JP2010021425A - Mounting method of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the cycle time when an electronic component is mounted after the electronic component which is held by a nozzle is recognized by a component recognition device installed near a mounting head. <P>SOLUTION: When the electronic components recognized by the component recognizing means installed near the mounting head are mounted on the substrate, electronic components scheduled to be mounted are sorted in the increasing order of heights and held in the increasing order of the heights, and a clamp is elevated up to a maximum height where the held electronic component does not interfere when the mounting head moves in a plane direction to mount the electronic component on the fixed substrate. As an electronic component to be mounted increases in height, the clamp is lowered to a maximum height where the electronic component does not interfere in accordance with the increased height, and then the substrate height is made lower in order. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention is an electronic component mounting method, in particular an electronic component is sucked and held by a suction nozzle of a nozzle head mounted on the mounting head, and the component is recognized by a component recognition device installed near the mounting head. The present invention relates to an electronic component mounting method suitable for application when mounting electronic components at a high speed in an electronic component mounting apparatus mounted on a substrate positioned and fixed to a clamp at a predetermined position.

  FIG. 1 shows an outline of a conventional mounter (electronic component mounting apparatus). The mounter 1 moves the mounting head 13 in the X direction by the X axis 12 and moves in the Y direction integrally with the X axis 12 by the Y axis 14, and the suction nozzle at the lower end of the nozzle head attached to the head 13. The electronic component sucked and held from the component supply unit 11 by 13a can be mounted on the circuit board 10 which is transported by the substrate transport unit 15 and positioned and fixed to the clamp.

  The mounting head 13 is provided with a board recognition camera 17 for recognizing a reference mark or the like of the circuit board 10, and an electronic component sucked by the suction nozzle 13a is recognized on the mounter base. The component recognition camera 16 and the like are installed.

  By the way, some conventional mounters are equipped with a plurality of nozzle heads that allow the suction nozzle to move in the Z-axis direction. In such a mounter, each nozzle head is operated in parallel, and after the electronic components are sucked to the suction nozzle from the component supply unit, the nozzles are held so that the sucked and held electronic components do not interfere with the structure or installation in the machine. While the head is controlled in the Z axis (height), the mounting head is moved in the XY (planar) direction and positioned at the target position, and then the electronic component is mounted on the substrate.

  Therefore, the mounting head itself is sufficient so that it does not interfere with the structure even if it moves XY in consideration of the height of the electronic components that are scheduled to be mounted at the assembly stage before the mounter is shipped. It is installed at a height with a margin.

  Therefore, when mounting electronic components on the board, the electronic components sucked by the nozzle head (suction nozzle) are once lowered to the lowest point where they do not interfere with the structure inside the machine, and the electronic components are sequentially moved from the lowest point. Japanese Patent Application Laid-Open No. 2004-133867 discloses a technique that realizes tact-up by mounting a component to reduce the Z-axis direction stroke as a whole when mounting the component.

JP-A-11-330786

  However, the technique disclosed in Patent Document 1 is effective when a component recognition device that recognizes an electronic component held by a nozzle head is installed at a low position on the base or the like. Is installed in the vicinity of the mounting head, the electronic component is lowered to the lowest point after performing the component recognition at a high position, so that it is not necessarily an effective technique. there were.

  The present invention has been made to solve the above-mentioned conventional problems, and after recognizing an electronic component held by a nozzle by a component recognition device installed at a high position such as in the vicinity of the mounting head, the electronic component is It is an object of the present invention to provide an electronic component mounting method capable of improving the tact time when mounting on a substrate.

  According to the present invention, an electronic component is held from a component supply unit by a vertically movable nozzle head mounted on a mounting head movable in a plane direction, and the height of a component recognition means installed in the vicinity of the mounting head The electronic component is moved up to recognize the component, and the height of the electronic component is maintained, and the mounting head is moved above the substrate clamped to the fixed portion of the substrate transfer device and held by the nozzle head. An electronic component mounting method for lowering an electronic component and mounting it on the board, wherein the electronic components to be mounted are sorted in advance in ascending order of the height, and when holding and mounting in order from the electronic component having the lowest height, Initially, the electronic component held when the mounting head is moved in the plane direction is raised to the maximum height that does not interfere with the substrate containing the mounted electronic component. As the height of the electronic component to be mounted increases, the electronic component is clamped to the fixed portion by the Z-direction moving portion at the maximum height that does not interfere with the mounted electronic component according to the height. The problem is solved by lowering the substrate and sequentially setting the substrate height lower.

