CN1464312A - Machine allocation of IC test processor and process for making the same - Google Patents
Machine allocation of IC test processor and process for making the same Download PDFInfo
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- CN1464312A CN1464312A CN 02122740 CN02122740A CN1464312A CN 1464312 A CN1464312 A CN 1464312A CN 02122740 CN02122740 CN 02122740 CN 02122740 A CN02122740 A CN 02122740A CN 1464312 A CN1464312 A CN 1464312A
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- pallet
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Abstract
The present invention is test bench configuration and measurement process for IC test. The test bench includes material stacking and feed buffering area for stacking ICs to be tested; empty IC tray dispatching mechanism for sucking empty tray for concentration in the empty IC tray area; double-IC conveying arm with double sucking heads to suck one pair of ICs; one pair of alternately conveyed temporary storing trays for conveying ICs to IC test area for continuous test; and tested IC setting area. In the test bench, all tested ICs are set based on their parameters. The present invention has high efficiency, small covered area and short processing path.
Description
Technical field
The present invention is a kind of board configuration and work flow thereof of IC test handler, be meant a kind of board of the IC of being used in test jobs routine processes especially, and after IC to be tested sent into measuring head and carries out test and reach survey, place the function mode of each required mechanism of supervisor and the configuration that configuration mode meets working efficiency most according to this IC test result range, to increase the usefulness that operation is carried out.
Background technology
In the whole board work flow of IC test handler (IC Handler), the most important no more than: how to keep the test fluency of IC measuring head (IC TEST HEAD) as far as possible, and the operation of its test I C is interrupted and influenced overall efficiency.General IC test handler emphatically its IC often only draw IC from pan feeding and test after the survey again to measuring head and be delivered to by another conveyer arm that to survey the district concentrated in the smoothness that flows of board by a conveyer arm of inhaling vacuum.So simple, direct IC wafer transport flow process is the key of whole board prouctiveness, because on the board pipeline of this IC test handler, often exist to changing situation that feed that IC bearing dish (TRAY) makes the test section interrupts or IC is intact after testing IC surveys IC holding tray that rest area can't in time supply and be directed at and make the operation of whole test section be forced to interrupt, have a strong impact on this IC test handler and carry out efficient.
Summary of the invention
The board configuration and the work flow thereof that the purpose of this invention is to provide a kind of IC test handler, it can make the entire job program appropriateness analysis and research dexterously, can fill part and utilize its mechanism, mix into an efficiency/space than maximal value work board with inter-agency space characteristic and direction.
For achieving the above object, the invention provides a kind of board configuration of IC test handler, primary structure is a small-sized board, and on board, be provided with and pile up feed buffer part, empty pallet scheduling mechanism, empty IC pallet is dispatched mechanism, goes into the two IC conveying arms of survey portion, the two IC conveying arms of intact survey portion, back and forth transports temporary disk, the IC test section, mechanisms such as the intact survey of IC rest area.It is characterized in that, pile up the feed buffer part and be located at the avris of board, is the stacked feed pallet of filling IC to be measured, and each feed pallet can be done the lifting of Z-direction and carry, and the feed pallet of the superiors can be done moving of Y direction by the Y-axis gear train; Empty IC pallet is dispatched mechanism and is made up of the pedestal and the cantilever thereof of a tool X-axis gear train, this cantilever is provided with vacuum cup, and Z axle that can pedestal is the axle center rotation, the feed pallet of the sky of having got IC of feed buffer part can be picked up, it is standby to concentrate on sky IC stackable pallet district, or move as X-axis by the X-axis gear train, empty IC pallet is placed on the certified products holding tray; Going into the two IC conveying arms of survey portion has two absorption heads, can once draw a pair of IC, is provided with the X-axis gear train and makes X axis conveying IC; The two IC conveying arms of intact survey portion have two absorption heads, can once draw a pair of IC, it has X-axis gear train and Y-axis gear train, can make X-axis and Y direction and carry IC, main be responsible for the IC to be measured on the feed pallet of feed buffer part be transported to back and forth transport temporary disk go into to survey in the IC seat groove, and intact the surveys IC that will back and forth transport in the intact survey IC seat groove of temporary disk has been transported to the survey rest area; Back and forth transport temporary disk and be located at a pair of temporary disk of dislocation each other of the measuring head both sides of test section, this temporary disk is done the to-and-fro movement of Y direction the intact IC of survey of IC/ to be measured is sent into/send the IC test section by the Y-axis gear train; The intact rest area of surveying of IC can be divided into certified products holding tray and other grade product holding trays, has supplied to survey IC and has sorted out placement.
