JP5940243B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

The present invention relates to an electronic component mounting apparatus that takes out an electronic component from a component supply device and mounts the electronic component on a printed circuit board that has been positioned, and an electronic component mounting method thereof.

This type of electronic component mounting apparatus is disclosed in, for example, Patent Document 1. No electronic components are stored in the first part of a new reel on which a supply tape storing electronic components is wound in the respective storage portions formed side by side in the delivery direction. For this reason, after the component supply device is connected to the electronic component mounting device, the reel that has been supplied with the component is removed from the component supply device and a new reel supply tape is set in the feeder, or a new reel supply tape is inserted into the feeder. After connecting the component supply device to the electronic component mounting device and removing the electronic component from the supply tape, the electronic component is not stored in the component storage part of the supply tape, so that the removal abnormality does not occur There is a need to.

  In Patent Document 1, an image pickup device is used to pick up an image of an electronic component outlet to detect the presence / absence of the component and automatically cue the component.

JP 2007-12888 A

  However, if there is a clear difference between the supply tape and the electronic component and there is a component that cannot be detected by imaging, it is necessary for the operator to manually send the supply tape each time. For example, when changing the model of the printed circuit board and replacing the component supply device, when loading a new supply tape due to a component shortage into the feeder, the contrast between the supply tape and the electronic component should be adjusted to avoid abnormal component removal. If there is a part that does not have a clear difference and cannot detect the presence or absence of the part by imaging, it is necessary to feed the supply tape one pitch at a time to the position where the part is stored, which makes the preparation work complicated and takes time. The problem occurs.

  Further, since the preparation work is complicated and takes time, there is a possibility that an abnormal takeout may occur when the supply tape feeding by the operator is insufficient. Furthermore, the time required for the preparation work becomes longer, the start of operation of the electronic component mounting apparatus is delayed, and the operation time may be reduced.

Therefore, the present invention provides an electronic component mounting apparatus and an electronic component mounting method capable of reliably performing a work of loading a new supply tape due to a component shortage into a feeder when the model of a printed circuit board is changed and the component supply device is replaced. The purpose is to provide.
It is another object of the present invention to provide an electronic component mounting apparatus and an electronic component mounting method that shorten the preparation work time and have a high operating rate.

In order to achieve the above object, the present invention has at least the following features.
The present invention feeds a supply tape storing electronic components to a plurality of storage units arranged at predetermined intervals , sequentially moves the storage unit to a component extraction port for taking out the electronic component, and from the component extraction port to the electronic component in the electronic component mounting apparatus or an electronic component mounting apparatus method for mounting the print substrate taken out, first by having a height measurement sensor that measures the internal height of the housing part which has sequentially moved to the component outlet port 1 It is characterized by.

Further, the present invention, the measurement results to determine the presence or absence of the electronic component in the accommodating portion based on accommodates an electronic component wherein by sequentially moving from a tip of the supply tape in the first of said housing portions The second feature is that the storage portion is detected to cue the supply tape.
Further, the present invention measures the height of the storage part or the electronic component in the height direction or the height of a specific location, obtains a deviation amount from the predetermined contour or the specific location, and determines the position of the cueing Correction is a third feature.

The present invention is directed to a fourth, characterized in that provided on the mounting head for mounting said height detection sensor in the component pickup print substrate is taken out of the electronic component from the outlet.
Furthermore, the present invention provides a fifth aspect in which the height detection sensor is provided in a component supply device on which the plurality of feeders are placed, and the height detection sensor is scanned between the component outlets of the plurality of feeders. Features.
Moreover, the present invention is characterized in that the height detection sensor is a laser displacement sensor.

Furthermore, the present invention is the beginning of the supply tape, wherein by sequentially moving the next of the storage portion to the component outlet port by sending the supply tape when the electronic component by the judgment is determined that there is no The seventh feature is that when it is determined that the supply tape is present, the feeding of the supply tape is stopped.
Further, the present invention is the beginning of the supply tape, wherein by sequentially moving the next of the storage portion to the component outlet port by sending the supply tape when the electronic component by the judgment is determined that there is no The eighth feature is to start the mounting when it is determined to be present.

According to the present invention, the present invention provides an electronic component mounting apparatus and an electronic device that can reliably perform a work of loading a new supply tape due to a component shortage into a feeder when the type of printed circuit board is changed and the component supply apparatus is replaced. A component mounting method can be provided.
In addition, according to the present invention, it is possible to provide an electronic component mounting apparatus and an electronic component mounting method that shorten the preparation work time and have a high operating rate.

