductor element was tested by a test machine.

If the test is over, the electrical connection between the semiconductor component and the test socket TS is released, and the test shuttle 140 will move further in the right direction. In addition, the second mover 160 extracts the tested semiconductor component from the test reciprocating member 140 located on the right side, and then classifies it according to the test result, and introduces it to the customer located at the lead-in position IP, the re-test position WP, and the fixed position FP. Tray CT.

Further, the customer tray CT from which the mounted semiconductor elements are all taken out at the take-out position WP is transferred to the storage position AP by the tray transfer unit 170 (refer to the arrow k), and then moved to the first storage stacker 112 to be stored.

Moreover, if the customer tray CT located at the lead-in position IP is filled with the semiconductor component, the customer tray CT at the lead-in position IP is moved to the second storage stacker 113, and if the customer tray CT at the re-test position RP is filled up The semiconductor component is moved to the third storage stacker 114 by the customer tray CT at the retest position RP. According to this, if the customer tray CT is removed from the lead-in position IP or the re-test position RP, the tray conveyor 170 transfers the customer tray CT located at the waiting position SP to the lead-in position IP (refer to arrows l ₁ , l ₂ ) or to the tray Retest the position RP (see arrow m). Here, the waiting position SP has a vacant customer tray CT that is previously moved from the waiting stacker 115 and is waiting. Of course, according to the embodiment, the vacant customer tray CT of the bit at the take-out position WP can be moved to the waiting position SP by the tray conveyor 170, or the vacant customer tray CT located at the take-out position WP can be directly transferred. The lead-in location IP of the customer tray CT has been removed or the location RP is re-tested.

If a new test for 1 lot is completed by the process as described above, as shown in FIG. 3, the customer tray CT loaded on the third storage stacker 114 is moved to the retest position RP in units of one (refer to The arrow n) is moved by the tray conveyor 170 to the customer tray CT at the retest position RP to the take-out position WP (refer to arrow o). In addition, the first transfer unit 130 takes the semiconductor component to be retested from the customer tray CT located at the take-out position WP and loads it to the loading plate 120, and then retests by the same process as the new test. Of course, according to the embodiment, the customer tray CT moved to the take-out position WP by the tray conveyor 170 may first be completely moved to the test batch stacker 111 (refer to the arrow p) for storage, and then stored in the test batch. The customer tray CT of the stacker 111 is moved to the take-out position WP in units of one piece and tested.

<Second embodiment>

Figure 4 is a schematic plan view of a sorter 200 in accordance with a second embodiment of the present invention.

As shown in FIG. 4, the sorting machine 200 according to the present invention includes: a test batch stacker 211, a pair of loading plates 220, a first mover 230, a pair of test shuttles 240, a connector 250, and a second mover. 260, the first storage stack The machine 212, the second storage stacker 213, the third storage stacker 214, the waiting stacker 215, the tray conveyor 270, the retest failure stacker 216, and the like.

The test batch stacker 211, the pair of loading plates 220, the first mover 230, the pair of test reciprocators 240, the connector 250, the second mover 260, the first storage stacker 212, and the second storage stack The functions and operations of the blower 213, the third storage stacker 214, the waiting stacker 215, and the tray conveyor 270 are the same as those of the first embodiment, and thus the description thereof will be omitted.

The retest failure stacker 216 is configured to store the customer tray CT at the retest failure position RFP when the customer tray CT located at the retest failure position RFP is filled with the retest failed semiconductor component.

In the sorting machine 200 having the above configuration, the procedure of the new test is the same as that of the first embodiment, and the description thereof will be omitted.

If the customer tray CT located at the retest position RP is filled with the semiconductor component as the retest target by the new test, the customer tray CT located at the retest position RP is moved to the third storage stacker 214 and is accommodated. . Then, if the new test is all completed, the customer tray CT accommodated in the third storage stacker 214 is moved to the retest position RP (refer to arrow 1) in units of one piece, and then will be located by means of the tray conveyor 270. The customer tray CT that retests the position RP is moved to the take-out position WP (refer to arrow 2). Then, retest. The semiconductor component that failed the retest during such a retest is introduced to the customer tray CT located at the retest failure position RFP. Of course, if the customer tray CT located at the retest failure location RFP is filled with semiconductor components, the associated customer tray CT is received into the retest failure stacker 216.

