JP5342374B2 - Electronic component mounting device - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus in which a plurality of holding means provided in a mounting head from a component supply unit take out an electronic component and mount it on a printed board.

  Such an electronic component mounting apparatus is disclosed in Patent Document 1, for example. When the electronic component cannot be taken out from the same component supply unit a predetermined number of times, the electronic component mounting operation of the electronic component mounting apparatus is stopped. In addition, when an extraction error occurs in the same electronic component extraction cycle, the electronic component is extracted from the component supply unit in which the extraction error occurs in the next extraction cycle when the predetermined number of times has been reached. At this time, the position of the electronic component at the electronic component extraction position is recognized, and the electronic component is extracted in a state where the extraction position by the holding means is corrected.

JP 2005-109119 A

  However, when the mounting operation as described above is stopped, the operator checks the parts supply unit and finds and corrects the cause of the take-out abnormality, but in most cases it is a simple cause and the cause is investigated. In many cases, it can be easily corrected or need not be corrected, and it seems that there is no problem even if the frequency of stopping the mounting operation is reduced.

  Accordingly, an object of the present invention is to improve the production efficiency of a printed circuit board by reducing the number of times of stopping the mounting operation of the electronic component mounting apparatus when an abnormality in taking out the electronic component from the component supply unit occurs.

Therefore, according to the first aspect of the present invention, the component supply unit sequentially supplies the electronic components to the take-out position, and the electronic means supplied to the take-out position is taken out by the holding means provided in the mounting head and mounted on the printed circuit board. In the electronic component mounting device,
Storage means for storing the number of continuous abnormality settings for stopping the mounting operation when the take-out abnormality by the holding means is continuously generated in the same component supply unit;
Detecting means for detecting the occurrence of a take-out abnormality by the holding means;
Control means for controlling the mounting operation to stop when the detection abnormality is detected by the detection means and the continuous abnormality setting number is reached;
In the case where the number of occurrences of continuous take-out has reached a predetermined number of times greater than or equal to the number of continuous abnormality settings instead of the number of continuous abnormality settings stored in the storage means, and the storage tape handled by the component supply unit is a paper tape And a setting unit that can be set so that the control unit controls the mounting operation to stop.

According to a second aspect of the present invention, the component supply unit sequentially supplies the electronic components to the take-out position, and the electronic components supplied to the take-out position are taken out by the holding means provided in the mounting head and mounted on the printed circuit board. In the mounting device,
Storage means for storing the number of continuous abnormality settings for stopping the mounting operation when the take-out abnormality by the holding means is continuously generated in the same component supply unit;
Detecting means for detecting the occurrence of a take-out abnormality by the holding means;
Control means for controlling the mounting operation to stop when the detection abnormality is detected by the detection means and the continuous abnormality setting number is reached;
Instead of the number of continuous abnormality settings stored in the storage means, the number of occurrences of the continuous take-out abnormality reaches a predetermined number greater than the number of continuous abnormality settings, and the storage tape handled by the component supply unit is a paper tape and its electronic Setting means is provided which can be set so that the control means controls to stop the mounting operation when the size of the component is equal to or smaller than a predetermined size.

According to a third aspect of the present invention, in the first or second aspect, in the same take-out cycle by the same mounting head, a take-out abnormality by the holding means has occurred, but when the continuous abnormality set number has not been reached, In the next take-out cycle, before taking out electronic components, the board recognition camera images the component storage part of the component storage tape at the take-out position, the recognition processing device recognizes the captured image, and the recognition process result The holding means that has been corrected and moved based on the electronic component is configured to take out an electronic component from the component storage portion at the take-out position.

  The present invention can reduce the number of times of stopping the mounting operation of the electronic component mounting apparatus when an abnormality in taking out the electronic component from the component supply unit occurs, and can improve the production efficiency of the printed circuit board.

