JP6301635B2 - Board inspection method - Google Patents

Description

  The present invention relates to a board inspection method for inspecting a board on which an electronic component is mounted. More specifically, the present invention inspects whether an electronic component accidentally dropped in an upstream component mounting process is present as a foreign matter on the board. On how to do.

  There are a solder printing device, a component mounting device, a reflow device, a substrate inspection device, and the like as a device for producing a substrate on which a large number of electronic components are mounted. It is common to construct a substrate production line by connecting these devices with a substrate transfer device. Here, there is a case where electronic components are mounted on the substrate in an overlapping manner. For example, a large component is double-mounted across a low-profile small component, or a shield component is mounted so as to cover a shielding target component. In such a case, after mounting a large part or a shield part, it is impossible to inspect a small part or a part to be shielded that has entered the lower side. In order to cope with this, a board inspection device is arranged between a component mounting device for mounting a small component or a shielding target component and a second component mounting device for mounting a large component or a shield component. It has been broken. In addition to inspecting mounted small parts and shielding target parts, this board inspection apparatus can inspect the presence / absence of foreign matter (foreign matter inspection) at the mounting positions of large parts and shield parts to be mounted in the future. Preferably it is.

  By the way, the substrate production line is generally constructed in a clean atmosphere such as a clean room having a dustproof function. For this reason, the foreign matter detected by the foreign matter inspection of the board inspection device is not an externally mixed one, but is often an electronic component that is accidentally dropped by the upstream component mounting device. In addition, the operational reliability of the component mounting apparatus has been remarkably improved in recent years, and electronic components are rarely dropped. Therefore, even if the foreign matter inspection is performed on all the substrates as an inspection object, there is no problem in most substrates. In consideration of such actual conditions, it is expected that productivity can be improved if the foreign substance inspection method can be improved.

  A technical example for inspecting the presence or absence of an electronic component dropped on a substrate is disclosed in Patent Document 1. In the electronic component mounting method according to claim 2 of Patent Document 1, it is determined whether or not an electronic component drop abnormality has occurred in the process of sequentially mounting electronic components on a printed circuit board by a suction nozzle. It is characterized in that a foreign object is inspected at mounting points before and after a drop abnormality. That is, the dropped electronic component is searched for the inspection target range in the range in which the suction nozzle may have dropped the electronic component while moving. Furthermore, claim 4 discloses a mode in which the electronic component mounting operation is stopped when it is determined that there is a foreign object.

JP 2010-258115 A

  By the way, in the technical example of patent document 1, since a foreign material inspection function is provided to a component mounting apparatus, apparatus cost rises significantly. In other words, the cost performance of the board production line can be improved if the foreign substance inspection is performed not by the component mounting apparatus but by the board inspection apparatus generally provided for inspecting the mounted electronic component. .

  Also, in the technical example of Patent Document 1, when an electronic component drop abnormality occurs, the mounting operation is stopped and a foreign object inspection is immediately performed. However, in this method, the production of the substrate is interrupted and the productivity is lowered. For this reason, even if the electronic component is accidentally dropped, the production of the substrate may be continued by mounting the next electronic component of the same type by the retry operation. In this case, the search for the dropped electronic component is left to the board inspection process on the downstream side. In practice, the dropped electronic component can be removed later unless it enters a mounting position where a large component or a shield component will be mounted.

  The present invention has been made in view of the above-mentioned problems of the background art, and even if an electronic component is dropped in the component mounting process, the substrate in which the electronic component is dropped is maintained while continuing to produce the substrate. It is an object to be solved to provide a substrate inspection method that increases productivity by inspecting for the presence or absence of foreign matter only in the substrate inspection process and contributes to improvement of cost performance of the substrate production line.

The invention of the board inspection method according to claim 1 that solves the above-described problem includes a component mounting step by the component mounting apparatus in a board production line that includes an upstream component mounting apparatus in the board transport direction and a downstream board inspection apparatus. In this step, the electronic component supplied from the component supply device is picked up by the suction nozzle of the component transfer device, transported to the mounting position on the substrate, and the mounted substrate is inspected in the substrate inspection process by the substrate inspection device. A method for inspecting a substrate, wherein the electronic component is dropped in the component mounting step, and when the fall is detected, the substrate is set as a foreign object inspection target substrate and the electronic component is continuously mounted. A substrate setting step, and an inspection execution step of inspecting the foreign substance inspection target substrate for the presence or absence of foreign substances by the substrate inspection apparatus.

