JP7145029B2 - Cutting equipment for semiconductor materials - Google Patents

Description

The present invention relates to a semiconductor material cutting apparatus for cutting a semiconductor strip into individual semiconductor packages.

A semiconductor material cutting machine is a device for cutting packaged semiconductor strips into individual semiconductor packages.

Such a semiconductor material cutting apparatus not only has the function of cutting the semiconductor strip, but also inspects the top and bottom surfaces of the cut semiconductor package after the semiconductor strip has been cut, washed and dried to detect manufacturing defects. Provides the ability to handle a series of steps to classify semiconductor packages as they arise.

As a patent related to such a cutting device for semiconductor materials, the technology described in the prior art column of Korean Patent No. 10-1303103 (hereinafter referred to as "prior art 1") is known. It has become.

The semiconductor material cutting apparatus of prior art 1 has an on-loader that supplies semiconductor strips, and while moving along the X-axis, unloads the semiconductor strips onto a chuck table or picks up each semiconductor package from the chuck table. a strip picker and a unit picker for picking the semiconductor strips, a chuck table for sucking the semiconductor strips placed by the picker and horizontally moving or rotating the semiconductor strips, and the semiconductor strips transferred by the chuck table to respective packages. A sawing device that cuts the package into three pieces, a cleaning device that removes foreign matter generated during cutting, a drying device that dries each semiconductor package that has been cleaned, and individual semiconductor packages are set in advance through vision inspection, etc. and a handler that loads the trays according to established quality standards.

In the semiconductor material cutting apparatus having the above-described configuration, when the semiconductor strip supplied from the on-loader is loaded onto the inlet rail, the strip picker waiting at the pick-up position picks up the semiconductor strip, and then moves. transfer the semiconductor strip of the on-loader to the chuck table by lowering it onto the chuck table.

The strip picker is provided with an interlock pin and the chuck table is provided with a pin insertion hole into which the interlock pin is inserted so that the strip picker can pick up the semiconductor strip from a predetermined position. Therefore, when the strip picker picks up the semiconductor strip, the interlock pin is inserted into the pin insertion hole, so that the strip picker and the chuck table are always coupled at a fixed position, and the semiconductor strip sucked by the strip picker is held. can be easily placed on the chuck table.

However, the interlock pin and pin insertion hole of prior art 1 as described above only align the positions of the strip picker and the chuck table, and the position of the semiconductor strip positioned between the strip picker and the chuck table. cannot be aligned.

Therefore, even if the semiconductor strips are aligned at the loading section, the strip picker does not work even if the semiconductor strips are aligned at the loading section because loading and unloading are always performed at fixed positions by the interlock pins and the pin insertion holes when there is an error in the position of the semiconductor strips. Since the semiconductor strip is transmitted with the interlock pin and the pin insertion hole of the chuck table fitted together, there is a problem that the semiconductor strip must be transmitted to the chuck table without correcting the positional error of the semiconductor strip.

In addition, even if the semiconductor strip transferred to the chuck table is misaligned, the semiconductor strip on the chuck table must be picked up by the strip picker and reloaded after correcting the position. Also, there is a problem that position correction is impossible due to the interlock pin of the strip picker and the pin insertion hole of the chuck table.

As described above, if the semiconductor strip is placed on the chuck table with a positional error, the defect rate of the semiconductor package may increase or the chuck table or cutting blade may be damaged during the cutting process using the cutting device. It may cause

On the other hand, a technology has been developed in which a semiconductor strip is picked up or put down by a strip picker after confirming the position of the semiconductor strip, that is, the position in the X-axis direction, the Y-axis direction, and the θ direction, using a vision sensor. As a related patent, the one disclosed in Korean Registered Patent No. 10-1275697 (hereinafter referred to as "prior art 2") is known.

However, in the case of prior art 2, since the pin and the pin insertion hole are not used, when the semiconductor strip is unloaded from the strip picker after the position correction is completed, changes in the external environment, such as vibration inside and outside the equipment and the passage of time, may occur. Inability to respond appropriately to changes associated with Therefore, when the external environment changes drastically, the loading and unloading of the semiconductor strips using the strip picker must be performed irregularly.

Korea Registered Patent No. 10-1303103 Korea Registered Patent No. 10-1275697

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems. To provide a semiconductor material cutting device capable of improving accuracy by correcting a positional error of a semiconductor strip by selectively raising and lowering an interlock pin as required.

An apparatus for cutting a semiconductor material according to one aspect of the present invention includes an aligning table on which a semiconductor strip supplied from an on-loader is sucked and which is movable in the Y-axis direction and rotatable in the θ direction, and which is sucked by the aligning table. a loading block, which is provided in the front and rear direction of the loaded semiconductor strip and has one or more first interlock pinholes on the top thereof; a chuck table on which the semiconductor strip is sucked, provided with one or more second interlock pinholes on the top thereof, and movable in the Y-axis direction and rotatable in the θ direction for cutting into semiconductor packages; It is installed between the loading part and the chuck table so as to be movable in the X-axis direction. A strip picker equipped with a strip vision for inspection and equipped with an interlock pin that can move up and down so that the interlock pin can be inserted into the first interlock pinhole or the second interlock pinhole as required. and including.

Also, based on the result of the alignment state inspection of the strip vision, the loading unit moves in the Y-axis direction and rotates in the θ-direction to correct the positional errors of the semiconductor strip in the Y-axis and θ-directions. After correcting the positional error of the semiconductor strip in the X-axis direction by moving the strip picker in the X-axis direction with the interlock pin of the picker raised, the strip picker picks up the semiconductor strip on the alignment table. The semiconductor strip attracted by the strip picker is transferred to the chuck table while the interlock pin of the strip picker is lowered and inserted into the second interlock pin hole.

Also, based on the result of the alignment state inspection of the strip vision, the loading unit moves in the Y-axis direction and rotates in the θ-direction to correct the positional errors of the semiconductor strip in the Y-axis and θ-directions. The strip picker sucks the semiconductor strip on the alignment table while the interlock pin of the picker is lowered and inserted into the first interlock pin hole, and the interlock pin of the strip picker is raised. and transferring the semiconductor strip sucked by the strip picker to the chuck table after correcting the positional error of the semiconductor strip in the X-axis direction by moving the strip picker in the X-axis direction.

