JP4829941B2 - Surface mount machine - Google Patents

Description

  The present invention relates to a surface mounter, and more particularly, to a surface mounter that mounts components using a component supply tape.

  2. Description of the Related Art Conventionally, surface mounters that mount components using a component supply tape are known. (For example, refer to Patent Document 1).

  In Patent Document 1, a component is taken out from a component supply tape that is sent out from a component supply device at a predetermined pitch and moved, and a head unit for mounting the extracted component on a substrate, and an imaging unit attached to the head unit In addition, a surface mounter including an image processing apparatus that performs image processing of an image captured by an imaging unit and a control unit that controls driving of a component supply apparatus is disclosed. In this surface mounter, the imaging unit attached to the head unit captures an image of the component at the component extraction position of the component supply device, and the image processing device performs image processing on the captured image of the component. This image is used as a reference for acquiring the component interval as an initial image. Next, the control unit conveys the component supply tape of the component supply device at the minimum pitch, and the imaging unit captures an image for every one-pitch feed in a stopped state without moving. Then, the image picked up by the image processing apparatus is processed for every one pitch feed and compared with the initial image, and the above pitch feed, pick-up, and comparison with the initial image are repeated until both images match. In the surface mounter according to Patent Document 1, the control unit detects the number of pitches to which the component supply tape is sent after the initial image is captured until the image that matches the initial image is captured, thereby reducing the component spacing. Is configured to get.

JP 2002-176290 A

  However, since many types of components are mounted on the board, the components stored in the component supply tape have various sizes. In this case, the surface mounter disclosed in Patent Document 1 can capture only a part of the component when the component housed in the component supply tape is large, and the image can be displayed almost even when it is sent by one pitch at the minimum pitch. There may be no change. In this case, there is a possibility that the images may be erroneously recognized as matching even though the same part is captured. For this reason, the surface mounter disclosed in Patent Document 1 has a problem in that when components having different sizes are used, the component spacing may not be detected with high accuracy.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to provide a component spacing between components stored in a component supply tape even when components having different sizes are used. It is to provide a surface mounter capable of obtaining the accuracy with high accuracy.

Means for Solving the Problems and Effects of the Invention

In order to achieve the above object, a surface mounter according to one aspect of the present invention includes an imaging unit that images a plurality of components stored at a predetermined interval on a component supply tape sent from a component supply device, and an imaging unit. A control unit that obtains a predetermined interval based on the captured image of the component, the control unit compares the size of the component and the size of the field of view of the imaging unit , and based on the comparison result, the imaging unit When a plurality of parts to be imaged fall within the field of view of the image pickup unit, when one part to be picked up by the image pickup unit falls within the field of view of the image pickup unit, and parts picked up by the image pickup unit fall within the field of view of the image pickup unit The control unit is configured to perform control to change the imaging condition of the component according to the three cases , and the control unit is configured to control the component imaged by the imaging unit. Don't fit in the field of view If it is discriminated, control is performed so that parts adjacent to each other in the adjacent direction are picked up in multiple times and the parts interval is acquired based on the images of the parts picked up in multiple times. It is configured.

  In the surface mounter according to this aspect, as described above, when the control unit is configured to change the imaging condition of the component according to the size of the component imaged by the imaging unit, the component is large In addition, since it is possible to capture a part by capturing an image under imaging conditions suitable for a large part, even when a part having a different size is used, a predetermined interval between parts stored in the part supply tape is used. Can be obtained with high accuracy.

  In the surface mounter according to the above aspect, it is preferable that the surface mounting machine further includes a board imaging unit for detecting a position of the board on which the component is mounted, and the board imaging unit images the component stored in the component supply tape. It is comprised so that it may function also as a part. If comprised in this way, since the components accommodated in the component supply tape can be imaged using the substrate imaging unit for detecting the position of the substrate, a dedicated imaging unit is separately provided to obtain the component spacing. Unlike the case where it provides, it can suppress that a number of parts increases.

In the surface mounter according to the above aspect, the control unit preferably compares the size of the component with the size of the field of view of the imaging unit, and based on the comparison result, the plurality of components imaged by the imaging unit A case where the image is captured within the field of view of the imaging unit, a case where one component captured by the image capture unit is within the field of view of the image capture unit, and a case where a component captured by the image capture unit is not within the field of view of the image capture unit. In addition to discriminating between the three cases , control is performed to change at least one of the imaging position of the component and the number of times of imaging by the imaging unit according to the three cases . According to this configuration, when a component is small, a plurality of components are imaged at a time, and when a component is large, one component is imaged in multiple times, so that the size of the component can be adjusted. Imaging can be performed. Thereby, imaging of a component can be performed efficiently according to the size of the component.

In the surface mounter according to the above aspect, the control unit preferably compares the size of the component with the size of the field of view of the imaging unit, and based on the comparison result , a plurality of components are present in the field of view of the imaging unit. When it is determined that they fit, the imaging unit picks up a plurality of parts at a time at an imaging position where the plurality of parts fit within the field of view of the imaging unit, and acquires a predetermined interval based on the captured images of the parts It is configured to perform control . With this configuration, when the components are small and a plurality of components fit within the field of view of the imaging unit, the interval between the components can be acquired by one imaging based on the captured images of the plurality of components. . As a result, the time required for imaging the component can be shortened, and the interval between the components can be acquired efficiently.

In the surface mounter according to the above aspect, the control unit preferably compares the size of the component with the size of the field of view of the imaging unit, and based on the comparison result, one component is present in the field of view of the imaging unit. When it is determined that they fit, a plurality of parts are respectively picked up by the image pickup unit at an image pickup position where one whole part falls within the field of view of the image pickup unit, and a predetermined interval is set based on the image of each picked up part. It is configured to perform acquisition control . If comprised in this way, since the whole component can be imaged with respect to each component, the failure of imaging can be suppressed. Thereby, since it is possible to more reliably image components, it is possible to accurately acquire the interval between components.

In the surface mounter according to the above aspect, the control unit preferably compares the size of the component with the size of the field of view of the imaging unit, and the component does not fit within the field of view of the imaging unit based on the comparison result. and when it is determined, along with the imaged plural times for each of a plurality of parts by the imaging unit, a control to obtain a predetermined interval based plural times on the image of each of the components captured Configured to do . If configured in this way, even if the component is large and does not fit within the field of view of the imaging unit, it is possible to recognize a large component more reliably by capturing the component in multiple times, so the component spacing Can be obtained with higher accuracy.

  In the surface mounting machine according to the above aspect, the control unit preferably acquires the predetermined interval and is sent out by the component supply device when the predetermined interval between the components stored in the component supply tape is not specified. The feed pitch of the component supply tape is configured to coincide with a predetermined interval. According to this configuration, even when the feed pitch of the component supply device is not set at the time of mounting, the predetermined pitch of the components stored in the component supply tape can be acquired and the feed pitch of the component supply device can be set. Therefore, the mounting can be started without the operator setting the feed pitch of the component supply device. As a result, the burden on the operator can be reduced and productivity can be improved.

  In the surface mounting machine according to the above aspect, preferably, when the component supply tape is added, the control unit acquires a predetermined interval between the components stored in the added component supply tape and is added. The feeding pitch at which the component supply tape is fed is configured to coincide with a predetermined interval. With this configuration, even though the same component as the currently installed component supply tape is stored, the component supply is different from the currently installed component supply tape. Even when the tapes are added, it is possible to acquire the interval between the components and to match the feeding pitch of the component supply tape with the interval between the components. As a result, it is not necessary to set the interval between parts again, and it is possible to prevent erroneous setting, so that work efficiency can be improved.

