JP2007165360A - Electronic part mounting device and electronic part mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic part mounting device and an electronic part mounting method by which mounting operation efficiency can be improved, in case when a form of an object to be mounted is limited. <P>SOLUTION: The electronic part mounting method is used to pick up a nearly square electronic part by a transferring head wherein a plurality of suction nozzles 10 are arranged in series, and to mount it along the lengthwise direction in either of X and Y directions of a substrate. The suction nozzles located every other element are defined as first and second nozzle groups respectively by bundling them in the arrangement order of the transferring head. The groups are classified based on three operation patterns which are set in correspondence with three kinds of part size (small, medium and large electronic parts P1, P2 and P3) beforehand. Thus, mutual interference among adjoining nozzles can be eliminated to simultaneously hold the electronic parts as much as possible. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus and electronic component mounting method for transferring and mounting an electronic component on a substrate by a transfer head.

  A mounting apparatus for mounting electronic components on a board is provided with a component supply unit in which a number of parts feeders such as tape feeders for storing electronic components are arranged in parallel, and electronic components are transferred from these parts feeders by a transfer head. The mounting operation of picking up and transferring onto the substrate is repeated. In order to improve the efficiency of the mounting operation, a multiple transfer head in which a plurality of unit transfer heads each having a suction nozzle for holding an electronic component are arranged on the transfer head is often used (for example, Patent Documents). 1).

In this patent document example, the arrangement pitch of each unit transfer head is made as small as possible to make the transfer head compact, and the combination of the types of electronic components simultaneously held by these unit transfer heads is set appropriately. As a result, as many electronic components as possible can be mounted.
JP 2003-258494 A

  By the way, depending on the type of the board, a limited number of electronic components may be mounted in a specific direction. For example, in a memory board for a personal computer, a large number of elongated memory chips are densely mounted in parallel in the horizontal and vertical directions. In order to realize good working efficiency in the mounting work for the substrate of such a form, it is desired to improve the mounting operation efficiency by simultaneously holding as many electronic components as possible by the transfer head. However, in the conventional electronic component mounting methods including the above-described patent document examples, no measures for improving the mounting operation efficiency have been shown when the mounting target form is limited in this way.

  Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of improving the mounting operation efficiency when the form of mounting is limited.

  The electronic component mounting apparatus according to the present invention mounts a substantially rectangular electronic component by aligning the longitudinal direction of the electronic component with either the first direction of the substrate or the second direction orthogonal to the first direction. A mounting apparatus for positioning a substrate, a component positioning unit for supplying a plurality of electronic components in a posture in which the longitudinal direction is aligned with the first direction, and elevating and rotating around a shaft are possible. A plurality of unit transfer heads each having a single suction nozzle arranged at a predetermined arrangement pitch in the first direction, and the transfer head between the component supply unit and the substrate positioning unit. A head moving mechanism for moving along the transfer path, component recognition means for recognizing the electronic component provided on the transfer path and held by the transfer head from below, elevating operation of the suction nozzle and Θ rotation The component mounting operation including the operation is set in advance for each of the first nozzle group and the second nozzle group defined by bundling a plurality of suction nozzles that are positioned one by one in the arrangement order of the transfer head. Component mounting operation control means to be executed based on the operation pattern and storage means for storing the operation pattern are provided.

An electronic component mounting method according to the present invention includes a substrate positioning unit that positions a substrate, a component supply unit that supplies a plurality of electronic components in a posture in which the longitudinal direction of the electronic component is aligned with the first direction, lifting and lowering around the shaft A multiple-type transfer head in which a plurality of unit transfer heads each having a suction nozzle capable of Θ rotation are arranged at a predetermined arrangement pitch in the first direction, and the transfer heads as the component supply unit and the substrate positioning An electronic component comprising: a head moving mechanism that moves along a transfer path between the component and a component recognizing unit that recognizes the electronic component that is provided in the transfer path and is held by the transfer head from below An electronic component mounting method for mounting a substantially rectangular electronic component by aligning the longitudinal direction with either a first direction of a substrate or a second direction orthogonal to the first direction by a mounting device, of The component pick-up process for sucking and holding the electronic components by the suction nozzle of the position transfer head, the head moving step for moving the transfer head holding the electronic components on each unit transfer head to the substrate, and the component recognition means A component recognition process for recognizing an electronic component, a component mounting process for mounting the electronic component after the component recognition process on a substrate, and each suction by rotating the suction nozzle around the axis in the pickup process or the component mounting process. A nozzle Θ rotation step for aligning the rotational position of the electronic component sucked and held by the nozzle in the Θ direction with a specified position, and performing the lifting and lowering operation and Θ rotation operation of the suction nozzle in the process from the component pickup step to the component mounting step. A plurality of component mounting operations that are positioned one by one in the arrangement order of the transfer head For each of the first nozzle group and a second nozzle group that is defined by enclosing the suction nozzle, to be executed on the basis of the operation pattern set in advance.