The top view of an electronic component mounting apparatus is shown. It is a control block diagram. It is the component supply unit typically represented and the expanded longitudinal cross-sectional view of the principal part. It is a figure which shows a line sensor unit. It is a figure which shows mounting data. It is a figure which shows the data which concern on the kind of each electronic component corresponding to the arrangement | positioning number of a component supply unit. It is a figure which shows parts library data. It is a figure which shows the flowchart which concerns on extraction abnormality determination stop determination. It is a figure which shows the flowchart which concerns on a continuous frequency determination process.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1, and component supply devices 3A, 3B, 3C, and 3D are divided into four blocks on the front and rear of the apparatus main body 2 of the electronic component mounting apparatus 1, and a plurality of them are arranged in parallel. It is installed. The component supply device 3A has a lane number (component supply unit arrangement number) in the 100s, the component supply device 3B has a lane number in the 200s, and the component supply device 3C has a lane number in the 300s. 3D has lane numbers in the 400s.

  Each of the component supply devices 3A, 3B, 3C, and 3D has a large number of component supply units 5 arranged in parallel on a feeder base of a cart base that is a mounting base. When the cart base is properly attached to the apparatus main body 2, power is supplied to the component supply unit 5 mounted on the cart base so as to face the road. Further, when the connection tool is released and the handle is pulled, it can be moved by a caster provided on the lower surface. When the sensor detects that the cart base is properly attached to the apparatus main body 2, the feeder base is provided so as to be lifted and lowered by the drive source.

  Each of the component supply devices 3A, 3B, 3C, and 3D is disposed so that the tip of the component supply side faces the pickup area of the mounting head 6, and each component supply unit 5 is freely rotatable on the cart table. Rotate a feed sprocket whose teeth are fitted into feed holes opened at predetermined intervals to a storage tape that is sequentially wound in a state of being wound around a supply reel placed on the supply reel, and the storage tape is picked up and picked up by electronic components. To remove the cover tape from the carrier tape in front of the component suction and take-out position by driving the tape feed mechanism intermittently fed by the feed motor (servo motor) 17 to the position and driving of the peeling motor 18 (servo motor). Cover tape peeling mechanism, and the cover tape Ca is peeled by the cover tape peeling mechanism to form the carrier tape Cc at predetermined intervals. It can be taken out by the suction nozzle 29 as holding means described later from the front end to supply loaded on to storages Cb the electronic components sequentially to the component suction pick-up position.

  As shown in FIG. 3 which is an enlarged longitudinal sectional view of a component supply unit and its main part schematically shown, the storage tape C fed out from the supply reel is arranged so as to dive under the suppressor 30 and It is sent to the suction removal position. The suppressor 30 is provided with a component extraction port 31 for pickup by the suction nozzle 29. Further, the suppressor 30 is formed with a slit 32, and the cover tape Ca is peeled off from the carrier tape Cc of the storage tape C from the slit 32 and stored in a cover tape storage section provided in the component supply unit 5. The That is, the electronic component mounted on the storage tape C is sent to the component suction / extraction position with the cover tape Ca peeled off from the carrier tape Cc, and is picked up by the suction nozzle 29 via the component extraction port 31. It becomes.

  Between the front-side component supply devices 3B and 3D and the rear-side component supply devices 3A and 3C, there are two supply conveyors, positioning units 8 and 8 (having a conveyor) that constitute the substrate transport mechanism, and discharge. A conveyor is provided. Each supply conveyor transports each printed circuit board P received from upstream to each positioning unit 8, and after each electronic component is mounted on each substrate P positioned by a positioning mechanism (not shown) in each positioning unit 8, It is transported to each discharge conveyor and then transported to the downstream device.

  Each beam 10 that moves along the guide rail 9 by the Y-axis drive motor 11 in the Y direction is provided with a mounting head 6 that moves by the X-axis drive motor 13 along the beam 10 in the longitudinal direction, that is, in the X direction. The mounting head 6 is provided with, for example, 14 suction nozzles 29. Therefore, in one pick-up cycle of one mounting head 6, that is, one electronic head picking and mounting operation of one mounting head 6 is 14 by a maximum of 14 suction nozzles 29.

  The mounting head 6 is equipped with a vertical axis drive motor 14 for moving the suction nozzle 29 up and down, and a θ-axis drive motor 15 for rotating around the vertical axis. Therefore, the suction nozzle of the mounting head 6 can move in the X direction and the Y direction, can rotate about the vertical axis, and can move up and down.

  Reference numeral 12 denotes a component recognition camera, which captures an image of the electronic component from below in order to recognize the position of the electronic component with respect to the suction nozzle 39 by being displaced and held in the XY direction and the rotation angle. Reference numeral 19 denotes a board recognition camera provided on the mounting head 6 for picking up an image of a mark attached to the printed board P.