The driving unit further includes a driving unit for moving the loading unit in the X-axis direction, and the loading unit moves in the X-axis and Y-axis directions and rotates in the θ direction based on the alignment state inspection result of the strip vision. to correct the positional errors of the semiconductor strips in the X-axis, Y-axis and θ directions, and the strip picker moves to the alignment table in a state where the interlock pins of the strip picker are lowered and inserted into the first interlock pinholes. picking up the upper semiconductor strip and transferring the semiconductor strip picked up by the strip picker to the chuck table in a state where the interlock pin of the strip picker is lowered and inserted into the second interlock pin hole; characterized by

The semiconductor device further includes a cutting unit for cutting the semiconductor strips sucked by the chuck table, and a cutting unit vision for inspecting an alignment state of the semiconductor strips sucked by the chuck table, wherein the cutting unit vision is and inspecting whether the cutting line of the semiconductor strip sucked by the chuck table is positioned within the error range of the blade escape groove of the chuck table.

Further, the semiconductor strip transferred to the chuck table is inspected by the cutting part vision, and based on the inspection result of the cutting part vision, when the alignment state of the semiconductor strip is deviated, the interlock pin of the strip picker is detected. is lifted, the strip picker picks up the semiconductor strip on the chuck table, and the chuck table moves in the Y-axis direction and rotates in the θ direction to remove the positional error of the semiconductor strip in the Y-axis and θ directions. is corrected, the strip picker moves in the X-axis direction to correct the positional error of the semiconductor strip in the X-axis direction, and then, with the interlock pin of the strip picker raised, the semiconductor sucked by the strip picker It is characterized by transferring the strip to the chuck table again.

Further, the semiconductor strip transferred to the chuck table is inspected by the cutting part vision, and based on the inspection result of the cutting part vision, when the alignment state of the semiconductor strip is deviated, the interlock pin of the strip picker is detected. is lowered, the strip picker picks up the semiconductor strip on the chuck table, and the chuck table moves in the Y-axis direction and rotates in the θ direction to remove the position error of the semiconductor strip in the Y-axis and θ directions. After correcting the positional error of the semiconductor strip in the X-axis direction by moving the strip picker in the X-axis direction, the semiconductor strip sucked by the strip picker is moved in a state in which the interlock pin of the strip picker is raised. is transmitted to the chuck table again.

Also, one side of the loading block is provided with a plurality of fiducial holes, and the strip vision inspects the fiducial holes and the semiconductor strip together, and the aligning table detects the fiducial holes. It is characterized by checking the alignment state of the adsorbed semiconductor strips.

In addition, the loading unit further includes a pair of inlet rails movably provided in the Y-axis direction for guiding the semiconductor strips supplied from the on-loader unit and varying according to the width of the semiconductor strips. Characterized by

The semiconductor material cutting apparatus of the present invention described above has the following effects.

Misalignment of the semiconductor strips in the Y-axis and θ directions is corrected at the loading section, and corrections in the X-axis direction of the semiconductor strips are performed by the strip picker. By lowering the strip picker toward the loading unit or the chuck table while the pins are raised, the positions of the semiconductor strips in the X-axis direction can be aligned and positional errors of the semiconductor strips can be corrected.

When the position of the semiconductor strip has been corrected, the strip picker descends toward the loading section or the chuck table while the interlock pin remains lowered. It can be picked up by the strip picker or placed on the chuck table while the direction position is fixed, so it is highly accurate without being affected by external factors such as vibration inside and outside the equipment and the passage of time. It can be lowered and placed in a state where the position error is corrected.

According to the present invention, by providing the existing interlock pin and interlock pinhole, problems such as position correction of the semiconductor strip and inability to reload can be solved, and the interlock pin can be moved up and down. , The interlock pin can be raised to correct the position during position correction or reloading, and when correction is not required, the interlock pin and the interlock pinhole can ensure mechanical accuracy.

Therefore, the present invention enables accurate loading and unloading without being affected by the surrounding environment, which is the advantage of the existing interlock pin, and eliminates the drawback of the existing interlock pin, namely vibration inside and outside the equipment. It is possible to overcome the problems that it was impossible to correct the position of the materials and the correspondence with the passage of time.

1 is a plan view of a semiconductor strip supplied to a semiconductor material cutting device; FIG. 1 is a plan view of a cutting device for semiconductor materials; FIG. FIG. 3 is a view showing a state in which interlock pins of the strip picker of FIG. 2 are lowered and semiconductor strips are placed on a loading section; FIG. 4 is a view showing a state in which a strip picker descends to a loading unit and picks up a semiconductor strip in the state of FIG. 3; FIG. 5 is a diagram showing a state in which a strip picker is raised to pick up a semiconductor strip in the state of FIG. 4; FIG. 3 is a view showing a state in which interlock pins of the strip picker of FIG. 2 are raised and semiconductor strips are placed on a loading section; FIG. 7 is a diagram illustrating a state in which the strip picker descends to a loading unit and picks up semiconductor strips in the state of FIG. 6; FIG. 8 is a diagram showing a state in which the strip picker is raised to pick up a semiconductor strip in the state of FIG. 7; FIG. 3 is a view showing a state in which the strip picker of FIG. 2 is lowered onto the chuck table while interlock pins of the strip picker are lowered; FIG. 10 is a diagram showing a state in which the strip picker is lifted in the state of FIG. 9 and the semiconductor strips are placed on the chuck table; 3 is a view showing a state in which the interlock pins of the strip picker of FIG. 2 are raised and the semiconductor strips are placed on the chuck table; FIG. FIG. 12 is a diagram showing a state in which the strip picker descends to the chuck table and picks up the semiconductor strip in the state of FIG. 11;

The following merely illustrates the principles of the invention. Thus, those skilled in the art will be able to devise various apparatus, even though not expressly described or illustrated herein, that embody the principles of the invention and fall within the concept and scope of the invention. deaf. Also, all conditional terms and embodiments recited in this specification are expressly intended in principle only for the purpose of enabling an understanding of the inventive concept, and thus expressly recited. It should be understood that the embodiments and conditions are not limited.

The above-mentioned objects, particulars and advantages will become more apparent from the following detailed description in conjunction with the accompanying drawings, thereby making it easier for those skilled in the art to which the invention pertains to implement the technical ideas of the invention. It is something that can be done.

Embodiments described herein are described with reference to cross-sectional and/or perspective views that are ideally illustrative illustrations of the invention. Accordingly, embodiments of the present invention are not limited to the particular forms illustrated, but encompass variations in form produced by the manufacturing process.
Before we get into the description, let's define the following:

The X-axis means the direction in which the strip picker 300 and the unit picker 400 move horizontally, and the Y-axis means the axis perpendicular to the horizontal plane of the X-axis.

