TW201926531A - Sawing apparatus of semiconductor materials improving the accuracy by automatically determining whether to correct the positional error of the semiconductor strip by moving up or down the interlock pin - Google Patents

Abstract

The present invention relates to a semiconductor material sawing apparatus for sawing a semiconductor strip into individual semiconductor packages, and, more particularly, to a semiconductor material sawing apparatus that improves the accuracy by automatically determining, when needed, whether to correct a positional error of the semiconductor strip by moving up or down an interlock pin when a semiconductor strip is picked up from a loading portion by a strip picker or unloaded to a suction table by the strip picker.

Description

Semiconductor material cutting device

The present invention relates to a semiconductor material cutting apparatus for cutting semiconductor strips into individual semiconductor packages.

A semiconductor material cutting device is a device that cuts a completed semiconductor strip into individual semiconductor packages.

In addition to the simple function of cutting a semiconductor strip, the semiconductor material cutting device provides a series of processes for inspecting the upper surface and the lower surface of the cut semiconductor package after performing the cutting, cleaning and drying processes on the semiconductor strip. The surface is sorted and a defective semiconductor package is produced.

As a patent of the semiconductor material cutting device as described above, the content described in the prior art of the Korean Patent No. 10-1303103 (hereinafter referred to as "prior art 1") is known.

The semiconductor material cutting device of the prior art 1 comprises: a loader providing a semiconductor strip; a strip picker and a unit picker, moving along the X axis to unload the semiconductor strip to the chuck table or picking up the semiconductor packages from the chuck table; a chucking table that moves or rotates in a horizontal direction by adsorbing a semiconductor strip in a state in which a semiconductor strip is placed; a sawing device cuts a semiconductor strip transferred by a chuck table into individual packages; and a cleaning device removes Foreign matter generated during cutting; a drying device that dries the semiconductor packages that have been cleaned; a classifier that visually inspects individual semiconductor packages and deposits them onto the tray according to a predetermined quality standard.

In the semiconductor material cutting apparatus having the configuration as described above, when the semiconductor strip supplied from the loader is loaded onto the lead-in track, the strip pickup which is in standby at the pick-up position picks up the semiconductor strip and moves to be unloaded to The chuck table, thereby transferring the semiconductor strip of the loader to the chuck table.

The strip picker is provided with an interlocking pin so that the strip pickup can pick up the semiconductor strip at a fixed position like the above, and the chuck table is provided with a pin insertion hole into which the interlocking pin is inserted. Therefore, when the strip pickup picks up the semiconductor strip, the interlock pin is inserted into the pin insertion hole, whereby the strip picker and the chuck table are always combined at a fixed position, so that the strip pickup can be easily adsorbed The semiconductor strip is placed on the chuck table.

However, the interlock pin and the pin insertion hole of the prior art 1 as described above can only align with the position of the strip picker and the chuck table, and cannot align the position of the semiconductor strip between the strip picker and the chuck table. .

Therefore, in the case where an error occurs in the position of the semiconductor strip, the interlock pin and the pin insertion hole are always loaded or unloaded at a fixed position, so that even if the semiconductor strip is aligned at the loading portion, it is picked up by the mating strip. The interlocking pin of the device and the pin insertion hole of the chuck table convey the semiconductor strip, and thus the problem of being transmitted to the chuck table only in a state where the positional error of the semiconductor strip is not corrected.

In addition, when the position of the semiconductor strip conveyed to the chuck table is skewed, the strips on the chuck table should be picked up by the strip picker to correct the position and then reloaded, but there is also a mutual pickup due to the strip pickers. The pin and the pin of the suction cup are inserted into the hole and the position cannot be corrected.

As described above, if a positional error is generated in the semiconductor strip to the chuck table, the defect rate of the semiconductor package may be increased or the chuck table or the dicing blade may be damaged when the dicing process using the dicing apparatus is performed.

On the other hand, it has been developed to pick up or unload a semiconductor strip by a strip pickup or the like after confirming the positional state of the semiconductor strip, that is, the position in the X-axis direction, the Y-axis direction, and the θ direction by the visual sensor. As a patent of this technology, the content described in Korean Patent No. 10-1275697 (hereinafter referred to as "Prior Art 2") is known.

However, in the prior art 2, since the pin and the pin insertion hole are not used, when the semiconductor strip is unloaded from the strip pickup after the position correction is completed, it is impossible to cope with external environmental changes such as vibration inside and outside of the apparatus and changes with time. Therefore, there is a problem that the strip pickup irregularly loads or unloads the semiconductor strip in the case where the external environment is intensified.

[Prior Art Literature]

[Patent Literature]

(Patent Document 1) Korean Registered Patent No. 10-1303103

(Patent Document 2) Korean Registered Patent No. 10-1275697

[Question to be solved by the invention]

The present invention has been made to solve the above problems, and an object thereof is to provide a method of selecting a semiconductor strip by a strip picker or unloading a semiconductor strip to a chuck table by a strip picker, if necessary. The semiconductor material cutting device is improved in that the interlocking pin is lifted and lowered, thereby correcting the positional error of the semiconductor strip and improving the accuracy.

[Means for solving the problem]

According to a feature of the invention, a semiconductor material cutting apparatus is characterized by comprising: a loading portion comprising an alignment stage and a loading block, the alignment stage adsorbing a semiconductor strip supplied by the loader portion, movable in the Y-axis direction Rotating in the θ direction, the loading blocks are respectively provided to the front and rear direction of the semiconductor strips adsorbed on the alignment stage and at the upper portion are provided with more than one first interlocking pin holes; The semiconductor strip conveyed by the loading portion is cut into individual semiconductor packages to adsorb the semiconductor strip, and at the upper portion is provided with more than one second interlocking pin hole, which is movable in the Y-axis direction and can be rotated in the θ direction; and strip picking Provided to be movable in the X-axis direction between the loading portion and the chuck table, adsorbing the semiconductor strip supplied to the loading portion and transferring it to the chuck table, and being provided on one side for A strip vision device that inspects the alignment of the semiconductor strips is provided with an interlocking pin in a liftable manner to insert the interlocking pins into the first or second interlocking pin holes as needed.

Further, the semiconductor material cutting device is characterized in that the loading portion is corrected in the Y-axis and the θ direction, and the X-axis direction of the strip pickup is corrected in a state where the interlock pin of the strip pickup is raised Thereafter, the strip picker adsorbs the semiconductor strip on the alignment stage, and is adsorbed in a state in which the interlocking pin of the strip picker is lowered and inserted into the second interlocking pin hole. A semiconductor strip of the strip picker is delivered to the chuck table.

Further, the semiconductor material cutting device is characterized in that the loading portion is corrected in the Y-axis and the θ direction, and in a state where the interlocking pin of the strip pickup is lowered and inserted into the first interlocking pin hole, The strip picker adsorbs the semiconductor strip on the alignment stage, and after the interlock pin of the strip picker is in an up state, the X-axis direction of the strip picker is corrected, and the strip is adsorbed A semiconductor strip of the strip picker is transferred to the chuck table.