  According to this, since the drop of the electronic component is monitored in the component mounting process, and only when the fall is detected, the corresponding board is set as the foreign object inspection target board, the next electronic component of the same type can be obtained by the retry operation. You can continue to produce the board. Further, in the substrate inspection process, it is only necessary to inspect the presence / absence of foreign matter by limiting to the target substrate for foreign matter inspection, so that the inspection can be made more efficient as compared with the case where foreign matter inspection is performed on all substrates in the prior art. Therefore, productivity can be improved in terms of both the continuation of board production in the component mounting process and the efficiency of inspection in the board inspection process.

  In addition, since the board inspection apparatus used for visual inspection of electronic components mounted in the board inspection process includes an inspection camera apparatus having a visual field range and resolution suitable for inspection, the inspection camera apparatus is also used for foreign object inspection. It's easy to do. On the other hand, a board recognition camera device generally provided in a component mounting apparatus has a limited field-of-view range and resolution because it only needs to be able to recognize an ID code that identifies a board or a fiducial mark that serves as a positioning reference. Not suitable for inspection. For this reason, as exemplified in Patent Document 1, in order to give a foreign substance inspection function to the component mounting device, it is necessary to remake the camera device and its peripheral portion, and the device cost is significantly increased. Therefore, according to the present invention, the substrate inspection apparatus for appearance inspection can be effectively used for foreign matter inspection, and the cost performance of the substrate production line is improved.

It is the front view which illustrated the line composition of the substrate production line which enforces the substrate inspection method of an embodiment. It is the top view which showed the detailed structure of the component mounting apparatus. It is a flowchart of the component mounting process implemented in a component mounting apparatus group. It is a flowchart of the board | substrate inspection process implemented with a board | substrate inspection apparatus.

  A substrate inspection method according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a front view illustrating a line configuration of a substrate production line 9 for performing the substrate inspection method of the embodiment. The substrate production line 9 is a dual lane type line that transports two substrates K in parallel. As shown in the figure, the board production line 9 includes a solder printing apparatus 1, a component mounting apparatus group 2, a board inspection apparatus 3, a post-process component mounting apparatus 4, and a reflow apparatus 5 in this order on the upstream side (in FIG. Lined from the left side to the downstream side (right side in FIG. 1). The arrangement direction of these five devices 1 to 5 coincides with the X-axis direction for transporting the substrate K.

  Substrate transport devices 61 to 66 for loading and unloading substrates are provided on the upstream side and the downstream side of the five devices 1 to 5, respectively. Also in the 5 devices 1 to 5, a substrate transport device (not shown) for transporting and positioning the substrate is provided. In addition, a host computer (not shown) that holds the production data of the substrate K and manages the production progress status of the five devices 1 to 5 is provided. The five devices 1 to 5 and the host computer are connected by communication, and production data, progress data and other data are exchanged via communication as necessary. The board production line 9 is capable of producing a board K on which a large part is double-mounted across a low-profile small part and a board K on which a shield part that covers a shield target part is mounted.

  The solder printing apparatus 1 prints paste-like solder on a predetermined position of the board K that has been loaded. The component mounting device group 2 is configured by arranging four component mounting devices 21 to 24 having the same configuration. Each of the component mounting apparatuses 21 to 24 is in charge of a component mounting process. Each component mounting apparatus 21 to 24 mounts an electronic component on the solder of the substrate K. The substrate inspection apparatus 3 is in charge of the substrate inspection process. The board inspection apparatus 3 performs an appearance inspection of electronic components mounted on the board K in the component mounting apparatus group 2. Further, as will be described later, the substrate inspection apparatus 3 performs an inspection for the presence or absence of foreign matter (foreign matter inspection) in conjunction with the appearance inspection for the foreign matter inspection target substrate. The substrate inspection apparatus 3 includes an inspection camera device having a visual field range and resolution suitable for inspection, and operates with visual inspection software and foreign matter inspection software.