The θ direction means a clockwise or counterclockwise tilt direction on the XY plane.
The forward direction means the direction in which the semiconductor strip S is pulled out from the on-loader section on the X-axis, and the backward direction means the direction opposite to the forward direction.

DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor material cutting apparatus 10 according to a preferred embodiment of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a plan view of semiconductor strips supplied to a semiconductor material cutting device, FIG. 2 is a plan view of the semiconductor material cutting device, and FIG. 4 shows the state in which the semiconductor strip is placed, FIG. 4 shows the state in which the strip picker descends to the loading section in the state of FIG. 3 and picks up the semiconductor strip, and FIG. FIG. 6 is a view showing a state in which the picker rises and picks up the semiconductor strip, FIG. 6 shows a state in which the interlock pin of the strip picker in FIG. 2 is raised and the semiconductor strip is placed on the loading section; 7 is a diagram showing a state in which the strip picker descends to the loading section and picks up the semiconductor strip in the state of FIG. 6; FIG. 8 is a diagram showing a state in which the strip picker rises in the state of FIG. 7 and picks up the semiconductor strip; 9 shows a state in which the strip picker is lowered onto the chuck table with the interlock pin of the strip picker shown in FIG. FIG. 11 is a diagram showing the state where the semiconductor strip is placed on the chuck table with the interlock pin of the strip picker shown in FIG. FIG. 10 is a diagram showing a state in which the strip picker descends to the chuck table and picks up the semiconductor strip;

In this case, (a) of FIGS. 3 to 8 is a perspective view of the strip picker and the loading section, (b) of FIGS. 3 to 8 is a side view of the loading section of the strip picker, and (b) of FIGS. c) is a rear view of the strip picker and loading section; 9 to 12(a) are perspective views of the strip picker and chuck table, FIGS. 9 to 12(b) are side views of the strip picker and chuck table, and FIGS. 9 to 12(c) are It is a rear view of a strip picker and a chuck table.

First, the semiconductor strip S supplied to the semiconductor material cutting apparatus 10 according to the preferred embodiment of the present invention will be described.

As shown in FIG. 1, a semiconductor strip S means that a plurality of semiconductor packages P are connected in a strip shape. Therefore, when cut using a blade 230 of the cutting unit 200, which will be described later, the semiconductor packages P are individualized.

A semiconductor material cutting apparatus 10 according to a preferred embodiment of the present invention will be described below.

As shown in FIGS. 2 and 3, a semiconductor material cutting apparatus 10 according to a preferred embodiment of the present invention includes an on-loader section in which a semiconductor strip S is drawn into a magazine, and an on-loader section. An aligning table 111 on which a semiconductor strip S to be supplied is attracted and which is movable in the Y-axis direction and rotatable in the .theta. A loading unit 100 comprising a loading block 130 having at least one first interlock pinhole 131, and a semiconductor strip S for cutting the semiconductor strip S transferred from the loading unit 100 into individual semiconductor packages P. is sucked, one or more second interlock pinholes 211 are provided in the upper part, and the chuck table 210 is provided movably in the Y-axis direction and rotatable in the θ direction, the loading section 100 and the cutting section 200. A strip vision (a strip vision device) installed in between to be movable in the X-axis direction, sucks the semiconductor strips S supplied to the loading unit 100, transfers the semiconductor strips S to the cutting unit 200, and inspects the alignment of the semiconductor strips S on one side. (not shown) is provided so that the interlock pin 370 is inserted into the first interlock pin hole 131 of the loading unit 100 or the second interlock pin hole 211 of the chuck table 210 of the cutting unit 200 as required. , a strip picker 300 having an interlock pin 370 which can move up and down, a cleaning unit 500 for removing foreign matter from the semiconductor package P generated by cutting the cutting unit 200, and drying the semiconductor package P cleaned by the cleaning unit 500 and a drying unit 600 installed between the cutting unit 200 and the drying unit 600 so as to be movable in the X-axis direction. A unit picker 400, an inspection unit 700 that inspects the semiconductor packages P dried by the drying unit 600, and a classification that classifies and transports the semiconductor packages P based on the inspection results of the semiconductor packages P performed by the inspection unit 700. and a part 800 .

The semiconductor strip S is supplied to the on-loader section in a magazine state, and the semiconductor strip S is loaded using a pusher provided in the on-loader section or a gripper provided on one side of the strip picker 300. It fulfills the function of supplying to the unit 100 .

When the semiconductor strips S are supplied from the on-loader section, the loading section 100 is placed on the alignment table 111 through a pair of inlet rails 150 that guide the semiconductor strips S supplied from the on-loader section. At this time, the inlet rail 150 is movably provided in the Y-axis direction so that the width thereof can be adjusted according to the type and size of the semiconductor strip S. The alignment table 111 can attract the semiconductor strip S, is movable in the Y-axis direction of the semiconductor strip S and rotatable in the θ direction, and functions to correct the Y-axis direction and the θ direction of the semiconductor strip. .

As shown in FIGS. 3 to 8, the loading unit 100 includes a plate 110 having an alignment table 111 on which the semiconductor strip S is set, and the loading unit 100 is provided on the plate 110 in the front and rear directions of the semiconductor strip S, and a loading block 130 having one or more first interlock pinholes 131 on the top thereof.

One side of the top surface of the loading block 130 is provided with a first interlock pin hole 131 and another side of the top surface is provided with a plurality of fiducial holes or fiducial marks. The fiducial holes of the loading block 130 are inspected together with the semiconductor strips S by a strip vision provided on one side of the strip picker 300, so that the semiconductor strips S adsorbed on the alignment table 111 are inspected together. You can check alignment. At this time, a plurality of fiducial holes are provided so that an easily inspected fiducial hole can be selected based on the position of the fiducial mark formed on the semiconductor strip S and the aligned state can be confirmed. preferably.

A loading block 130 and an inlet rail 150 are installed on the plate 110, a semiconductor strip S is placed thereon, and an alignment table 111 movable in the Y-axis direction and the θ direction is provided. Accordingly, the semiconductor strip S is attracted and placed on the plate 110 by the alignment table 111 .

The loading blocks 130 are provided on the front and rear sides of the semiconductor strip S, respectively, and are formed on one side of the upper portion thereof for checking the alignment state of the semiconductor strip S, and on the other side of the upper portion thereof. Through the first interlock pinhole 131 into which the interlock pin 370 of the strip picker 300 is inserted, the alignment inspection of the semiconductor strip S and the function of providing the semiconductor strip S to the fixed position of the strip picker 300 are performed.