Further, the semiconductor material cutting device further includes a driving portion that moves the loading portion in the X-axis direction, the loading portion being corrected in the X-axis, the Y-axis, and the θ direction to align the semiconductor strip, The strip pickup picks up the semiconductor strip on the alignment stage in a state in which the interlock pin of the strip pickup is lowered to be inserted into the first interlocking pin hole, at the strip pickup The semiconductor strip adsorbed to the strip pickup is transferred to the chuck table in a state where the interlock pin is lowered and inserted into the second interlocking pin hole.

Further, the semiconductor material cutting device is characterized by further comprising: a cutting portion for cutting a semiconductor strip adsorbed on the chuck table; and a cutting portion vision device for inspecting a pair of semiconductor strips adsorbed on the chuck table a quasi-state; the cutting portion vision device checks whether a cutting line of a semiconductor strip adsorbed on the chuck table is within an error range of a blade avoiding groove formed in the chuck table.

Further, the semiconductor material cutting device is characterized in that the semiconductor strip conveyed to the chuck table is inspected by the cutting portion vision device, and the strip picking is performed in a case where the alignment state of the semiconductor strip is skewed The semiconductor strip on the chuck table is adsorbed while the interlock pin of the strip pickup is in a state of being lifted, the correction is performed in the Y-axis and the θ direction, and the strip pickup is corrected in the X-axis direction. Thereafter, the semiconductor strip adsorbed to the strip pickup is again transferred to the chuck table with the interlocking pin of the strip pickup being in an ascending state.

Further, the semiconductor material cutting device is characterized in that the semiconductor strip conveyed to the chuck table is inspected by the cutting portion vision device, and the strip picking is performed in a case where the alignment state of the semiconductor strip is skewed The semiconductor strip on the chuck table is adsorbed while the interlock pin of the strip pickup is in a state of being lowered, the correction is performed in the Y-axis and the θ direction, and the strip pickup is corrected in the X-axis direction. Thereafter, the semiconductor strip adsorbed to the strip pickup is again transferred to the chuck table while the interlock pin of the strip pickup is in the raised state.

Further, the semiconductor material cutting device is characterized in that a plurality of reference holes are provided on one side of the loading block, and the reference hole and the semiconductor strip are collectively inspected by the strip vision device to confirm adsorption The aligned state of the semiconductor strips of the alignment stage.

Further, the semiconductor material cutting device is characterized in that the loading portion further includes a pair of lead-in rails for guiding the semiconductor strip supplied by the loader portion so as to be along the Y-axis direction in accordance with the change in the width of the semiconductor strip mobile.

[Effect of the invention]

The semiconductor material cutting device of the present invention as described above has the following effects.

Correcting the skew of the semiconductor strip in the Y-axis and the θ direction at the loading portion, and correcting the X-axis of the semiconductor strip by the strip picker, and when the X-axis position needs to be corrected, the interlock pin of the strip picker is in a rising state Next, the strip pickup is lowered toward the loading portion or the chuck table, whereby the positional error of the semiconductor strip can be corrected by aligning the positional error of the semiconductor strip in the X-axis direction.

Further, in a state where the positional correction of the semiconductor strip is completed, the strip pickup is lowered toward the loading portion or the chuck table with the interlocking pin being lowered, whereby the semiconductor strip is bonded by the interlocking pin and the hole. When the X-axis position is in a fixed position, it is picked up by the strip picker or placed on the chuck table, so that it can be accurately corrected by positional errors without being affected by internal or external vibration of the device or external factors such as time. Uninstall.

According to the present invention, problems such as position correction and reloading of the semiconductor strip cannot be solved by the provision of the interlocking pin and the interlocking pin hole, and the interlocking pin is provided in an up-down manner, thereby performing When the position is corrected or reloaded, the interlocking pin can be raised and corrected, and the mechanism precision can be ensured by the interlocking pin and the interlocking pin hole without correction.

Therefore, according to the present invention, accurate loading and unloading can be realized without being affected by the surrounding environment, and the existing interlocking pin can overcome the vibration and the change with time inside and outside the device, and the position of the material cannot be corrected. problem.

The following merely illustrates the principles of the invention. Therefore, the invention may be practiced otherwise, and the invention may be embodied within the scope and scope of the invention. In addition, it should be understood that all of the conditional terms and embodiments recited in the specification are merely used to understand the concept of the invention, and are not limited to the specific examples and states.

The above objects, features, and advantages will be apparent from the following detailed description of the drawings.

The embodiments described in the present invention will be described with reference to cross-sectional views and/or perspective views which are preferred illustrations of the present invention. Therefore, the embodiments of the present invention are not limited to the specific embodiments shown, but also include morphological changes that occur depending on the process.

Before describing, define the following items.

The X axis refers to a direction in which the strip pickup 300 and the unit pickup 400 move horizontally, and the Y axis refers to an axis which is perpendicular to the X axis in a horizontal plane.

The θ direction refers to a direction that is inclined clockwise or counterclockwise on the X-Y plane.

The front direction refers to the direction in which the semiconductor strip S is taken out from the loader portion on the X axis, and the rear direction refers to the opposite direction in the front direction.

Hereinafter, a semiconductor material cutting device 10 according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

1 is a plan view of a semiconductor strip supplied to a semiconductor material cutting device, FIG. 2 is a plan view of the semiconductor material cutting device, and FIGS. 3(a) to 3(c) are interlocking pins of the strip picker of FIG. FIG. 4(a) to FIG. 4(c) are diagrams showing a state in which the semiconductor strip is placed on the loading portion, and FIGS. 4(a) to 4(c) are diagrams showing the strip pickup being lowered toward the loading portion in the state of FIGS. 3(a) to 3(c). FIG. 5(a) to FIG. 5(c) show the state in which the strip pickup device is lifted to pick up the semiconductor strip in the state of FIGS. 4(a) to 4(c). 6(a) to 6(c) are diagrams showing a state in which the interlocking pin of the tape pickup of FIG. 2 is raised and the semiconductor strip is placed on the loading portion, and FIGS. 7(a) to 7(() (c) is a view showing a state in which the strip pickup is lowered toward the loading portion and the semiconductor strip is sucked in the state of Figs. 6(a) to 6(c), and Figs. 8(a) to 8(c) are diagrams. FIG. 7(a) to FIG. 7(c) are diagrams showing a state in which the strip pickup is lifted to pick up a semiconductor strip, and FIGS. 9(a) to 9(c) are diagrams showing the strip in FIG. FIG. 10(a) to FIG. 10(c) are diagrams shown in FIGS. 9(a) to 9(c), in a state in which the interlocking pin with the pickup is in a lowered state and the strip pickup is lowered toward the chuck table. FIG. 11(a) to FIG. 11(c) are diagrams showing a state in which the strip pickup is raised to place the semiconductor strip to the chuck table, and FIGS. 11(a) to 11(c) are diagrams showing the interlocking pin of the strip pickup of FIG. FIG. 12(a) to FIG. 12(c) are diagrams showing the strip pickup device descending toward the chuck table to adsorb the semiconductor strip in the state of FIGS. 11(a) to 11(c). A diagram of the state of the belt.

