JP5155217B2 - Electronic component mounting device - Google Patents

Description

  In the present invention, electronic components stored in a storage tape or the like are sequentially supplied to an extraction position, and the electronic components supplied to the extraction position are extracted by a suction nozzle provided in a mounting head and mounted on a printed circuit board. The present invention relates to a component mounting apparatus.

  Such an electronic component mounting apparatus is disclosed in Patent Document 1, for example. If an abnormality occurs in the component supply unit with respect to the electronic component feeding operation, such as when the electronic component cannot be normally supplied to the take-out position, the production operation of the printed circuit board of the apparatus is stopped, and the abnormality Depending on the type, the parts supply unit was removed from the feeder base and the removal position was checked to correct the abnormality.

JP 2005-109119 A

  However, unless the component supply unit in which the abnormality occurred was removed from the feeder base, it was not possible to make corrections by checking the electronic component extraction position, etc. Caused an increase in the downtime of the electronic component mounting apparatus, which caused the production efficiency to deteriorate.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to shorten the work time for repairing / correcting a component supply unit in which an abnormality has occurred and to improve the production efficiency of a printed circuit board.

For this reason, according to the first aspect of the present invention, the electronic components stored in the storage tape with a predetermined interval are sequentially supplied to the extraction position by intermittently sending the storage tape for the predetermined interval, and the electronic component is supplied to the extraction position. In the electronic component mounting method in which the suction nozzle provided in the mounting head is taken out and mounted on the printed circuit board,
When an abnormality occurs in the component supply unit regarding the electronic component feeding operation, the fact that the abnormality has occurred in this component supply unit is stored,
The camera images the take-out position of the component supply unit in which the abnormality has occurred after mounting the electronic component on the printed circuit board,
An image relating to the imaged abnormality is displayed, and whether the storage tape is to be sent for the predetermined interval or not to be sent at the next suction is input from an input means provided in the screen .

According to a second aspect of the present invention, the electronic components stored in the storage tape with a predetermined interval are sequentially supplied to the extraction position by intermittently sending the storage tape by the predetermined interval, and the electronic component is supplied to the extraction position. In the electronic component mounting method in which the suction nozzle provided in the mounting head takes out the electronic component and mounts it on the printed circuit board.
When an abnormality occurs in the component supply unit regarding the electronic component feeding operation, the fact that the abnormality has occurred in this component supply unit is stored,
The suction nozzle provided in the mounting head takes out an electronic component,
Mount the electronic component of the suction nozzle that holds the electronic component in this mounting head on the printed circuit board,
The camera images the take-out position of the component supply unit in which the abnormality has occurred after this mounting,
An image relating to the imaged abnormality is displayed, and whether the storage tape is to be sent for the predetermined interval or not to be sent at the next suction is input from an input means provided in the screen .

According to a third aspect of the present invention, the electronic components stored in the storage tape with a predetermined interval are sequentially supplied to the extraction position by intermittently sending the storage tape by the predetermined interval, and the electronic component is supplied to the extraction position. In the electronic component mounting method in which the suction nozzle provided in the mounting head takes out the electronic component and mounts it on the printed circuit board.
When a suction abnormality occurs by detecting the suction state of the electronic component supplied from the component supply unit and taken out by the suction nozzle of the mounting head and held by suction, the fact that the suction abnormality has occurred is stored.
Attach the electronic components of all the suction nozzles that hold the electronic components in this mounting head to the printed circuit board,
The camera images the take-out position of the component supply unit in which the suction abnormality has occurred after this mounting,
The picked-up image relating to the suction abnormality is displayed, and at the time of the next suction, whether the storage tape is to be sent for the predetermined interval or not is input from an input means provided in the screen .

According to a fourth aspect of the present invention, the electronic components stored in the storage tape with a predetermined interval are sequentially supplied to the extraction position by intermittently sending the storage tape by the predetermined interval, and supplied to the extraction position. In the electronic component mounting method in which a plurality of suction nozzles provided on the mounting head are taken out and mounted on the printed circuit board,
Abnormal suction occurred when an electronic component supplied from the component supply unit and taken out by the suction nozzle of the mounting head and picked up and held was picked up and recognized by the component recognition camera, and there was no electronic component. Remember that
Attach the electronic components of all the suction nozzles that hold the electronic components in this mounting head to the printed circuit board,
The camera images the take-out position of the component supply unit in which the suction abnormality has occurred after this mounting,
The picked-up image relating to the suction abnormality is displayed, and at the time of the next suction, whether the storage tape is to be sent for the predetermined interval or not is input from an input means provided in the screen .