  According to the present invention, a plurality of suction positions each including one of the component mounting operations including the lifting / lowering operation of the suction nozzle and the Θ rotation operation in the process from the component pick-up process to the component mounting process are skipped in the arrangement order of the transfer head. By executing the operation based on the preset operation pattern for each of the first nozzle group and the second nozzle that binds the nozzles, it is possible to eliminate a component interference between adjacent suction nozzles and simultaneously hold a large number of electronic components. Therefore, when the form to be mounted is limited to the form in which the rectangular component is mounted in a specific direction, the mounting operation efficiency can be improved.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is an explanatory view of a component mounting form by the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. FIG. 3B is a front view of the unit transfer head of the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 4 is the present invention. FIG. 5 is a block diagram showing the configuration of the control system of the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 6 is a block diagram showing the configuration of the control system of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 7, FIG. 8, FIG. 9, and FIG. 10 are operations in the electronic component mounting method of one embodiment of the present invention. FIG. 11 is an explanatory diagram of a pattern, and FIG. 11 is a section of an electronic component mounting apparatus according to an embodiment of the present invention. It is a flow diagram of a mounting operation processing.

  First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is disposed in the center of the base 1 in the X direction (substrate transport direction). The transport path 2 transports the substrate 3 supplied from the upstream side, and is positioned on the mounting stage set at the center position of the transport path 2 in a posture in which one side of the substrate 3 is aligned in the X direction (see FIG. 2). . Therefore, the transport path 2 is a substrate positioning portion that positions the substrate 3. Component supply units 4A and 4B are arranged on both sides of the conveyance path 2, and a large number of tape feeders 5 are arranged in parallel on the component supply units 4A and 4B. The tape feeder 5 accommodates electronic components held on the tape, and supplies the electronic components by pitch feeding the tape.

Y axis tables 6A and 6B are disposed on both ends of the upper surface of the base 1, and the Y axis table 6
Two X-axis tables 7A and 7B are installed on A and 6B. By driving the Y-axis table 6A, the X-axis table 7A moves horizontally in the Y direction, and by driving the Y-axis table 6B, the X-axis table 7B moves horizontally in the Y direction. The X-axis tables 7A and 7B are equipped with a transfer head 8 and a camera 11 that moves integrally with the transfer head 8, respectively.

  When the Y-axis table 6A, the X-axis table 7A, the Y-axis table 6B, and the X-axis table 7B are driven in combination, the transfer head 8 moves horizontally, and electronic components are picked up from the respective component supply units 4 by suction nozzles 10 ( 3) and mounted on the substrate 3 positioned in the transport path 2. The Y-axis table 6A, the X-axis table 7A, the Y-axis table 6B, and the X-axis table 7B are head moving mechanisms that move the transfer head 8 along the transfer path between the component supply units 4A and 4B and the substrate positioning unit. It has become.

  The camera 11 that has moved onto the substrate 3 images the substrate 3. The position of the substrate 3 is detected by performing a recognition process on the imaging result by the recognition processing unit 23 (see FIG. 5). A line camera 12 is disposed on the transfer path from the component supply unit 4 to the conveyance path 2. The line camera 12 images the electronic components held by each transfer head 8 from below. By recognizing the imaging result by the recognition processing unit 23, the position and shape of the electronic component P held by the transfer head 8 can be recognized. That is, the line camera 12 and the recognition processing unit 23 serve as component recognition means that is provided in the transfer path of the transfer head 8 and recognizes the electronic component P held by the transfer head 8 by imaging from below.

  Next, with reference to FIG. 2, the board | substrate used as the mounting object of this electronic component mounting apparatus and the mounting form of an electronic component are demonstrated. A substrate 3 shown in FIG. 2 is a memory substrate used in a personal computer, and a plurality of substantially rectangular electronic components (semiconductor memory) P taken out from the component feeder 4A or the tape feeder 5 of the component supplier 4B are mounted on the substrate 3. Is done. The mounting direction of the electronic component P on the substrate 3 is limited to the first direction (X direction) of the substrate 3 or the second direction (Y direction) orthogonal to the first direction. Mounting is performed by aligning the longitudinal direction of P to one of these two directions.

  Here, the component posture in the tape feeder 5 is always the same posture, and the electronic component P is supplied in a posture in which the longitudinal direction of the electronic component P is aligned with a direction orthogonal to the tape feeding direction (Y direction). That is, the component supply units 4A and 4B supply the electronic component P to a pickup position by the transfer head 8 described below in a posture in which the longitudinal direction is aligned with the X direction. Accordingly, in the component mounting operation in which the electronic component P is taken out by the transfer head 8 and transferred and mounted on the substrate 3, the rotational alignment of the electronic component P in the Θ direction is only 180 ° or ± 90 ° as it is. What is necessary is just to perform, and the required operation forms are summarized in a simple operation pattern.