The present invention also provides a kind of work flow of board configuration of IC test handler, and the work flow of its principal organ is as follows:
(A) IC to be measured is placed on the IC seat groove of the feed pallet that piles up the feed buffer part, and with the feed tray stack;
(B) via lifting of Z axle and separating mechanism, can be with next dish of feed pallet, after separating separately, place on the Y uranium gear train, it is moving to do y-axis shift, and its first row IC seat groove is positioned on the coordinate position of IC extracting position just, infeed the IC of survey portion conveying arm take out in the first row IC seat groove each IC to be measured and after the first row IC seat groove has been got IC to be measured, to Y-axis stepping one lattice, second row's IC seat groove is positioned at continue to infeed the IC of survey portion conveying arm on the IC extracting position and takes out IC to be measured; After whole dish feed pallet has been got IC to be measured, continue to shift out next feed pallet again by piling up the feed buffer part;
(C) the IC to be measured that the IC of survey portion conveying arm will take out of going into of IC conveying arm inserts temporary disk and goes into to survey in the IC seat groove;
(D) go into to survey/after the intact temporary disk of surveying the delivery area is put into IC to be measured by flow process (C), send into the measuring head left side of test section to the Y-axis gear train; Simultaneously temporary disk is sent the test section by a Y-axis gear train self-test right side, and accepting the IC to be measured that inserts of the IC of survey portion conveying arm, to go into to survey to wait in the IC seat groove that to temporary disk next time-histories is sent into the test section tested;
(E) measuring head of test section arrives first the going into to survey on the IC seat groove to take out to playback behind the IC to be measured and test of temporary disk in its left side in the first element time-histories, be somebody's turn to do after testing and surveyed IC to put back to intact the surveys IC seat groove of temporary disk interior and when next time-histories, temporary disk is sent the test section, temporary disk is sent to the right side of measuring head simultaneously, to put back to the intact survey IC seat groove of temporary disk interior and when the next time-histories to the survey IC that goes into to survey to take out in the IC seat groove be somebody's turn to do after playback is done to test behind the IC to be measured of temporary disk for measuring head, temporary disk is sent the test section, and temporary disk is sent to the right side of measuring head once more simultaneously;
(F) the intact survey IC of the portion conveying arm of IC conveying arm takes out intact the surveys IC in the intact IC of survey of the temporary disk seat groove, and the test result of gained when test according to measuring head, delivers to the intact rest area of surveying of IC according to different brackets classification placement;
(G) blank panel scheduling mechanism draws arm with its pedestal and picks up the feed pallet that is removed behind the IC to be measured fully and is transported to its Y-axis lowermost end, serves as that axle rotates and inserts sky IC stackable pallet district with its pedestal, becomes sky IC pallet; And its blank panel scheduling mechanism also can pick up the empty IC pallet in the empty IC stackable pallet district when removing because of having filled up survey IC in the position of qualified survey product holding tray, replaces qualified survey product holding tray.
Description of drawings
Fig. 1 is the board all departments arrangement plan of IC test handler of the present invention;
Fig. 2 A～Fig. 2 C is feed buffer part of the present invention and IC conveying arm planar gesture synoptic diagram;
Fig. 2 D is a feed buffer part action synoptic diagram of the present invention;
Fig. 3 A, Fig. 3 B-1, Fig. 3 C, Fig. 3 D-1 or Fig. 3 A, Fig. 3 B-2, Fig. 3 C, Fig. 3 D-2 are IC conveying arm of the present invention and go into to survey/the intact delivery area planar gesture synoptic diagram of surveying;
Fig. 4 A～Fig. 4 E is of the present invention go into to survey/intact delivery area and test section planar gesture synoptic diagram surveyed;
Fig. 5 A, Fig. 5 B are blank panel scheduling mechanism action synoptic diagram of the present invention.
