JP4107712B2 - Electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method for sequentially mounting electronic components held by a plurality of mounting nozzles so as to be movable up and down at predetermined positions on a circuit board.
[0002]
[Prior art]
Electronic component mounting apparatuses are required to mount electronic components on a circuit board quickly and accurately to improve mounting quality.
[0003]
Hereinafter, the electronic component mounting method will be described with reference to FIGS. 4 to 6, taking a conventional electronic component mounting apparatus having four suction nozzles as an example of the mounting nozzles as an example.
[0004]
As shown in FIGS. 4 and 5, the conventional electronic component mounting apparatus 10 includes a substrate transport device 12 that carries in and out a circuit board 11, a component supply device 13 that has a plurality of component supply units, and a desired suction nozzle. An XY robot 17 having a mounting head unit 15 capable of loading and unloading four suction nozzles 14 and capable of moving up and down and rotating the loaded suction nozzle 14 and a substrate recognition camera 16; The component imaging device 18 that images the electronic component 22, the component discarding unit 19 for discarding the electronic component 22 when the component orientation measurement result is abnormal, and the control unit that controls the operation of the electronic component mounting device 10 20.
[0005]
The mounting operation in the electronic component mounting apparatus 10 is performed as follows.
First, the circuit board 11 is carried into the mounting position by the board transfer device 12. The XY robot 17 moves the board recognition camera 16 onto the circuit board 11 and checks the position where each electronic component 22 is to be mounted. Next, the mounting head unit 15 is moved to the component supply unit 13 by the XY robot 17, and each electronic component 22 (22 </ b> A to 22 </ b> D) is provided by each of the plurality of suction nozzles 14 (first to fourth suction nozzles 14 </ b> A to 14 </ b> D). ) Are sucked and held, and all the suction nozzles 14 are raised to the upper end position. And each electronic component 22A-22D is moved to the component imaging device 18 by moving the mounting head part 15 so that each electronic component 22A-22D hold | maintained by each suction nozzle 14A-14D passes on the component imaging device 18. The holding posture is photographed, the holding posture is measured, and the quality of the holding posture is determined based on the measurement result.
[0006]
From the determination result, if the holding posture of the electronic components 22A to 22D is normal, the positions of the electronic components 22A to 22D are corrected based on the obtained image information. Is moved to a desired first mounting position, and the first suction nozzle 14A holding the electronic component 22A is first lowered to the mounting height L1 to mount the electronic component 22A on the mounting circuit board 11. Thereafter, the first suction nozzle 14A is raised to the recognition height L2. Next, the mounting head unit 15 is moved to a desired second mounting position by the XY robot 17, and similarly, the electronic components 22B, 22C, and 22D are sequentially placed by the second to fourth suction nozzles 14B, 14C, and 14D. Mounted on the circuit board 11. Note that L0 in FIG. 5 is the position of the upper surface of the circuit board 11. FIG. 6 shows, as an example, a timing chart of the suction nozzle of the conventional electronic component mounting method when movement in the XY direction by the XY robot 17 is unnecessary.
[0007]
Thus, in the conventional electronic component mounting method, as shown in FIGS. 5 and 6, in the process of mounting the electronic component 22, the mounting head unit 15 is moved to the mounting position, and each suction nozzle 14 is moved to the component imaging device. The electronic component 22 is lowered from the recognition height L2 (for example, the top dead center in the raising / lowering range of the suction nozzle 14) that can be imaged by the electronic component 18 to the mounting height L1 at which the electronic component 22 is actually mounted on the circuit board 11. After the electronic component 22 is mounted, it is raised again to the recognition height L2, and after confirming that the suction nozzle 14 has been raised to the recognition height L2, the next suction nozzle 14 is lowered and mounted. These operations are repeated in order.