  Next, the transfer head 8 will be described with reference to FIG. As shown in FIG. 3A, the transfer head is multi-type, and unit transfer heads 9 each having a suction nozzle 10 that sucks and holds an electronic component are placed at a predetermined arrangement pitch np (hereinafter, “nozzle”). This is a configuration in which a plurality (eight in this case) are arranged in series in the X direction (first direction) in the “pitch np”.

  As shown in FIG. 3B, a suction nozzle 10 that sucks and holds an electronic component is detachably mounted on a nozzle mounting portion 9 a provided at the lower end of the unit transfer head 9. The suction nozzle 10 includes a shaft portion 10a provided with a suction hole for sucking an electronic component at a lower end portion, and a bowl-shaped reflector 10b provided on the upper portion of the shaft portion 10a. The reflection plate 10 b reflects the illumination light irradiated from below when the electronic component held by the suction nozzle 10 by the line camera 12 is imaged, and makes the line camera 12 incident.

  Each of these unit transfer heads 9 includes a nozzle lifting mechanism (not shown) and a nozzle Θ rotation mechanism (not shown) that can be individually controlled. By driving the unit transfer head 9 individually, the suction nozzle 10 is driven. Can be individually rotated around the axis and moved up and down. That is, the transfer head 8 is a multiple type in which a plurality of unit transfer heads 9 each having a suction nozzle 10 capable of moving up and down and rotating around the axis are arranged at a predetermined arrangement pitch (nozzle pitch np) in the first direction. It is a transfer head.

  In the component mounting operation by the transfer head 8, a plurality of electronic components P are transferred and mounted by these eight suction nozzles 10. In this embodiment, the suction nozzles 10 are grouped into two nozzle groups. The plurality of suction nozzles 10 belonging to each nozzle group are caused to perform the component mounting operation of the same pattern. As shown in FIG. 3A, these suction nozzles 10 are assigned numbers N <b> 1 to N <b> 8 from the left end side according to the arrangement of the unit transfer heads 9 in the transfer head 8.

  The four suction nozzles 10 with odd numbers N1, N3, N5 and N7 are defined as the first nozzle group [1], and the four suction nozzles 10 with even numbers N2, N4, N6 and N8 are the second nozzles. It is defined as group [2]. That is, in the transfer head 8, the plurality of suction nozzles 10 are defined by bundling a plurality of suction nozzles 10 that are located at odd-numbered and even-numbered jumps in the arrangement order of the transfer head 8. The nozzle group is divided into a first nozzle group [1] and a second nozzle group [2].

  The suction nozzles 10 grouped in this way perform the operation for each nozzle group as shown in FIG. 4 in the component mounting operation. That is, as shown in FIG. 4A, the suction nozzle 10 belonging to the first nozzle group [1] and the second nozzle group [2] are controlled by controlling the height position of the suction nozzle 10 for each nozzle group. The heights of the suction nozzles 10 belonging to the above can be made different.

  Then, by setting the height difference Δh of these suction nozzles 10 to be larger than the thickness of the electronic component P, as shown in FIG. 4B, the electronic component P having a large component size with respect to the nozzle pitch np. Are held by two adjacent suction nozzles 10 and these electronic components P can be rotated around the axis of the shaft portion 10a without interfering with each other. Thereby, in the component mounting operation in which the electronic component P is taken out from the component supply units 4A and 4B and transferred and mounted on the substrate 3, the rotational position of the electronic component P in the Θ direction can be changed as necessary.

  Next, the configuration of the control system of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 5, a CPU 20 is an arithmetic unit, and executes various programs stored in the program storage unit 21 to control the following units to execute operation control such as mounting operation and arithmetic processing. In executing this program, various data stored in the data storage unit 22 are referred to. In addition to the sequence program for the mounting operation, the program storage unit 21 stores an operation pattern selection program 21a. The operation pattern selection program 21a is a program for selecting an operation pattern to be executed by the suction nozzles 10 of the first nozzle group [1] and the second nozzle group [2] according to the component size of the electronic component P to be mounted. It is.

  In addition to the mounting sequence data, the data storage unit 22 stores component data 22a and operation pattern data 22b. The component data 22a stores data related to the size of the electronic component P to be mounted for each component type. The operation pattern data 22b is data indicating a component mounting operation pattern to be executed by the suction nozzles 10 of the first nozzle group [1] and the second nozzle group [2]. Therefore, the data storage unit 22 is a storage unit that stores the above-described operation pattern.

  In the component mounting operation, when the CPU 20 executes the operation pattern selection program 21a, an operation pattern corresponding to the electronic component to be mounted is read from the data storage unit 22, and further, the CPU 20 is based on the read operation pattern. By controlling the mechanism drive unit 24, the component mounting operation including the raising / lowering operation of the suction nozzle 10 and the Θ rotation operation is executed. Therefore, the CPU 20 and the operation pattern selection program 21a perform the component mounting operation including the raising / lowering operation and the Θ rotation operation of the suction nozzle 10 in the first nozzle group [1] and the second nozzle group [2] defined as described above. Each of these is a component mounting operation control means to be executed based on a preset operation pattern.