A: IC to be measured
B: the intact IC that surveys
1: board
2: pile up the feed buffer part
21: the feed pallet
212: the first rows of 211:IC seat groove IC seat groove
213: the second row IC seat grooves
The 22:Y shaft transmission
The 23:IC extracting position
The 3:IC conveying arm
31: go into the two IC conveying arms of survey portion
The 311:X shaft transmission
312: the holding head assembly
32: the two IC conveying arms of intact survey portion
The 321:X shaft transmission
322: the holding head assembly
The 323:Y shaft transmission
4: go into to survey/the intact delivery area of surveying
41: temporary disk
411: go into to survey IC seat groove
412: the intact IC seat groove of surveying
The 413:Y shaft transmission
42: temporary disk
421: go into to survey IC seat groove
422: the intact IC seat groove of surveying
The 423:Y shaft transmission
5: blank panel scheduling mechanism
51: pedestal 52: draw arm
53: hinged cantilever/X-axis gear train
6: empty IC stackable pallet district
61: empty IC pallet
The 7:IC test section
71:IC measuring head 72: holding head assembly
The intact rest area of surveying of 8:IC
81: qualified survey product holding tray 82: other grade product holding trays
Embodiment
Please refer to primary structure shown in Figure 1 is a small-sized board 1, and on board 1, be provided with and pile up feed buffer part 2, blank panel scheduling mechanism 5, empty IC pallet is dispatched mechanism, goes into the two IC conveying arms 31 of survey portion, is finished the two IC conveying arms 32 of survey portion, back and forth transport temporary disk, IC test section 7, mechanisms such as the intact survey of IC rest area 8 is characterized by:
Pile up the feed buffer part: being located at the avris of board, is the stacked feed pallet of filling IC to be measured, and each feed pallet can be done the lifting of Z-direction and carry; And undermost feed pallet can be done moving of Y direction by the Y-axis gear train; Empty IC pallet is dispatched mechanism; Pedestal and cantilever thereof by a tool X-axis gear train are formed, this cantilever is provided with vacuum cup, and the central shaft on can pedestal is the axle center rotation, the feed pallet of the sky of having got IC of feed buffer part can be picked up, Rotate 180 ° is to top, empty IC stackable pallet district, and it is standby to concentrate on sky IC stackable pallet district, and X shaddock gear train moves as X-axis, empty IC pallet in the empty IC stackable pallet district is picked up, be placed into the intact rest area of surveying of IC;
Go into the two IC conveying arms of survey portion: be provided with two absorption heads, can once draw a pair of IC, other is provided with the X-axis gear train and can makes X axis and carry IC, main be responsible for the IC to be measured on the feed pallet of feed buffer part deliver to back and forth transport temporary disk go into to survey in the IC seat groove;
The two IC conveying arms of intact survey portion: be provided with two absorption heads, can once draw a pair of IC, have X-axis gear train and Y-axis gear train, can make X-axis and Y direction and carry IC, the intact survey IC that back and forth transports in the intact survey IC seat groove of temporary disk has been transported to the survey rest area.
Back and forth transport temporary disk: be located at a pair of temporary disk of dislocation each other of the measuring head both sides of test section, this temporary disk is done the to-and-fro movement of Y direction the intact IC of survey of IC/ to be measured is sent into/send the IC test section by the Y-axis gear train;
The intact rest area of surveying of IC: can be divided into certified products district and several other grade rest areas, supply to survey IC and sorted out placement.