[0008]
If it is determined that there is an abnormality in the holding posture of the electronic components 22A to 22D when the electronic component 22 is recognized by imaging with the component imaging device 18, the mounting head unit 15 is moved by the XY robot 17 to the component discarding unit. The electronic components 22A to 22D held by the suction nozzles 14A to 14D are discarded.
[0009]
[Problems to be solved by the invention]
However, in the above-described conventional electronic component mounting method, the previous suction nozzle 14 (for example, the first suction nozzle 14A) is mounted and moved up to the recognition height L2, and then the next suction nozzle 14 (for example, the second suction nozzle 14A). Since the operation of lowering the suction nozzle 14B) from the recognition height L2 to the mounting height L1 has been repeatedly performed, it takes a long time to move along with the vertical movement of the suction nozzle 14 during this time, and this is a cause of increasing the tact time. And led to a decline in production capacity.
[0010]
The present invention has been made to solve this problem, and an object of the present invention is to provide an electronic component mounting method capable of reducing the tact time associated with the movement of a mounting nozzle such as a suction nozzle.
[0011]
[Means for Solving the Problems]
In order to solve the above problem, the electronic component mounting method according to the present invention includes a plurality of mounting nozzles that are movable up and down in a mounting head portion that is movable in a predetermined direction. The electronic component mounting method for sequentially mounting the electronic components held by the mounting nozzles to predetermined positions on the circuit board by raising and lowering the electronic components, and when mounting the electronic components sequentially by each mounting nozzle, When mounting an electronic component with a mounting nozzle, hold the mounting nozzle from the holding height when another mounting nozzle is moved so that the mounting nozzle of the mounting head is positioned on the circuit board. Stand-by reference height that is lower than the height and does not interfere with the electronic components on the circuit board by the electronic components held by the mounting nozzle It is lowered to wait, when to first increase the mounting nozzle to perform the mounting operation from the mounting height to above the standby reference height, when the mounting nozzle is raised to the standby reference height, following implementation After the mounting head portion has started moving for the mounting operation of the nozzle and the mounting head portion has moved , the other mounting nozzle is mounted so that the electronic component is mounted on the circuit board from the standby reference height. it is lowered to a height at which to perform the mounting operation.
[0012]
Thereby, the tact time associated with the movement of the mounting nozzle such as the suction nozzle can be reduced.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
In the electronic component mounting method according to the first aspect of the present invention, a plurality of mounting nozzles can be moved up and down in a mounting head part movable in a predetermined direction, and the mounting nozzle is moved by the mounting head part and the mounting nozzle is moved up and down. Electronic component mounting method for sequentially mounting the electronic components held by the mounting nozzle to a predetermined position on the circuit board, when the electronic components are sequentially mounted by each mounting nozzle, the first mounting nozzle in the mounting head portion When mounting an electronic component using the mounting height of the mounting nozzle from the holding height when the mounting head is moved so that the mounting nozzle of the mounting head is positioned on the circuit board. The electronic component held by the mounting nozzle is lowered to the standby reference height where it does not interfere with the electronic component on the circuit board. To wait Te, the time of initially raising the mounted nozzle to perform the mounting operation from the mounting height to above the standby reference height, when the mounting nozzle is raised to the standby reference height, the implementation of the following mounting nozzle After moving the mounting head part for operation, after the mounting head part has moved , the other mounting nozzle is lowered from the standby reference height to the mounting height at which the electronic component is mounted on the circuit board. it is intended to perform a mounting operation by.
[0014]
According to this method, since the second and subsequent mounting nozzles are lowered to a standby reference height that is lower than the holding height and are on standby, as compared with the case of waiting at the holding height as in the prior art. Then, these mounting nozzles can be lowered to the mounting height in a short time.
[0016]
Also, according to this method, when the mounting nozzle is raised to the standby reference height, the movement operation of the mounting head for the mounting operation of the next mounting nozzle is started, and the next mounting nozzle is moved to the standby reference height. Compared with the case where the mounting head is moved to the holding height and the mounting head is moved and the next mounting nozzle is lowered when the mounting nozzle is raised to the holding height. It is possible to move quickly to the nozzle mounting operation.
