JP5031619B2 - Electronic component mounting device - Google Patents

Description

  The present invention relates to an electronic component that is sucked and held by a suction nozzle provided in a mounting head that is provided in a pair of beams movable in one direction so as to be movable in the other direction perpendicular to the one direction along each beam. The present invention relates to an electronic component mounting apparatus that captures images with a component recognition camera.

This type of electronic component mounting apparatus is disclosed in, for example, Patent Document 1. In general, when the upper position of the component recognition camera is reached, the suction nozzle is stopped and the illumination device is turned on to image the electronic component sucked and held by the suction nozzle or while moving the suction nozzle. An electronic component sucked and held by the suction nozzle is imaged by a component recognition camera.
JP-A-6-61700

  Therefore, in a single electronic component mounting apparatus, even if a plurality of mounting heads are provided, the normal electronic component recognition processing is performed only by either the former stop imaging recognition or the latter fly imaging recognition. Met. For this reason, even if the same fly imaging recognition is used, various electronic component mounting apparatuses are desired from the viewpoint of increasing the production efficiency of printed circuit boards accompanying the miniaturization of electronic components.

  Accordingly, an object of the present invention is to provide various electronic component mounting apparatuses from the viewpoint of increasing the production efficiency of a printed circuit board with the miniaturization of electronic components even if the same fly imaging recognition is performed.

For this reason, the first invention is a component supply device that supplies an electronic component, and a component that is positioned between the component supply device and a positioning unit that is mounted on the substrate and positioned on the substrate transfer device. A suction nozzle provided on the mounting head, comprising: a recognition camera; and a pair of beams movable in one direction, a mounting head provided so as to be movable along each beam in another direction orthogonal to the one direction In the electronic component mounting apparatus for picking up an image of the electronic component taken out from the component supply apparatus and sucked and held by the component recognition camera, a different type of mounting head is attached to each beam, and the type of the mounting head and one based on the required imaging count in recognizing processing of electronic components per the mounting head and the position of the mounting head and the position of the component recognition camera in the one direction Then, when the mounting head moves in the other direction and the positions in the other direction coincide with each other, the component recognition camera takes an image, or the position of the component recognition camera and the position of the mounting head are determined. When the beam moves in the one direction and the position in the one direction coincides with the other direction, the number of times of imaging necessary for recognizing the electronic component is plural. When the position of the component recognition camera and the position of the mounting head coincide with each other in the one direction and the other direction, switching is performed by a switching device to perform imaging a plurality of times .

The present invention is also an imaging recognition, the type of a different type of mounting head attached to each beam, based on the required imaging count in recognizing processing of electronic components per one mounting head, When the position of the component recognition camera and the position of the mounting head are aligned in one direction and the mounting head moves in the other direction, the component recognition camera captures an image when the position in the other direction matches, or component recognition When the position of the camera and the position of the mounting head are aligned in the other direction and the beam moves in one direction and the positions in both directions match, it is necessary to take an image or to recognize the electronic component Since the necessary number of times of imaging is multiple times and the position of the component recognition camera and the position of the mounting head coincide in the one direction and the other direction, the switching device switches to pick up the image for multiple stop images . , Electric It is possible to provide a variety of electronic component mounting apparatus from the viewpoint of production efficiency of printed circuit board due to miniaturization of components.

  Hereinafter, an embodiment of an electronic component mounting apparatus 1 for mounting electronic components on a printed circuit board P will be described with reference to FIG. The electronic component mounting device 1 includes a transport device 2 that transports the printed circuit board P, a component supply device 3 that supplies electronic components, and a pair of beams 4A that can be moved in one direction (Y direction) by a Y-axis motor 18. 4B and mounting heads 6A and 6B, each having a suction nozzle 5 and movable by an X-axis motor 19 in the direction along the beams 4A and 4B, are provided.

  That is, one mounting head 6A disposed on the beam 4A is called a high-speed mounting head. The mounting head 6A is biased downward by springs, for example, twelve suction nozzles 5 are provided. Electronic components are simultaneously provided from a plurality of component supply units 3B arranged in parallel on the circumference by suction nozzles 5 positioned at 3 o'clock and 9 o'clock positions of each mounting head 6. It is also possible to take it out. The three mounting heads 6B arranged on the beam 4B are called multifunction mounting heads, and each mounting head 6B is urged downward by a spring, for example, one suction nozzle. 5 is disposed.