  A fifth invention is characterized in that, in the inventions according to claims 1 to 4, the production operation of the printed circuit board is stopped after the image is displayed.

  The sixth invention is characterized in that, when storing the occurrence of the suction abnormality, it is stored that an abnormality has occurred when the number of abnormalities reaches a set number.

  The present invention can shorten the work time for repairing / correcting a component supply unit in which an abnormality has occurred, thereby improving the production efficiency of a printed circuit board.

The top view of an electronic component mounting apparatus is shown. It is a control block diagram. It is the longitudinal cross-sectional view of the components supply unit typically represented and the principal part. It is a figure which shows a flowchart. It is a figure which shows an abnormal screen. It is a figure which shows a flowchart. It is a figure which shows the imaging screen of the winding-up abnormality state of a cover tape. It is a longitudinal cross-sectional view of the principal part of the component supply unit of the abnormal state of winding of a cover tape. It is a longitudinal cross-sectional view of the principal part of the component supply unit of a cover tape cutting | disconnection abnormal state. It is a figure which shows the imaging screen of a cover tape piece abnormal state. It is a figure which shows the imaging screen of the state in which the electronic component fell on the storage tape.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1, and component supply devices 3A, 3B, 3C, and 3D are divided into four blocks on the front and rear of the apparatus main body 2 of the electronic component mounting apparatus 1, and a plurality of them are arranged in parallel. It is installed. The component supply device 3A has a lane number (component supply unit arrangement number) in the 100s, the component supply device 3B has a lane number in the 200s, and the component supply device 3C has a lane number in the 300s. 3D has lane numbers in the 400s.

  Each of the component supply devices 3A, 3B, 3C, and 3D has a large number of component supply units 5 arranged in parallel on a feeder base of a cart base that is a mounting base. When the cart base is properly attached to the apparatus main body 2, power is supplied to the component supply unit 5 mounted on the cart base so as to face the road. Further, when the connector is released and the handle is pulled, it can be moved by a caster provided on the lower surface. When the sensor detects that the cart base is properly attached to the apparatus main body 2, the feeder base is provided so as to be lifted and lowered by the drive source.

  Each of the component supply devices 3A, 3B, 3C, and 3D is disposed so that the tip of the component supply side faces the pickup area of the mounting head 6, and each component supply unit 5 is freely rotatable on the cart table. Rotate a feed sprocket whose teeth are fitted into feed holes opened at predetermined intervals to a storage tape that is sequentially wound in a state of being wound around a supply reel placed on the supply reel, and the storage tape is picked up and picked up by electronic components. To remove the cover tape from the carrier tape in front of the component suction and take-out position by driving the tape feed mechanism intermittently fed by the feed motor (servo motor) 17 to the position and driving of the peeling motor 18 (servo motor). The cover tape is peeled off by the cover tape peeling mechanism and formed on the carrier tape at predetermined intervals. Can be taken out by the suction nozzle 29 to be described later from the tip of the electronic part loaded in the pay portion Cb are sequentially supplied to the component pickup removal position.

  As shown in FIG. 3, the storage tape C fed out from the supply reel is fed into the component suction / removal position so as to dive under the suppressor 30. The suppressor 30 is provided with a pickup outlet 31 for pickup by the suction nozzle 29. A slit 32 is formed in the suppressor 30, and the cover tape Ca of the storage tape C is peeled off from the slit 32 and stored in a cover tape storage section provided in the component supply unit 5. That is, the electronic component mounted on the storage tape C is sent to the component suction / extraction position with the cover tape Ca peeled off, and is picked up by the suction nozzle 29 through the extraction port 31.

  Between the front-side component supply devices 3B and 3D and the rear-side component supply devices 3A and 3C, there are two supply conveyors, positioning units 8 and 8 (having a conveyor) that constitute the substrate transport mechanism, and discharge. A conveyor is provided. Each supply conveyor transports each printed circuit board P received from upstream to each positioning unit 8, and after each electronic component is mounted on each substrate P positioned by a positioning mechanism (not shown) in each positioning unit 8, It is transported to each discharge conveyor and then transported to the downstream device.