At least one first interlock pin hole 131 into which the interlock pin 370 of the strip picker 300 is inserted is preferably formed on the upper portion of the loading block 130. When the interlock pin 370 is lowered, the first interlock pin hole 131 is formed. By being inserted into the interlock pin hole 131, the semiconductor strip S can be fixed to be picked up at a fixed position of the strip picker 300. When the interlock pin 370 is raised, the strip picker 300 can pick up the semiconductor strip. It is possible to correct the position of S in the X-axis direction.

The first interlock pinhole 131 interlocks the strip picker 300 when the strip picker 300 descends toward the loading unit 100 to pick up the semiconductor strips S placed on the loading unit 100 . By providing a space into which the pin 370 is inserted, it functions to align the strip picker 300 and the loading unit 100 .

In this case, a plurality of first interlock pinholes 131 may be formed on the loading block 130 . This is to allow the interlock pin 370 to be inserted in accordance with the size of the replaced picker head 330 when replacing the later-described picker head 330 .

Preferably, the interlock pin 370 and the first interlock pinhole 131 or the second interlock pinhole 211 are arranged upward and downward with respect to the semiconductor strip S, respectively, so as to pick up the semiconductor strip S stably. each can be provided.

The inlet rails 150 are installed on the plate 110 so as to be movable in the Y-axis direction from both sides of the semiconductor strip S so that the semiconductor strip S can be guided regardless of its type and size.

Therefore, when the semiconductor strip S is supplied through the on-loader part, the inlet rail 150 moves from the side of the semiconductor strip S in the Y-axis direction to guide the semiconductor strip S to be positioned on the alignment table 111 . Then, the semiconductor strip S can be set on the alignment table 111 of the plate 110 .

Also, the alignment table 111 of the loading unit 100 is movable in the Y-axis direction and rotatable in the θ direction. Therefore, when the position of the semiconductor strip S in the Y-axis direction or the .theta. The position in the θ direction can be corrected to a fixed position.

As described above, through the movement and rotation of the alignment table 111 of the loading unit 100 in the Y-axis direction, it is possible to correct the position of the semiconductor strip S placed on the loading unit 100 in the Y-axis direction and the θ direction. Such position correction may be performed by a controller (not shown). In other words, the driving part for driving the inlet rail 150 and the driving part for rotating the loading part 100 can be driven by the electric signal of the control part.

However, in addition to this, the loading unit 100 can correct all of the X-axis, Y-axis and θ directions of the semiconductor strip S by further providing a driving unit for moving the loading unit 100 in the X-axis direction. In this case, since the loading unit 100 has corrected the X-axis, Y-axis, and θ directions of the semiconductor strip S, the interlock pin 370 of the strip picker 300 is lowered to open the first interlock pinhole of the loading block 130 . 131 , the strip picker 300 can stably and fixedly pick up the semiconductor strip S attracted to the loading unit 100 , and the interlock pin 370 of the strip picker 300 and the second interlock pin of the chuck table 210 . The semiconductor strips S aligned with the holes 211 can be stably transferred to the chuck table 210 .

The cutting unit 200 functions to cut the semiconductor strips S transferred from the loading unit 100 into individual semiconductor packages, and as shown in FIG. 2, the semiconductor strips S transferred through the strip picker 300 are sucked. It comprises a chuck table 210 and a blade 230 for cutting the semiconductor strip S sucked on the chuck table 210 to individualize the semiconductor packages P. As shown in FIG.

The chuck table 210, on which the semiconductor strip S transferred through the strip picker 300 is placed, moves the semiconductor strip S in the Y-axis direction so as to be positioned under the blade 230, and changes the direction in the θ direction. and a function of correcting the Y-axis direction and θ direction of the semiconductor strip S placed on the chuck table 210 .
Such a chuck table 210 is installed movably along the Y axis and rotatable in the θ direction.

As described above, since the chuck table 210 is installed movably along the Y-axis and rotatable in the θ direction, the chuck table 210 can be easily moved to the cutting position of the blade 230, thereby cutting the semiconductor strip. S can be moved to the cutting position of the blade 230 to cut.

Meanwhile, the cutting unit 200 is provided with a cutting unit vision (not shown) for inspecting the alignment state of the semiconductor strips S sucked on the chuck table 210 . The individual semiconductor packages P are vacuum-sucked on the chuck table 210 so that the semiconductor strips S to be cut and the individualized semiconductor packages P are prevented from being detached and can be stably sucked. At this time, in order to protect the chuck table 210 from the blade 230, a blade escape groove is formed in the chuck table 210, and if the cutting line of the semiconductor strip S is positioned within the error range of the blade escape groove of the chuck table 210, , cutting can be performed. Therefore, the cutting section vision inspects whether or not the cutting line of the semiconductor strip S is positioned within the error range of the blade clearance groove of the chuck table 210, and if it is out of the error range, the semiconductor strip S is cut. The semiconductor strip S is picked up by the strip picker 300, corrected in the X-axis direction of the strip picker 300, corrected in the Y-axis and .theta. directions of the chuck table 210, and re-aligned and reloaded.

Incidentally, the position correction in the chuck table 210 can be performed by the controller. In other words, the drive section that moves the chuck table 210 along the Y axis and the drive section that rotates it in the .theta. direction can be driven by electric signals from the control section.
A detailed description of the positional correction of the semiconductor strip S or the semiconductor package P performed on the chuck table 210 will be given later.

As described above, the chuck table 210 is provided with blade relief grooves, so that the semiconductor strip S can be easily cut without damaging the chuck table 210 when the semiconductor strip S is cut by the blade 230 .

The chuck table 210 is formed with a second interlock pin hole 211 for inserting the interlock pin 370 of the strip picker 300, as shown in FIGS.

The second interlock pinhole 211 is used to interlock the strip picker 300 when the strip picker 300 descends toward the chuck table 210 to place the semiconductor strip S sucked by the strip picker 300 on the chuck table 210 . By providing a space into which the pin 370 is inserted, it functions to align the strip picker 300 and the chuck table 210 .

The blade 230 functions to cut the semiconductor strip S sucked by the chuck table 210 into individual semiconductor packages P. As shown in FIG.

The strip picker 300 is installed between the loading unit 100 and the cutting unit so as to be movable in the X-axis direction, and picks up the semiconductor strips S set and loaded on the alignment table 111 of the plate 110 of the loading unit 100 to the cutting unit 200 . It fulfills the function of transmitting to the chuck table 210 . Although not shown, one side of the strip picker 300 may be provided with a strip vision for inspecting alignment of the semiconductor strips S and a gripper for pulling out the semiconductor strips S from the magazine.