It is a schematic plan view of the electronic component mounting apparatus which is embodiment of this invention. It is a figure which shows the drive part which moves the feeder base of a components supply apparatus, its vicinity, and a mounting head. It is a figure which shows the front view of a monitor. It is a control block diagram for the control which concerns on the electronic component mounting of the electronic component mounting apparatus which is embodiment of this invention. It is a figure which shows the flowchart of the automatic cueing operation | movement of an electronic component (feeder). In the flowchart shown in FIG. 5, it is a figure which shows a mode that the height in a accommodating part is measured in the state in case there is no electronic component in the accommodating part which accommodates the electronic component of a supply tape. In the flowchart shown in FIG. 5, it is a figure which shows the state which measures the height in the head storage part which accommodated the electronic component. It is a figure which shows the shift | offset | difference of the accommodating part position in the cueing operation | movement of an electronic component (feeder). It is a figure which shows the basic idea which measures the shift | offset | difference of a storage part position.

  A first embodiment of an electronic component mounting apparatus that mounts electronic components on a printed circuit board will be described below with reference to FIGS. FIG. 1 is a schematic plan view of an electronic component mounting apparatus according to an embodiment of the present invention. The electronic component mounting apparatus 1 includes a transport device 2 that transports the printed circuit board P in the X direction, and a plurality of feeders 13 that are provided on one side of the transport device 2, that is, on the upper side of the paper, for supplying electronic components. A component supply device 5 such as a cart arranged freely, and a component supply such as a cart in which a plurality of feeders 13 are detachably arranged for supplying electronic components provided on the other side of the conveying device 2, that is, the lower side of the sheet. An apparatus 3; a pair of beams 7 and 8 that can be moved in the vertical direction of the paper by a driving source; 11 is provided.

  The component supply device 3 is detachable from the main body of the electronic component mounting apparatus 1. When the component supply device 3 on which a plurality of feeders 13 are mounted is connected to the main body of the electronic component mounting apparatus 1, the component supply device 3 is provided on the feeder 13. A tape feed driving device (motor) and a control device (not shown) are connected to the power source of the electronic component mounting device main body and the CPU 17 via the component supply device 3.

  The transport device 2 is disposed in the middle part of the electronic component mounting device 1, and is a substrate supply unit that inherits the printed circuit board P from the upstream device, and the electrons held by suction by the suction nozzles 101 and 111 of the mounting heads 10 and 11. A positioning unit that positions and fixes the printed circuit board P supplied from the substrate supply unit for mounting components, and a discharge unit that inherits the printed circuit board P on which the electronic component is mounted by this positioning unit and conveys it to the downstream device. Composed.

  FIG. 2 shows the feeder base 12 of the component supply device 5 among the component supply devices 3 and 5 having the same configuration, the vicinity thereof, and the drive unit that moves the mounting head 10. In FIG. 2, the component supply device 5 includes a feeder base 12. As shown in FIG. 2, the feeder base 12 has a plurality of feeders 13 detachably arranged in each lane, and a reel 65 around which a supply tape 41 having electronic components is wound corresponding to each feeder 13. Is arranged. Each feeder 13 has a component outlet (component suction position) 43 for taking out electronic components one by one with the mounting head 10.

  As shown in FIGS. 1 and 2, the beam 7 that moves the mounting head 10 that processes the feeder 13 of the component supply device 5 and the mounting head 11 that processes the feeder 13 of the component supply device 3 are moved. The beam 8 which is long in the X direction is individually moved by a slider fixed to each beam along a pair of guides extending vertically on the left and right sides of the paper by driving the Y direction linear motors 9 and 99 which are Y direction drive motors. Move in the Y direction. The Y-direction linear motors 9 and 99 include a pair of stators fixed along a pair of left and right bases 1A and 1B, and a mover 9a fixed to a lower portion of a mounting plate provided at both ends of the beams 7 and 8. , 99a.

Further, as shown in FIG. 2, the mounting head 11 (10) is moved along the guide in the longitudinal direction (X direction) of the beams 7 and 8 by an X direction linear motor 23 (223) which is an X direction driving motor. Are provided on the inside. The X-direction linear motor 23 (223) includes a pair of front and rear stators fixed to each beam 8 (7), and a mover provided between the stators and provided on the mounting head 11 (10). Have
Furthermore, as shown in FIG. 1, the mounting heads 10 and 11 are provided inside the beams 7 and 8 so as to face each other.