  The post-process component mounting apparatus 4 takes charge of the second component mounting process. The post-process component mounting device 4 mounts a large component, a shield component, or the like on the substrate K that has been inspected by the substrate inspection device 3. The post-process component mounting apparatus 4 includes a tray-type component supply device that supplies large components and shield components. The reflow apparatus 5 carries in the board K on which electronic parts including large parts and shield parts are mounted. The reflow device 5 heats and re-melts the paste-like solder and then solidifies it by cooling to complete the mounting of the electronic component.

  Next, the detailed structure of the component mounting apparatuses 21 to 24 constituting the component mounting apparatus group 2 will be described. FIG. 2 is a plan view showing a detailed structure of the component mounting apparatuses 21 to 24. The component mounting devices 21 to 24 are configured by assembling a substrate transport device 71, component supply devices 72 and 73, a component transfer device 74, component camera devices 751 and 752, disposal boxes 761 and 762 and the like on a machine base 79. ing.

The substrate transport device 71 carries in, positions, and unloads the substrate K (shown with hatching in FIG. 2 for the sake of convenience) to the mounting position set at the center of the machine base 79. The substrate transfer device 71 includes a first substrate transfer lane 711 and a second substrate transfer lane 715 arranged in parallel on the machine base 79 . The first substrate transport lane 711 includes a pair of guide rails 712 and 713 extending in the X-axis direction in parallel and a pair of endless conveyor belts (not shown). The conveyor belt rotates along the guide rails 712 and 713 in a state where the substrate K is placed on the conveyor conveyance surface, and conveys the substrate K. Similarly, the second substrate transport lane 715 includes a pair of guide rails 716 and 717 and a pair of conveyor belts, and transports the substrate K.

  Clamp devices (not shown) are respectively provided below the conveyor belts at the mounting positions of the first substrate transfer lane 711 and the second substrate transfer lane 715. The clamp device pushes up the substrate K, clamps it in a horizontal posture, and positions it at the mounting position. Thereby, the component transfer device 74 can perform the mounting operation of the electronic component at the mounting position.

  The two component supply devices 72 and 73 sequentially supply electronic components to the component supply positions 725 and 735. The two component supply devices 72 and 73 are disposed so as to face each other on the front side and the rear side (the upper side and the lower side in FIG. 2) of the machine base 79 with the substrate transfer device 71 interposed therebetween. Each of the component supply devices 72 and 73 includes component supply stages 721 and 731 and a plurality of cassette type feeders 722 and 732. The component supply stages 721 and 731 are substantially rectangular and are detachably mounted on the upper surface of the machine base 79. Plural (18 strips in FIG. 2) slots are engraved on the upper surfaces of the component supply stages 721 and 731 in parallel with the Y-axis direction (vertical direction in FIG. 2). In each slot, narrow cassette type feeders 722 and 732 are detachably set.

  Each cassette type feeder 722, 732 includes main bodies 723, 733 and component supply reels 724, 734. The main bodies 723 and 733 have component supply positions 725 and 735 at their front ends, and support the component supply reels 724 and 734 in a rotatable manner on the rear side. The component supply reels 724 and 734 are wound with an elongated tape (not shown) in which electronic components are sealed at a predetermined pitch. The tape is fed out to the component supply positions 725 and 735 by a predetermined pitch by a tape feeding mechanism (not shown) provided in the main bodies 723 and 733. At the component supply positions 725 and 735, the electronic device is supplied by releasing the sealed state of the tape.

The component transfer device 74 sucks the electronic components supplied from the component supply devices 72 and 73 at the component supply positions 725 and 735, conveys them to the mounting position on the substrate K, and mounts them. The component transfer device 74 includes a Y-axis slider 741 (shown by a one-dot chain line), an X-axis slider 742 (shown by a one-dot chain line), a mounting head 743, a Y-axis rail, a Y-axis drive mechanism, and an X-axis drive mechanism that are not shown. It is configured. The Y-axis slider 741 is mounted on a Y-axis rail that extends in the Y-axis direction. The Y-axis slider 741 is driven in the Y-axis direction by the Y-axis drive mechanism. The X-axis slider 742 is mounted on the Y-axis slider 741. The X-axis slider 742 is driven in the X-axis direction by the X-axis drive mechanism. The mounting head 743 is disposed so as to move integrally with the X-axis slider 742. The mounting head 743 is driven at a position higher than the substrate K between the two component supply devices 72 and 73 in the X-axis direction and the Y-axis direction.