  The suction nozzle 5 can be moved up and down by a vertical axis motor, and is rotated around the vertical axis by a θ-axis motor. As a result, the suction nozzles 5 of the mounting heads 6A and 6B move in the X direction and the Y direction. It is possible to rotate around a vertical line and move up and down.

  The transport device 2 is disposed at an intermediate portion before and after the electronic component mounting device 1, and includes a substrate supply unit that inherits the printed circuit board P from an upstream device (located on the left side in FIG. 1), and the mounting heads 6. The board positioning unit for positioning and fixing the printed circuit board P supplied from the board supply unit in order to mount the electronic component sucked and held by the suction nozzle 5, and the printed circuit board P on which the electronic component is mounted by the positioning unit are inherited. And a substrate discharging unit that is transported to a downstream device (located on the right side in FIG. 1).

  The component supply device 3 is disposed on both the front side and the rear side of the transport device 2, and is provided with a feeder base 3A that is attached to the device main body of the electronic component mounting device 1, and a plurality of components on the feeder base 3A. And a component supply unit 3B group for supplying various electronic components one by one to the component take-out portion (component suction position).

  Then, the pair of front and rear beams 4A and 4B which are long in the X direction slides on the sliders fixed to the beams 4A and 4B along the guides extending in the pair of left and right by driving the Y-axis motor 18. Move in the Y direction individually. The Y-axis motor 18 includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover 9A fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. It is comprised from the linear motor which consists of.

  The beams 4A and 4B are respectively provided with the mounting heads 6 that move along the guides in the longitudinal direction (X direction) by an X-axis motor 19, and the X-axis motor 19 is provided with each beam 4A. 4B is composed of a linear motor including a pair of front and rear stators fixed to 4B and a mover provided on the mounting head 6 between the stators.

  Accordingly, the mounting heads 6 are provided inside the beams 4A and 4B so as to face each other, and move above the printed circuit board P on the positioning unit of the transfer device 2 and the component extraction position of the component supply unit 3B.

  In addition, each mounting head 6 is provided with a board recognition camera 8 and images a positioning mark attached to the printed board P being positioned. Two illumination units 10 are provided in the electronic component mounting apparatus 1 and irradiate illumination light to the electronic components sucked and held by the suction nozzles 5. When the electronic component D sucked and held by the suction nozzle 5 is a BGA (Ball Grid Array), the lighting unit 10 emits a plurality of BGA reflection lights that irradiate illumination light in a state inclined toward the component. BGA lighting LED (Light Emitting Diode), which is a general light, general reflection lighting LED which is a general reflection lighting, transmission light, LED for coaxial lighting, etc., component recognition camera 12, etc. Composed.

  Accordingly, the illuminating lamp 11 irradiates the electronic components sucked and held by the suction nozzles 5 of the mounting heads 6A and 6B with the illumination light, images them with the component recognition cameras 12, and recognizes them with the component recognition processing device. The positional deviation with respect to the center of the suction nozzle 5 is grasped.

  Next, a description will be given below based on FIG. 2 which is a control block diagram relating to imaging control of electronic components. First, reference numeral 20 denotes a control microcomputer (hereinafter referred to as “control microcomputer”) as a control device that performs overall control of operations related to component mounting operation for mounting electronic components on the printed circuit board P in the electronic component mounting apparatus 1. , A CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory), the CPU being stored in the ROM based on the data stored in the RAM According to the program, the operation related to component mounting is controlled. The RAM is optimized for improving productivity based on NC data indicating the mounting coordinates of the electronic component on the printed circuit board P for each mounting order, component library data that is characteristic of the electronic component, and the NC data. The optimized data, which is the attached mounting order data, is stored.

  Reference numeral 21 denotes an operator's operation microcomputer (hereinafter referred to as “operation microcomputer”), which includes a CPU, a ROM, and a RAM, and stores the above-described NC data, component library data, optimization data, and the like. The operation microcomputer 21 is connected to an operation monitor 22 and an input device 23 such as a keyboard and a mouse.

  Reference numeral 25 denotes an image processing microcomputer (hereinafter referred to as “image processing microcomputer”) as an image processing apparatus, which includes a CPU, a ROM, and a RAM, and stores the above-described component library data, position data of the component recognition camera 12, and the like. Has been.