  Next, the control block diagram of FIG. 2 will be described. The electronic component mounting apparatus 1 includes a CPU (Central Processing Unit) 20 as a control apparatus that performs overall control of the mounting apparatus 1, and a bus line connected to the CPU 20. RAM (Random Access Memory) 21 and ROM (Read Only Memory) 22 are provided. The CPU 20 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 22 based on the data stored in the RAM 21. That is, the CPU 20 controls the drive of the Y-axis drive motor 11, the X-axis drive motor 13, the vertical axis drive motor 14, the θ-axis drive motor 15 and the like via the interface 24 and the drive circuit 27 and each component supply unit. 5 is controlled. In FIG. 2, for convenience of explanation, even if there are a plurality of them, for example, the mounting head 6 and the component supply unit 5 are omitted as one.

  The RAM 21 stores mounting data for each type of printed circuit board P related to component mounting. For each mounting order (step number), the X direction (indicated by X) in the printed circuit board P, Y Information on direction (indicated by Y) and angle (indicated by Z), arrangement number information of each component supply unit 5 and the like are stored (see FIG. 5).

  Further, in the RAM 21, as shown in FIG. 6, each electronic component type (component ID) corresponding to the component supply unit arrangement number (lane number) of each component supply unit 5 for each type of printed circuit board P is stored. Information, that is, part arrangement information is stored, and this part arrangement information is data relating to which part supply unit 5 is mounted at which position on the cart table.

  Further, component library data relating to the characteristics of the electronic component is stored for each component ID. That is, as shown in FIG. 6, in the component library data, the size in the X direction and the Y direction, the type of the storage tape C (embossed tape, paper tape), and an electronic component take-out abnormality continuously occur for each component ID. When the predetermined number is reached, it is composed of the number of continuous abnormality settings for stopping the mounting operation of the electronic component mounting apparatus 1.

  At this time, the carrier tape Cc of the embossed tape is made of synthetic resin, and the carrier tape Cc of the paper tape is made of paper, and the substrate recognition camera 19 is used to check the position of the electronic component supplied to the component suction / extraction position. When the recognition processing device 23 captures an image and performs recognition processing, it is difficult to grasp the position of the electronic component because the distinction between the electronic component and the carrier tape Cc is unclear in the image.

  For this reason, for the component supply unit 5 that supplies the electronic component stored in the embossed tape, the number of consecutive abnormal settings in the component library data of the electronic component is “1”, and the electronic component stored in the paper tape is supplied. For the component supply unit 5, the number of continuous abnormality settings in the component library data of the large and expensive electronic component is also “1”, but the number of continuous abnormality settings in the small and small component library data is For example, any one of “2”, “3”, [4], “5”, and “6”.

  A recognition processing device 23 is connected to the CPU 20 via an interface 24. The recognition processing device performs recognition processing of an image captured by the component recognition camera 12 or an image captured by the board recognition camera 19. The processing result is sent to the CPU 20. That is, the CPU 21 performs recognition processing (calculation of the amount of displacement of the electronic component sucked and held by the suction nozzle 18 or the position of the printed board P positioned) by the image captured by the board recognition camera 8 or the component recognition camera 12. An instruction is output to the recognition processing device 29 and a recognition processing result is received from the recognition processing device 29.

  Reference numeral 25 denotes a monitor as a display means for displaying a part image and a screen for setting various data. The monitor 25 is provided with various touch panel switches 26 as input means, and an operator operates the touch panel switch 26. Thus, various settings can be made.

  Reference numeral 28 denotes a line sensor as a component presence / absence detecting device for detecting the presence / absence of the electronic component D sucked and held by the suction nozzle 29. The line sensor 28 receives a light projector 28A that emits a light beam that goes straight in the horizontal direction and the light beam. As possible, it is constituted by a light receiver 28B in which a large number of CCD elements are arranged in parallel on a straight line in the vertical direction, and is provided in the mounting head 6, but may be provided in the apparatus main body 2. The projector 28A may collect the light of the LED with a lens and emit a light beam that travels in parallel, or may use a laser. About 1000 CCD elements are juxtaposed in a vertical width of about 10 mm, and the light receiver 28B can be realized. Each CCD element can detect the amount of light received, and can be used as an ON / OFF sensor by determining the threshold of the amount of light received, and the portion shielded from light by the electronic component D by the ON / OFF output is thick. It is possible to detect the presence or absence of a component sucked by the suction nozzle 29, or to detect a suction abnormality that is a so-called standing state or oblique suction state without being normally sucked by a surface that should not be sucked. it can.

