KR101788556B1

KR101788556B1 - Chip Mounter

Info

Publication number: KR101788556B1
Application number: KR1020150150169A
Authority: KR
Inventors: 이용재
Original assignee: 한화테크윈 주식회사
Priority date: 2015-10-28
Filing date: 2015-10-28
Publication date: 2017-10-23
Also published as: KR20170049153A

Abstract

According to an aspect of the present invention, there is provided a chip mounting apparatus including: a shuttle for transferring a plurality of chips formed from a wafer to a pickup head; A plurality of mounting heads for mounting the chips carried from the shuttle onto a printed circuit board; A camera configured to move with the mounting head and capture an image of the shuttle and an image of the printed circuit board; And an image analyzer for analyzing the image of the photographed shuttle so as to judge whether a part or the whole of the chip is missing in the shuttle and whether a part or all of the chip is deviated from the correct position.

Description

Chip Mounter

The present invention relates to a chip mounting apparatus, and more particularly, it relates to a chip mounting apparatus, and more particularly to a system and method for capturing the presence and position of chips mounted on a shuttle with a camera moving together with a mounting head, Lt; RTI ID = 0.0 > off < / RTI >

Surface Mount Technology (SMT) is a technology that attaches semiconductor chips or other electronic components to a layout designed on a printed circuit board (PCB). In order to achieve such an SMT, a surface mounting machine includes a plurality of suction nozzles for suctioning and moving components.

In order to mount the component on the PCB properly, it is important to determine whether the component is properly adhered to the suction nozzle. In the past, whether the component was adsorbed or not was determined by checking the air pressure inside the nozzle. However, miniaturization of nozzles and parts accompanied by miniaturization of the PCB has been accompanied by a gradual increase in errors in the pneumatic check inside the nozzles. Even though the component is not adsorbed to the nozzle due to such an error, the component is mistakenly recognized as being adsorbed, so that the flux dipping process is still proceeded, so that the nozzle is contaminated and the contamination of the nozzle is transferred to other parts or PCB, To increase the defect rate.

In order to solve this problem, conventionally, a separate camera was installed from the lower side to the upper side around the shuttle pad to judge whether or not the component was attracted to the nozzle. However, according to this method, it is possible to judge whether or not the component is properly adsorbed by the adsorption nozzle only after the component adsorption process has elapsed. Therefore, if the component is not adsorbed, it takes time to detect the component, The subsequent process proceeds to cause various problems such as contamination of nozzles, process errors, and the like.

Korean Laid-Open Publication No. 2010-0031020 Korea Patent No. 1197311

SUMMARY OF THE INVENTION It is an object of the present invention to provide an apparatus that can precisely grasp the presence or absence of a chip to reduce chip absorption errors of a header and prevent contamination of a PCB and other chips, thereby minimizing a reduction in productivity.

In addition, when all the chips are deviated from the shuttle's position, the offset of the pick-up head is corrected so that all the chips can be seated in the correct position from the next shuttle.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

Other specific details of the invention are included in the detailed description and drawings.

The embodiments of the present invention have at least the following effects.

The shuttle and the printed circuit board are photographed with the camera moving together with the mounting head, and the presence or absence of the chip and the position of the chip can be grasped accurately through the photographed image, thereby reducing chip absorption errors in the header. Accordingly, contamination of the printed circuit board (PCB) and other chips can be prevented, and the decrease in productivity can be minimized.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