  The control microcomputer 20, the operation microcomputer 21, and the image processing microcomputer 25 are connected via a LAN line 26 and a hub 27. The control microcomputer 20 is connected to an X-axis servo amplifier 27 for the X-axis motor 19 and a Y-axis servo amplifier 28 for the Y-axis motor 18.

  Reference numeral 30 denotes a position monitoring circuit. When pulse signals are input from the X-axis motor 19 and the Y-axis motor 18 and coincide with the position data of the component recognition camera 12, a position coincidence signal is issued to the image capturing circuit 31. Upon receiving the position matching signal, the image capturing circuit 31 outputs the image capturing signal to the component recognition camera 12 on the front side (left side in FIG. 2) or the back side (right side in FIG. 2) for exposure, and causes the illumination lamp 11 to perform exposure. Output the flash lighting signal to light up.

  Then, the image data of the image captured by the component recognition camera 12 is sent to the image processing microcomputer 31 via the image capturing circuit 31 and subjected to recognition processing, and the positional deviation with respect to the suction nozzle 5 is grasped.

  Next, description will be made below based on FIG. 3 which is a flowchart relating to recognition control. First, the control microcomputer 20 reads and acquires NC data and mounting order data necessary for the production operation of the printed circuit board P stored in the RAM. Then, the production operation is started, and when the printed circuit board P is inherited from the upstream device (not shown) and exists on the substrate supply unit of the transport device 2, the printed circuit board P on the substrate supply unit is transferred to the substrate positioning unit. The printed circuit board P is positioned and fixed.

  When the printed circuit board P is positioned, according to the NC data, for example, the back beam 4A is moved in the Y direction by the drive of the Y axis motor 18, and the mounting head 6A is moved in the X direction by the X axis motor 19. Then, the electronic component is moved to above the component extraction position of the component supply unit 3B that supplies the electronic component of step number 0001 of the NC data, and the suction nozzle 5 is lowered by driving the vertical axis motor to take out the electronic component from the component supply unit 3B. In this case, the mounting head 6 is moved in the X direction and rotated, and each suction nozzle 5 is moved up and down, so that the plurality of suction nozzles 5 can take out up to 12 electronic components from the component supply unit 3B one after another. it can.

  Further, after or after taking out the electronic component by the suction nozzle 5 of the mounting head 6A on the back side, the beam 4B on the near side moves in the Y direction by the drive of the Y axis motor 18 and the X axis motor 19 As a result, the mounting head 6B moves in the X direction, moves to above the component take-out position of the corresponding component supply unit 3B, and the suction nozzle 5 is lowered by driving the vertical axis motor to take out the electronic component from the component supply unit 3B. it can. In this case, since there are three mounting heads 6B and each mounting head 6B has one suction nozzle 5, up to three electronic components can be taken out by the beam 4B.

  And after taking out, the suction nozzle 5 of both mounting head 6A, 6B will be raised, and the image capture by the component recognition camera 12 will be started. In this case, the control microcomputer 20 creates mounting order data optimized for improving productivity based on the NC data. Then, the control microcomputer 20 is based on the created mounting order data, the number of electronic components sucked by the suction nozzle 5, the type of mounting head, and the number of times of imaging necessary for recognizing the electronic components, It is determined whether or not to capture an image once per beam.

  In this case, when the suction nozzle 5 that sucks and holds the electronic component to be picked up is the high-speed mounting head 6A, in the case of fly image picking up while moving, or the electronic component to be picked up is picked up and held. When the suction nozzle 5 is a single multifunctional mounting head 6B and fly imaging is performed, the control microcomputer 20 determines the position of the mounting head to be imaged in the X direction as the position of the component recognition camera 12 in the X direction. Therefore, the X-axis motor 19 is controlled via the X-axis servo amplifier 27 to move the mounting head in the X direction, and the mounting head is arranged on the Y line of the component recognition camera 12.

  After this arrangement, the control microcomputer 20 outputs a command related to image capture to the image processing microcomputer 25. Then, although fly imaging recognition is performed, the component recognition camera 12 and the beam are designated, and the position of the mounting head of the beam in the Y direction is monitored.