According to above-mentioned each structure, the work flow of its principal organ is as follows, please refer to feed buffer part and the IC conveying arm planar gesture synoptic diagram of Fig. 2 A-Fig. 2 C, the feed buffer part action synoptic diagram of Fig. 2 D and the IC conveying arm of Fig. 3 A → Fig. 3 B-1 → Fig. 3 C → Fig. 3 D-1 are surveyed shown in the planar gesture synoptic diagram of delivery area with intact with the IC conveying arm of going into to survey delivery area or Fig. 3 A → Fig. 3 B-2 → Fig. 3 C → Fig. 3 D-2:
(A) IC to be measured (a) is placed on the IC seat groove 211 of the feed pallet 21 that piles up feed buffer part 2, and feed pallet 21 is stacked;
(B) via lifting of Z axle and separating mechanism, can be with next dish of feed pallet 21, separate separately and be placed on the Y-axis gear train 22, it is moving to do y-axis shift, and its first row IC seat groove 212 is positioned on the coordinate position of IC extracting position 23 just, infeed the IC of survey portion conveying arm 31 take out in the first row IC seat groove 212 each IC to be measured (a) and after the first row IC seat groove 212 has been got IC to be measured (a), to Y-axis stepping one lattice, the second row IC seat groove 213 is positioned at continues to infeed the IC of survey portion conveying arm 31 taking-up IC to be measured (a) on the IC extracting position 23; After whole dish feed pallet 21 has been got IC to be measured, continue to shift out next feed pallet 21 again by piling up feed buffer part 2;
(C) the IC to be measured (a) that the IC of survey portion conveying arm 31 will take out of going into of IC conveying arm 3 inserts temporary disk 41 and goes into to survey in the IC seat groove 411 or temporary disk 42 goes into to survey in the IC seat groove 421;
(D) please refer to shown in Fig. 4 A～Fig. 4 E, go into to survey/after the intact temporary disk 41 of surveying delivery area 4 is put into IC to be measured (a) by flow process (C), send into IC measuring head 71 left sides of IC test section 7 by Y-axis gear train 413; Simultaneously temporary disk 42 is sent IC test section 7 by Y-axis gear train 423 from IC measuring head 71 right sides, and accepting the IC to be measured (a) that inserts of the IC of survey portion conveying arm 31, to go into to survey to wait in the IC seat groove 421 that to temporary disk 42 next time-histories is sent into IC test section 7 tested;
(E) IC to be measured (a) the back playback of going into to survey on the IC seat groove 411 to take out that arrives first the temporary disk 41 in its left side in the first element time-histories of the IC measuring head 71 of IC test section 7 is tested, and has been somebody's turn to do survey IC (b) after testing and has put back in the intact survey IC seat groove 412 of temporary disk 41.And when next time-histories, temporary disk 41 is sent IC test section 7; Temporary disk 42 is sent to the right side of IC measuring head 71 simultaneously, measuring head 71 is tested to the IC seat groove 421 interior IC to be measured of taking-up (b) the back playback of going into to survey of temporary disk 42, be somebody's turn to do after testing and surveyed IC (b) to put back to intact the surveys IC seat groove 422 of temporary disk 42 interior and when next time-histories, temporary disk 42 is sent IC test section 7, and temporary disk 41 is sent to the right side of IC measuring head 71 once more simultaneously.
(F) the intact survey IC of the portion conveying arm 32 of IC conveying arm 3 takes out the temporary disk 41 intact IC of survey seat grooves 412 intact survey IC (b) interior or that temporary disk 42 finishes in the survey IC seat grooves 422, and the test result of gained during according to IC measuring head 71 test, deliver to the intact rest area 8 of surveying of IC and sort out according to different brackets and place.
(G) blank panel scheduling mechanism 5 draws arm 52 with its pedestal 51 and picks up the feed pallet 21 that is removed IC to be measured (a) back fully and is transported to its Y-axis lowermost end, serves as that sky IC stackable pallet district 6 is inserted in the axle rotation with its pedestal 51, becomes sky IC pallet 61; And its blank panel scheduling mechanism 5 surveys IC (b) when removing in the position of qualified survey product holding tray 81 because of having filled up, and also the empty IC pallet 61 in the empty IC stackable pallet district 6 can be picked up, and replaces qualified survey product holding tray 81 (shown in Fig. 5 A, Fig. 5 B).