  The recognition processing unit 23 recognizes the position of the substrate 3 by performing recognition processing on the imaging result of the camera 11, and recognizes the electronic component held by the transfer head 8 by performing recognition processing on the imaging result of the line camera 12. recognize. The mechanism drive unit 24 drives mechanism units such as the X-axis tables 6A and 6B, the Y-axis tables 7A and 7B, and the transfer head 8. The operation input unit 25 is input means such as a keyboard and a mouse, and inputs operation commands and various data such as component data 22a. The display unit 26 is a display device and displays a guidance screen at the time of operation input.

  Next, referring to FIGS. 6 to 10, the types (shape / dimensions) of electronic components (FIG. 6) that can be mounted in the component mounting operation shown in the present embodiment (FIG. 6) and operation patterns of the mounting operation (FIG. 7 to 10) will be described. Here, the transfer head 8 including a plurality of unit transfer heads 9 can be held simultaneously in one mounting turn in which the rectangular electronic component P is taken out from the component supply units 4A and 4B and transferred and mounted on the substrate 3. The combinations of the size of the electronic component P and the holding posture when the electronic component is simultaneously transferred by the transfer head 8 are classified into three patterns. The aforementioned operation pattern is set according to the combination pattern.

  First, FIG. 6A shows a combination pattern for small electronic components P1, that is, even if all the suction nozzles 10 are held with the longitudinal direction of the electronic components P1 aligned with the first direction, This is a first combination pattern for a long side dimension L1 that does not cause interference. Here, the condition that the two adjacent components do not interfere with each other means that the gap S between the two adjacent components is set in advance as a marginal gap where there is no possibility of interference in the state where the two adjacent components are held by the suction nozzle 10. It is larger than Sm.

  In other words, the electronic component P1 having the long side dimension L1 smaller than the threshold value (D (TH) = np−Sm) defined by the dimension obtained by subtracting the above-described minimum gap Sm from the nozzle pitch np is the first. It becomes the target of the combination pattern. In the combination pattern described in the present embodiment, the electronic component P that is the target of each pattern is classified based on the threshold value D (TH) set based on the nozzle pitch np.

  In such component mounting operation for the first combination pattern component, an operation pattern (first operation pattern) as shown in FIG. 7 is executed. First, as shown in FIG. 7 (a), the tape feeder 5 is supplied in a posture in which the longitudinal direction is aligned with the first direction by the suction nozzles 10 of N1, N3, N5, and N7 belonging to the first nozzle group [1]. The electronic component P <b> 1 (1) in the state of being sucked is held. Here, the electronic component P1 (1) is a first group of electronic components P1 to be picked up by the suction nozzles 10 belonging to the first nozzle group [1].

At this time, if the arrangement of the tape feeders 5 in the component supply units 4A, 4B is an arrangement that allows the electronic components P1 to be simultaneously sucked by the plurality of suction nozzles 10, the plurality of suction nozzles 10 are moved up and down simultaneously. Simultaneous suction for simultaneously holding the electronic component P1 on each suction nozzle 10 is executed, and when such a condition is not satisfied, the component suction is performed individually for each suction nozzle 10.

  Next, as shown in FIG. 7 (b), the N2, N4, N6, and N8 suction nozzles 10 belonging to the second nozzle group [2] are supplied in a posture in which the longitudinal direction is aligned with the first direction by the tape feeder 5. The electronic component P <b> 1 (2) in the state of being sucked is held. Here, the electronic component P1 (2) is a second group of electronic components P1 to be picked up by the suction nozzles 10 belonging to the second nozzle group [2]. Even in this case, simultaneous suction by a plurality of suction nozzles 10 is performed if possible.

  As a result, as shown in FIG. 7C, the transfer head 8 holds the electronic component P1 in a posture in which the longitudinal direction is aligned with the first direction by the suction nozzles 10 of all the unit transfer heads 9 in this state. To move above the line camera 12. Then, a scanning operation is performed in which the transfer component 8 moves in the X direction and moves the electronic component P <b> 1 held above the line camera 12. Thereby, the electronic component P1 is imaged and component recognition is performed. Thereafter, the transfer head 8 moves to the substrate 3 and mounts the electronic component P1 held by each suction nozzle 10 at each mounting point. At this time, since no mutual interference occurs between the electronic components P1, each unit transfer head 9 can arbitrarily perform the necessary Θ rotation according to the mounting direction.