In this case, FIGS. 3(a) to 8(a) are perspective views of the strip pickup and the loading portion, and FIGS. 3(b) to 8(b) are side views of the loading portion of the strip pickup, 3(c) to 8(c) are rear views of the strip pickup and the loading portion. 9(a) to 12(a) are perspective views of the strip picker and the chuck table, and FIGS. 9(b) to 12(b) are side views of the strip picker and the chuck table, FIG. 9 ( c) to Fig. 12(c) is a rear view of the strip picker and the chuck table.

First, the semiconductor strip S supplied to the semiconductor material cutting device 10 of the preferred embodiment of the present invention will be described.

As shown in FIG. 1, the semiconductor strip S means that a plurality of semiconductor packages P are connected in a strip form. Therefore, if it is cut by the blade 230 of the cutting portion 200 to be described later, it is individualized into a plurality of semiconductor packages P.

Hereinafter, a semiconductor material cutting device 10 of a preferred embodiment of the present invention will be described.

As shown in FIGS. 2 and 3(a) to 3(c), the semiconductor material cutting apparatus 10 of the preferred embodiment of the present invention includes a loader portion for introducing the semiconductor strip S into the magazine. The state is supplied thereto; the loading portion 100 includes an alignment table 111 and a loading block 130, and the alignment table adsorbs the semiconductor strip S supplied by the loader portion, is movable in the Y-axis direction, and is rotatable in the θ direction. The loading blocks are respectively provided to the front and rear direction of the semiconductor strips adsorbed on the alignment stage and one or more first interlocking pin holes 131 are provided in the upper portion; the chuck table 210 for the semiconductor strips to be transferred from the loading portion 100 The strip S is cut into individual semiconductor packages P to adsorb the semiconductor strip S, and one or more second interlocking pin holes 211 are provided in the upper portion, movable in the Y-axis direction, and rotatable in the θ direction; and the strip pickup 300 Provided to be movable between the loading portion 100 and the cutting portion 200 in the X-axis direction, the semiconductor strip S supplied to the loading portion 100 is adsorbed and transferred to the cutting portion 200, and is provided on one side for inspecting the semiconductor strip Strip vision visor of S alignment state (not shown) The interlocking pin 370 is provided in a liftable manner so that the interlocking pin 370 can be inserted into the first interlocking pin hole 131 of the loading portion 100 or the second interlocking pin hole 211 of the chuck table 210 of the cutting portion 200 as needed. The cleaning unit 500 removes the foreign matter of the semiconductor package P which is cut by the cutting unit 200, the drying unit 600, and the semiconductor package P cleaned by the cleaning unit 500, and the unit pickup 400 so as to be in the cutting unit 200 and the drying unit 600. The semiconductor package P cut by the cutting unit 200 is transported to the drying unit 600 by the cleaning unit 500; the inspection unit 700 checks the semiconductor package P dried in the drying unit 600; and the classification unit 800 The semiconductor package P is sorted and shipped based on the inspection performed by the inspection unit 700 on the semiconductor package P.

The loader portion functions to supply the semiconductor strip S thereto in a state of being introduced into the magazine, by the pusher provided in the loader portion or the grip provided on one side of the strip picker 300 The semiconductor strip or the like supplies the semiconductor strip S to the loading portion 100.

When the semiconductor strip S is supplied from the loader portion, the loading portion 100 places the semiconductor strip onto the alignment stage 111 by guiding a pair of lead-in rails 150 of the semiconductor strip S supplied from the loader portion. At this time, the introduction rail 150 is provided in such a manner as to be movable in the Y-axis direction so that the width can be adjusted according to the kind or size of the semiconductor strip S. The alignment stage 111 can adsorb the semiconductor strip S, can move in the Y-axis direction of the semiconductor strip S, and can rotate in the θ direction, thereby exhibiting a function of correcting the Y-axis direction and the θ direction of the semiconductor strip.

As shown in FIGS. 3(a) to 3(c) and 8(a) to 8(c), the loading portion 100 includes: a board 110 equipped with an alignment stage 111 on which the semiconductor strip S is mounted; and a loading block 130, one or more first interlocking pin holes 131 are provided in the upper direction and the rear direction of the semiconductor strip S on the board 110, respectively.

A first interlocking pin hole 131 is provided on the upper surface side of the loading block 130, and a plurality of reference holes or reference marks are provided on the other upper surface side. The reference hole and the semiconductor strip S can be inspected together by a strip vision device provided on one side of the strip picker 300, whereby the reference hole of the loading block 130 can confirm the semiconductor strip S adsorbed on the alignment stage 111. Alignment status. At this time, it is preferable to provide a plurality of reference holes so that the alignment holes which are easy to inspect can be selected in accordance with the position of the reference mark formed on the semiconductor strip S to confirm the alignment state.

A loading block 130 and an introduction rail 150 are disposed on the board 110, and an alignment stage 111 is disposed, and the alignment stage mounts the semiconductor strip S to be movable in the Y-axis direction and the θ direction. Therefore, the board 110 adsorbs the semiconductor strip S by the alignment stage 111.

The loading blocks 130 are respectively disposed to the front and the rear of the semiconductor strip S, and function to have a reference mark formed on the upper side for checking the alignment state of the semiconductor strip S, and another formed on the upper portion. The first interlocking pin hole 131 of the interlock pin 370 of the side insertion strip pickup 300 performs alignment inspection of the semiconductor strip S, and supplies the semiconductor strip S to a fixed position of the strip pickup 300.

Preferably, more than one first interlocking pin hole 131 of the interlocking pin 370 inserted into the strip picker 300 is formed in the upper portion of the loading block 130, and is inserted into the first interlocking pin in a state where the interlocking pin 370 is lowered. The hole 131 can thereby be fixed in such a manner that the semiconductor strip S can be picked up to the fixed position of the strip pickup 300, and the strip pickup 300 can correct the X of the semiconductor strip S in a state where the interlock pin 370 is raised. Axis position.

The first interlocking pin hole 131 functions to provide an interlocking pin inserted into the strip picker 300 when the strip picker 300 is lowered toward the loading portion 100 in order to pick up the semiconductor strip S placed on the loading portion 100. The space of 370 is thereby aligned with the position of the strip picker 300 and the loading portion 100.

In this case, a plurality of first interlocking pin holes 131 may be formed in the upper portion of the loading block 130 in order to insert the interlocking pin according to the size of the replaced pickup head 330 when replacing the pickup head 330 described below. 370.

Preferably, the interlocking pin 370 and the first interlocking pin hole 131 or the second interlocking pin hole 211 are respectively provided for the semiconductor strips S to be stably picked up, and are respectively provided to the upper side and the lower side with respect to the semiconductor strip S.

The introduction rail 150 is provided to the board 110 so as to be movable in the Y-axis direction on both sides of the semiconductor strip S so as to be guided regardless of the kind and size of the semiconductor strip S.