  That is, the mounting head 6A on the back side or the predetermined mounting head 6B on the near side passes above the component recognition camera 12 on the back side or the near side by driving the Y-axis motor 18 of the beam 4A or 4B, but passes through that. Since the position in the Y direction of the back or front side component recognition camera 12 and the position in the Y direction of the mounting head 6A on the back side or the predetermined mounting head 6B on the front side are matched before, the position monitoring circuit 30 When a pulse signal from the Y-axis motor 18 is input and coincides with the position data of the component recognition camera 12, a position coincidence signal is issued to the image take-in circuit 31, and the image take-in circuit 31 that has received this position coincidence signal captures an image. And a flash lighting signal is output to the illuminating lamp 11 to light it with a predetermined illumination pattern.

  Accordingly, the image is captured, image data relating to the captured image is sent from the image capture circuit 31 to the image processing microcomputer 25, the electronic component is recognized, and the image processing microcomputer 25 transmits to the control microcomputer 20. The recognition process result is sent. For this reason, the control microcomputer 20 considers the position recognition result of each electronic component to the mounting coordinates of the electronic component in the NC data, and the electronic component is mounted on the printed circuit board P while the suction nozzle 5 corrects the positional deviation. . That is, in the X and Y directions, the Y axis motor 18 corresponding to each beam 4A or 4B and the X axis motor 19 associated with the mounting head 6A or 6B, the mounting angle by the θ axis motor, and as a result, Each suction nozzle 5 has its X / Y direction and mounting angle corrected, and the suction nozzle 5 mounts each electronic component on the printed circuit board P while correcting the positional deviation.

  Further, after taking out the electronic components from the component supply unit 3B, the mounting order data created by the control microcomputer 20, the number of electronic components sucked by the suction nozzle 5, the type of mounting head, and the electronic components are recognized. When it is determined whether or not to capture an image once per beam based on the number of imaging required above, if it is determined that the image is not captured once per beam, the control microcomputer 20 next selects one mounting head. It is determined whether the image is picked up only once, in other words, whether the image is picked up multiple times per mounting head.

  In this case, if it is determined that an image is captured only once per mounting head, in other words, it is determined that imaging is not performed a plurality of times per mounting head, the suction nozzle 5 that sucks and holds the electronic component to be imaged is mounted with a multifunctional type. In the case of fly imaging for the head 6B, the control microcomputer 20 sets the Y-axis servo amplifier 28 to match the position of the mounting head to be imaged in the Y direction with the position of the component recognition camera 12 in the Y direction. Then, the Y axis motor 18 is controlled to move the beam 4B of the mounting head 6B in the Y direction, and the mounting head is arranged on the X straight line of the component recognition camera 12.

  After this arrangement, the control microcomputer 20 outputs a command related to image capture to the image processing microcomputer 25. Then, although fly imaging recognition is performed, the component recognition camera 12 and the beam 4B are designated, and the position of the beam 4B in the X direction of the predetermined mounting head 6B is monitored.

  In other words, the predetermined mounting head 6B on the near side passes above the component recognition camera 12 on the near side by driving the X-axis motor 19 of the beam 4B. Since the position in the X direction matches the position in the X direction of the predetermined mounting head 6B on the near side, the position monitoring circuit 30 inputs a pulse signal from the X-axis motor 19 and matches the position data of the component recognition camera 12. Then, a position matching signal is issued to the image capturing circuit 31, and the image capturing circuit 31 that has received the position matching signal outputs the image capturing signal to the component recognition camera 12 on the front side (left side in FIG. 2) for exposure. At the same time, a flash lighting signal is output to the illuminating lamp 11 to light it with a predetermined illumination pattern.

  Accordingly, the image is captured, image data relating to the captured image is sent from the image capture circuit 31 to the image processing microcomputer 25, the electronic component is recognized, and the image processing microcomputer 25 transmits to the control microcomputer 20. The recognition process result is sent. For this reason, the control microcomputer 20 considers the position recognition result of each electronic component to the mounting coordinates of the electronic component in the NC data, and the electronic component is mounted on the printed circuit board P while the suction nozzle 5 corrects the positional deviation. That is, in the X and Y directions, the Y axis motor 18 corresponding to each beam 4A or 4B and the X axis motor 19 associated with the mounting head 6A or 6B, the mounting angle by the θ axis motor, and as a result, Each suction nozzle 5 has its X / Y direction and mounting angle corrected, and the suction nozzle 5 mounts each electronic component on the printed circuit board P while correcting the positional deviation.