  Each beam 10 that moves along the guide rail 9 by the Y-axis drive motor 11 in the Y direction is provided with a mounting head 6 that is moved by the X-axis drive motor 13 in the longitudinal direction, that is, in the X direction. Are provided with a plurality of suction nozzles. The mounting head 6 is equipped with a vertical axis drive motor 14 for moving the suction nozzle up and down, and a θ-axis drive motor 15 for rotating around the vertical axis. Therefore, the suction nozzle of the mounting head 6 can move in the X direction and the Y direction, can rotate about the vertical axis, and can move up and down.

  A component recognition camera 12 images the electronic component from below in order to recognize the position of the electronic component with respect to the suction nozzle and how much the electronic component is sucked and held with respect to the XY direction and the rotation angle. Reference numeral 19 denotes a board recognition camera provided on the mounting head 6 for picking up an image of a mark attached to the printed board P.

  Next, the control block diagram of FIG. 2 will be described. The electronic component mounting apparatus 1 includes a CPU (Central Processing Unit) 20 as a control apparatus that performs overall control of the mounting apparatus 1, and a bus line connected to the CPU 20. RAM (Random Access Memory) 21 and ROM (Read Only Memory) 22 are provided. The CPU 20 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 22 based on the data stored in the RAM 21. That is, the CPU 20 controls the drive of the Y-axis drive motor 11, the X-axis drive motor 13, the vertical axis drive motor 14, the θ-axis drive motor 15 and the like via the interface 24 and the drive circuit 27 and each component supply unit. 5 is controlled. In FIG. 3, for convenience of explanation, even though there are a plurality of them, for example, the mounting head 6 and the component supply unit 5 are omitted as one.

  The RAM 21 stores mounting data for each type of printed circuit board P related to component mounting. For each mounting order (step number), the X direction (indicated by X) in the printed circuit board P, Y Information on the direction (indicated by Y) and angle (indicated by Z), the arrangement number information of each component supply unit 5, and the like are stored.

  The RAM 21 stores information on the types (component IDs) of electronic components corresponding to the component supply unit arrangement numbers (lane numbers) of the component supply units 5 for each type of the printed circuit boards P, that is, component arrangement information. This component arrangement information is data relating to which component supply unit 5 is mounted at which position on the cart table. Further, component library data relating to the characteristics of the electronic component is stored for each component ID.

  A recognition processing device 23 is connected to the CPU 20 via the interface 24. The recognition processing device 23 performs recognition processing of an image captured by the component recognition camera 12, and the processing result is sent to the CPU 20. Is sent out. That is, the CPU 20 outputs an instruction to the recognition processing device 23 so as to perform recognition processing (calculation of misalignment amount) on the image captured by the component recognition camera 12 and receives the recognition processing result from the recognition processing device 23. It is.

  Reference numeral 25 denotes a monitor for displaying a part image and a screen for setting various data. The monitor 25 is provided with various touch panel switches 26 as input means. Can be set.

  Reference numeral 28 denotes a line sensor for detecting the presence / absence of a component. The line sensor 28 has a projector 28A that emits a light beam that goes straight in the horizontal direction and a large number of CCD elements arranged in a vertical line so that the light beam can be received. The optical receiver 28 </ b> B is provided and provided in the mounting head 6, but may be provided in the apparatus main body 2. The projector 28A may collect the light of the LED with a lens and emit a light beam that travels in parallel, or may use a laser. About 1000 CCD elements are juxtaposed in a vertical width of about 10 mm, and the light receiver 28B can be realized. Each CCD element can detect the amount of light received, and can be used as an ON / OFF sensor by determining the threshold of the amount of light received, and the portion shielded from light by the electronic component D by the ON / OFF output is thick. It is possible to detect the presence or absence of a component sucked by the suction nozzle 29, or to detect a suction abnormality that is a so-called standing state or oblique suction state without being normally sucked by a surface that should not be sucked. it can.