[0018]
Below, with reference to FIGS. 1 to 3 for the electronic component mounting method according to the embodiment of the present invention. In addition, in the electronic component mounting apparatus which performs this electronic component mounting method, the same code | symbol is attached | subjected about the same component as the conventional electronic component mounting apparatus.
[0019]
As shown in FIGS. 1 to 3, the control unit 2 provided in the electronic component mounting apparatus 1 has a height before stopping the suction nozzle 14 in addition to the recognition height L2 and the mounting height L1. The standby reference height L3, which is the height during standby, is previously recognized. The standby reference height L3 is already mounted on the circuit board 11 on which the electronic component 22 (22A to 22D) held by the suction nozzle 14 (first to fourth suction nozzles 14A to 14D) is to be mounted. It is a height that does not interfere with the electronic component 22, and is a height between the recognition height L2 and the mounting height L1, as shown in FIG. The standby reference height L3 and the mounting height L1 are set according to the thickness of the electronic component 22.
[0020]
As in the conventional electronic component mounting method, the control unit 2 measures the component holding posture by the component imaging device 18, and the electronic component 22A held by the first suction nozzle 14A is mounted on the circuit board 11 ( After the mounting head unit 15 is moved by the XY robot 17 so as to be positioned immediately above the first mounting point), the following operation is performed.
[0021]
First, in the mounting head unit 15, the first suction nozzle 14 </ b> A that sucks and holds the electronic component 22 </ b> A is lowered to the mounting height L <b> 1 and at the same time the electronic component 22 </ b> B to 22 </ b> D is sucked and held to the recognition height L <b> 2. The second to fourth suction nozzles 14B to 14D are lowered to the standby reference height L3 to be on standby. Then, after the first suction nozzle 14A reaches the mounting height L1 and mounts the electronic component 22A at a desired position on the upper surface of the circuit board 11, the first suction nozzle 14A is raised to the recognition height L2. At the same time when the suction nozzle 14A passes the standby reference height L3, the mounting head unit 15 is moved in the XY direction by the XY robot 17, and the second mounting position (the second electronic component held by the second suction nozzle 14B). 22B is moved to a position directly above the mounting point of the circuit board 11, and the second suction nozzle 14B that has been waiting at the standby reference height L3 is started to be lowered to mount the electronic component 22B. Thereafter, similarly, the second and third suction nozzles 14B and 14C pass the standby reference height L3 after being mounted, and at the same time, the third and fourth suction nozzles 14C and 14C holding the electronic components 22C and 22D, respectively. The electronic components 22C and 22D are mounted on the upper surface of the circuit board 11 by lowering 14D.
[0022]
As described above, according to the present embodiment, since the second to fourth suction nozzles 14B to 14D are lowered in advance to the standby reference height L3 that is lower than the recognized height L2, they are on standby. Compared to the case where the second to fourth suction nozzles 14B to 14D are waiting at the recognition height L2 as in the prior art, these second to fourth suction nozzles 14B to 14D are mounted to the mounting height L1. It can be lowered in a short time, and the tact can be shortened by deleting the time spent on the amount of nozzle movement.
[0023]
When the previous suction nozzles 14A to 14C are raised to the standby reference height L3 after mounting, the movement operation of the mounting head unit 15 for mounting operation of the next suction nozzles 14B to 14D is started and the next In order to lower the suction nozzles 14B to 14D from the standby reference height L3 to the mounting height L1, the mounting head portion 15 when the previous suction nozzles 14A to 14C are raised to the recognition height L2 after mounting, as in the past. Compared with the case where the next suction nozzles 14B to 14D are moved downward and the next suction nozzles 14B to 14D are moved downward, it is possible to quickly move to the mounting operation of the next suction nozzles 14B to 14D. .