3 to 12, the strip picker 300 includes a picker body 310, a picker head 330 replaceably installed on the picker body 310, and a fastening part for coupling the picker body 310 and the picker head 330. 350 is provided corresponding to the first interlock pinhole 131 or the second interlock pinhole 211 and can be moved up and down. It includes an interlock pin 370 to be inserted and a pin driving part 390 for moving the interlock pin 370 up and down. The strip picker 300 is installed on the first guide frame 910 . Therefore, the strip picker 300 can move in the X-axis direction by moving along the first guide frame 910 , sucks the semiconductor strip S supplied from the loading unit 100 , and transfers the semiconductor strip S to the cutting unit 200 . be able to.

The picker head 330 is coupled to the lower portion of the picker body 310 by a fastening portion 350 , and the lower portion of the picker head 330 is provided with a suction portion for sucking the semiconductor strip S.

The interlock pin 370 is provided on the strip picker 300 so as to correspond to the first interlock pinhole 131 or the second interlock pinhole 211 and is moved up and down by the pin driver 390 . In this case, the pin drive 390 can be a cylinder that is pneumatically or hydraulically or electrically driven.

When the interlock pin 370 is lowered by the pin driving unit 390, the interlock pin 370 protrudes below the picker head 330 of the strip picker 300, so that the strip picker 300 is lowered toward the loading unit 100 or the chuck table 210. , the interlock pin 370 is inserted into the first interlock pinhole 131 or the second interlock pinhole 211 .

In addition, when the interlock pin 370 is lifted by the pin driving unit 390, the interlock pin 370 does not protrude below the picker head 330 of the strip picker 300, thereby allowing the strip picker 300 to move toward the loading unit 100 or the chuck table 210. , the interlock pin 370 is no longer inserted into the first interlock pinhole 131 or the second interlock pinhole 211 .

The elevation of the interlock pin 370 is determined according to the positional error of the semiconductor strip S sucked by the loading unit 100 or the chuck table 210 in the X-axis direction, which will be described in detail later.

The picker head 330 can be used interchangeably with different size picker heads 330 according to the size and type of the semiconductor strip S. FIG. In this case, it is possible to easily connect and disconnect the picker head 330 to be replaced with the picker body 310 using the fastening part 350 .

Also, the position of the interlock pin 370 may vary depending on the size of the semiconductor strip S and the size of the picker head 330 . To accommodate this, the loading block 130 is formed with a plurality of first interlock pinholes 131 .

The cleaning unit 500 is disposed between the cutting unit 200 and the drying unit 600 and functions to remove foreign matter from the semiconductor package P generated by cutting the cutting unit 200 .

In this case, the semiconductor package P cut by the cutting section 200 is cleaned by the cleaning section 500 while being sucked by the unit picker 400 .

In other words, when the unit picker 400 transfers the semiconductor packages P from the cutting section 200 to the drying section 600 , they pass through the cleaning section 500 . The cleaning unit 500 removes foreign matter from the semiconductor package P by cleaning the lower surface of the semiconductor package P sucked by the unit picker 400 .

The drying unit 600 functions to dry the semiconductor packages P cleaned by the cleaning unit 500 .

In this case, the drying unit 600 dries the semiconductor packages P transferred from the cutting unit 200 by the unit picker 400 and transfers the dried semiconductor packages P to the turntable 710 by X-axis movement and rotation.

The unit picker 400 is installed between the cutting section 200 and the drying section 600 so as to be movable in the X-axis direction, and has a function of transferring the semiconductor packages P cut by the cutting section 200 to the drying section 600 via the cleaning section 500. fulfill

Such a unit picker 400 is installed on the first guide frame 910 . By moving the unit picker 400 along the first guide frame 910, it can move in the X-axis direction.

The inspection unit 700 functions to inspect the semiconductor packages P dried by the drying unit 600, and as shown in FIG. A table 710, a first vision unit 721 for imaging and inspecting the top surface of the semiconductor package P loaded on the turntable 710, a second vision unit 722 for imaging and inspecting the bottom surface of the semiconductor package P, and the turntable 710. and first and second sort pickers 731 and 732 for picking up the semiconductor packages P loaded on the stack and moving them to the second vision unit 722 or transmitting them to the sorting unit 800 .

In this case, the turntable 710 is movable in the Y-axis direction. Also, the first sort picker 731 is installed on a fourth guide frame 940 and can move along the fourth guide frame 940 to move in the X-axis direction, and the second sort picker 732 can move along the fourth guide frame 940 . By being installed on the guide frame 930 and moving along the third guide frame 930, it can move in the X-axis direction.

In addition, both surfaces of the semiconductor package P can be inspected by imaging both the top surface and the bottom surface of the semiconductor package P by the configuration of the first and second vision units 721 and 722 .

The sorting unit 800 performs a function of sorting and unloading the semiconductor packages P based on the inspection results of the semiconductor packages P performed by the inspection unit 700. As shown in FIG. A first carry-out tray 810 on which good semiconductor packages P transferred by the sort picker 732 are loaded, and a second carry-out tray 810 on which defective semiconductor packages P transferred by the first sort picker 731 or the second sort picker 732 are loaded. a tray picker 850 for unloading the tray and supplying a new tray when all the semiconductor packages P are loaded on one of the unloading tray 830, the first unloading tray 810, and the second unloading tray 830; and a third vision unit 870 that is provided in the second carry-out tray 830 and that images the semiconductor package P for inspection.

The tray picker 850 is installed on the second guide frame 920 . Therefore, the tray picker 850 can move in the X-axis direction by moving along the second guide frame 920 .

A detailed description of the operation of unloading the sorted semiconductor packages P after the semiconductor strips S are cut by the semiconductor material cutting apparatus 10 of the present invention configured as described above is described in Korean Patent No. 10-1303103. No. (prior art 1)” and “Korean Patent Publication No. 10-2017-0026751”, so detailed description will be omitted.

Hereinafter, the operation of correcting the position of the semiconductor strip S performed by the semiconductor material cutting apparatus 10 of the present invention having the above-described configuration will be described.

The position correction operation of the semiconductor strip S is performed between the loading unit 100 and the strip picker 300 and between the strip picker 300 and the chuck table 210, depending on whether the semiconductor strip S is shifted or not, and the X position of the semiconductor strip S. It can be divided into first to third position correction operations depending on where the position correction in the axial direction is performed.