  With these configurations, the mounting heads 10 and 11 move between the printed circuit board P on the positioning unit of the transport device 2 and the component outlet 43 of the feeder 13 of the component supply devices 3 and 5.

  The mounting heads 10 and 11 are provided with suction nozzles 101 and 111 urged downward by, for example, ten springs at predetermined intervals on the circumference. , 11 can be simultaneously taken out from a plurality of feeders 13 arranged in parallel by suction nozzles located at 3 o'clock and 9 o'clock positions. The suction nozzle can be moved up and down by a vertical axis motor 25 (225) (see FIG. 4), and the mounting heads 10 and 11 are rotated around a vertical axis by a θ-axis motor 26 (226) (see FIG. 4). As a result, the suction nozzles 101 and 111 of the mounting heads 10 and 11 can move in the X direction and the Y direction, can rotate about the vertical line, and can move up and down.

  The mounting heads 10 and 11 are provided with board recognition cameras 14 and 14, respectively, for picking up an image of a positioning mark attached to the printed board P being positioned. Further, the component recognition camera 15 captures images of the electronic components sucked and held by the suction nozzles at once.

  Further, the mounting heads 10 and 11 are provided with laser displacement sensors 16 and 16, respectively, to determine the surface height of the printed circuit board P being positioned and the surface height of the electronic components at the outlet 43 of the feeder 13 as will be described later. measure.

Furthermore, monitors 20 and 201 for displaying an operation screen and the like are provided before and after the electronic component mounting apparatus 1.
FIG. 3 shows a front view of the monitor 20 as an example, since the monitors 20 and 201 are similarly configured. A touch panel switch 21 and an operation panel 31 are provided as monitor 20 input means.
The operation panel 31 is provided in the lower part of the monitor 20. The operation panel 31 includes a feeder preparation button 51, a power button 52, a start button 53, a space from the left side to the right side, A stop (STOP) button 54 and an operation panel designation (PANEL) button 55 are arranged. Each of the buttons 51 to 55 includes a colored cover 61 to 65 and light emitters 71 to 75 such as a light emitting element (LED) provided inside each cover.

  The feeder preparation button 51 is pressed by an operator when replacing the feeder 13, and the feeder 3 is released from the locked state by being pressed, so that the feeder can be replaced. The power button 52 is pressed when the power is turned on or off, and the start switch 53 is pressed when starting the operation of the apparatus after the power is turned on. The stop switch 54 is pressed when stopping the operating device. Further, the operation panel designation button 55 is pressed when designating the touch panel switch 21 operated by the operator, and among the touch panel switches of the monitors 20 and 201, the switch of one touch panel switch in which the operation panel designation button 55 is pressed. Only the operator's operation is accepted, and the operation of the touch panel switch of the other monitor is not accepted.

  FIG. 4 is a control block diagram for control related to electronic component mounting of the electronic component mounting apparatus 1. Each element of the electronic component mounting apparatus 1 is centrally controlled by a CPU (Central Processing Unit) 17 which is a control device. A ROM (Read Only Memory) 19 for storing a program related to this control and various types A RAM (Random Access Memory) 18 for storing data is connected via a bus line 22b. A monitor 20 (201) and a touch panel switch 21 are connected to the CPU 17 via an interface 22. Further, the Y-direction linear motor 9 and the like are connected to the CPU 17 via the drive circuit 24 and the interface 22.

The RAM 18 stores NC data for each type of printed circuit board P (substrate type) to be produced. This NC data includes operation data, setup data, mounting data, and the like. The operation data includes an NC data name comment, the size of the printed circuit board in the X and Y directions, the thickness of the printed circuit board, the presence / absence of a front part, the height of the front part, and the board finishing mode. Further, the feeder 18 for supplying electronic components to the printed circuit boards of a plurality of different board types to be produced is placed in the RAM 18 as much as possible, and even if the board type to be produced changes, the feeders 13 of the component supply devices 3 and 5 Parts arrangement data set in advance so as to avoid replacement work as much as possible are stored.
The RAM 18 also stores component library data representing the characteristics of each electronic component, which is composed of shape data, recognition data, control data, and component supply data.