[0024]
In the above embodiment, the case of the mounting head 15 having the four suction nozzles 14A to 14D has been described. However, it is a matter of course that the present invention is effective if the number of the suction nozzles 14 is plural. In addition, as a holding height when the mounting head unit 15 is moved so that the suction nozzle 14 of the mounting head unit 15 is positioned on the circuit board 11, the electronic component 22 held by the suction nozzle 14 is used by the component imaging device 18. The case where the height is set to recognize the electronic component 22 by imaging will be described, and according to this, the mounting operation by each suction nozzle 14 can be performed accurately and quickly according to the actual operation. It goes without saying that this is not the case. Moreover, although the case where the mounting operation is performed by the suction operation as the mounting nozzle has been described, the present invention is not limited to this.
[0025]
【The invention's effect】
As described above in detail, according to the present invention, in the electronic component mounting apparatus in which a plurality of mounting nozzles are provided in the mounting head portion, when mounting the electronic component by the first mounting nozzle, From the holding height when the mounting head portion is moved so that the mounting nozzle of the mounting head portion is located on the circuit board, it is lower than the holding height of this mounting nozzle and is held by the mounting nozzle. When the electronic component is lowered to the standby reference height where it does not interfere with the electronic components on the circuit board, and then the mounting nozzle that initially performed the mounting operation is raised from the mounting height above the standby reference height. in, when the mounting nozzle is raised to the standby reference height, the start of the movement of the mounting head for mounting operation of the next mounting nozzle, after the mounting head is moved, the other The instrumentation nozzle, the electronic component from said standby reference height by causing the mounting operation is lowered to a mounting height which is mounted on a circuit board, it is possible to reduce the overall mounting tact, result, production Efficiency is improved.
[Brief description of the drawings]
FIG. 1 is a front view showing a positional relationship of a plurality of suction nozzles for explaining an electronic component mounting method according to an embodiment of the present invention.
FIG. 2 is a timing chart of the suction nozzle of the electronic component mounting method (showing a case where movement in the XY direction by an XY robot is unnecessary as an example);
FIG. 3 is a perspective view of an electronic component mounting apparatus that performs the electronic component mounting method.
FIG. 4 is a perspective view of an electronic component mounting apparatus for performing a conventional electronic component mounting method.
FIG. 5 is a front view showing a positional relationship between a plurality of suction nozzles for explaining a conventional electronic component mounting method;
FIG. 6 is a timing chart of a suction nozzle of a conventional electronic component mounting method (as an example, a case where movement in the XY direction by an XY robot is unnecessary) is shown.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Control unit 11 Circuit board 14, 14A-14D Adsorption nozzle (mounting nozzle)
15 Mounting Head 17 XY Robot 18 Component Imaging Devices 22, 22A to 22D Electronic Component L1 Mounting Height L2 Recognition Height (Holding Height)
L3 standby reference height

Claims (1)

A plurality of mounting nozzles can be moved up and down in a mounting head portion that can move in a predetermined direction, and the mounting nozzle is moved by the mounting head portion and the mounting nozzle is moved up and down, so that the electronic components held by the mounting nozzle can be placed on the circuit board. An electronic component mounting method for sequentially mounting to a predetermined position of
When mounting electronic components sequentially with each mounting nozzle, when mounting electronic components with the first mounting nozzle in the mounting head, mount the other mounting nozzle so that the mounting nozzle of the mounting head is on the circuit board. The stand-by reference that is lower than the holding height of this mounting nozzle from the holding height when the head is moved, and the electronic components held by the mounting nozzle do not interfere with the electronic components on the circuit board Lower to stand and wait
When the mounting nozzle that has been mounted first is raised from the mounting height above the standby reference height, when the mounting nozzle is raised to the standby reference height, the mounting nozzle for the next mounting nozzle start the movement of the mounting head, after the mounting head is moved, the other mounting nozzle, mounting operation electronic component from said standby reference height is lowered to mounting height is mounted on the circuit board electronic components mounting method to perform.

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