KR101788556B1 - Chip Mounter - Google Patents
Chip Mounter Download PDFInfo
- Publication number
- KR101788556B1 KR101788556B1 KR1020150150169A KR20150150169A KR101788556B1 KR 101788556 B1 KR101788556 B1 KR 101788556B1 KR 1020150150169 A KR1020150150169 A KR 1020150150169A KR 20150150169 A KR20150150169 A KR 20150150169A KR 101788556 B1 KR101788556 B1 KR 101788556B1
- Authority
- KR
- South Korea
- Prior art keywords
- chip
- shuttle
- mounting
- chips
- head
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
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- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
According to an aspect of the present invention, there is provided a chip mounting apparatus including: a shuttle for transferring a plurality of chips formed from a wafer to a pickup head; A plurality of mounting heads for mounting the chips carried from the shuttle onto a printed circuit board; A camera configured to move with the mounting head and capture an image of the shuttle and an image of the printed circuit board; And an image analyzer for analyzing the image of the photographed shuttle so as to judge whether a part or the whole of the chip is missing in the shuttle and whether a part or all of the chip is deviated from the correct position.
Description
The present invention relates to a chip mounting apparatus, and more particularly, it relates to a chip mounting apparatus, and more particularly to a system and method for capturing the presence and position of chips mounted on a shuttle with a camera moving together with a mounting head, Lt; RTI ID = 0.0 > off < / RTI >
Surface Mount Technology (SMT) is a technology that attaches semiconductor chips or other electronic components to a layout designed on a printed circuit board (PCB). In order to achieve such an SMT, a surface mounting machine includes a plurality of suction nozzles for suctioning and moving components.
In order to mount the component on the PCB properly, it is important to determine whether the component is properly adhered to the suction nozzle. In the past, whether the component was adsorbed or not was determined by checking the air pressure inside the nozzle. However, miniaturization of nozzles and parts accompanied by miniaturization of the PCB has been accompanied by a gradual increase in errors in the pneumatic check inside the nozzles. Even though the component is not adsorbed to the nozzle due to such an error, the component is mistakenly recognized as being adsorbed, so that the flux dipping process is still proceeded, so that the nozzle is contaminated and the contamination of the nozzle is transferred to other parts or PCB, To increase the defect rate.
In order to solve this problem, conventionally, a separate camera was installed from the lower side to the upper side around the shuttle pad to judge whether or not the component was attracted to the nozzle. However, according to this method, it is possible to judge whether or not the component is properly adsorbed by the adsorption nozzle only after the component adsorption process has elapsed. Therefore, if the component is not adsorbed, it takes time to detect the component, The subsequent process proceeds to cause various problems such as contamination of nozzles, process errors, and the like.
SUMMARY OF THE INVENTION It is an object of the present invention to provide an apparatus that can precisely grasp the presence or absence of a chip to reduce chip absorption errors of a header and prevent contamination of a PCB and other chips, thereby minimizing a reduction in productivity.
In addition, when all the chips are deviated from the shuttle's position, the offset of the pick-up head is corrected so that all the chips can be seated in the correct position from the next shuttle.
The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.
According to an aspect of the present invention, there is provided a chip mounting apparatus including: a shuttle for transferring a plurality of chips formed from a wafer to a pickup head; A plurality of mounting heads for mounting the chips carried from the shuttle onto a printed circuit board; A camera configured to move with the mounting head and capture an image of the shuttle and an image of the printed circuit board; And an image analyzer for analyzing the image of the photographed shuttle so as to judge whether a part or the whole of the chip is missing in the shuttle and whether a part or all of the chip is deviated from the correct position.
Other specific details of the invention are included in the detailed description and drawings.
The embodiments of the present invention have at least the following effects.
The shuttle and the printed circuit board are photographed with the camera moving together with the mounting head, and the presence or absence of the chip and the position of the chip can be grasped accurately through the photographed image, thereby reducing chip absorption errors in the header. Accordingly, contamination of the printed circuit board (PCB) and other chips can be prevented, and the decrease in productivity can be minimized.