The operation of the electronic component mounting apparatus having the above configuration will be described below.
When the printed circuit board P is inherited from the upstream device (not shown) and exists on the supply unit of the transport apparatus 2, the printed circuit board P on the supply unit is moved to the positioning unit, and the plane direction of the printed circuit board P and Position in the vertical direction and fix.

  When the printed circuit board P is positioned, the slider 7 slides in the Y direction along the guide that the beam 7 on the upper side of the paper extends forward and backward by the drive of the Y direction linear motor 9 and moves in the Y direction. 23 (see FIG. 2), the mounting head 10 moves in the X direction, moves to above the component extraction position of the feeder 13, and the suction nozzle 101 is lowered by driving the vertical axis motor to take out the electronic component from the feeder 13. In this case, the plurality of suction nozzles 101 can take out the electronic components from the feeder 13 by moving and rotating the mounting head 10 in the X direction and further raising and lowering the suction nozzles 101. Similarly to the beam 7 on the upper side of the paper, the beam 8 on the lower side of the paper moves in the Y direction along the guide extending forward and backward by driving the Y direction linear motor, and the mounting head 11 is moved in the X direction by the X direction linear motor. To the upper part picking position of the feeder 13, and the suction nozzle 111 is lowered by driving the vertical axis motor to take out the electronic part from the feeder 13. In this case, the plurality of suction nozzles 111 can take out the electronic components from the feeder 13 by moving and rotating the mounting head 11 in the X direction and further raising and lowering the suction nozzles 111.

  That is, first, in accordance with, for example, the step of the mounting data, ten electronic components are sequentially taken out from the feeder 13 of the component supply device 5 by the mounting head 10 provided on the beam 7 on the upper side of the paper surface, and at the same time, the component supply device 3. Ten electronic components are sequentially taken out from the feeder 13 by the mounting head 11 provided on the beam 8 below the paper surface. That is, the ten suction nozzles 101 of the mounting head 10 provided on the beam 7 on the upper side of the paper take out the electronic components from the feeder 13 in order, and at the same time, ten of the mounting heads 11 provided on the beam 8 on the lower side of the paper. Each of the mounting heads 10 and 11 picks up and removes ten electronic components according to the corresponding steps such that the suction nozzle 111 takes out the electronic components from the feeder 13. At this time, the start of component suction by the mounting head 11 on the lower side of the paper and the start of component suction by the mounting head 10 on the upper side of the paper, and the end of suction of all components by the mounting head 11 on the lower side of the paper and the upper side of the paper. In some cases, the end of the suction of all the components by the mounting head 10 may deviate.

  Further, after the removal, the suction nozzles 101 and 111 of both mounting heads 10 and 11 are raised so that the mounting heads 10 and 11 pass above the component recognition camera 15 and both mounting heads 10 and 11 are moved during this movement. The ten electronic parts sucked and held by the ten suction nozzles 101 and 111 are collectively picked up, and the recognition processing device 27 performs recognition processing on the picked-up images, and the respective pick-up nozzles 101 and 111 are subjected to the recognition processing. Grasp the misalignment of electronic components.

  Thereafter, the substrate recognition camera 8 provided on the mounting heads 10 and 11 of both beams 7 and 8 is moved above each printed circuit board P, and a positioning mark attached to the printed circuit board P positioned on the transport device 2. The recognition processing device 27 recognizes the captured image and grasps the position of each printed circuit board P. Thereafter, the laser displacement sensor 16 measures the height of a plurality of locations on the substrate, and grasps the surface height of the substrate. Then, by adding the position recognition result of each printed circuit board P and each component recognition processing result to the mounting coordinates of the mounting data, each suction nozzle 101, 111 corrects the mounting stroke due to the positional shift and the surface height of the board. Meanwhile, each electronic component is mounted on each printed board P.

  As described above, when the electronic component is mounted on the printed circuit board P, when the component out of the feeder 13 of the component supply device 3 occurs, the CPU 20 operates to detect that the component is out of operation. In addition, a display device such as an unillustrated indicator lamp provided in the electronic component mounting apparatus 1 blinks to notify the operator. Further, the CPU 17 operates, the motors such as the Y-direction linear motors 9 and 99 and the X-direction linear motors 23 and 223 are stopped, and the electronic component mounting operation is stopped. When the operator presses the feeder preparation button 51 shown in FIG. 3 of the monitor 20 or the monitor 201, the illuminating body 71 that has been lit is turned off and the feeder preparation button 51 is turned off. In addition, the feeder 13 can be replaced, and the operator replaces the feeder 13 in which the part has run out.