1 is a plan view of a chip mounting apparatus 1 according to an embodiment of the present invention.
2 is a diagram illustrating a process of transferring a chip C by the pickup head 124 according to an embodiment of the present invention.
3 is a plan view of the mounting portion 20 according to an embodiment of the present invention.
4 is a plan view of the shuttle 212 when the chip mounting apparatus 1 according to the embodiment of the present invention operates normally.
5 to 7 are views showing a process in which the mounting head 225 picks up a chip C from the chip supporting plate 213 when the chip mounting apparatus 1 according to the embodiment of the present invention operates normally .
8 is a view illustrating a process in which a chip C is immersed in a flux F when the chip mounting apparatus 1 operates normally according to an embodiment of the present invention.
9 is a view showing a process in which a chip C is mounted on a printed circuit board (PCB) when the chip mounting apparatus 1 according to an embodiment of the present invention operates normally.
Figure 10 is a plan view of the shuttle 212 according to one embodiment of the present invention when some chips C are missing. And the mounting head 225 according to the example picks up the chip C from the chip supporting plate 213. [
FIG. 14 is a view showing a process in which a chip C according to an embodiment of the present invention is immersed in the flux F when some chips C are missing.
15 is a view showing a process in which a chip C is mounted on a printed circuit board (PCB) when some chips C are missing.
16 is a plan view of the shuttle 212 according to one embodiment of the present invention when some chips C are displaced in place.
17 to 22 show a process of picking up a chip C from the chip supporting plate 213 when the mounting head 225 according to the embodiment of the present invention picks up some of the chips C from the correct position to be.
23 is a plan view of the shuttle 212 according to one embodiment of the present invention when all the chips C are displaced in place.
Figs. 24 to 27 are diagrams showing a process in which the mounting head 225 according to the embodiment of the present invention picks up the chips C from the chip supporting plate 213 when all the chips C are deviated from the correct positions to be.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms " comprises "and / or" comprising "used in the specification do not exclude the presence or addition of one or more other elements in addition to the stated element.

Although the first, second, etc. are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical scope of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view of a chip mounting apparatus 1 according to an embodiment of the present invention.

1, the chip mounting apparatus 1 includes a loading section 10, a mounting section 20, a reflowing section 30, and an unloading section 40. As shown in FIG. The loading section 10, the mounting section 20, the reflowing section 30, and the unloading section 40 may be sequentially arranged in a line along the X-axis direction.

The loading section 10 includes a substrate supply section 11 and a chip supply section 12. The substrate supply unit 11 supplies a printed circuit board (PCB) to the mounting unit 20 and the chip supply unit 12 supplies the chip C to the mounting unit 20. [ The chip C will be described below as a flip chip having solder bumps SB, but it is not limited thereto and may be various types of chips. The chip supply unit 12 may be disposed on one side of the substrate supply unit 11 along the Y-axis direction. Here, the Y-axis direction refers to a direction perpendicular to the X-axis direction.

The substrate supply section 11 includes a substrate supply section 11, a loader 111, a conveyor 112, and a detector 113. The loader 111 loads the printed circuit board (PCB) and transfers the printed circuit board (PCB) to the conveyor 112. The conveyor 112 conveys the printed circuit board (PCB) to the mounting portion 20. The detector 113 is disposed on one side of the substrate supply unit 11 and reads a Reject Mark on the printed circuit board PCB. The REJECT mark is a mark indicating whether or not the chip (C) packaging area on the printed circuit board (PCB) is defective.

The chip feeder 12 may include a wafer cassette 121, a wafer feeder 122, a wafer support 123 and a pick-up head 124. Here, a plurality of chips C are formed on the wafer W through a fab (FAB) process, a back grinding process, and a sawing process. The chips C formed on the wafers W are separated by the individual chips C by the soaking process. A plurality of solder bumps (SB) are formed on one surface of the chip (C). One surface of the chip C on which the solder bumps SB are formed is referred to as a bump surface and the other surface of the chip C on which the solder bumps SB are not formed facing the bump surface is referred to as an adsorption surface.

The wafer cassette 121 accommodates the wafer W in a slot formed therein and the wafer transfer unit 122 draws the wafer W from the wafer cassette 141 and transfers the wafer W to the wafer support unit 123. The pick-up head 124 is disposed between the wafer support 123 and the mounting portion 20. The pick-up head 124 picks up the chips C formed on the wafer W in individual units and transfers them to the mounting unit 20.

The mounting portion 20 is disposed adjacent to the rear of the loading portion 10 to surface-mount the chip C on a printed circuit board (PCB). This will be described in detail below.