  The mounting head 743 includes a head body 744, a suction nozzle 745, a substrate recognition camera device 746, a nozzle camera device 747, a nozzle drive mechanism (not shown), a pneumatic control unit, and the like. On the lower side of the head main body 744, a suction nozzle 745 is provided downward. The suction nozzle 745 has a suction path inside. The open lower end of the suction path is a component suction portion that sucks electronic components. The suction nozzle 745 is moved up and down and rotated by a nozzle drive mechanism. The internal air pressure of the suction path of the suction nozzle 745 is controlled to a positive pressure and a negative pressure by the air pressure control unit.

  When the internal air pressure of the suction path is controlled to a negative pressure, the suction nozzle 745 sucks the electronic component to the component suction portion. Further, when the internal air pressure of the suction path is controlled to a positive pressure, the suction nozzle 745 moves the electronic component away from the component suction portion and mounts it on the substrate K. The air pressure control unit includes a negative pressure and a positive pressure generation unit, and at least one of a pressure sensor that measures the air pressure in the adsorption path and a flow rate sensor that measures the amount of air flowing through the adsorption path. The number of suction nozzles 745 may be one, or a plurality of suction nozzles 745 may be provided in a rotatable revolver.

  A substrate recognition camera device 746 and a nozzle camera device 747 are further provided below the head body 744. The board recognition camera device 746 captures an image of an ID code or a fiducial mark attached to the surface of the board K and acquires image data. By performing image processing on this image data, the type of the substrate K can be specified, and the exact coordinate position of the positioned substrate K can be detected. Then, the X-axis and Y-axis coordinate values on the substrate K are calibrated, and the position control of the suction nozzle 745 to the mounting position is performed accurately. The nozzle camera device 747 captures an image of the component suction portion at the lower end of the suction nozzle 745 from the side, and acquires image data including the sucked electronic component. The applicant of the present application has already disclosed a nozzle camera device 747 having a plurality of suction nozzles 745 in Japanese Patent No. 5253540.

  The nozzle camera device 747 and the air pressure control unit can separately monitor whether the suction nozzle 745 drops the electronic component by mistake. More specifically, the nozzle camera device 747 acquires image data by imaging from the side when the suction nozzle 745 is positioned at a predetermined height. Therefore, whether or not the suction nozzle 745 is sucking an electronic component to the component suction portion can be easily determined by performing image processing on the image data. Further, the internal air pressure and the air flow rate of the suction path are different between the case where the suction nozzle 745 sucks the electronic component in the component suction portion and the case where the suction portion does not suck the electronic component. Therefore, the fall of the electronic component can be detected by at least one of the pressure sensor and the flow rate sensor of the air pressure control unit. Further, if the nozzle camera device 747 and the air pressure control unit are used together to monitor the drop of the electronic component, the detection accuracy is further improved.

  The two component camera devices 751 and 752 are provided upward on the upper surface of the machine base 79 between the substrate transfer device 71 and the two component supply devices 72 and 73, respectively. The component camera devices 751 and 752 capture the picked-up electronic components and acquire image data while the suction nozzle 745 moves from the component supply devices 72 and 73 onto the substrate K. If the image processing of the image data reveals an error in the posture of the electronic component attracted or a shift in the rotation angle, the mounting operation of the component transfer device 74 is finely adjusted as necessary. Of course, according to the image data of the component camera devices 751 and 752, it can be determined whether or not the suction nozzle 745 is sucking the electronic component.

  The two disposal boxes 761 and 762 are disposed adjacent to the component camera devices 751 and 752, respectively. The disposal boxes 761 and 762 accommodate electronic components to be discarded. For example, when the suction nozzle 745 picks up an electronic component, the posture in which the electronic component is sucked may be determined to be defective based on the image data of the component camera devices 751 and 752. In this case, since it is difficult to mount the electronic component on the board K, it is discarded in the discard boxes 761 and 762.