  A counter 35 is provided for each component supply unit 5 that performs a suction operation for taking out an electronic component by the suction nozzle 29 and counts the number of occurrences when a suction abnormality occurs and is detected.

  The component supply unit 5 that intermittently feeds the storage tape C by the feed motor 17 includes a CPU 38, a RAM 39, and a ROM 40. Reference numeral 16 denotes a drive circuit connected to the CPU 38 via an interface 41. The CPU 38 controls the feed motor 17 and the peeling motor 18 via the drive circuit 16. The CPU 38 provided in the component supply unit 5 is connected to the CPU 20 provided in the electronic component mounting apparatus main body 1 via the interfaces 41 and 24.

  With the above-described configuration, the “unloading abnormal stop mode” in which the mounting operation of the component mounting apparatus 1 is stopped when a continuous abnormality of electronic components occurs and the number of continuous abnormality settings stored as component library data is reached. In the state where “” is selected, specifically, the “unloading abnormal stop mode” is set to “valid” by pressing operation of the setting means, that is, the touch panel switch 26 displayed on the monitor 25, and the electronic component mounting apparatus 1 The operation in which the automatic operation is performed will be described below.

  First, the printed circuit board P is conveyed from the upstream device to the positioning unit 8 via the supply conveyor, and is positioned and fixed by the positioning mechanism. In the component supply unit 5, the CPU 38 performs an initialization process and outputs a ready signal to the CPU 20 of the electronic component mounting apparatus main body 1, so that the component supply unit 5 can feed the storage tape C. The electronic component mounting apparatus main body 1 is notified.

  The CPU 20 outputs a feed signal to the component supply unit 5 in order to control the component feed operation of the component supply unit 5 that supplies the electronic component to be taken out based on the mounting data stored in the RAM 21. The CPU 38 receiving this feed signal stops the output of the ready signal, turns the feed motor 17 into the servo-on state (energized state) via the drive circuit 16, and performs the parts feed operation of the storage tape C. Then, the drive of the feed motor 17 is started and the sprocket is intermittently rotated by a predetermined angle in the feed direction, whereby the storage tape C is intermittently fed through the feed hole.

  When this tape feeding mechanism is driven, the peeling motor 18 of the cover tape peeling mechanism is driven in synchronism with this, and the cover tape Ca is peeled (peeled) for one intermittent feed. Subsequently, when the tape feeding mechanism and the cover tape peeling mechanism are stopped, the electronic component D sent to the component suction / extraction position is stopped. Then, the electronic component D is picked up via the component take-out port 31 by the suction nozzle 29, and the next intermittent feeding of the storage tape C and the peeling of the cover tape Ca are performed again.

  When the feed motor 17 is rotated by a predetermined angle by the encoder, the CPU 38 outputs a ready signal to the CPU 20 of the electronic component mounting apparatus body 1 based on the signal from the encoder, and the component supply unit 5 feeds the storage tape C. When the electronic component mounting apparatus main body 1 informs the electronic component mounting apparatus main body 1 that the operation is possible and the CPU 20 inputs a ready signal, the CPU 20 moves the mounting head 6 to face the component supply unit 5. The suction nozzle 29 is lowered to pick up and take out the electronic component at the component picking up position.

  However, with regard to the electronic component feeding operation described above, when no abnormal feeding occurs in the component supply unit 5, the suction nozzle 29 picks up the electronic component D via the component take-out port 31. More specifically, the suction nozzle of the mounting head 6 moves so as to be positioned above the component supply unit 5 that stores electronic components to be mounted in accordance with the mounting order. However, in the Y direction, the Y-axis drive motor 11 is driven and the beam 10 is moved. In the X direction, the X-axis drive motor 13 is driven and the mounting head 6 is moved. Since the predetermined component supply unit 5 is already in the component pick-up position, the vertical axis drive motor 14 Lowers the suction nozzle to suck and take out the electronic components, and then the suction nozzle 29 rises.