Therefore, when the semiconductor strip S is supplied by the loader portion, the lead-in track 150 is moved in the Y-axis direction on the side of the semiconductor strip S, thereby guiding the semiconductor strip S on the alignment stage 111, The semiconductor strip S can thus be mounted to the alignment stage 111 of the board 110.

Further, the alignment stage 111 of the loading unit 100 is configured to be movable in the Y-axis direction and rotatable in the θ direction. Therefore, when the position of the semiconductor strip S in the Y-axis direction or the θ direction is not at a fixed position, the mounting portion 100 is corrected in the Y-axis direction and rotated in the θ direction, whereby the Y-axis direction of the semiconductor strip S can be obtained. The position and the position in the θ direction are corrected to a fixed position.

As described above, the Y-axis direction and the θ-direction position of the semiconductor strip S placed on the loading unit 100 can be corrected by the movement and rotation of the alignment table 111 of the loading unit 100 along the Y-axis. This position correction can be controlled by Implemented by a part (not shown). In other words, the drive unit that drives the lead-in rail 150 and the drive unit that rotates the mount unit 100 can be driven by the electric signal of the control unit.

In addition to this, a drive unit that moves the loading unit 100 in the X-axis direction is provided, so that the mounting unit 100 can correct both the X-axis direction, the Y-axis direction, and the θ direction of the semiconductor strip S. In this case, since the X-axis direction, the Y-axis direction, and the θ direction of the semiconductor strip S are corrected in the loading unit 100, the interlock pin 370 of the strip picker 300 can be embedded. In the state to the first interlocking pin hole 131 of the loading block 130, the semiconductor strip S adsorbed on the loading portion 100 is firmly picked up by the strip picker 300, and the interlocking pin 370 of the strip picker 300 can be fitted. In alignment with the second interlocking pin hole 211 of the chuck table 210, the aligned semiconductor strips S are stably transferred to the chuck table 210.

The cutting portion 200 functions to cut the semiconductor strip S transferred from the loading portion 100 into individual semiconductor packages. As shown in FIG. 2, the cutting portion includes a chuck table 210 that adsorbs the semiconductor transferred by the strip pickup 300. The strip S; and the blade 230 are cut into semiconductor strips S adsorbed on the chuck table 210 to be individually formed into a semiconductor package P.

The chuck table 210 functions to: place the semiconductor strip S conveyed by the strip pickup unit 300, and move the semiconductor strip S in the Y-axis direction in a lower portion of the blade 230 to rotate in the θ direction for switching directions; The Y-axis direction and the θ direction of the semiconductor strip S placed on the chuck table 210 are corrected.

This chuck table 210 is disposed in such a manner as to be movable along the Y axis and rotatable in the θ direction.

As described above, the chuck table 210 is disposed in such a manner as to be movable along the Y-axis and rotatable in the θ direction, so that the chuck table 210 can be easily moved to the cutting position of the blade 230, whereby the semiconductor strip S can be moved to the blade 230. Cutting at the cutting position.

On the other hand, the cutting portion 200 is provided with a cutting portion vision device (not shown) for inspecting the alignment state of the semiconductor strip S adsorbed on the chuck table 210. The chuck table 210 vacuum-adsorbs the individual semiconductor packages P, respectively, so that the semiconductor strips S to be cut and the individual semiconductor packages P can be prevented from falling off and stably adsorbed. At this time, in order to protect the chuck table 210 from the influence of the blade 230, a blade avoiding groove is formed in the chuck table 210, as long as the cutting line of the semiconductor strip S is within the error range of the blade avoiding groove formed in the chuck table 210. Cutting. Therefore, the cutting portion vision device checks whether the cutting line of the semiconductor strip S is within the error range of the blade avoiding groove formed in the chuck table 210, and in the case of the state of being out of the error range, the strip pickup 300 picks up the semiconductor strip S is reloaded by correcting the X-axis direction of the tape pickup 300, correcting and realigning the semiconductor strip S in the Y-axis direction and the θ direction of the chuck table 210.

For reference, the chuck table 210 can implement position correction by the control unit. In other words, the drive unit that moves the chuck table 210 in the Y-axis direction and the drive unit that rotates the chuck table in the θ direction can be driven by the electric signal of the control unit.

The positional correction of the semiconductor strip S or the semiconductor package P performed by the chuck table 210 as described above will be described in detail later.

As described above, the chuck table 210 is provided with a blade avoiding groove, so that when the blade 230 cuts the semiconductor strip S, the semiconductor strip S can be easily cut without damaging the chuck table 210.

As shown in FIGS. 9 to 12, a second interlocking pin hole 211 into which the interlock pin 370 of the tape pickup 300 is inserted is formed in the chuck table 210.

The second interlocking pin hole 211 functions to provide an insertion strip when the strip pickup 300 descends toward the chuck table 210 in order to unload the semiconductor strip S adsorbed to the strip pickup 300 to the chuck table 210. The space of the interlock pin 370 of the pickup 300 is thereby aligned with the position of the strip picker 300 and the chuck table 210.

The blade 230 functions to cut the semiconductor strip S adsorbed on the chuck table 210 into individual semiconductor packages P.

The tape pickup 300 is provided to be movable in the X-axis direction between the loading unit 100 and the cutting portion, and is configured to transfer the semiconductor strip S to the alignment table 111 of the board 110 stacked on the loading unit 100 to the cutting portion. The function of the suction cup table 210 of 200. Although not shown, a strip vision device for inspecting the alignment state of the semiconductor strip S and a holder for taking out the semiconductor strip S from the magazine may be provided on one side of the strip pickup 300.

In addition, as shown in FIGS. 3 to 12, the strip pickup 300 is provided to the first guide frame 910, the strip pickup 300 including: a pickup main body 310; a pickup head 330, which is replaceably set to a pickup body 310; a fastening portion 350 that couples the pickup body 310 with the pickup head 330; and an interlocking pin 370 that is provided in correspondence with the first interlocking pin hole 131 or the second interlocking pin hole 211 and The lifting and lowering is inserted into the first interlocking pin hole 131 or the second interlocking pin hole 211 at the time of the lowering; the pin driving portion 390 moves the interlocking pin 370 up and down. Therefore, the strip pickup 300 moves along the first guide frame 910, thereby being movable in the X-axis direction, and can be adsorbed to the cutting portion 200 by adsorbing the semiconductor strip S supplied from the loading portion 100.

The pickup head 330 is coupled to the lower portion of the pickup main body 310 by the fastening portion 350, and the adsorption portion that adsorbs the semiconductor strip S is provided at the lower portion of the pickup head 330.

The interlocking pin 370 is provided to the tape pickup 300 in a manner corresponding to the first interlocking pin hole 131 or the second interlocking pin hole 211, and is lifted and lowered by the pin driving portion 390. In this case, the pin driving portion 390 may be a cylinder that is driven by air pressure, hydraulic pressure, or electricity.