  After the replacement work is completed, first, when the operator presses the feeder preparation button 51, the light emitter 71 is turned on and the feeder preparation button 51 is turned on. Next, when the worker presses the start button 53, the electronic component mounting operation starts.

  Hereinafter, the automatic cueing operation of the electronic component when the feeder 13 is replaced will be described with reference to FIGS. FIG. 5 shows a flowchart of the automatic cueing operation of the electronic component. FIG. 6 shows a state in which the height in the storage portion 44 is measured in the state shown in the flowchart shown in FIG. 5 in the case where there is no electronic component 42 in the storage portion 44 that stores the electronic component 42 of the supply tape 41. FIG. 7 shows a state in which the height in the leading storage portion 44 that stores the electronic component 42 is measured. Reference numeral 40 denotes a suppressor 40 which is a supply tape presser.

  The CPU 17 determines whether or not an automatic cueing operation is necessary for a suction target feeder 13 (hereinafter referred to as a suction target feeder) 13 before performing an operation of sucking and taking out an electronic component from the feeder 13 (step 1). For example, as described above, when the suction target feeder 13 has not been set so far and is a newly installed feeder 13 that has been replaced, for example, the CPU 17 is sent from a control device provided in the suction target feeder 13. Based on the feeder number (serial number), it is determined that automatic cueing processing is necessary.

  As a result, the CPU 17 selects the laser displacement sensor 16 close to the suction target feeder 13 among the laser displacement sensors 16 and 16 provided on the mounting head 10 or 11 based on the suction target feeder 13 and the positions of the mounting heads 10 and 11. To do. Then, the laser displacement sensor 16 selected along with the movement of the mounting head 10 or 11 moves above the component outlet 43 formed in the suppressor 40 provided in the suction target feeder 13 shown in FIG. 2 (step 2). .

  The laser displacement sensor 16 that has reached the upper side of the component outlet projects a laser beam 45 through the component outlet 43, detects the reflected light, and measures the height of the supply tape 41 in the storage portion 44 ( Step 3). The measurement result is sent to the CPU 17, and the CPU 17 sets the threshold value Sh from the bottom surface of the storage unit 44, for example, half the thickness of the electronic component 42 as the threshold value Sh. It is determined that there is an electronic component, and if it is equal to or less than the threshold value Sh, it is determined that there is no electronic component (steps 4 and 5). When the electronic component is not present in the storage unit 44 (FIG. 6), the CPU 17 outputs a pitch feed signal to the target suction target feeder 3, and the suction target feeder 13 is one pitch that is the designated pitch, that is, Then, the supply tape 41 is fed by a distance corresponding to the interval between the storage portions 44 for storing the electronic components (step 6).

  Thereafter, until the presence / absence of an electronic component is determined by the presence / absence determination of step 5 in the same manner, the height measurement in the storage unit 44 from step 3 to step 6 and the determination of the presence / absence of electronic component in the storage unit 44 The feed tape 41 is fed one pitch repeatedly.

  When the storage unit 44 storing the electronic component 42 reaches the component take-out port 43, the CPU 17 determines that the first electronic component 42 has arrived based on the measurement result of the laser displacement sensor 16, and cues the electronic component. Ends. Then, the CPU 17 outputs a signal for starting the operation of sucking the electronic component 42 that has been cueed, and the electronic component 42 is taken out by the mounting head 10 as described with reference to FIG. .

For the feeder 13 for which automatic cueing has been completed, a flag indicating that cueing has been completed is provided in the RAM 18, and it is necessary to determine whether or not automatic cueing for the feeder 13 is required thereafter until a part shortage is detected again. It may be used for determination.
Furthermore, the feeder 13 for which the automatic cueing has been completed is not replaced by the parts supply device, and thereafter, when the production model is changed, it is not used for production, but is used again when the production model is switched. In addition, the feeder 17 is continuously managed by the CPU 17 so as not to perform the automatic cueing operation.

  According to the embodiment described above, when the suction target feeder 13 has not been set up to that point and has been replaced and newly attached, the CPU 17 determines that automatic cueing processing is necessary, and has been described above. Thus, the supply tape is fed one pitch at a time until the storage unit storing the electronic components reaches the component take-out port 43 based on the height measurement result of the storage unit by the laser displacement sensor 16 to automatically cue the electronic components. Operation is performed. Therefore, when the suction target feeder 13 is replaced, the operator does not need to perform a cueing operation. As a result, the preparation work can be simplified and the work time can be shortened. In addition, it is possible to reliably avoid an abnormality in taking out the electronic component that occurs when the cueing work by the operator is insufficient.