  In addition, after taking out electronic components from the component supply unit 3B, the control microcomputer 20 recognizes the mounting order data created, the number of electronic components sucked by the suction nozzle 5, the type of mounting head, and the electronic components. When it is determined whether or not to capture an image once per beam based on the number of imaging required above, if it is determined that the image is not captured once per beam, the control microcomputer 20 next selects one mounting head. If it is determined whether to capture only once per image, and only one image per mounted head is not imaged, in other words, if it is determined to image multiple times per mounted head, the suction that holds and holds the electronic component to be imaged This is the case where the nozzle 5 is of a multifunctional mounting head 6B and is for stop imaging.

  In other words, for example, the electronic component held by the multifunctional mounting head 6B is imaged twice by changing the illumination pattern. In this case, the control microcomputer 20 determines the X direction of the mounting head to be imaged and Control is performed so that the position in the Y direction matches the position in the X direction and the Y direction of the component recognition camera 12. After this arrangement, the control microcomputer 20 outputs a command for image capture to the image processing microcomputer 25, and stop imaging recognition is performed. However, although the component recognition camera 12 and the beam 4B are designated, Since the alignment is performed, the position of the mounting head 6B of the beam 4B is not monitored.

Therefore, the image capture circuit 31 outputs an image capture signal to the component recognition camera 12 for exposure and outputs a flash lighting signal to the illumination lamp 11 to light with a predetermined illumination pattern to capture the image. Further, an image capture signal is output to the component recognition camera 12 to be exposed, and a flash lighting signal is output to the illumination lamp 11 so that the image is captured with another illumination pattern different from the predetermined illumination pattern. Then, the image is captured, and the image data relating to the captured image is sent from the image capture circuit 31 to the image processing microcomputer 25, the electronic component is recognized, and the image processing microcomputer 25 recognizes the control microcomputer 20. Processing result is sent. For this reason, the control microcomputer 20 considers the position recognition result of each electronic component to the mounting coordinates of the electronic component in the NC data, and the electronic component is mounted on the printed circuit board P while the suction nozzle 5 corrects the positional deviation. . That is, in the X and Y directions, the Y axis motor 18 corresponding to each beam 4A or 4B and the X axis motor 19 associated with the mounting head 6A or 6B, the mounting angle by the θ axis motor, and as a result, Each suction nozzle 5 has its X / Y direction and mounting angle corrected, and the suction nozzle 5 mounts each electronic component on the printed circuit board P while correcting the positional deviation.

  The three mounting heads 6B disposed on the beam 4B may be ones in which each mounting head moves in the X-axis direction, or each mounting head independently moves in the X-axis direction.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a schematic plan view of an electronic component mounting apparatus. It is a control block diagram concerning imaging control of electronic parts. It is a flowchart figure concerning recognition control.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Conveyance apparatus 3 Component supply apparatus 3B Component supply unit 4A, 4B Beam 5 Adsorption nozzle 6A, 6B Mounting head 12 Component recognition camera 20 Control microcomputer 25 Image processing microcomputer

Claims (1)

A component supply device that supplies electronic components, and a component recognition camera that is positioned between the component supply device and a positioning unit that is mounted on the substrate and positioned on the substrate transport device, and moves in one direction A pair of possible beams, and a mounting head provided so as to be movable in the other direction orthogonal to the one direction along each beam, and taken out from the component supply device by a suction nozzle provided in the mounting head In the electronic component mounting apparatus for picking up the electronic components sucked and held by the component recognition camera, a different type of mounting head is attached to each beam, and the type of the mounting head and the electronic components per one mounting head are based on the required imaging count in recognizing process, the mounting f and the position of the mounting head and the position of the component recognition camera by aligning the one direction The component recognition camera captures an image when the position of both of the other directions coincides while moving the head in the other direction, or the position of the component recognition camera and the position of the mounting head in the other direction. Then, when the beam moves in the one direction and the positions in the one direction coincide with each other, the number of times of imaging required for the recognition processing of the electronic component is multiple times. An electronic component mounting apparatus , wherein a switching device switches and images whether or not to stop imaging a plurality of times when the position of the recognition camera and the position of the mounting head coincide in the one direction and the other direction .