The first position correction operation will be described below.

In the first position correcting operation, when the semiconductor strip S sucked by the alignment table 111 of the plate 110 of the loading unit 100 is not positioned at a fixed position, the loading unit 100 corrects the Y-axis and θ direction, and the strip picker 300 is corrected. This means the operation of performing position correction in the X-axis direction in the loading unit 100 . Therefore, the first position correction operation is performed in the loading unit 100 without using the interlock pin 370 of the strip picker 300 , and then mechanically using the interlock pin 370 of the strip picker 300 on the chuck table 210 . Accuracy can be ensured, so it can be lowered and placed in an accurate position.

More specifically, when the semiconductor strip S is supplied from the on-loader to the alignment table 111 of the plate 110 of the loading unit 100 , the strip vision provided on one side of the strip picker 300 detects the semiconductor strip S on the alignment table 111 . check the alignment of the At this time, the strip vision inspects the fiducial hole provided in the loading block 130 and the fiducial mark formed on the semiconductor strip S or a specific semiconductor package together to detect the X of the semiconductor strip S. Acquire positional deviation information in the axial, Y-axis, and θ directions. Thereafter, the alignment table 111 rotates and moves in the Y-axis direction to correct the position of the semiconductor strip S in the Y-axis and θ directions to a fixed position. Here, the correction of the semiconductor strip S in the X-axis direction can be corrected by moving the strip picker 300 in the X-axis direction, and the correction of the strip picker 300 is performed when the semiconductor strip S is loaded by the loading unit 100. Alternatively, it can be done when the semiconductor strip S is unloaded onto the chuck table 210 . As an example, the first position correction operation corrects the X-axis direction of the strip picker 300 when the semiconductor strip S is loaded by the loading unit 100 .

In order to correct the strip picker 300 in the X-axis direction in the loading unit 100, the pin driving unit 390 operates to raise the interlock pin 370, as shown in FIG.

The strip picker 300 with the interlock pin 370 raised moves along the inlet rail 150 above the loading unit 100 so as to correct the positional error in the X-axis direction, thereby aligning the semiconductor strip S and the strip picker 300 in the X-axis direction. Align.

After the positional errors of the semiconductor strip S in the X-axis, Y-axis and θ directions are aligned, the strip picker 300 descends to the loading unit 100 to pick up the semiconductor strip S as shown in FIG. A strip picker 300 picks up a semiconductor strip S, as shown in FIG.

As described above, the position of the semiconductor strip S is corrected without interference of the interlock pins 370 by lowering the strip picker 300 to the loading unit 100 while the interlock pins 370 of the strip picker 300 are raised.

Specifically, in the conventional semiconductor material cutting device, the interlock pin of the strip picker and the interlock pinhole are fitted (or the pin is inserted into the interlock pinhole) to correct the position of the semiconductor strip. could not be done.

However, in the semiconductor material cutting apparatus 10 according to the preferred embodiment of the present invention, the interlock pin 370 of the strip picker 300 rises when the semiconductor strip S loaded on the loading unit 100 is not positioned at a fixed position. By lowering the semiconductor strip S and the strip picker 300 in the X-axis direction, the semiconductor strip S and the strip picker 300 are aligned in the X-axis direction and then lowered to the loading unit 100 in this state. You can prevent it from being broken. Therefore, unlike the conventional semiconductor material cutting apparatus, the position of the semiconductor strip S can be easily corrected.

After the strip picker 300 sucks and picks up the semiconductor strip S, the strip picker 300 moves in the X-axis direction to transfer the semiconductor strip S to the chuck table 210 of the cutting unit 200 .

In this case, since the loading unit 100 has corrected the semiconductor strip S in the X-axis, Y-axis and θ directions, the semiconductor strip S picked up by the strip picker 300 is in a fixed position.

Therefore, when the strip picker 300 unloads the semiconductor strip S onto the chuck table 210, the interlock pin 370 is inserted into the second interlock pin hole 211 of the chuck table 210, as shown in FIGS. While the interlock pin 370 is lowered by the pin driving unit 390 , the strip picker 300 descends toward the chuck table 210 to transfer the semiconductor strip S attracted by the strip picker 300 to the chuck table 210 .

Thus, when the position of the semiconductor strip S sucked by the strip picker 300 in the X-axis direction is the fixed position, the semiconductor strip S is transferred to the chuck table 210 while the interlock pin 370 is lowered. The pins 370 and the second interlocking pinholes 211 allow the strip picker 300 and the chuck table 210 to be aligned so that the semiconductor strip S can be unloaded. Therefore, the semiconductor strip S can be transferred from the strip picker 300 to the chuck table 210 while the positions of the semiconductor strip S in the X-axis, Y-axis and .theta. directions are all fixed.

In addition, when the strip picker 300 descends to the chuck table 210 while the interlock pin 370 is lowered, the strip picker 300 can be rapidly lowered since there is no need to perform separate position measurement using the strip picker vision. .

In addition, when the strip picker 300 descends to the chuck table 210 while the interlock pin 370 is descending, the interlock pin 370 and the second interlock pin hole 211 are fitted (or the second interlock pin hole 211 is fitted). Since the interlock pin 370 is inserted), the strip picker 300 can be lowered without error even if external environmental factors such as shaking and time delay occur.

The second position correction operation will be described below.

In the second position correcting operation, when the semiconductor strip S set and loaded on the alignment table 111 of the plate 110 of the loading unit 100 is not positioned at a fixed position, the loading unit 100 corrects the Y-axis and θ directions to correct the strip. Correcting the position of the picker 300 in the X-axis direction means an operation performed during the process of transferring the semiconductor strip S sucked by the strip picker 300 to the chuck table 210 . Therefore, in the second position correction operation, the loading unit 100 corrects the Y-axis and θ direction, picks up the semiconductor strip S using the interlock pins 370 of the strip picker 300 , and unloads the semiconductor strip S onto the chuck table 210 . It is to lower and place on the chuck table 210 by correcting without using the interlock pin 370 of the strip picker 300 when placing the strip.

Therefore, even if the strip picker vision of the strip picker 300 confirms that the position of the semiconductor strip S supplied to the loading unit 100 in the X-axis direction is not the normal position, the inlet rail 150 and the loading unit 100 of the loading unit 100 do not move. 3, the strip picker 300 is moved while the interlock pin 370 is lowered by the pin drive unit 390 as shown in FIG. descend.