When the interlocking pin 370 is lowered by the pin driving portion 390, the interlocking pin 370 protrudes toward the lower portion of the pickup head 330 of the strip pickup 300, and thus the strip pickup 300 faces the loading portion 100 or the chuck table 210. When the direction is lowered, the interlock pin 370 is inserted into the first interlocking pin hole 131 or the second interlocking pin hole 211.

In addition, when the interlocking pin 370 is raised by the pin driving portion 390, the interlocking pin 370 does not protrude toward the lower portion of the pickup head 330 of the strip pickup 300, and thus the strip pickup 300 faces the loading portion 100 or the suction cup When the direction of the stage 210 is lowered, the interlocking pin 370 is not inserted into the first interlocking pin hole 131 or the second interlocking pin hole 211.

This lifting and lowering of the interlocking pin 370 depends on the X-axis positional error of the semiconductor strip S adsorbed on the loading unit 100 or the chuck table 210, and the details thereof will be described later.

The pickup head 330 can be used by replacing the pickup heads 330 of different sizes according to the size and kind of the semiconductor strip S. In this case, the pickup main body 310 and the pickup head 330 to be replaced can be easily joined and disassembled by the fastening portion 350.

Further, the position of the interlocking pin 370 is also changed according to the size of the semiconductor strip S and the size of the pickup head 330. To cope with this, a plurality of first interlocking pin holes 131 are formed in the loading block 130.

The cleaning unit 500 is disposed between the cutting unit 200 and the drying unit 600 and functions to remove foreign matter of the semiconductor package P that is cut by the cutting unit 200.

In this case, the semiconductor package P cut by the cutting portion 200 is cleaned in the cleaning portion 500 in a state of being adsorbed by the unit pickup 400.

In other words, when the unit pickup 400 transfers the semiconductor package P from the cutting portion 200 to the drying portion 600, it passes through the cleaning portion 500, and the cleaning portion 500 cleans the lower surface of the semiconductor package P adsorbed on the unit pickup 400, thereby removing the semiconductor package. P foreign body.

The drying unit 600 functions to dry the semiconductor package P cleaned by the cleaning unit 500.

In this case, the drying unit 600 dries the semiconductor package P transferred from the cutting unit 200 by the unit pickup 400, and transfers the dried semiconductor package P to the rotary stage 710 by movement and rotation along the X-axis.

The unit pickup 400 is provided to be movable between the cutting unit 200 and the drying unit 600 in the X-axis direction, and functions to convey the semiconductor package P cut by the cutting unit 200 to the drying unit 600 via the cleaning unit 500.

Such a unit pickup 400 is disposed to the first guide frame 910, and the unit pickup 400 moves along the first guide frame 910, thereby being movable in the X-axis direction.

The inspection unit 700 functions to inspect the semiconductor package P dried in the drying unit 600. As shown in FIG. 2, the inspection unit includes a rotating table 710 that stacks the semiconductor package P transferred from the drying unit 600 and is movable in the Y-axis direction. a first visual unit 721 that inspects an upper surface of the semiconductor package P stacked on the rotary stage 710 for inspection; a second visual unit 722 that inspects a lower surface of the semiconductor package P for inspection; and a first sort picker 731 and The binary sorter 732 picks up the semiconductor package P stacked on the rotary stage 710 and moves it to the second visual unit 722 or to the sorting section 800.

In this case, the rotary table 710 is movable in the Y-axis direction. In addition, the first sorting pickup 731 is disposed to the fourth guiding frame 940 to move along the fourth guiding frame 940, thereby being movable in the X-axis direction, and the second sorting pickup 732 is disposed to the third guiding frame 930 along the third The guide frame 930 is moved, thereby being movable in the X-axis direction.

Further, the upper surface and the lower surface of the semiconductor package P are collectively imaged by the configuration of the first visual unit 721 and the second visual unit 722, whereby inspection can be performed on both surfaces of the semiconductor package P.

The classification unit 800 functions to classify and transport the semiconductor package P based on the result of performing inspection on the semiconductor package P by the inspection unit 700. As shown in FIG. 2, the classification unit includes a first carry-out tray 810, and stacked. The semiconductor package P that is transported by the first sort picker 731 or the second sort picker 732; the second carry-out tray 830, which is stacked and transported by the first sort picker 731 or the second sort picker 732 is a defective product a semiconductor package P; a tray pickup 850, when the semiconductor package P is all stacked on any one of the first carry-out tray 810 and the second carry-out tray 830, the corresponding tray is shipped, a new tray is supplied; and the third The vision unit 870 is provided in the second carry-out tray 830, and takes a semiconductor package P for inspection.

The tray pickup 850 is disposed on the second guide frame 920. Therefore, the tray pickup 850 moves along the second guide frame 920, thereby being movable in the X-axis direction.

The semiconductor material cutting device 10 of the present invention having the above configuration is known in the "Korean Patent Registration No. 10-1303103 (Prior Art 1)" and "Korean Patent Publication No. 10-2017-0026751". The details of the operation of transporting the classified semiconductor package P after the semiconductor strip S is cut are omitted, and thus detailed description thereof will be omitted.

Hereinafter, the position correcting operation of the semiconductor strip S performed by the semiconductor material cutting device 10 of the present invention having the above configuration will be described.

The positional correction operation of the semiconductor strip S is performed between the loading unit 100 and the strip pickup unit 300, and between the strip pickup unit 300 and the chuck table 210, and the semiconductor strip S can be skewed according to whether the semiconductor strip S is skewed or not. The position of the X-axis position correction is divided into a first position correction operation to a third position correction operation.

Hereinafter, the first position correcting operation will be described.

The first position correcting operation is an operation in which the loading unit 100 performs the correction in the Y-axis direction and the θ direction when the semiconductor strip S of the alignment table 111 of the plate 110 of the loading unit 100 is not at the fixed position. The loading unit 100 corrects the X-axis position of the strip picker 300. Therefore, the first position correcting operation can ensure the accuracy of the mechanism by using the interlocking pin 370 of the strip picker 300 on the chuck table 210 after the loading unit 100 performs the correction without using the interlocking pin 370 of the strip picker 300. This can be unloaded to the ready position.

In more detail, when the semiconductor strip S is supplied from the loader portion to the alignment table 111 of the board 110 of the loading portion 100, the alignment is checked by the strip vision device provided on one side of the strip pickup 300 The alignment state of the semiconductor strip S on the stage 111. At this time, the strip vision device collectively inspects the reference hole provided on the loading block 130 and the reference mark or the specific semiconductor package formed on the semiconductor strip S to obtain the X-axis, the Y-axis, and the θ-axis of the semiconductor strip S. Location skew information. Thereafter, the Y-axis position and the θ-direction position of the semiconductor strip S are corrected to a fixed position by the rotation of the alignment stage 111 and the movement in the Y-axis direction. Here, the X-axis correction of the semiconductor strip S can be performed by moving the strip pickup 300 in the X-axis direction, or when the semiconductor strip S is loaded by the loading unit 100 or the semiconductor strip S is unloaded to the chuck table 210. The correction of the strip picker 300 is performed at the time. The first position correcting operation is an example of performing X-axis correction of the strip picker 300 when the semiconductor strip S is loaded by the loading unit 100.