  Further, according to the embodiment described above, the presence or absence of the electronic component is determined based on the height measurement result of the storage unit by the laser displacement sensor 16, so that there is no difference in contrast between the supply tape and the electronic component based on the recognition image. Even in the case of a component whose presence or absence cannot be determined, the cueing operation can be reliably realized.

  Furthermore, according to the embodiment described above, the time required for the preparation work can be shortened, and the non-operation time of the electronic component mounting apparatus 1 can be reduced to improve the operation time.

  Further, even when the component supply device 3 is newly mounted in an empty lane of the feeder base 12 of the component supply device 3 or 5, when the electronic component is first taken out from the feeder 13, as in the case of replacing the feeder 13, By feeding the supply tape one pitch at a time to each feeder 13 and automatically performing cueing operation of the electronic components, the same effects as the above-described embodiment can be obtained.

Further, when the production of one board model in the electronic component mounting apparatus 1 is completed and the next board type is produced, each feeder 13 is replaced even when the component supply device 3 or 5 on which the feeder 13 is mounted is replaced. When the electronic component is taken out from the feeder 13, the feeding tape is fed to each feeder 13 one pitch at a time in the same manner as when the feeder 13 of the embodiment described above is replaced, and the electronic component is automatically cued. The same effect can be obtained.
In determining the presence / absence of an electronic component in the storage unit, a certain value from the bottom surface of the storage unit may be used as a threshold instead of a certain value. Moreover, it is good also considering the distance from the upper surface of a supply tape instead of the distance from a storage part bottom face.

  In addition, the laser displacement sensor may be a transmission type instead of a reflection type, or a sensor (photoelectric sensor, photosensor, length measurement sensor) that uses another light source may be used. An OFF output may be used as a reference.

  Moreover, the installation location of the laser displacement sensor may be installed on the component supply device side instead of on the beam. In addition, one laser displacement sensor installed on the component supply device side may scan the feeder outlet 43 of the feeder to cue the corresponding feeder.

  In the embodiment described above, the case where the storage portion of the supply tape falls within a predetermined range at the component outlet 43 has been described. However, for example, when the supply tape is automatically mounted on the feeder 13, the position of the storage unit may be shifted as indicated by the broken line in FIG. If the amount of deviation ΔX is outside the allowable range, it is necessary to correct the ΔX and perform cueing.

  In the second embodiment of the present invention, the laser displacement sensor 16 measures the deviation amount ΔX to perform cueing. FIG. 9 is a diagram showing a basic idea of measuring the displacement of the storage unit position. In FIG. 9, the horizontal axis indicates the position D in the moving direction of the supply tape, and the vertical axis indicates the height H from the bottom of the storage unit. In this embodiment, as shown in FIG. 9, the height of the storage part (carrier tape) when the storage part 44 passes through the outlet is measured with reference to the bottom part of the storage part, and the outline of the storage part (supply) The front and rear edges in the moving direction of the tape 41 are obtained. The solid line in FIG. 9 shows the outline of the storage portion 44 when the storage portion 44 comes to a predetermined position of the component outlet. The broken line is a diagram showing the outline of the storage unit that stops from the predetermined position by ΔX and stops. In FIG. 9, the difference between the two contours is the shift amount.

  Therefore, for example, when the amount of deviation described above is obtained using a storage unit in which the electronic part 42 of the first part of the supply tape 41 is not stored, and the amount of deviation is in front as shown in FIG. Move forward by ΔX. Or if it has advanced to ΔX ahead contrary to Drawing 9, the next storage part will be stopped before ΔX. After that, it is only necessary to advance one pitch at a time.

As shown in FIG. 9, it is not always necessary to measure the contour (entire range), and only a specific range, for example, a range in which a difference of only the edge of the storage unit can be measured may be measured.
Moreover, you may measure deviation | shift amount using an electronic component instead of an accommodating part. In this case, the contour of the electronic component used for cueing or the height of the specific portion, for example, the edge of the electronic component is measured. In this case, the amount of deviation is obtained assuming that the electronic component is in the center of the storage unit.