By above-mentioned steps as can be known, feed pallet of the present invention go into the IC of survey portion conveying arm respectively got one row IC to be measured after, one lattice of stepping at once, make next row's IC seat groove in place, so design can be complied with and be maintained pure X-axis mobile alignment into the IC of survey portion conveying arm and carry IC to be measured, does not have unnecessary route to lower efficient fully; This blank panel scheduling mechanism adopts a pedestal and draws arm and adds rotation cantilever/X-axis gear train 53 again, available its hinged cantilever is operated the feed pallet and the empty IC stackable pallet district of Y direction simultaneously, can utilize its X-axis gear train that empty IC pallet is delivered to qualified survey product holding tray zone again, its architectural characteristic is dwindled the area that takies.After the intact one group of IC of IC measuring head 71 every surveys in the IC of the present invention again test section 7 had put back to and surveyed IC, the temporary disk that can arrive opposite side at once picked up IC to be measured and tests, and circulates so continuously, guarantees the highest operational paradigm of this IC test handler.
Claims (2)
1. the board of IC test handler configuration, primary structure is a small-sized board, and on board, be provided with and pile up feed buffer part, empty pallet scheduling mechanism, empty IC pallet is dispatched mechanism, goes into the two IC conveying arms of survey portion, the two IC conveying arms of intact survey portion, back and forth transports temporary disk, the IC test section, mechanisms such as the intact survey of IC rest area is characterized in that
Pile up the feed buffer part: being located at the avris of board, is the stacked feed pallet of filling IC to be measured, and each feed pallet can be done the lifting of Z-direction and carry; And the feed pallet of the superiors can be done moving of Y direction by the Y-axis gear train;
Empty IC pallet is dispatched mechanism: pedestal and cantilever thereof by a tool X-axis gear train are formed, this cantilever is provided with vacuum cup, and Z axle that can pedestal is the axle center rotation, the feed pallet of the sky of having got IC of feed buffer part can be picked up, it is standby to concentrate on sky IC stackable pallet district, or move as X-axis by the X-axis gear train, empty IC pallet is placed on the certified products holding tray;
Go into the two IC conveying arms of survey portion: two absorption heads are arranged, can once draw a pair of IC, be provided with the X-axis gear train and make X axis conveying IC;
The two IC conveying arms of intact survey portion: two absorption heads are arranged, can once draw a pair of IC, it has X-axis gear train and Y-axis gear train, can make X-axis and Y direction and carry IC; Main be responsible for the IC to be measured on the feed pallet of feed buffer part be transported to back and forth transport temporary disk go into to survey in the IC seat groove; And the interior intact survey IC of intact survey IC seat groove that will back and forth transport temporary disk has been transported to the survey rest area;
Back and forth transport temporary disk: be located at a pair of temporary disk of dislocation each other of the measuring head both sides of test section, this temporary disk is done the to-and-fro movement of Y direction the intact IC of survey of IC/ to be measured is sent into/send the IC test section by the Y-axis gear train;
The intact rest area of surveying of IC: can be divided into certified products holding tray and other grade product holding trays, supply to survey IC and sorted out placement.