As shown in FIGS. 6(a) to 6(c), in order to perform the X-axis correction of the tape pickup 300 in the loading unit 100, the pin driving unit 390 operates to raise the interlock pin 370.

The strip pickup 300, in which the interlock pin 370 is raised, moves in the upper portion of the loading portion 100 in a manner of correcting the positional error in the X-axis direction along the first guide introduction rail 150 to align the X of the semiconductor strip S with the strip pickup 300 Axis direction.

After aligning the positional errors of the X-axis, the Y-axis, and the θ-axis direction of the semiconductor strip S, as shown in FIGS. 7(a) to 7(c), the strip pickup 300 is lowered toward the loading portion 100 to adsorb the semiconductor. The strip S, and then as shown in Figs. 8(a) to 8(c), the strip picker 300 picks up the semiconductor strip S.

As described above, the interlocking pin 370 of the tape pickup 300 is lowered toward the loading portion 100, whereby the positional correction of the semiconductor strip S is realized without interference of the interlocking pin 370.

In detail, the conventional semiconductor material cutting apparatus cannot perform picking by correcting the position of the semiconductor strip by bonding the interlocking pin of the strip pickup and the interlocking pin hole (or the pin inserted into the interlocking pin hole).

However, in the semiconductor material cutting device 10 of the preferred embodiment of the present invention, in the case where the semiconductor strip S stacked on the loading portion 100 is not in a fixed position, the interlock pin 370 of the tape pickup 300 is in a rising state. Since the loading portion 100 is lowered, even if it is lowered after the alignment of the semiconductor strip S and the strip pickup 300 in the X-axis direction, it is possible to prevent the interlock pin 370 from being combined with the first interlocking pin hole 131 and being prevented from being picked up. . Therefore, unlike the conventional semiconductor material cutting device, the position of the semiconductor strip S can be easily corrected.

The strip pickup unit 300 moves in the X-axis direction in order to transport the semiconductor strip S to the chuck table 210 of the cutting portion 200 after the semiconductor strip S is picked up by suction.

In this case, since the X-axis, the Y-axis, and the θ-axis of the semiconductor strip S are all corrected in the loading unit 100, the semiconductor strip S adsorbed to the strip pickup 300 is at a fixed position.

Therefore, as shown in FIGS. 9(a) to 9(c) and FIGS. 10(a) to 10(c), when the strip pickup 300 unloads the semiconductor strip S to the chuck table 210, strip picking The holder 300 is lowered by the pin driving portion 390 in a state in which the interlocking pin 370 is inserted into the second interlocking pin hole 211 of the chuck table 210 toward the chuck table 210 to be adsorbed to the strip pickup unit 300. The semiconductor strip S is transferred to the chuck table 210.

As described above, in the case where the X-axis position of the semiconductor strip S adsorbed to the strip pickup 300 is at a fixed position, the semiconductor strip S is transferred to the chuck table 210 while the interlock pin 370 is in a lowered state, thereby The semiconductor strip S can be unloaded by aligning the positions of the strip picker 300 and the chuck table 210 by the interlock pin 370 and the second interlock pin hole 211. Therefore, the semiconductor strip S can be transferred from the strip pickup unit 300 to the chuck table 210 in a state where the X-axis position, the Y-axis position, and the θ-direction position of the semiconductor strip S are both fixed positions.

Further, in the case where the strip picker 300 is lowered toward the chuck table 210 with the interlock pin 370 in a lowered state, it is not necessary to measure the position by the additional strip picker vision, and thus the strip picker 300 can be quickly lowered.

Moreover, in the case where the tape pickup 300 is lowered toward the chuck table 210 with the interlock pin 370 in a lowered state, the interlock pin 370 is coupled with the second interlock pin hole 211 (or the interlock pin 370 is inserted into the second mutual Since the pin hole 211) is locked, the strip pickup 300 can be accurately lowered without any change in external environmental factors such as sway and time delay.

Hereinafter, the second position correcting operation will be described.

The second position correcting operation is an operation in which the loading unit 100 performs the Y-axis direction and the θ-axis correction when the semiconductor strip S of the alignment table 111 stacked on the board 110 of the loading unit 100 is not in a fixed position. The X-axis position correction of the strip pickup 300 is performed in the process of transferring the semiconductor strip S adsorbed to the strip pickup unit 300 to the chuck table 210. Therefore, the second position correcting action is as follows: after the loading section 100 performs the Y-axis, θ-direction correction, the semiconductor strip S is picked up using the interlock pin 370 of the strip picker 300, and then the semiconductor strip S is unloaded to the chuck table 210. At this time, the correction is performed without using the interlock pin 370 of the tape pickup 300 to be unloaded to the chuck table 210.

Therefore, even if the strip picker vision device of the strip picker 300 confirms that the X-axis position of the semiconductor strip S supplied to the loading portion 100 is not in a fixed position, the loading portion 100 simply passes the introduction rail 150 and the loading portion 100. The rotation of the semiconductor strip S only corrects the Y-axis position and the θ-direction position of the semiconductor strip S to a fixed position, and then, as shown in FIGS. 3(a) to 3(c), the strip pickup 300 is interposed by the interlock pin 370. The state in which the pin drive unit 390 is lowered is lowered.

In this case, as shown in FIGS. 4(a) to 4(c), the interlock pin 370 is inserted into the first interlocking pin hole 131 of the loading portion 100, and the semiconductor strip S is attracted to the strip picker 300, And as shown in FIGS. 5(a) to 5(c), the strip pickup 300 picks up the semiconductor strip S.

The strip pickup 300 moves in the X-axis direction in order to convey the semiconductor strip S to the chuck table 210 of the cutting portion 200 after picking up the semiconductor strip S.

The strip picker 300 moved to the chuck table 210 is lowered toward the chuck table 210 to unload the semiconductor strip S. In this case, the strip pickup unit 300 is in the ascending state toward the chuck table at the interlock pin 370 as shown in FIGS. 11(a) to 11(c) and FIGS. 12(a) to 12(c). The direction of 210 is lowered, and thereafter the X-axis position correction amount of the semiconductor strip S is reflected and unloaded. Therefore, when the strip pickup 300 is lowered, the correction is performed without interference of the interlock pin 370.

On the other hand, when the semiconductor strip S is cut, the alignment state of the semiconductor strip S is inspected by the cutting portion vision device, and then, in the case where the position is skewed or where position correction is required, the load can be reloaded. The semiconductor strip S is placed on the chuck table 210.

The following series of actions is referred to as a reloading action of the semiconductor strip S: after the strip pickup 300 unloads the semiconductor strip S to the chuck table 210, the semiconductor strip S is picked up again to align the semiconductor strip S With the position of the strip picker 300, the semiconductor strip S is unloaded again.