In this case, as shown in FIG. 4, the interlock pin 370 is inserted into the first interlock pin hole 131 of the loading unit 100, the semiconductor strip S is attracted to the strip picker 300, and as shown in FIG. 300 picks up the semiconductor strip S;

After the strip picker 300 picks up the semiconductor strip S, the strip picker 300 moves in the X-axis direction to transfer the semiconductor strip S to the chuck table 210 of the cutting unit 200 .

After moving to the chuck table 210, the strip picker 300 descends toward the chuck table 210 to unload the semiconductor strips S thereon. In this case, the interlock pin 370 reflects the positional correction amount of the semiconductor strip S in the X-axis direction after the strip picker 300 descends toward the chuck table 210 in the elevated state as shown in FIGS. This allows correction without interference of the interlock pin 370 as the strip picker 300 is lowered.

On the other hand, if there is a misalignment after inspecting the alignment state of the semiconductor strip S with the vision of the cutting part when cutting the semiconductor strip S, or if additional position correction is required, the semiconductor placed on the chuck table 210 is Strip S can be reloaded.

After the strip picker 300 unloads the semiconductor strip S on the chuck table 210, the semiconductor strip S is picked up again, the positions of the semiconductor strip S and the strip picker 300 are aligned, and the semiconductor strip S is unloaded again. is called a reloading operation of the semiconductor strip S.

At this time, as shown in FIG. 12, the strip picker 300 descends to the chuck table 210 while the interlock pin 370 of the strip picker 300 is lifted by the pin driving unit 390 to suck the semiconductor strip S. can also pick up the semiconductor strip S, and the strip picker 300 descends to the chuck table 210 while the interlock pin 370 of the strip picker 300 is lowered by the pin drive unit 390 to suck the semiconductor strip S, and then the strip picker 300 can pick up the semiconductor strip S;

When picking up the semiconductor strip S sucked by the chuck table 210, it is possible to pick up the semiconductor strip S with the interlock pin 370 raised or lowered. The position of the semiconductor strip S can be corrected by lowering the strip picker 300 onto the chuck table 210 while the lock pin 370 is raised. Correction of the position of the semiconductor strip S in the X-axis direction is performed by the strip picker 300, and correction of the semiconductor strip S in the Y-axis and θ directions is performed by the chuck table 210, so that reloading and correction on the chuck table 210 are possible. .

Therefore, the semiconductor strip S can be transferred from the strip picker 300 to the chuck table 210 while the positions of the semiconductor strip S in the X-axis, Y-axis and .theta. directions are all fixed.

Such reloading can be performed when the semiconductor strip S transferred to the chuck table 210 is not positioned at a predetermined position, as well as the second position correction operation described above.

In other words, as in the first position correcting operation, when the semiconductor strip S is picked up from the loading unit 100, even if the position of the semiconductor strip S is corrected, the semiconductor strip S transferred to the chuck table 210 remains at the fixed position. If not, the reload operation described above could be performed.

The third position correction operation will be described below.

The third position correction operation is performed when the loading unit 100 can be corrected in the X-axis, Y-axis and θ directions in the semiconductor material cutting apparatus 10 having a driving unit for moving the loading unit 100 in the X-axis direction. be. That is, it means the operation when the semiconductor strip S set and loaded on the alignment table 111 of the plate 110 of the loading unit 100 is at a fixed position in the X-axis, Y-axis and θ directions. This means that the supplied semiconductor strip S is inspected by the strip vision, and the correction of the positional deviation in the loading unit 100 is completed. It can also mean the case where

When the semiconductor strip S is supplied from the loading unit 100 to the alignment table 111 of the plate 110, the semiconductor strip S on the alignment table 111 and the fiducial hole of the loading block 130 are inspected together by strip vision. After confirming the state of alignment in the Y-axis and θ direction, the loading unit 100 adjusts the X-axis, Y-axis and θ-direction of the semiconductor strip S by correcting the X-axis, Y-axis and θ-direction of the alignment table based on the inspection results. position is corrected to the fixed position.

After that, the strip picker 300 is lowered while the interlock pin 370 of the strip picker 300 is lowered by the pin driving unit 390 .

In this case, as shown in FIG. 4, the interlock pin 370 is inserted into the first interlock pin hole 131 of the loading unit 100, the semiconductor strip S is attracted to the strip picker 300, and as shown in FIG. 300 is raised to pick up the semiconductor strip S. FIG.

Therefore, the semiconductor strip S is sucked by the strip picker 300 in a state where the X-axis, Y-axis, and θ directions are all fixed, and the strip picker 300 descends to the loading unit 100 while the interlock pin 370 descends. In this case, the interlock pin 370 of the strip picker 300 and the first interlock pin hole 131 are fitted (or the state in which the interlock pin 370 is inserted into the first interlock pin hole 131). Even if external environmental factors such as time delay change, the strip picker 300 can be lowered without error.

After the strip picker 300 sucks and picks up the semiconductor strip S, the strip picker 300 moves in the X-axis direction to transfer the semiconductor strip S to the chuck table 210 of the cutting unit 200 .

In this case, as described above, since the semiconductor strip S sucked by the strip picker 300 is in a fixed position, when the strip picker 300 transfers the semiconductor strip S to the chuck table 210, as shown in FIGS. 9 and 10. , the interlock pin 370 is lowered by the pin driving unit 390 so that the interlock pin 370 is inserted into the second interlock pin hole 211 of the chuck table 210, and the strip picker 300 is lowered toward the chuck table 210, The semiconductor strip S sucked by the strip picker 300 is transferred to the chuck table 210 .

Thus, when the semiconductor strip S sucked by the strip picker 300 is in a fixed position, the interlock pin 370 and the second interlock pin 370 are transferred to the chuck table 210 while the interlock pin 370 is lowered. The locking pinhole 211 allows the positions of the strip picker 300 and the chuck table 210 to be aligned so that the semiconductor strip S can be unloaded. Therefore, the semiconductor strip S can be transferred from the strip picker 300 to the chuck table 210 while the positions of the semiconductor strip S in the X-axis, Y-axis, and θ directions are all fixed.

In the above-described embodiment, the Y-axis and θ direction correction in the loading unit 100 or the X-axis, Y-axis and θ direction correction in the loading unit 100 were described. As a result, if there is no positional deviation in a specific axis, only the axis requiring correction can be corrected.

For example, if the semiconductor strip S is misaligned only in the Y-axis or .theta. direction, the loading unit 100 can correct only the Y-axis or .theta. direction. This means that 1-axis, 2-axis, or 3-axis correction can be performed according to the state of positional deviation of the semiconductor strip S. FIG.