The reflow portion 30 is disposed adjacent to the rear of the mounting portion 20 to reflow the solder bumps BP of the chip C and to bond the solder bumps BP with the contact pads of the printed circuit board PCB. The unloading portion 40 is disposed adjacent to the rear side of the reflowing portion 30 and unloads the printed circuit board (PCB) to which the chip C is bonded.

2 is a diagram illustrating a process of transferring a chip C by the pickup head 124 according to an embodiment of the present invention.

As shown in FIG. 2, the pick-up head 124 includes a flip head 125 and a transport head 126.

The flip head 125 includes a flip head body 125a, a flip head rod 125b, and a rotary shaft rod 125c. 2, the flip head 125 picks up a chip C formed on the wafer W, and flips the picked-up chip C. As shown in FIG. The flip head 125 can move between the upper portion of the wafer W and the point P where the chip C is flipped. Therefore, when the flip head 125 moves downward to pick up the chip C, when the chip C is picked up, the flip head 125 moves upward to the point P where it is flipped again.

As shown in FIG. 2, the flip head rod 125b is formed at one end of the flip head body 125a, and a suction hole (not shown) is formed at one end of the flip head rod 125b. When the chip C is picked up, the inside of the suction hole is depressurized to adsorb the bump surface of the chip C. The suction holes are kept in a reduced pressure state while the flip head 125 picks up the chip C so that the chip C is not released from the flip head 125 during pickup. A rotation shaft rod 125c is formed at an upper end of the flip head body 125a. The flip head body 125a is rotated by 180 degrees about the rotary shaft rod 125c to flip the chip C such that the bump face of the chip C faces downward.

As shown in FIG. 2, the transport head 126 is disposed on top of the flip head 125 and includes a transport head body 126a and a transport head rod 126b. The transport head 126 receives the chip C flipped by the flip head 125 and carries it to the mounting portion 20. [ At this time, the transport head main body 126a moves forward and backward and up and down in the X-axis direction. A suction hole (not shown) is formed at one end of the transport head rod 126b. The suction holes are kept in a reduced pressure state while the transport head 126 picks up the chip C so that the chip C is not released from the transport head 126 during transportation.

3 is a plan view of the mounting portion 20 according to an embodiment of the present invention.

3, the mounting portion 20 includes a chip transferring unit 21, a mounting unit 22, a flux plate 23, a printed circuit board supporting unit 24 and an optical inspection unit 25 do.

The chip transfer unit 21 includes a rail 211, a shuttle 212 and a chip support plate 213. The chip transfer unit 21 transfers the chip C carried by the transfer head 126 in the X axis direction.

The rails 211 are formed as a pair and are arranged in a straight line in the X axis direction parallel to each other. The shuttle 212 has a thin rectangular plate shape. The shuttle 212 is installed on the rail 211 and is capable of linearly reciprocating along the rail 211 in the X-axis direction.

At least one chip supporting plate 213 is formed on the upper portion of the shuttle 212. The chip supporting plate 213 has a rectangular thin plate shape. The chip C is seated on the upper surface of the chip supporting plate 213. The chip C is seated with the bump side facing downward, and the solder bump SB comes into contact with the upper surface of the chip supporting plate 213. The chip support plate 213 may have a larger area than the chip C. [ When there are a plurality of chip supporting plates 213, it is preferable that the chip supporting plates 213 are arranged in line in the X-axis direction on the shuttle 212 although they may have various arrangements. Hereinafter, the chip (C) and the chip supporting plate 213 are respectively described as four cases, but the present invention is not limited thereto.

The chip supporting plates 213 may be formed in a plurality of chip supporting plates 213 according to an embodiment of the present invention. The chip supporting plate 213 is preferably made of a soft material, and in particular, the chip supporting plate 213 may be made of a silicon material. However, the present invention is not limited thereto, and the material of the chip supporting plate 213 may be formed of various materials capable of minimizing chip damage due to collision with the solder bumps SB.