  Next, the substrate inspection method of the embodiment will be described. The board inspection method of the embodiment is carried out in cooperation with the component mounting apparatus group 2 in charge of the component mounting process and the board inspection apparatus 3 in charge of the board inspection process. FIG. 3 is a flowchart of a component mounting process performed by the component mounting apparatus group 2. FIG. 4 is a flowchart of a substrate inspection process performed by the substrate inspection apparatus 3.

  In the component mounting process of the component mounting apparatus group 2 in FIG. 3, the period from the start of the component mounting loop in step S1 to the end of the component mounting loop in step S13 is repeated by the number of electronic components to be mounted on the board K. At this time, the type and number of electronic components to be mounted by the component mounting apparatuses 21 to 24, the number of suction nozzles 745 included in the component mounting apparatuses 21 to 24, and the like are not limited. In step S2, first, the suction nozzle 745 of the component transfer device 74 is driven to the component supply positions 725 and 735 of the component supply devices 72 and 73 to suck the electronic components.

  Next, in step S3, it is determined whether or not the electronic component has been successfully attracted. This determination can be performed using at least one of the nozzle camera device 747 and the air pressure control unit described above. If an electronic component is missing at a predetermined position on the tape of the component supply reels 724 and 734, the suction nozzle 745 cannot suck the electronic component. At this time, the process returns to step S2, and the suction nozzle 745 sucks the electronic component again after the component supply devices 72 and 73 have fed out the tape. If an electronic component is present at a predetermined position on the tape but cannot be sucked, the process returns to step S2 to suck the electronic component again. In the latter case, the electronic component is dropped. However, since the component supply positions 725 and 735 are away from the substrate K, there is little concern that the dropped electronic component reaches the substrate K. If the electronic component has been successfully attracted in step S3, the process proceeds to step S4.

  In step S4, the suction nozzle 745 stops above or passes above the component camera devices 751 and 752 while the electronic component is being transported to the mounting position of the substrate K. The component camera devices 751 and 752 capture the electronic component sucked by the suction nozzle 745 and acquire image data. This image data is subjected to image processing. In step S5, the presence / absence of an electronic component is determined based on the image processing result. When an electronic component is not found in the component suction portion of the suction nozzle 745, the process proceeds to step S6, and when found, the process proceeds to step S7.

  In step S6, the substrate K is set as a foreign object inspection target substrate. This is because it can be estimated that the electronic component is accidentally dropped while the suction nozzle 745 moves from the component supply positions 725 and 735 to above the component camera devices 751 and 752. This is because there is a concern that the dropped electronic component may reach the substrate K at a moving speed. After step S6, the process returns to step S2.

  In step S7, the suction nozzle 745 is driven to the mounting position of the substrate K and then descends to mount the electronic component. In the next step S8, it is determined whether the electronic component has been accidentally dropped during the mounting operation. This determination can be performed using at least one of the nozzle camera device 747 and the air pressure control unit, as in step S3. When it is detected that the electronic component has fallen, the electronic component is not mounted on the substrate K, and there is a concern that the electronic component is falling on the substrate K, so the process joins step S6.

  If no drop of the electronic component is detected in step S8, the process proceeds to step S9, and the suction nozzle 745 is raised. In the next step S10, it is determined whether or not the raised suction nozzle 745 is brought back without mounting the electronic component on the substrate K. When the suction nozzle 745 brings back the electronic component for some reason, the electronic component is not necessary, and the process proceeds to step S11.

  In step S <b> 11, the suction nozzle 745 is driven to the disposal boxes 761 and 762 to separate and discard the attracted electronic components. In the next step S12, it is determined whether an electronic component has been accidentally dropped during the movement to the disposal boxes 761 and 762 and during the disposal operation. This determination can be performed using at least one of the nozzle camera device 747 and the air pressure control unit, similarly to step S3 and step S8. When a drop of an electronic component is detected, the electronic component is not mounted on the substrate K and is not in the disposal boxes 761 and 762, and there is a concern that the electronic component is falling on the substrate K. , Merges into step S6.