As described above, the semiconductor material cutting apparatus 10 according to the preferred embodiment of the present invention corrects the positional deviation of the semiconductor strip S by the first to third position correction operations, unlike the conventional semiconductor material cutting apparatus. By automatically determining the elevation of the interlock pin 370 according to the state and whether the correction of the positional deviation is to be performed on the loading unit 100 or on the chuck table 210, mechanical accuracy can be ensured. It is possible to correct the position of the semiconductor strip S and respond to changes in external environmental factors, and to simultaneously achieve rapid pick-up and unloading of the semiconductor strip S.

While the invention has been described above with reference to preferred embodiments thereof, those of ordinary skill in the art may depart from the spirit and scope of the invention as defined in the following claims. Instead, the present invention can be modified or modified in various ways.

REFERENCE SIGNS LIST 10 semiconductor material cutting device 100 loading section 110 plate 111 alignment table 130 loading block 131 first interlock pinhole 150 inlet rail 200 cutting section 210 chuck table 211 second interlock pinhole 230 blade 300 strip picker 310 picker body 330 picker Head 350 Fastening Part 370 Interlock Pin 390 Pin Driving Part 400 Unit Picker 500 Cleaning Part 600 Drying Part 700 Inspection Part 710 Turntable 721 First Vision Unit 722 Second Vision Unit 731 First Sort Picker 732 Second Sort Picker 800 Sorting Part 810 first carry-out tray 830 second carry-out tray 850 tray picker 870 third vision unit 910 first guide frame 920 second guide frame 930 third guide frame 940 fourth guide frame S semiconductor strip P semiconductor package

Claims (9)

An aligning table on which the semiconductor strips supplied from the on-loader are sucked and which is movable in the Y-axis direction and rotatable in the θ direction on the XY plane; and a loading block provided with one or more first interlock pinholes on the top thereof;
In order to cut the semiconductor strip transferred from the loading unit into individual semiconductor packages, the semiconductor strip is sucked and provided with one or more second interlock pinholes on the top thereof, and is movable in the Y-axis direction; a chuck table rotatable in the θ direction on the XY plane;
It is installed between the loading part and the chuck table so as to be movable in the X-axis direction, absorbs the semiconductor strips supplied to the loading part, transfers the semiconductor strips to the chuck table, and inspects the alignment of the semiconductor strips. The interlock pin is inserted into the first interlock pinhole or the second interlock pinhole when the position correction of the semiconductor strip is unnecessary or the position correction is completed. and a strip picker provided with a lock pin that can move up and down. Based on the alignment state inspection result of the strip vision,
The loading unit moves in the Y-axis direction and rotates in the θ direction to correct positional errors of the semiconductor strips in the Y-axis and θ directions, and lifts the strip picker while the interlock pin of the strip picker is raised. After moving in the X-axis direction to correct the positional error of the semiconductor strip in the X-axis direction, the strip picker picks up the semiconductor strip on the alignment table;
2. The semiconductor strip sucked by the strip picker is transferred to the chuck table while the interlock pin of the strip picker is lowered and inserted into the second interlock pin hole. 3. The semiconductor material cutting device according to . Based on the alignment state inspection result of the strip vision,
The loading unit moves in the Y-axis direction and rotates in the θ direction to correct the positional errors of the semiconductor strips in the Y-axis and θ directions, and the interlock pin of the strip picker descends to move the first interlock pin. The strip picker sucks the semiconductor strip on the alignment table while being inserted into the hole,
With the interlock pin of the strip picker raised, the strip picker is moved in the X-axis direction to correct the positional error of the semiconductor strip in the X-axis direction, and then the semiconductor strip is transferred to the chuck table. 2. The apparatus for cutting semiconductor materials according to claim 1, wherein: further comprising a driving unit for moving the loading unit in the X-axis direction;
Based on the alignment state inspection result of the strip vision,
The loading unit moves in the X-axis and Y-axis directions and rotates in the θ direction to correct the positional errors of the semiconductor strips in the X-axis, Y-axis and θ directions, and the interlock pins of the strip picker descend. the strip picker sucks the semiconductor strip on the alignment table while being inserted into the first interlock pinhole by
2. The semiconductor strip sucked by the strip picker is transferred to the chuck table while the interlock pin of the strip picker is lowered and inserted into the second interlock pin hole. 3. The semiconductor material cutting device according to . a cutting unit for cutting the semiconductor strips chucked on the chuck table; and a cutting unit vision for inspecting alignment of the semiconductor strips chucked on the chuck table,
2. The semiconductor of claim 1, wherein the cutting unit vision inspects whether a cutting line of the semiconductor strip sucked by the chuck table is positioned within an error range of a blade escape groove of the chuck table. Material cutting device. The semiconductor strip transferred to the chuck table is inspected by the cutting part vision, and if the alignment state of the semiconductor strip is deviated based on the inspection result of the cutting part vision, the interlock pin of the strip picker is raised. the strip picker sucks the semiconductor strip on the chuck table in the state of
The chuck table moves in the Y-axis direction and rotates in the .theta. direction to correct the positional errors of the semiconductor strips in the Y-axis and .theta. 6. The semiconductor strip sucked by the strip picker is transferred to the chuck table again in a state where the interlock pin of the strip picker is raised after correcting the positional error of the direction. Apparatus for cutting semiconductor material as described. The semiconductor strip transferred to the chuck table is inspected by the cutting section vision, and if the alignment state of the semiconductor strip is deviated based on the inspection result of the cutting section vision, the interlock pin of the strip picker is lowered. the strip picker sucks the semiconductor strip on the chuck table in the state of
The chuck table moves in the Y-axis direction and rotates in the θ direction to correct the positional errors of the semiconductor strips in the Y-axis and θ directions, and the strip picker moves in the X-axis direction to move the semiconductor strips in the X-axis direction. 6. The semiconductor strip sucked by the strip picker is transferred again to the chuck table after correcting the positional error of the strip picker while the interlock pin of the strip picker is raised. semiconductor material cutting equipment. a plurality of fiducial holes are provided on the top of the loading block;
2. The semiconductor material of claim 1, wherein the strip vision inspects the fiducial hole and the semiconductor strip together to check alignment of the semiconductor strip sucked on the alignment table. cutting device. The loading unit further includes a pair of inlet rails movably provided in the Y-axis direction to guide the semiconductor strips supplied from the on-loader unit and vary according to the width of the semiconductor strips. 2. The apparatus for cutting semiconductor material according to claim 1, wherein

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