The mounting unit 22 picks up and carries the chip C placed on the chip supporting plate 213 in the Y axis direction. The mounting unit 22 includes a Y-axis guide rod 310, an X-axis guide rod 320, a moving bar 330, a mounting head supporter 224, a mounting head 225 and a camera 226. As shown in FIG. 3, a pair of Y-axis guide rods 221 are formed and are arranged in a straight line in the Y-axis direction parallel to each other. The X-axis guide rods 222 are located between the two Y-axis guide rods 221, and the X-axis guide rods 222 are linearly arranged in the X-axis direction. Thus, the two Y-axis guide rods 221 are perpendicular to the X-axis guide rods 222, respectively. Both ends of the X-axis guide rod 222 are coupled to the Y-axis guide rods 221 so as to linearly reciprocate along the Y-axis guide rods 221 in the Y-axis direction.

The movable bar 223 is coupled to the X-axis guide rod 222 so as to linearly reciprocate along the X-axis guide rod 222 in the X-axis direction. The movement bar 223 is coupled with the mounting head supporter 224 so that when the movement bar 223 performs the movement, the mounting head supporter 224 moves together. At least one mounting head 225 is attached to the mounting head support 224. The number of the mounting heads 225 may be plural, and in this case, the number of the mounting heads 225 may correspond to the number of the chip supporting plates 213, and may be spaced corresponding to the intervals of the chip supporting plates 213. Hereinafter, the case where four mounting heads 225 are used is described, but the present invention is not limited thereto.

The mounting head 225 picks up the chip C placed on the chip supporting plate 213 in the Y axis direction and mounts the chip on the printed circuit board (PCB). A detailed description will be given below.

The mounting head 225 must easily move to mount the chip C on the printed circuit board (PCB). Thus, the two Y-axis guide rods 221 are arranged so as to sandwich the chip transferring unit 21, the flux plate 23, and the printed circuit board support unit 24 therebetween. The two Y-axis guide rods 221 are positioned in the Y-axis direction with one end of the rail 211 at the one end and the other end at the rear of the printed circuit board support unit 24.

The camera 226 is mounted on at least one of the moving bar 223 and the mounting head supporter 224 to photograph the upper surface of the shuttle 212 on which the chip C to be sucked is placed and the printed circuit board PCB to be mounted. As shown in FIG. 3, only one camera 226 according to one embodiment of the present invention is installed. In this case, one camera 226 shoots all of the upper surface of the shuttle 212 on which the chip C to be picked up and the printed circuit board (PCB) to be mounted. Therefore, the mounting position of the printed circuit board (PCB) and the position of the chip (C) can be grasped.

A plurality of cameras 226 according to another embodiment of the present invention may be installed. In this case, the first camera is disposed forward in the Y-axis direction and the second camera is disposed forward in the Y-axis direction. When the X-axis guide rod 222 moves in the Y-axis direction after the mounting head 225 picks up the chip C, the first camera is mounted on the upper part of the printed circuit board PCB before the mounting head 225 Located. Therefore, the mounting position of the printed circuit board (PCB) can be grasped in advance. When the X-axis guide rod 222 moves in the Y-axis direction after the second camera is mounted on the printed circuit board (PCB), the second camera is positioned above the shuttle 222 before the mounting head 225. Therefore, the position of the chip C can be grasped in advance.

A detailed description of the flux plate 23, the printed circuit board support unit 24, and the optical inspection unit 25 will be described below.

4 is a plan view of the shuttle 212 when the chip mounting apparatus 1 according to the embodiment of the present invention operates normally.

As shown in FIG. 4, when the chip mounting apparatus 1 according to an embodiment of the present invention operates normally, the chip C is seated at the central portion of the chip supporting plate 213.

5 to 7 are views showing a process in which the mounting head 225 picks up a chip C from the chip supporting plate 213 when the chip mounting apparatus 1 according to the embodiment of the present invention operates normally .

As shown in FIGS. 3 and 5, the four mounting heads 225 may have a plurality of arrangements, but are preferably arranged in line in the X-axis direction so as to correspond to the chip supporting plates 213. The mounting heads 225 include a mounting head body 225a and a mounting head rod 225b. The mounting head body 225a is fixed to the bottom surface of the mounting head support portion 224. The mounting head body 225a may be formed in the longitudinal direction in the Z-axis direction. Here, the Z-axis direction refers to a direction perpendicular to both the X-axis direction and the Y-axis direction.