2. the work flow of the board configuration of IC test handler as claimed in claim 1 is characterized in that the work flow of its principal organ is as follows:
(A) IC to be measured is placed on the IC seat groove of the feed pallet that piles up the feed buffer part, and with the feed tray stack;
(B) via lifting of Z axle and separating mechanism, can be with next dish of feed pallet, after separating separately, place on the Y uranium gear train, it is moving to do y-axis shift, and its first row IC seat groove is positioned on the coordinate position of IC extracting position just, infeed the IC of survey portion conveying arm take out in the first row IC seat groove each IC to be measured and after the first row IC seat groove has been got IC to be measured, to Y-axis stepping one lattice, second row's IC seat groove is positioned at continue to infeed the IC of survey portion conveying arm on the IC extracting position and takes out IC to be measured; After whole dish feed pallet has been got IC to be measured, continue to shift out next feed pallet again by piling up the feed buffer part;
(C) the IC to be measured that the IC of survey portion conveying arm will take out of going into of IC conveying arm inserts temporary disk and goes into to survey in the IC seat groove;
(D) go into to survey/after the intact temporary disk of surveying the delivery area is put into IC to be measured by flow process (C), send into the measuring head left side of test section to the Y-axis gear train; Simultaneously temporary disk is sent the test section by a Y-axis gear train self-test right side, and accepting the IC to be measured that inserts of the IC of survey portion conveying arm, to go into to survey to wait in the IC seat groove that to temporary disk next time-histories is sent into the test section tested;
(E) measuring head of test section arrives first the going into to survey on the IC seat groove to take out to playback behind the IC to be measured and test of temporary disk in its left side in the first element time-histories, be somebody's turn to do after testing and surveyed IC to put back to intact the surveys IC seat groove of temporary disk interior and when next time-histories, temporary disk is sent the test section, temporary disk is sent to the right side of measuring head simultaneously, to put back to the intact survey IC seat groove of temporary disk interior and when the next time-histories to the survey IC that goes into to survey to take out in the IC seat groove be somebody's turn to do after playback is done to test behind the IC to be measured of temporary disk for measuring head, temporary disk is sent the test section, and temporary disk is sent to the right side of measuring head once more simultaneously;
(F) the intact survey IC of the portion conveying arm of IC conveying arm takes out intact the surveys IC in the intact IC of survey of the temporary disk seat groove, and the test result of gained when test according to measuring head, delivers to the intact rest area of surveying of IC according to different brackets classification placement;
(G) blank panel scheduling mechanism draws arm with its pedestal and picks up the feed pallet that is removed behind the IC to be measured fully and is transported to its Y-axis lowermost end, serves as that axle rotates and inserts sky IC stackable pallet district with its pedestal, becomes sky IC pallet; And its blank panel scheduling mechanism also can pick up the empty IC pallet in the empty IC stackable pallet district when removing because of having filled up survey IC in the position of qualified survey product holding tray, replaces qualified survey product holding tray.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02122740 CN1464312A (en) | 2002-06-07 | 2002-06-07 | Machine allocation of IC test processor and process for making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02122740 CN1464312A (en) | 2002-06-07 | 2002-06-07 | Machine allocation of IC test processor and process for making the same |
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| CN1464312A true CN1464312A (en) | 2003-12-31 |
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| CN 02122740 Pending CN1464312A (en) | 2002-06-07 | 2002-06-07 | Machine allocation of IC test processor and process for making the same |
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| WO2008125011A1 (en) * | 2007-04-12 | 2008-10-23 | Semiconductor Testing Advanced Research Lab Inc. | Method and apparatus for testing system-in-package devices, micro sd devices |
| CN100559197C (en) * | 2007-02-01 | 2009-11-11 | 鸿劲科技股份有限公司 | A kind of electronic assembly test and classification device |
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| CN100428437C (en) * | 2005-10-27 | 2008-10-22 | 京元电子股份有限公司 | Feeding device |
| CN101082631B (en) * | 2006-05-31 | 2010-10-13 | 鸿劲科技股份有限公司 | IC detecting machine capable of simultaneously multiple parallel built-in testing |
| CN101082633B (en) * | 2006-06-01 | 2010-09-29 | 鸿劲科技股份有限公司 | IC detecting machine capable of simultaneously multiple parallel built-in testing |
| CN100559197C (en) * | 2007-02-01 | 2009-11-11 | 鸿劲科技股份有限公司 | A kind of electronic assembly test and classification device |
| CN101241869B (en) * | 2007-02-08 | 2010-06-23 | 鸿劲科技股份有限公司 | Chip testing classifier |
| WO2008125011A1 (en) * | 2007-04-12 | 2008-10-23 | Semiconductor Testing Advanced Research Lab Inc. | Method and apparatus for testing system-in-package devices, micro sd devices |
| CN101308707B (en) * | 2007-05-15 | 2011-04-06 | 鸿劲科技股份有限公司 | Sorting machine for memory IC detection |
| CN101315402B (en) * | 2007-06-01 | 2011-06-01 | 致茂电子股份有限公司 | Multi-test seat test station having in-turn arranged feeding section, test section and discharging section |
| CN101493474B (en) * | 2008-01-22 | 2012-03-21 | 致茂电子股份有限公司 | Modular program assembly for IC element detecting machine |
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