At this time, as shown in FIGS. 12(a) to 12(c), the tape pickup 300 can be moved toward the chuck table 210 in a state where the interlock pin 370 of the tape pickup 300 is lifted and lowered by the pin driving portion 390. After the semiconductor strip S is ascended and the semiconductor strip S is picked up, the semiconductor strip S may be picked up after the interlock pin 370 of the strip picker 300 is lowered by the pin driving portion 390 to adsorb the semiconductor strip S. Pick up the semiconductor strip S.

When picking up the semiconductor strip S adsorbed on the chuck table 210, picking can be performed with the interlock pin 370 rising or falling, but after picking up for correction, the strip picker 300 takes the strip picker 300 The interlocking pin 370 is lowered toward the chuck table 210, whereby the positional correction of the semiconductor strip S can be performed. The X-axis position correction of the semiconductor strip S is performed by the strip pickup unit 300, and the Y-axis and the θ-axis correction of the semiconductor strip 300 are performed on the chuck table 210, whereby reloading and correction can be performed on the chuck table 210.

Therefore, the semiconductor strip S can be transferred from the strip pickup unit 300 to the chuck table 210 in a state where the X-axis position, the Y-axis position, and the θ-direction position of the semiconductor strip S are both fixed positions.

In addition to the second position correcting action as described above, the reloading can be performed without the semiconductor strip S transferred to the chuck table 210 being in a fixed position.

In other words, when the semiconductor strip S is picked up from the loading unit 100 like the first position correcting action, even if the position of the semiconductor strip S has been corrected, the position of the semiconductor strip S transferred to the chuck table 210 is not at a fixed position. In the case of the above, the reloading action as described above can also be performed.

Hereinafter, the third position correcting operation will be described.

The third position correcting operation is related to the semiconductor material cutting device 10 equipped with a driving unit that moves the loading unit 100 in the X-axis direction, and can be corrected in the X-axis, the Y-axis, and the θ direction in the loading unit 100. That is, the third position correcting operation refers to an operation in which the semiconductor strip S of the alignment stage 111 stacked on the board 110 of the loading unit 100 is positioned at a fixed position in the X-axis, the Y-axis, and the θ direction. The case refers to a state in which the positional skew correction is completed at the loading unit 100 after the supplied semiconductor strip S is inspected by the strip vision device, but it may also mean that the supplied semiconductor strip S is supplied to the position without skewing. Fixed position situation.

When the semiconductor strip S is supplied to the alignment stage 111 of the board 110 in the loading section 100, after the semiconductor strip S on the alignment stage 111 and the reference hole of the loading block 130 are collectively inspected by the strip vision device, When the X-axis, the Y-axis, and the θ-axis are aligned, the mounting unit 100 corrects the X-axis, the Y-axis, and the θ-axis of the alignment stage based on the inspection result, thereby the X-axis, the Y-axis, and the θ direction of the semiconductor strip S. The position is corrected to a fixed position.

Thereafter, the tape pickup 300 is lowered in a state where the interlock pin 370 of the tape pickup 300 is lowered by the pin driving portion 390.

In this case, as shown in FIGS. 4(a) to 4(c), the interlock pin 370 is inserted into the first interlocking pin hole 131 of the loading portion 100, and the semiconductor strip S is attracted to the strip picker 300, And as shown in FIGS. 5(a) to 5(c), the strip pickup 300 is raised, thereby picking up the semiconductor strip S.

Therefore, the semiconductor strip S is adsorbed to the strip pickup unit 300 in a state where the X-axis position, the Y-axis position, and the θ-direction position are both fixed positions, and the strip pickup 300 is loaded toward the loading with the interlock pin 370 in a lowered state. When the portion 100 is lowered, the interlocking pin 370 of the tape pickup 300 is coupled with the first interlocking pin hole 131 (or the state in which the first interlocking pin hole 131 is fitted with the interlocking pin 370), so even if shaking occurs And the change of the external environmental factors such as the time delay, the strip picker 300 can also be accurately and surely lowered.

The strip pickup unit 300 moves in the X-axis direction in order to transport the semiconductor strip S to the chuck table 210 of the cutting portion 200 after the semiconductor strip S is picked up by suction.

In this case, as described above, the position of the semiconductor strip S adsorbed to the strip pickup 300 is in a fixed position, and thus when the strip pickup 300 transfers the semiconductor strip S to the chuck table 210, as shown in Fig. 9 ( a) to FIG. 9(c) and FIGS. 10(a) to 10(c), the strip picker 300 is borrowed by the interlocking pin 370 to be inserted into the second interlocking pin hole 211 of the chuck table 210. The state in which the pin drive unit 390 is lowered is lowered toward the chuck table 210, and the semiconductor strip S adsorbed to the strip pickup unit 300 is transferred to the chuck table 210.

As described above, in the case where the semiconductor strip S adsorbed to the strip pickup 300 is in a fixed position, the semiconductor strip S is transferred to the chuck table 210 with the interlock pin 370 in a lowered state, whereby The lock pin 370 and the second interlock pin hole 211 align the position of the strip picker 300 and the chuck table 210 to unload the semiconductor strip S. Therefore, the strip pickup unit 300 can be transported from the strip pickup unit 300 to the chuck table 210 in a state where the X-axis position, the Y-axis position, and the θ-direction position of the semiconductor strip S are both fixed positions.

In the above-described embodiment, the Y-axis and the θ-axis correction are performed on the loading unit 100, or the X-axis, the Y-axis, and the θ-axis correction are performed on the loading unit 100, but the strip vision is performed. In the case where the alignment state of the semiconductor strip S is not detected when the position is skewed on the specific axis, the correction can be performed only on the axis to be corrected.

For example, when only the Y-axis or the θ-axis position of the semiconductor strip S is skewed, only the Y-axis or the θ-axis correction may be performed on the loading unit 100. This means that 1-axis, 2-axis or 3-axis correction can be performed depending on the positional skew state of the semiconductor strip S.

As described above, unlike the conventional semiconductor material cutting device, the semiconductor material cutting device 10 of the preferred embodiment of the present invention performs the first position correcting operation to the third position correcting operation, depending on the position of the semiconductor strip S, and is The positional skew correction is automatically performed on the loading unit 100 or the suction table 210 to automatically determine the lifting and lowering of the interlocking pin 370, thereby not only ensuring the accuracy of the mechanism, but also correcting the position of the semiconductor strip S and responding to changes in external environmental factors. The fast picking up and unloading of the semiconductor strip S is achieved at the same time.

As described above, the present invention has been described with reference to the preferred embodiments of the present invention, and those skilled in the art can, without departing from the scope of the invention and the scope of the invention as described in the appended claims The invention is subject to various modifications or variations.