  In the present invention, a plurality of nozzle heads may be mounted on the mounting head.

  According to the present invention, the electronic component held by the nozzle head from the component supply unit is raised to the height of the component recognition means in the vicinity of the mounting head to recognize the component, and the height is maintained from the low electronic component. Mounted on a substrate raised to the maximum height at which the electronic component does not interfere, and as the height of the electronic component increases, the maximum height at which the electronic component does not interfere with the mounted electronic component Since the mounting is performed while lowering the substrate, it is possible to greatly reduce the distance to be lowered when mounting an electronic component of an arbitrary size, so that it is possible to improve the tact time.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 2 is an enlarged view showing an outline of a mounting head applied to one embodiment according to the present invention. Since the configuration of the other electronic component mounting apparatus is substantially the same as that shown in FIG. 1, description will be made using the same reference numerals as necessary.

  A plurality (four in this case) of nozzle heads 20 are mounted on the mounting head 13 shown in FIG. 2, and each nozzle head 20 has a shaft 22 and a suction nozzle 24 attached to the lower end thereof. Yes. Each nozzle head 20 is provided with a Z-axis motor 26 that moves the suction nozzle 24 up and down, and a θ-axis motor 28 that rotates around the axis.

  Also, in the vicinity of the mounting head 13, together with a substrate recognition device 30 for recognizing a reference mark or the like on the substrate, an electronic component that is sucked and held by the suction nozzle 24 from the component supply unit 11 and raised to a predetermined recognition height A component recognition device 32 comprising a laser sensor or the like for recognizing is attached.

  Further, as shown in FIG. 3 for explaining the mounting operation of the electronic component, in this embodiment, the clamp 34 for positioning and fixing the circuit board 10 is fixed to the predetermined position of the board transport section 15 by the Z-direction moving section. The circuit board 10 can be raised to a height close to the mounting head 13 that moves in the XY direction by raising the fixing part 42, and can be set to an arbitrary height. It can be positioned.

  Here, the fixing part 42 that moves the circuit board 10 up and down by the Z-direction moving part will be described.

  In FIG. 4, the outline | summary of the board | substrate conveyance part 15 with which the mounting apparatus of this embodiment is provided is shown.

  As shown in this figure, the substrate transport unit 15 is used for positioning and fixing the carry-in unit 40 for carrying the substrate 10 and the carried substrate 10 and mounting the electronic component P thereon by the mounting head 13. The fixing unit 42 and an unloading unit 44 for unloading the substrate 10 that has been mounted are configured.

  In the carry-in portion 40, the fixed portion 42, and the carry-out portion 44, an endless carry-in belt 40A, a positioning belt 42A, and a carry-out belt 44A that are rotated by a driving pulley to move and stop the substrate 10 are respectively provided in the carrying direction. It is disposed inside the rail portion 46 that regulates the left and right substrate positions.

  Further, in the fixing portion 42 for positioning and fixing the substrate 10, the positioning belt 42A can move up and down a slight gap in order to clamp the substrate, and as shown in FIG. It functions as a clamp 34 that is pressed and fixed.

  Further, the fixing portion 42 is shown in FIG. 5 in a state where the substrate 10 is clamped as viewed from the arrow A direction on the downstream side in the transport direction, and in FIG. 6 is a state where the entire substrate transport portion 15 is viewed from the inside perpendicular to the transport direction. As shown schematically, the Z-direction moving part 56 including a ball screw 54 that is rotated via a timing belt 52 by a motor 50 disposed on the back side of the base part 48 of the apparatus main body moves up and down as a whole. It is possible.

  Then, as shown in FIG. 7, the control device 60 controls the carry-in belt 40 </ b> A, the positioning belt 42 </ b> A, and the conveyance belt 44 </ b> A to realize loading, positioning, and carry-out of the substrate 10. Also, when the substrate 10 is carried into the fixed portion 42 by a substrate tip sensor 62 (not explicitly shown in FIG. 4) and the detection signal is input to the control device 60, it is shown in FIG. As described above, the substrate 10 is fixed to the fixing portion 42 with the clamp 34, and the control of moving the substrate 10 clamped to the fixing portion 42 up and down by driving the Z-direction moving portion 56 by the motor 50 is realized. It has become.

  Next, the operation of the present embodiment will be described with reference to the flowchart of FIG.

  First, the electronic components to be mounted, which are shown as an example of component data in FIG. 9A, are sorted in ascending order of height as shown in FIG. 9B, and the electronic components are sorted in the sorted component height order. The board mounting expected height for fixing the circuit board 10 when mounting is determined. At this time, when there are a plurality of electronic components having the same height or an approximate height as in this example, the electronic components may be grouped and determined for each group.