  That is, in the first operation pattern, when the electronic component P1 whose long side dimension is smaller than the threshold value D (TH) set based on the nozzle pitch np (predetermined arrangement pitch) is used as the first operation pattern. By the suction nozzles 10 of the nozzle group [1] and the second nozzle group [2], the first group electronic components and the second group electronic components to be picked up by the respective nozzle groups are supplied from the component supply units 4A and 4B. After taking out, these electronic components P1 are moved to the line camera 12 which is a component recognition means.

  Next, FIG. 6B shows a combination pattern for the medium-sized electronic component P2, that is, when all the suction nozzles 10 are held with the longitudinal direction of the electronic component P2 aligned with the first direction, The two adjacent suction nozzles 10 have shapes and sizes that can avoid mutual interference when the electronic component P2 is held in a state where the electronic component P2 is rotated by 90 °. It is the 2nd combination pattern made into object. In this case, the condition that two adjacent components do not cause interference is that 1/2 of the sum of the long side dimension L2 and the short side dimension B2 of the electronic component P2 is smaller than the threshold value D (TH). The electronic component P2 having the long side dimension L2 and the short side dimension B2 satisfying such conditions is an object of the second combination pattern.

  In such component mounting operation for the second combination pattern component, an operation pattern (second operation pattern) as shown in FIG. 8 is executed. First, as shown in FIG. 8 (a), supply is performed in a posture in which the longitudinal direction is aligned with the first direction by the tape feeder 5 by the suction nozzles 10 of N1, N3, N5, and N7 belonging to the first nozzle group [1]. The electronic component P <b> 2 (1) in the state of being sucked is held. The electronic component P2 (1) is a first group of electronic components P2 that are sucked and held by the suction nozzles 10 belonging to the first nozzle group [1]. Even in this case, simultaneous suction by a plurality of suction nozzles 10 is performed if possible.

Next, as shown in FIG. 8B, the suction nozzles 10 of N1, N3, N5, and N7 are rotated by 90 °, and the long side direction of the electronic component P2 (1) held by each suction nozzle 10 is changed to the first direction. Align in two directions. Then, as shown in FIG. 8 (c), supply is performed in a posture in which the longitudinal direction is aligned with the first direction by the tape feeder 5 by the suction nozzles 10 of N2, N4, N6, and N8 belonging to the second nozzle group [2]. The electronic component P <b> 2 (2) in the state of being sucked is held. The electronic component P2 (2) is a second group of electronic components P2 that are sucked and held by the suction nozzles 10 belonging to the second nozzle group [2].

  As a result, as shown in FIG. 8D, the transfer head 8 aligns the longitudinal direction of the electronic component P2 (1) of the first group with the suction nozzle 10 belonging to the first nozzle group [1] in the second direction. The electronic component P2 (2) of the second group is held in a posture in which the longitudinal direction is aligned with the first direction by the suction nozzle 10 belonging to the second nozzle group [2]. Then, in this state, the transfer head 8 moves above the line camera 12 to perform component recognition. Thereafter, the transfer head 8 moves to the substrate 3 and mounts the electronic component P2 held by each suction nozzle 10 at each mounting point. At this time, when Θ rotation is required at the time of mounting depending on the mounting direction of each electronic component P2, as shown in FIG. 4, the suction nozzle 10 and the second nozzle group [2 of the first nozzle group [1]. ] Of the suction nozzle 10 is made different to prevent interference between the electronic components P2.

  That is, in the second operation pattern, when an electronic component in which 1/2 of the sum of the long side dimension and the short side dimension is smaller than the threshold value D (TH) is targeted, the first nozzle group [1] After the first group of electronic components P2 (1) is taken out from the component supply units 4A and 4B, the longitudinal direction of the first group of electronic components is rotated in the second direction, and then the second nozzle group [2] causes the second group to be second. After the group of electronic components P2 (2) are taken out from the component supply units 4A and 4B, the first group and the second group of electronic components P2 are moved to the line camera 12 as the component recognition means.

  FIG. 6C shows a shape / size adjacent to each other even when the combination pattern for the large-sized electronic component P3, that is, the second combination pattern is applied, adjacent to each other. This is a third combination pattern intended for those having shapes and dimensions that can avoid mutual interference when the two suction nozzles 10 hold the electronic component P3 in a state rotated by 90 °. In this case, the condition that two adjacent components do not cause interference is that the short side dimension B3 is smaller than the above-described threshold value D (TH), and the electronic component P3 that satisfies such a condition is the third set. It becomes the target of the alignment pattern.

  In such a component mounting operation for the third combination pattern component, an operation pattern as shown in FIG. 9 is executed. First, as shown in FIG. 9 (a), supply is performed in a posture in which the longitudinal direction is aligned with the first direction by the tape feeder 5 by the suction nozzles 10 of N1, N3, N5, and N7 belonging to the first nozzle group [1]. The electronic component P3 in a state of being held is sucked and held. The electronic component P3 (1) is a first group of electronic components P3 that are sucked and held by the suction nozzles 10 belonging to the first nozzle group [1]. Even in this case, simultaneous suction by a plurality of suction nozzles 10 is performed if possible.