In addition, when all the chips are deviated from the shuttle's position, the offset of the pick-up head is corrected so that all the chips can be seated in the correct position from the next shuttle.
The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.
1 is a plan view of a
2 is a diagram illustrating a process of transferring a chip C by the pickup head 124 according to an embodiment of the present invention.
3 is a plan view of the
4 is a plan view of the
5 to 7 are views showing a process in which the mounting
8 is a view illustrating a process in which a chip C is immersed in a flux F when the
9 is a view showing a process in which a chip C is mounted on a printed circuit board (PCB) when the
Figure 10 is a plan view of the
FIG. 14 is a view showing a process in which a chip C according to an embodiment of the present invention is immersed in the flux F when some chips C are missing.
15 is a view showing a process in which a chip C is mounted on a printed circuit board (PCB) when some chips C are missing.
16 is a plan view of the
17 to 22 show a process of picking up a chip C from the
23 is a plan view of the
Figs. 24 to 27 are diagrams showing a process in which the
BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.
Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.
The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms " comprises "and / or" comprising "used in the specification do not exclude the presence or addition of one or more other elements in addition to the stated element.
Although the first, second, etc. are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical scope of the present invention.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
1 is a plan view of a
1, the
The
The
The
The wafer cassette 121 accommodates the wafer W in a slot formed therein and the
The mounting
The
2 is a diagram illustrating a process of transferring a chip C by the pickup head 124 according to an embodiment of the present invention.
As shown in FIG. 2, the pick-up head 124 includes a
The
As shown in FIG. 2, the
As shown in FIG. 2, the
3 is a plan view of the mounting
3, the mounting
The
The
At least one
The
The mounting
The
The mounting
The mounting
The
A plurality of
A detailed description of the
4 is a plan view of the
As shown in FIG. 4, when the
5 to 7 are views showing a process in which the mounting
As shown in FIGS. 3 and 5, the four mounting
A mounting
8 is a view illustrating a process in which a chip C is immersed in a flux F when the
3, the
As shown in FIG. 8, the upper surface of the
The
9 is a view showing a process in which a chip C is mounted on a printed circuit board (PCB) when the
The
The control unit (not shown) notifies that the mounting
The control unit (not shown) further includes an image analysis unit (not shown) and a mounting head controller (not shown). The image analyzing unit analyzes the image of the
10 is a plan view of the
10, the
FIGS. 11 to 13 illustrate a process in which the mounting
11, if the chip C is not picked up by the pick-up head 124, the chip C is seated only on the upper side of the three
Only a part of the chips C may be mounted on the printed circuit board (PCB). This is because only the mounted part is used to evaluate the merchantability. According to an embodiment of the present invention, the control unit (not shown) instructs only the three mounting
Only a part of the chips C may not be mounted on the printed circuit board (PCB). This is because only the printed circuit board (PCB), which is entirely mounted, is recognized as being commercially viable. According to another embodiment of the present invention, in this case, the control unit (not shown) commands all the mounting
Fig. 14 is a view showing a process in which a chip C according to an embodiment of the present invention is immersed in a flux F when some chips C are missing, Fig. 15 is a view showing a state in which some chips C are missing , The chip C is mounted on the printed circuit board (PCB).
According to one embodiment of the present invention, only the three mounting
16 is a plan view of the
16, the
17 to 22 show a process of picking up a chip C from the
If the
According to an embodiment of the present invention, the control unit (not shown) instructs only the three mounting
23 is a plan view of the
23, when all the chips C are separated from the correct position of the
Figs. 24 to 27 are diagrams showing a process in which the mounting
If an offset occurs in the
In this case, as shown in FIG. 25, the controller (not shown) controls the
At the same time, the control unit (not shown) issues an offset correction command to the
It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.