  In step S12, when the falling of the electronic component is not detected, it can be estimated that the electronic component is discarded in the discard boxes 761 and 762. That is, there is no concern that the electronic component has fallen on the substrate K, but the electronic component is not mounted on the substrate K. Accordingly, the process returns to step S2 without going through step S6.

  If the electronic component has not been taken home in step S10, the suction nozzle 745 has successfully completed the mounting operation. In this case, the flow relating to the electronic component is terminated in step S13, and the process returns to step S1 to shift to mounting of the next electronic component. On the other hand, when returning from step S6 and step S12 to step S2, a retry operation is performed, and the electronic components of the same component type that have been dropped or discarded are adsorbed.

  In the component mounting process of FIG. 3, only when there is a concern that an electronic component that has been accidentally dropped is falling on the substrate K, the substrate K is set as a foreign object inspection target substrate. Step S5, step S6, step S8, and step S12 in FIG. 3 correspond to the inspection board setting step of the present invention in which the board is set as a foreign object inspection target board when the fall of the electronic component is detected. Information indicating that the substrate K has been set as the foreign object inspection target substrate is notified to the downstream substrate inspection apparatus 3 in accordance with the conveyance of the substrate K.

  In the substrate inspection process of the substrate inspection apparatus 3 of FIG. 4, first, the substrate K is carried into the substrate inspection apparatus 3 by the substrate transfer apparatus 63 in step S31. At this time, the substrate inspection apparatus 3 is also notified whether or not the substrate K is set as a foreign object inspection target substrate. Next, in step S32, the appearance inspection of the electronic components already mounted by the component mounting apparatus group 2 is performed on all the substrates K as inspection targets. Next, in step S33, it is determined whether or not a foreign object inspection target board is set. If there is no setting, the substrate inspection process for the substrate K is terminated without performing the foreign substance inspection. Thereby, the board | substrate K is carried out toward the post process component mounting apparatus 4, and a subsequent process is implemented.

  When the foreign substance inspection target substrate is set in step S33, the process proceeds to step S34, and the foreign substance inspection is performed. At this time, it is not necessary to set the entire surface of the foreign object inspection target substrate as the foreign object inspection target region, and an area in which the influence may be caused when there is a dropped electronic component may be set as the foreign object inspection target region. In the embodiment, the foreign object inspection target region is set in consideration of a predetermined margin at the mounting position of the large component or shield component mounted by the post-process component mounting apparatus 4. Note that various known methods, generally a method using image processing, can be applied to the foreign substance inspection implementation method.

  In the next step S35, the inspection result of the foreign substance inspection is referred to, and when no foreign substance exists, the substrate inspection process for the substrate K is finished. On the other hand, when there is a foreign object, the operator is notified of the detection of the foreign object in step S36. This eliminates the risk that the post-process component mounting apparatus 4 mounts a large component or shield component in an area where foreign matter on the board K (in other words, an electronic component dropped by the component mounting apparatus group 2) exists. it can.

  Step S34 in FIG. 4 corresponds to an inspection execution step of the present invention in which the substrate inspection apparatus 3 inspects the foreign object inspection target substrate for the presence or absence of foreign objects. Further, in step S34 in FIG. 4, setting the foreign object inspection target region in consideration of a predetermined margin at the mounting position of the large component or shield component mounted by the post-process component mounting apparatus 4 is the inspection region of the present invention. This corresponds to the setting step.

  In the substrate inspection method according to the embodiment, the electronic component supplied from the component supply devices 72 and 73 in the component mounting process is sucked by the suction nozzle 745 of the component transfer device 74 and conveyed to the mounting position on the substrate K and mounted. Is a substrate inspection method for inspecting by a substrate inspection apparatus 3 in a substrate inspection process, and monitoring a drop of an electronic component in a component mounting process. An inspection board setting step (step S5, step S6, step S8, and step S12) to be set, and an inspection execution step (step S34) for inspecting the foreign substance inspection target board for the presence or absence of foreign substances by the board inspection apparatus 3. Have.