  Next, as shown in FIG. 9B, the suction nozzles 10 of N1, N3, N5, and N7 are rotated by 90 °, and the long side direction of the electronic component P3 held by each suction nozzle 10 is set to the second direction. Match. Then, as shown in FIG. 10 (c), supply is performed in a posture in which the longitudinal direction is aligned with the first direction by the tape feeder 5 by the suction nozzles 10 of N2, N4, N6, and N8 belonging to the second nozzle group [2]. The electronic component P3 (2) in the state of being sucked is held. The electronic component P3 (2) is a second group of electronic components P3 that are sucked and held by the suction nozzles 10 belonging to the second nozzle group [2]. Next, as illustrated in FIG. 9D, the suction nozzles 10 of N2, N4, N6, and N8 are rotated by 90 °, and the long side direction of the electronic component P3 held by the suction nozzle 10 is aligned with the second direction.

Accordingly, as shown in FIG. 9E, the transfer head 8 holds the electronic component P3 in a posture in which the longitudinal direction is aligned with the second direction by the suction nozzles 10 of all the unit transfer heads 9. Then, in this state, the transfer head 8 moves above the line camera 12 to perform component recognition. Thereafter, the transfer head 8 moves to the substrate 3 and mounts the electronic component P3 held by each suction nozzle 10 at each mounting point. At this time, when Θ rotation is required during mounting depending on the mounting direction of the electronic component P3, as shown in FIG. 4, the suction nozzle 10 of the first nozzle group [1] and the second nozzle group [2] The height position of the suction nozzle 10 is varied to prevent the electronic components P3 from interfering with each other.

  That is, in the third operation pattern, when an electronic component having a short side dimension smaller than the threshold value D (TH) is targeted, the first nozzle group [1] supplies the first group of electronic components. After taking out from the parts 4A and 4B, the longitudinal direction of the first group of electronic components P3 (1) is aligned with the second direction, and then the second group of electronic components P3 (2) is moved by the second nozzle group [2]. After taking out from the component supply units 4A and 4B, the longitudinal direction of the second group of electronic components P3 (2) is aligned with the second direction, and then the first group and the second group of electronic components are line cameras as component recognition means. 12 is moved.

  As described above, the operation pattern that defines the component mounting operation including the raising / lowering operation and the Θ rotation operation of the suction nozzle 10 includes the above-described first operation pattern, second operation pattern, and third operation pattern. . In the case where the electronic component mounting apparatus shown in the present embodiment includes two component supply units 4A and 4B that are symmetrically arranged with the conveyance path 2 serving as a board positioning unit interposed therebetween, In the two operation patterns, the second group of electronic components P2 (2) taken out after the first group of electronic components P2 (1) is first taken out by the suction nozzle 10 of the first nozzle group [1] If only the electronic component whose mounting direction is in the first direction or the opposite direction 180 degrees different from the first direction is configured, a more efficient component mounting operation can be realized.

  That is, as shown in FIG. 10, among the electronic components P2 mounted on the substrate 3, the electronic components P2 mounted in the longitudinal direction in the 0 ° direction or the 180 ° direction are changed to the second group of electronic components P2 (2 These are taken out by the suction nozzle 10 of the second nozzle group [2]. At this time, the electronic component P2 mounted in the 0 ° direction is taken out from the component supply unit 4A in the example shown in FIG. 10 from the component supply unit whose component orientation in the tape feeder 5 matches this direction. The electronic component P2 mounted in the 180 ° direction is taken out from the component supply unit 4B in which the component posture in the tape feeder 5 matches this direction.

  When the transfer head 8 is moved to the substrate 3 and these electronic components P2 are mounted, the second group of electronic components P2 (2) is mounted first. At this time, since the rotational position of the electronic component P2 (2) in the Θ direction coincides with the mounting direction on the substrate 3, the suction nozzle 10 of the second nozzle group [2] needs to perform the Θ rotation operation. There is no. After the component mounting operation by the suction nozzle 10 of the second nozzle group [2] is completed, the suction nozzle 10 of the first nozzle group [1] arbitrarily performs the Θ rotation operation without causing interference with adjacent components. It is allowed to do as needed. That is, in such an operation pattern, in the component pick-up process, the component supply unit from which the second group of electronic components P2 (2) is to be taken out depends on the mounting direction of each electronic component of the second group on the substrate 3. The component supply units 4A and 4B are selected.

  The electronic component mounting apparatus is configured as described above. Next, an electronic component mounting method executed by the electronic component mounting apparatus will be described along the flow of FIG. In this electronic component mounting method, a substantially rectangular electronic component such as an SOP type semiconductor memory component is mounted with its longitudinal direction aligned with either the first direction of the substrate 3 or the second direction orthogonal to the first direction. It is applied to the form to be limited.