A mounting head rod 225b is formed at the lower end of the mounting head main body 225a. As shown in Fig. 6, the mounting head rod 225b moves up and down in the Z-axis direction with respect to the mounting head body 225a. Therefore, the height of the lower end of the mounting head rod 225b is variable. At one end of the mounting head rods 225b, a suction hole (not shown) is formed. When the chip C is picked up, the inside of the suction hole is depressurized to adsorb the adsorption surface of the chip C. As shown in Fig. 7, the suction holes are kept in a reduced pressure state while the mounting head 225 picks up the chips C, so that the chips C are not separated from the mounting heads 225 during pickup. All mounting heads 225 are controllable simultaneously or individually. All of the mounting head rods 225b can simultaneously or independently move up and down, and can perform rotational motion with respect to the Z-axis direction. The adsorption holes can be depressurized simultaneously or separately.

8 is a view illustrating a process in which a chip C is immersed in a flux F when the chip mounting apparatus 1 operates normally according to an embodiment of the present invention.

3, the flux plate 23 is positioned between the chip transferring unit 21 and the printed circuit board support unit 24 in the Y-axis direction.

As shown in FIG. 8, the upper surface of the flux plate 23 is opened, and a receiving portion 231 is formed therein. The accommodating portion 231 is filled with a flux Fl. The chips C adsorbed to the mounting heads 225 are immersed in the flux F before being bonded to the contact pads of the printed circuit board PCB. The chip C is immersed so that the flux F is sufficiently applied to the solder bumps SB. The flux F removes the oxide film formed on the solder bumps SB. Then, when the chip C is mounted on the surface of the printed circuit board (PCB), the flux F bonds the solder bumps SB to the connection pads of the printed circuit board (PCB).

The optical inspection unit 25 is located at one side of the flux plate 23 in the X-axis direction. The optical inspection unit 25 reads reference position information of the mounting area on the printed circuit board PCB and information on the position of the solder bump SB of the chip C attracted to the mounting head 225. [ The camera can be used as the optical inspection unit 25. [

9 is a view showing a process in which a chip C is mounted on a printed circuit board (PCB) when the chip mounting apparatus 1 according to an embodiment of the present invention operates normally.

The optical inspection unit 25 includes a printed circuit board transferring rail 251 and a conveying gripper 252. As shown in FIG. 3, the printed circuit board (PCB) is transported from the conveyor 112 formed in the loading unit 10 to the PCB transferring rail 251. The printed circuit board (PCB) is moved to the position where the mounting process is performed by the feeding gripper 252. 9, the chip C on which the optical inspection has been completed is mounted on the surface of the printed circuit board (PCB) as shown in Fig. 9 based on the positional information of the read solder bump SB.

The control unit (not shown) notifies that the mounting head 225 picks up the chip C, immerses the picked-up chip C into the flux F and optically inspects the solder bump SB, The movement bar 223, and the mounting head 225 so that the process of mounting the X-axis guide rod C on the connection pad of the printed circuit board (PCB) is performed sequentially and continuously .

The control unit (not shown) further includes an image analysis unit (not shown) and a mounting head controller (not shown). The image analyzing unit analyzes the image of the shuttle 212 taken by the camera 226 to determine the position of the chip. Further, it is determined whether a part or all of the chip C is missing on the shuttle 212. A mounting head controller (not shown) controls the movement of the mounting head 225 and the attraction of the chip C.

10 is a plan view of the shuttle 212 according to one embodiment of the present invention when some chips C are missing.

10, the flip head 125 or the transport head 126 of the pick-up head 124 can not move the chip C when the chip C is missing and is not seated on the chip support plate 213 Some have not absorbed. When the head sucks the chip (C), a pneumatic pressure difference occurs inside the head. Generally, this pneumatic pressure difference is checked to determine whether or not the chip C is adsorbed. However, if the chip C is small, an error may occur in the pneumatic check. Therefore, even if the chip C is not adsorbed on the head, it may be overlooked. According to one embodiment of the present invention, the camera 226 may photograph the shuttle 212 to determine whether the chip C is missing.