In the surface mounting machine according to the above aspect, the imaging unit is preferably provided, and further includes a movable head unit for taking out the component from the component supply tape and mounting the component on the substrate, In this imaging position, the component is imaged while moving at a pitch equal to the minimum pitch of the component supply device corresponding to the width of the component supply tape. With this configuration, the predetermined interval of the component supply tape is an integral multiple of the minimum pitch of the component supply device. Therefore, by imaging the component while moving at the minimum pitch of the component supply device, The components stored at intervals can be reliably imaged. In the surface mounter according to the aforementioned aspect, preferably, when the control unit determines that a plurality of components imaged by the imaging unit are within the field of view of the imaging unit , the imaging unit is configured to have a predetermined interval. Are controlled by the control unit so as to image a region that can be acquired by one imaging. In the surface mounter according to the above aspect, the imaging unit is preferably configured to perform imaging from a direction facing a component housed in a component supply tape.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a plan view showing the overall configuration of a surface mounter according to an embodiment of the present invention. 2-9 is a figure for demonstrating the structure of the surface mounter shown in FIG. Hereinafter, the structure of the surface mounter 100 according to the embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, the surface mounter 100 according to the present embodiment is a device that mounts a component 120 (see FIG. 3) supplied from a tape feeder 110 on a printed board 130. The tape feeder 110 is an example of the “component supply device” in the present invention. The printed circuit board 130 is an example of the “board” in the present invention. As shown in FIG. 1, the surface mounter 100 includes a pair of substrate transport conveyors 10 extending in the X direction and a head unit 20 that can move in the XY directions above the pair of substrate transport conveyors 10. A plurality of tape feeders 110 for supplying the components 120 are arranged on both sides of the pair of substrate transport conveyors 10. The head unit 20 has a function of acquiring the component 120 from the tape feeder 110 and mounting the component 120 on the printed circuit board 130 on the substrate transport conveyor 10. The substrate transfer conveyor 10 and the head unit 20 are installed on the base 1. Hereinafter, a specific structure of the surface mounter 100 will be described.

  A pair of board | substrate conveyance conveyors 10 are comprised so that the printed circuit board 130 can be stopped and hold | maintained in a predetermined mounting operation position while conveying the printed circuit board 130 to a X direction.

  Further, as shown in FIG. 1, the tape feeder 110 is arranged in the X direction so as to face each other on the Y1 direction side and the Y2 direction side of the base 1. These tape feeders 110 are respectively attached to feeder plates (not shown) attached to the base 1. The tape feeder 110 holds a reel (not shown) around which a tape 121 holding a plurality of parts 120 (see FIG. 3) with a predetermined part interval Lp is wound. As shown in FIG. 2, the tape feeder 110 intermittently feeds the tape 121 from the reel at a predetermined pitch, and a component 120 held on the tape 121 is provided at the tip of the tape feeder 110. The component 120 is supplied by being conveyed to the component extraction unit 111. The tape 121 is an example of the “component supply tape” in the present invention. The component 120 is an electronic component such as an IC, a transistor, a capacitor, or a resistor.

  As shown in FIG. 3, the tape 121 includes a carrier tape 122 having a component storage portion 122 a for storing the component 120, and the component 120 is placed in the component storage portion 122 a of the carrier tape 122 by covering the carrier tape 122. The cover tape 123 is held. The component storage portion 122a of the carrier tape 122 is formed in a concave shape corresponding to the shape of the component 120, and is provided at a predetermined component interval Lp along the direction in which the carrier tape 122 extends. Further, the carrier tape 122 is provided with an engagement hole 122b for engaging with a sprocket 51 described later of the tape feeder 110 along the direction in which the carrier tape 122 extends. Further, as shown in FIG. 2, the cover tape 123 covering the component storage portion 122a is peeled from the carrier tape 122 at the rear end (Y2 direction in FIG. 2) of the component extraction portion 111, so that the component 120 is removed. It is configured to be exposed to the outside.

  3 and 4, the tape 121 (121a and 121b) has a width W (W1 and W2) and a component interval Lp (Lp1 and Lp2) that vary depending on the size of the component 120 accommodated in the carrier tape 122. ). As shown in FIG. 3, a small component 120a is accommodated at a component interval Lp1 on a tape 121a having a width W1. Further, as shown in FIG. 4, a large part 120b is accommodated in a part interval Lp2 in a tape 121b having a width W2. Thus, since the component interval Lp (Lp1, Lp2) of the tape 121 (121a, 121b) varies depending on the size of the component 120, when the component 120 is sucked every time pitch feed is performed at a predetermined pitch, In order to take out the parts 120 without failing to attract the parts 120, each tape feeder 110 needs to feed the tape 121 at a pitch that matches the part interval Lp of the parts 120 accommodated in the tape 121. Further, even the tape 121 that stores the same component 120 may have a different component interval Lp due to a difference in manufacturer. Therefore, when the tape 121 is replaced or added for replenishment of parts, the tape feeder 110 performs mounting after changing the size of the feed pitch so as to match the part interval Lp of the tape 121. There is a need. The tapes 121a and 121b are examples of the “component supply tape” in the present invention.

  As shown in FIGS. 6 to 9, the tape feeder 110 sends the tape 121 (121a, 121b, 121c, 121d) at a pitch that is an integral multiple of a predetermined minimum pitch L (L1, L2, L3). It is configured. The minimum pitch L of the tape feeder 110 is defined by the width W (W1, W2, W3) of the tape 121 to be loaded. For this reason, as shown in FIG. 6, in the case of the tape 121a having the width W1, the minimum pitch is the size of L1. As shown in FIG. 7, in the case of the tape 121b having the width W2, the size of the minimum pitch is L2. As shown in FIG. 8, in the case of the tape 121c having the width W3, the size of the minimum pitch is L3. On the other hand, in the case of the tape 121d having the same width W1 as that of the tape 121a, the minimum pitch is also equal to that of the tape 121a at L1. For this reason, since the component 120 is taken out without being displaced during mounting, the component interval Lp (Lp1, Lp2, Lp3, Lp4) of each tape 121 has an interval that is an integral multiple of the minimum pitch L of the tape feeder 110. It is stipulated in. Each of 121c and 121d is an example of the “component supply tape” in the present invention.

  In addition, as shown in FIG. 1, the component imaging device 11 is disposed between the pair of board conveyors 10 and the tape feeder 110 arranged so as to face each other on the Y1 direction side and the Y2 direction side of the base 1. Each is arranged. The component imaging device 11 is fixedly installed on the base 1 with the imaging direction facing upward so as to face the head unit 20. Then, the component imaging device 11 images the lower surface of the component 120 sucked by the suction nozzle 22 by moving the head unit 20 above the component imaging device 11 with the component 120 sucked by the suction nozzle 22 described later. It is configured to be able to. Thereby, the component imaging device 11 can image the suction state of the component 120 to the suction nozzle 22.

  As shown in FIG. 1, the head unit 20 is configured to be movable in the X direction along a head unit support portion 30 extending in the X direction. Specifically, the head unit support section 30 includes a ball screw shaft 31, a servo motor 32 that rotates the ball screw shaft 31, and a guide rail (not shown) in the X direction. It has a ball nut 21 to which the shaft 31 is screwed. The head unit 20 is configured to move in the X direction with respect to the head unit support 30 when the ball screw shaft 31 is rotated by a servo motor 32. Further, the head unit support portion 30 is configured to be movable in the Y direction along a pair of fixed rail portions 40 provided on the base 1 and extending in the Y direction. Specifically, the fixed rail portion 40 includes a guide rail 41 that supports both ends of the head unit support portion 30 so as to be movable in the Y direction, a ball screw shaft 42 that extends in the Y direction, and a servo motor that rotates the ball screw shaft 42. 43, and the head unit support portion 30 is provided with a ball nut 33 into which the ball screw shaft 42 is screwed. The head unit support portion 30 is configured to move in the Y direction along the guide rail 41 when the ball screw shaft 42 is rotated by the servo motor 43. With such a configuration, the head unit 20 is configured to be able to move on the base 1 in the XY directions.

  The head unit 20 is provided with six suction nozzles 22 arranged in a row in the X direction so as to protrude downward. Each suction nozzle 22 is configured to be able to generate a negative pressure state at the tip thereof by a negative pressure generator (not shown). The suction nozzle 22 can suck and hold the component 120 supplied from the tape feeder 110 at the tip by this negative pressure.

  Each suction nozzle 22 is configured to be movable in the vertical direction (Z direction in FIG. 2) with respect to the head unit 20 by a mechanism (not shown) such as a servo motor. The surface-mount machine 100 conveys the component 120 while the suction nozzle 22 is located at the raised position, performs imaging by the component imaging device 11, and the like, and the tape feeder 110 of the component 120 when the suction nozzle 22 is located at the lowered position. It is configured to perform suction and mounting on the printed circuit board 130. As shown in FIG. 1, the suction of the component 120 from the tape feeder 110 is performed in a state where the suction nozzle 22 is disposed above the component extraction portion 111 of the tape feeder 110 as the head unit 20 moves. This is done by lowering 22 to the lowered position and generating negative pressure at the nozzle tip. Further, the suction nozzle 22 is configured such that the suction nozzle 22 itself can rotate around its axis. Thereby, in the surface mounting machine 100, it is possible to adjust the attitude | position (direction in a horizontal surface) of the components 120 hold | maintained at the front-end | tip of a nozzle by rotating the adsorption nozzle 22 in the middle of conveying the components 120. FIG. .

  In the present embodiment, the substrate imaging devices 23 are attached to the head unit 20 at both ends in the X direction. The board imaging device 23 is constituted by a CCD area camera, and is attached with the imaging direction facing downward (Z2 direction) from the head unit 20, as shown in FIG. The substrate imaging device 23 is an example of the “imaging unit” and “substrate imaging unit” in the present invention. In addition, an illumination device (not shown) composed of a plurality of LEDs is provided at the lower end portion of the board imaging device 23. At the time of imaging, the imaging light emitted from the illumination device and reflected by the printed circuit board 130 is taken into the board imaging device 23 so that imaging is performed. When the component 120 is mounted, the substrate imaging device 23 acquires a reference point of the mounting position of the component 120 by imaging a board mark (not shown) provided on the surface of the printed board 130. The mounting position of the component 120 is recognized based on the captured image of the board mark. The board imaging device 23 also functions as an imaging unit that images the component 120 housed in the tape 121 by being moved above the component extraction unit 111 of the tape feeder 110 in order to acquire the component interval Lp. Is configured to do. The movement of the board imaging device 23 to the component extraction unit 111 is performed by the head unit 20 moving above the tape feeder 110.

  The operation of the surface mounter 100 is controlled by the main body control unit 2 shown in FIG. The main body control unit 2 includes a main control unit 3, an image processing unit 4, a storage unit 5, and a motor control unit 6. The main body control unit 2 is electrically connected to the feeder control unit 117 via the connector 118 of each tape feeder 110 connected to a connector (not shown) of the surface mounter 100. The main body control unit 2 is configured to perform drive control of the tape feeder 110 by sending a control signal from the main control unit 3 to the feeder control unit 117. The main control unit 3 is an example of the “control unit” in the present invention.

  The main control unit 3 is composed of a CPU that executes logical operations. The main control unit 3 performs imaging control by the component imaging device 11 and the board imaging device 23 and drive control of each servo motor via the motor control unit 6 according to the mounting program stored in the storage unit 5. It is configured.

  Further, in the present embodiment, the main control unit 3 calculates the component interval Lp of the tape 121 loaded in each of the plurality of tape feeders 110 set in the surface mounter 100 from the storage unit 5 as shown in FIG. In addition to reading, the feed pitch corresponding to the part interval Lp is designated and a control signal is sent to the feeder control unit 117 of each tape feeder 110. Here, when the component interval Lp (feed pitch) is not specified in the mounting program stored in the storage unit 5, the main control unit 3 acquires the component interval Lp of the tape 121 and sends it out by the tape feeder 110. The feed pitch of the tape 121 is made to coincide with the acquired component interval Lp. The acquisition of the component interval Lp is executed when the surface mounting machine 100 starts mounting on the printed circuit board 130.

  In the present embodiment, the main control unit 3 is configured to capture the component 120 by the board imaging device 23 and acquire the component interval Lp of the tape 121 based on the captured image of the component 120. . At this time, the main control unit 3 is configured to change the imaging conditions (imaging position and number of imaging) of the component 120 according to the size of the component 120 imaged by the board imaging device 23.

  In the present embodiment, when acquiring the component interval Lp of the tape 121, the main control unit 3 compares the size of the component 120 accommodated in the tape 121 with the size of the visual field of the board imaging device 23. The imaging position and the number of imaging of the component 120 by the board imaging device 23 are changed according to the size of the component 120. Specifically, as shown in FIG. 6, when a plurality of components 120 a (120) fit within the field of view Sc of the board imaging device 23, the plurality of components 120 a (120) A plurality of (two in the present embodiment) parts 120a (120) are picked up at a time at an image pickup position that falls within. And the main control part 3 is comprised so that component space | interval Lp1 (Lp) may be acquired based on the image of several imaged components 120a (120).

  In the present embodiment, as shown in FIG. 7, when one component 120 b (120) fits in the field of view Sc of the board imaging device 23, the main control unit 3 makes the entire component 120 b (120). Is configured to image each of the plurality of components 120b (120) at an imaging position within the field of view Sc of the board imaging device 23. And the main control part 3 is comprised so that component space | interval Lp2 (Lp) may be acquired based on the image of each imaged component 120b (120).

  Further, in the present embodiment, as shown in FIG. 8, when the component 120 c (120) does not fit within the field of view Sc of the board imaging device 23, the main control unit 3 causes the component 120 c adjacent to the board imaging device 23 to be adjacent. Each of (120) is divided into a plurality of times (four times in the present embodiment) and imaged. The main control unit 3 is configured to acquire the component interval Lp3 (Lp) based on the images of the respective components 120c (120) imaged in a plurality of times.

  Further, as shown in FIGS. 6 to 9, when acquiring the component interval Lp (Lp1, Lp2, Lp3, Lp4), the board imaging device 23, as described above, the component 120 (120a, 120b, 120c). The part 120 is imaged while moving at a pitch equal to the minimum pitch L (L1, L2, L3) of the tape feeder 110 corresponding to the width W (W1, W2, W3) of the tape 121 at the imaging position corresponding to the size of the tape 121. Is configured to do.

  At the time of mounting, splicing of the tape 121 is performed to replenish the component 120. At this time, the tape 121 holding the same component 120 may have a component interval Lp different from that of the original tape 121 if the manufacturer is different. That is, when the tape 121a (121) shown in FIG. 6 is spliced with the tape 121d (121) (see FIG. 9) having the same component 120a (120), the component 120a (120) is mounted during mounting. The interval changes from Lp1 (3 pitches of the minimum pitch L1) to Lp4 (2 pitches of the minimum pitch L1). For this reason, when the tape 121d is spliced to the tape 121a for replenishment of the component 120a, the main control unit 3 acquires the component interval Lp4 of the component 120a stored in the added tape 121d and the tape 121d. The feed pitch is made to coincide with the acquired component interval Lp4.

  As shown in FIG. 5, the image processing unit 4 generates image data suitable for performing image recognition of the component 120 by performing predetermined image processing on the imaging signal output from the main control unit 3. Is configured to do. The image processing unit 4 is configured to output the generated image data to the main control unit 3.

  The storage unit 5 includes a ROM (Read Only Memory) that stores a program for controlling the CPU and a captured image, a component interval Lp of the component 120 stored in the tape 121, and a RAM (Random Access Memory) that can be rewritten. ). The storage unit 5 stores a mounting program for manufacturing a predetermined printed circuit board 130. At the time of mounting, the mounting program is read from the main control unit 3, and the surface mounter 100 is controlled according to the mounting program, whereby the component 120 is mounted. The mounting program includes the type, shape, mounting position and angle of the component 120 mounted on the printed circuit board 130, the width W of the tape 121 in which the component 120 is stored, the component interval Lp, the number of components 120 to be stored, The position of the tape feeder 110 loaded with the tape 121, the feed pitch, and other information necessary for manufacturing the printed circuit board 130 are defined. However, there is a case where the component interval Lp of the tape 121 is unknown at the time of creating the mounting program. In this case, the part interval Lp (= feed pitch of the tape feeder 110) is not specified.

  Based on the control signal output from the main control unit 3, the motor control unit 6 includes each servo motor of the surface mounter 100 (servo motor 43 for moving the head unit support unit 30 in the Y direction (see FIG. 1)). The servo motor 32 (see FIG. 1) for moving the head unit 20 in the X direction and the servo motor (not shown) for moving the suction nozzle 22 in the vertical direction are controlled. The motor control unit 6 moves the head unit 20 to a preset mounting position of the component 120 by a control signal from the main control unit 3 at the time of mounting, and at the time of obtaining the component interval Lp, the suction nozzle 22. The head unit 20 is moved so that the board imaging device 23 is arranged at the same position as the position where the suction of the component 120 is performed.

  Next, the structure of the tape feeder 110 will be described. Here, one of a plurality of tape feeders 110 (see FIG. 1) arranged on the Y2 direction side of the base 1 will be described as an example.

  As shown in FIG. 2, the tape feeder 110 is provided with a component take-out part 111 at the front end (Y1 direction). In addition, a tape passage 112 is continuously provided in the tape feeder 110 up to the component extraction unit 111. A tape storage unit 113 is disposed at the rear of the tape feeder 110. A handle 114 for carrying the tape feeder 110 is attached to the upper surface of the tape storage portion 113. Further, a feeder control unit 117 that controls the feeding of the tape 121 is provided below the tape feeder 110. An engaging member 115 for attaching the tape feeder 110 is provided in front of the feeder controller 117. Further, below the engagement member 115, a connector 118 for electrically connecting the main body control unit 2 and the feeder control unit 117 of the surface mounting machine 100 protrudes from the front side (Y1 direction side) of the feeder control unit 117. It is provided to do.

  As shown in FIGS. 1 and 2, the component take-out portion 111 is provided with an opening 111 a on the upper surface of the tape feeder 110. Through the opening 111 a, the tape passage 112 is exposed to the outside of the tape feeder 110 in the component extraction unit 111. The component 120 held on the tape 121 delivered through the tape passage 112 is taken out by the suction nozzle 22 of the head unit 20 through the opening 111a of the component take-out portion 111, and at the same time the component 120 by the board imaging device 23. Imaging is performed.

  As shown in FIG. 2, the tape passage 112 passes through the inside of the tape feeder 110 from the lower end portion on the rear (Y2 direction) side to the component extraction portion 111 located on the upper surface on the front (Y1 direction) side. Is provided. A pair of sensors 116 are provided in the middle of the tape path 112 so as to sandwich the tape 121 passing through the tape path 112 from above and below (Z direction). The pair of sensors 116 is an optical sensor including a light emitting unit and a light receiving unit. When the tape 121 is spliced to replenish the component 120, the sensor 116 detects the joint of the tape 121. Further, below the component take-out unit 111 (Z2 direction), a tape transport unit 50 for sending out the tape 121 in which the component 120 is stored is arranged. The tape storage portion 113 provided above the tape passage 112 is formed in a box shape so as to store the cover tape 123 peeled off by the component extraction portion 111. Further, a tape inlet 113a is provided on the upper side of the tape storage portion 113 on the Y1 direction side. A tape delivery unit 60 is disposed at the tape introduction port 113a.

  Further, a handle 114 is attached to the upper surface of the tape storage portion 113 so as to be rotatable at a predetermined angle. The handle 114 is connected to an engaging member 115 attached to the lower side of the tape feeder 110 by a link member (not shown). The engaging member 115 is configured to fix the tape feeder 110 to the surface mounter 100 by engaging with a feeder plate (not shown) attached to the base 1. When the tape feeder 110 is fixed to the surface mounter 100 by the engaging member 115, a connector 118 provided below the engaging member 115 so as to protrude from the front side of the feeder controller 117 is provided on the surface mounter 100 side. It is configured to be connected to a connector (not shown). The connector 118 includes a signal line, a power line, and the like, and electrically connects the main body control unit 2 of the surface mounter 100 and the feeder control unit 117 of the tape feeder 110 by connecting to a connector on the surface mounter 100 side. It is configured as follows. Thereby, as shown in FIG. 5, it is possible to link the component suction operation of the surface mounter 100 and the tape feeding operation of the tape feeder 110.

  The tape transport unit 50 of the tape feeder 110 transmits the driving force of the driving motor 52 to the sprocket 51 for pulling out the tape 121 from the reel and feeding the carrier tape 122, the driving motor 52 for rotating the sprocket 51, and the sprocket 51. And an intermediate gear portion 53. The sprocket 51 is provided with a plurality of feed dogs 51a at predetermined intervals on the outer peripheral portion. The feed dogs 51a protrude from the bottom surface of the tape passage 112 and engage holes 122b of the carrier tape 122 (see FIG. 3). ). Then, when the driving force of the drive motor 52 is transmitted through the intermediate gear portion 53, the sprocket 51 rotates and pulls out the tape 121 from the reel to the component take-out portion 111, and the cover tape 123 is peeled off. The carrier tape 122 is sent out.

  At the time of mounting the component 120, the sprocket 51 cooperates with the suction operation of the component 120 by the suction nozzle 22 of the head unit 20 at a predetermined pitch that matches the component interval Lp of the components 120 stored in the carrier tape 122. Intermittent driving for feeding out the tape 121 is performed. Thus, the component 120 is conveyed to the opening 111 a of the component extraction unit 111, and the components 120 are sequentially extracted by the suction nozzle 22 of the head unit 20.

  As shown in FIG. 2, the tape 121 transported to the component extraction unit 111 by the sprocket 51 is configured such that the cover tape 123 is peeled off by the tape delivery unit 60 at the Y2 direction end of the component extraction unit 111. ing.

  As shown in FIG. 2, the tape delivery unit 60 includes a feed roller 61 that is rotatably provided to feed the cover tape 123 to the tape storage unit 113, and a drive motor 62 that rotates the feed roller 61. The intermediate gear portion 63 for transmitting the driving force of the drive motor 62 to the feed roller 61 and the take-up lever 64 having a pressure roller 64a that sandwiches the cover tape 123 together with the feed roller 61. The feed roller 61 is disposed so as to face the pressing roller 64 a, and is configured to rotate when the driving force of the drive motor 62 is transmitted through the intermediate gear portion 63. The feed roller 61 is configured to be fed to the tape storage portion 113 while peeling the cover tape 123 from the carrier tape 122 by rotating while sandwiching the cover tape 123 together with the pressing roller 64a attached to the take-up lever 64. ing.

  The tape feeder 110 is configured to be controlled by a feeder control unit 117 (see FIG. 5). As shown in FIG. 5, the feeder control unit 117 includes a main control unit 117a, a motor control unit 117b, and a storage unit 117c.

  The main control unit 117a is composed of a CPU that executes logical operations. The main control unit 117a is configured to link the component suction operation of the surface mounter 100 and the tape feeding operation of the tape feeder 110 based on a control signal from the main control unit 3 of the surface mounter 100. When the feed pitch is designated by the control signal from the main control unit 3 of the surface mounter 100, the main control unit 117a stores the feed pitch in the storage unit 117c and outputs a control signal to the motor control unit 117b. Thus, the tape 121 is fed at a designated feed pitch.

  In addition, when the splicing of the tape 121 is performed, the main control unit 117a outputs the position of the joint of the tape 121 detected by the sensor 116 to the main body control unit 2 of the surface mounter 100 via the connector 118. It is configured as follows. The main control unit 3 of the main body control unit 2 reads the information of the newly added tape 121 from the storage unit 5 of the main body control unit 2 when the sensor 116 detects the joint of the tape 121, and also feeds the feeder. A control signal is output to the control unit 117 to set a feed pitch that matches the part interval Lp of the parts 120 of the new tape 121.

  The motor control unit 117b controls the rotation of the drive motor 52 of the tape transport unit 50 and the drive motor 62 of the tape delivery unit 60 based on the control signal output from the main control unit 117a. The feed amount of 122 and the feed amount of the cover tape 123 by the tape delivery unit 60 are adjusted to be substantially the same. At this time, the sprocket 51 is intermittently driven at a designated feed pitch.

  The storage unit 117c includes a ROM that stores a program for controlling the CPU, and a RAM that stores a feed pitch output from the main control unit 3 of the surface mounter 100.

  FIG. 10 is a flowchart for explaining the operation of acquiring the tape component interval. Next, with reference to FIG. 5 to FIG. 8 and FIG. 10, an operation of acquiring the component interval Lp of the tape 121 by the surface mounter 100 of this embodiment will be described.

  As described above, the acquisition of the component interval Lp of the tape 121 needs to be performed when the component interval Lp of the tape 121 (= feeding pitch of the tape feeder 110) is not specified in the mounting program stored in the storage unit 5. There is. Therefore, in step S1, the main control unit 3 reads a mounting program from the storage unit 5 at the start of mounting, and determines whether or not a feed pitch is specified for each tape feeder 110 set in the surface mounter 100. To do. For the tape feeder 110 for which the feed pitch is designated, the designated feed pitch is set in the tape feeder 110 by outputting a control signal from the main control unit 3 to the feeder control unit 117 in step S17. The component 120 is picked up and mounted at the feed pitch specified in step S18. On the other hand, if the feed pitch is not specified, the process proceeds to step S2.

  In step S2, when the head unit 20 is moved, the board imaging device 23 is arranged above the component extraction unit 111 (Z1 direction). Specifically, as shown in FIG. 5, the board imaging device 23 is disposed at the same position as the position where the component 120 is sucked by the suction nozzle 22. At the time of starting the mounting, the surface mounter is in a state where the tape 121 loaded in the tape feeder 110 is pulled out to a position where the component 120 is sucked by the suction nozzle 22 of the component pick-up unit 111 (a state where the head is cueed). Since it is set to 100, the component 120 is disposed immediately below the board imaging device 23.

  Next, in step S <b> 3, the main control unit 3 reads the shape data of the component 120 from the storage unit 5, and compares the size of the component 120 with the size of the visual field Sc of the board imaging device 23. Then, the main controller 3 changes the imaging condition under the following conditions (1) to (3) according to the size of the component 120 to acquire the component interval Lp.

  As a condition of (1), when the sum of the size of the component 120 and the minimum pitch L is smaller than 1/2 of the visual field Sc of the board imaging device 23 (in the case of the component 120a in FIG. 6), a plurality of components It is determined that the batch recognition of 120a is possible, and the process proceeds to step S4. Further, as the condition (2), the sum of the size of the component 120 and the minimum pitch L is ½ or more of the imaging field of view Sc of the board imaging device 23 and the size of the field of view Sc of the board imaging device 23. If the size of the component 120 is small (component 120b), it is determined that one component 120b can be individually recognized, and the process proceeds to step S9. If the size of the component 120 is equal to or larger than the size of the field of view Sc of the board imaging device 23 (component 120c) as the condition of (3), the process proceeds to step S19 and division recognition of the component 120c is performed.

  Here, the sum of the size of the component 120 and the minimum pitch L is smaller than ½ of the size of the visual field Sc of the board imaging device 23, as shown in FIGS. Regarding (Y direction), the sum of the length A (A1, A2, A3) of the component 120 in the Y direction and the minimum pitch L (L1, L2, L3) is the width A0 of the visual field Sc of the board imaging device 23 in the Y direction. And the length B (B1, B2, B3) of the component 120 in the X direction with respect to the width direction (X direction) of the tape 121 is the width of the visual field Sc of the board imaging device 23 in the X direction. It is smaller than B0. In this embodiment, the width A0 in the Y direction and the width B0 in the X direction of the visual field Sc of the substrate imaging device 23 are equal, and the visual field Sc has a square shape.

  Hereinafter, details of the operation in the case where the conditions (1) to (3) in step S3 are satisfied will be described.

  First, a case where the condition (1) is satisfied will be described. As shown in FIG. 6, the component 120a housed in the tape 121a has a relationship of length A1 + minimum pitch L1 <(1/2) A0 of the component 120a with respect to the Y direction, and the length of the component 120a with respect to the X direction. And B1 <B0. For this reason, the two parts 120a fit in the visual field Sc. Therefore, in step S3, it is determined that the condition (1) is satisfied, and the process proceeds to step S4.

  In step S4, the main control unit 3 images the plurality of components 120a by the board imaging device 23, reads the shape data of the components 120a from the storage unit 5, and performs batch recognition of the plurality of components 120a. In step S6, it is determined whether or not a plurality of (two) components 120a have been successfully recognized. Here, when the two parts 120a are not within the visual field Sc of the board imaging device 23, it is determined that the recognition has failed, and the process proceeds to step S6. In step S6, the main control unit 3 drives the head unit 20 to move the board imaging device 23 by the minimum pitch L1, and tries the batch recognition in step S4 again. In this way, in steps S4 to S6, the batch recognition and the minimum pitch (L1) movement of the board imaging device 23 are repeated until the batch recognition of the plurality of components 120a is successful. On the other hand, as shown in FIG. 6, when the two components 120a are within the field of view Sc of the board imaging device 23, the process proceeds to step S7 by successfully recognizing two adjacent components 120a.

  If the batch recognition is successful, as shown in FIG. 6, in step S7, based on the recognition result of the two components 120a, the component center positions C1 and C2 of the respective components 120a are calculated. In step S8, the main control unit 3 obtains the component interval Lp1 by calculating the distance between the component center positions C1 and C2 of the adjacent components 120a.

  Thereafter, in step S17, the main control unit 3 outputs the acquired component interval Lp1 to the feeder control unit 117 of the tape feeder 110, and sets the feed pitch of the tape 121a to coincide with the component interval Lp1. The main control unit 117a of the feeder control unit 117 stores the received feed pitch (part interval Lp1) in the storage unit 117c.

  As described above, when the sum of the size of the component 120 and the minimum pitch L is smaller than ½ of the visual field Sc of the board imaging device 23 (when the condition (1) is satisfied), a plurality (2 The component interval Lp1 is acquired by batch recognition of the component 120a.

  Next, a case where the condition (2) of step S3 is satisfied will be described.

  As shown in FIG. 7, the component 120b accommodated in the tape 121b has a length A2 + minimum pitch L2> (1/2) A0 of the component 120b in the Y direction and a length A2 <A0 of the component 120b. Have a relationship. Further, with respect to the X direction, there is a relationship of the length B2 <B0 of the component 120b. Therefore, the whole of one part 120b fits in the visual field Sc. In this case, it is determined in step S3 that the condition (2) is satisfied, and the process proceeds to step S9.

  In step S9, the main control unit 3 images the component 120b from the board imaging device 23, reads shape data of the component 120b from the storage unit 5, and recognizes the component 120b from the captured image data.

  And as shown in FIG. 7, in step S10, the main control part 3 acquires the component center position C1 of the recognized component 120b. In step S11, the component center position C1 is stored in the storage unit 5 as the first component center position C1.

  Next, as shown in FIG. 7, the main control unit 3 moves the board imaging device 23 by the minimum pitch L2 in step S12 in order to perform image recognition of the adjacent component 120b, and in step S13, Component recognition of the component 120b is performed. As a result of the component recognition, if the entire next component 120b does not fit in the field of view Sc of the board imaging device 23, it is determined in step S14 that the component recognition has failed, and the process proceeds to step S12 and the minimum pitch ( L2) The movement and the component recognition in step S13 are repeated.

  On the other hand, when it is determined in step S14 that the recognition of the component 120b is successful, as shown in FIG. 7, in step S15, the main control unit 3 sets the second component center position C2 of the recognized next component 120b. get. In step S <b> 16, the main control unit 3 obtains the component interval Lp <b> 2 by calculating the distance between the first component center position C <b> 1 and the second component center position C <b> 2 stored in the storage unit 5. .

  Thereafter, in step S17, the main control unit 3 outputs the acquired component interval Lp2 to the feeder control unit 117 of the tape feeder 110, and sets the feed pitch of the tape 121b to coincide with the component interval Lp2. The main control unit 117a of the feeder control unit 117 stores the received feed pitch (part interval Lp2) in the storage unit 117c.

  As described above, the sum of the size of the component 120 and the minimum pitch L is ½ or more of the imaging field of view Sc of the board imaging device 23, and the component 120 is larger than the size of the field of vision Sc of the board imaging device 23. Is small (when the condition (2) is satisfied), the component interval Lp2 is acquired by individually recognizing the component 120b.

  Next, the case where the condition (3) of step S3 is satisfied will be described.

  As shown in FIG. 8, the component 120c accommodated in the tape 121c has a relationship of length A3> A0 of the component 120c with respect to the Y direction, and a relationship of length B3> B0 of the component 120c with respect to the X direction. Have. For this reason, it can be seen that the part 120c does not fit in the field of view Sc. In this case, it is determined in step S3 that the condition (3) is satisfied, and the process proceeds to step S19.

  In step S19, the first component center position C1 and the second component center position C2 of the adjacent component 120c are acquired by performing division recognition of the component 120c. The details of the division recognition of the component 120c will be described later.

  Next, in step S20, the part interval Lp3 is acquired by calculating the distance between the acquired first part center position C1 and the second part center position C2.

  Thereafter, in step S17, the main control unit 3 outputs the acquired component interval Lp3 to the feeder control unit 117 of the tape feeder 110, and sets the feed pitch of the tape 121c to coincide with the component interval Lp3. The main control unit 117a of the feeder control unit 117 stores the received feed pitch (part interval Lp3) in the storage unit 117c.

  In this way, when the size of the component 120 is equal to or larger than the size of the visual field Sc of the board imaging device 23 (when the condition (3) is satisfied), the component interval Lp3 is obtained by performing the division recognition of the component 120c. Is acquired.

  As described above, when the component interval Lp (Lp1, Lp2, Lp3) is acquired and the feed pitch is set in the tape feeder 110, the tape 121 is intermittently fed at the set feed pitch (Lp) in step S18. At the same time, the component 120 is sucked and mounted.

  As described above, even when the feed pitch is not set at the start of mounting, the component interval Lp of the tape 121 loaded in the tape feeder 110 is acquired, and the acquired component interval Lp is fed to the tape feeder 110. By setting the pitch, the mounting of the component 120 on the printed board 130 by the surface mounter 100 is started.

  FIG. 11 is a flowchart showing a flow of an operation (subroutine) at the time of component division recognition shown in step S19 of FIG. Next, with reference to FIG. 8 and FIG. 11, the division recognition operation of the component 120c when acquiring the component interval Lp of the tape 121c according to one embodiment of the present invention will be described.

  In the present embodiment, as shown in FIG. 8, in the division recognition, the four corners P1 to P4 of the large component 120c are imaged by the board imaging device 23, respectively, and the main control unit 3 detects each corner P1 to P1. The component 120c is divided and recognized based on the image of P4 and the shape data of the component 120c stored in the storage unit 5. Here, since the cue of the tape 121c loaded in the tape feeder 110 is set at the start of mounting, as shown in FIG. 5, the component takeout unit 111 is directly below the board imaging device 23 as shown in FIG. A part 120c is arranged.

  First, in step S31, the main controller 3 reads shape data of the component 120c from the storage unit 5, and moves the board imaging device 23 to the first corner P1 of the component 120c based on the shape data. As shown in FIG. 8, the visual field of the board | substrate imaging device 23 at this time becomes Sc1.

  Next, in step S32, the board imaging device 23 images the first corner P1, and recognizes the first corner P1 of the component 120c based on the shape data of the component 120c, thereby recognizing the first corner P1. The position is obtained.

  In step S33, the board imaging device 23 is moved to the second corner P2 of the component 120c. As shown in FIG. 8, the visual field of the board | substrate imaging device 23 at this time is moved to Sc2.

  Next, in step S34, the board | substrate imaging device 23 images the 2nd corner | angular part P2. And the main control part 3 acquires the position of the 2nd corner | angular part P2 by image-recognizing the 2nd corner | angular part P2 of the component 120c based on the shape data of the component 120c.

  In step S35, the board imaging device 23 is moved to the third corner P3 of the component 120c. As shown in FIG. 8, the visual field of the board | substrate imaging device 23 at this time is moved to Sc3.

  Next, in step S36, the board | substrate imaging device 23 images the 3rd corner | angular part P3. The main control unit 3 recognizes an image of the third corner P3 of the component 120c based on the read shape data of the component 120c, thereby acquiring the position of the third corner P3.

  In step S37, the board imaging device 23 is moved to the fourth corner P4 of the component 120c. As shown in FIG. 8, the visual field of the board | substrate imaging device 23 at this time is moved to Sc4.

  Next, in step S38, the substrate imaging device 23 images the fourth corner P4. Then, the main controller 3 recognizes an image of the fourth corner P4 of the component 120c based on the read shape data of the component 120c, thereby acquiring the position of the fourth corner P4.

  Thus, as shown in FIG. 8, the positions of the four corners P1 to P4 of the first part 120c are acquired. Based on the positions of the first corner portion P1 to the fourth corner portion P4, the main control portion 3 calculates the first component center position C1 in step S39 and also acquires the first component center position C1 acquired in step S40. Is stored in the storage unit 5.

  In step S41, the board imaging device 23 is moved by the minimum pitch L3 of the tape feeder 110 in order to recognize the adjacent component 120c. Here, in step S <b> 42, an attempt is made to detect the next component 120 c by performing imaging with the board imaging device 23. In step S43, the presence / absence of the part 120c in the visual field Sc is determined, and the minimum pitch (L3) movement from step S41 to step S43 and the board imaging until the next part 120c enters the visual field Sc from the captured image data. The imaging with the device 23 is repeated.

  When the next part 120c is confirmed in the visual field Sc in step S43, the process proceeds to step S44. That is, in step S44, the board imaging device 23 is moved to the first corner P5 based on the shape data of the component 120c. At this time, the visual field of the board imaging device 23 is Sc5. In step S45, the board imaging device 23 images the first corner P5 of the component 120c, and acquires the position of the first corner P5. The subsequent processing up to step S52 is the same as the processing for obtaining the first component center position C1 of the component 120c (processing from step S33 to step S40).

  Therefore, by the processing from step S46 to step S51, the positions of the second corner P6 (field Sc6), the third corner P7 (field Sc7), and the fourth corner P8 (field Sc8) of the part 120c are changed. To be acquired. In step S52, the second component center position C2 is calculated based on the positions of the first corner portion P5 to the fourth corner portion P8.

  As described above, the first component center position C1 and the second component center position C2 are calculated even in the case of the component 120c that does not fit in the field of view Sc of the board imaging device 23. Then, as shown in FIG. 10, the process proceeds to step S20, and the distance between the first part center position C1 and the second part center position C2 acquired by the main control unit 3 is calculated, whereby the tape 121c. The component interval Lp3 is acquired.

  FIG. 12 is a flowchart showing a flow of operation when splicing (tape addition) is performed for replenishment of parts. Next, with reference to FIGS. 2, 6, 9, and 12, an operation of acquiring the component interval Lp of the tape 121 during splicing of the surface mounter 100 according to the embodiment of the present invention will be described.

  Splicing of the tape 121 is performed by an operator using a dedicated jig. The new tape 121 spliced by splicing is fed into the tape passage 112 of the tape feeder 110 as the supply of the component 120 proceeds.

  First, as shown in FIG. 2, when the tape 121 spliced by splicing is sent to the tape path 112 inside the tape feeder 110 and passes between the sensors 116, a new tape 121 is obtained by the sensor 116 in step S <b> 61. A seam is detected. At this time, a detection signal is output from the sensor 116 to the main control unit 3 of the surface mounter 100 via the main control unit 117 a of the feeder control unit 117. As a result, the main control unit 3 acquires the joint position of the tape 121.

  In step S62, the main control unit 3 reads the mounting program stored in the storage unit 5 and acquires the component interval Lp (feed pitch) of the components 120 stored in the newly added tape 121. In step S63, when the component interval Lp of the spliced tape 121 is not specified in the mounting program, the process proceeds to step S64, where the component interval Lp of the tape 121 is acquired, and the newly acquired component interval Mounting is performed with Lp set as the feed pitch. The acquisition of the component interval Lp of the tape 121 in step S64 is performed by the same processing (processing from step S2 to step S17 and steps S19 and S20) as in the flowchart shown in FIG. To do. As a result, even when the tape 121d shown in FIG. 9 is spliced to the tape 121a shown in FIG. 6, a new component interval Lp4 of the tape 121d is obtained, and mounting is performed at a feed pitch that matches the component interval Lp4 of the tape 121d. Is continued. At this time, the feed pitch is set to Lp1 when the main controller 3 sends the joint portion of the new tape 121d to the component take-out portion 111 based on the acquired distance between the tape 121d and the known tape passage 112. To Lp4.

  Further, when the component program Lp (feed pitch) of the spliced tape 121 is specified in the mounting program stored in the storage unit 5, the process proceeds to step S65 and the setting of the feed pitch of the tape feeder 110 is changed. Determine if you need to. As described above, when the tape 121d of FIG. 9 is spliced to the tape 121a of FIG. 6, it is necessary to change the feed pitch of the tape feeder 110. Therefore, the process proceeds to step S66 and a new feed pitch is set. The setting is made in the storage unit 5 and the mounting is continued in step S67.

  When the same tape 121a is spliced to the tape 121a, the setting of the feed pitch of the tape feeder 110 does not need to be changed. In this case, it is determined in step S65 that it is not necessary to change the feed pitch setting, and the mounting is continued in step S67.

  As described above, even when the tape 121 having a different component interval Lp of the tape 121 is spliced, the component interval Lp of the tape 121 is acquired and mounting is performed by setting a new feed pitch of the tape 121.

  In the present embodiment, as described above, the main control unit 3 is configured to change the imaging condition of the component 120 according to the size of the component 120 imaged by the board imaging device 23, whereby the component 120 Even when the component 120c is large (in the case of the component 120c), the component 120c can be imaged under the imaging conditions suitable for the large component 120c, and the component interval Lp can be acquired. The component interval Lp of the components 120 housed in 121 can be obtained with high accuracy.

  In the present embodiment, as described above, the position of the printed circuit board 130 is detected by configuring the board imaging device 23 so as to function also as an imaging unit that images the component 120 housed in the tape 121. Since the component 120 housed on the tape 121 can be imaged using the board imaging device 23 for the purpose, the number of components increases unlike the case where a separate dedicated imaging unit is provided to acquire the component interval Lp. Can be suppressed.

  In the present embodiment, as described above, the main control unit 3 determines the size of the component 120 (the length A in the Y direction and the length B in the X direction) and the size of the visual field Sc of the board imaging device 23. By comparing (A0 and B0) and changing the imaging position and the number of times of imaging of the component 120 by the board imaging device 23 according to the size of the component 120, the component 120 is small (component 120a). ), The plurality of parts 120a are imaged at a time, and when the part 120 is large (part 120c), the part 120c is imaged in a plurality of times (four times in the present embodiment). The imaging according to the magnitude | size of can be performed. Thereby, imaging of the component 120 can be efficiently performed according to the size of the component 120.

  Further, in the present embodiment, as described above, the main control unit 3 compares the size of the component 120 with the size of the field of view Sc of the board imaging device 23, and compares the size of the component 120 and the field of view Sc of the board imaging device 23. When the component 120 is accommodated (in the case of the component 120a), the plurality of components 120a are imaged at the same time by the substrate imaging device 23 at the imaging position where the plurality of components 120a are within the visual field Sc of the substrate imaging device 23, and the images are captured. By configuring so as to acquire the component interval Lp based on the images of the plurality of components 120a, the component 120 is small, and when the plurality of components 120a are within the field of view Sc of the board imaging device 23, the images are captured. The component interval Lp can be acquired by one imaging based on the images of the plurality of components 120a. Thereby, since the time required for imaging the component 120 can be shortened, the component interval Lp can be acquired efficiently.

  In the present embodiment, as described above, the main control unit 3 compares the size of the component 120 with the size of the visual field Sc of the board imaging device 23, and compares the size of the component 120 with the visual field Sc of the board imaging device 23. When the component 120 is accommodated (in the case of the component 120b), the plurality of components 120b are respectively imaged by the substrate imaging device 23 at the imaging position where the entire one component 120b is within the visual field Sc of the substrate imaging device 23. By configuring so as to acquire the component interval Lp based on the images of the respective components 120b, it is possible to image the entire component 120b with respect to each component 120b, thereby suppressing imaging failure. it can. Thereby, since imaging of the component 120 can be performed more reliably, the component interval Lp can be obtained with high accuracy.

  Further, in the present embodiment, as described above, the main control unit 3 compares the size of the component 120 with the size of the field of view Sc of the board imaging device 23, so that the component 120 is within the field of view Sc of the board imaging device 23. If the image does not fit (in the case of the component 120c), the board imaging device 23 captures images of each of the plurality of components 120c in four times, and the images of each component 120c captured in four times. By configuring so as to acquire the component interval Lp based on this, even when the component 120 is large and does not fit in the field of view Sc of the board imaging device 23, the component 120c is imaged in four steps to obtain a large component. Since 120c can be recognized more reliably, the component interval Lp can be acquired more accurately.

  In the present embodiment, as described above, the main control unit 3 acquires the component interval Lp and sends it out by the tape feeder 110 when the component interval Lp of the component 120 stored in the tape 121 is not specified. By configuring the feed pitch of the tape 121 to match the component interval Lp, the component interval Lp of the component 120 accommodated in the tape 121 is obtained even when the feed pitch of the tape feeder 110 is not set at the time of mounting. Since the feed pitch of the tape feeder 110 can be set, the mounting can be started without the operator setting the feed pitch of the tape feeder 110. As a result, the burden on the operator can be reduced and productivity can be improved.

  Further, in the present embodiment, as described above, when the tape 121 is added (splicing), the main control unit 3 acquires the component interval Lp of the components 120 stored in the added tape 121, and By configuring the feeding pitch at which the added tape 121 is sent out to coincide with the component interval Lp, the same component 120a as the tape 121a currently installed is stored, but the currently installed tape 121a is stored. Even when a tape 121d having a different component interval Lp from that of the tape 121a is added, the component interval Lp (Lp4) is acquired and the feed pitch of the tape 121 (121d) is set to the component interval Lp (Lp4). Can be matched. As a result, it is not necessary to set the component interval Lp again, and it is possible to prevent erroneous setting, thereby improving work efficiency.

  Further, in the present embodiment, as described above, the board imaging device 23 moves the component while moving at the minimum pitch L of the tape feeder 110 corresponding to the width W of the tape 121 above the component extraction unit 111 (Z1 direction). Since the component interval Lp of the tape 121 is an integral multiple of the minimum pitch L of the tape feeder 110 by being configured to perform the imaging of 120, the imaging of the component 120 is performed while moving at the minimum pitch L of the tape feeder 110. By doing so, it is possible to reliably image the component 120 accommodated at the component interval Lp.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the above-described embodiment, the substrate imaging device 23 is configured to image the component 120 stored in the tape 121 in order to acquire the component interval Lp. The board imaging device 23 is not limited to imaging the component. A dedicated imaging unit for imaging the component 120 may be provided separately. Further, when the surface mounter 100 is provided with another imaging unit capable of imaging the component 120 housed on the tape 121, the imaging unit may be used. In this case, it may be configured to change which imaging unit performs imaging according to the size of the component, the position of the component supply apparatus that holds the component, and the like. The imaging unit only needs to be able to image a plurality of components 120 stored in the tape 121.

  Moreover, although the board | substrate imaging device 23 showed the example comprised so that the components 120 might be imaged, moving with the minimum pitch L of the tape feeder 110 in the said embodiment, this invention is not restricted to this, Board | substrate imaging The component 120 may be imaged while the board imaging device 23 moves in accordance with the size of the visual field Sc captured by the unit 23. Further, the tape feeder 110 may be configured to take an image with the imaging unit while feeding the tape 121 at the minimum pitch L without moving the imaging unit.

  Moreover, in the said embodiment, although the board | substrate imaging device 23 showed the example respectively attached to the both ends of the X direction of the head unit 20, this invention is not restricted to this, An imaging part is attached to a head unit. There is no need to be. The imaging unit may be separately attached to another movable mechanism. The imaging unit may be provided only at one end of the head unit.

  In the above embodiment, when the component 120c does not fit in the field of view Sc of the board imaging device 23, the main control unit 3 divides the adjacent component 120c into four times by the board imaging device 23. Although an example configured to capture an image has been shown, the present invention is not limited to this, and the imaging of the component 120c need not be performed in four steps. Imaging of the large component 120c may be performed twice or three times, or may be performed five times or more. As long as the position of the component 120c can be acquired, the number of times may be two or more.

  In the above embodiment, the main control unit 3 is configured to capture the four corners P1 to P4 by the board imaging device 23 when recognizing the component 120c. However, the present invention is not limited to this, and it is not necessary to image the corners of the component. What is necessary is just to perform imaging of components so that the position of components can be acquired. Therefore, you may comprise so that the terminal of components may be imaged. For example, when the part is a QFP (Quad Flat Package), since the terminal has a shape protruding from the four sides, the vicinity of the center of these four sides may be imaged. In this way, it is only necessary to image a part where the position of the component can be easily specified according to the shape of the component.

  In the above-described embodiment, the main control unit 3 has one component in the field of view Sc of the board imaging device 23 when the plurality of components 120 fits in the field of view Sc of the board imaging device 23 according to the size of the component 120. In the case where 120 fits, the example in which the imaging conditions are changed by dividing into three cases where the part 120 does not fit within the field of view Sc of the board imaging device 23 has been shown, but the present invention is not limited to this, and the present invention is not limited to this. Depending on the size, the case classification may be different from the above three case classifications. The control unit may change the imaging condition by dividing into four or more cases according to the size of the component. Further, the imaging condition may be changed depending on two cases of whether or not the image is within the field of view of the imaging unit.

  In the above embodiment, the main control unit 3 compares the size of the field of view Sc of the board imaging device 23 and the size of the component 120 and classifies them into three cases, thereby imaging conditions (imaging position and number of imaging). However, the present invention is not limited to this, and the magnification of the board imaging device 23 can be changed according to the size of the component 120. If the size of the component is large, the magnification is low. Even if the imaging magnification is changed in accordance with the size of the component (the size of the field of view Sc is increased), so that the magnification is high (the size of the field of view Sc is small) when the size of the component is small. Good.

  In the above-described embodiment, the substrate imaging device 23 is configured by a CCD area camera. However, the substrate imaging device 23 of the present invention is not limited to this, and a line camera that scans and images, or TDI (Time Delay Integration). ) It may be configured with a camera. At this time, when the scanning direction of the line camera or the TDI camera is parallel to the component sending-out direction (Y direction), the substrate imaging device 23 is changed in accordance with the size of the component 120 to change the board distance. What is necessary is just to change the length of the width | variety A0 of the Y direction of the visual field Sc of the imaging device 23. Further, when the scanning direction of the line camera or the TDI camera is perpendicular to the component sending direction (Y direction), the visual field Sc is changed by changing the scanning distance of the board imaging device 23 according to the size of the component 120. The length of the width B0 in the X direction is changed. When the plurality of components 120 are accommodated within the field of view Sc of the board imaging device 23, the board imaging is performed at an imaging position where the plurality of components 120a (120) are within the width A0 in the Y direction of the field of vision Sc of the substrate imaging device 23. The device 23 images a plurality of components 120a (120) at a time, and acquires a component interval Lp based on the captured images of the plurality of components 120a (120). On the other hand, if the component 120 does not fit within the Y-direction width A0 of the visual field Sc of the board imaging device 23, the adjacent components 120c (120) may be imaged in multiple steps. .

  As described above, in the above-described embodiment, the main control unit 3 shows an example in which the imaging condition (imaging position and number of imaging) is changed according to the size of the component 120. However, the present invention is not limited to this, and the control is performed. In addition to the imaging position and the number of times of imaging, the imaging unit performs imaging magnification, scan distance (when the board imaging unit is a line camera or TDI camera), and imaging unit that performs imaging (when there are a plurality of imaging units, which imaging unit performs imaging) It may be configured to change the imaging condition such as whether to perform or not) according to the size of the component. Further, the control unit may be configured to combine these imaging conditions.

  Moreover, in the said embodiment, when the tape 121 was spliced for replenishment of the components 120, it comprised so that the joint of the tape 121 might be detected by the optical sensor 116 which consists of a light emission part and a light-receiving part. Although an example is shown, the present invention is not limited to this, and the joint of the tape 121 may be detected by a method other than detection by a sensor. For example, the main control unit 3 is configured to subtract the number of components 120 stored on the tape 121 based on the data of the mounting program every time the components 120 are mounted. When splicing is performed, it may be configured to recognize that there is a joint of the tape 121 at a position where the number of components 120 held on the tape 121 is “0”. In addition, an area in which the part 120 is not accommodated in the joint portion of the tape 121 may be provided for a predetermined number of times of pitch feeding, and it may be configured to recognize that there is a joint when the suction has failed for a predetermined number of times. Good.

  In the above embodiment, when the sum of the size of the component 120 and the minimum pitch L is smaller than ½ of the size of the imaging field of view Sc of the board imaging device 23 (component 120a), the plurality of components 120 are added. Although an example in which imaging is performed collectively has been shown, the present invention is not limited to this, and conditions for imaging a plurality of parts collectively may be different from the above conditions. . Further, it may be configured to store in advance in the storage section whether or not the parts can be imaged collectively.

  Moreover, in the said embodiment, although the main control part 3 of the surface mounting machine 100 showed the example comprised so that the space | interval Lp of the components 120 accommodated in the tape 121 might be acquired, this invention is not limited to this, The main controller 3 does not have to acquire the interval Lp between the components 120 accommodated in the tape 121. Each feeder controller 117 (main controller) of each tape feeder 110 set in the surface mounter 100 is used. 117a) may acquire the interval Lp of the parts 120.

  Further, in the above embodiment, the main control unit 3 acquires the component center positions C1 and C2 of the component 120 and calculates the distance between the component center positions C1 and C2 of the adjacent components 120 to obtain the component interval Lp. However, the present invention is not limited to this, and the component interval need not be obtained from the distance between the component center positions. You may comprise so that a component space | interval may be calculated | required from the distance between each edge part and corner | angular part of adjacent components. Moreover, you may comprise so that a component space | interval may be calculated | required from the distance between each terminal formed in the predetermined position of adjacent components according to the shape of components.

It is a top view which shows the whole structure of the surface mounter by one Embodiment of this invention. It is a side view which shows typically the internal structure of the tape feeder by one Embodiment of this invention. It is a perspective view which shows the shape of the tape and components by one Embodiment of this invention. It is a perspective view which shows the shape of the tape and components by one Embodiment of this invention. It is a block diagram which shows the control structure of the surface mounting machine and tape feeder by one Embodiment of this invention. It is a top view for demonstrating the acquisition method of the space | interval of the components accommodated in the tape by one Embodiment of this invention. It is a top view for demonstrating the acquisition method of the space | interval of the components accommodated in the tape by one Embodiment of this invention. It is a top view for demonstrating the acquisition method of the space | interval of the components accommodated in the tape by one Embodiment of this invention. It is a top view for demonstrating the acquisition method of the space | interval of the components accommodated in the tape by one Embodiment of this invention. It is a flowchart for demonstrating the acquisition operation | movement of the space | interval of the components accommodated in the tape by one Embodiment of this invention. It is a flowchart which shows the flow of the operation | movement (subroutine) at the time of the division | segmentation recognition of components shown to step S19 of FIG. It is a flowchart which shows the flow of operation | movement when splicing is performed for the replenishment of the components of the surface mounter by one Embodiment of this invention.

Explanation of symbols

3 Main control unit (control unit)
20 Head unit 23 Substrate imaging device (imaging unit, substrate imaging unit)
100 Surface mounter 110 Tape feeder (component supply device)
120, 120a, 120b, 120c Component 121, 121a, 121b, 121c, 121d Tape (component supply tape)
130 Printed circuit board (board)

Claims (11)

An imaging unit for imaging a plurality of components stored at predetermined intervals on a component supply tape sent from the component supply device;
A control unit that acquires the predetermined interval based on the image of the component imaged by the imaging unit;
The control unit compares the size of the component and the size of the field of view of the imaging unit, and based on the comparison result, a plurality of the components imaged by the imaging unit are within the field of view of the imaging unit And three cases of a case where one of the parts imaged by the imaging unit falls within the field of view of the imaging unit and a case where the part imaged by the imaging unit does not fit within the field of view of the imaging unit And controlling to change the imaging condition of the component according to the three cases,
When the control unit determines that the component imaged by the imaging unit does not fit within the field of view of the imaging unit, the control unit divides the image adjacent to the adjacent direction and shoots multiple times. A surface mounter configured to perform control for acquiring a component interval based on an image of each component imaged in a plurality of times. A board imaging unit for detecting the position of the board on which the component is mounted;
The surface mounter according to claim 1, wherein the board imaging unit is configured to function also as an imaging unit that images a component housed in the component supply tape.   The control unit compares the size of the component with the size of the field of view of the imaging unit, and based on the comparison result, a plurality of the components captured by the imaging unit are within the field of view of the imaging unit. A case where one component captured by the imaging unit is within the field of view of the imaging unit, and a case where the component captured by the imaging unit is not within the field of view of the imaging unit. 3. The surface according to claim 1, wherein the surface is configured to determine a case and to perform control to change at least one of an imaging position and an imaging count of the component by the imaging unit according to the three cases. Mounting machine.   When the control unit compares the size of the component and the size of the field of view of the imaging unit, and determines that a plurality of the components are within the field of view of the imaging unit based on the comparison result, The plurality of components are imaged at a time by the imaging unit at the imaging position where the plurality of components fall within the field of view of the imaging unit, and the predetermined interval is acquired based on the captured images of the plurality of components. The surface mounter according to claim 1, wherein the surface mounter is configured to perform control.   The control unit compares the size of the component with the size of the field of view of the imaging unit, and if it is determined that one component fits within the field of view of the imaging unit based on the comparison result, The imaging unit images each of the plurality of components at the imaging position where one entire component is within the field of view of the imaging unit, and obtains the predetermined interval based on the captured image of each component The surface mounter according to claim 1, wherein the surface mounter is configured to perform control.   The control unit compares the size of the component with the size of the field of view of the imaging unit and, based on the comparison result, determines that the component does not fit within the field of view of the imaging unit, The imaging unit is configured to perform image capturing for each of the plurality of components in a plurality of times, and to perform control for acquiring the predetermined interval based on the image of each of the components imaged in a plurality of times. The surface mounter according to claim 1, wherein the surface mounter is used.   The control unit obtains the predetermined interval and feeds the component supply tape to be sent out by the component supply device when the predetermined interval between the components stored in the component supply tape is not specified. The surface mounter according to claim 1, wherein the surface mounter is configured to match the predetermined interval.   The controller obtains the predetermined interval of the added component supply tape when the component supply tape is added, and sets the feed pitch at which the added component supply tape is sent out to the predetermined interval. The surface mounter according to claim 1, wherein the surface mounter is configured to be matched. The image pickup unit is provided, and further includes a movable head unit for taking out the component from the component supply tape and mounting the component on the substrate,
The imaging unit is configured to image the component at the predetermined imaging position while moving at a pitch equal to a minimum pitch of the component supply device according to a width of the component supply tape. Item 9. The surface mounter according to any one of Items 1 to 8. When the control unit determines that the plurality of parts imaged by the imaging unit are within the field of view of the imaging unit, the imaging unit can acquire the predetermined interval by one imaging. The surface mounter according to claim 1, wherein the surface mounter is configured to be controlled by the control unit so as to image a region.   The surface mounter according to claim 1 or 10, wherein the imaging unit is configured to perform imaging from a direction facing a component housed in the component supply tape.

Images