Thus, the interference between the job of moving the customer tray CT from the retest stacker 214 to the take-out position WP and the operation of classifying the semiconductor elements after retesting for retesting is prevented. That is, for the semiconductor element that needs to be classified to the re-test position RP in the re-test operation of the sorter 200, it cannot be loaded onto the customer tray CT that is moved to the take-out position WP via the re-test position RP, thereby It is loaded into the customer tray CT set in the dedicated retest failure location RFP, thereby preventing interference between the two jobs.

<Third embodiment>

Figure 5 is a schematic plan view of a sorting machine 300 in accordance with a third embodiment of the present invention.

As shown in FIG. 5, the sorting machine 300 according to the present invention includes: a test batch stacker 311, a pair of loading plates 320, a first mover 330, a pair of test shuttles 340, a connector 350, and a second mover. 360, the first storage stacker 312, the second storage stacker 313, the waiting stacker 315, the tray conveyor 370, the retest batch stacker 317, and the like.

The test batch stacker 311, the pair of loading plates 320, the first mover 330, the pair of test shuttles 340, the connector 350, the second mover 360, the first storage stacker 312, and the second storage stack The functions and operations of the downtime machine 313, the waiting stacker 315, and the tray transfer unit 370 are the same as those of the first embodiment, and the description thereof will be omitted.

The re-test batch stacker 317 is used to store a customer tray CT loaded with semiconductor components to be retested, and is configured to be adjacent to the test batch. Stacker 311. To this end, the tray conveyor 370 transfers the customer tray CT at the retest position RP to the carry-out position CP located behind the retest batch stacker 317. The carry-out position CP is different from the lead-out position WP. In addition, the customer tray CT at the carry-out position CP will be moved to the retest batch stacker 317.

In the sorting machine 300 having the above configuration, the procedure of the new test is the same as that of the first embodiment, and the description thereof will be omitted, and the process which is different from the first embodiment will be described.

If the customer tray CT located at the retest position RP is filled with the semiconductor component as the retest object by the new test, the tray conveyor 370 transfers the customer tray CT at the retest position RP to the carry-out position CP (refer to Arrow α). Then, the customer tray CT at the carry-out position CP is moved to the retest batch stacker 317 (reference arrow β) and stored. Then, if the new test is completed, the customer tray CT accommodated in the retest batch stacker 317 is moved to the carry-out position CP (reference arrow γ), and the semiconductor component as the retest target is located by the first mover 330. The customer tray CT of the carry-out position CP is moved to the loading plate 320 to be loaded and retested.

Thus, the operation of moving the customer tray CT and the semiconductor component for the new test and the interference between the customer tray CT loaded with the semiconductor component as the retest article to retest the batch stacker 317 for retesting Get prevented.

As described above, the present invention has been specifically described by way of embodiments in conjunction with the accompanying drawings, which are merely preferred embodiments of the present invention. The scope of the invention is defined by the claims and their equivalents.

100‧‧‧Test Sorter

111‧‧‧Test batch stacker

112‧‧‧First storage stacker

113‧‧‧Second storage stacker

114‧‧‧ Third storage stacker

115‧‧‧Awaiting stacker

120‧‧‧Loading board

130‧‧‧First mover

140‧‧‧Test reciprocating parts

150‧‧‧Connector

160‧‧‧Second mover

170‧‧‧Tray transfer device

Claims (8)