  In this case, when the suction nozzle 29 picks up and picks up the electronic component, the presence or absence of the electronic component D sucked and held by the suction nozzle 29 by the line sensor 28 is detected every time it is picked up, and the surface that should not be picked up is picked up normally. The electronic component to be adsorbed by all the 14 adsorbing nozzles 29 provided in the mounting head 6 that is one take-out cycle is detected if an abnormal adsorbing that is a so-called standing state or oblique adsorbing state is detected without being adsorbed by Until all the components are sucked, the above-described feeding and sucking operations of the electronic components are repeated.

  In this electronic component feeding and sucking / removing operation, if a suction abnormality is detected, i.e., the absence of the electronic component D is detected, or a suction abnormality such as the standing state or the oblique suction state is detected, The CPU 20 increments the number of counts of the counter 35 corresponding to the component supply unit 5 in which the abnormality has occurred, and, as shown in FIG. 8, the abnormality has occurred in this component supply unit 5 in this take-out cycle. A pocket recognition flag is set for the supply unit 5 and stored in the RAM 21 (actual pocket recognition is performed in the next extraction cycle).

  In this case, in the same component supply unit 5, there are cases in which suction abnormalities occur continuously with the removal of electronic components, but this is not limited to this removal cycle, and only when this is continued including the next removal cycle. The counter 35 continues the counting, and when it is not continuous, the number of counting is canceled. By counting in this way, when the CPU 20 determines whether or not the number of continuous abnormality settings has been reached, if it is determined that the number of continuous abnormality settings has not been reached, a case where no takeout abnormality has occurred and Similarly, the extraction abnormal stop determination of the current extraction cycle ends, and the extraction abnormal stop determination of the next extraction cycle is performed.

  Further, when the CPU 20 determines that the number of continuous abnormality settings has been reached, the electronic component mounting apparatus 1 is controlled to stop (abnormally stop) the mounting operation. After the stop, the operator confirms the component supply unit 5 and finds out and corrects the cause of the take-out abnormality.

  When the number of continuous abnormalities has not been reached in the previous extraction cycle but an abnormality has occurred, the electronic component is removed from the component supply unit 5 in which an abnormality has occurred and the pocket recognition flag is set in the next extraction cycle. Before the take-out, the X-axis drive motor 13 and the Y-axis drive motor 11 are driven to move the board recognition camera 19 to the component suction / take-out position, and the storage portion Cb of the storage tape C at the component suction / take-out position is imaged and recognized. The processing device 23 performs recognition processing (pocket recognition). When this recognition process is performed, for example, the size data of the rectangular storage unit Cb in plan view is stored in the RAM 21, so that the edge of the storage unit Cb subjected to the recognition process and the electronic component D stored in the storage unit Cb are included. In order to recognize the size closest to the size data among the sizes of the edges of the electronic component D as the component storage unit Cb, the storage unit Cb is distinguished from the electronic component stored in the storage unit Cb. It is possible to grasp the position of the storage portion Cb at the component suction / extraction position.

  Then, based on the recognition processing result, the correction value is stored in the RAM 21, the X-axis drive motor 13 and the Y-axis drive motor 11 are driven in consideration of this correction value, and then the vertical axis drive motor 14 is driven. Then, the suction nozzle 29 descends and picks up the electronic components. As a result, the suction nozzle 29 can reliably extract the electronic component from the component supply unit 5 in which the extraction abnormality has occurred, although the number of continuous abnormality setting has not been reached in the previous extraction cycle. In addition, if the pocket is recognized in this way, the suction nozzle can be moved in accordance with the position of the storage portion Cb at the component suction / extraction position, and the suction / extraction of the electronic component can be stabilized. According to FIG. 9, the adsorption abnormality is counted even in the next take-out cycle. However, when the pocket is recognized in this way, it is not normally a continuous abnormality, so the number of counting is canceled.

  It should be noted that instead of capturing an image of the storage portion Cb of the storage tape C at the component suction / extraction position and determining the position of the storage portion Cb at the component suction / extraction position, the position of the electronic component in the storage portion Cb is determined. The suction nozzle may be moved in accordance with the position of the electronic component to stabilize the suction and removal of the electronic component.