FIGS. 11 to 13 illustrate a process in which the mounting head 225 picks up a chip C from the chip supporting plate 213 according to an embodiment of the present invention when a part of the chips C is missing.

11, if the chip C is not picked up by the pick-up head 124, the chip C is seated only on the upper side of the three chip supporting plates 213, Chips are missing. The control unit (not shown) recognizes this through the camera 226.

Only a part of the chips C may be mounted on the printed circuit board (PCB). This is because only the mounted part is used to evaluate the merchantability. According to an embodiment of the present invention, the control unit (not shown) instructs only the three mounting heads 225 corresponding to the chip supporting plate 213 on which the chip C exists. Therefore, as shown in Figs. 12 and 13, only the three mounting head rods 225b are lowered to pick up the chips C. Fig.

Only a part of the chips C may not be mounted on the printed circuit board (PCB). This is because only the printed circuit board (PCB), which is entirely mounted, is recognized as being commercially viable. According to another embodiment of the present invention, in this case, the control unit (not shown) commands all the mounting heads 225 to wait. Then, the shuttle 212 returns to the pick-up head 125 and loads the missing chip C thereon. At this time, all the mounting heads 225 wait at the top of the arrival position of the shuttle 212 to pick up the chip C as soon as the shuttle 212 arrives, without an error alarm. This process is performed even when all the chips C are missing.

Fig. 14 is a view showing a process in which a chip C according to an embodiment of the present invention is immersed in a flux F when some chips C are missing, Fig. 15 is a view showing a state in which some chips C are missing , The chip C is mounted on the printed circuit board (PCB).

According to one embodiment of the present invention, only the three mounting heads 225 adsorb the chips C. Therefore, the control unit (not shown) instructs deposition of the flux F and mounting of the printed circuit board (PCB) on only the three mounting heads 225 to which the chip C is adsorbed. Therefore, as shown in Figs. 14 and 15, only the three mounting head rods 225b are lowered to deposit and mount the chips C.

16 is a plan view of the shuttle 212 according to one embodiment of the present invention when some chips C are displaced in place.

16, the flip head 125 of the pick-up head 124 moves from the wafer W to the chip (not shown) when the chip C is detached from the correct position of the chip supporting plate 213, (C). Or an error has occurred in the process of transferring the chip C from the flip head 125 to the transport head 126. According to an embodiment of the present invention, in this case, the camera 226 can photograph the shuttle 212 to know whether or not the chip C is detached.

17 to 22 show a process of picking up a chip C from the chip supporting plate 213 when the mounting head 225 according to the embodiment of the present invention picks up some of the chips C from the correct position to be.

If the flip head 125 misidentifies the position of one chip C, the chip C is seated in the correct position only on the top of the three chip supporting plates 213, The chip C is released from the fixed position on the upper portion of the support plate 213. The control unit (not shown) recognizes this through the camera 226.

According to an embodiment of the present invention, the control unit (not shown) instructs only the three mounting heads 225 corresponding to the chip supporting plate 213 on which the chip C exists. Therefore, as shown in Figs. 18 and 19, only the three mounting head rods 225b are lowered to adsorb the chips C. 20, the controller (not shown) controls the X-axis guide rod 222 and the movable bar 223 so that the other one mounting head 225 can be positioned on the upper portion of the separated chip, Y axis move command. When a control unit (not shown) issues a pick-up command to the other one mounting head 225, all of the four mounting heads 225 pick up the chip C as shown in Figs. Then, as shown in Figs. 8 and 9, all of the four mounting heads 225 deposit and mount the chip C. Fig.

23 is a plan view of the shuttle 212 according to one embodiment of the present invention when all the chips C are displaced in place.

23, when all the chips C are separated from the correct position of the chip supporting plate 213 and are placed at the wrong positions, particularly when the degree of detachment of all the chips C is all the same, An offset occurs in the transport head 125 among the transport heads 124. According to an embodiment of the present invention, in this case, the camera 226 can photograph the shuttle 212 to know whether or not the chip C is detached.