1: chip mounting apparatus 10: loading section
11: substrate supply unit 12: chip supply unit
20: mounting part 21: chip transferring unit
211: rail 212: shuttle
213: chip supporting plate 22: mounting unit
221: Y-axis guide rod 222: X-axis guide rod
223: Movement bar 224: Mounting head support
225: mounting head 226: camera
Claims (6)
A plurality of mounting heads for mounting the chips carried from the shuttle onto a printed circuit board;
A camera configured to move with the mounting head and capture an image of the shuttle and an image of the printed circuit board; And
And an image analyzer for analyzing the image of the photographed shuttle so as to judge whether a part or all of the chip is missing in the shuttle and whether a part or all of the chip is deviated from the correct position,
The camera comprises:
When the mounting head moves in a direction in which the printed circuit board is positioned after picking up the chip from the shuttle, the mounting position of the printed circuit board is previously determined in accordance with being positioned above the printed circuit board before the mounting head A first camera installed at a position where the camera can be positioned; And
When the mounting head moves in a direction in which the shuttle is positioned after the chip is mounted on the printed circuit board, the mounting head is installed at a position where the position of the chip can be grasped in advance And a second camera which is connected to the second camera.
If it is determined by the image analysis unit that a part of the chip is missing from the shuttle,
And a mounting head controller for controlling the mounting head to mount only the remaining chips mounted on the shuttle onto the printed circuit board.
If it is determined by the image analysis unit that the entire chip is deviated from a predetermined position of the shuttle,
And calculates the offset correction value on the basis of a coordinate value moved by the mounting head in order to suck all of the chips in order to correct the offset of the pick-up head.
If it is determined by the image analysis unit that a part or all of the chip is missing from the shuttle,
Further comprising a mounting head controller for controlling the mounting head to wait at an upper portion of the arrival position of the shuttle for the mounting head to pick up the entire chip as the missing chip is conveyed again by the shuttle, Chip mounting device.
If it is determined by the image analysis unit that the entire chip is deviated from a predetermined position of the shuttle,
And calculates the offset correction value on the basis of a coordinate value moved by the mounting head in order to suck all of the chips in order to correct the offset of the pick-up head.
If it is determined by the image analysis unit that a part of the chip is deviated from a predetermined position of the shuttle,
A mounting head controller for sucking only the remaining chips that are seated in the predetermined position of the shuttle, and controlling the chips to be moved to a position of some of the chips separated from the predetermined position, The chip mounting apparatus further includes:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150150169A KR101788556B1 (en) | 2015-10-28 | 2015-10-28 | Chip Mounter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150150169A KR101788556B1 (en) | 2015-10-28 | 2015-10-28 | Chip Mounter |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170049153A KR20170049153A (en) | 2017-05-10 |
KR101788556B1 true KR101788556B1 (en) | 2017-10-23 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020150150169A KR101788556B1 (en) | 2015-10-28 | 2015-10-28 | Chip Mounter |
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KR (1) | KR101788556B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110176425B (en) * | 2019-05-05 | 2021-12-10 | 深圳市迪科贝科技有限公司 | Energy-saving chip picking equipment firm in grabbing |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006339392A (en) * | 2005-06-02 | 2006-12-14 | Juki Corp | Component mounting apparatus |
JP2008091815A (en) * | 2006-10-05 | 2008-04-17 | Yamaha Motor Co Ltd | Mounting machine, and components imaging method thereof |
-
2015
- 2015-10-28 KR KR1020150150169A patent/KR101788556B1/en active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006339392A (en) * | 2005-06-02 | 2006-12-14 | Juki Corp | Component mounting apparatus |
JP2008091815A (en) * | 2006-10-05 | 2008-04-17 | Yamaha Motor Co Ltd | Mounting machine, and components imaging method thereof |
Also Published As
Publication number | Publication date |
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KR20170049153A (en) | 2017-05-10 |
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