In FIG. 11, the operation pattern data 22b is read from the data storage unit 22 prior to the start of the component mounting operation (ST1). When the component mounting operation is started, the component data 22a of the electronic component to be mounted is read from the data storage unit 22 in the next mounting turn (
ST2). As a result, the component size of the electronic component is identified (ST3), and the following processing is executed based on the identified component size.

  First, it is determined whether or not the long side dimension of the electronic component is smaller than the threshold value D (TH) shown in FIG. 6, that is, whether or not it corresponds to the first combination pattern component shown in FIG. (ST4). If YES here, the first operation pattern is selected (ST8). If NO, whether or not 1/2 of the sum of the long side dimension and the short side dimension is smaller than the threshold value D (TH), that is, in the second combination pattern component shown in FIG. It is determined whether or not this is the case (ST5). If YES here, the second operation pattern is selected (ST9). If NO, it is determined whether or not the short side dimension is smaller than the threshold value D (TH), that is, whether or not it corresponds to the third combination pattern component shown in FIG. 6C (ST6). ).

  If YES here, the third operation pattern is selected (ST10). On the other hand, if NO, an error notification is given that the electronic component is not an application target of a preset operation pattern (ST7). Then, in accordance with the operation pattern selected in this way, a component mounting operation including steps from the component pick-up process to the component mounting process is executed (ST11). This component mounting operation is performed in a form including the lifting / lowering operation of the suction nozzle 10 and the Θ rotation operation as described above, and by binding a plurality of suction nozzles 10 that are positioned one by one in the arrangement order in the transfer head. Each of the defined first nozzle group [1] and second nozzle group [2] is executed based on a preset operation pattern.

  Thereafter, it is confirmed whether or not the electronic component is the final component to be mounted on the board 3. If there is another electronic component that does not correspond to the final component and is to be mounted, the process returns to (ST2). The same processing steps are repeatedly executed for the other electronic components. Then, in (ST12), by confirming that the mounting operation has been completed for the final component, the component mounting operation process is terminated.

  In this component mounting operation, first, the transfer head 8 to be mounted is moved above the component supply units 4A and 4B, and the electronic components are sucked and held by the suction nozzles 10 of the plurality of unit transfer heads 9 (pickup). Process). Next, the transfer head 8 holding the electronic component in each unit transfer head 9 is moved to the substrate 3 (head moving process). In this head moving step, the transfer head 8 is moved above the line camera 12 and the electronic component is recognized by imaging the electronic component held by the suction nozzle 10 (component recognition step).

  Thereafter, the electronic component after the component recognition step is mounted on the substrate 3 while correcting the position based on the component recognition result (component mounting step). In the above-described pickup process and / or component mounting process, the rotation position of the electronic component sucked and held by each suction nozzle 10 by rotating the suction nozzle 10 around the axis depends on the individual operation state. Then, a nozzle Θ rotation process for adjusting to a predetermined specified position is executed.

  As described above, the electronic component mounting apparatus and the electronic component mounting method of the present invention transfer the component mounting operation including the lifting / lowering operation and the Θ rotation operation of the suction nozzle 10 in the process from the component pickup process to the component mounting process. Each of the first nozzle group [1] and the second nozzle group [2] in which a plurality of suction nozzles 10 positioned one by one in the order of arrangement in the head 8 is executed based on a preset operation pattern. It is what I did.

This eliminates component interference between adjacent suction nozzles and allows multiple electronic components to be held simultaneously. For example, when mounting a large number of rectangular components such as semiconductor memory in a limited specific direction. When the target form is limited, the mounting operation efficiency can be improved.

  The electronic component mounting apparatus and the electronic component mounting method of the present invention can simultaneously hold a large number of electronic components by eliminating component interference between adjacent suction nozzles, and the shape of the mounting target is a rectangular component in a specific direction. In the case where it is limited to the form to be mounted on, the effect that the mounting operation efficiency can be improved, which is useful in the application of mounting a substantially rectangular electronic component such as a plurality of semiconductor memories on the substrate.

The top view of the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the component mounting form by the electronic component mounting apparatus of one embodiment of this invention (A) Front view of transfer head of electronic component mounting apparatus of one embodiment of the present invention (b) Front view of unit transfer head of electronic component mounting apparatus of one embodiment of the present invention Explanatory drawing of operation | movement of the transfer head in the electronic component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the shape and size of an electronic component to be mounted by the electronic component mounting apparatus of one embodiment of the present invention Explanatory drawing of the operation | movement pattern of the component mounting operation | movement in the electronic component mounting method of one embodiment of this invention Explanatory drawing of the operation | movement pattern of the component mounting operation | movement in the electronic component mounting method of one embodiment of this invention Explanatory drawing of the operation | movement pattern of the component mounting operation | movement in the electronic component mounting method of one embodiment of this invention Explanatory drawing of the operation | movement pattern of the component mounting operation | movement in the electronic component mounting method of one embodiment of this invention Flow chart of component mounting operation processing by electronic component mounting apparatus according to one embodiment of the present invention