  According to this, the component mounting apparatus group 2 in charge of the component mounting process monitors the drop of the electronic component, and when the drop is detected, the board is simply set as the foreign object inspection target board. For this reason, in the component mounting apparatus group 2, the next electronic component of the same type can be mounted by the retry operation, and the production of the board can be continued. In addition, since the substrate inspection apparatus 3 in charge of the substrate inspection process only needs to inspect the presence or absence of foreign matter only on the substrate subject to foreign matter inspection, it is inspected compared to the case where foreign matter inspection is performed on all substrates using the conventional technology. Can be made more efficient. Therefore, productivity can be improved in terms of both the continuation of board production in the component mounting process and the efficiency of inspection in the board inspection process.

  Further, the board inspection apparatus 3 used for the appearance inspection of the electronic components already mounted in the board inspection process includes an inspection camera apparatus having a field of view range and resolution suitable for inspection. Therefore, the inspection camera apparatus is used for foreign object inspection. It is easy to use both. On the other hand, the board recognition camera device 746 that is generally provided in the component mounting apparatuses 21 to 24 only needs to be able to recognize an ID code that identifies the board K, a fiducial mark that serves as a positioning reference, and the like, and thus has a limited field of view range and resolution. It is not suitable for foreign matter inspection. For this reason, as exemplified in Patent Document 1, in order to provide the foreign material inspection function to the component mounting devices 21 to 24, it is necessary to remake the camera device and its peripheral portion, which greatly increases the device cost. . Therefore, according to the present embodiment, the substrate inspection apparatus 3 for visual inspection can be effectively used for foreign matter inspection, and the cost performance of the substrate production line 9 is improved.

  Furthermore, the substrate inspection method according to the embodiment includes an inspection region setting step (step S34) for setting a region in which the influence is concerned when there is an electronic component dropped on the surface of the substrate for foreign object inspection as a foreign object inspection target region. In addition, in the inspection execution step, the substrate inspection apparatus 3 inspects the foreign object inspection target area of the foreign object inspection target substrate for the presence or absence of foreign objects.

  According to this, since only a part of the surface of the foreign object inspection target substrate is set as the foreign object inspection target region, the time required for the foreign object inspection can be shortened, and the productivity can be improved accordingly.

  Furthermore, in the board inspection method of the embodiment, in the inspection area setting step, the foreign object inspection target area is mounted by the post-process component mounting apparatus 4 in charge of the component mounting process and the second component mounting process after the board inspection process. The mounting position of a specific large component or shield component is set in consideration of a predetermined margin.

  According to this, foreign object inspection can be performed in advance with the mounting position of a large component or shield component that is difficult to inspect after mounting the component as an inspection target region. Therefore, there is no risk of mounting a large component or a shield component in a state where an electronic component accidentally dropped on the upstream side is sandwiched below, and the quality and reliability of the substrate to be produced are improved.

  Further, in the board inspection method of the embodiment, in the inspection board setting step, the electronic component drop is monitored by the suction nozzle 745 in the middle of picking up the electronic component by the component supply devices 72 and 73 and transporting it to the mounting position. When picking up the picked-up state of the parts with the parts camera devices 751 and 752, when picking up the electronic parts at the pick-up position of the pick-up nozzle 745, and discarding the electronic parts that the pick-up nozzle 745 is not attached at the pick-up position 761, This process is performed when transporting to 762 and discarding.

  According to this, when there is a concern that an electronic component that has been accidentally dropped on the upstream side is falling on the substrate K, the setting of the substrate to be inspected for foreign matter can be performed reliably, and when there is no concern, the setting is made. Not performed. In other words, since the foreign substance inspection can be performed on the minimum necessary substrate, the productivity is greatly improved.

  Furthermore, in the substrate inspection method of the embodiment, in the inspection substrate setting step, the electronic component fall is monitored by a method of image processing the image data acquired by imaging the suction nozzle 745 and the internal air pressure of the suction nozzle 745. It is based on at least one of the methods for detecting the operation status of the pneumatic control unit to be controlled.

  According to this, the fall of an electronic component can be detected by a highly reliable method. Furthermore, if both methods are used in combination to monitor the fall of the electronic component, the detection accuracy is further improved.

  Further, in the substrate inspection method of the embodiment, in the inspection execution step, the appearance inspection of the mounted electronic components is performed with all the substrates as inspection targets, and the foreign object inspection target substrate is checked for the presence or absence of foreign matters along with the appearance inspection. Conduct an inspection.