  The board mounting expected height includes the height of the electronic component held by the nozzle head 20 for mounting and the height of the mounted component on the substrate when the electronic component already exists on the substrate. It is determined by calculation in consideration (step 1).

  For example, if only the height of the electronic component to be mounted is considered, the substrate mounting planned height is determined with a margin for a stroke sufficient to press the electronic component sucked by the nozzle head against the substrate. . Also, as shown in FIG. 3A as “the height of the upper surface of the board at the time of clamping”, when the electronic component Pa is already mounted on the board when the circuit board 10 is loaded, the board is scheduled to be mounted. The height is set to the maximum height at which the electronic component P attracted to the nozzle head 20 does not interfere with the mounted electronic component Pa as shown in FIG. This maximum height can be determined by calculation in consideration of an appropriate margin, but may be determined experimentally.

  After the above step 1 is completed, the substrate is carried in by the substrate transport unit 15, positioned, and fixed to the clamp 34 (step 2). Next, in order to mount the electronic component having the lowest height (in this example, height 0.3 mm) at first, it is clamped to the fixed portion 42 by the Z-direction moving portion 56 such as the motor 50 according to the height of the component. The circuit board 10 is lifted, the board is positioned at the predetermined board mounting expected height (step 4), the nozzle head is lowered, and the sucked electronic component is brought to the target position on the board. Implement (steps 5 and 6).

  When the component height acquired in step 4 is changed in the operations in steps 4 to 6 described above, the planned board mounting height determined in accordance with the component height is reset, and FIG. As shown in the images B) to (D), the process is repeated in the direction in which the component height increases in order until there is no target electronic component (step 3).

  According to the embodiment described in detail above, in the mounter in which the component recognition device is installed in the vicinity of the mounting head 13, the tact when mounting electronic components without being affected by the mounting height of the mounting head is reduced. It becomes possible to improve.

  In addition, since the mounting head 13 is equipped with a plurality of nozzle heads 20, by simultaneously attracting electronic components classified in the same group, it can be repeatedly mounted on a substrate set at the same height. Tact up can be further improved.

Perspective view showing a partially broken outline of the entire mounter FIG. 2 is an enlarged perspective view showing an outline of a mounting head applied to an embodiment according to the present invention. Explanatory drawing which shows the image of the procedure which mounts an electronic component by this embodiment The perspective view which shows the outline | summary of the board | substrate conveyance part applied to this embodiment The front view which expands and shows the fixing | fixed part of the said board | substrate conveyance part Internal side view showing the outline of the substrate transfer unit The block diagram which shows the principal part of the control system of this embodiment Flow chart showing the operation of this embodiment Chart showing examples of electronic components to be mounted and results sorted in order of component height

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Circuit board 11 ... Component supply part 13 ... Mounting head 13a ... Adsorption nozzle 20 ... Nozzle head 22 ... Shaft 24 ... Adsorption nozzle 26 ... Z-axis motor 28 ... (theta) axis motor 30 ... Board recognition apparatus 32 ... Component recognition apparatus 34 ... Clamp 40 ... Carry-in part 42 ... Fixing part 44 ... Carry-out part 50 ... Motor 52 ... Timing belt 54 ... Ball screw 56 ... Z direction moving part P ... Electronic component

Claims (2)

With a nozzle head that can be moved up and down mounted on a mounting head that can move in the plane direction, the electronic component is held from the component supply unit and raised to the height of the component recognition means installed near the mounting head. While recognizing the part and maintaining the height of the electronic component, the mounting head is moved above the substrate clamped to the fixed portion of the substrate transfer device, and the electronic component held by the nozzle head is lowered. An electronic component mounting method for mounting on the substrate,
Sort the electronic components to be mounted in ascending order of height,
When holding and mounting in order from the electronic components with the lowest height, the electronic components that are held when the mounting head is moved in the plane direction are initially set to the maximum height that does not interfere with the board that contains the mounted electronic components. Raise the substrate clamped to the fixed part by the moving part,
As the height of the electronic component to be mounted is increased, the substrate clamped on the fixed portion by the Z-direction moving portion is adjusted to the maximum height so that the electronic component does not interfere with the mounted electronic component. An electronic component mounting method, wherein the substrate height is lowered and the substrate height is sequentially set lower.   The electronic component mounting method according to claim 1, wherein a plurality of the nozzle heads are mounted on the mounting head.

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