A semiconductor component testing sorting machine, comprising: a test batch stacker for accommodating a customer tray loaded with a semiconductor component to be tested; and a test support section leading from the test batch stacker After the semiconductor component is taken out from the customer tray that is moved in position, the semiconductor component is electrically connected to the tester side, and the semiconductor component is classified according to the test result and introduced into the customer tray at the introduction position or the customer tray at the retest position. Wherein the take-out position is a position at which a semiconductor component to be tested is taken out from a customer tray, and the lead-in position is a position at which a semiconductor component to be tested is introduced to a customer tray, and the re-test position is to be a retest target. a semiconductor package is introduced into a position of the customer tray; and the first storage stacker is configured to receive a customer tray in which the mounted semiconductor element is taken out by the test support unit and then passes through the storage position, wherein the storage position is The loaded semiconductor components are all vacant a position where the tray is transferred from the take-out position; a second storage stacker for accommodating the customer tray from the lead-in position; and a third storage stacker for accommodating the customer tray from the re-test position; waiting a stacker for accommodating a vacant customer tray to be supplied to a waiting position for waiting for a customer tray to be moved to the lead-in position or re-test position; a pallet mover for Lead out position, lead in position, retest position, Transferring a customer tray between waiting positions, the tray conveyor comprising: a picker for picking up a customer tray; a lifter for lifting the picker; and a level shifter for moving the picker to the lead Position, lead-in position, retest position, wait position above. The semiconductor component testing sorting machine according to claim 1, wherein the pick-up device has a detachment preventing cover for preventing detachment of the semiconductor element mounted on the customer tray. A semiconductor component test sorting machine according to claim 1, further comprising: retesting the batch stacker for accommodating a customer tray loaded with a semiconductor component as a retest article, wherein the load is loaded The customer tray of the semiconductor component of the retested article is transferred to the rear position of the retest batch stacker by means of the tray transferer and then stored in the retest batch stacker. A semiconductor component test sorting machine according to claim 1, further comprising: a retest failure stacker for accommodating a customer tray loaded with a semiconductor component that fails during the retest. A test support method in a semiconductor component test sorting machine, comprising: a moving step of moving a customer tray loaded with a semiconductor component to be tested to an extraction position, wherein the lead-out position is to be tested semiconductor a position where the component is taken out from the customer tray; a test support step, which provides support after the semiconductor component is taken out from the customer tray at the take-out position, so that the semiconductor component is subjected to a new test in the test machine, and then the new test is completed. The components are sorted such that the semiconductor component passed through the new test is introduced to the customer tray at the introduction position, and the semiconductor component as the retest object is introduced to the customer tray at the retest position, wherein the introduction position is passed The tested semiconductor component is introduced to a position of a customer tray that introduces a semiconductor component as a retest object to a customer tray; a transfer step of placing the customer at the retest location by means of a tray transporter The tray is moved to the take-out position; the test step is re-tested, and if the new test is completed, support is provided to effect re-testing of the semiconductor component loaded on the customer tray located at the take-out position by the transfer step. A test support method in a semiconductor component test sorting machine according to claim 5, wherein said transferring step comprises: a first step of moving a customer tray located at said retest position to a retest stack a second step, if the new test is completed, moving the customer tray located in the retest stacker to the retest position; and the third step, which is located in the retest position by the second step The customer tray is moved to the take-out position. The test support method in the semiconductor component test sorting machine according to claim 6, wherein the transferring step further comprises: a fourth step of moving the customer tray located at the take-out position by the third step to the test batch stacker; and the fifth step, the customer who is accommodated in the test batch stacker by the fourth step The tray is moved to the take-out position. A test support method in a semiconductor component test sorting machine, comprising: a moving step of moving a customer tray loaded with a semiconductor component to be tested to an extraction position, wherein the lead-out position is to be tested a position at which the semiconductor component is taken out from the customer tray; a test support step, after the semiconductor component is taken out from the customer tray at the take-out position, support is provided to enable the semiconductor component to obtain a new test in the test machine, and then the new test is completed. The semiconductor components are sorted such that the semiconductor component passed through the new test is introduced to the customer tray at the introduction position, and the semiconductor component as the retest object is introduced to the customer tray at the retest position, wherein the introduction position is The semiconductor component to be tested is introduced into the position of the customer tray, the retest position is a position at which the semiconductor component as the retest object is introduced to the customer tray; and the transfer step is to be in the retest position by means of the tray shifter Customer tray transfer a carry-out position different from the take-out position, wherein the carry-out position is a position at which the semiconductor component as the re-tested object is carried out from the customer tray; the re-test support step, if the new test is completed, providing support for loading Re-testing of semiconductor components on a customer tray located in the carry-out position by the transfer step, The transferring step includes the following steps: a first step of moving a customer tray located at the re-test position to the carry-out position; and a second step of moving a customer tray located at the carry-out position to a retest batch stacker And a third step of moving the customer tray stored in the retest batch stacker to the carry-out position by the second step.