  According to this, the board inspection apparatus 3 for appearance inspection can be effectively used for foreign substance inspection, and the cost performance of the board production line 9 is improved.

  In step S3 in FIG. 3, the foreign substance inspection target board may be set also when there is a concern about the electronic component falling from the component supply positions 725 and 735 of the component supply devices 72 and 73. Further, in step S34 in FIG. 4, the foreign matter inspection may be performed using the entire surface of the foreign matter inspection target substrate as the inspection target region. In addition to the above, the flowcharts of FIGS. 3 and 4 can be applied as appropriate.

Furthermore, the foreign substance inspection is not limited to the substrate inspection apparatus 3 described in the embodiment, and may be performed by another apparatus. For example, instead of the component mounting device 24 on the most downstream side of the component mounting device group 2, a dual head type composite device having a mounting head and an inspection head may be arranged. In this aspect, the foreign matter inspection can be performed with the inspection head after the mounting operation is completed with the mounting head of the composite apparatus. Further, for example, instead of the post-process component mounting device 4 , a dual head type composite device having an inspection head and a mounting head may be used. In this aspect, after the foreign substance inspection is completed with the inspection head of the composite apparatus, the large-sized component and the shield component can be mounted with the mounting head. In addition to the above, the substrate production line 9 can be modified as appropriate. Various other applications and modifications are possible for the present invention.

1: Solder printing device 2: Component mounting device group 21-24: Component mounting device 3: Board inspection device 4: Post-process component mounting device 5: Reflow device 61-66: Substrate transport device 71: Substrate transport device 72, 73: Component supply device 74: Component transfer device 745: Suction nozzle 747: Nozzle camera device 751, 752: Component camera device 761, 762: Waste box 9: Substrate production line K: Substrate

Claims (6)

In a board production line including an upstream component mounting apparatus and a downstream board inspection apparatus in the board transport direction, the electronic component supplied from the component supply apparatus in the component mounting process by the component mounting apparatus is adsorbed by the component transfer apparatus. A substrate inspection method for performing an inspection in a substrate inspection process by the substrate inspection apparatus , with a substrate mounted by being sucked by a nozzle and transported to a mounting position on the substrate as an inspection target,
An inspection board setting step for monitoring the fall of the electronic component in the component mounting process, setting the board as a foreign object inspection target board when the fall is detected , and continuing the mounting of the electronic component ;
A substrate inspection method comprising: performing an inspection for the presence or absence of foreign matter on the foreign matter inspection target substrate by the substrate inspection apparatus. An inspection region setting step of setting a region in which the influence of the electronic component that has fallen out of the surface of the substrate to be inspected for foreign matter is concerned as a foreign object inspection target region;
2. The substrate inspection method according to claim 1, wherein in the inspection execution step, the substrate inspection apparatus inspects the presence / absence of a foreign matter in the foreign matter inspection target region of the foreign matter inspection target substrate.   In the inspection area setting step, the foreign object inspection target area is set in consideration of a predetermined margin at a mounting position of a specific electronic component to be mounted in the second component mounting process after the component mounting process and the board inspection process. The substrate inspection method according to claim 2. In the inspection board setting step, the monitoring of the drop of the electronic component is as follows:
When the suction nozzle picks up the electronic component by the component supply device and picks up the electronic component with the component camera device while it is transported to the mounting position.
When the suction nozzle mounts the electronic component at the mounting position; and
The substrate inspection method according to claim 1, wherein the substrate inspection method is performed at least one time when an electronic component that has not been mounted at the mounting position by the suction nozzle is transported to a disposal box and discarded.   In the inspection board setting step, the electronic component falling is monitored by a method of performing image processing on image data acquired by imaging the suction nozzle and an operation state of an air pressure control unit that controls the internal air pressure of the suction nozzle. The board | substrate inspection method as described in any one of Claims 1-4 by at least 1 method of the method to detect.   2. In the inspection execution step, an appearance inspection of mounted electronic components is performed on all substrates as inspection targets, and the presence / absence inspection of the foreign matter is performed on the foreign object inspection target substrate in conjunction with the appearance inspection. The board | substrate inspection method as described in any one of -5.

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