Explanation of symbols

2 Transfer path 3 Substrate 4A, 4B Component supply unit 8 Transfer head 9 Unit transfer head 10 Suction nozzle [1] First nozzle group [2] Second nozzle group P1, P2, P3 Electronic components

Claims (4)

An electronic component mounting apparatus for mounting a substantially rectangular electronic component by aligning the longitudinal direction of the electronic component with either the first direction of the substrate or the second direction orthogonal to the first direction,
A substrate positioning unit that positions the substrate, and a component supply unit that supplies a plurality of the electronic components in a posture in which the longitudinal direction is aligned with the first direction;
A multiple-type transfer head in which a plurality of unit transfer heads having suction nozzles capable of moving up and down and rotating around the axis are arranged at a predetermined arrangement pitch in the first direction;
A head moving mechanism for moving the transfer head along a transfer path between the component supply unit and the substrate positioning unit;
Component recognition means for recognizing the electronic component provided in the transfer path and held by the transfer head from below;
A first nozzle group and a second nozzle defined by bundling a plurality of suction nozzles positioned one by one in the order of arrangement in the transfer head for component mounting operations including lifting and lowering operations of the suction nozzles and Θ rotation operations For each of the groups, a component mounting operation control means that is executed based on a preset operation pattern;
An electronic component mounting apparatus comprising storage means for storing the operation pattern. A substrate positioning unit for positioning a substrate, a component supply unit for supplying a plurality of electronic components in a posture in which the longitudinal direction of the electronic component is aligned with the first direction, and a suction nozzle capable of moving up and down and rotating around the axis are provided. A plurality of unit transfer heads arranged in the first direction at a predetermined arrangement pitch, and a transfer head along the transfer path between the component supply unit and the substrate positioning unit. A substantially rectangular electronic component by an electronic component mounting apparatus comprising: a head moving mechanism for moving the electronic component; and a component recognizing unit provided on the transfer path for recognizing the electronic component held by the transfer head from below. An electronic component mounting method in which the longitudinal direction is aligned with either the first direction of the substrate or the second direction orthogonal to the first direction,
A component pick-up step for sucking and holding electronic components by suction nozzles of the plurality of unit transfer heads, a head moving step for moving a transfer head holding electronic components to each unit transfer head to the substrate, and the components A component recognition step of recognizing the electronic component by a recognition means, a component mounting step of mounting the electronic component after the component recognition step on a substrate, and the pickup nozzle or the component mounting step, the suction nozzle is rotated around the axis by Θ. A nozzle Θ rotation step for aligning the rotation position of the electronic component sucked and held by each suction nozzle in the Θ direction with a specified position,
A plurality of suction nozzles that are positioned one by one in the order of arrangement in the transfer head are bundled in a component mounting operation including a lifting / lowering operation and a Θ rotation operation of the suction nozzle in the process from the component pickup process to the component mounting process. An electronic component mounting method, wherein each of the first nozzle group and the second nozzle group defined by (1) is executed based on a preset operation pattern. When the operation pattern is intended for an electronic component whose long side dimension is smaller than a threshold value set based on the predetermined arrangement pitch, the operation patterns are respectively provided by the suction nozzles of the first nozzle group and the second nozzle group. A first operation pattern for moving the electronic components of the first group and the second group of electronic components to be picked up by the nozzle group from the component supply unit to the component recognition means;
When 1/2 of the sum of the long side dimension and the short side dimension is an electronic component that is smaller than the threshold value, the first nozzle group removes the first group of electronic components from the component supply unit. After taking out, the longitudinal direction of the first group of electronic components is aligned with the second direction, and then the second group of electronic components is taken out from the component supply unit by the second nozzle group, and then the first group. And a second operation pattern for moving the second group of electronic components to the component recognition means;
When an electronic component having a short side dimension smaller than the threshold value is targeted, the first group of electronic components is taken out of the component supply unit by the first nozzle group and then the first group of electronic components is removed. The longitudinal direction is aligned with the second direction, and then the second group of electronic components is taken out from the component supply unit by the second nozzle group, and then the longitudinal direction of the second group of electronic components is aligned with the second direction. 3. The electronic component mounting method according to claim 2, further comprising a third operation pattern for moving the electronic components of the first group and the second group to the component recognition means. The electronic component mounting apparatus includes a plurality of the component supply units arranged symmetrically across the board positioning unit,
In the second operation pattern, the second group of electronic components is configured only by the electronic components whose mounting direction on the substrate is the first direction or an opposite direction that is 180 degrees different from the first direction,
In the component pick-up step, the component supply unit from which the second group of electronic components is to be taken out is selected from the plurality of component supply units according to the mounting direction of each electronic component of the second group on the substrate. The electronic component mounting method according to claim 3.

Images