  Next, the process of determining the number of consecutive times of abnormal takeout will be described with reference to FIG. 9. First, the “takeout abnormal stop mode” is set to “invalid” by the pressing operation of the setting means, that is, the touch panel switch 26 displayed on the monitor 25. Whether it is set is determined by the CPU 20. If it is determined that it is not set to “invalid”, in other words, it is set to “valid”, the number of consecutive abnormal retrievals is controlled according to the set number. That is, it is controlled by the CPU 20 according to the number of consecutive abnormality settings stored as the part library data as described above.

  However, when it is determined that “invalid” is set, it is determined that “1” is set when it is determined whether or not the continuous abnormality setting number is set to “1”. Then, it is controlled by the CPU 20 according to the set number of “1”.

  If it is determined that the continuous abnormality setting number is not set to “1”, it is next determined whether or not the continuous abnormality setting number is set to “5” or more. When it is determined that the value is set to “5” or more, the CPU 20 controls the number of times as set.

  Further, when it is determined that the continuous abnormality setting number is not set to “1” and is not set to “5” or more, the storage tape handled by the component supply unit 5 in which the next take-out abnormality has occurred is determined. It is determined whether C is a paper tape. In this case, if it is determined not to be a paper tape, that is, an embossed tape, it is controlled by the CPU 20 in accordance with the set number.

  If it is determined that the tape is a paper tape, it is next determined based on the component library data of the electronic component whether the size of the electronic component handled by the component supply unit 5 is small. In this case, it is determined whether the size in the X direction and the size in the Y direction are equal to or smaller than a certain dimension.

  If it is determined that the electronic component is not smaller than the predetermined size, that is, it is not a small-sized electronic component, it is controlled by the CPU 20 according to the set number. If it is determined that the size is not more than the above-mentioned fixed size, the removal abnormality shown in FIG. 8 is shown when the number of consecutive abnormality settings of the part library data is set to “2”, “3”, and [4]. In the stop determination, the CPU 20 controls the continuous abnormality setting number to be “4” uniformly.

  That is, in the take-out abnormality stop determination of FIG. 8, for example, even when the number of consecutive abnormality settings of the part library data is stored as “2”, the CPU 20 controls the number of consecutive abnormality settings as “4”. That is, even when the takeout abnormality occurs twice continuously, the mounting operation of the electronic component mounting apparatus 1 is not controlled to stop, and when it occurs three times, the mounting operation is not controlled to stop similarly. Control is made so that the mounting operation is stopped only when it occurs.

  And when this mounting operation stops, the operator checks the parts supply unit and finds out the cause of the abnormal take-out and corrects it, but in most cases it is a simple cause, and it is easy to investigate and correct the cause. In many cases, there is no need to make corrections, and it is considered that there is no problem even if the frequency of stopping the mounting operation is reduced. In this case, the number of times of stopping the mounting operation of the electronic component mounting apparatus when the takeout abnormality occurs can be reduced, and the production efficiency of the printed circuit board can be improved.

  Further, in the above case, when the number of continuous abnormality settings is set to 2 to 4 times in the part library data and stored, and the paper tape is in the X direction size and the Y direction size is below a certain dimension. Since the number of consecutive abnormal settings is controlled as “4” uniformly, if it occurs 1 to 3 times, the mounting operation is not stopped, and as described above, the abnormality is detected in the next removal cycle. Before the electronic component is taken out from the component supply unit 5 in which the pocket recognition flag is set, the X-axis drive motor 13 and the Y-axis drive motor 11 are driven to move the board recognition camera 19 to the component pick-up position. Then, the storage portion Cb of the storage tape C at this component suction / extraction position is imaged, and the recognition processing device 23 performs recognition processing (pocket recognition). When this recognition process is performed, for example, the size data of the rectangular storage unit Cb in plan view is stored in the RAM 21, so that the edge of the storage unit Cb subjected to the recognition process and the electronic component D stored in the storage unit Cb are included. In order to recognize the size closest to the size data among the sizes of the edges of the electronic component D as the component storage unit Cb, the storage unit Cb is distinguished from the electronic component stored in the storage unit Cb. It is possible to grasp the position of the storage portion Cb at the component suction / extraction position.