  When the slip amount is obtained, the supply tape is moved by the ratio of the shift amount with respect to one pitch. For example, when driven by a pulse motor, the amount of deviation is adjusted by adding or reducing pulses proportional to the number of pulses required to move by one pitch.

  According to the second embodiment described above, the cueing can be performed more accurately, and the electronic component can be taken out more reliably.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1: Electronic component mounting apparatus 2: Conveyance apparatus 3: Component supply apparatus 5: Component supply apparatus 7, 8: Beam 10, 11: Mounting head 13: Feeder 16: Laser displacement sensor 17: CPU (control apparatus) 18: RAM ( Storage device)
20: Monitor 40: Suppressor 41: Supply tape 42: Electronic component 43: Component outlet 44: Storage unit 45: Laser light.

Claims (7)

A supply tape storing electronic components in a plurality of storage units arranged at predetermined intervals, and a plurality of feeders for attaching the supply tape and sequentially moving the storage unit to a component outlet for taking out the electronic components are attached and detached. In an electronic component mounting apparatus that includes a component supply device that is freely provided, and that takes out the electronic component from the component outlet and mounts the electronic component on a printed circuit board.
A height measurement sensor for measuring the outline and the internal height of the storage unit that has been sequentially moved to the component outlet;
Based on the measurement result of the height measurement sensor, it is determined that an electronic component is present in the storage unit when the measurement result is equal to or greater than a certain threshold from the bottom surface of the storage unit, and the electronic component is stored in the storage unit when the measurement result is equal to or less than the threshold value. A determination means for determining that the part does not exist;
In the sequential movement, when it is determined that there is no electronic component, the supply tape is sent by a distance corresponding to the interval between the storage units, and the sequential movement is performed to start the supply unit from the front end of the supply tape. A cueing unit for cueing the supply tape by detecting a storage unit that first stores an electronic component;
A deviation amount detecting means for detecting a deviation amount from a predetermined position with respect to the component outlet of the storage unit based on a measurement result by the height measurement sensor;
Correction means for correcting the deviation amount based on the detection result of the deviation amount detection means,
The cueing device performs cueing of the supply tape after correcting the shift amount by the correcting device.   A feeder in which the height detection sensor is provided on each of two mounting heads that take out the electronic component from the component outlet and is mounted on a printed circuit board, and among the plurality of feeders, a feeder to be attracted is newly attached. In this case, the height measurement sensor close to the suction target feeder is selected, and the selected height measurement sensor is moved above the component outlet of the suction target feeder to be above the component outlet. 2. The electronic component mounting apparatus according to claim 1, wherein the height measurement sensor that has arrived measures the internal height of the storage unit.   The electronic component mounting apparatus according to claim 1, wherein the height detection sensor is a laser displacement sensor.   The electronic component mounting apparatus according to claim 1, wherein the height detection sensor is one of a photoelectric sensor, a photo sensor, and a length measurement sensor. A supply tape storing electronic components is sent to a plurality of storage units arranged at predetermined intervals, and the storage unit is sequentially moved to a component extraction port for taking out the electronic components, and the electronic component is extracted from the component extraction port and printed. In an electronic component mounting method for mounting on a substrate,
The height measurement sensor measures the outline and the internal height of the storage unit that has sequentially moved to the component outlet, and based on the measurement result, the measurement result is equal to or greater than a threshold value from the bottom surface of the storage unit. If it is determined that there is an electronic component in the storage unit, if it is less than a threshold, it is determined that there is no electronic component in the storage unit, and if it is determined that the electronic component is not present in the storage unit,
Detecting and correcting a deviation amount from a predetermined position with respect to the component outlet of the storage unit based on a measurement result of the height measurement sensor;
After correcting the amount of deviation, the electronic tape is first stored in the storage unit from the leading end of the supply tape by moving the supply tape by the distance corresponding to the interval of the storage unit. An electronic component mounting method for detecting a storage portion that is in operation and cueing the supply tape.   The cueing of the supply tape, when it is determined that there is no electronic component in the determination, the next storage unit is sequentially moved to the component outlet by sending the supply tape, and when it is determined that it is present 6. The electronic component mounting method according to claim 5, wherein the feeding of the supply tape is stopped.   The cueing of the supply tape, when it is determined that there is no electronic component in the determination, the next storage unit is sequentially moved to the component outlet by sending the supply tape, and when it is determined that it is present The electronic component mounting method according to claim 5, wherein the mounting is started.

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