  It should be noted that the suction operation for picking up the electronic component by the suction nozzle 29 is performed, and when the suction abnormality occurs, the A counter 35 for counting the number of times of occurrence or the component recognition camera 12 takes an image and the recognition processing device 23. The B counter 36 is provided for each component supply unit 5 for counting the number of occurrences of no component when it is recognized that the electronic component is not adsorbed by the adsorption nozzle 29, that is, when there is no component.

  The component supply unit 5 that intermittently feeds the storage tape C by the feed motor 17 includes a CPU 38, a RAM 39, and a ROM 40. Reference numeral 16 denotes a drive circuit connected to the CPU 38 via an interface 41. The CPU 38 controls the feed motor 17 and the peeling motor 18 via the drive circuit 16. The CPU 38 provided in the component supply unit 5 is connected to the CPU 20 provided in the electronic component mounting apparatus main body 1 via the interfaces 41 and 24.

  With the above configuration, when the electronic component mounting apparatus 1 is automatically operated, the operation shown in the flowchart of FIG. 4 is performed. First, the printed circuit board P is moved from the upstream apparatus via the supply conveyor to the positioning unit 8. Are positioned and fixed by a positioning mechanism.

  In the component supply unit 5, the CPU 38 performs an initialization process and outputs a ready signal to the CPU 20 of the electronic component mounting apparatus main body 1, so that the component supply unit 5 can feed the storage tape C. The electronic component mounting apparatus main body 1 is notified.

  The CPU 20 outputs a feed signal in order to control the component feeding operation of the component supply unit 5 based on the mounting data stored in the RAM 21. The CPU 38 receiving this feed signal stops the output of the ready signal, turns the feed motor 17 into the servo-on state (energized state) via the drive circuit 16, and performs the parts feed operation of the storage tape C. Then, the drive of the feed motor 17 is started and the sprocket is intermittently rotated by a predetermined angle in the feed direction, whereby the storage tape C is intermittently fed through the feed hole.

  When this tape feeding mechanism is driven, the peeling motor 18 of the cover tape peeling mechanism is driven in synchronism with this, and the cover tape Ca is peeled (peeled) for one intermittent feed. Subsequently, when the tape feeding mechanism and the cover tape peeling mechanism are stopped, the electronic component D sent to the component suction / extraction position is stopped. Then, the electronic component D is picked up via the pickup outlet 31 by the suction nozzle 29, and the next intermittent feeding of the storage tape C and the peeling of the cover tape Ca are performed again.

  Even when the servo is off (the feed motor 17 is not energized, that is, the feed motor 17 is de-energized), the position of the feed motor 17 is monitored by the encoder monitoring. The regular position feed is established by adding the deviation at the servo-off time to the fixed rotation, and the positioning control of the feed motor 17 is maintained until the component suction is completed. Similarly, with respect to the peeling motor 18, the position of the peeling motor 18 is monitored by an encoder.

  When the feed motor 17 is rotated by a predetermined angle by the encoder, the CPU 38 outputs a ready signal to the CPU 20 of the electronic component mounting apparatus body 1 based on the signal from the encoder, and the component supply unit 5 feeds the storage tape C. When the electronic component mounting apparatus main body 1 informs the electronic component mounting apparatus main body 1 that the operation is possible and the CPU 20 inputs a ready signal, the CPU 20 moves the mounting head 6 to face the component supply unit 5. The suction nozzle 29 is lowered to pick up and take out the electronic component at the component picking up position.

  However, with regard to the electronic component feeding operation described above, when no abnormal feeding occurs in the component supply unit 5, the electronic component D is sucked and taken out by the suction nozzle 29 via the take-out port 31. More specifically, the suction nozzle of the mounting head 6 moves so as to be positioned above the component supply unit 5 that stores the electronic components to be mounted in accordance with the mounting sequence. In the X direction, the X-axis drive motor 13 is driven and the mounting head 6 is moved. Since the predetermined component supply unit 5 is already in the component pick-up position, the vertical axis drive motor 14 Lowers the suction nozzle to suck and take out the electronic components, and then the suction nozzle 29 rises.

  With regard to the electronic component feeding operation, when a feeding abnormality occurs in the component supply unit 5, the abnormality flag is turned on and the fact that the abnormality has occurred in the component feeding unit 5 is stored in the RAM 21. Until the electronic components to be sucked by the plurality of suction nozzles 29 are all sucked, the above-described feeding and sucking operations of the electronic components are repeated. Since this feed abnormality will be described later, a description thereof is omitted here.

  In this case, when the suction nozzle 29 picks up and picks up the electronic component, the presence or absence of the electronic component D sucked and held by the suction nozzle 29 by the line sensor 28 is detected, or the surface that should not be picked up is picked up and not picked up normally. Thus, the above-described feeding and suction of the electronic components are performed until all of the electronic components to be sucked to the plurality of suction nozzles 29 of the mounting head 6 are sucked if the abnormal suction is detected in the so-called standing state or oblique suction state. The take-out operation is repeated.

  When the suction abnormality is detected, the count value of the A counter 35 corresponding to the component supply unit 5 in which the abnormality has occurred is incremented by “1”, and the CPU 20 determines whether or not the abnormal number set value has been exceeded. For example, if the abnormal number set value set to “twice” has not been reached, the above operation is repeated until all the electronic components to be sucked by the plurality of suction nozzles 29 of the mounting head 6 are sucked. At this time, when the abnormality count set value is reached, if an abnormality occurs in the component supply unit 5 regarding the electronic component feeding operation, the abnormality flag is turned ON to indicate that the abnormality has occurred in the component supply unit 5. The above operation is repeated until all the electronic components to be sucked by the plurality of suction nozzles 29 of the mounting head 6 are sucked.

  When all of the electronic components to be sucked by the plurality of suction nozzles 29 of the mounting head 6 have been sucked, the mounting head 6 moves so as to mount the electronic component on the printed circuit board P that has been positioned. 6, the electronic component held by the suction nozzle 29 when the mounting head 6 moves and passes the upper position of the component recognition camera 12 is imaged by the component recognition camera 12 (fly recognition) and printed. The board recognition camera 19 images the mark attached to the board P.

  Based on the imaging result of the component recognition camera 12, the recognition processing device 23 performs a recognition process to determine how much the electronic component is displaced and held with respect to the suction nozzle and whether there is an electronic component. In this case, based on the recognition processing result by the recognition processing device 23, the CPU 20 determines whether there is no component (not sucked and held). Further, the recognition processing device 23 performs recognition processing based on the captured image of the substrate recognition camera 19, and the position of the printed circuit board P is grasped.

  In this case, if it is determined that the electronic component is attracted to the suction nozzle 29, the CPU 20 adds the electronic component position recognition processing result and the substrate recognition processing result to the mounting coordinates of the mounting data, and the Y axis drive motor is processed by the CPU 20. 11, the X-axis drive motor 13 and the θ-axis drive motor 15 are corrected and controlled, and the mounting nozzle 6 mounts the electronic component at a predetermined position on the printed circuit board P while correcting the positional deviation. Whether or not there are no components as described above and the mounting operation are repeated until all the electronic components sucked by the plurality of suction nozzles 29 are mounted.

  In this case, when the CPU 20 determines whether there is no component, if it is determined that there is no component (sucked but dropped), the count value of the B counter 36 corresponding to the component supply unit 5 in which the suction error has occurred is calculated. The CPU 20 determines whether or not the abnormal number set value has been exceeded by incrementing “1”. If the abnormal number set value set to “twice” has not been reached, for example, the plurality of suction nozzles 29 of the mounting head 6 are determined. The above operation is repeated until all electronic components to be mounted are mounted. At this time, when the set number of abnormal times is reached, the abnormal flag is turned on, the fact that the suction error has occurred in the component supply unit 5 is stored in the RAM 21, and the suction nozzles 29 of the mounting head 6 are suction-held. The determination as to whether there are no more components and the mounting operation are repeated until all the electronic components are mounted.

  When all the electronic components sucked and held by the plurality of suction nozzles 29 of the mounting head 6 have been mounted on the printed circuit board P, the abnormality flag is turned on and the fact that an abnormality has occurred in the component supply unit 5 is stored in the RAM 21. The CPU 20 determines whether or not it has been performed. If it is determined that the abnormality has not been stored in the RAM 21, the production operation of the printed circuit board P is continued.

  However, if it is determined that the abnormality has been stored in the RAM 21, the periphery (recognition) including the take-out port 31 of the component supply unit 5 having the smallest arrangement number among the component supply units 5 in which the abnormality has occurred is recognized. Position) The board recognition camera 19 is moved upward to pick up an image, the image is stored in the RAM 21 and the recognition processing device 23 performs recognition processing. If there is another component supply unit 5 in which an abnormality has occurred, the image pickup is performed as described above. And the recognition process is repeated.

  When the imaging and recognition processing of all the component supply units 5 in which an abnormality has occurred is completed, the CPU 20 causes the component supply unit 5 having the smallest arrangement number among the component supply units 5 in which an abnormality has occurred as shown in FIG. The abnormal screen according to the above is displayed on the monitor 25, and the production operation of the electronic component mounting apparatus 1 is controlled to be stopped.

  Next, after the production operation is stopped, the operator can determine a coping method for correction / repair of the component supply unit 5 by looking at the abnormal screen, which will be described with reference to FIG. That is, the component supply unit 5 with the lane number “101” as the arrangement number is displayed as having an abnormality “cover tape entrainment”, so the “return switch section” which is the touch panel switch 26 of this display screen. When the button 26A is pressed, an imaged screen as shown in FIG.

  That is, if it is normal, the cover tape Ca of the storage tape C is peeled off through the slits 32 formed in the suppressor 30 (see FIG. 3), but if the cover tape Ca is not peeled off and there is a winding abnormality ( An imaging screen as shown in FIG. 7 is displayed. This winding abnormality is a state in which the cover tape Ca cannot be peeled off by driving the peeling motor 18, and the encoder detects that the peeling motor 18 has not been able to rotate by a predetermined angle. Can be detected.

  In the case of an abnormal winding of the cover tape, since there is an electronic component at the component pickup / removal position, in order to prevent the tape from being fed at the next pickup, the “switch section that does not feed” 26B is pressed in FIG. When the abnormal image display switch section 26C is pressed, for example, when there is an abnormality in which the cover tape is cut (see FIG. 9), an imaging screen as shown in FIG. 10 is displayed. This cover tape breakage abnormality is a state where the cover tape Ca is not tensioned and cannot be peeled even when the peeling motor 18 is driven, and can be detected by a sensor or the like that detects whether or not this tension is present.

  If the cover tape is out of order, the electronic component D is present at the component pick-up position, so that the “non-feed switch part” 26B is pressed so that the tape is not fed during the next pick-up. When the switch portion 26C is pressed, the imaging screen of the component supply unit 5 having the next abnormality is displayed, and the imaging screen of the component supply unit 5 having the abnormality is displayed one after another.

  When the imaging screen of the component supply unit 5 in which all the feeding abnormalities are present is displayed, when the “complete switch unit” 26D is pressed, the normal screen is restored. If the next suction component is in the component pick-up position, pressing the “feeding switch unit” 26E causes the tape to not be fed at the next pick-up time when the operation is resumed after correcting / repairing the component supply unit 5. Will be.

  In addition, even when the feed motor 17 is energized, there is a feed abnormality in which the storage tape C cannot be fed in an overload state, a feed abnormality in which feed signals are duplicated, and a feed abnormality in which joint detection is abnormal. Explaining the feed abnormality in which the feed signals overlap, the CPU 20 outputs the feed signal to the component supply unit 5, and when the CPU 38 receiving the feed signal drives the feed motor 17 to rotate to a predetermined angle, the signal from the encoder The CPU 38 outputs a ready signal to the CPU 20 to notify the electronic component mounting apparatus body 1 that the component supply unit 5 is capable of feeding the storage tape C. However, the CPU 38 receives the feed signal from the CPU 20 and receives the CPU 38. However, it is an abnormality that the sending signal is received again before the ready signal is output to the CPU 20.

  Although the electronic component is taken out by the suction nozzle 29 through the take-out port 31, it may fall on the carrier tape in a state where it does not completely enter the storage portion Cb. In this case, in FIG. An imaging screen as shown is displayed.

  Then, the operator removes the component supply unit 5 having the abnormality from the feeder base of the cart base and corrects / repairs the component supply unit 5 according to the abnormality, but removes the component supply unit from the feeder base. Before, for each component supply unit in which an abnormality has occurred, an image of the periphery including the take-out port 31 is displayed, so that the cause of the abnormality can be specified in advance, so that subsequent corrections and repairs can be performed accurately and quickly. As a result, the production efficiency of the printed circuit board can be improved.

  In the above embodiment, after sequentially displaying images obtained by capturing the periphery including the take-out port 31 of each component supply unit in which an abnormality has occurred, control is performed to stop the production operation of the printed circuit board. The stop of the production operation and the display of the image may be performed simultaneously, or the image may be displayed after the production operation of the printed circuit board is stopped.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 5 Component supply unit 12 Component recognition camera 17 Feed motor 18 Peeling motor 19 Substrate recognition camera 20 CPU
21 RAM
23 recognition processing device 28 line sensor 29 suction nozzle 31 outlet

Claims (6)

The electronic components stored in the storage tape at predetermined intervals are sequentially supplied to the extraction position by intermittently sending the storage tape by the predetermined interval , and the electronic components supplied to the extraction position are supplied to the mounting head. In the electronic component mounting method in which the provided suction nozzle is taken out and mounted on the printed circuit board,
When an abnormality occurs in the component supply unit regarding the electronic component feeding operation, the fact that the abnormality has occurred in this component supply unit is stored,
The camera images the take-out position of the component supply unit in which the abnormality has occurred after mounting the electronic component on the printed circuit board,
An electronic component mounting method characterized by displaying an image relating to the imaged abnormality and inputting whether or not to send the storage tape for the predetermined interval at the next suction from an input means provided in the screen . The electronic components stored in the storage tape at predetermined intervals are sequentially supplied to the extraction position by intermittently sending the storage tape by the predetermined interval , and the electronic components supplied to the extraction position are supplied to the mounting head. In the electronic component mounting method in which the provided suction nozzle is taken out and mounted on the printed circuit board,
When an abnormality occurs in the component supply unit regarding the electronic component feeding operation, the fact that the abnormality has occurred in this component supply unit is stored,
The suction nozzle provided in the mounting head takes out an electronic component,
Mount the electronic component of the suction nozzle that holds the electronic component in this mounting head on the printed circuit board,
The camera images the take-out position of the component supply unit in which the abnormality has occurred after this mounting,
An electronic component mounting method characterized by displaying an image relating to the imaged abnormality and inputting whether or not to send the storage tape for the predetermined interval at the next suction from an input means provided in the screen . The electronic components stored in the storage tape at predetermined intervals are sequentially supplied to the extraction position by intermittently sending the storage tape by the predetermined interval , and the electronic components supplied to the extraction position are supplied to the mounting head. In the electronic component mounting method in which the provided suction nozzle is taken out and mounted on the printed circuit board,
When a suction abnormality occurs by detecting the suction state of the electronic component supplied from the component supply unit and taken out by the suction nozzle of the mounting head and held by suction, the fact that the suction abnormality has occurred is stored.
Attach the electronic components of all the suction nozzles that hold the electronic components in this mounting head to the printed circuit board,
The camera images the take-out position of the component supply unit in which the suction abnormality has occurred after this mounting,
An electronic component mounting method characterized by displaying an image relating to the picked-up abnormality and inputting whether or not to send the storage tape for the predetermined interval at the next suction from an input means provided in the screen . The electronic components stored in the storage tape at predetermined intervals are sequentially supplied to the extraction position by intermittently sending the storage tape by the predetermined interval , and the electronic components supplied to the extraction position are supplied to the mounting head. In the electronic component mounting method in which a plurality of suction nozzles provided are taken out and mounted on a printed circuit board,
Abnormal suction occurred when an electronic component supplied from the component supply unit and taken out by the suction nozzle of the mounting head and picked up and held was picked up and recognized by the component recognition camera, and there was no electronic component. Remember that
Attach the electronic components of all the suction nozzles that hold the electronic components in this mounting head to the printed circuit board,
The camera images the take-out position of the component supply unit in which the suction abnormality has occurred after this mounting,
An electronic component mounting method characterized by displaying an image relating to the picked-up abnormality and inputting whether or not to send the storage tape for the predetermined interval at the next suction from an input means provided in the screen .   5. The electronic component mounting method according to claim 1, wherein the printed circuit board production operation is stopped after the image is displayed. 5. The electronic component mounting method according to claim 3, wherein when the occurrence of the suction abnormality has been stored, the abnormality is stored when the number of abnormalities reaches a set number.

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