Figs. 24 to 27 are diagrams showing a process in which the mounting head 225 according to the embodiment of the present invention picks up the chips C from the chip supporting plate 213 when all the chips C are deviated from the correct positions to be.

If an offset occurs in the transport head 125, as shown in FIG. 24, the chips C are separated from the correct positions on the upper portions of all the four chip supporting plates 213. The control unit (not shown) recognizes this through the camera 226.

In this case, as shown in FIG. 25, the controller (not shown) controls the X-axis guide rod 222 and the X- And instructs the bar 223 to move the X axis and the Y axis. When a control unit (not shown) issues a pick-up command to all the mounting heads 225, all of the four mounting heads 225 pick up the chips C as shown in Figs. 26 and 27. Then, as shown in Figs. 8 and 9, all of the four mounting heads 225 deposit and mount the chip C. Fig.

At the same time, the control unit (not shown) issues an offset correction command to the transport head 125. The degree of correction is calculated by extracting coordinates obtained by moving the X-axis guide rod 222 and the movement bar 223 along the X-axis and the Y-axis. The calculation method can use a formula for correcting the already known offset. Once the offset of the transport head 125 is corrected, then all of the chips C are seated in the correct position of the shuttle 212.

It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

1: chip mounting apparatus 10: loading section
11: substrate supply unit 12: chip supply unit
20: mounting part 21: chip transferring unit
211: rail 212: shuttle
213: chip supporting plate 22: mounting unit
221: Y-axis guide rod 222: X-axis guide rod
223: Movement bar 224: Mounting head support
225: mounting head 226: camera

Claims

A shuttle for transferring a plurality of chips formed from a wafer to a pick-up head and carrying the chips;
A plurality of mounting heads for mounting the chips carried from the shuttle onto a printed circuit board;
A camera configured to move with the mounting head and capture an image of the shuttle and an image of the printed circuit board; And
And an image analyzer for analyzing the image of the photographed shuttle so as to judge whether a part or all of the chip is missing in the shuttle and whether a part or all of the chip is deviated from the correct position,
The camera comprises:
When the mounting head moves in a direction in which the printed circuit board is positioned after picking up the chip from the shuttle, the mounting position of the printed circuit board is previously determined in accordance with being positioned above the printed circuit board before the mounting head A first camera installed at a position where the camera can be positioned; And
When the mounting head moves in a direction in which the shuttle is positioned after the chip is mounted on the printed circuit board, the mounting head is installed at a position where the position of the chip can be grasped in advance And a second camera which is connected to the second camera.

The method according to claim 1,
If it is determined by the image analysis unit that a part of the chip is missing from the shuttle,
And a mounting head controller for controlling the mounting head to mount only the remaining chips mounted on the shuttle onto the printed circuit board.

[Claim 3 is abandoned upon payment of the registration fee.]

3. The method of claim 2,
If it is determined by the image analysis unit that the entire chip is deviated from a predetermined position of the shuttle,
And calculates the offset correction value on the basis of a coordinate value moved by the mounting head in order to suck all of the chips in order to correct the offset of the pick-up head.

The method according to claim 1,
If it is determined by the image analysis unit that a part or all of the chip is missing from the shuttle,
Further comprising a mounting head controller for controlling the mounting head to wait at an upper portion of the arrival position of the shuttle for the mounting head to pick up the entire chip as the missing chip is conveyed again by the shuttle, Chip mounting device.

[Claim 5 is abandoned upon payment of registration fee.]

5. The method of claim 4,
If it is determined by the image analysis unit that the entire chip is deviated from a predetermined position of the shuttle,
And calculates the offset correction value on the basis of a coordinate value moved by the mounting head in order to suck all of the chips in order to correct the offset of the pick-up head.

[Claim 6 is abandoned due to the registration fee.]

The method according to claim 1,
If it is determined by the image analysis unit that a part of the chip is deviated from a predetermined position of the shuttle,
A mounting head controller for sucking only the remaining chips that are seated in the predetermined position of the shuttle, and controlling the chips to be moved to a position of some of the chips separated from the predetermined position, The chip mounting apparatus further includes: