JPH07307598A - Electronic part mounting device and electronic part mounting method - Google Patents

Abstract

PURPOSE:To reduce a coork time by sensing an image of one or both of a plurality of nozzles provided to a transfer head or an electronic part attracted to the nozzles at once. CONSTITUTION:A transfer head 10 is made to approach a parts feeder 5, electronic parts A, B are attracted to nozzles N1, N2 provided to the transfer head 10 and pick up operation is carried out. The transfer head 10 is moved on a camera 11 just once and an image of the electronic parts A, B is picked up by one imaging operation. Then, a part recognition part performs recognition treatment for the electronic parts A, B and outputs results thereof to a control part. The control part commands an XY table driving part to drive an X-table 9 and a Y-table and to correct a position of a substrate for XY direction based on a position correction amount. The control part moves the transfer head 10 onto a substrate and commands a transfer head driving part to mount the electronic parts A, B on a substrate based on an angle correction amount after angle correction of a corresponding nozzle.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method capable of reducing takt time.

[0002]

2. Description of the Related Art An electronic component mounting apparatus is widely used as an apparatus for automatically mounting electronic components on a board. In the electronic component mounting apparatus, it is required to shorten the tact time from the start of mounting to the end of mounting as much as possible.

[0003]

Some conventional electronic component mounting apparatuses include a transfer head having a plurality of nozzles. The mounting operation in this conventional electronic component mounting apparatus is as follows. Was there. That is, first, the electronic component is sucked from the parts feeder to one of the plurality of nozzles used this time. Secondly, the transfer head is moved so that the nozzle that has adsorbed the electronic component is within the visual field of the image pickup means such as a camera. Thirdly, an image of one electronic component is captured by the image pickup means. Fourth, the positional deviation of the electronic component from the ideal position is obtained from the captured image, and the correction amount is calculated. Fifth, position correction is performed by this correction amount, and electronic components are mounted on the board. As described above, in the conventional electronic component mounting apparatus, each electronic component is moved in the order of parts feeder → imaging means → board. Here, the time required for this movement is not negligible,
There was a problem that the tact time was extended by that much.

Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of shortening the tact time.

[0005]

An electronic component mounting apparatus according to the present invention includes a positioning means for positioning a board, a parts feeder for supplying electronic parts to be mounted on the board, and an electronic part picked up from the parts feeder for positioning. The electronic component is mounted on the substrate positioned by the means, and has a transfer head having a plurality of nozzles for adsorbing the electronic component, and moving means for relatively moving the substrate and the transfer head,
It has an image pickup means for collectively picking up an image of one or both of the plurality of nozzles provided in the transfer head or the electronic components sucked by these nozzles.

[0006]

With the above structure, the images of the plurality of nozzles or the electronic components sucked by these nozzles are collectively captured.
Here, in the conventional means, the movement between the parts feeder, the image pickup means, and the substrate is performed by the number of electronic components, but according to the present invention, this movement needs to be performed only once. Can save you time,
The tact time can be shortened.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. In FIG. 1, 1 is a base, and 2 and 3 are provided in parallel on the base 1 to transfer the substrate 4 in the X direction,
These are guide rails for positioning, and these guide rails 2 and 3 correspond to positioning means. 5 is the base 1
It is a parts feeder that is provided on the side of and supplies various types of electronic components. Here, the parts feeder of this embodiment includes a tube feeder, a tray feeder and the like in addition to the tape feeder shown in FIG. Further, 6 and 7 are gate-shaped Y frames provided on both edges of the base 1 in the Y direction, and 8 is slidably guided at both ends to the Y frames 6 and 7, and the Y motor 41 ( (See FIG. 3), the Y table moves in the Y direction, 9 is slidably engaged with the Y table 8 in the X direction, and the X table is moved by the X motor 40 (see FIG. 3) in the X direction, and 10 is the X table 9. Is a transfer head (details will be described later) provided in the. That is,
When the X motor 40 and the Y motor 41 are driven, the transfer head 10 can be moved relative to the substrate 4 in the XY directions, and the X table 9 and the Y table 8 correspond to moving means. Reference numeral 11 denotes a camera as an image pickup unit that collectively picks up images of the electronic components A, B, C, and D adsorbed by the four nozzles N1 to N4 provided in the transfer head 10. In this embodiment, the camera 11 includes a substrate 4 as shown in FIG.
It is arranged at an intermediate position between the parts feeder 5 and the parts feeder 5. This arrangement means that the parts feeder 5 and the camera 1
1 is preferable, and the distance between the camera 11 and the substrate 4, that is, the moving distance of the transfer head 9 can be minimized, which is preferable. A line image sensor may be used as the image pickup means.

Next, the transfer head 10 will be described with reference to FIGS. 2 is a perspective view of a transfer head of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 5 is a sectional view of a transfer head of the electronic component mounting apparatus according to an embodiment of the present invention. In FIG. 2, reference numeral 12 is a bracket integral with the X table 9, 13 is an L-shaped Z table which is supported by the bracket 12 so as to be movable up and down in the Z direction, and which is moved up and down when the Z motor 14 is driven. It is a horizontal part of the Z table 13. A horizontal plate 15 is provided in the middle of the Z table 13. As shown in FIG. 5, the horizontal portion 13a has four nozzles N1, N
2, N3 and N4 (however, the nozzles N2 and N4 are not shown in the figure) are vertically inserted. Since the nozzles N2 and N4 have the same support structure as the nozzles N1 and N3 (however, the shape of the nozzle itself differs depending on the type of electronic component to be sucked), only the nozzles N1 and N3 will be described. Now, projecting pieces 16 and 17 are radially provided on the tops of the nozzles N1 and N3. Reference numerals 18 and 19 are cylinders for selecting whether or not to use the nozzles N1 and N3, and are fixed to the plate 15. 20,
Reference numeral 21 is a rod of the cylinders 18 and 19, and 22 and 23 are locking claws fixed to the lower ends of the rods 20 and 21 and engaged with the projecting pieces 16 and 17, respectively. Further, projecting pieces 24 and 25 are provided on the opposite side of the projecting pieces 16 and 17, and these projecting pieces 2 and
The upper ends of springs 26 and 27 whose lower ends are fixed to the horizontal portion 13a are fixed to the nozzles 4 and 25, respectively.
3 is biased downward by springs 26 and 27. Further, splines 28 and 29 are attached to the nozzles N1 and N3 so as to be movable up and down and rotate integrally with the nozzles N1 and N3. Reference numeral 30 denotes a θ table fixed to the plate 15 so that its output shaft 31 faces downward, and 32 denotes the output shaft 3
It is a spline that is fixed to the lower end portion of 1 and is screwed to the splines 28 and 29. Therefore, when the θ motor 30 is driven and the output shaft 31 is rotated by Δθ from the origin position,
Only the angle according to the number of teeth of the splines 32, 28, 29,
The nozzles N1 and N3 can be rotated. further,
When the electronic component C sucked by the nozzle N3 is mounted on the substrate 4 by using the nozzle N3, the cylinder 19 is driven to cause the rod 21 to project and the locking claw 23 to the position shown by the chain line in FIG. By lowering (arrow M1), the electronic component C
Is lowered as indicated by an arrow M2, and the Z motor 14 is further driven to lower the Z table 13 by a small distance as indicated by an arrow M3. 33 and 34 are nozzles N1
Piping for connecting an air pressure adjusting device (not shown) for applying a negative pressure or a positive pressure to the inner hole of N3, and 35, as shown in FIG. B
It is a light diffusing plate that brightens the background such as to make the contrast of the image clear.

FIG. 3 is a block diagram of an electronic component mounting apparatus according to an embodiment of the present invention. In FIG. 3, 42 and 43 are cylinders for selecting use / non-use of the nozzles N2 and N4, which are similar to the cylinders 18 and 19. Four
Reference numeral 4 denotes an XY table drive unit including a driver for driving the X motor 40 and Y motor 41, 45 denotes a transfer head drive unit including a driver for driving the Z motor 14, the θ motor 30 ,. A component recognition unit including a module for recognizing the position and size of a component from the image output from the camera 11, a storage unit 47 including a RAM (random access memory) for temporarily storing necessary information such as an angle correction amount described below, Reference numeral 48 denotes a control unit including a CPU (central processing unit) that controls each component and a ROM (read only memory) that stores the control program according to FIG.

Next, each step of the electronic component mounting method of this embodiment will be described with reference to FIG. FIG. 4 is a flowchart showing an electronic component mounting method according to an embodiment of the present invention. First, in steps 1 to 4, the transfer head 10 is brought close to the parts feeder 5, and the four nozzles N1 to N4 provided in the transfer head 10 sequentially suck the electronic components A to D to perform a pickup operation. Then only once camera 1
The transfer head 10 is moved to 1 and the images of the electronic components A to D are captured by one imaging operation (step 5). Then, the component recognition unit 46 performs recognition processing for each of the electronic components A to D,
The result is output to the control unit 48. The control unit 48 includes the storage unit 4
The information such as the ideal position is read from 7 to calculate the position correction amounts ΔX and ΔY and the angle correction amount Δθ of each electronic component, and the storage unit 4
Write to 7 (steps 6-9). Then, the control unit 48 commands the XY table drive unit 44 based on the position correction amounts ΔX and ΔY to drive the X table 9 and the Y table 8 to correct the position of the substrate 4 in the XY directions. Then, the controller 48 moves the transfer head 10 onto the substrate 4, and adjusts the angle correction amount Δθ.
Based on the above, the transfer head drive unit 45 is instructed to correct the angle of the corresponding nozzle, and then the electronic components A to D are sequentially mounted on the substrate 4 (steps 10 to 13). Of course, at the time of implementation,
The cylinder on the nozzle to be mounted is driven to bring this nozzle into use.

FIG. 6 is an exemplary view of an image by the electronic component mounting apparatus in one embodiment of the present invention. In FIG. 6, S1 to S3
Are images of the electronic components A to C. It should be noted that the nozzle N4 is in a suction error (or unused) state, and the image of the nozzle N4 is obtained instead of the image of the electronic component D. As described above, the present embodiment is not limited to the case where all the nozzles are used.

[0012]

According to the present invention, the positioning means for positioning the board, the parts feeder for supplying the electronic parts to be mounted on the board, the electronic parts picked up from the parts feeder, and the electronic parts on the board positioned by the positioning means. A plurality of nozzles mounted on the transfer head, the transfer head having a plurality of nozzles for adsorbing electronic components, and a moving unit that relatively moves the substrate and the transfer head. Alternatively, since it has an image pickup means for collectively picking up one or both images of the electronic components sucked by these nozzles, it is possible to save the time for the transfer head to move to the image pickup means and shorten the tact time. it can.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a transfer head of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a block diagram of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 4 is a flowchart showing an electronic component mounting method according to an embodiment of the present invention.

FIG. 5 is a sectional view of a transfer head of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 6 is an exemplary view of an image by an electronic component mounting apparatus according to an embodiment of the present invention.

[Explanation of symbols]

 2 Guide rail 3 Guide rail 4 Substrate 5 Parts feeder 8 Y table 9 X table 10 Transfer head 11 Camera N1 nozzle N2 nozzle N3 nozzle N4 nozzle A Electronic component B Electronic component C Electronic component D Electronic component

Claims (2)

[Claims] 1. A positioning means for positioning a board, a parts feeder for supplying electronic parts to be mounted on the board, an electronic part picked up from the parts feeder, and the electronic parts mounted on the board positioned by the positioning means. And a plurality of nozzles provided in the transfer head, the transfer head having a plurality of nozzles for adsorbing electronic components, and a moving unit that relatively moves the substrate and the transfer head. Alternatively, an electronic component mounting apparatus having an image pickup means for collectively picking up an image of one or both of the electronic components sucked by these nozzles. 2. A step of adsorbing and picking up a plurality of electronic components from a parts feeder to a plurality of nozzles provided in a transfer head, and an image of the plurality of electronic components adsorbed by the plurality of nozzles at once. An electronic component mounting method comprising: an image capturing step; and a step of mounting a electronic component on a substrate by performing position correction based on the obtained image.