  Then, based on the recognition processing result, the correction value is stored in the RAM 21, the X-axis drive motor 13 and the Y-axis drive motor 11 are driven in consideration of this correction value, and then the vertical axis drive motor 14 is driven. Then, the suction nozzle 29 descends and picks up the electronic components. As a result, the suction nozzle 29 can reliably extract the electronic component from the component supply unit 5 in which the extraction abnormality has occurred, although the number of continuous abnormality setting has not been reached in the previous extraction cycle. In addition, if the pocket is recognized in this way, the suction and removal of the electronic component can be stabilized by moving the suction nozzle in accordance with the position of the storage portion Cb at the component suction and extraction position. According to FIG. 9, the adsorption abnormality is counted even in the next take-out cycle. However, when the pocket is recognized in this way, it is not normally a continuous abnormality, so the number of counting is canceled.

  As long as the number of continuous abnormality settings is set to 2 to 4 times and stored in the part library data, even if it is a paper tape and the size in the X direction and the size in the Y direction are not less than a certain size, as described above. Control may be performed by uniformly setting the number of consecutive abnormality settings to “4”. Furthermore, if the number of continuous abnormality settings is set to 2 to 4 times in the part library data and the paper tape is used, even if the size in the X direction and the size in the Y direction are not less than a certain size, it is continuously uniform as described above. The number of abnormal settings may be controlled as “4”.

  The part presence / absence detection apparatus may be a line sensor unit 45 as shown in FIG. 4 and will be described below. That is, a light emitting element 47 such as an LED is disposed in an upper portion of a cylindrical light emitting unit mounting body 46 provided at a substantially central portion of the mounting head 6, and a lens 48 and a conical shape below the lens 48 are disposed below the light emitting element 47. A light-receiving unit including a light-emitting unit 51 configured by disposing a reflector 50 having a reflective surface 49 and a plurality of CCD elements as light-receiving elements that receive light from the light-emitting element 47 via the reflector 50 52 may constitute the line sensor unit 45.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 5 Component supply unit 12 Component recognition camera 19 Substrate recognition camera 20 CPU
21 RAM
23 Recognition processing device 28 Line sensor 29 Adsorption nozzle 31 Component outlet

Claims (3)

In the electronic component mounting apparatus in which the component supply unit sequentially supplies the electronic components to the extraction position, and the holding means provided in the mounting head extracts the electronic components supplied to the extraction position and mounts them on the printed circuit board.
Storage means for storing the number of continuous abnormality settings for stopping the mounting operation when the take-out abnormality by the holding means is continuously generated in the same component supply unit;
Detecting means for detecting the occurrence of a take-out abnormality by the holding means;
Control means for controlling the mounting operation to stop when the detection abnormality is detected by the detection means and the continuous abnormality setting number is reached;
In the case where the number of occurrences of continuous take-out has reached a predetermined number of times greater than or equal to the number of continuous abnormality settings instead of the number of continuous abnormality settings stored in the storage means, and the storage tape handled by the component supply unit is a paper tape An electronic component mounting apparatus comprising: setting means that can be set so that the control means controls to stop the mounting operation. In the electronic component mounting apparatus in which the component supply unit sequentially supplies the electronic components to the extraction position, and the holding means provided in the mounting head extracts the electronic components supplied to the extraction position and mounts them on the printed circuit board.
Storage means for storing the number of continuous abnormality settings for stopping the mounting operation when the take-out abnormality by the holding means is continuously generated in the same component supply unit;
Detecting means for detecting the occurrence of a take-out abnormality by the holding means;
Control means for controlling the mounting operation to stop when the detection abnormality is detected by the detection means and the continuous abnormality setting number is reached;
Instead of the number of continuous abnormality settings stored in the storage means, the number of occurrences of the continuous take-out abnormality reaches a predetermined number greater than the number of continuous abnormality settings, and the storage tape handled by the component supply unit is a paper tape and its electronic An electronic component mounting apparatus, comprising: a setting unit configured to control the control unit to stop the mounting operation when the size of the component is equal to or less than a predetermined size. In the same take-out cycle with the same mounting head, when the take-out abnormality by the holding means has occurred, but the number of continuous abnormalities has not been reached, the board recognition camera before taking out the electronic components in the next take-out cycle Then, the holding means that has imaged the component storage portion of the component storage tape at the extraction position, recognized the captured image by the recognition processing device, and corrected and moved based on the recognition processing result is the position of the extraction position. 3. The electronic component mounting apparatus according to claim 1 , wherein an electronic component is taken out from the component storage unit.

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