10‧‧‧Semiconductor material cutting device

100‧‧‧Loading Department

110‧‧‧ board

111‧‧‧Alignment table

130‧‧‧Loading block

131‧‧‧First interlocking pin hole

150‧‧‧Introduction of orbit

200‧‧‧cutting department

210‧‧‧Sucker table

211‧‧‧Second interlocking pin hole

230‧‧‧blade

300‧‧‧With picker

310‧‧‧ picker body

330‧‧‧ picker head

350‧‧‧ fastening department

370‧‧‧Interlocking pin

390‧‧ ‧ pin drive department

400‧‧‧unit picker

500‧‧‧Cleaning Department

600‧‧‧Drying Department

700‧‧‧Inspection Department

710‧‧‧Rotating table

721‧‧‧First Vision Unit

722‧‧‧Second Visual Unit

731‧‧‧First Category Picker

732‧‧‧Second sort picker

800‧‧‧Classification Department

810‧‧‧first delivery tray

830‧‧‧Second shipped tray

850‧‧‧Tray pickup

870‧‧‧ Third Vision Unit

910‧‧‧First Guide Frame

920‧‧‧Second guiding framework

930‧‧‧ Third Guiding Framework

940‧‧‧fourth guiding framework

S‧‧‧Semiconductor strip

P‧‧‧Semiconductor package

X, Y, θ‧‧‧ directions

1 is a top plan view of a semiconductor strip supplied to a semiconductor material cutting device. 2 is a top plan view of a semiconductor material cutting device. 3(a) to 3(c) are views showing a state in which the interlocking pin of the tape pickup of Fig. 2 is lowered and the semiconductor strip is placed on the loading portion. 4(a) to 4(c) are diagrams showing a state in which the strip pickup is lowered toward the loading portion and the semiconductor strip is sucked in the state of Figs. 3(a) to 3(c). 5(a) to 5(c) are diagrams showing a state in which the strip pickup device is lifted and the semiconductor strip is picked up in the state of Figs. 4(a) to 4(c). 6(a) to 6(c) are views showing a state in which the interlocking pin of the tape pickup of Fig. 2 is raised and the semiconductor strip is placed on the loading portion. 7(a) to 7(c) are views showing a state in which the strip pickup is lowered toward the loading portion and the semiconductor strip is adsorbed in the state of Figs. 6(a) to 6(c). 8(a) to 8(c) are diagrams showing a state in which the strip pickup is lifted and the semiconductor strip is picked up in the state of Figs. 7(a) to 7(c). 9(a) to 9(c) are views showing a state in which the tape pickup is lowered toward the suction table in a state where the interlock pin of the tape pickup of Fig. 2 is lowered. FIGS. 10(a) to 10(c) are diagrams showing a state in which the strip pickup is lifted and the semiconductor strip is placed on the chuck table in the state of FIGS. 9(a) to 9(c). 11(a) to 11(c) are views showing a state in which the interlocking pin of the tape pickup of Fig. 2 is raised and the semiconductor strip is placed on the chuck table. 12(a) to 12(c) are diagrams showing a state in which the strip pickup is lowered toward the chuck table in the state of Figs. 11(a) to 11(c) to adsorb the semiconductor strip.

Claims (9)

A semiconductor material cutting device, comprising: a loading portion including an alignment table and a loading block, the alignment table adsorbing a semiconductor strip supplied by the loader portion, movable in a Y-axis direction, and being movable along a θ direction Rotating, the loading blocks are respectively provided to the front and rear direction of the semiconductor strip adsorbed on the alignment stage and one or more first interlocking pin holes are provided in the upper portion; the chuck table for the semiconductor to be transferred from the loading portion The strip is cut into individual semiconductor packages to adsorb the semiconductor strip, and more than one second interlocking pin hole is disposed in the upper portion, which is movable in the Y-axis direction and can be rotated in the θ direction; and a strip picker can be The loading portion and the chuck table are disposed to move in the X-axis direction, and the semiconductor strip supplied to the loading portion is adsorbed and transferred to the chuck table, and one side is provided with a semiconductor strip for inspection. The aligning strip vision visor is provided with an interlocking pin in a liftable manner to insert an interlocking pin into the first interlocking pin hole or the second interlocking pin hole as needed. The semiconductor material cutting device according to claim 1, wherein the loading portion is corrected in the Y-axis and the θ direction, and the interlock pin of the tape pickup is in a state of being raised. After the X-axis direction of the strip picker, the strip picker adsorbs the semiconductor strip on the alignment stage, and the interlock pin of the strip picker is lowered to be inserted into the second interlocking pin In the state of the hole, the semiconductor strip adsorbed to the strip pickup is transferred to the chuck table. The semiconductor material cutting device according to claim 1, wherein the loading portion is corrected in the Y-axis and the θ direction, and the interlock pin of the strip pickup is lowered to be inserted into the first In the state of the interlocking pin hole, the strip picker adsorbs the semiconductor strip on the alignment stage, and corrects the strip picker in a state where the interlock pin of the strip picker is in a rising state After the X-axis direction, the semiconductor strip adsorbed to the strip pickup is transferred to the chuck table. The semiconductor material cutting device according to the first aspect of the invention, further comprising: a driving unit that moves the loading unit in the X-axis direction, wherein the loading unit is corrected in the X-axis, the Y-axis, and the θ direction. Aligning the semiconductor strip, the strip picker adsorbs the semiconductor on the alignment stage in a state where the interlock pin of the strip pickup is lowered to be inserted into the first interlocking pin hole The strip conveys the semiconductor strip adsorbed to the strip pickup to the chuck table in a state where the interlock pin of the strip pickup is lowered and inserted into the second interlocking pin hole. The semiconductor material cutting device according to claim 1, further comprising: a cutting portion for cutting a semiconductor strip adsorbed on the chuck table; and a cutting portion vision device for inspecting the adsorption portion The alignment state of the semiconductor strip of the chuck table, the cutting portion vision device checking whether the cutting line of the semiconductor strip adsorbed on the chuck table is within an error range of the blade avoiding groove formed in the chuck table. The semiconductor material cutting device of claim 5, wherein the semiconductor strip transferred to the chuck table is inspected by the cutting portion vision device, and the alignment of the semiconductor strip is skewed In the case where the strip picker is in a rising state of the strip pickup, the semiconductor strip on the chuck table is adsorbed, and the chuck table is corrected in the Y-axis and the θ direction. After the strip pickup is corrected in the X-axis direction, the semiconductor strip adsorbed to the strip pickup is again transferred to the chuck table with the interlock pin of the strip pickup being raised. The semiconductor material cutting device of claim 5, wherein the semiconductor strip transferred to the chuck table is inspected by the cutting portion vision device, and the alignment of the semiconductor strip is skewed In the case where the strip picker is in a state where the interlock pin of the strip picker is lowered, the semiconductor strip on the chuck table is adsorbed, and the chuck table is corrected in the Y-axis and the θ direction. After the strip pickup is corrected in the X-axis direction, the semiconductor strip adsorbed to the strip pickup is again transferred to the chuck table with the interlock pin of the strip pickup being raised. The semiconductor material cutting device according to claim 1, wherein a plurality of reference holes are provided on one side of the loading block, and the reference hole is inspected together by the strip vision device. The semiconductor strips confirm the alignment state of the semiconductor strips adsorbed on the alignment stage. The semiconductor material cutting device according to claim 1, wherein the loading portion further includes a pair of lead-in rails for guiding the semiconductor strip supplied from the loader portion, in order to be according to the semiconductor strip The width changes to move in the Y-axis direction.